CN110153079A - A kind of base-plate cleaning head and base plate cleaning device - Google Patents
A kind of base-plate cleaning head and base plate cleaning device Download PDFInfo
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- CN110153079A CN110153079A CN201910440128.2A CN201910440128A CN110153079A CN 110153079 A CN110153079 A CN 110153079A CN 201910440128 A CN201910440128 A CN 201910440128A CN 110153079 A CN110153079 A CN 110153079A
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- Prior art keywords
- cleaning
- hole
- base
- pad
- cleaning pad
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- 238000004140 cleaning Methods 0.000 title claims abstract description 280
- 239000012530 fluid Substances 0.000 claims abstract description 118
- 239000000758 substrate Substances 0.000 claims abstract description 87
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 56
- 239000003344 environmental pollutant Substances 0.000 claims abstract description 32
- 231100000719 pollutant Toxicity 0.000 claims abstract description 32
- 238000005086 pumping Methods 0.000 claims description 10
- 230000002209 hydrophobic effect Effects 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 55
- 230000000694 effects Effects 0.000 description 15
- 238000010586 diagram Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 9
- 238000005498 polishing Methods 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 7
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
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- 230000008569 process Effects 0.000 description 5
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- 238000010521 absorption reaction Methods 0.000 description 3
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- 230000008025 crystallization Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007521 mechanical polishing technique Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/044—Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
- B08B5/043—Cleaning travelling work
Abstract
The invention discloses a kind of base-plate cleaning heads, Circular cleaning pads including being connected to the pedestal lower surface with certain thickness disk-shaped base and with one heart, the pedestal through-thickness has multiple channels, the cleaning pad has multiple through-holes, each through-hole is coupled to different channels, different fluid hoses extends through the through-hole in the channel to the cleaning pad, so that cleaning solution can be sprayed to substrate surface via the fluid hose and through-hole and be siphoned away after in conjunction with pollutant by other through-holes.
Description
Technical field
The invention belongs to chemical Mechanical Polishing Technique fields, in particular to a kind of base-plate cleaning head and base-plate cleaning
Device.
Background technique
With the rapid development of semiconductor industry, integrated circuit feature size constantly tends to miniaturize, semiconductor wafer to
Small size, high circuit closeness, quick, low power consumption direction are developed, and integrated circuit has entered very large scale integrated circuit sub-micro
The technological phase of meter level.Along with being gradually increased for silicon wafer diameter, line width gradually reduces in element, the increasing of number of metal
More, the planarization of semiconductor film film surface has important influence, silicon wafer to the high-performance, low cost, high finished product rate of device
The flatness requirement on surface will be increasingly stringent.
Currently, chemically mechanical polishing (CMP, Chemical Mechanical Planarization) is global as obtaining
The planarization techniques of planarization effect have developed into and integrate the technologies such as polishing, board transport, online measuring, cleaning
Chemical Mechanical Polishing Technique.Substrate is usually pull-in on the lower part of carrier head by this cmp method, and substrate has heavy
Lamination is connected on one side on the polishing pad of rotation, carrier head under the drive of driving part with polishing pad rotating Vortex and give
The downward load of substrate；Meanwhile polishing fluid is supplied in the upper surface of polishing pad and is distributed between substrate and polishing pad, in chemistry
And the completing substrate overall situation polishes under mechanical comprehensive function.After substrate is chemically-mechanicapolish polished, it can be remained in substrate surface
The removal object and polishing fluid of processing, in order to remove the pollutant of substrate surface in time, chemical-mechanical polisher configuration is corresponding
Cleaning unit.
Currently, cleaning unit mainstream is cleaned configured with the cleaning of substrate vertical mode and substrate level mode, every kind of substrate
Cleaning unit configuration is not again identical.The cleaning unit of vertical mode can save the device space, the technique of megasonic cleaning and scrub
Consistency is more preferable, but due to being affected by gravity during drying, drying effect is not so good as horizontal mode, and the cleaning list of horizontal mode
Be unfavorable for pollutant removes substrate surface to member in time again.
Therefore, it needs to design a kind of base-plate cleaning head and base plate cleaning device, solves technology existing in the prior art and ask
Topic.
Summary of the invention
The present invention is directed to solve one of the technical problems existing in the prior art at least to some extent.For this purpose, of the invention
It is proposed a kind of base-plate cleaning head, comprising: there is certain thickness disk-shaped base and be connected to the pedestal lower surface with one heart
Circular cleaning pads, the pedestal through-thickness have multiple channels, and the cleaning pad has multiple through-holes, each through-hole coupling
To different channels, different fluid hoses extends through the through-hole in the channel to the cleaning pad, so that cleaning solution can be via
The fluid hose and through-hole are sprayed to substrate surface and are siphoned away after in conjunction with pollutant by other through-holes.
