CN110164806A - Box - Google Patents
Box Download PDFInfo
- Publication number
- CN110164806A CN110164806A CN201910113138.5A CN201910113138A CN110164806A CN 110164806 A CN110164806 A CN 110164806A CN 201910113138 A CN201910113138 A CN 201910113138A CN 110164806 A CN110164806 A CN 110164806A
- Authority
- CN
- China
- Prior art keywords
- box
- chip
- wafer
- pair
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012790 confirmation Methods 0.000 claims abstract description 55
- 238000012545 processing Methods 0.000 claims abstract description 24
- 238000003860 storage Methods 0.000 claims description 7
- 239000011232 storage material Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 66
- NOQGZXFMHARMLW-UHFFFAOYSA-N Daminozide Chemical group CN(C)NC(=O)CCC(O)=O NOQGZXFMHARMLW-UHFFFAOYSA-N 0.000 description 33
- 238000005520 cutting process Methods 0.000 description 24
- 238000003754 machining Methods 0.000 description 19
- 230000011218 segmentation Effects 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241001062009 Indigofera Species 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
- H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Dicing (AREA)
Abstract
Box is provided, be able to confirm that by chip from the case where pulling out in box and returned after processing as defined in implementing.According to the present invention, it provides box (8), it stores chip (W), the box (8) includes: a pair of sidewalls portion (8a) is opposed to be equipped with the multiple accommodating grooves (84) for storing chip (W) in a pair of sidewalls portion (8a)；Top (8b), the top of a pair of sidewalls portion (8a) is linked up；Bottom (8c), the lower part of a pair of sidewalls portion (8a) is linked up；Access unit (8d) is formed by a pair of sidewalls portion (8a), top (8b) and bottom (8c), allows the discrepancy of chip (W)；And back (8e), its opposite side at access unit (8d) prevents chip from falling off, and at least any one party in sidewall portion (8a), access unit (8d) and back (8e) is equipped with the confirmation flag (81) for the discrepancy for being able to confirm that chip (W).
Description
Technical field
The present invention relates to the boxes stored to chip.
Background technique
For example pass through cutting by the chip that segmentation preset lines division is formed with multiple devices such as IC, LSI on front
Device is divided into each device, and is used for the electronic equipments such as mobile phone, personal computer.
Cutter device includes box mounting table, loads the box stored to multiple chips；Carrying-in/carrying-out unit, will
Chip is moved out from the box to interim receiving platform, and is moved in from the interim receiving platform into box；First transport unit, will be brilliant
Piece is transported from interim receiving platform to chuck table；Cutting unit, the chip kept to chuck table are cut；With
And second transport unit, by the wafer transfer after cutting to cleaning unit, which can automatically carry out following one
The operation of series: chip is cut by cutting unit, the chip after cutting is cleaned in cleaning unit, is passed through
First transport unit will be positioned in interim receiving platform by the wafer transfer after cleaning to interim receiving platform, by carrying-in/carrying-out unit
Wafer storage box desired locations.(for example, referring to patent document 1).
Patent document 1: No. 3076179 bulletins of Japanese Patent Publication No.
According to above-mentioned cutter device, it can successively implement machining to the multiple chips being accommodated in box.Chip exists
It is incorporated in box after being supported on the ring-shaped frame with the opening stored to chip by band.It is stored to chip
The sidewall portion of box be opposed to be equipped with multiple accommodating grooves, chip is stored in each accommodating groove.When implementation machining
When, the end for the frame being accommodated in box is held by the handle part of carrying-in/carrying-out unit and is transported to interim receiving platform
On, then moved in from interim receiving platform to chuck table by the first transport unit.But frame is by laminal component shape
At the frame kept sometimes to the chip of major diameter can generate flexure.In the flexure of the frame feelings bigger than the flexure expected
Under condition, although wafer storage in defined position, can not also hold frame by carrying-in/carrying-out unit, can generate nothing
The phenomenon that method pulls out chip from box.In this case, it is judged as that chip is not accommodated in the defined position of box and is not carried out
Processing, the chip for being accommodated in next accommodating groove is moved out and continues machining.
