CN110146421A - It is a kind of to clean the method for probe, laser resistance adjuster - Google Patents
It is a kind of to clean the method for probe, laser resistance adjuster Download PDFInfo
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- CN110146421A CN110146421A CN201910520628.7A CN201910520628A CN110146421A CN 110146421 A CN110146421 A CN 110146421A CN 201910520628 A CN201910520628 A CN 201910520628A CN 110146421 A CN110146421 A CN 110146421A
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- China
- Prior art keywords
- probe
- dust
- cleaning
- image
- laser
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume, or surface-area of porous materials
- G01N15/02—Investigating particle size or size distribution
- G01N15/0205—Investigating particle size or size distribution by optical means, e.g. by light scattering, diffraction, holography or imaging
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume, or surface-area of porous materials
- G01N15/02—Investigating particle size or size distribution
- G01N15/0205—Investigating particle size or size distribution by optical means, e.g. by light scattering, diffraction, holography or imaging
- G01N15/0227—Investigating particle size or size distribution by optical means, e.g. by light scattering, diffraction, holography or imaging using imaging, e.g. a projected image of suspension; using holography
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D3/00—Control of position or direction
- G05D3/12—Control of position or direction using feedback
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume, or surface-area of porous materials
- G01N15/02—Investigating particle size or size distribution
- G01N15/0205—Investigating particle size or size distribution by optical means, e.g. by light scattering, diffraction, holography or imaging
- G01N2015/025—Methods for single or grouped particles
Abstract
The embodiment of the present application provides a kind of method of cleaning probe, laser resistance adjuster, is related to laser field.This method is applied to laser resistance adjuster, this method comprises: whether the dust adhered on the probe that judgement is mounted on the laser resistance adjuster meets preset cleaning condition；When the dust of the attachment meets preset cleaning condition, controls the probe and be moved to preset cleaning positions；The dust adhered on probe described in laser beam flying based on cleaning positions control output, so that the laser beam removes the dust of the attachment.This method also improves the cleaning effect of probe while improving the convenience of probe cleaning.
Description
Technical field
This application involves laser fields, in particular to a kind of method for cleaning probe, laser resistance adjuster.
Background technique
Laser resistance adjuster is mainly beaten on thick, film resistor using superfine laser beam, is realized by resistance steam raising
Thick, thin film circuit cutting.Probe card, main body are welded with more probes, and the equal lead of every probe is connected to the amount of resistance adjuster
Examining system, the measurement of every resistance at least need to use a pair of of probe.During laser beam steam raising resistance, partial ohmic
Material can be sputtered out by high temperature melting and (form dust), and a part is taken away by exhausting system, and a part is sticked on probe tip.
Over time, the dust particles on needle point can be increasing, finally influences the cut quality of the edge of a knife, leads to the resistance value or essence of resistance
Degree is affected.
Currently, the dust on the probe of laser resistance adjuster, generallys use three kinds of modes and is cleaned or cleaned: artificial to use
Brush cleaning；Equipment fixes hairbrush automated cleaning；Probe is removed, is cleaned using weak caustic solution.Individually use brush cleaning
When, the hard dust particle being sticked on probe is not easy to be brushed off；Probe cleaning is removed, though can guarantee to clean up, is grasped
It is more troublesome to make process.As it can be seen that the probe on laser resistance adjuster cleans inconvenience at present.
Summary of the invention
The application provides a kind of method of cleaning probe, laser resistance adjuster, to improve on laser resistance adjuster in the prior art
The inconvenient technical problem of probe cleaning.
Embodiments herein is accomplished in that
In a first aspect, the embodiment of the present application provides a kind of method for cleaning probe, it is applied to laser resistance adjuster, this method packet
It includes: determining whether the dust adhered on the probe being mounted on the laser resistance adjuster meets preset cleaning condition；Described
When the dust of attachment meets preset cleaning condition, controls the probe and be moved to preset cleaning positions；Based on the cleaning
The dust adhered on probe described in the laser beam flying of position control output, so that the laser beam removes the powder of the attachment
Dirt.
In the embodiment of the present application, the characteristics of laser capable of being exported using laser resistance adjuster itself, adhere on probe
When dust meets cleaning condition, the preset cleaning positions that probe is moved to, and then control and adhere on laser beam flying probe
Dust, achieve the purpose that remove dust.Compared with prior art, it does not on the one hand need individually to remove probe again and be cleaned,
The convenience for improving probe cleaning greatly；Dust on another aspect probe is usually the fusant of resistance material, is adopted
It can be realized with laser and melt or gasify again, cleaning effect is relatively good.Therefore, the side of cleaning probe provided by the embodiments of the present application
Method also improves the cleaning effect of probe while improving the convenience of probe cleaning.
As a kind of possible implementation, probe described in the laser beam flying based on cleaning positions control output,
Include:
Acquire the image of the probe and display；User is obtained to be inputted according to the image of the probe and the cleaning positions
Scanning information, the scanning information is used to indicate position of the dust of the attachment on the probe；Control the laser
The position of the instruction of scanning information described in beam scanning.
In the embodiment of the present application, scanning information can indicate position of the dust of attachment on probe, make laser beam only
It is attached with the position of dust on scanning probe, avoids laser scanning to the unattached position for having dust of probe, and leads to probe
The case where bending or damage, guarantee the integrity of the probe cleaned.
As a kind of possible implementation, the scanning information includes the dust of the attachment relative to the probe
Coordinate.
In the embodiment of the present application, by the position where the dust of coordinate instruction attachment, the mode of coordinate representation is more smart
Really, the accuracy of positioning dust position is improved.
As a kind of possible implementation, determine that the dust adhered on the probe being mounted on the laser resistance adjuster is full
The preset cleaning condition of foot, comprising:
Obtain the probe image currently acquired；The probe image is analyzed, according to the dust of the attachment in institute
State the size that area shared in probe image determines the dust of the attachment；Be greater than in the size of the dust of the attachment or
When equal to preset value, determine that the dust of the attachment meets preset cleaning condition.
In the embodiment of the present application, it is determined if to meet cleaning condition, the ruler of dust according to the size of the dust of attachment
It is very little to be easier to judge, and it is not easy have error, improve the accuracy for determining whether to meet cleaning condition.
As a kind of possible implementation, after the cleaning positions described in the laser beam flying of control output, the method
Further include:
The image of the probe after acquisition cleaning；The image of the probe is analyzed, it is described after judging cleaning
Whether dust is attached on probe；It is attached on the probe after judging cleaning if being attached with dust on the probe after cleaning
The size of dust whether be more than or equal to the preset value；If the size of the dust adhered on the probe after cleaning
More than or equal to the preset value, controls the laser beam and scan the cleaning positions again.
In the embodiment of the present application, after completing cleaning, continue to judge dust size, if being unsatisfactory for corresponding condition,
It needs to clean again, and then can guarantee that probe cleans up.
As a kind of possible implementation, it is pre- to determine that the dust adhered on the probe being mounted on laser resistance adjuster meets
If cleaning condition, comprising: obtain the probe image that currently acquires；The probe image is sent to user monitoring side；It is connecing
When receiving the clear instruction that the user monitoring side is sent, determine that the dust of the attachment meets preset cleaning condition.
In the embodiment of the present application, in addition to laser resistance adjuster itself judges whether to probe cleaning, use can also be passed through
The user of family monitoring side initiates clear instruction, meets the cleaning demand of user.
As a kind of possible implementation, the probe image currently acquired is obtained, comprising: determine whether carrying out
Repair resistance；Determining currently when carrying out repairing resistance, receive complete to repair the instruction of resistance when, obtain the probe image currently acquired.
In the embodiment of the present application, if carrying out repairing resistance, just judge whether to need to clean to visit after completing to repair resistance process
Needle ensure that the continuity of generating process.
As a kind of possible implementation, the probe is moved to preset cleaning positions, comprising:
The probe is moved to the position within the focal position 5mm apart from the laser beam.
In the embodiment of the present application, the position within the focal position 5mm of the laser beam is as cleaning positions, Neng Goubao
Demonstrate,prove laser beam flying arrive probe while, scan effect it is preferable.
