CN110170917A - A kind of polishing underlay and preparation method thereof - Google Patents
A kind of polishing underlay and preparation method thereof Download PDFInfo
- Publication number
- CN110170917A CN110170917A CN201910620456.0A CN201910620456A CN110170917A CN 110170917 A CN110170917 A CN 110170917A CN 201910620456 A CN201910620456 A CN 201910620456A CN 110170917 A CN110170917 A CN 110170917A
- Authority
- CN
- China
- Prior art keywords
- polishing underlay
- polishing
- working lining
- buffer layer
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The present invention provides a kind of polishing underlays, are used for 3D product single-sided polishing, and the polishing underlay includes working lining and buffer layer, and the buffer layer is covered on work layer surface, and working lining is equipped with multiple grooves far from the one side of buffer layer；Wherein, the working lining is formulated by following component by weight percentage: 20~50 parts of filler, 45~70 parts of bonding agent, 1~10 part of dispersing agent.The present invention also provides a kind of preparation method of polishing underlay, big, the resistance to grinding using the polishing underlay intensity of this method preparation.Simultaneously as the big abrasive material of the hardness such as diamond, aluminium oxide is not added, the single-sided polishing especially suitable for 3D product.Abrasive material is not added in polishing underlay provided by the invention, not damaged to 3D product underlying surfaces, can play cushioning and protection, keeps 3D product underlying surfaces intact, greatly improves the yields of product.And polishing underlay preparation is easy, it is cheap without making specific clamp tool.
Description
Technical field
The present invention relates to polishing technology fields, particularly, are related to a kind of polishing underlay and preparation method thereof.
Background technique,
Polishing underlay is one of the critical component in polishing technology, there is important shadow to polishing efficiency and processing quality
It rings.Polishing underlay performance is mainly determined by the material category of polishing underlay, material property, surface texture and state etc..Polishing lining
The reasonable selection of pad has great significance for controlling and optimizing polishing process.
Currently, domestic polishing underlay majority contains abrasive material, grinding and polishing can be played the role of simultaneously, but be chiefly used in processing
The 2D product such as glass, sapphire, ceramics carries out twin polishing to it, achievees the purpose that thinned product.And add for 3D product
Work, it is general at present by the fixed product of production fixture, achieve the effect that single-sided polishing；Or processed by polishing underlay,
But existing polishing underlay majority contains abrasive material, not only the service life is short, but also yield is low.For 3D product single-sided polishing, usually need
Will be using complicated technique and machinery equipment, and fraction defective is high, substantially increases processing cost.
Therefore, it is badly in need of a kind of new technique of polishing underlay in the industry.
Summary of the invention
It is an object of that present invention to provide a kind of polishing underlays, to solve to be directed to 3D product single-sided polishing, polishing process and machine
The device is complicated for device, and fraction defective is high, the high technical problem of processing cost.
To achieve the above object, the present invention provides a kind of polishing underlay, the polishing underlay includes working lining and buffering
Layer, the buffer layer are covered on work layer surface, and working lining is equipped with multiple grooves far from the one side of buffer layer；
Wherein, the working lining is formulated by following component by weight percentage: 20~50 parts of filler, bonding agent 45~
70 parts, 1~10 part of dispersing agent.
Further, the working lining is formulated by following component by weight percentage: filler 20%~50%, in conjunction with
Agent 45%~70%, dispersing agent 1%~10%.
Further, the filler is the combination of one or more of calcium carbonate, barium sulfate, sodium bicarbonate, calcium silicates.
Further, the bonding agent is glycidyl ester epoxy resin, alicyclic based epoxy resin, organosilicon epoxy
The combination of one or more of resin, epoxy acrylate, polyester acrylate, vinyl ether resin.
Further, the dispersing agent includes singly being not limited to vinyl bis-stearamides, tristerin, poly- second two
Alcohol, oily amino oleic acid ester.
Further, the buffer layer is PC plate material.
Present invention offer additionally provides the preparation method of above-mentioned polishing underlay, comprising the following steps:
Step 1) weighs raw material needed for working lining in polishing underlay；
After raw material weighed in step 1 is sufficiently mixed by step 2), it is filled into mold；
Step 3) is handled using vacuum machine deaeration, is finally placed in curing molding in baking oven, cooled to room temperature；
Step 4) cooled to room temperature covers one layer of buffer layer on the working lining made.
Further, each 20~30min of material stirring in the step 2).