Terminate in the machining to each chip being accommodated in box and cut the chip of completion to be back to shape in box
Under state, operator, which is judged as, is divided into each device for all chips by cutter device, to transporting the box under
One process.But when will include to frame can not hold by carrying-in/carrying-out unit as described above that cutting is not carried out
When the box of the chip of processing is transported to subsequent processing, in subsequent processing, when picking up each device from the band of frame and be welded in
It when circuit board, can lead to the problem of following: can not be interrupted from unprocessed die pick device, production line.Such problems
It is not limited to cutter device, pulls out receipts relative to box moving in multiple wafer storages in box and passing through carrying-in/carrying-out unit
Such problems can be generated in all devices of nano-crystal piece.
Summary of the invention
The present invention is to complete in view of the above fact, and main technical task is to provide box, be able to confirm that from
Chip is pulled out in box and implements the case where defined processing returns later.
In order to solve above-mentioned technical task, according to the present invention, box is provided, chip is stored, wherein the box packet
Contain: a pair of sidewalls portion is opposed to be equipped with the multiple accommodating grooves for storing chip in a pair of sidewalls portion；Top,
The top in a pair of sidewalls portion is linked up；Bottom links up the lower part in a pair of sidewalls portion；Access unit, by
A pair of sidewalls portion, top and the bottom are formed, and chip is allowed to enter and leave；And back, it is prevented in the opposite side of the access unit
Chip falls off, and at least any one party in the sidewall portion, the access unit or the back is equipped with the discrepancy for being able to confirm that chip
Confirmation flag.
It is preferred that the confirmation flag includes at least any one party in color, LED, light bulb, luminous storage material, reflecting plate.The box energy
Enough it is configured to store by the chip for being supported on frame is brought, which has the opening for storing chip.Additionally, it is preferred that
The box is configured to from moving out chip in box and after processing as defined in implementing, when by wafer storage when box, the confirmation mark
Note changes and is able to carry out the discrepancy confirmation of chip.
Box according to the present invention can easily distinguish and return to the chip in box after moving out chip from box and not remove from box
Chip out, can will be not carried out as defined in the chip that handles remove without transporting to subsequent processing, thus by subsequent processing
The interruption of production line prevent trouble before it happens.
Detailed description of the invention
Fig. 1 is the overall perspective view for having moved in the cutter device of box of present embodiment.
Fig. 2 is by the amplified enlarged partial isometric view of the part A of box shown in FIG. 1.
(a) of Fig. 3 is the exploded perspective view of the confirmation flag of present embodiment, and (b) of Fig. 3 is to show to will confirm that mark group
It is filled to the perspective view of the state in confirmation portion.
Fig. 4 is the enlarged partial isometric view being illustrated to the movement of the carrying-in/carrying-out unit of cutter device shown in FIG. 1.
(a), (b) and (c) of Fig. 5 is the partial sectional view for showing the movement for the confirmation flag for being disposed in box shown in FIG. 1.
Fig. 6 is to show in box shown in Fig. 2 that there are the offices of the state of the confirmation flag in the case where raw wafer
Portion's amplification stereogram.
Label declaration
2: cutter device；8: box；8a: sidewall portion；9: box workbench；10: carrying-in/carrying-out unit；16: the first transport unit；
24: cutting unit；25: the second transport unit；27: cleaning device；80: confirmation portion；81: confirmation flag；81a, 81b, 81c: the wing
Portion；811: rotation axle portion；812: central axis；82: opening portion；83: Rotation Controllers；83a: the 1 rake；83b: the 2 inclination
Portion；83c: vertical wall portion；84: accommodating groove.
Specific embodiment
Hereinafter, being illustrated referring to box of the attached drawing to embodiments of the present invention.
The box for moving in present embodiment is shown in FIG. 1 and defined processing (machining) is implemented to wafer W and cuts
Cut the overall perspective view of device 2.
The front-surface side of cutting apparatus 2 is provided with operating unit 4, which inputs processing conditions for operator
Deng the instruction for being directed to device.As shown, the wafer W as machined object is pasted on band T, becoming to be supported on by band T has
The state of the ring-shaped frame F for the opening stored to wafer W is accommodated with multiple in box 8 shown in Fig. 1.In addition, in chip
It is formed with the segmentation preset lines for being set as vertical on the front of W, is formed with device in the multiple regions divided by the segmentation preset lines
Part D.It is that can move up and down to the box workbench 9 of defined position that box 8, which is placed in through driving mechanisms control (not shown),.
