CN110170652A - A kind of molding face printing equipment of Variable Area and its Method of printing - Google Patents

A kind of molding face printing equipment of Variable Area and its Method of printing Download PDF

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Publication number
CN110170652A
CN110170652A CN201910362283.7A CN201910362283A CN110170652A CN 110170652 A CN110170652 A CN 110170652A CN 201910362283 A CN201910362283 A CN 201910362283A CN 110170652 A CN110170652 A CN 110170652A
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China
Prior art keywords
laser
printing
area
diode
intersection point
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CN201910362283.7A
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CN110170652B (en
Inventor
范有
赵庆洋
毛德锋
叶施强
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HANGZHOU HIMALAYA INFORMATION TECHNOLOGY Co Ltd
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HANGZHOU HIMALAYA INFORMATION TECHNOLOGY Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20Direct sintering or melting
    • B22F10/28Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30Process control
    • B22F10/36Process control of energy beam parameters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/20Cooling means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40Radiation means
    • B22F12/44Radiation means characterised by the configuration of the radiation means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40Radiation means
    • B22F12/44Radiation means characterised by the configuration of the radiation means
    • B22F12/45Two or more
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/30Platforms or substrates
    • B22F12/33Platforms or substrates translatory in the deposition plane
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses a kind of molding face printing equipment of Variable Area and its Method of printings.The device includes cooling system, laser source, diode laser array module, collimation lens, condenser lens, workbench, powder bed and guide rail.In the apparatus, the diode laser of array distribution is installed, all lasers can cover entire print area on substrate.When every layer of metal powder is plated in completion according to set thickness, the laser beam that laser source is projected is according to preset printing path, laser above print area is opened, laser above nonprinting region is then closed, continue to be plated in next layer of metal powder after completing the printing of current layer, until whole printing process terminates.The device can greatly improve SLM printing effect, and improve because of excessive bring warpage of sweep span and other issues since by the way of the printing of face, the progressive scan compared to conventional method is printed.