Preferably, the through-hole is equidistantly uniformly distributed along the circumference with different-diameter of the cleaning pad.
Preferably, the through-hole is equidistantly uniformly distributed along the radial direction of the cleaning pad.
Preferably, two adjacent through-holes are respectively used to spray and siphon away cleaning solution.
Preferably, the radius of the cleaning pad is less than the radius of the pedestal.
Preferably, connecting plate is detachably provided between the pedestal and cleaning pad, the connecting plate has and cleaning
Pad the through-hole that is equally distributed, different fluid hoses extends through the channel of the pedestal and the through-hole of connecting plate to the cleaning pad
Through-hole, cleaning solution is sprayed via the through-hole of fluid hose and cleaning pad to substrate surface, alternatively, passing through cleaning solution
It is siphoned away by the through-hole and fluid hose of the cleaning pad coupled from substrate surface.
Preferably, the inner wall of the fluid hose is provided with hydrophobic layer.
Preferably, the lower surface of the cleaning pad is provided with multiple protrusions.
Preferably, the radius of the cleaning pad is less than the radius of substrate.
Meanwhile the invention also discloses a kind of base plate cleaning devices comprising base-plate cleaning head recited above, cleaning head
Driving device, apparatus for fixing substrate, first fluid pipeline, second fluid pipeline, so that the cleaning head can be away from substrate surface one
Set a distance is parallel to substrate surface movement, and the first fluid pipeline and second fluid pipeline are respectively by cleaning head and liquid-supply unit
It is connected with pumping cells.
Base-plate cleaning head and its base plate cleaning device described herein, it is structurally reasonable, it can quickly remove substrate table
The pollutant in face, high-efficiency washing substrate surface.
Detailed description of the invention
It will be apparent and be easier to understand by made detailed description, advantages of the present invention in conjunction with the following drawings,
These attached drawings are only schematical, are not intended to limit protection scope of the present invention, in which:
Fig. 1 is the structural schematic diagram of base-plate cleaning head of the present invention；
Fig. 2 is the component disassembly diagram of Fig. 1 counterpart substrate cleaning head；
Fig. 3 to Fig. 4 is the distribution schematic diagram of through-hole on the cleaning pad of the present invention；
Fig. 5 is the structural schematic diagram of another embodiment of base-plate cleaning head of the present invention；
Fig. 6 is the perspective view of the cleaning pad of the present invention；
Fig. 7 is the structural schematic diagram of base plate cleaning device of the present invention；
Fig. 8 is the schematic diagram of base-plate cleaning head and its connecting line in Fig. 7；
Fig. 9 is the structural schematic diagram of another embodiment of base plate cleaning device of the present invention；
Figure 10 to Figure 11 is the structural schematic diagram of cleaning head driving apparatus of the present invention.
Wherein, the meaning of numerals is as follows:
1000- base plate cleaning device；
100- cleaning head；
200- apparatus for fixing substrate；
300- cleans head driving apparatus；
301- cross bar；302- vertical bar；
10- pedestal；The channel 11-；1101- upper opening；1102- lower opening；12. fluid hose；
20- cleaning pad；21- through-hole；22- protrusion；
30- substrate holding apparatus；31- through-hole；
40- first fluid pipeline；
50- second fluid pipeline；
60- liquid-supply unit；
70- pumping cells；
80- rotating electric machine；
90- pollutant and/or the cleaning solution of splashing.
Specific embodiment
Combined with specific embodiments below and its attached drawing, technical solution of the present invention is described in detail.It records herein
Embodiment be specific specific embodiment of the invention, for illustrating design of the invention；These explanations are explanatory
With it is illustrative, should not be construed as the limitation to embodiment of the present invention and the scope of the present invention.Except the implementation recorded herein
Exception, those skilled in the art can also be based on the claim of this application books and its specification disclosure of that using aobvious and easy
The other technical solutions seen, these technical solutions include any obviously replacing using to making for the embodiment recorded herein
The technical solution changed and modified.
The attached drawing of this specification is schematic diagram, aids in illustrating design of the invention, it is schematically indicated the shape of each section
And its correlation.It should be understood that for the ease of clearly showing the structure of each component of the embodiment of the present invention, it is each attached
It is not drawn according to identical ratio between figure, identical reference marker is for indicating identical part in attached drawing.