Box 8 includes: a pair of sidewalls portion 8a, 8a, they store wafer W；Top 8b, by a pair of sidewalls portion 8a,
The top of 8a links up；Bottom 8c links up the lower part of a pair of sidewalls portion 8a, 8a；Access unit 8d, by an opposite side
Wall portion 8a, 8a, top 8b and bottom 8c are formed, and wafer W is allowed to enter and leave；Back 8e prevents crystalline substance in the opposite side of access unit 8d
Piece falls off；And confirmation portion 80, it is disposed in sidewall portion 8a.Confirmation portion 80 has corresponding with each wafer W of box 8 is accommodated in
The confirmation flag 81 that ground is arranged.
The carrying-in/carrying-out moved in Y direction shown in arrow Y in figure is equipped in front of the discrepancy oral area 8d of box 8
Unit 10.Carrying-in/carrying-out unit 10 hold to the wafer W before machining and by by wafer W from the entrance 8d of box 8
It pulls out and moves out, and the wafer W after cutting is moved in into box 8.It is provided between box 8 and carrying-in/carrying-out unit 10 and temporarily puts
Region 12, wafer W of the interim mounting as carrying-in/carrying-out object make wafer W contraposition constant temporarily putting region 12 and being equipped with
Position the interim receiving platform 14 of a pair.
It is equipped the first transport unit 16 near region 12 temporarily putting, has to the frame F being integrally formed with wafer W
The rotating arm for being adsorbed and being transported is moved out to the wafer W on the interim receiving platform 14 for temporarily putting region 12 single by the first conveying
Member 16 is adsorbed and is transported to as holding unit on the chuck table 18 constituted, and is attracted by the chuck table 18,
And frame F is fixed by multiple fixtures 19, to be maintained on chuck table 18.
Chuck table 18 be configured to rotation and can by processing feed unit (not shown) as process into
To moving back and forth in the X-direction in direction, it is single that alignment is configured in the top of the movement routine of the X-direction of chuck table 18
Member 20, which detects the segmentation preset lines to be cut of wafer W.
Aligned units 20 have the shooting unit 22 shot to the front of wafer W, are obtained according to shooting unit 22
Image, handled, the segmentation preset lines to be cut can be detected by pattern match etc..It is obtained by shooting unit 22
Image be sent to control unit (not shown), and be shown in display unit.
The cutting that the wafer W kept to chuck table 18 implements machining is equipped in the left side of aligned units 20
Unit 24.Cutting unit 24 is integrally formed with aligned units 20, and the two links and moves in Y direction and Z-direction.
Cutting unit 24 is configured to be equipped with cutting tool 28 in the front end for the main shaft 26 that can be rotated, and can be in Y
It is moved in axis direction and Z-direction.Cutting tool 28 is located on the extended line of the X-direction of shooting unit 22.
Fig. 2 is by the amplified enlarged partial isometric view of part A of box 8 shown in FIG. 1.As shown, in the side wall of box 8
Portion 8a is equipped with confirmation portion 80, which is used to confirm the discrepancy of the multiple wafer Ws for the inside for being accommodated in box 8.Confirmation portion
80 have confirmation flag 81 and for making the opening portion 82 outstanding of confirmation flag 81.Confirmation flag 81 is formed as by from formation
It is protruded in the opening portion of sidewall portion 8a 82 and can be configured to the discrepancy according to wafer W from external visual and change its state.
More specific description is carried out to confirmation portion 80 referring to Fig. 3.(a) of Fig. 3 be by sidewall portion 8a opening portion 82 bottom
The section that the height of portion 82a is cut in the horizontal direction, be will confirm that label 81 and Rotation Controllers 83 removed from confirmation portion 80 and
The perspective view of the state of decomposition.In addition, (b) of Fig. 3 is to show to be assembled with confirmation flag 81 and rotation control in confirmation portion 80
The perspective view of the state of device 83.As shown in (a) of Fig. 3, confirmation flag 81 has rotation axle portion 811, is arranged in rotation axle portion 811
There are three alar part 81a, 81b and 81c.Alar part 81a, 81b and 81c are in plan view according to 120 ° of equally spaced arranging.Separately
Outside, it is coated with red coating on the alar part 81a indicated with point, the coating of blue is coated on the alar part 81b indicated with oblique line,
The coating of white is coated on the alar part 81c indicated with white background.Center up and down is equipped at the center of rotation axle portion 811
Axis 812, confirmation flag 81 are pivoted about with central axis 812.