Description

A kind of molding face printing equipment of Variable Area and its Method of printing
Technical field
The present invention relates to 3D printing techniques, more particularly, to a kind of molding face printing equipment of Variable Area and its printing side Method.
Background technique
3D printing technique has become an important technology indispensable in current rapid prototyping method, and selective laser is molten Melt (Selective Laser Melting, SLM) technology and be put forward for the first time by German Froounholfer research institute in nineteen ninety-five, Working principle is similar to SLS.SLM is to convert thermal energy for the energy of laser to form metal powder, and the main distinction is SLS In the fabrication process, metal powder is not completely melt, and SLM is in the fabrication process, and metal powder is heated to after being completely melt Molding.SLM workflow is that printer control laser is selectively irradiated powder above the powder laid, gold Belong to powder to be heated to form after being completely melt.Then piston makes the height of workbench one unit of reduction, new one layer of powder paving It being sprinkling upon on molded current layer, the data that equipment calls in a new layer cross section carry out laser fusing, it is bonded with previous layer cross section, This process successively recycles until whole object forms.The whole process of SLM carries out in the Processing Room of inert gas shielding, It is aoxidized at high temperature to avoid metal.
By SLM prints principle: each final part is by melting from level to level, and every one layer of melting is put down Platform decline, new powder are paved with this layer and repeat the above process.Its real forming principle is laser by the energy of certain energy density Amount gets to powder bed, so that powder reaches molten condition in the region scanned, energy density that powder receives and laser Several factors are related, such as scanning speed, sweep span, scan power, and the energy of laser forms hot shadow in metal powder surface It rings area and forms molten bath, molten bath influences surrounding powder and forms welding effect.Laser can be scanned according to certain rule and direction to need Molding melt region is wanted, according to the reasonable naturalization scan path of different materials, scanning area is divided into ribbon, checkerboard Deng, it can effectively discharge inside parts stress, every layer of scan vector of planning can reduce internal flaw, and to obtain consistency higher, The better part of mechanical property.However compared with tradition subtracts material manufacture, lot of materials can be saved.SLM technical restriction: shaping speed It is lower, in order to improve machining accuracy, need with thinner processing thickness.Time used in processing small size part is also longer, therefore It is dfficult to apply to manufacture on a large scale.
From be analyzed above it is found that laser scanning pitch, scanning speed and laser power shaping efficiency is played it is most important Effect.If improving printing effect, surface sweeping spacing can be increased, but molten bath is limited in scope, if spacing is excessive, can made The overlapping rate of cladding width is too small, can seriously reduce surface of shaped parts quality;Scanning speed is affected to consistency, in difference Sweep span under, as the decreasing trend of the reduction consistency of scanning speed is substantially the same, scanning speed be 60mm/s when Consistency highest, but by Surface scan it is found that if reducing scanning speed again, forming surface will appear very serious spherodization, Rough surface is porous, so scanning speed when powder SLM shapes should be 60-90mm/s;When laser power reduces, part Consistency also accordingly reduces, and the energy that increasing laser power can be such that powder absorbs is consequently increased, and promotes powder particles fuse amount Increase, reduce melt viscosity and surface tension, to increase pool depth and width, increases intergranular cohesive force, thus Forming quality and part consistency are improved, under same energy density, but as becoming larger for spot diameter can make it possible to quantity set In in upper surface, the influence that the powder of every layer of lower section good cannot receive laser molten pool is effectively melted, and part matter is directly affected Amount.The tensile strength of part vertical direction reduces, it is easier to generate slight crack.
By to the prior art, paper, patent access, either increase surface sweeping spacing in existing method or improve and swash Optical scanning power method is inherently line-scan mode, and difference is line space size, row scanning mode and laser power Size, but sweep span, laser power and scanning speed have within limits, more than can make after certain threshold value Obtaining surface of shaped parts quality reduces.Therefore existing method still rests on quantitative change level to the raising of SLM printing effect, the present invention It is improved for when SLM progressive scanning mode, scan pattern is become into area surface printing, it is intended to improve SLM printing effect Improve Forming Quality simultaneously.
Summary of the invention
In order to overcome deficiency present in background technique, the purpose of the present invention is to provide a kind of molding faces of Variable Area SLM printing effect can be improved in printing equipment and its Method of printing, reasonable in design, system perfecting, and improves SLM molding The printing equipment of quality.
Technical solution used by the present invention solves the above problems is:
One, the molding face printing equipment of a kind of Variable Area
The present invention includes cooling system, laser source, diode laser array module, collimation lens, condenser lens, work Platform, powder bed and guide rail;Laser source is located in cooling system, by optical fiber by the laser beam in diode laser array module Collimated lens, condenser lens are projected in the powder bed of workbench, form molded part in powder bed, and workbench bottom can be It is moved on guide rail.
The diode laser array module includes multiple diode lasers, is arranged on substrate according to array.
The laser projection region area that the diode laser array module is projected and CAD model maximum cross-section profile Minimum area-encasing rectangle area is identical.
The diode laser array module increases and decreases according to the minimum area-encasing rectangle area of CAD model maximum cross-section profile to swash Light device quantity guarantees that laser projection region area is not less than the rectangular area.
Two, a kind of the step of Method of printing of the molding face printing equipment of Variable Area, the Method of printing includes:
Step 1) inputs CAD model to model layers and determines each layer outline data;
Step 2) determines the mutual inclusion relation of every layer of each profile;
Step 3) determines the specification and number of diode laser array;
Step 4) determines diode laser array in current layer printing path;
Step 5) determines open and-shut mode and the printing of diode laser array according to printing path;
Step 6) updates next layer of outline data, judges whether to have printed all layers of profile, if so, terminating, otherwise Continue to execute step 4) -5), until meeting printing termination condition.
In the step 4), determine diode laser array in the specific steps of current layer printing path are as follows:
Step 4-1) extract current layer all contour curve set C;
Step 4-2) assume that laser number is m in X-direction, laser number is n in Y-direction, is located at jth row, the i-th column The coordinate of laser is (xi, yj), wherein 1≤j≤m, 1≤l≤r;
Step 4-3) for crossing (xi, 0) and perpendicular to the straight line l of Xi, calculate liWith the intersection point of collection of curves C, reject and song Line set C tangent intersection point remembers that intersection point is (x respectivelyi, y1), (xi, y2) ..., (xi, yk);
Step 4-4) open and-shut mode in the i-th column laser judged according to intersection point situation;
Step 4-5) according to step 4-3), step 4-4) successively judge 1,2 ..., the open and-shut mode of m laser.
