CN110170652A - A kind of molding face printing equipment of Variable Area and its Method of printing - Google Patents
A kind of molding face printing equipment of Variable Area and its Method of printing Download PDFInfo
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- CN110170652A CN110170652A CN201910362283.7A CN201910362283A CN110170652A CN 110170652 A CN110170652 A CN 110170652A CN 201910362283 A CN201910362283 A CN 201910362283A CN 110170652 A CN110170652 A CN 110170652A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/36—Process control of energy beam parameters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/20—Cooling means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/40—Radiation means
- B22F12/44—Radiation means characterised by the configuration of the radiation means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/40—Radiation means
- B22F12/44—Radiation means characterised by the configuration of the radiation means
- B22F12/45—Two or more
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/30—Platforms or substrates
- B22F12/33—Platforms or substrates translatory in the deposition plane
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Automation & Control Theory (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of molding face printing equipment of Variable Area and its Method of printings.The device includes cooling system, laser source, diode laser array module, collimation lens, condenser lens, workbench, powder bed and guide rail.In the apparatus, the diode laser of array distribution is installed, all lasers can cover entire print area on substrate.When every layer of metal powder is plated in completion according to set thickness, the laser beam that laser source is projected is according to preset printing path, laser above print area is opened, laser above nonprinting region is then closed, continue to be plated in next layer of metal powder after completing the printing of current layer, until whole printing process terminates.The device can greatly improve SLM printing effect, and improve because of excessive bring warpage of sweep span and other issues since by the way of the printing of face, the progressive scan compared to conventional method is printed.
Description
Technical field
The present invention relates to 3D printing techniques, more particularly, to a kind of molding face printing equipment of Variable Area and its printing side
Method.
Background technique
3D printing technique has become an important technology indispensable in current rapid prototyping method, and selective laser is molten
Melt (Selective Laser Melting, SLM) technology and be put forward for the first time by German Froounholfer research institute in nineteen ninety-five,
Working principle is similar to SLS.SLM is to convert thermal energy for the energy of laser to form metal powder, and the main distinction is SLS
In the fabrication process, metal powder is not completely melt, and SLM is in the fabrication process, and metal powder is heated to after being completely melt
Molding.SLM workflow is that printer control laser is selectively irradiated powder above the powder laid, gold
Belong to powder to be heated to form after being completely melt.Then piston makes the height of workbench one unit of reduction, new one layer of powder paving
It being sprinkling upon on molded current layer, the data that equipment calls in a new layer cross section carry out laser fusing, it is bonded with previous layer cross section,
This process successively recycles until whole object forms.The whole process of SLM carries out in the Processing Room of inert gas shielding,
It is aoxidized at high temperature to avoid metal.
By SLM prints principle: each final part is by melting from level to level, and every one layer of melting is put down
Platform decline, new powder are paved with this layer and repeat the above process.Its real forming principle is laser by the energy of certain energy density
Amount gets to powder bed, so that powder reaches molten condition in the region scanned, energy density that powder receives and laser
Several factors are related, such as scanning speed, sweep span, scan power, and the energy of laser forms hot shadow in metal powder surface
It rings area and forms molten bath, molten bath influences surrounding powder and forms welding effect.Laser can be scanned according to certain rule and direction to need
Molding melt region is wanted, according to the reasonable naturalization scan path of different materials, scanning area is divided into ribbon, checkerboard
Deng, it can effectively discharge inside parts stress, every layer of scan vector of planning can reduce internal flaw, and to obtain consistency higher,
The better part of mechanical property.However compared with tradition subtracts material manufacture, lot of materials can be saved.SLM technical restriction: shaping speed
It is lower, in order to improve machining accuracy, need with thinner processing thickness.Time used in processing small size part is also longer, therefore
It is dfficult to apply to manufacture on a large scale.
From be analyzed above it is found that laser scanning pitch, scanning speed and laser power shaping efficiency is played it is most important
Effect.If improving printing effect, surface sweeping spacing can be increased, but molten bath is limited in scope, if spacing is excessive, can made
The overlapping rate of cladding width is too small, can seriously reduce surface of shaped parts quality;Scanning speed is affected to consistency, in difference
Sweep span under, as the decreasing trend of the reduction consistency of scanning speed is substantially the same, scanning speed be 60mm/s when
Consistency highest, but by Surface scan it is found that if reducing scanning speed again, forming surface will appear very serious spherodization,
Rough surface is porous, so scanning speed when powder SLM shapes should be 60-90mm/s;When laser power reduces, part
Consistency also accordingly reduces, and the energy that increasing laser power can be such that powder absorbs is consequently increased, and promotes powder particles fuse amount
Increase, reduce melt viscosity and surface tension, to increase pool depth and width, increases intergranular cohesive force, thus
Forming quality and part consistency are improved, under same energy density, but as becoming larger for spot diameter can make it possible to quantity set
In in upper surface, the influence that the powder of every layer of lower section good cannot receive laser molten pool is effectively melted, and part matter is directly affected
Amount.The tensile strength of part vertical direction reduces, it is easier to generate slight crack.