Bottom 82a in opening portion 82 is formed with the recess portion 82b stored to Rotation Controllers 83.In addition, with it is recessed
Portion 82b adjacent position, which is formed with, will confirm that the bearing of central axis 812 of label 81 is the support holes 82d that can be rotated.In addition, branch
Bearing bore 82d is also formed in the top of opening portion 82.
Rotation Controllers 83 has the function of being controlled the rotation of the confirmation flag 81 in confirmation portion 80.Such as Fig. 3
(a) it shown in, is formed in the upper surface of Rotation Controllers 83 inclined in the way of declining when overlooking towards counter clockwise direction
1st rake 83a, and be adjacent to the 1st rake 83a and be formed in the way of declining when overlooking towards clockwise direction
Inclined 2nd rake 83b.It is formed with vertically in the end of the counter clockwise direction side of the 1st rake 83a of Rotation Controllers 83
The end of wall portion 83c, vertical wall portion 83c and the 2nd rake 83b form about 120 ° of angle when looking down.In the 1st rake
Contact portion between 83a and the 2nd rake 83b is formed with crest line 83d, and crest line 83d is formed in deviation due to aftermentioned
Clockwise position (such as the position for being 65 ° with the side vertical wall portion 83c).As a result, the 1st rake 83a become with
2nd rake 83b compares the lesser gently sloping surface of tilt angle, and the 2nd rake 83b becomes greatly sloped side.In Rotation Controllers 83
Lower surface is equipped with spring 83e, and when Rotation Controllers 83 is assembled to confirmation portion 80, spring 83e is contained and is fixed on bullet
Spring incorporating section 82c.Rotation Controllers 83 is configured to move up and down in recess portion 82b.
Shown in (b) of Fig. 3 in the state of confirmation flag 81, white alar part 81c is vertical with Rotation Controllers 83
Wall portion 83c is abutted, and the end abutment of the inclined surface of red alar part 81a and the 2nd rake 83b.Rotation Controllers as a result,
83 block clockwise as the rotation for hindering confirmation flag 81 in the case where overlook view functions, inverse
Development of resistance function when on clockwise as rotation.
The box 8 of present embodiment and the cutter device 2 for having moved in box 8 are substantially constituted as described above, referring to figs. 1 to figure
6, it is acted on and is illustrated.
When implementing machining using cutter device 2, operator removes the box 8 for being accommodated with multiple raw wafer W
Enter to cutter device 2, and is placed on box workbench 9.At this point, as shown in figure 4, the wafer W for being accommodated in box 8 is incorporated in be formed
In the accommodating groove 84 of the inner wall of sidewall portion 8a, 8a of box 8.By storing raw wafer W, such as Fig. 5 in accommodating groove 84
(a) shown in become following state: to the indigo plant of the side of the raw wafer W frame F kept and confirmation flag 81
The alar part 81b of color and the alar part 81c of white are abutted.Therefore, when being carried out really from side to the box 8 for being accommodated with raw wafer W
When recognizing, as shown in Fig. 2, becoming the alar part 81a of red from the state outstanding of all opening portions 82 in confirmation portion 80.
When starting the machining of cutter device 2 according to the instruction of operator, as shown in figure 4, being accommodated in the regulation of box 8
The wafer W of position be moved to and move out the handle part 10a of unit 10 and hold frame F and pulled out to Y direction, temporarily putting region
The clamping is released on the interim receiving platform 14 of 12 a pair.Also, move interim receiving platform 14 in a direction close to each other, thus
Wafer W is positioned to the center for temporarily putting region 12.In addition, for ease of description, the first transport unit 16 is omitted in Fig. 4
Diagram.