The each laser of the determination is in the specific steps of the open and-shut mode of current print area according to intersection point situation Judge that the open and-shut mode in the i-th column laser, specific judgment rule are as follows:
In intersection point (xk, y1) and intersection point (xk+1, y1) between laser be all turned on, wherein k be odd number;
In intersection point (xk, y1) and intersection point (xk+1, y1) between laser all close, wherein k be even number.
The invention has the advantages that:
The present invention can be mentioned greatly since by the way of the printing of face, the progressive scan compared to conventional method is printed High SLM printing effect, and improve because of excessive bring warpage of sweep span and other issues.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention.
Fig. 2 is schematic perspective view of the invention.
Fig. 3 is all laser opening and closing schematic diagrames in the embodiment of the present invention.
Fig. 4 is that laser opens signal at every layer cross section profile in the embodiment of the present invention.
Fig. 5 is the opening and closing schematic diagram of each laser in each column laser in the embodiment of the present invention.
Fig. 6 is in the embodiment of the present invention for the molding face Method of printing flow chart of Variable Area.
In figure: 1, cooling system, 2, laser source, 3, diode laser array module, 4, collimation lens, 5, laser beam, 6, condenser lens, 7, workbench, 8, powder bed, 9, molded part, 9.1, molded part Internal periphery, 9.2, molded part outer profile, 10, lead Rail, 11, optical fiber.
Specific embodiment
The present invention is further illustrated with reference to the accompanying drawing and by embodiment.
As shown in Figure 1 and Figure 2, the present invention includes cooling system 1, laser source 2, diode laser array module 3, collimation Lens 4, condenser lens 6, workbench 7, powder bed 8 and guide rail 10;Laser source 2 is located in cooling system 1, by optical fiber 11 by two The collimated lens 4 of laser beam 5, condenser lens 6 in pole pipe laser array module 3 are projected in the powder bed 8 of workbench 7, Molded part 9 is formed in powder bed 8,7 bottom of workbench can move on the rail 9.
The diode laser array module 3 includes multiple diode lasers, is arranged in substrate according to array On.
The laser projection region area and CAD model maximum cross-section profile that the diode laser array module 3 is projected Minimum area-encasing rectangle area it is identical.
The diode laser array module 3 increases and decreases according to the minimum area-encasing rectangle area of CAD model maximum cross-section profile Number of lasers guarantees that laser projection region area is not less than the rectangular area.
It is the stereoscopic schematic diagram of printing equipment of the present invention shown in Fig. 2, wherein laser source 2 is connected to laser battle array by optical fiber 11 Column module 3, the laser projection region projected is identical as the minimum area-encasing rectangle area of printer model maximum cross-section profile, passes through Single laser diode is used parallel, these laser beams 5 can be opened or closed.
The detailed description for specifically judging laser open and-shut mode is provided below with reference to Fig. 3-5:
In the present embodiment, for convenience of explanation, each small circle represents a laser in Fig. 3-5, wherein laser Number with it is inconsistent in Fig. 2;In addition, number of lasers is also that can be set according to the size of practical molded part, such as in practical printing Described in claim 4.
As shown in figure 3, diode laser array module corresponds to entire print area, there is molding under print area Part Internal periphery 9.1 and molded part outer profile 9.2, wherein the laser being located at other than molded part profile 9.2 is entirely closed state, Laser between molded part Internal periphery 9.1 and molded part outer profile 9.2 is in open state, in molded part Internal periphery 9.1 Laser be completely in closed state.Wherein the laser of hollow circular portion is entirely closed state, and solid circular portion indicates It is region to be printed that it is the portion region that laser, which is opened,
Model is under each layering section, and the corresponding laser in profile place is as shown in figure 4, these lasers are in out The mark laser for opening state, and opening and be closed as each column laser.
As shown in figure 5, can determine x point and straight line and molded part perpendicular to X-axis after the x coordinate of given each column The intersection point of Internal periphery 9.1 and molded part outer profile 9.2, i.e. mark laser P1, P2, P3, P4.If being denoted as P1, P2, P3, P4 The laser at place is respectively the 1st, 2,3,4 laser can according to the specific judgment rule of the open and-shut mode of the i-th column laser Know that all lasers are all turned between laser P1-P2, all lasers between laser P2-P3 are turned off, and are swashed All lasers between light device P3-P4 are opened.
It is the Method of printing of the molding face printing equipment of Variable Area of the present invention as shown in Figure 6, printing step includes:
Step 1) is to CAD 3D model layers and determines each layer outline data: under normal circumstances, giving three-dimensional digital model It is stl file, specified lift height is set to stl file and obtains every layer of number of contours according to lift height to the model layers According to;
Step 2) determines the inclusion relation of each layer of profile, to obtain Internal periphery and outer profile data;
Step 3) determines the area of print area according to the minimum area-encasing rectangle of CAD model maximum cross-section, and then determines and swash The specification and number of light device array;
It is actually to be carried out according to current cross-section bottom profiled data to the laser array phase that step 4) face, which prints lower printing path, It divides, it is ensured that each column laser corresponds to entire print area, and carries out digital representation to all lasers, so that it is determined that often The mark laser of closure is opened in column
Step 5) determines each laser in the open and-shut mode of current print area: made the straight line of each column laser, it should Straight line in print area it is inevitable with each contour curve there are intersection point, these intersection points are to open the mark of closure in the column to swash Light device, and then determine the open and-shut mode of laser under all column, the open and-shut mode according to determined laser carries out current layer Printing;
Step 6) updates next layer of outline data, judges whether to have printed all layers of profile, if so, terminating, otherwise Execute step 4) -5) continue to print, it is finished until all layers print.
In the step 4), determine diode laser array in the specific steps of current layer printing path are as follows:
Step 4-1) extract current layer all contour curve set C;
Step 4-2) assume that laser number is m in X-direction, laser number is n in Y-direction, is located at jth row, the i-th column The coordinate of laser is (xi, yj), wherein 1≤j≤m, 1≤i≤r;
Step 4-3) for crossing (xi, 0) and perpendicular to the straight line l of Xi, calculate liWith the intersection point of collection of curves C, reject and song Line set C tangent intersection point remembers that intersection point is (x respectivelyi, y1), (xi, y2) ..., xi, yk);
Step 4-4) open and-shut mode in the i-th column laser judged according to intersection point situation;
Step 4-5) be according to step 4-3), step 4-4) successively judge 1,2 ..., the open and-shut mode of m column laser.
The each laser of the determination is in the specific steps of the open and-shut mode of current print area according to intersection point situation Judge that the open and-shut mode in the i-th column laser, specific judgment rule are as follows:
In intersection point (xk, y1) and intersection point (xk+1, y1) between laser be all turned on, wherein k be odd number;
In intersection point (xk, y1) and intersection point (xk+1, y1) between laser all close, wherein k be even number.