Further, deaeration handles 20-30min in vacuum machine in the step 3), and the pressure in vacuum machine is -90
~-110kpa.
Further, the temperature for being placed in curing molding in baking oven in the step 3) after vacuum machine deaeration processing is 120-
150℃。
The invention has the following advantages:
(1) a kind of polishing underlay provided by the invention is used for 3D product single-sided polishing, is made of working lining and buffer layer,
The buffer layer is covered on work layer surface, and working lining is equipped with multiple grooves far from the one side of buffer layer, and the buffer layer is PC
Plate, the working lining are formulated by following component by weight percentage: 20~50 parts of filler, 45~70 parts of bonding agent, point
1~10 part of powder.Wherein, filler mainly plays a part of to increase intensity and content is moderate, otherwise will affect the molding of polishing underlay,
Bonding agent plays bonding and solidification, and dispersing agent is mainly uniformly mixed effect.Especially as working lining main component
Bonding agent (preferred epoxy), not only has excellent adhesive property, but also wear-resisting property and satisfactory mechanical property, and chemistry is steady
Qualitative good, shrinking percentage is low, easy processing molding and it is low in cost.Meanwhile it is big because the hardness such as diamond, aluminium oxide are not added
Abrasive material, the single-sided polishing especially suitable for 3D product.Abrasive material is not added in polishing underlay provided by the invention, to 3D product lower layer
Surface is not damaged, can play cushioning and protection, keeps 3D product underlying surfaces intact, greatly improves the non-defective unit of product
Rate.Meanwhile polishing underlay provided by the invention, working lining are equipped with multiple grooves far from the one side of buffer layer, not only have and hold bits
Effect, and polishing fluid can be excluded in time cause the quite resistance to grinding of this polishing underlay, meanwhile, it is capable to which protection is processed well
Product.
(2) preparation method of polishing underlay provided by the invention, preparation process is thermoset forming, easy to operate, is not necessarily to
Specific clamp tool is made, it is cheap.Not only intensity is big for polishing underlay prepared by the present invention, resistance to grinding, and cooperates resin copper dish
It uses, can be widely applied to the single-sided polishing field of the 3D product such as glass, sapphire, ceramics.The polishing underlay can be good at
Protect product surface, work at the same time layer far from buffer layer one side be equipped with multiple grooves can exclude in time glass powder, jewel powder,
Ceramic powder.In addition, the groove is corresponding according to concrete shape Demand Design because the production of polishing underlay has upper/lower die
Upper mold is suppressed.
(3) polishing underlay relative to existing containing abrasive material (service life is 6-8 days, curved surface fraction defective more than 7%),
Polishing underlay long service life provided by the invention, and curved surface fraction defective is lower, the service life on grinding machine can achieve 12-
15 days, the curved surface fraction defective contacted with 3D product can control within 5%.
Other than objects, features and advantages described above, there are also other objects, features and advantages by the present invention.
The present invention is further detailed explanation below.
Specific embodiment
The embodiment of the present invention is described in detail below, but the present invention can be limited and be covered according to claim
Multitude of different ways implement.
Embodiment 1:
A kind of polishing underlay, the polishing underlay include working lining and buffer layer, and the buffer layer is covered on working lining table
Face, working lining are equipped with multiple grooves far from the one side of buffer layer；Wherein, the working lining is matched by following component by weight percentage
It makes: 35% calcium carbonate, 60% organosilicon epoxy resin, 5% polyethylene glycol.The buffer layer is that PC plate material (is also poly- carbon
Acid esters plate).
The polishing underlay is made by the following method, and each material mixing of the working lining of above-mentioned mass component is stirred 20~30
It after minute, being filled into mold, handles 20-30min using vacuum machine deaeration, the pressure in vacuum machine is -90~-110kpa,
It is then placed into baking oven high temperature curing molding, the temperature of curing molding is 120-150 DEG C, and last cooled to room temperature is glued
Paste PC plate material.
Embodiment 2:
A kind of polishing underlay, the polishing underlay include working lining and buffer layer, and the buffer layer is covered on working lining table
Face, working lining are equipped with multiple grooves far from the one side of buffer layer；Wherein, the working lining is formulated by following component: 20%
Barium sulfate, 70% alicyclic based epoxy resin, 10% tristerin.The buffer layer is PC plate material.
The specific preparation method of the present embodiment polishing underlay while embodiment 1.
Embodiment 3:
A kind of polishing underlay, the polishing underlay include working lining and buffer layer, and the buffer layer is covered on working lining table
Face, working lining are equipped with multiple grooves far from the one side of buffer layer；Wherein, the working lining is formulated by following component: 20%
Sodium bicarbonate, 30% calcium silicates, 49% epoxy acrylate, 1% vinyl bis-stearamides.The buffer layer is PC plate material.
The specific preparation method of the present embodiment polishing underlay while embodiment 1
Comparative example 1:(filler is too low, and bonding agent is excessively high)
A kind of polishing underlay, the polishing underlay include working lining and buffer layer, and the buffer layer is covered on working lining table
Face, working lining are equipped with multiple grooves far from the one side of buffer layer；Wherein, the working lining is formulated by following component: 15%
Calcium carbonate, 75% organosilicon epoxy resin, 10% polyethylene glycol.The buffer layer is PC plate material.
The specific preparation method of the present embodiment polishing underlay while embodiment 1.
Comparative example 2:(bonding agent is too low, and filler is excessively high)
A kind of polishing underlay, the polishing underlay include working lining and buffer layer, and the buffer layer is covered on working lining table
Face, working lining are equipped with multiple grooves far from the one side of buffer layer；Wherein, the working lining is formulated by following component: 55%
Calcium carbonate, 40% organosilicon epoxy resin, 5% polyethylene glycol.The buffer layer is PC plate material.
The specific preparation method of the present embodiment polishing underlay while embodiment 1.
Diamond abrasive is added in comparative example 3:()
A kind of polishing underlay, the polishing underlay include working lining and buffer layer, and the buffer layer is covered on working lining table
Face, working lining are equipped with multiple grooves far from the one side of buffer layer；Wherein, the working lining is formulated by following component: 25%
Diamond, 20% calcium silicates, 50% organosilicon epoxy resin, 5% polyethylene glycol.The buffer layer is PC plate material.
The polishing underlay prepared using embodiment 1-3 and comparative example 1-5 is attached to grinding machine lower wall, and upper disk pastes resin copper dish,
Combined process 3D glass product, test result are as follows:
| Polishing underlay | Curved surface fraction defective | Service life |
| Embodiment 1 | 4.8% | 12 days |
| Embodiment 2 | 4.5% | 13 days |
| Embodiment 3 | 4.3% | 15 days |
| Comparative example 1 | 5.5% | 9 days |
| Comparative example 2 | 7.1 | 8 days |
| Comparative example 3 | 8.5 | 7 days |
As seen from the above table: polishing underlay long service life provided by the invention, and curved surface fraction defective is lower, on grinding machine
Service life can achieve 12-15 days, and the curved surface fraction defective contacted with 3D product can control within 5%.Work as polishing underlay
Working lining in filler it is too low, when bonding agent is excessively high, the intensity of polishing underlay is too low, and wearability is deteriorated, and service life shortens.When
Bonding agent is too low in the working lining of polishing underlay, and when filler is excessively high, the intensity of polishing underlay is excessively high, be easy to cause product bad.
When adding the biggish diamond abrasive of a certain amount of hardness in the working lining of polishing underlay, the intensity of polishing underlay is excessively high, is easy
Cause product bad, and polishing underlay is also prone to wear.
In conclusion because abrasive material is not added in polishing underlay provided by the invention, it is not damaged to 3D product underlying surfaces,
Cushioning and protection can be played, keeps 3D product underlying surfaces intact, greatly improves the yields of product.Relative to existing
Polishing underlay (service life 6-8 days, fraction defective 7% or so) of some containing abrasive material, polishing underlay provided by the invention use
Service life is long, and curved surface fraction defective is lower, and the service life on grinding machine can achieve 12-15 days, the curved surface contacted with 3D product
Fraction defective can control within 5%.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of polishing underlay, which is characterized in that the polishing underlay includes working lining and buffer layer, and the buffer layer is covered on
Work layer surface, and working lining is equipped with multiple grooves far from the one side of buffer layer；
Wherein, the working lining is formulated by following component by weight percentage: 20~50 parts of filler, bonding agent 45~70
Part, 1~10 part of dispersing agent.
2. a kind of polishing underlay according to claim 1, which is characterized in that the working lining is by weight percentage by following
Component is formulated: filler 20%~50%, bonding agent 45%~70%, dispersing agent 1%~10%.