Then, frame F is adsorbed by the first transport unit 16, make the first transport unit 16 rotate and will be with frame
The wafer W that F is integrally formed is transported to chuck table 18, and is kept by chuck table 18.Then, chuck table
18 move in the X-axis direction and are positioned at wafer W the underface of aligned units 20.When wafer W is located in aligned units 20
Underface when, shooting unit 22 shoots the front of wafer W, displays the captured image single in display (not shown)
Member searches for 2 key patterns of the target as pattern match.The key pattern for example can use the device for being formed in wafer W
The characteristic of circuit in part D.
When completing the pattern match between this 2 points, keeps the straight line for connecting two key patterns parallel with segmentation preset lines, press
Move cutting unit 24 in the Y-axis direction according to key pattern and the distance between the center line of segmentation preset lines, to complete
The contraposition of the segmentation preset lines to be cut and cutting tool 28.
When making chuck table 18 in the state of the contraposition of the segmentation preset lines that be cut and cutting tool 28
Cutting water is moved and be properly supplied in the X-axis direction, and makes cutting unit while making 28 high speed rotation of cutting tool
When 24 decline, the segmentation preset lines aligned are cut.
One side is according to the spacing for the segmentation preset lines for being stored in control unit (not shown) to cutting unit 24 in Y direction
Cutting is repeated in upper progress indexing feeding on one side, to all cut equidirectional segmentation preset lines.In addition, making
After chuck table 18 is rotated by 90 °, cutting similar to the above is carried out, to make vertical with the segmentation preset lines cut before
Segmentation preset lines also cut completely, be divided into each device D.
After moving chuck table 18 in the X-axis direction, pass through the second conveying that can be moved in the Y-axis direction
25 pairs of the unit wafer Ws for terminating cutting are held and are transported to cleaning device 27.In cleaning device 27, on one side from not shown
Washer jet injection water make wafer W low speed rotation (such as 300rpm) on one side, to be cleaned to wafer W.
After the washing, followed while making wafer W high speed rotation (such as 3000rpm) air nozzle spray air and it is right
Wafer W is dried, and then adsorb to wafer W being back to by the first transport unit 16 and temporarily puts region 12, then leads to
Cross the original reception position that carrying-in/carrying-out unit 10 makes wafer W be back to box 8.By implementing to each wafer W for being accommodated in box 8
Above-mentioned movement can implement machining to all wafers W for being accommodated in box 8.
Here, more specific description is carried out to the effect of the confirmation flag 81 when implementing above-mentioned machining.Such as according to Fig. 5
(a) it is illustrated as, in the state that raw wafer W is accommodated in box 8, the alar part of frame F and confirmation flag 81
81b, alar part 81c are abutted, to make to indicate that red alar part 81a is prominent from opening portion 82.At this point, the lower surface quilt of alar part 81c
It is positioned on the 1st rake 83a of Rotation Controllers 83, but is equipped with spring 83e in the lower surface of Rotation Controllers 83, rotate
Controller 83 againsts spring 83e into the recess portion 82b for the bottom 82a for being formed in opening portion 82 by the effect of alar part 81c
It sinks to.At this point, the effect of confirmation flag 81 is wanted to inverse in the effect by the reaction force of the 1st rake 83a and spring 83e
The power of clockwise rotation.Here, when in order to implement machining and by the chip in the defined accommodating groove 84 for being accommodated in box 8
The frame F of W when direction shown in arrow (direction of access unit 8d) pull-out, is solved by carrying-in/carrying-out unit 10 in (b) of Fig. 5
Except the abutting state of the alar part 81b and 81c of the side and confirmation flag 81 of frame F.Then, as shown in (b) of Fig. 5, pass through the 1st
The effect of the reaction force of rake 83a and spring 83e and rotate the direction shown in arrow into figure of confirmation flag 81, from opening
From the point of view of oral area 82, any alar part of confirmation flag 81 becomes state outstanding not vertical with sidewall portion 8a.