Second aspect, the embodiment of the present application provide a kind of laser resistance adjuster, comprising: device for image is mounted on for determination
Whether the dust adhered on the probe on the laser resistance adjuster meets preset cleaning condition；Support device, for described
When device for image determines that the dust of the attachment meets preset cleaning condition, controls the probe and be moved to preset cleaning position
It sets；Laser aid, for probe described in the laser beam flying based on cleaning positions control output, so that the laser beam is clear
Except the dust of the attachment.
As a kind of possible implementation, the device for image is also used to acquire and show the image of the probe；Institute
It states laser aid and is also used to obtain the scanning information that user inputs according to the image of the probe and the cleaning positions, it is described to sweep
It retouches information and is used to indicate position of the dust of the attachment on the probe；The laser aid is also used to control the laser
The position of the instruction of scanning information described in beam scanning.
Detailed description of the invention
Technical solution in ord to more clearly illustrate embodiments of the present application will make below to required in the embodiment of the present application
Attached drawing is briefly described, it should be understood that the following drawings illustrates only some embodiments of the application, therefore should not be seen
Work is the restriction to range, for those of ordinary skill in the art, without creative efforts, can be with
Other relevant attached drawings are obtained according to these attached drawings.
Fig. 1 is laser resistance adjuster structural schematic diagram provided by the embodiments of the present application.
Fig. 2 is the flow chart of the method for cleaning probe provided by the embodiments of the present application.
Fig. 3 is the implementation flow chart of the mode of cleaning probe provided by the embodiments of the present application.
Icon: 100- laser resistance adjuster；101- laser aid；102- device for image；103- probe card；104- support dress
It sets.
Specific embodiment
Below in conjunction with attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application is described.
Fig. 1 is please referred to, is 100 structural schematic diagram of laser resistance adjuster provided by the embodiments of the present application, laser resistance adjuster includes
Laser aid 101, device for image 102, probe card 103 and support device 104.Laser aid 101 can with outgoing laser beam, and
The laser beam of control output is scanned in certain region.Device for image 102 is connect with laser aid 101, can be set
In the side of laser aid 101, the light path coaxial of device for image 102 and laser aid 101 can be observed in real time laser point and visit
The position of needle.Probe card 103 is located at 101 lower section of laser aid, is welded with more probes in probe card 103, when measuring resistance,
It at least needs to use a pair of of probe.Support device 104 is connect with probe card 103, and probe card 103 is fixed in support device 104,
Support device 104 can drive probe card 103 mobile.
It should be noted that only included in laser resistance adjuster 100 shown in FIG. 1 introduced with the embodiment of the present application it is clear
The related structure of method for washing probe, applied to institute in the laser resistance adjuster 100 of the method for cleaning probe of the embodiment of the present application
Including device or component be not limited to shown in Fig. 1.
For laser aid 101, it is to be understood that a laser emitter is equivalent to, in the fortune of laser resistance adjuster 100
During row, including laser beam beaten on resistance, to realize the cutting to resistance, and cleaning probe, all passes through laser dress
Set 101 outgoing laser beams.Since the light beam that laser aid 101 exports is mainly used for resistance trimming, what laser aid 101 exported swashs
Light beam is generally thinner, and thinner laser beam causes to damage for can also reduce the cleaning of probe to a certain extent to probe.
It may include camera and processor for device for image 102, camera can acquire in its image pickup scope
Image, after collecting image, processor can carry out image procossing and analysis to image.In addition, laser resistance adjuster 100 may be used also
To include the display screen connecting with device for image 102, acquired image can be sent to aobvious by the processor of device for image 102
Display screen, so that the image of display screen real-time display acquisition, such as during repairing resistance, user can be monitored by display screen and be repaired
Resistance process.In addition, the laser beam that device for image 102 and laser aid 101 export be it is coaxial, laser aid 101 can be controlled
Controlling laser beam is scanned, and the region specifically scanned or range can be determined by user using device for image 102,
After determination, laser aid 101 controls laser beam and is scanned in the region or range.