3. a kind of polishing underlay according to claim 1, which is characterized in that the filler is calcium carbonate, barium sulfate, carbonic acid
The combination of one or more of hydrogen sodium, calcium silicates.
4. a kind of polishing underlay according to claim 1, which is characterized in that the bonding agent is glycidol esters epoxy
Resin, alicyclic based epoxy resin, organosilicon epoxy resin, epoxy acrylate, polyester acrylate, in vinyl ether resin
One or more of combinations.
5. a kind of polishing underlay according to claim 1, which is characterized in that the dispersing agent includes singly being not limited to ethylene
Base bis-stearamides, tristerin, polyethylene glycol, oily amino oleic acid ester.
6. -5 any a kind of polishing underlay according to claim 1, which is characterized in that the buffer layer is PC plate material.
7. a kind of preparation method of the polishing underlay as described in claim 1-6 is any, which comprises the following steps:
Step 1) weighs raw material needed for working lining in polishing underlay；
After raw material weighed in step 1 is sufficiently mixed by step 2), it is filled into mold；
Step 3) is handled using vacuum machine deaeration, is finally placed in curing molding in baking oven, cooled to room temperature；
Step 4) cooled to room temperature covers one layer of buffer layer on the working lining made.
8. a kind of preparation method of polishing underlay according to claim 7, which is characterized in that each material in the step 2)
Stir 20~30min.
9. a kind of preparation method of polishing underlay according to claim 7, which is characterized in that in vacuum in the step 3)
Deaeration handles 20-30min in machine, and the pressure in vacuum machine is -90~-110kpa.
10. a kind of preparation method of polishing underlay according to claim 7, which is characterized in that vacuum in the step 3)
The temperature that curing molding in baking oven is placed in after machine deaeration processing is 120-150 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910620456.0A CN110170917A (en) | 2019-07-10 | 2019-07-10 | A kind of polishing underlay and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910620456.0A CN110170917A (en) | 2019-07-10 | 2019-07-10 | A kind of polishing underlay and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110170917A true CN110170917A (en) | 2019-08-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910620456.0A Pending CN110170917A (en) | 2019-07-10 | 2019-07-10 | A kind of polishing underlay and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114502324A (en) * | 2019-08-21 | 2022-05-13 | 应用材料公司 | Additive manufacturing of polishing pads |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1476367A (en) * | 2000-12-01 | 2004-02-18 | �����֯��ʽ���� | Polishing pad, method of mfg. polishing pad, and cushion layer polishing pad |
| JP2004243428A (en) * | 2003-02-12 | 2004-09-02 | Rodel Nitta Co | Polishing pad |
| CN101077569A (en) * | 2006-05-25 | 2007-11-28 | 罗门哈斯电子材料Cmp控股股份有限公司 | Chemical mechanical polishing pad |
| CN102026775A (en) * | 2008-05-16 | 2011-04-20 | 东丽株式会社 | Polishing pad |
| CN107163213A (en) * | 2017-05-31 | 2017-09-15 | 蓝思科技（长沙）有限公司 | Polishing pad, preparation method and applications |
-
2019
- 2019-07-10 CN CN201910620456.0A patent/CN110170917A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1476367A (en) * | 2000-12-01 | 2004-02-18 | �����֯��ʽ���� | Polishing pad, method of mfg. polishing pad, and cushion layer polishing pad |
| JP2004243428A (en) * | 2003-02-12 | 2004-09-02 | Rodel Nitta Co | Polishing pad |
| CN101077569A (en) * | 2006-05-25 | 2007-11-28 | 罗门哈斯电子材料Cmp控股股份有限公司 | Chemical mechanical polishing pad |
| CN102026775A (en) * | 2008-05-16 | 2011-04-20 | 东丽株式会社 | Polishing pad |
| CN107163213A (en) * | 2017-05-31 | 2017-09-15 | 蓝思科技（长沙）有限公司 | Polishing pad, preparation method and applications |
Non-Patent Citations (2)
| Title |
|---|
| 山西省化工研究所: "《聚氨酯弹性体手册》", 31 January 2001, 化学工业出版社 * |
| 百度: "分散剂的种类和作用", 《百度经验HTTPS://JINGYAN.BAIDU.COM/ARTICLE/36D6ED1F7AF19A1BCF4883B7.HTML》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114502324A (en) * | 2019-08-21 | 2022-05-13 | 应用材料公司 | Additive manufacturing of polishing pads |
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Application publication date: 20190827 |
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