When implementing machining to the wafer W pulled out from box 8, the wafer W completed the process passes through carrying-in/carrying-out list
Member 10 is back in the defined accommodating groove for the box 8 stored before processing.As Fig. 5 (c) in shown in arrow, when by moving in
When moving out unit 10 makes wafer W be back to box 8, frame F is abutted with the alar part 81c of white and is made confirmation flag 81 to shown in arrow
Direction rotate 60 °.As described above, the crest line 83d of Rotation Controllers 83, which is formed in, is biased to clockwise position, therefore
During being somebody's turn to do, the lower surface of red alar part 81a slips over and is got on the inclined surface of the 2nd rake 83b of Rotation Controllers 83
It crosses crest line 83d and reaches the 1st rake 83a.Then, the front end of alar part 81a is abutted with the side of frame F, confirmation flag 81
Stop.Blue alar part 81b can be visual from side from the protrusion of opening portion 82 as a result,.That is, confirmation flag 81 does not add from expression
The red alar part 81a of the state of work is transformed to indicate to complete the alar part to the blue of the machining for the wafer W stored
81b.Operator confirmation flag 81 can easily verify that the chip as defined in being accommodated in accommodating groove 84 by visual observation as a result,
The machined completion of W.
In addition, being illustrated to following situation: in the cutter device 2 for the box 8 for being placed with present embodiment, when to receipts
When being contained in the wafer W implementation machining of box 8, carrying-in/carrying-out unit 10 is set to be difficult to clamp frame due to flexure of frame F etc.
F, to generate the phenomenon that can not implementing machining to a part for the wafer W for being accommodated in box 8.Although to box 8 is accommodated in
Multiple wafer Ws implement machining, but do not pull out the wafer W that do not processed by carrying-in/carrying-out unit 10 existing
In the case of, from the foregoing it may be appreciated that the confirmation flag 81 for being located at the confirmation portion 80 of the box 8 kept to wafer W does not rotate,
Always indicate the red alar part 81a of unprocessed state.As a result, as shown in fig. 6, operator can be from side by visual observation
There is the red alar part 81a mixed in together with the alar part 81b for the blue for indicating to complete the process, energy to confirm in confirmation flag 81
Enough easily verify that there are raw wafer W.Therefore, operator can remove not before by the conveying to subsequent processing of box 8
The wafer W of processing additional to raw wafer W can implement machining, so as to avoid in subsequent processing from
The problem of raw wafer W carries out the pickup of device D and interrupts production line.
Since above-mentioned confirmation flag 81 is made of three alar part 81a~81c, such as directly box 8 can be transported
Into the processing unit for the processing for implementing subsequent processing, the function of confirmation flag 81 can be also utilized in subsequent processing.More
For body, in subsequent processing, in blue alar part 81b in the situation outstanding of the confirmation portion of box 8 80, it is confirmed as wafer W not
Processing, move out wafer W from the access unit 8d of box 8 and implement the defined working process in subsequent processing and the case where return
Under, confirmation flag 81 is rotated into the alar part 8c of white, and the wafer W for being confirmed as being accommodated in box 8 completes the process.
In the above-described embodiment, it will confirm that label 81 is disposed in sidewall portion 8a, the confirmation flag 81 is by being disposed in rotation
The red alar part 81a of shaft 811, the alar part 81b of blue, white alar part 81c are constituted, but not limited to this.Confirmation flag 81
Access unit 8d or back 8e can also be disposed in.Alternatively, it is also possible to which diverse storage is arranged in each alar part of confirmation flag 81
Body of light, reflecting plate etc. and the machining state for being able to confirm that stored wafer W.Alternatively, it is also possible to be configured to be formed in box 8
Proximity sensor is arranged in each accommodating groove of sidewall portion 8a and the receiving state of wafer W is detected, in the sidewall portion of box 8
At least any one party in 8a, access unit 8d and back 8e is according to side corresponding with each wafer W of accommodating groove is accommodated in
The illuminator being made of LED or light bulb etc. is arranged in formula.In such a case it is possible to be configured to the connection according to the proximity sensor,
Cut-off signal detects the discrepancy of wafer W, makes that LED or light bulb are lighted, extinguished and confirming wafer W is undressed and processes
Which of at.In addition, when LED light or light bulb is arranged, such as the LED of two kinds of colors, light bulb can be arranged to distinguish not
It processes, complete the process.In addition, being configured in the case where constituting confirmation flag and LED or light bulb is arranged in box 8
Power supply is not arranged in box 8, but provides power supply by contact from 9 side of box workbench of mounting box 8.