By to the prior art, paper, patent access, either increase surface sweeping spacing in existing method or improve and swash
Optical scanning power method is inherently line-scan mode, and difference is line space size, row scanning mode and laser power
Size, but sweep span, laser power and scanning speed have within limits, more than can make after certain threshold value
Obtaining surface of shaped parts quality reduces.Therefore existing method still rests on quantitative change level to the raising of SLM printing effect, the present invention
It is improved for when SLM progressive scanning mode, scan pattern is become into area surface printing, it is intended to improve SLM printing effect
Improve Forming Quality simultaneously.
Summary of the invention
In order to overcome deficiency present in background technique, the purpose of the present invention is to provide a kind of molding faces of Variable Area
SLM printing effect can be improved in printing equipment and its Method of printing, reasonable in design, system perfecting, and improves SLM molding
The printing equipment of quality.
Technical solution used by the present invention solves the above problems is:
One, the molding face printing equipment of a kind of Variable Area
The present invention includes cooling system, laser source, diode laser array module, collimation lens, condenser lens, work
Platform, powder bed and guide rail;Laser source is located in cooling system, by optical fiber by the laser beam in diode laser array module
Collimated lens, condenser lens are projected in the powder bed of workbench, form molded part in powder bed, and workbench bottom can be
It is moved on guide rail.
The diode laser array module includes multiple diode lasers, is arranged on substrate according to array.
The laser projection region area that the diode laser array module is projected and CAD model maximum cross-section profile
Minimum area-encasing rectangle area is identical.
The diode laser array module increases and decreases according to the minimum area-encasing rectangle area of CAD model maximum cross-section profile to swash
Light device quantity guarantees that laser projection region area is not less than the rectangular area.
Two, a kind of the step of Method of printing of the molding face printing equipment of Variable Area, the Method of printing includes:
Step 1) inputs CAD model to model layers and determines each layer outline data;
Step 2) determines the mutual inclusion relation of every layer of each profile;
Step 3) determines the specification and number of diode laser array;
Step 4) determines diode laser array in current layer printing path;
Step 5) determines open and-shut mode and the printing of diode laser array according to printing path;
Step 6) updates next layer of outline data, judges whether to have printed all layers of profile, if so, terminating, otherwise
Continue to execute step 4) -5), until meeting printing termination condition.
In the step 4), determine diode laser array in the specific steps of current layer printing path are as follows:
Step 4-1) extract current layer all contour curve set C;
Step 4-2) assume that laser number is m in X-direction, laser number is n in Y-direction, is located at jth row, the i-th column
The coordinate of laser is (xi, yj), wherein 1≤j≤m, 1≤l≤r;
Step 4-3) for crossing (xi, 0) and perpendicular to the straight line l of Xi, calculate liWith the intersection point of collection of curves C, reject and song
Line set C tangent intersection point remembers that intersection point is (x respectivelyi, y1), (xi, y2) ..., (xi, yk);
Step 4-4) open and-shut mode in the i-th column laser judged according to intersection point situation;
Step 4-5) according to step 4-3), step 4-4) successively judge 1,2 ..., the open and-shut mode of m laser.
The each laser of the determination is in the specific steps of the open and-shut mode of current print area according to intersection point situation
Judge that the open and-shut mode in the i-th column laser, specific judgment rule are as follows:
In intersection point (xk, y1) and intersection point (xk+1, y1) between laser be all turned on, wherein k be odd number;
In intersection point (xk, y1) and intersection point (xk+1, y1) between laser all close, wherein k be even number.
The invention has the advantages that:
The present invention can be mentioned greatly since by the way of the printing of face, the progressive scan compared to conventional method is printed
High SLM printing effect, and improve because of excessive bring warpage of sweep span and other issues.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention.
Fig. 2 is schematic perspective view of the invention.
Fig. 3 is all laser opening and closing schematic diagrames in the embodiment of the present invention.
Fig. 4 is that laser opens signal at every layer cross section profile in the embodiment of the present invention.
Fig. 5 is the opening and closing schematic diagram of each laser in each column laser in the embodiment of the present invention.
Fig. 6 is in the embodiment of the present invention for the molding face Method of printing flow chart of Variable Area.
In figure: 1, cooling system, 2, laser source, 3, diode laser array module, 4, collimation lens, 5, laser beam,
6, condenser lens, 7, workbench, 8, powder bed, 9, molded part, 9.1, molded part Internal periphery, 9.2, molded part outer profile, 10, lead
Rail, 11, optical fiber.
Specific embodiment
The present invention is further illustrated with reference to the accompanying drawing and by embodiment.
As shown in Figure 1 and Figure 2, the present invention includes cooling system 1, laser source 2, diode laser array module 3, collimation
Lens 4, condenser lens 6, workbench 7, powder bed 8 and guide rail 10;Laser source 2 is located in cooling system 1, by optical fiber 11 by two
The collimated lens 4 of laser beam 5, condenser lens 6 in pole pipe laser array module 3 are projected in the powder bed 8 of workbench 7,
Molded part 9 is formed in powder bed 8,7 bottom of workbench can move on the rail 9.
The diode laser array module 3 includes multiple diode lasers, is arranged in substrate according to array
On.
The laser projection region area and CAD model maximum cross-section profile that the diode laser array module 3 is projected
Minimum area-encasing rectangle area it is identical.
The diode laser array module 3 increases and decreases according to the minimum area-encasing rectangle area of CAD model maximum cross-section profile
Number of lasers guarantees that laser projection region area is not less than the rectangular area.
It is the stereoscopic schematic diagram of printing equipment of the present invention shown in Fig. 2, wherein laser source 2 is connected to laser battle array by optical fiber 11
Column module 3, the laser projection region projected is identical as the minimum area-encasing rectangle area of printer model maximum cross-section profile, passes through
Single laser diode is used parallel, these laser beams 5 can be opened or closed.
The detailed description for specifically judging laser open and-shut mode is provided below with reference to Fig. 3-5:
In the present embodiment, for convenience of explanation, each small circle represents a laser in Fig. 3-5, wherein laser
Number with it is inconsistent in Fig. 2;In addition, number of lasers is also that can be set according to the size of practical molded part, such as in practical printing
Described in claim 4.
As shown in figure 3, diode laser array module corresponds to entire print area, there is molding under print area
Part Internal periphery 9.1 and molded part outer profile 9.2, wherein the laser being located at other than molded part profile 9.2 is entirely closed state,
Laser between molded part Internal periphery 9.1 and molded part outer profile 9.2 is in open state, in molded part Internal periphery 9.1
Laser be completely in closed state.Wherein the laser of hollow circular portion is entirely closed state, and solid circular portion indicates
It is region to be printed that it is the portion region that laser, which is opened,
Model is under each layering section, and the corresponding laser in profile place is as shown in figure 4, these lasers are in out
The mark laser for opening state, and opening and be closed as each column laser.
As shown in figure 5, can determine x point and straight line and molded part perpendicular to X-axis after the x coordinate of given each column
The intersection point of Internal periphery 9.1 and molded part outer profile 9.2, i.e. mark laser P1, P2, P3, P4.If being denoted as P1, P2, P3, P4
The laser at place is respectively the 1st, 2,3,4 laser can according to the specific judgment rule of the open and-shut mode of the i-th column laser
Know that all lasers are all turned between laser P1-P2, all lasers between laser P2-P3 are turned off, and are swashed
All lasers between light device P3-P4 are opened.
It is the Method of printing of the molding face printing equipment of Variable Area of the present invention as shown in Figure 6, printing step includes:
Step 1) is to CAD 3D model layers and determines each layer outline data: under normal circumstances, giving three-dimensional digital model
It is stl file, specified lift height is set to stl file and obtains every layer of number of contours according to lift height to the model layers
According to;
Step 2) determines the inclusion relation of each layer of profile, to obtain Internal periphery and outer profile data;
Step 3) determines the area of print area according to the minimum area-encasing rectangle of CAD model maximum cross-section, and then determines and swash
The specification and number of light device array;
It is actually to be carried out according to current cross-section bottom profiled data to the laser array phase that step 4) face, which prints lower printing path,
It divides, it is ensured that each column laser corresponds to entire print area, and carries out digital representation to all lasers, so that it is determined that often
The mark laser of closure is opened in column
Step 5) determines each laser in the open and-shut mode of current print area: made the straight line of each column laser, it should
Straight line in print area it is inevitable with each contour curve there are intersection point, these intersection points are to open the mark of closure in the column to swash
Light device, and then determine the open and-shut mode of laser under all column, the open and-shut mode according to determined laser carries out current layer
Printing;
Step 6) updates next layer of outline data, judges whether to have printed all layers of profile, if so, terminating, otherwise
Execute step 4) -5) continue to print, it is finished until all layers print.
In the step 4), determine diode laser array in the specific steps of current layer printing path are as follows:
Step 4-1) extract current layer all contour curve set C;
Step 4-2) assume that laser number is m in X-direction, laser number is n in Y-direction, is located at jth row, the i-th column
The coordinate of laser is (xi, yj), wherein 1≤j≤m, 1≤i≤r;
Step 4-3) for crossing (xi, 0) and perpendicular to the straight line l of Xi, calculate liWith the intersection point of collection of curves C, reject and song
Line set C tangent intersection point remembers that intersection point is (x respectivelyi, y1), (xi, y2) ..., xi, yk);
Step 4-4) open and-shut mode in the i-th column laser judged according to intersection point situation;
Step 4-5) be according to step 4-3), step 4-4) successively judge 1,2 ..., the open and-shut mode of m column laser.
The each laser of the determination is in the specific steps of the open and-shut mode of current print area according to intersection point situation
Judge that the open and-shut mode in the i-th column laser, specific judgment rule are as follows:
In intersection point (xk, y1) and intersection point (xk+1, y1) between laser be all turned on, wherein k be odd number;
In intersection point (xk, y1) and intersection point (xk+1, y1) between laser all close, wherein k be even number.
Claims (6)
1. a kind of molding face printing equipment of Variable Area, it is characterised in that: including cooling system (1), laser source (2), two poles
Pipe laser array module (3), collimation lens (4), condenser lens (6), workbench (7), powder bed (8) and guide rail (10);Swash
Light source (2) is located in cooling system (1), is passed through the laser beam (5) in diode laser array module (3) by optical fiber (11)
Collimation lens (4), condenser lens (6) are projected in the powder bed (8) of workbench (7), form molded part on powder bed (8)
(9), workbench (7) bottom can move on guide rail (9).
2. the molding face printing equipment of a kind of Variable Area according to claim 1, it is characterised in that: the diode swashs
Light device array module (3) includes multiple diode lasers, is arranged on substrate according to array.
3. the molding face printing equipment of a kind of Variable Area according to claim 1, it is characterised in that: the diode swashs
The minimum area-encasing rectangle area of laser projection region area and CAD model maximum cross-section profile that optical arrays module (3) is projected
It is identical.
4. the molding face printing equipment of a kind of Variable Area according to claim 3, it is characterised in that: the diode swashs
Optical arrays module (3) increases and decreases number of lasers according to the minimum area-encasing rectangle area of CAD model maximum cross-section profile, guarantees laser
Projected area area is not less than the rectangular area.
5. for a kind of Method of printing of the molding face printing equipment of Variable Area described in claim 1-4, which is characterized in that
The step of Method of printing includes:
Step 1) inputs CAD model to model layers and determines each layer outline data;
Step 2) determines the mutual inclusion relation of every layer of each profile;
Step 3) determines the specification and number of diode laser array;
Step 4) determine diode laser array in current layer printing path, specifically:
Step 4-1) extract current layer all contour curve set;
Step 4-2) assume that laser number is m in X-direction, laser number is n in Y-direction, is located at theRow, theColumn laser
The coordinate of device is, wherein;
Step 4-3) for mistakeAnd perpendicular to the straight line of X, calculateWith collection of curvesIntersection point, reject and collection of curvesTangent intersection point remembers that intersection point is respectively);
Step 4-4) judged according to intersection point situationThe open and-shut mode of column laser;
Step 4-5) be according to step 4-3), step 4-4) successively judge 1,2 ..., the open and-shut mode of m column laser;
Step 5) determines open and-shut mode and the printing of diode laser array according to printing path;
Step 6) updates next layer of outline data, judges whether to have printed all layers of profile, if so, terminating, otherwise continues
Execute step 4) -5), until meeting printing termination condition.
6. a kind of Method of printing of the molding face printing equipment of Variable Area according to claim 5, which is characterized in that institute
The each laser of the determination stated judges according to intersection point situation in the specific steps of the open and-shut mode of current print areaColumn
The open and-shut mode of laser, specific judgment rule are as follows:
In intersection pointBetween laser be all turned on, whereinFor odd number;
In intersection pointBetween laser all close, whereinFor even number.
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Cited By (5)
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CN114101708A (en) * | 2021-10-28 | 2022-03-01 | 西安交通大学 | Lattice laser scanning method and device for laser additive manufacturing |
CN114378308A (en) * | 2021-11-30 | 2022-04-22 | 杭州正向增材制造技术有限公司 | Laser printing method and system |
CN115770885A (en) * | 2021-09-07 | 2023-03-10 | 广东汉邦激光科技有限公司 | Three-dimensional printing method and three-dimensional printing device |
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