The structural schematic diagram of base-plate cleaning head of the present invention, as shown in Figures 1 and 2, base-plate cleaning head 100 include pedestal
10 and cleaning pad 20, the pedestal 10 is disc-shaped structure, and pedestal 10 has certain thickness, 10 edge of pedestal in the axial direction
Its thickness direction is provided through the channel 11 of multiple axis for being parallel to pedestal 10, extends to pedestal 10 above the channel 11
Upper surface and form upper opening 1101 in the upper surface, extend to below the channel 11 lower surface of pedestal 10 and
The lower surface forms lower opening 1102；The cleaning pad 20 is removably connected to 10 lower surface of pedestal, cleaning pad with one heart
20 have multiple through-holes 21 for running through setting vertically along its thickness direction, different fluid hoses 12 extend through the channel 11 to
The through-hole 21 of the cleaning pad 20, allow external cleaning solution or gas via fluid hose 12 flow into cleaning head 100 and from
The lower end of the through-hole 21 of cleaning pad 20 is flowed out, to make external cleaning solution or gas injection to the surface of substrate to be cleaned；Class
As, the lower end after the cleaning solution of injection to substrate surface to be cleaned is in conjunction with the pollutant of substrate surface, by fluid hose 12
Suction function and be inhaled into cleaning head 100 from the lower end of the fluid hose of cleaning head 100 12 and from the fluid hose of cleaning head 100 12
Upper end outflow, the pollutant of substrate surface is siphoned away by the fluid hose 12 of cleaning head 100 with realizing, and then completes to substrate
The cleaning on surface.
As the one aspect of the present embodiment, the inner wall in the channel 11 of the outer wall and pedestal 10 of the fluid hose 12, which seals, to be connected
It connects, so that cleaning solution under the action of negative pressure containing pollutant can only be delivered to from the bottom to top cleaning head by fluid circuit 12
100 outside；In the embodiment shown in fig. 1, the section radius for conveying the channel 11 of cleaning solution is equal to for siphoning away containing dirt
The section radius in the channel 11 of the cleaning solution of object is contaminated, correspondingly, the caliber of the fluid hose 12 for conveying cleaning is equal to for inhaling
Walk the caliber of the fluid hose 12 of the cleaning solution containing pollutant；It is understood that the channel 11 of the conveying cleaning solution is cut
Radius surface may also be distinct from that the section radius in the channel 11 for siphoning away the cleaning solution containing pollutant, correspondingly, for defeated
The caliber of the fluid hose 12 of cleaning is sent to be different from the caliber for siphoning away the fluid hose 12 of the cleaning solution containing pollutant.As this
The one aspect of embodiment, institute's fluid hose are made of the highly stable inert material of itself chemical property, such as polyethylene, polychlorostyrene second
Alkene etc., the pollutant for not having to cleaning solution and its substrate surface react, and improve the durable of base-plate cleaning head to a certain extent
Property.
It should be noted that the effect of setting fluid hose 12 and beneficial effect are, if being not provided with fluid hose 12, clean
Liquid contains and the cleaning solution of pollutant transmits between cleaning head and substrate via the channel 11 of pedestal 10, in base-plate cleaning mistake
The pollutant and/or cleaning solution that generate in journey and its crystallization are easily collected on the inner wall in the channel 11 of pedestal 10, if pedestal 10
Thickness is excessive and causes the length in the channel 11 of pedestal 10 too long, then is difficult to thoroughly clean the inner wall in long and narrow channel 11；Fluid
The setting of pipe 12 can not consider the problems of that the channel 11 of pedestal 10 is difficult to clean, can flexible setting pedestal 10 as needed height
Degree.When carrying out the maintenance operation of cleaning head 100, only fluid hose 12 need to be removed out of the channel of pedestal 10 11 and be cleaned i.e.
Can, the maintenance time of cleaning head is shortened, the maintenance cost of cleaning head 100 is significantly reduced.
As the one aspect of the present embodiment, the fluid hose 12 extends to cleaning pad 20 via the channel 11 of pedestal 10
Through-hole 21, the lower surface a distance of the lower end of fluid hose 12 apart from cleaning pad 20 avoids in base-plate cleaning process medium fluid
The lower end of pipe 12 is in contact with the functional structure body of substrate surface and destroys substrate to be cleaned, causes the yield rate of base-plate cleaning
It reduces.As the another aspect of the present embodiment, the pipe thickness of the fluid hose 12 is 0.5-1.5mm, so that fluid hose 12 has
There is certain flexibility, more easily to pass through the through-hole 21 by extending to cleaning pad 20 of pedestal 10.
The cleaning pad 20 for being removably connected to 10 lower surface of pedestal with one heart is circular configuration, the upper table of the circular configuration
Face it is parallel with lower surface to make cleaning pad 20 diametrically have uniform thickness, and the upper surface of the cleaning pad 20 and
Lower surface is plane；According to an aspect of an embodiment of the present invention, the lower surface of cleaning pad 20 settable multiple raised 22；Clearly
Clean pad 20 with a thickness of 0.1mm to 22mm, it is preferred that cleaning pad 20 with a thickness of 10mm to 20mm so that cleaning pad 20 can be with
The liquid of a certain amount of such as cleaning solution etc of adsorption/absorption, cleaning pad 20 can become soft after liquid described in adsorption/absorption
It is soft, to guarantee that cleaning pad 20 can effectively remove pollutant when contacting with substrate surface to be cleaned and not to described to clear
It washes substrate surface to cause to damage, i.e. guarantee cleaning pad 20 not feature structure of wounded substrate while cleaning base plate surface；Root
According to the another aspect of the embodiment of the present invention, cleaning pad 20 is made of porous polymeric materials, and specifically, cleaning pad 20 can be by polyethylene
Times of alkoxide polymer, acrylate copolymer, polyoxyethylene polymer, polyether polymer, condensation polymer and urethane resin
A kind of polymeric material of anticipating is made.
Cleaning pad 20 has multiple through-holes 21 for running through setting vertically along its thickness direction, each through-hole 21 of cleaning pad 20
The channel 11 different from pedestal 10 corresponds connection, and fluid hose 12 extends to cleaning pad 20 via the channel 11 of pedestal 10
Through-hole 21, so that cleaning solution can be sprayed via the through-hole 21 of fluid hose 12 and cleaning pad 20 to the surface of substrate to be cleaned, alternatively,
So that cleaning solution in conjunction with pollutant after through being delivered to outside cleaning head 100 by the through-hole 21 and fluid hose 12 of cleaning pad 20.
As shown in figure 3, the through-hole 21 is distributed on the circumference with different radii of the cleaning pad 20, so that cleaning
Liquid can between substrate surface and cleaning head 100 constant flow；Fig. 3 shows the position distribution of the through-hole 21 of cleaning pad 20, leads to
Hole 21 is distributed in the circumference C with different radiinOn (n, n are positive integer for n=1,2,3 ...), the circumference CnWith cleaning pad 20
Geometric center O be the center of circle distribution, circumference C with different radii of the through-hole 21 along cleaning pad 20nEquidistantly it is uniformly distributed
In cleaning pad 20, it is meant that, the distance between adjacent two through-hole 21 on same circumference is equal.According to the present embodiment
One aspect, the effect of the through-hole 21 in adjacent circumferential can be different, for example, cleaning solution is via most inner side circumference C1On it is more
After a injection to the surface of substrate to be cleaned of through-hole 21, in circumference C1Through-hole 21 discharge pressure and adjacent circumferential C2Through-hole
Via circumference C under the collective effect of 21 pull of vacuum2On multiple through-holes 21 be delivered to the outside of cleaning head 100；As this
A kind of variant of embodiment, cleaning solution can also be via circumference C2On the injection of multiple through-holes 21 to behind the surface of substrate to be cleaned,
In circumference C2Through-hole 21 discharge pressure and most inner side circumference C1Through-hole 21 pull of vacuum collective effect under via circumference
Multiple through-holes 21 on C1 are delivered to the outside of cleaning head 100.
As the alternative embodiment of 21 position distribution of through-hole, Fig. 4 shows another position of through-hole 21 of cleaning pad 20
Distribution form, through-hole 21 are distributed on the radius centered on the geometric center O of cleaning pad 20, the phase being distributed on same Radius
Adjacent the distance between through-hole 21 can be equal or different；The effect for the through-hole 21 being distributed in adjacent radius is generally different, so that
Cleaning solution is via radius R1On the injection of multiple through-holes 21 to behind the surface of substrate to be cleaned in radius R1Multiple through-holes 21 row
Pressure and adjacent radius R out2Through-hole 21 pull of vacuum collective effect under via radius R2On through-hole 21 be delivered to cleaning
First 100 outside.
It is understood that the through-hole 21 and the channel 11 being coupled with it can also arrange according to other positions relationship
Setting, for example, through-hole 21 is substantially equally uniformly arranged on cleaning pad 20 each other, or with interval between through-hole 21
Different distance is arbitrarily set to cleaning pad 20, or so that through-hole 21 is arranged in certain specific shape and be set to cleaning pad 20,
As long as making the setting of through-hole 21 reach following effect not departing from spirit of the invention and belong to the scope of protection of the present invention: so that
Cleaning solution is sprayed via fluid hose 12 to the surface of substrate to be cleaned, in discharge pressure and other through-holes 21 of fluid hose 12
Under the collective effect of pull of vacuum, it is delivered to the outside of cleaning head 100 via the through-hole 21 and fluid hose 12 of cleaning pad 20, realizes
The effect of cleaning solution for being combined with pollutant is siphoned away or is drained, to realize the post-processing to substrate surface.
According to another embodiment of the invention, as shown in Figure 1, cleaning pad 20 is connected to the lower surface of pedestal 10 with one heart,
The radius of the cleaning pad 20 is less than the radius of the pedestal 10, so that pollutant in base-plate cleaning operation process and/or flying
The cleaning solution 90 splashed is splashed down to the outer circumference surface of cleaning pad 20 and its neighbouring staircase areas, in order to complete in cleaning head 100
The pollutant and/or cleaning solution that splash down in the staircase areas are cleaned using the water flow sprayed from bottom to up after operation；
In contrast, if the radius of cleaning pad 20 is identical as the radius of pedestal 10, pollutant and/or cleaning solution be easier to splash down to
The periphery of the lower section of pedestal 10, so as to cause being difficult to through cleaning way that is commonly used in the art, spraying water from the bottom to top to root
It is cleaned according to cleaning head of the invention.Those skilled in the art are also understandable to be, can also be by the radius of cleaning pad 20
It is set greater than the radius of pedestal 10, to prevent cleaning solution and/or pollutant from splashing in the operation process of cleaning head 100
The lower circumference region of pedestal 10.In general, the radius of the cleaning pad 20 be the pedestal 10 radius 80% to
95%, it is preferred that the radius of the cleaning pad 20 is the 90% of the radius of the pedestal 10.
According to another embodiment of the invention, connecting plate 30 is detachably provided between pedestal 10 and cleaning pad 20,
As shown in figure 5, the connecting plate 30 is with certain thickness disc structure, the radius of connecting plate 30 and the radius of cleaning pad 20
Roughly the same, the upper surface and the lower surface of the disc structure is plane and the two is parallel to each other, the upper surface of connecting plate 30 with
The lower surface of pedestal 10 is detachably connected, and the lower surface of connecting plate 30 and the upper surface of cleaning pad 20 are detachably connected；Institute
State the through-hole 31 that connecting plate 30 extends through setting with multiple through-thickness, the position distribution and pedestal 10 of the through-hole 31
On channel 11 and cleaning pad 20 through-hole 21 position distribution it is identical, i.e., the channel 11 of pedestal 10, cleaning pad 20 through-hole 21
And the through-hole 31 of connecting plate 30 can correspond coupling connection, fluid hose 12 is via the channel 11 of pedestal 10, connecting plate 30
Through-hole 31 extends to the through-hole 21 of cleaning pad 20, so that cleaning solution can successively be sprayed via the through-hole 21 of fluid hose 12 and cleaning pad 20
Be incident upon the surface of substrate to be cleaned, alternatively, make cleaning solution in conjunction with the pollutant of substrate surface after, transmitted in fluid hose 12
Negative pressure under the action of, cleaning solution is successively delivered to the outer of cleaning head 100 via the through-hole 21 of cleaning pad 20 and fluid circuit 12
Portion realizes the cleaning to substrate surface.
According to the one aspect of the present embodiment, as shown in figure 5, thickness of the thickness of the connecting plate 30 between cleaning pad 20
Between the thickness of pedestal 10；As a kind of variant, connecting plate 30 with a thickness of the 1/3 to 2/3 of 10 thickness of pedestal, or
1 times to 5 times of the thickness with a thickness of cleaning pad 20 of the pedestal 10.For technically, the height of pedestal 10 does not surpass generally
120mm, preferably more than 80mm are crossed, so that cleaning solution is smaller almost without the pressure loss or loss after entering fluid hose 12,
It in other words, will not be excessively long and narrow due to the fluid hose 12 so that cleaning solution loses excessive pressure or the excessive flow velocity of loss；Into one
Step ground, the height of the through-hole 31 of connecting plate 30 should also make cleaning solution after flowing through through-hole 31 almost without the pressure loss or pressure
It loses smaller.The advantages of such structure setting, also resides in, can be with, when the suction function using fluid hose 12 is by substrate surface
When cleaning solution siphons away, it is passed through the negative pressure pressure of 12 upper end of fluid hose and the negative pressure pressure substantially phase of the lower openings of cleaning pad 20
Deng pressure loss very little.
It should be noted that the effect of setting connecting plate 30 and beneficial effect are, since the pedestal is usually by all
Such as PEEK or PPS engineering plastics are made and are frequently necessary to carry out being replaced and cleaned the several work such as pad 20, cause pedestal 10 in length
Phase is easy to produce nature deformation or damage after, generally requires to replace entire pedestal 10, excessively high so as to cause maintenance cost；?
After connecting plate 30 is arranged, when maintenance operation, only needs replacing connecting plate 30 without integral replacing pedestal 10, thus substantially drops
The low maintenance cost of cleaning head 100.
According to the another aspect of the present embodiment, the internal coat of the fluid hose 12 has hydrophobic layer, such as PTFE, FEP are dredged
Water material, the i.e. hydrophobic contact angle of 12 inner wall of fluid hose with hydrophobic layer are greater than 90 °, so that the cleaning solution containing pollutant passes through
When being conveyed by fluid hose 12, it is unlikely to the pollutant generated in the inner wall attaching substrates cleaning process of fluid hose 12 and/or clear
Washing lotion and its crystallization and influence the fluid velocity inside fluid hose 12.The effect of hydrophobic layer is set in the inner wall of fluid hose 12 and is had
Beneficial effect also resides in, and the dye object for effectively reducing the generation of base-plate cleaning process and/or cleaning solution and its crystallization are in fluid hose 12
The adhesion amount of wall reduces the maintenance frequency of cleaning head 100, improves the service efficiency of base-plate cleaning head.
As the one aspect of the present embodiment, the internal diameter of the fluid hose 12 is 3-5mm, the preferred fluid hose 12
Internal diameter is 4mm, so that cleaning solution can smoothly transmit between cleaning head 100 and substrate to be cleaned via fluid hose 12.As
The one aspect of the present embodiment, the fluid velocity of the cleaning solution flowed out via the through-hole 21 of cleaning pad 20 are 5-20mL/s, preferably
, the fluid velocity for the cleaning solution that the through-hole 21 via cleaning pad 20 flows out is 8-20mL/s, so that pollutant is from substrate
Surface separation.
Fig. 6 shows the structural schematic diagram of cleaning pad 20, and the lower surface of cleaning pad 20 is provided with multiple raised 22, described convex
It plays 22 to be arranged between adjacent through-holes 21, the protrusion 22 of the cleaning pad 20 can fast adsorption/absorption be a certain amount of such as cleans
The liquid of liquid etc so that cleaning pad 20 soften, prevent 20 top of cleaning pad be arranged connecting plate 30 or pedestal 10 with it is to be cleaned
Substrate directly contacts and the feature structure of wounded substrate.According to the one aspect of the present embodiment, raised 21 cross sectional shape
It may be that other are close-shaped for square, triangle, ellipse etc. for circle.As the another aspect of the present embodiment, institute
Stating protrusion 22 can be according to the generally uniform lower surface for being arranged in cleaning pad 20 of certain rule, and protrusion 22 can also be with through-hole 21
A part is overlapped, as long as the function of not influencing cleaning pad 20 uses, the protrusion 22 of cleaning pad 20 can arbitrarily be set to cleaning pad
20 lower surface.As the another aspect of the present embodiment, raised 22 height can be the 1/3 to 1/ of 20 thickness of cleaning pad
2, to guarantee that the function of cleaning pad 20 uses.
Disclosed herein as well is a kind of base plate cleaning devices, as shown in fig. 7, base plate cleaning device 1000 includes institute of the present invention
Base-plate cleaning head 100, apparatus for fixing substrate 200, first fluid pipeline 40 and the second fluid pipeline 50 stated, apparatus for fixing substrate
200 for fixing substrate W to be cleaned, and base-plate cleaning head 100 is arranged in the upside of substrate W and is cleaning head driving apparatus (not
Show) under the action of away from substrate surface certain distance to be cleaned and mobile, the first fluid pipeline 40 that is parallel to substrate surface
One end connect with liquid-supply unit 60, multiple first fluid pipeline branch pipes are provided on first fluid pipeline 40, it is described first-class
The end of body pipeline branch pipe is connect with the fluid hose 12 of pedestal 10, and cleaning solution is via each first fluid pipeline branch pipe, fluid hose
12 and cleaning pad 20 the injection of through-hole 21 to the surface of substrate to be cleaned；It is described first-class according to the one aspect of the present embodiment
It may also set up flow control valve on body pipeline branch pipe, individually to control the flow in each channel 11, and then improve base to be cleaned
The cleaning effect of plate surface part.One end of the second fluid pipeline 50 is connect with pumping cells 70, second fluid pipeline 50
On be provided with multiple second fluid pipeline branch pipes, the end of the second fluid pipeline branch pipe is connect with fluid hose 12, cleaning solution
After in conjunction with the pollutant of substrate surface, under the action of negative pressure, pumping cells 70 are by the cleaning solution containing pollutant via clear
Through-hole 21, fluid hose 12, second fluid pipeline branch pipe and the second fluid pipeline 50 of clean pad 20 are delivered to the outer of cleaning head 100
Portion.
Fig. 8 is the schematic diagram of base-plate cleaning head and its connecting line in Fig. 7, in the present embodiment, the liquid-supply unit 60
It is connect respectively by pipeline with first fluid pipeline 40 and second fluid pipeline 50, the liquid-supply unit 60 and first fluid pipeline
It is provided with solenoid valve EV3 between 4, solenoid valve EV4 is provided between liquid-supply unit 60 and second fluid pipeline 50, by adjusting electricity
And first fluid the on-off of magnet valve can control the on-off of liquid-supply unit 60 with first fluid pipeline 40 and second fluid pipeline 50, i.e.,
The changeable conveying cleaning solution of the fluid hose that pipeline 40 and second fluid pipeline 50 connect or gas；The pumping cells 70 lead to respectively
It crosses pipeline to connect with first fluid pipeline 40 and second fluid pipeline 50, between the pumping cells 70 and first fluid pipeline 4
It is provided with solenoid valve EV1, solenoid valve EV2 is provided between pumping cells 70 and second fluid pipeline 50, passes through electromagnetic valve for adjusting
On-off can control the on-off of pumping cells 70 with first fluid pipeline 40 and second fluid pipeline 50, i.e., with first fluid pipeline
40 and second fluid the pipeline 50 changeable conveying cleaning solution of fluid hose 12 or gas that connect.
In the embodiment shown in fig. 8, solenoid valve EV3 connection, solenoid valve EV4 are disconnected, the liquid-supply unit 60 and first
Fluid circuit 40 connects, and the fluid hose 12 connecting with first fluid pipeline 40 sprays cleaning solution to the surface of substrate to be cleaned；
Meanwhile solenoid valve EV1 connection, solenoid valve EV2 are disconnected, the pumping cells 70 are connect with second fluid pipeline 50, in negative pressure
Cleaning solution containing pollutant is delivered to the outer of cleaning head 100 by the lower fluid hose 12 connecting with second fluid pipeline 50 of effect
Portion；Switch the function of adjacent fluid pipe 12, to drop by controlling the on-off of solenoid valve as the another aspect of the present embodiment
The quantity of the pollutant of low 12 inner wall of fluid hose attachment, extends the service life of cleaning head 100.
According to the one aspect of the present embodiment, the radius of cleaning pad 20 is less than the radius of substrate W, cleans head driving apparatus
(not shown) is needed in the upper parallel of substrate W in the movement of the surface of substrate to be cleaned, with the pollution of the upper surface cleaning base plate W
Object.According to the other side of the present embodiment, the lower part of apparatus for fixing substrate 200 can configure rotating electric machine 80, as shown in figure 9,
Rotating electric machine 80 drives apparatus for fixing substrate 200 to rotate, and cleaning head driving apparatus need to only be moved along the radial direction of substrate W
Complete the cleaning of substrate surface to be cleaned.According to another aspect of the present embodiment, the radius of cleaning pad 20 can also be slightly larger than
The radius of substrate W, cleaning head 100 are located at the top of substrate to be cleaned, drive cleaning without configuring cleaning head driving apparatus
Head moves left and right the cleaning that substrate can be completed.
Figure 10 is the structural schematic diagram of cleaning head driving apparatus of the present invention, and it is clear to can be applied to substrate shown in Fig. 7
In cleaning device, the cleaning head driving apparatus 300 includes cross bar 301 and vertical bar 302, and cross bar 301 is horizontally fixed on vertical bar 302
On, the end of cross bar 301 is arranged in the cleaning head 100, and vertical bar 302 can be along 302 place axis free swing of vertical bar, i.e. band
The cleaning head 100 of dynamic 301 end of cross bar is swung；Meanwhile the cross bar 302 can be moved freely along four-headed arrow A, that is, be changed clear
The lateral position of hair washing 100；Meanwhile the cross bar 302 can be moved freely along four-headed arrow B, that is, change the perpendicular of cleaning head 100
To position.
Figure 11 is the structural schematic diagram of cleaning another embodiment of head driving apparatus of the present invention, the cleaning head driving
Device 300 is moved freely along four-headed arrow C, the cleaning head driving to adjust the lateral position of the cleaning head 100, shown in Figure 11
Device can be applied in base plate cleaning device shown in Fig. 9, and rotating electric machine 80 drives apparatus for fixing substrate 200 to rotate, cleaning head
Driving device 300 moves the cleaning that substrate surface to be cleaned can be completed along the radial direction of substrate W.
Base plate cleaning device of the present invention can clean the substrate of 8 cun and 12 cun, described when cleaning 8 cun of substrates
Cleaning solution is 5-15mL/s by the speed that the through-hole 21 of cleaning pad 20 flows out；When cleaning 12 cun of substrates, the cleaning solution is by clear
The speed that the through-hole 21 of clean pad 20 flows out is 8-20mL/s, to complete the cleaning to substrate surface pollutant.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are included at least one embodiment or example of the invention.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle of the present invention and objective, this
The range of invention is defined by the claims and their equivalents.
Claims (10)
1. a kind of base-plate cleaning head, comprising: there is certain thickness disk-shaped base and be connected to the pedestal lower surface with one heart
Circular cleaning pads, the pedestal through-thickness have multiple channels, the cleaning pad have multiple through-holes, each through-hole coupling
It is bonded to different channels, different fluid hoses extends through the through-hole in the channel to the cleaning pad, so that cleaning solution can be through
It is sprayed to substrate surface by the fluid hose and through-hole and is siphoned away after in conjunction with pollutant by other through-holes.
2. base-plate cleaning head as described in claim 1, which is characterized in that the through-hole is different straight along having for the cleaning pad
The circumference of diameter is equidistantly uniformly distributed.
3. base-plate cleaning head as described in claim 1, which is characterized in that radial direction etc. of the through-hole along the cleaning pad
Away from being uniformly distributed.
4. base-plate cleaning head as claimed any one in claims 1 to 3, which is characterized in that two adjacent through-holes are used respectively
In spraying and siphon away cleaning solution.
5. base-plate cleaning head as described in claim 1, which is characterized in that the radius of the cleaning pad is less than the half of the pedestal
Diameter.
6. base-plate cleaning head as described in claim 1, which is characterized in that be removably disposed between the pedestal and cleaning pad
There is connecting plate, the connecting plate has the through-hole being distributed same as cleaning pad, and different fluid hoses extends through the pedestal
The through-hole of channel and connecting plate sprays cleaning solution via the through-hole of fluid hose and cleaning pad to the through-hole of the cleaning pad
It is incident upon substrate surface, alternatively, siphoning away cleaning solution from substrate surface via the through-hole and fluid hose of the cleaning pad of coupling.
7. base-plate cleaning head as claimed in claim 6, which is characterized in that the inner wall of the fluid hose is provided with hydrophobic layer.
8. base-plate cleaning head as described in claim 1, which is characterized in that the lower surface of the cleaning pad is provided with multiple convex
It rises.
9. base-plate cleaning head as described in claim 1, which is characterized in that the radius of the cleaning pad is less than the radius of substrate.
10. a kind of base plate cleaning device, which is characterized in that including the described in any item base-plate cleaning heads of claim 1-9, cleaning
Head driving apparatus, apparatus for fixing substrate, first fluid pipeline, second fluid pipeline, so that the cleaning head can be away from substrate surface
Certain distance is parallel to substrate surface movement, and the first fluid pipeline and second fluid pipeline are respectively by cleaning head and feed flow list
Member is connected with pumping cells.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910440128.2A CN110153079A (en) | 2019-05-24 | 2019-05-24 | A kind of base-plate cleaning head and base plate cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910440128.2A CN110153079A (en) | 2019-05-24 | 2019-05-24 | A kind of base-plate cleaning head and base plate cleaning device |
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| CN110153079A true CN110153079A (en) | 2019-08-23 |
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ID=67632609
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| CN201910440128.2A Pending CN110153079A (en) | 2019-05-24 | 2019-05-24 | A kind of base-plate cleaning head and base plate cleaning device |
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| JP2002166239A (en) * | 2000-11-30 | 2002-06-11 | Optrex Corp | Method for cleaning substrate |
| KR20100091031A (en) * | 2009-02-09 | 2010-08-18 | 세메스 주식회사 | Apparatus and method for cleaning substrae, and facility for cleanig substrate using the same |
| CN105382677A (en) * | 2014-08-26 | 2016-03-09 | 株式会社荏原制作所 | buff process module, SUBSTRATE PROCESSING APPARATUS and buff pad cleaning method |
| TW201725640A (en) * | 2016-01-11 | 2017-07-16 | 日月光半導體製造股份有限公司 | Method and apparatus for cleaning a substrate |
| CN107234101A (en) * | 2017-07-28 | 2017-10-10 | 京东方科技集团股份有限公司 | A kind of base plate cleaning device |
| CN210788334U (en) * | 2019-05-24 | 2020-06-19 | 清华大学 | Substrate cleaning head and substrate cleaning device |
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2019
- 2019-05-24 CN CN201910440128.2A patent/CN110153079A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002166239A (en) * | 2000-11-30 | 2002-06-11 | Optrex Corp | Method for cleaning substrate |
| KR20100091031A (en) * | 2009-02-09 | 2010-08-18 | 세메스 주식회사 | Apparatus and method for cleaning substrae, and facility for cleanig substrate using the same |
| CN105382677A (en) * | 2014-08-26 | 2016-03-09 | 株式会社荏原制作所 | buff process module, SUBSTRATE PROCESSING APPARATUS and buff pad cleaning method |
| TW201725640A (en) * | 2016-01-11 | 2017-07-16 | 日月光半導體製造股份有限公司 | Method and apparatus for cleaning a substrate |
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