Claims (6)

1. a kind of molding face printing equipment of Variable Area, it is characterised in that: including cooling system (1), laser source (2), two poles Pipe laser array module (3), collimation lens (4), condenser lens (6), workbench (7), powder bed (8) and guide rail (10);Swash Light source (2) is located in cooling system (1), is passed through the laser beam (5) in diode laser array module (3) by optical fiber (11) Collimation lens (4), condenser lens (6) are projected in the powder bed (8) of workbench (7), form molded part on powder bed (8) (9), workbench (7) bottom can move on guide rail (9).
2. the molding face printing equipment of a kind of Variable Area according to claim 1, it is characterised in that: the diode swashs Light device array module (3) includes multiple diode lasers, is arranged on substrate according to array.
3. the molding face printing equipment of a kind of Variable Area according to claim 1, it is characterised in that: the diode swashs The minimum area-encasing rectangle area of laser projection region area and CAD model maximum cross-section profile that optical arrays module (3) is projected It is identical.
4. the molding face printing equipment of a kind of Variable Area according to claim 3, it is characterised in that: the diode swashs Optical arrays module (3) increases and decreases number of lasers according to the minimum area-encasing rectangle area of CAD model maximum cross-section profile, guarantees laser Projected area area is not less than the rectangular area.
5. for a kind of Method of printing of the molding face printing equipment of Variable Area described in claim 1-4, which is characterized in that The step of Method of printing includes:
Step 1) inputs CAD model to model layers and determines each layer outline data;
Step 2) determines the mutual inclusion relation of every layer of each profile;
Step 3) determines the specification and number of diode laser array;
Step 4) determine diode laser array in current layer printing path, specifically:
Step 4-1) extract current layer all contour curve set
Step 4-2) assume that laser number is m in X-direction, laser number is n in Y-direction, is located at theRow, theColumn laser The coordinate of device is, wherein
Step 4-3) for mistakeAnd perpendicular to the straight line of X, calculateWith collection of curvesIntersection point, reject and collection of curvesTangent intersection point remembers that intersection point is respectively);
Step 4-4) judged according to intersection point situationThe open and-shut mode of column laser;
Step 4-5) be according to step 4-3), step 4-4) successively judge 1,2 ..., the open and-shut mode of m column laser;
Step 5) determines open and-shut mode and the printing of diode laser array according to printing path;
Step 6) updates next layer of outline data, judges whether to have printed all layers of profile, if so, terminating, otherwise continues Execute step 4) -5), until meeting printing termination condition.
6. a kind of Method of printing of the molding face printing equipment of Variable Area according to claim 5, which is characterized in that institute The each laser of the determination stated judges according to intersection point situation in the specific steps of the open and-shut mode of current print areaColumn The open and-shut mode of laser, specific judgment rule are as follows:
In intersection pointBetween laser be all turned on, whereinFor odd number;
In intersection pointBetween laser all close, whereinFor even number.
CN201910362283.7A 2019-04-30 2019-04-30 Variable area forming surface printing device and printing method thereof Active CN110170652B (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113103577A (en) * 2021-03-17 2021-07-13 中国科学院福建物质结构研究所 Array type rotating double-prism 3D printing equipment and printing method
CN113305303A (en) * 2021-06-01 2021-08-27 北京凯普林光电科技股份有限公司 Blue light 3D printer and system
CN114101708A (en) * 2021-10-28 2022-03-01 西安交通大学 Lattice laser scanning method and device for laser additive manufacturing
CN114378308A (en) * 2021-11-30 2022-04-22 杭州正向增材制造技术有限公司 Laser printing method and system

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19953000A1 (en) * 1999-11-04 2001-05-17 Horst Exner Rapid e.g. tool, prototype, mold and undercut section production by stereolithographic powder processing employs two beams for welding or sintering
CN204867409U (en) * 2015-04-08 2015-12-16 西南石油大学 High accuracy metal matrix composite material's preparation equipment
CN105608275A (en) * 2015-12-23 2016-05-25 南京航空航天大学 Generating method for printing path used for light three-dimensional model printing
WO2017098417A1 (en) * 2015-12-10 2017-06-15 Prima Electro S.P.A. Laser diode device for additive manufacturing
CN107310156A (en) * 2017-08-26 2017-11-03 吴江中瑞机电科技有限公司 The dynamic zoom scan light path system of many galvanometers of multi-laser
CN207440381U (en) * 2017-09-30 2018-06-01 合肥正阳光电科技有限责任公司 A kind of transmission-type long distance laser focusing arrangement
CN108637252A (en) * 2018-05-16 2018-10-12 南京先进激光技术研究院 3D printing scan method and 3D printer based on SLM technologies
CN109177153A (en) * 2013-06-10 2019-01-11 瑞尼斯豪公司 Selective laser curing apparatus and method
CN109414763A (en) * 2016-07-26 2019-03-01 惠普发展公司,有限责任合伙企业 Three-dimensional (3D) printing

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19953000A1 (en) * 1999-11-04 2001-05-17 Horst Exner Rapid e.g. tool, prototype, mold and undercut section production by stereolithographic powder processing employs two beams for welding or sintering
CN109177153A (en) * 2013-06-10 2019-01-11 瑞尼斯豪公司 Selective laser curing apparatus and method
CN204867409U (en) * 2015-04-08 2015-12-16 西南石油大学 High accuracy metal matrix composite material's preparation equipment
WO2017098417A1 (en) * 2015-12-10 2017-06-15 Prima Electro S.P.A. Laser diode device for additive manufacturing
CN105608275A (en) * 2015-12-23 2016-05-25 南京航空航天大学 Generating method for printing path used for light three-dimensional model printing
CN109414763A (en) * 2016-07-26 2019-03-01 惠普发展公司,有限责任合伙企业 Three-dimensional (3D) printing
CN107310156A (en) * 2017-08-26 2017-11-03 吴江中瑞机电科技有限公司 The dynamic zoom scan light path system of many galvanometers of multi-laser
CN207440381U (en) * 2017-09-30 2018-06-01 合肥正阳光电科技有限责任公司 A kind of transmission-type long distance laser focusing arrangement
CN108637252A (en) * 2018-05-16 2018-10-12 南京先进激光技术研究院 3D printing scan method and 3D printer based on SLM technologies

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ZAVALA-ARREDONDO M 等: "Laser diode area melting for high speed additive manufacturing of metallic components", 《MATERIALS & DESIG》 *
虞钢等: "《激光制造工艺力学》", 31 January 2012, 国防工业出版社 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113103577A (en) * 2021-03-17 2021-07-13 中国科学院福建物质结构研究所 Array type rotating double-prism 3D printing equipment and printing method
CN113103577B (en) * 2021-03-17 2022-06-10 中国科学院福建物质结构研究所 Array type rotating double-prism 3D printing equipment and printing method
CN113305303A (en) * 2021-06-01 2021-08-27 北京凯普林光电科技股份有限公司 Blue light 3D printer and system
CN114101708A (en) * 2021-10-28 2022-03-01 西安交通大学 Lattice laser scanning method and device for laser additive manufacturing
CN114378308A (en) * 2021-11-30 2022-04-22 杭州正向增材制造技术有限公司 Laser printing method and system

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