Claims (4)
1. a kind of box, stores chip, wherein
The box includes:
A pair of sidewalls portion is opposed to be equipped with the multiple accommodating grooves for storing chip in a pair of sidewalls portion；
Top links up the top in a pair of sidewalls portion；
Bottom links up the lower part in a pair of sidewalls portion；
Access unit is formed by a pair of sidewalls portion, top and the bottom, and chip is allowed to enter and leave；And
Back prevents chip from falling off in the opposite side of the access unit,
At least any one party in the sidewall portion, the access unit or the back is equipped with the confirmation for being able to confirm that the discrepancy of chip
Label.
2. box according to claim 1, wherein
The confirmation flag includes any way in color, LED, light bulb, luminous storage material or reflecting plate.
3. box according to claim 1 or 2, wherein
Box storage is supported on the chip of frame by band, which has the opening stored to chip.
4. box according to any one of claims 1 to 3, wherein
When chip is moved out from the box and processing as defined in implementing and by wafer storage when the box, which becomes
Change and be able to confirm that the discrepancy of chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018025863A JP7046635B2 (en) | 2018-02-16 | 2018-02-16 | cassette |
| JP2018-025863 | 2018-02-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110164806A true CN110164806A (en) | 2019-08-23 |
| CN110164806B CN110164806B (en) | 2024-03-19 |
Family
ID=67645362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910113138.5A Active CN110164806B (en) | 2018-02-16 | 2019-02-13 | Box (B) |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7046635B2 (en) |
| CN (1) | CN110164806B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI728858B (en) * | 2020-07-07 | 2021-05-21 | 頎邦科技股份有限公司 | Storage box for electronic devices |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102190131A (en) * | 2010-03-16 | 2011-09-21 | 株式会社迪思科 | Storage box |
| WO2014080500A1 (en) * | 2012-11-22 | 2014-05-30 | 富士機械製造株式会社 | Component mounting machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0880989A (en) * | 1994-07-11 | 1996-03-26 | Disco Abrasive Syst Ltd | Wafer cassette and method for using the same |
-
2018
- 2018-02-16 JP JP2018025863A patent/JP7046635B2/en active Active
-
2019
- 2019-02-13 CN CN201910113138.5A patent/CN110164806B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102190131A (en) * | 2010-03-16 | 2011-09-21 | 株式会社迪思科 | Storage box |
| WO2014080500A1 (en) * | 2012-11-22 | 2014-05-30 | 富士機械製造株式会社 | Component mounting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110164806B (en) | 2024-03-19 |
| JP7046635B2 (en) | 2022-04-04 |
| JP2019145557A (en) | 2019-08-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4775281A (en) | Apparatus and method for loading and unloading wafers | |
| CN109175680B (en) | Full-automatic PCB ultraviolet laser cutting machine | |
| KR100496949B1 (en) | Method and apparatus for mounting electronic components | |
| KR20190034858A (en) | Die bonding apparatus | |
| WO2016129069A1 (en) | Component supply device | |
| KR20080091730A (en) | Chip mounting apparatus and changing method for separation facilitation head in chip mounting apparatus | |
| KR101983375B1 (en) | Apparatus for supplying workpiece automatically | |
| KR20120120933A (en) | A component mounting machine | |
| CN107006142B (en) | Work machine and storage method | |
| CN110164806A (en) | Box | |
| US20050217217A1 (en) | Turn-over mechanism for packaging asymmetrically shaped articles | |
| US20220344185A1 (en) | Calibration pod for robotic wafer carrier handling and calibration performed using same | |
| WO2015097865A1 (en) | Component mounting device and component mounting method | |
| CN108136595B (en) | Component supply system and pick-up device for distributed components | |
| CN110651538B (en) | Working machine and calculation method | |
| KR20070107456A (en) | Condenser cutting apparatus and method thereof | |
| KR101030292B1 (en) | Machining apparatus | |
| JP2019197929A (en) | Component holding device, and suction nozzle determination method | |
| JP2022064087A (en) | Storage method of chip package and processing method of package substrate | |
| KR100483653B1 (en) | Sawing Sorter System | |
| US20180093357A1 (en) | Component mounter and component mounting method | |
| JP6420578B2 (en) | Tool assignment method, tool assignment apparatus, and substrate work machine | |
| WO2023084686A1 (en) | Component mounting machine and method for manufacturing substrate | |
| JP2000151189A (en) | Device and method for mounting electronic component | |
| JP7386392B2 (en) | Parts placement device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |