CN110148819B - Capacitive coupling structure of dielectric waveguide filter and dielectric waveguide filter - Google Patents
Capacitive coupling structure of dielectric waveguide filter and dielectric waveguide filter Download PDFInfo
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- CN110148819B CN110148819B CN201910535591.5A CN201910535591A CN110148819B CN 110148819 B CN110148819 B CN 110148819B CN 201910535591 A CN201910535591 A CN 201910535591A CN 110148819 B CN110148819 B CN 110148819B
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- 238000010168 coupling process Methods 0.000 title claims abstract description 109
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 109
- 230000008878 coupling Effects 0.000 title claims abstract description 108
- 230000001105 regulatory effect Effects 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 abstract description 40
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 24
- 230000003993 interaction Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 1
- 238000006880 cross-coupling reaction Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2002—Dielectric waveguide filters
Abstract
The invention discloses a capacitive coupling structure of a dielectric waveguide filter and the dielectric waveguide filter, wherein the capacitive coupling structure comprises a through hole arranged between two adjacent dielectric resonators in a dielectric body, and a first adjusting groove and a second adjusting groove which are respectively arranged around the circumference of the through hole, wherein the first adjusting groove is arranged in a non-closed mode, the second adjusting groove is arranged in a closed mode, the first adjusting groove and the second adjusting groove penetrate through a conductive layer of the dielectric body, a first plane where the first adjusting groove is positioned and a second plane where the second adjusting groove is positioned are arranged at opposite intervals, and the distance between the first plane and the second plane is smaller than the thickness of the dielectric body. The capacitive coupling structure is convenient to process, low in production and debugging difficulty and capable of guaranteeing production quality; therefore, the dielectric waveguide filter adopting the capacitive coupling structure has low production and debugging difficulty and high production quality, and is suitable for mass production.
Description
Technical Field
The invention relates to the technical field of filters, in particular to a capacitive coupling structure of a dielectric waveguide filter and the dielectric waveguide filter.
Background
Conventional dielectric waveguide filters generally achieve better performance and smaller size by adding cross-coupling to achieve good loss and rejection, and therefore require the introduction of capacitive coupling structures. Conventional dielectric waveguide filters generally take the following two forms for the purpose of achieving capacitive coupling: 1. the method has the advantages that the capacitive coupling bandwidth is controlled by adjusting the distance between the inner wall of the hole depth and the surface of the dielectric waveguide filter in a deep hole mode, and the smaller the distance is, the narrower the capacitive coupling bandwidth is, so that the adjustment of the narrow capacitive coupling bandwidth is realized, the distance is quite small, the problem of penetration easily occurs in the production process, and the difficulty of production and debugging is increased; 2. the through hole is adopted, the concentric closed circular ring with the through hole is arranged in the circumferential direction of the through hole, the width of the circular ring is adjusted, the narrower the width is, the narrower the capacitive coupling bandwidth is, therefore, the narrow capacitive coupling bandwidth is to be realized, the distance between the outer diameter and the inner diameter of the circular ring is quite small, the error in the production and debugging process is uncontrollable, and meanwhile, the short circuit risk is increased. Therefore, the capacitive coupling structure of the traditional dielectric waveguide filter has large production and debugging difficulty and is not beneficial to mass production.
Disclosure of Invention
Based on the structure, the capacitive coupling structure of the dielectric waveguide filter and the dielectric waveguide filter are provided, the capacitive coupling structure is convenient to process, the production and debugging difficulty is low, and the production quality can be ensured; therefore, the dielectric waveguide filter adopting the capacitive coupling structure has low production and debugging difficulty and high production quality, and is suitable for mass production.
The technical scheme is as follows:
in one aspect, a capacitive coupling structure of a dielectric waveguide filter is provided, including a through hole formed between two adjacent dielectric resonators in a dielectric body, and a first adjusting groove and a second adjusting groove respectively arranged around a circumference of the through hole, wherein the first adjusting groove is arranged in a non-closed form, the second adjusting groove is arranged in a closed form, the first adjusting groove and the second adjusting groove penetrate through a conductive layer of the dielectric body, a first plane where the first adjusting groove is located and a second plane where the second adjusting groove is located are arranged at opposite intervals, and a distance between the first plane and the second plane is smaller than a thickness of the dielectric body.
In another aspect, a dielectric waveguide filter is provided that includes the capacitive coupling structure.
According to the dielectric waveguide filter and the capacitive coupling structure thereof, the widths of the first regulating groove and the second regulating groove of the capacitive coupling structure can be flexibly regulated according to actual needs, compared with the traditional deep hole form or through hole form, the width of the first regulating groove and/or the width of the second regulating groove are not required to be independently made to be small enough, and the adjustment of the capacitive coupling bandwidth can be simply and flexibly realized by utilizing the interaction of the first regulating groove and the second regulating groove, so that the adjustment flexibility is improved, the processing is convenient, the production and debugging difficulty is also reduced, the production quality of products is ensured, the consistency of the dielectric waveguide filter is good, the dielectric waveguide filter is suitable for mass production, the dielectric waveguide filter is convenient to control different zero points, and the cost is saved.
Drawings
FIG. 1 is a schematic diagram of a first surface of a capacitive coupling structure of a dielectric waveguide filter according to one embodiment;
FIG. 2 is an enlarged partial view of a portion of the capacitive coupling structure A of the dielectric waveguide filter of FIG. 1;
FIG. 3 is a schematic diagram of a structure of a second surface of the capacitive coupling structure of the dielectric waveguide filter of FIG. 1;
FIG. 4 is a cross-sectional view of a portion of a capacitive coupling structure B-B of the dielectric waveguide filter of FIG. 1;
FIG. 5 is a schematic diagram of another embodiment of a capacitive coupling structure of the dielectric waveguide filter of FIG. 1;
FIG. 6 is a schematic diagram of the capacitive coupling structure of a dielectric waveguide filter of one embodiment;
FIG. 7 is a schematic diagram of another embodiment of a capacitive coupling structure of the dielectric waveguide filter of FIG. 6;
FIG. 8 is a schematic diagram of the structure of a first surface of a capacitive coupling structure of a dielectric waveguide filter of one embodiment;
FIG. 9 is a schematic diagram of a structure of a second surface of the capacitive coupling structure of the dielectric waveguide filter of FIG. 8;
FIG. 10 is a cross-sectional view of a portion of the capacitive coupling structure C-C of the dielectric waveguide filter of FIG. 8;
FIG. 11 is a schematic diagram of another embodiment of a capacitive coupling structure of the dielectric waveguide filter of FIG. 8;
FIG. 12 is a schematic diagram of the structure of a capacitive coupling structure of a dielectric waveguide filter according to one embodiment;
FIG. 13 is a schematic diagram of another embodiment of a capacitive coupling structure of the dielectric waveguide filter of FIG. 12;
FIG. 14 is a schematic diagram of the structure of a capacitive coupling structure of a dielectric waveguide filter of one embodiment;
fig. 15 is a schematic structural diagram of another embodiment of a capacitive coupling structure of the dielectric waveguide filter of fig. 14;
FIG. 16 is a schematic structural diagram of a capacitive coupling structure of a dielectric waveguide filter of one embodiment;
FIG. 17 is a schematic diagram of another embodiment of a capacitive coupling structure of the dielectric waveguide filter of FIG. 16;
FIG. 18 is a schematic diagram of the capacitive coupling structure of a dielectric waveguide filter of one embodiment;
FIG. 19 is a schematic diagram of another embodiment of a capacitive coupling structure of the dielectric waveguide filter of FIG. 18;
FIG. 20 is a schematic diagram of the capacitive coupling structure of a dielectric waveguide filter of one embodiment;
FIG. 21 is a schematic diagram of the capacitive coupling structure of a dielectric waveguide filter of one embodiment;
FIG. 22 is a schematic diagram of another embodiment of a capacitive coupling structure of the dielectric waveguide filter of FIG. 21;
FIG. 23 is a schematic diagram of the capacitive coupling structure of a dielectric waveguide filter of one embodiment;
FIG. 24 is a schematic diagram of another embodiment of a capacitive coupling structure of the dielectric waveguide filter of FIG. 23;
FIG. 25 is a schematic diagram of the capacitive coupling structure of a dielectric waveguide filter of one embodiment;
FIG. 26 is a schematic diagram of another embodiment of a capacitive coupling structure of the dielectric waveguide filter of FIG. 25;
FIG. 27 is a graph of β versus capacitively coupled bandwidth for a capacitively coupled structure of a dielectric waveguide filter of one embodiment;
FIG. 28 is a plot of β versus capacitive coupling bandwidth for a capacitive coupling structure of a dielectric waveguide filter of another embodiment;
FIG. 29 is a diagram of a D-coupling structure of a dielectric waveguide filter of one embodiment 1 Or D 2 Graph of the bandwidth of the capacitive coupling.
Reference numerals illustrate:
100. the medium body, 110, the through hole, 111, the lateral wall of through hole, 120, first adjustment tank, 121, first lateral wall, 122, second lateral wall, 123, first end, 124, second end, 125, first boundary line, 126, second boundary line, 130, second adjustment tank, 131, third lateral wall, 132, fourth lateral wall, 140, first surface, 141, first avoidance tank, 142, second avoidance tank, 143, third avoidance tank, 144, fourth avoidance tank, 145, fifth avoidance tank, 150, second surface, 160, medium block, 170, conductive layer, 1000, medium resonator, 1100, adjustment hole.
Detailed Description
The present invention will be further described in detail with reference to the drawings and the detailed description, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "disposed" or "fixed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "fixedly disposed" on or "fixedly connected" to another element, it can be detachably or non-detachably fixed therebetween. When an element is referred to as being "connected," "rotatably connected," or "rotatably connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," "up," "down," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The terms "first," "second," "third," and the like in this disclosure do not denote a particular quantity or order, but rather are used for distinguishing between similar names.
As shown in fig. 1 to 4, in one embodiment, a capacitive coupling structure of a dielectric waveguide filter is disclosed, including a through hole 110 disposed between two adjacent dielectric resonators 1000 in a dielectric body 100, and a first adjustment groove 120 and a second adjustment groove 130 disposed around a circumference of the through hole 110, respectively, where the first adjustment groove 120 is disposed in an unsealed form, the second adjustment groove 130 is disposed in a sealed form, the first adjustment groove 120 and the second adjustment groove 130 both penetrate through a conductive layer 170 of the dielectric body 100, a first plane in which the first adjustment groove 120 is disposed and a second plane in which the second adjustment groove 130 is disposed are disposed at opposite intervals, and a distance between the first plane and the second plane is smaller than a thickness of the dielectric body 100.
The capacitive coupling structure of the dielectric waveguide filter of the above embodiment includes a through hole 110, a first adjusting slot 120 and a second adjusting slot 130 disposed between two adjacent dielectric resonators 1000 in the dielectric body 100. The first adjusting groove 120 is configured in a non-closed form, i.e., two ends of the first adjusting groove 120 are not overlapped to form a broken annular shape, the second adjusting groove 130 is configured in a closed form, i.e., two ends of the second adjusting groove 130 are overlapped to form a complete annular shape, and the first adjusting groove 120 and the second adjusting groove 130 are both disposed around the circumference of the through hole 110 and both penetrate through the corresponding conductive layer 170; meanwhile, the opening plane of the first adjusting slot 120 is a first plane, the opening plane of the second adjusting slot 130 is a second plane, the first plane and the second plane are oppositely arranged at intervals, and the interval between the first plane and the second plane is smaller than the thickness of the medium body 100. The width of the first adjusting groove 120 and the width of the second adjusting groove 130 of the capacitive coupling structure of the dielectric waveguide filter in the above embodiment can be flexibly adjusted according to actual needs, compared with the traditional deep hole form or through hole form, the width of the first adjusting groove 120 and/or the width of the second adjusting groove 130 do not need to be independently made to be small enough, and the adjustment of the capacitive coupling bandwidth can be simply and flexibly realized by utilizing the interaction of the first adjusting groove 120 and the second adjusting groove 130, so that the adjustment flexibility is improved, the processing is convenient, the production and debugging difficulty is reduced, and the production quality of products is ensured.
It should be noted that, the diameter of the through hole 110 may be flexibly adjusted according to actual needs, so as to achieve the purpose of flexibly adjusting the capacitive coupling bandwidth. The first adjusting slot 120 and the second adjusting slot 130 both penetrate through the corresponding conductive layer 170, which means that the first adjusting slot 120 penetrates through the conductive layer 170 at the opening position thereof, and the second adjusting slot 130 also penetrates through the conductive layer 170 at the opening position thereof. The first plane in which the first adjusting groove 120 is located means that, in the thickness direction of the medium body 100, after a plane is selected, the first adjusting groove 120 is formed on the plane, and the plane is the first plane; similarly, the second plane of the second adjusting groove 130 refers to a plane selected in the thickness direction of the medium body 100 (as shown in F of fig. 4), and the second adjusting groove 130 is formed on the plane, which is the second plane. The distance between the first plane and the second plane (as shown in L of fig. 4) is smaller than the thickness of the medium body 100, so that the opening positions of the first adjusting groove 120 and the second adjusting groove 130 can be selected more flexibly and conveniently according to the requirements, and the debugging flexibility is enhanced. The dielectric body 100 may include a dielectric block 160, where the dielectric block 160 is provided with a through hole 110, and the outer surface of the dielectric block 160 (including the side wall 111 of the through hole) is formed with a conductive layer 170 by electroplating, so as to play a role of electromagnetic shielding; the dielectric block 160 can be made of high dielectric constant material, so that the function of transmitting signals and the function of structural support can be achieved; when the ceramic dielectric material is preferably used, the dielectric block 160 may be manufactured by die casting, so that the size and weight of the entire dielectric waveguide filter can be significantly reduced.
As shown in fig. 4, in one embodiment, the dielectric body 100 is provided with a first surface 140 and a second surface 150 that are disposed opposite to each other at intervals, the first surface 140, the second surface 150, and the sidewall 111 of the through hole are each provided with a conductive layer 170, and the first surface 140 is provided with an adjusting hole 1100 for adjusting the frequency. In this manner, the frequency can be adjusted accordingly using the adjustment aperture 1100. The depth of the adjusting hole 1100 can be correspondingly adjusted according to the frequency of actual needs, and only needs to meet the actual use requirements.
As shown in fig. 1 to 4, in one embodiment, the first surface 140 is provided with a first escape groove 141, and the first escape groove 141 communicates with one end of the through hole 110; the inner wall of the first avoiding groove 141 is provided with a first adjusting groove 120, and the second surface 150 is provided with a second adjusting groove 130. Thus, when elements such as a circuit board are installed on the first surface 140, the first adjusting groove 120 is arranged on the inner wall of the first avoiding groove 141, so that the elements such as the circuit board cannot interfere or affect the normal operation of the first adjusting groove 120, the first adjusting groove 120 is ensured to be matched with the second adjusting groove 130 which is formed on the second surface 150 reliably, the flexible capacity coupling bandwidth is adjusted, and the reliability of the operation is ensured. The first adjustment groove 120 may be provided on the inner wall of the first escape groove 141, or the first adjustment groove 120 may be provided on the bottom wall of the first escape groove 141, or the first adjustment groove 120 may be provided on the side wall of the first escape groove 141. In another embodiment, as shown in fig. 5, the inner wall of the first avoiding groove 141 may be provided with a second adjusting groove 130, and the second surface 150 may be provided with a first adjusting groove 120. When the circuit board and other components are mounted on the first surface 140, the circuit board and other components will not interfere or affect the normal operation of the second adjusting slot 130. The second adjustment groove 130 may be provided on the inner wall of the first avoidance groove 141, or the second adjustment groove 130 may be provided on the bottom wall of the first avoidance groove 141, or the second adjustment groove 130 may be provided on the side wall of the first avoidance groove 141.
As shown in fig. 6, in one embodiment, the first surface 140 is provided with a first escape groove 141, and the first escape groove 141 communicates with one end of the through hole 110; the inner wall of the first avoiding groove 141 is provided with a first adjusting groove 120, and the side wall 111 of the through hole is provided with a second adjusting groove 130. Thus, when the components such as the circuit board are mounted on the first surface 140, the first adjusting groove 120 is disposed on the inner wall of the first avoiding groove 141, so that the components such as the circuit board will not interfere or affect the normal operation of the first adjusting groove 120; meanwhile, the second adjusting groove 130 is arranged on the side wall 111 of the through hole, and elements such as circuit boards arranged on the second surface 150 and the first surface 140 can not interfere or affect the normal operation of the second adjusting groove 130; the first adjusting groove 120 and the second adjusting groove 130 are guaranteed to be matched reliably, so that the flexible adjustment of the capacitive coupling bandwidth is achieved, and the reliability of work is guaranteed. The first adjustment groove 120 may be provided on the inner wall of the first escape groove 141, or the first adjustment groove 120 may be provided on the bottom wall of the first escape groove 141, or the first adjustment groove 120 may be provided on the side wall of the first escape groove 141. As shown in fig. 7, in another embodiment, the inner wall of the first avoiding groove 141 may be provided with a second adjusting groove 130, and the sidewall 111 of the through hole may be provided with a first adjusting groove 120. Thus, when the circuit board and other components are mounted on the first surface 140, the circuit board and other components will not interfere or affect the normal operation of the second adjusting slot 130; meanwhile, the first adjusting groove 120 is arranged on the side wall 111 of the through hole, and elements such as circuit boards arranged on the second surface 150 and the first surface 140 can not interfere or affect the normal operation of the first adjusting groove 120; the first adjusting groove 120 and the second adjusting groove 130 are guaranteed to be matched reliably, so that the flexible adjustment of the capacitive coupling bandwidth is achieved, and the reliability of work is guaranteed. The second adjustment groove 130 may be provided on the inner wall of the first avoidance groove 141, or the second adjustment groove 130 may be provided on the bottom wall of the first avoidance groove 141, or the second adjustment groove 130 may be provided on the side wall of the first avoidance groove 141.
As shown in fig. 8 to 10, in one embodiment, the second surface 150 is provided with a second escape groove 142, and the second escape groove 142 communicates with one end of the through hole 110; the inner wall of the second avoidance groove 142 is provided with a first adjustment groove 120, and the first surface 140 is provided with a second adjustment groove 130. Thus, when the components such as the circuit board are installed on the second surface 150, the first adjusting groove 120 is arranged on the inner wall of the second avoiding groove 142, so that the components such as the circuit board cannot interfere or affect the normal operation of the first adjusting groove 120, the first adjusting groove 120 is ensured to be matched with the second adjusting groove 130 which is formed on the first surface 140 reliably, the flexible capacity coupling bandwidth is adjusted, and the reliability of the operation is ensured. The inner wall of the second avoidance groove 142 is provided with the first adjustment groove 120, and the first adjustment groove 120 may be provided on the bottom wall of the second avoidance groove 142, or the first adjustment groove 120 may be provided on the side wall of the second avoidance groove 142. In another embodiment, as shown in fig. 11, the inner wall of the second avoidance groove 142 may be provided with the second adjustment groove 130, and the first surface 140 may be provided with the first adjustment groove 120. Thus, when the circuit board and other components are mounted on the second surface 150, the circuit board and other components will not interfere or affect the normal operation of the second adjusting slot 130. The second adjusting groove 130 may be provided on the inner wall of the second avoidance groove 142, or the second adjusting groove 130 may be provided on the bottom wall of the second avoidance groove 142, or the second adjusting groove 130 may be provided on the side wall of the second avoidance groove 142.
As shown in fig. 12, in one embodiment, the second surface 150 is provided with a second relief groove 142, and the second relief groove 142 communicates with one end of the through hole 110; the inner wall of the second avoidance groove 142 is provided with a first adjustment groove 120, and the side wall 111 of the through hole is provided with a second adjustment groove 130. Thus, when the components such as the circuit board are mounted on the second surface 150, the first adjusting groove 120 is disposed on the inner wall of the second avoiding groove 142, so that the components such as the circuit board will not interfere or affect the normal operation of the first adjusting groove 120; meanwhile, the second adjusting groove 130 is arranged on the side wall 111 of the through hole, and elements such as circuit boards arranged on the first surface 140 and the second surface 150 can not interfere or affect the normal operation of the second adjusting groove 130; the first adjusting groove 120 and the second adjusting groove 130 are guaranteed to be matched reliably, so that the flexible adjustment of the capacitive coupling bandwidth is achieved, and the reliability of work is guaranteed. The inner wall of the second avoidance groove 142 is provided with the first adjustment groove 120, and the first adjustment groove 120 may be provided on the bottom wall of the second avoidance groove 142, or the first adjustment groove 120 may be provided on the side wall of the second avoidance groove 142. As shown in fig. 13, in another embodiment, the inner wall of the second avoidance groove 142 may be provided with a second adjustment groove 130, and the side wall 111 of the through hole may be provided with a first adjustment groove 120. Thus, when the circuit board and other components are mounted on the second surface 150, the circuit board and other components will not interfere or affect the normal operation of the second adjusting slot 130; meanwhile, the first adjusting groove 120 is arranged on the side wall 111 of the through hole, and elements such as circuit boards arranged on the second surface 150 and the first surface 140 can not interfere or affect the normal operation of the first adjusting groove 120; the first adjusting groove 120 and the second adjusting groove 130 are guaranteed to be matched reliably, so that the flexible adjustment of the capacitive coupling bandwidth is achieved, and the reliability of work is guaranteed. The second adjusting groove 130 may be provided on the inner wall of the second avoidance groove 142, or the second adjusting groove 130 may be provided on the bottom wall of the second avoidance groove 142, or the second adjusting groove 130 may be provided on the side wall of the second avoidance groove 142.
As shown in fig. 14, in one embodiment, the first surface 140 is provided with a third avoidance groove 143, the third avoidance groove 143 communicates with one end of the through hole 110, the second surface 150 is provided with a fourth avoidance groove 144, and the fourth avoidance groove 144 communicates with the other end of the through hole 110; the inner wall of the third avoidance groove 143 is provided with a first adjusting groove 120, and the inner wall of the fourth avoidance groove 144 is provided with a second adjusting groove 130. Thus, when the components such as the circuit board are mounted on the first surface 140, the first adjusting groove 120 is disposed on the inner wall of the third avoiding groove 143, so that the components such as the circuit board will not interfere or affect the normal operation of the first adjusting groove 120; meanwhile, when the circuit board and other elements are mounted on the second surface 150, the second adjusting groove 130 is disposed on the inner wall of the fourth avoiding groove 144, so that the circuit board and other elements will not interfere or affect the normal operation of the second adjusting groove 130; the first adjusting groove 120 and the second adjusting groove 130 are guaranteed to be matched reliably, so that the flexible adjustment of the capacitive coupling bandwidth is achieved, and the reliability of work is guaranteed. The inner wall of the third avoidance groove 143 is provided with the first adjustment groove 120, and the first adjustment groove 120 may be provided at the bottom wall of the third avoidance groove 143, or the first adjustment groove 120 may be provided at the side wall of the third avoidance groove 143. The inner wall of the fourth avoidance groove 144 is provided with the second adjustment groove 130, and the second adjustment groove 130 may be provided at the bottom wall of the fourth avoidance groove 144, or the second adjustment groove 130 may be provided at the side wall of the fourth avoidance groove 144.
As shown in fig. 15, in another embodiment, the inner wall of the third avoidance groove 143 may be provided with the second adjustment groove 130, and the inner wall of the fourth avoidance groove 144 may be provided with the first adjustment groove 120. Thus, when the circuit board and other components are mounted on the first surface 140, the second adjusting groove 130 is disposed on the inner wall of the third avoiding groove 143, so that the circuit board and other components will not interfere or affect the normal operation of the second adjusting groove 130; meanwhile, when components such as a circuit board are mounted on the second surface 150, the first adjusting groove 120 is disposed on the inner wall of the fourth avoidance groove 144, so that the components such as the circuit board will not interfere or affect the normal operation of the first adjusting groove 120; the first adjusting groove 120 and the second adjusting groove 130 are guaranteed to be matched reliably, so that the flexible adjustment of the capacitive coupling bandwidth is achieved, and the reliability of work is guaranteed. The second adjustment groove 130 may be provided on the inner wall of the third avoidance groove 143, or the second adjustment groove 130 may be provided on the bottom wall of the third avoidance groove 143, or the second adjustment groove 130 may be provided on the side wall of the third avoidance groove 143. The inner wall of the fourth avoidance groove 144 is provided with the first adjustment groove 120, and the first adjustment groove 120 may be provided on the bottom wall of the fourth avoidance groove 144, or the first adjustment groove 120 may be provided on the side wall of the fourth avoidance groove 144.
As shown in fig. 16, in one embodiment, the first surface 140 is provided with a first escape groove 141, and the first escape groove 141 communicates with one end of the through hole 110; the inner wall of the first avoiding groove 141 is provided with a first adjusting groove 120, and the first surface 140 is provided with a second adjusting groove 130. In this way, the first adjusting groove 120 and the second adjusting groove 130 are arranged close to or on the first surface 140 of the medium body 100, and the first adjusting groove 120 and the second adjusting groove 130 can be formed without turning over the medium body 100 during processing, so that processing steps are saved; meanwhile, the first adjusting groove 120 and the second adjusting groove 130 can be matched with each other, so that the flexible adjustment of the capacitive coupling bandwidth is realized, and the production debugging difficulty is reduced. The first adjustment groove 120 may be provided on the inner wall of the first escape groove 141, or the first adjustment groove 120 may be provided on the bottom wall of the first escape groove 141, or the first adjustment groove 120 may be provided on the side wall of the first escape groove 141.
As shown in fig. 17, in another embodiment, the inner wall of the first avoiding groove 141 may be provided with the second adjusting groove 130, and the first surface 140 may be provided with the first adjusting groove 120. Similarly, the first adjusting groove 120 and the second adjusting groove 130 can be formed without turning the medium body 100 during processing, so that processing steps are saved; meanwhile, the first adjusting groove 120 and the second adjusting groove 130 can be matched with each other, so that the flexible adjustment of the capacitive coupling bandwidth is realized, and the production debugging difficulty is reduced. The second adjustment groove 130 may be provided on the inner wall of the first avoidance groove 141, or the second adjustment groove 130 may be provided on the bottom wall of the first avoidance groove 141, or the second adjustment groove 130 may be provided on the side wall of the first avoidance groove 141.
As shown in fig. 18, in one embodiment, the second surface 150 is provided with a second escape groove 142, and the second escape groove 142 communicates with one end of the through hole 110; the inner wall of the second avoidance groove 142 is provided with a first adjustment groove 120, and the second surface 150 is provided with a second adjustment groove 130. In this way, the first adjusting groove 120 and the second adjusting groove 130 are arranged close to or on the second surface 150 of the medium body 100, and the first adjusting groove 120 and the second adjusting groove 130 can be formed without turning over the medium body 100 during processing, so that processing steps are saved; meanwhile, the first adjusting groove 120 and the second adjusting groove 130 can be matched with each other, so that the flexible adjustment of the capacitive coupling bandwidth is realized, and the production debugging difficulty is reduced. The inner wall of the second avoidance groove 142 is provided with the first adjustment groove 120, and the first adjustment groove 120 may be provided on the bottom wall of the second avoidance groove 142, or the first adjustment groove 120 may be provided on the side wall of the second avoidance groove 142.
In another embodiment, as shown in fig. 19, the inner wall of the second avoidance groove 142 may be provided with a second adjustment groove 130, and the second surface 150 may be provided with a first adjustment groove 120. Similarly, the first adjusting groove 120 and the second adjusting groove 130 can be formed without turning the medium body 100 during processing, so that processing steps are saved; meanwhile, the first adjusting groove 120 and the second adjusting groove 130 can be matched with each other, so that the flexible adjustment of the capacitive coupling bandwidth is realized, and the production debugging difficulty is reduced. The second adjusting groove 130 may be provided on the inner wall of the second avoidance groove 142, or the second adjusting groove 130 may be provided on the bottom wall of the second avoidance groove 142, or the second adjusting groove 130 may be provided on the side wall of the second avoidance groove 142.
As shown in fig. 20, in one embodiment, the first surface 140 is provided with a fifth avoidance groove 145, the first adjustment groove 120 is disposed on a side wall of the fifth avoidance groove 145, and the second adjustment groove 130 is disposed on a bottom wall of the fifth avoidance groove 145. Thus, when the components such as the circuit board are mounted on the first surface 140, the first adjusting groove 120 and the second adjusting groove 130 are disposed on the inner wall of the fifth avoidance groove 145, so that the components such as the circuit board will not interfere or affect the normal operation of the first adjusting groove 120 and the second adjusting groove 130; meanwhile, the first adjusting groove 120 and the second adjusting groove 130 can be matched reliably, so that the flexible adjustment of the capacitive coupling bandwidth is realized, and the reliability of the work is ensured. Of course, in other embodiments, the first adjusting groove 120 may be disposed at the bottom wall of the fifth avoidance groove 145, and the second adjusting groove 130 may be disposed at the side wall of the fifth avoidance groove 145. Meanwhile, in another embodiment, the fifth avoidance groove 145 may be disposed on the second surface 150, and the arrangement of the first adjustment groove 120 and the second adjustment groove 130 on the inner wall of the fifth avoidance groove 145 is the same as that described above, which is not repeated.
As shown in fig. 21, in one embodiment, the first surface 140 is provided with a first adjustment groove 120 and the sidewall 111 of the through-hole is provided with a second adjustment groove 130. In this way, the first adjusting groove 120 disposed on the first surface 140 can cooperate with the second adjusting groove 130 disposed on the sidewall 111 of the through hole to flexibly adjust the capacitive coupling bandwidth, thereby reducing the production debugging difficulty.
As shown in fig. 22, in one embodiment, the first surface 140 is provided with a second adjustment groove 130 and the sidewall 111 of the through-hole is provided with a first adjustment groove 120. In this way, the second adjusting groove 130 disposed on the first surface 140 can cooperate with the first adjusting groove 120 disposed on the sidewall 111 of the through hole to flexibly adjust the capacitive coupling bandwidth, thereby reducing the production debugging difficulty.
As shown in fig. 23, in one embodiment, the second surface 150 is provided with a first adjustment groove 120 and the sidewall 111 of the through-hole is provided with a second adjustment groove 130. In this way, the first adjusting groove 120 disposed on the second surface 150 can cooperate with the second adjusting groove 130 disposed on the sidewall 111 of the through hole to flexibly adjust the capacitive coupling bandwidth, thereby reducing the production debugging difficulty.
As shown in fig. 24, in one embodiment, the second surface 150 is provided with a second adjustment groove 130 and the sidewall 111 of the through-hole is provided with a first adjustment groove 120. In this way, the second adjusting groove 130 disposed on the second surface 150 can cooperate with the first adjusting groove 120 disposed on the sidewall 111 of the through hole to flexibly adjust the capacitive coupling bandwidth, thereby reducing the production debugging difficulty.
As shown in fig. 25, in one embodiment, the sidewall 111 of the through-hole is provided with a first adjustment groove 120 and a second adjustment groove 130; the first adjustment slot 120 is disposed proximate the first surface 140 relative to the second adjustment slot 130. In this way, the first adjusting slot 120 and the second adjusting slot 130 are both disposed on the sidewall 111 of the through hole, and elements such as circuit boards disposed on the first surface 140 and the second surface 150 of the medium body 100 will not interfere or affect the normal operation of the first adjusting slot 120 and the second adjusting slot 130, thereby ensuring the reliability of the operation.
As shown in fig. 26, in one embodiment, the sidewall 111 of the through hole is provided with a first adjustment groove 120 and a second adjustment groove 130; the second adjustment slot 130 is disposed proximate the first surface 140 relative to the first adjustment slot 120. In this way, the first adjusting slot 120 and the second adjusting slot 130 are both disposed on the sidewall 111 of the through hole, and elements such as circuit boards disposed on the first surface 140 and the second surface 150 of the medium body 100 will not interfere or affect the normal operation of the first adjusting slot 120 and the second adjusting slot 130, thereby ensuring the reliability of the operation.
In order to achieve narrow capacitive coupling bandwidth, production difficulty is reduced, design and processing are simple, assembly is easy, the widths of the first adjusting groove 120 and the second adjusting groove 130 can be flexibly adjusted according to actual requirements, debugging can be repeatedly conducted, and design and debugging difficulty is reduced.
As shown in fig. 2, in one embodiment, the area of the first adjustment groove 120 is adjustable. Thus, the capacitive coupling amount of the adjacent two dielectric resonators is adjusted by adjusting the area of the first adjustment groove 120. The area of the first adjusting groove 120 refers to the area of the conductive layer removed on the dielectric body, and the adjustment of the area of the first adjusting groove 120 can be achieved by adjusting the width or the circumference of the first adjusting groove 120; for example, when the first adjustment groove 120 is a non-closed form of a ring, the radius or arc length of the non-closed form of the ring may be adjusted to achieve the adjustment of the area size.
As shown in FIG. 2, in one embodiment, the first regulating groove 120 is provided as a ring in non-closed form, and the first regulating groove 120 includes a first side wall 121 and a second side wall 122 arranged opposite to each other with a distance D between the first side wall 121 and the second side wall 122 1 And D is 1 Is adjustable. Thus, the spacing between the first sidewall 121 and the second sidewall 122 is adjustable, preferably D 1 The width of the first adjusting groove 120 is larger than or equal to 0.5mm, namely the width of the first adjusting groove 120 is larger than 0.5mm, which is beneficial to designing the first adjusting groove 120, and meanwhile, the narrowing of the capacitive coupling bandwidth can be realized under the interaction of the second adjusting groove 130, and the narrower the width of the first adjusting groove 120, the narrower the capacitive coupling bandwidth. The width of the first adjustment slot 120 may be 0.5mm, 1mm, 2.5mm, or other dimensions that are capable of cooperating with the second adjustment slot 130 to achieve a narrow capacitive coupling bandwidth. Of course, D 1 Can also be smaller than 0.5mm, and only meets the processing requirement and the use requirement.
As shown in fig. 3, in one embodiment, the area of the second adjustment groove 130 is adjustable. Thus, the capacitive coupling amount of the adjacent two dielectric resonators is adjusted by adjusting the area of the second adjustment groove 130. The area of the second adjusting groove 130 refers to the area of the conductive layer removed on the medium body, and the adjustment of the area of the second adjusting groove 130 can be achieved by adjusting the width or the circumference of the second adjusting groove 130; for example, when the second adjustment groove 130 is a closed-form ring, the area size can be adjusted by adjusting the inner diameter or the outer diameter of the closed-form ring. The area of the second regulating groove 130 and the area of the first regulating groove 120 may be regulated separately or simultaneously.
As shown in FIG. 3, in one embodiment, the second adjustment groove 130 is provided as a closed-form ring, and the second adjustment groove 130 includes oppositely spaced apart firstThree side walls 131 and a fourth side wall 132, the spacing between the third side wall 131 and the fourth side wall 132 being D 2 And D is 2 Is adjustable. Thus, the spacing between the third sidewall 131 and the fourth sidewall 132 is adjustable, preferably D 2 The width of the second adjusting groove 130 is larger than or equal to 0.5mm, namely the width of the second adjusting groove 130 is larger than 0.5mm, which is beneficial to designing the second adjusting groove 130, and meanwhile, the narrowing of the capacitive coupling bandwidth can be realized under the interaction of the second adjusting groove 130 and the first adjusting groove 120, and the narrower the width of the second adjusting groove 130, the narrower the capacitive coupling bandwidth. The width of the second adjustment slot 130 may be 0.5mm, 1mm, 2.5mm, or other dimensions that can cooperate with the first adjustment slot 120 to achieve a narrow capacitive coupling bandwidth. So that the width of the second regulation groove 130 does not need to be too narrow, and a problem of short circuit between the conductive layers 170 separated by the second regulation groove 130 can be avoided. Of course, D 2 Can also be smaller than 0.5mm, and only meets the processing requirement and the use requirement. At the same time D 2 And D 1 Can be adjusted separately or simultaneously.
As shown in fig. 2, in the above-mentioned embodiment, the first adjusting groove 120 includes a first end 123 and a second end 124 opposite to each other, the first end 123 and the second end 124 are spaced apart, a line from the first end 123 to the center of the through hole 110 is a first boundary line 125, a line from the second end 124 to the center of the through hole 110 is a second boundary line 126, and an angle between the first boundary line 125 and the second boundary line 126 is β, and β is adjustable. Thus, along the length direction of the first adjustment groove 120, the first adjustment groove 120 extends from the first end 123 to the second end 124, and the first end 123 and the second end 124 are spaced apart, so that the first adjustment groove 120 is disposed circumferentially around a portion of the through hole 110 instead of entirely circumferentially around the through hole 110. Meanwhile, the capacitive coupling bandwidth can be adjusted by adjusting the included angle beta between the first boundary line 125 and the second boundary line 126, and when the angle beta is changed, the width and the width of the capacitive coupling bandwidth are correspondingly changed. And 0 degree<β<360 °, and β may be 45 °, 90 °, 135 °, 180 °, 225 °, or other angles that enable the first adjustment slot 120 to cooperate with the second adjustment slot 130 to adjust the capacitive coupling bandwidth. At the same time, beta can be combined with D 2 And D 1 The adjustment can be performed separately or simultaneously.
On the basis of any of the above embodiments, the cross-sectional shape of the first regulating groove 120 is an annular shape in an unsealed form, a square shape in an unsealed form, or an oval shape in an unsealed form. The cross-sectional shape of the first regulating groove 120 can be flexibly adjusted according to actual production conditions and production requirements. The cross-sectional shape of the first adjustment groove 120 is preferably a non-closed annular shape, which is convenient for processing and reduces the difficulty of production.
On the basis of any of the above embodiments, the cross-sectional shape of the second regulating groove 130 is a closed-form circular ring shape, a closed-form square frame shape, or a closed-form elliptical shape. The sectional shape of the second regulating groove 130 can be flexibly adjusted according to actual production conditions and production requirements. The cross-sectional shape of the second adjusting groove 130 is preferably a closed annular shape, which is convenient for processing and reduces the production difficulty.
When the first adjustment groove 120 is formed in the bottom wall of the avoidance groove (the first avoidance groove 141, the second avoidance groove 142, the third avoidance groove 143, the fourth avoidance groove 144, and the fifth avoidance groove 145) or the surface (the first surface 140 or the second surface 150) of the medium body 100, the first adjustment groove 120 includes a first side wall 121 and a second side wall 122 that are disposed at opposite intervals, the first side wall 121 is disposed near the central axis of the through hole 110 relative to the second side wall 122, which may be that the first side wall 121 is disposed at intervals with the side wall 111 of the through hole, or that the first side wall 121 is coincident with the side wall 111 of the through hole. When the first side wall 121 and the side wall 111 of the through hole are arranged at intervals, even if errors exist in the process of opening the through hole 110, the errors are not influenced in the subsequent process of opening the first adjusting groove 120, so that the design difficulty is reduced, the first adjusting groove 120 and the second adjusting groove 130 are ensured to be matched with each other, and a narrow capacitive coupling bandwidth is realized; meanwhile, the capacitive coupling bandwidth can be flexibly adjusted by adjusting the interval distance between the first side wall 121 and the side wall 111 of the through hole. When the first sidewall 121 is overlapped with the sidewall 111 of the through hole, the central axis of the through hole 110 can be utilized to position the opening of the first adjusting slot 120, so that the central axis of the first adjusting slot 120 can be overlapped with or close to the central axis of the through hole 110 as much as possible, and design errors are reduced. Similarly, when the second adjusting groove 130 is disposed on the bottom wall of the avoidance groove (the first avoidance groove 141, the second avoidance groove 142, the third avoidance groove 143, the fourth avoidance groove 144, or the fifth avoidance groove 145) or the surface (the first surface 140 or the second surface 150) of the medium body 100, the second adjusting groove 130 includes a third side wall 131 and a fourth side wall 132 that are disposed at opposite intervals, and the third side wall 131 is disposed near the central axis of the through hole 110 with respect to the fourth side wall 132, which may be that the third side wall 131 is disposed at intervals with the side wall 111 of the through hole, or that the third side wall 131 coincides with the side wall 111 of the through hole. When the third side wall 131 and the side wall 111 of the through hole are arranged at intervals, even if errors exist in the process of opening the through hole 110, the errors are not influenced in the subsequent process of opening the second adjusting groove 130, so that the design difficulty is reduced, the second adjusting groove 130 can be matched with the first adjusting groove 120, and a narrow capacitive coupling bandwidth is realized; meanwhile, the capacitive coupling bandwidth can be flexibly adjusted by adjusting the interval distance between the third side wall 131 and the side wall 111 of the through hole. When the third side wall 131 is overlapped with the side wall 111 of the through hole, the central axis of the through hole 110 can be utilized to position the opening of the second adjusting slot 130, so that the central axis of the second adjusting slot 130 can be overlapped with or close to the central axis of the through hole 110 as much as possible, and design errors are reduced.
In one embodiment, the cross-sectional shape of the first adjusting groove 120 is a first ring, the first ring is disposed concentrically with the through hole 110, the first ring extends from the first end 123 to the second end 124, and the first end 123 and the second end 124 are disposed at intervals, the diameter of the through hole 110 is 2mm, the inner diameter of the first ring is 2.4mm, and the outer diameter of the first ring is 4mm, i.e. the width of the first ring is 1.6mm. The line between the first end 123 of the first circular ring and the center of the through hole 110 is a first boundary line 125, the line between the second end 124 of the first circular ring and the center of the through hole 110 is a second boundary line 126, and the included angle between the first boundary line 125 and the second boundary line 126 is beta; the second adjusting groove 130 has a closed second circular ring in cross-sectional shape, and is concentrically disposed with the through hole 110, the second circular ring has an inner diameter of 2.4mm, and an outer diameter of 4mm, i.e., a width of 1.6mm. Thus, as shown in fig. 27 and 28, the width of the first ring and the width of the second ring are not required to be adjusted, and the capacitive coupling bandwidth can be correspondingly adjusted only by adjusting the size of beta, so that the method is simple and convenient, and the design difficulty and the production difficulty are reduced.
In one embodiment, the first adjusting groove 120 has a third circular ring with a cross-sectional shape, the third circular ring is concentric with the through hole 110, the diameter of the through hole 110 is 2mm, the third circular ring extends from the first end 123 to the second end 124, the first end 123 and the second end 124 are spaced apart, the inner diameter of the third circular ring is 2.4mm, and the distance between the outer diameter of the third circular ring and the inner diameter of the third circular ring is D 1 I.e. the third ring has a width D 1 . The line between the first end 123 of the third ring and the center of the through hole 110 is a first boundary line 125, the line between the second end 124 of the third ring and the center of the through hole 110 is a second boundary line 126, the included angle between the first boundary line 125 and the second boundary line 126 is beta, and beta=260°; the second adjusting groove 130 has a closed fourth circular ring with an inner diameter of 2.4mm and a distance D between the outer diameter of the fourth circular ring and the inner diameter of the fourth circular ring 2 I.e. the fourth ring has a width D 2 . Thus, as shown in FIG. 29, only flexible adjustment D is required 1 And D 2 The size of the capacitive coupling bandwidth can be correspondingly adjusted, the capacitive coupling bandwidth is simple and convenient, and the design difficulty and the production difficulty are reduced.
In one embodiment, a dielectric waveguide filter is also disclosed, comprising the capacitive coupling structure of any of the embodiments described above.
The dielectric waveguide filter of the above embodiment, the capacitive coupling structure includes a through hole 110, a first adjusting slot 120 and a second adjusting slot 130 disposed between two adjacent dielectric resonators 1000 in the dielectric body 100. The first adjusting groove 120 is configured in a non-closed form, i.e., two ends of the first adjusting groove 120 are not overlapped to form a broken annular shape, the second adjusting groove 130 is configured in a closed form, i.e., two ends of the second adjusting groove 130 are overlapped to form a complete annular shape, and the first adjusting groove 120 and the second adjusting groove 130 are both disposed around the circumference of the through hole 110 and both penetrate through the corresponding conductive layer 170; meanwhile, the opening plane of the first adjusting slot 120 is a first plane, the opening plane of the second adjusting slot 130 is a second plane, the first plane and the second plane are oppositely arranged at intervals, and the interval between the first plane and the second plane is smaller than the thickness of the medium body 100. The widths of the first adjusting groove 120 and the second adjusting groove 130 of the capacitive coupling structure of the dielectric waveguide filter in the embodiment can be flexibly adjusted according to actual needs, compared with the traditional deep hole form or through hole form, the widths of the first adjusting groove 120 and/or the second adjusting groove 130 are not required to be independently made to be small enough, and the adjustment of the capacitive coupling bandwidth can be simply and flexibly realized by utilizing the interaction of the first adjusting groove 120 and the second adjusting groove 130, so that the adjustment flexibility is improved, the processing is convenient, the production and debugging difficulty is reduced, the production quality of products is guaranteed, the consistency of the dielectric waveguide filter is good, the dielectric waveguide filter is suitable for mass production, the dielectric waveguide filter is convenient to control different zero points, and the cost is saved.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (11)
1. The capacitive coupling structure of the dielectric waveguide filter is characterized by comprising a through hole arranged between two adjacent dielectric resonators in a dielectric body, and a first adjusting groove and a second adjusting groove which are respectively arranged around the circumference of the through hole, wherein the first adjusting groove is arranged in a non-closed mode, the second adjusting groove is arranged in a closed mode, the first adjusting groove and the second adjusting groove penetrate through a conductive layer of the dielectric body, a first plane where the first adjusting groove is positioned and a second plane where the second adjusting groove is positioned are arranged at opposite intervals, and the distance between the first plane and the second plane is smaller than the thickness of the dielectric body; the first adjusting groove comprises a first end and a second end which are opposite, the first end and the second end are arranged at intervals, a connecting line from the first end to the center of the through hole is a first boundary line, a connecting line from the second end to the center of the through hole is a second boundary line, and an included angle between the first boundary line and the second boundary line is beta and beta is adjustable.
2. The capacitive coupling structure of a dielectric waveguide filter according to claim 1, wherein the dielectric body is provided with a first surface and a second surface which are arranged at opposite intervals, the first surface, the second surface and the side wall of the through hole are all provided with the conductive layer, and the first surface is provided with an adjusting hole for adjusting frequency.
3. The capacitive coupling structure of a dielectric waveguide filter according to claim 2, wherein the first surface is provided with a first avoidance groove, and the first avoidance groove is communicated with one end of the through hole;
any one of the first adjusting groove and the second adjusting groove is arranged on the inner wall of the first avoiding groove, and the other adjusting groove is arranged on the first surface, the second surface or the side wall of the through hole.
4. The capacitive coupling structure of a dielectric waveguide filter according to claim 2, wherein the second surface is provided with a second avoidance groove, and the second avoidance groove is communicated with one end of the through hole;
any one of the first adjusting groove and the second adjusting groove is arranged on the inner wall of the second avoiding groove, and the other adjusting groove is arranged on the first surface, the second surface or the side wall of the through hole.
5. The capacitive coupling structure of a dielectric waveguide filter according to claim 2, wherein the first surface is provided with a third avoidance groove, the third avoidance groove is communicated with one end of the through hole, the second surface is provided with a fourth avoidance groove, and the fourth avoidance groove is communicated with the other end of the through hole;
the inner wall of the third avoidance groove is provided with the first adjusting groove, and the inner wall of the fourth avoidance groove is provided with the second adjusting groove; or, the inner wall of the third avoidance groove is provided with the second adjusting groove, and the inner wall of the fourth avoidance groove is provided with the first adjusting groove.
6. The capacitive coupling structure of a dielectric waveguide filter according to claim 2, wherein a fifth avoidance groove is formed in the first surface or the second surface, and the first adjustment groove and the second adjustment groove are both disposed on an inner wall of the fifth avoidance groove.
7. The capacitive coupling structure of a dielectric waveguide filter according to claim 2, wherein either one of the first and second adjustment grooves is provided on the first or second surface, and the other adjustment groove is provided on a side wall of the through hole.
8. The capacitive coupling structure of a dielectric waveguide filter according to claim 1, wherein the first and second adjusting grooves are respectively spaced apart from each other on a side wall of the through hole.
9. The capacitive coupling structure of a dielectric waveguide filter according to any one of claims 1 to 8, wherein the area size of the first tuning slot is adjustable; and/or the area size of the second regulating groove is adjustable.
10. The capacitive coupling structure of a dielectric waveguide filter according to any one of claims 1 to 8, wherein the cross-sectional shape of the first tuning slot is an annular shape in an unsealed form, a square shape in an unsealed form, or an oval shape in an unsealed form; and/or the cross section of the second regulating groove is in a closed annular shape, a closed square shape or a closed elliptical shape.
11. A dielectric waveguide filter comprising a capacitive coupling structure according to any one of claims 1 to 10.
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| CN201910535591.5A CN110148819B (en) | 2019-06-20 | 2019-06-20 | Capacitive coupling structure of dielectric waveguide filter and dielectric waveguide filter |
| PCT/CN2019/105224 WO2020252946A1 (en) | 2019-06-20 | 2019-09-10 | Capacitive coupling structure for dielectric waveguide filter and dielectric waveguide filter |
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| CN201910535591.5A CN110148819B (en) | 2019-06-20 | 2019-06-20 | Capacitive coupling structure of dielectric waveguide filter and dielectric waveguide filter |
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| WO2020087378A1 (en) | 2018-10-31 | 2020-05-07 | 华为技术有限公司 | Dielectric filter and communication device |
| CN110148819B (en) * | 2019-06-20 | 2024-03-26 | 京信通信技术(广州)有限公司 | Capacitive coupling structure of dielectric waveguide filter and dielectric waveguide filter |
| CN110265753B (en) * | 2019-07-16 | 2023-10-27 | 深圳国人科技股份有限公司 | Dielectric waveguide filter |
| CN110459843A (en) * | 2019-08-22 | 2019-11-15 | 深圳市国人射频通信有限公司 | A kind of dielectric waveguide filter |
| CN110518313A (en) * | 2019-09-02 | 2019-11-29 | 深圳市国人射频通信有限公司 | A kind of dielectric waveguide filter |
| KR20220062121A (en) * | 2019-09-30 | 2022-05-13 | 후아웨이 테크놀러지 컴퍼니 리미티드 | Dielectric Filters and Communication Devices |
| CN110611143B (en) * | 2019-09-30 | 2021-07-23 | 京信通信技术(广州)有限公司 | Capacitive coupling structure of dielectric filter, design method and dielectric filter |
| CN110600840B (en) * | 2019-09-30 | 2021-06-25 | 京信通信技术(广州)有限公司 | Balance degree adjusting method of dielectric filter and filter |
| CN110783668B (en) * | 2019-10-12 | 2021-02-09 | 京信通信技术(广州)有限公司 | Communication device, dielectric waveguide filter and capacitance coupling adjusting method thereof |
| CN110729534A (en) * | 2019-10-21 | 2020-01-24 | 摩比科技（深圳）有限公司 | Dielectric waveguide filter |
| CN111446525B (en) * | 2020-02-19 | 2022-03-11 | 深圳市大富科技股份有限公司 | Dielectric resonator, dielectric filter, transceiver and base station |
| CN111403863A (en) * | 2020-04-03 | 2020-07-10 | 京信射频技术(广州)有限公司 | Communication device, dielectric waveguide filter and capacitance coupling adjusting method thereof |
| CN115483517A (en) * | 2021-05-31 | 2022-12-16 | 上海华为技术有限公司 | Dielectric filter, printed circuit board and communication equipment |
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| CN110148819B (en) * | 2019-06-20 | 2024-03-26 | 京信通信技术(广州)有限公司 | Capacitive coupling structure of dielectric waveguide filter and dielectric waveguide filter |
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