For support device 104, as a kind of optional embodiment: including attachment device and control device, connection dress
It sets and is moveably mounted on control device, attachment device can be connecting rod, connecting rod one end and the fixed company of probe card 103
It connects, the connecting rod other end is mounted on control device.Control device controls probe card 103 by controlling the movement of connecting rod
Movement, mobile direction can be upper and lower.It is understood that support device 104 can only control probe card 103 perpendicular
Histogram to movement.
Above-mentioned control device and processor may is that a kind of IC chip, have signal handling capacity.May be used also
To be general processor, including central processing unit (Central Processing Unit, CPU), network processing unit (Network
Processor, NP) etc.；Can also be digital signal processor, specific integrated circuit, ready-made programmable gate array or other
Programmable logic device, discrete gate or transistor logic, discrete hardware components.General processor can be microprocessor
Or the processor is also possible to any conventional processor etc..
Next the structure for combining laser resistance adjuster 100 is situated between to the method work of cleaning probe provided by the embodiments of the present application
It continues.It referring to figure 2., is the flow chart of the method provided by the embodiments of the present application for cleaning probe, as described in Figure 2, this method comprises:
Step 210: whether the dust adhered on the probe that judgement is mounted on laser resistance adjuster 100 meets preset cleaning
Condition.
Step 220: when the dust of the attachment meets preset cleaning condition, control probe is moved to preset cleaning
Position.
Step 230: the dust adhered on the laser beam flying probe based on cleaning positions control output.
The method of cleaning probe provided by the embodiments of the present application also improves while improving the convenience of probe cleaning
The cleaning effect of probe.
For step 210- step 230, when being applied to laser resistance adjuster 100, probe therein is in probe card 103
Probe, it is, therefore, to be understood that in step 210, needing to judge that the dust adhered on each probe in probe card 103 is
It is no to meet preset cleaning condition, further, in a step 220, regardless of how many root probe meets preset cleaning condition,
Can traveling probe card 103, further, in step 230, in the dust of scanning attachment, be also based on every meet it is clear
The probe for washing condition is scanned.
For step 210, which can be executed by device for image 102.It is understood that if the powder adhered on probe
Dirt it is fewer perhaps smaller will not operation to probe or use have an impact.Meet preset cleaning condition and represents spy
The dust adhered on needle can operation to probe or use have an impact, need to clean it.
Wherein, it about preset cleaning condition, can be the quantity of the dust of attachment, be also possible to the ruler of the dust of attachment
It is very little.The dust adhered on probe is usually graininess, if granular dust sticks together, quantity is not easy to judge.Cause
This, which can be a size range or a size threshold, when the size of the dust of attachment belongs to the size
Range or when meeting the size threshold, just can determine that probe meets the preset condition.
Further, for step 210, the embodiment of the present application provides two kinds of optional embodiments.The first embodiment party
The probe image currently acquired is obtained likes:；Probe image is analyzed, it is shared in probe image according to the dust of attachment
Area determines the size of the dust of attachment；When the size of the dust of attachment is more than or equal to preset value, the powder of attachment is determined
The dust-full preset cleaning condition of foot.
Wherein, it is analyzed to probe image, when determining the dust size adhered on probe, it will be understood that image
The process analyzed is the equal of the process of an image procossing, probe image is first carried out gray processing, after gray processing processing
The probe image is embodied in the form of multiple pixels, by positioning to each pixel, can be judged attached on probe
Dust in probe image where position.Also, the profile for each dust particles be also it is known, by powder
The boundary point of dirt particle or the position (coordinate) in pixel coordinate of profile point are calculated, and attachment can be calculated
Dust area shared in probe image carries out corresponding data processing to the area: such as changing whole, removal decimal place,
Obtain the size of dust.Certainly, during analysis, however, it is determined that have multiple dust particles out, then each dust particles exist
Shared area is all calculated in probe image.
After determining dust size, if preset cleaning condition is a size threshold, then by dust size and being somebody's turn to do
Size threshold (minimum value) is compared, and if more than or equal to the size threshold, it is preset clear to determine that the dust of attachment meets
Wash condition.Where it is assumed that there are multiple dust size values, each size value is compared with the size threshold, if having at least
One size value is greater than the size threshold, determines that the dust of attachment meets preset cleaning condition.If preset cleaning condition is
One size range, then dust size is judged whether in the size range, if dust size in the size range, determines
The dust of attachment meets preset cleaning condition.Where it is assumed that there is multiple dust size values, judge each size value whether
In the size range, if there is at least one size value in the size range, determine that the dust of attachment meets preset cleaning item
Part.In the embodiment of the present application, size threshold can be 20 microns, and the lower limit of size range is not more than 20 microns, size range
The upper limit be not less than 20 microns, such as size range be 19-21 microns.
Second of embodiment: the probe image currently acquired is obtained；Probe image is sent to user monitoring side；It is connecing
When receiving the clear instruction of user monitoring side transmission, determine that the dust of attachment meets preset cleaning condition.
Wherein, user monitoring side can be remote monitoring end, such as the monitoring device of monitoring room；It is also possible to aforementioned implementation
The included display screen of laser resistance adjuster 100 described in example.After probe image is sent to user monitoring side, one is with
Family rule of thumb can visually judge whether probe needs to clean；Another kind is when sending probe image to user monitoring side, to incite somebody to action
The dust size obtained after analysis is sent to user monitoring side together, user according to dust size judge probe whether needs
Cleaning.After determining that probe needs to clean, clear instruction is initiated on user monitoring side, is sent to by user monitoring side, in turn
Make device for image 102 when receiving clear instruction, determines that the dust adhered on probe meets cleaning condition.It should be noted that
It is that the image that device for image 102 is transferred to user monitoring side can be static state, is also possible to dynamically, it is dynamic i.e. real-time
Monitoring picture.
In addition, regardless of which kind of embodiment is step 210 use, for laser resistance adjuster 100, in order to guarantee its production
The continuity of process, the cleaning of probe are executed after can repairing resistance process completing one, therefore, in two kinds of embodiments, are obtained
The probe image currently acquired is taken to comprise determining that currently whether carrying out repairing resistance；It is determining currently when carrying out repairing resistance, is receiving
To when completing to repair the instruction of resistance, the probe image currently acquired is obtained.
Wherein it is determined that currently whether carrying out repairing resistance, in the operational process of all parts in laser resistance adjuster 100,
All parts can communicate, and device for image 102 can determine whether repairing resistance certainly by the communication between other component,
Such as laser aid 101, resistance process is repaired in the participation of laser aid 101, and in 101 no longer outgoing laser beam of laser aid, is represented
Entirely resistance process is repaired to have completed.So whole process may is that laser aid 101 starts after repairing resistance process, just filled with image
It sets 102 to be communicated, after completing to repair resistance, generates the instruction for completing to repair resistance, be sent to device for image 102, device for image 102 exists
After receiving instruction, the probe image currently acquired is obtained.
After completing step 210, step 220 is executed, step 220 can be executed by support device 104.Wherein, preset
Cleaning positions represent a preferable scan position of laser beam, and laser beam is interior in the position, can sufficiently carry out to probe clear
It washes.In the embodiment of the present application, which can be the region within the focal position 5mm apart from laser beam.Therefore it walks
Rapid 220 may include: that probe is moved to the position within the focal position 5mm apart from the laser beam.
For support device 104, there are two the positions where probe card 103, and one is where when measuring resistance
Position, another is the cleaning positions, therefore support device 104 moves probe card 103 between two positions.It is filled in image
It sets after 102 judgement probes meet cleaning condition, the instruction of traveling probe card 103, support device 104 is sent to support device 104
Probe card 103 is moved to cleaning positions upon receipt of the instructions, certainly, after completing cleaning, support device 104 is by probe card
103 playback, to maintain normal production process.It should be noted that laser aid 101 is in the top of probe card 103, because
This, the moving direction that support device 104 controls is to move up and down.
After completing step 220, executing step 230 can be by laser aid 101 and device for image for step 230
102 complete.Since dust is only attached to the portion of probe, in order to avoid position of the laser to unattached dust is damaged
It is bad, before starting cleaning, need to orient position of the dust of attachment on probe, so that laser aid 101 is targetedly right
Dust is purged.
As an alternative embodiment, step 230 includes: the image of acquisition probe and display；Obtain user according to
The scanning information of image and the cleaning positions input of probe, scanning information are used to indicate position of the dust of attachment on the probe
It sets；Control the position of laser beam flying scanning information instruction.
Wherein, the image of acquisition probe can be executed by device for image 102, and display can be by connecting with device for image 102
Display screen execute.User checks the image that device for image 102 acquires in real time by display screen, determines that the dust of attachment is being visited
Position on needle, and the position is marked, the scanning information which inputs as user.The form of label can be logical
Coordinate label is crossed, during user carries out coordinate label, coordinate can be marked on the basis of probe image, it can also be to visit
Coordinate is marked on the basis of needle.Therefore, which can be coordinate of the dust relative to probe image of attachment, be also possible to
Coordinate of the dust of attachment relative to probe.In short, the scanning information can be used to indicate that position of the dust of attachment on probe
It sets.
After user inputs scanning information, laser aid 101 can obtain the scanning information by device for image 102, swash
Electro-optical device 101 controls the position of laser beam flying scanning information instruction, such as the position can be the tip position of probe.Swash
Electro-optical device 101 is internally provided with galvanometer system, and the galvanometer system and device for image 102 can link, and therefore, passes through image
The coordinate that device 102 determines, can indicate the track of galvanometer system movement, i.e. galvanometer system can directly refer to according to scanning information
The coordinate shown is scanned.
For laser resistance adjuster 100, resistance trimming or repair resistance etc. processes be conventional process, under normal circumstances, powder
Dirt can all be attached to the needle region of probe, and the position of dust attachment in other words is usually fixation, not have too big variation.Cause
This can store scanning information after getting scanning information for the first time, carry out every time clearly next time and later
When washing, the scanning information of storage is directly acquired, is then scanned further according to the coordinate of scanning information instruction.
By the method for the cleaning probe of the embodiment of the present application, the structure of laser resistance adjuster 100 itself is taken full advantage of, no
It is only completed the cleaning of probe on laser resistance adjuster 100, and entire cleaning process will not influence the life of laser resistance adjuster 100 itself
Production process is convenient and efficient.
When being scanned cleaning, laser aid 101 (is located in laser aid 101 using included galvanometer system
Portion), scanning speed quickly (generally 300mm/s-500mm/s), and in probe card 103 probe attachment dust it is narrow
(usually 5mm*100mm), so will soon complete to clean.Also, cleaning object is the dust particles of hard, dust particles
Be the fusant of resistance material, therefore laser can be used and melt or gasify again, realize the purpose of cleaning, and cleaning effect compared with
It is good.
After executing step 230, i.e., after laser beam cleans probe, this method further include: the spy after acquisition cleaning
The image of needle；The image of probe is analyzed, whether is attached with dust on the probe after judging cleaning；If the probe after cleaning
On be attached with dust, whether the size of dust adhered on the probe after judging cleaning is more than or equal to preset value；If cleaning
The size of the dust adhered on probe afterwards is more than or equal to preset value, and control laser beam scans cleaning positions again.
Wherein, the probe image after acquisition cleaning can be executes after laser aid 101 stops outgoing laser beam.
Next, being a kind of implementation flow chart provided by the embodiments of the present application, as shown in figure 3, completing referring to figure 3.
After laser repairs resistance, the size discrimination of probe tip dust particles is carried out, if size is not exceeded, continues next laser and repair to hinder
Journey；If size is exceeded, the position of support system (i.e. support device 104) traveling probe card 103.Image system (i.e. device for image
102) scanning area (i.e. user determines scan position by the image that device for image 102 acquires) is drawn, sweep parameter is loaded
(i.e. confirmation scanning information), and then laser cleaning is carried out according to sweep parameter.
In the embodiment of the present application, for all parts on laser resistance adjuster 100, device for image 102, for judging peace
Whether the dust adhered on the probe on laser resistance adjuster 100 meets preset cleaning condition.Support device 104, is used for
When device for image 102 determines that the dust adhered to meets preset cleaning condition, control probe is moved to preset cleaning positions.
Laser aid 101, for probe described in the laser beam flying based on cleaning positions control output, so that the laser beam is clear
Except the dust of the attachment.
Optionally, device for image 102 is also used to acquire and show the image of the probe；Laser aid 101 is also used to obtain
The scanning information that family is inputted according to the image of the probe and the cleaning positions is taken, the scanning information is used to indicate described
Position of the dust of attachment on the probe；Laser aid 101 is also used to control scanning information described in the laser beam flying
The position of instruction.
Optionally, device for image 102 is also used to: obtaining the probe image currently acquired；The probe image is divided
Analysis determines the size of the dust of the attachment according to the dust of attachment area shared in the probe image；Institute
When stating the size of the dust of attachment more than or equal to preset value, determine that the dust of the attachment meets preset cleaning condition.
Optionally, device for image 102 is also used to: the image of the probe after acquisition cleaning；To the image of the probe
It is analyzed, whether is attached with dust on the probe after judging cleaning；If being attached with dust on the probe after cleaning,
Whether the size of the dust adhered on the probe after judging cleaning is more than or equal to the preset value.If the institute after cleaning
The size for stating the dust adhered on probe is more than or equal to the preset value, and laser aid 101 is also used to control the laser
Shu Zaici scans the cleaning positions.
Optionally, device for image 102 is also used to: obtaining the probe image currently acquired；The probe image is sent to
User monitoring side；When receiving the clear instruction that the user monitoring side is sent, it is default to determine that the dust of the attachment meets
Cleaning condition.
Optionally, device for image 102 is also used to: determining whether carrying out repairing resistance；It currently is carrying out repairing resistance determining
When, receive complete to repair the instruction of resistance when, obtain the probe image that currently acquires.
The all parts of laser resistance adjuster 100 are used to complete each step of the method for the cleaning probe in previous embodiment
Suddenly, it for the detailed embodiment of each step, and is corresponded in previous embodiment, is not repeated to introduce herein.
In several embodiments provided herein, it should be understood that disclosed device and method can also pass through
Other modes are realized.The apparatus embodiments described above are merely exemplary, for example, flow chart and block diagram in attached drawing
Show the device of multiple embodiments according to the application, the architecture, function and operation in the cards of method.
The above description is only an example of the present application, the protection scope being not intended to limit this application, for ability
For the technical staff in domain, various changes and changes are possible in this application.Within the spirit and principles of this application, made
Any modification, equivalent substitution, improvement and etc. should be included within the scope of protection of this application.It should also be noted that similar label and
Letter indicates similar terms in following attached drawing, therefore, once it is defined in a certain Xiang Yi attached drawing, then in subsequent attached drawing
In do not need that it is further defined and explained.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
The above, the only specific embodiment of the application, but the protection scope of the application is not limited thereto, it is any
Those familiar with the art within the technical scope of the present application, can easily think of the change or the replacement, and should all contain
Lid is within the scope of protection of this application.Therefore, the protection scope of the application shall be subject to the protection scope of the claim.
Claims (10)
1. a kind of method for cleaning probe, which is characterized in that be applied to laser resistance adjuster, which comprises
Judge whether the dust adhered on the probe being mounted on the laser resistance adjuster meets preset cleaning condition；
When the dust of the attachment meets preset cleaning condition, controls the probe and be moved to preset cleaning positions；
The dust adhered on probe described in laser beam flying based on cleaning positions control output, so that the laser beam is clear
Except the dust of the attachment.
2. the method according to claim 1, wherein the laser beam flying based on cleaning positions control output
The probe, comprising:
Acquire the image of the probe and display；
The scanning information that user inputs according to the image of the probe and the cleaning positions is obtained, the scanning information is for referring to
Show position of the dust of the attachment on the probe；
Control the position of the instruction of scanning information described in the laser beam flying.
3. according to the method described in claim 2, it is characterized in that, the scanning information include the attachment dust relative to
The coordinate of the probe.
4. the method according to claim 1, wherein judging to be mounted on attached on the probe on the laser resistance adjuster
Dust meet preset cleaning condition, comprising:
Obtain the probe image currently acquired；
The probe image is analyzed, according to the dust of the attachment, area shared in the probe image determines institute
State the size of the dust of attachment；
When the size of the dust of the attachment is more than or equal to preset value, it is preset clear to determine that the dust of the attachment meets
Wash condition.
5. according to the method described in claim 4, it is characterized in that, the cleaning positions described in the laser beam flying of control output
Afterwards, the method also includes:
The image of the probe after acquisition cleaning；
The image of the probe is analyzed, whether is attached with dust on the probe after judging cleaning；
If being attached with dust on the probe after cleaning, whether the size of the dust adhered on the probe after judging cleaning
More than or equal to the preset value；
If the size of the dust adhered on the probe after cleaning is more than or equal to the preset value, the laser beam is controlled
The cleaning positions are scanned again.
6. the method according to claim 1, wherein adhering on the probe that is mounted on laser resistance adjuster of judgement
Dust meets preset cleaning condition, comprising:
Obtain the probe image currently acquired；
The probe image is sent to user monitoring side；
When receiving the clear instruction that the user monitoring side is sent, determine that the dust of the attachment meets preset cleaning item
Part.
7. the method according to claim 4 or 6, which is characterized in that obtain the probe image currently acquired, comprising:
It determines whether carrying out repairing resistance；
Determining currently when carrying out repairing resistance, receive complete to repair the instruction of resistance when, obtain the probe image currently acquired.
8. the method according to claim 1, wherein the probe is moved to preset cleaning positions, comprising:
The probe is moved to the position within the focal position 5mm apart from the laser beam.
9. a kind of laser resistance adjuster characterized by comprising
Device for image, for judging it is preset clear whether the dust adhered on the probe being mounted on the laser resistance adjuster meets
Wash condition；
Support device when for determining that the dust of the attachment meets preset cleaning condition in the device for image, controls institute
It states probe and is moved to preset cleaning positions；
Laser aid, for probe described in the laser beam flying based on cleaning positions control output, so that the laser beam
Remove the dust of the attachment.
10. laser resistance adjuster according to claim 9, which is characterized in that
The device for image is also used to acquire and show the image of the probe；
The laser aid is also used to obtain the scanning information that user inputs according to the image of the probe and the cleaning positions,
The scanning information is used to indicate position of the dust of the attachment on the probe；
The laser aid is also used to control the position of the instruction of scanning information described in the laser beam flying.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910520628.7A CN110146421A (en) | 2019-06-14 | 2019-06-14 | It is a kind of to clean the method for probe, laser resistance adjuster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910520628.7A CN110146421A (en) | 2019-06-14 | 2019-06-14 | It is a kind of to clean the method for probe, laser resistance adjuster |
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| CN110146421A true CN110146421A (en) | 2019-08-20 |
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| CN201910520628.7A Pending CN110146421A (en) | 2019-06-14 | 2019-06-14 | It is a kind of to clean the method for probe, laser resistance adjuster |
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| US20010007421A1 (en) * | 1997-09-12 | 2001-07-12 | Arno G. Marcuse | Method and apparatus for cleaning electronic test contacts |
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| CN107199251A (en) * | 2017-07-06 | 2017-09-26 | 武汉翔明激光科技有限公司 | A kind of laser cleaner |
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|---|---|---|---|---|
| US20010007421A1 (en) * | 1997-09-12 | 2001-07-12 | Arno G. Marcuse | Method and apparatus for cleaning electronic test contacts |
| CN1416310A (en) * | 2001-10-30 | 2003-05-07 | 李俊豪 | Method for quick resistance trimming by using laser on printed circuit board directly |
| CN101474626A (en) * | 2008-01-03 | 2009-07-08 | 尚富煜科技股份有限公司 | Laser cleaning system and method thereof |
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Application publication date: 20190820 |