CN110146370B - Micro-force loading measuring device and method - Google Patents
Micro-force loading measuring device and method Download PDFInfo
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- CN110146370B CN110146370B CN201910461694.1A CN201910461694A CN110146370B CN 110146370 B CN110146370 B CN 110146370B CN 201910461694 A CN201910461694 A CN 201910461694A CN 110146370 B CN110146370 B CN 110146370B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
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- G01N2203/0016—Tensile or compressive
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- G—PHYSICS
- G01—MEASURING; TESTING
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- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/003—Generation of the force
- G01N2203/0032—Generation of the force using mechanical means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
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- G01N2203/0051—Piezoelectric means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
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Abstract
The invention provides a micro-force loading measuring device and a micro-force loading measuring method, which comprise a piezoelectric component, a moving component, a first loading module, a second loading module, a first measuring module and a processing module, wherein the piezoelectric component is arranged on the moving component; the first loading module is used for applying mechanical force to the moving assembly through the deformation of the piezoelectric assembly and driving the moving assembly to move through the mechanical force; the second loading module is used for applying electrostatic force to the moving assembly and driving the moving assembly to move through the electrostatic force; the first measuring module is used for measuring the displacement of the moving component; the processing module is used for obtaining the magnitude of the force borne by the moving component according to the displacement of the moving component, wherein the force comprises the mechanical force, the electrostatic force and the adhesion force, and therefore the coupling measurement of mechanical loading and electric loading is realized.
Description
Technical Field
The invention relates to the technical field of micro-nano measurement, in particular to a micro-force loading measurement device and method.
Background
With the continuous development of precision instrument technology, the scientific research and industrial fields put higher requirements on the mechanical behavior characterization of materials under the condition of micro mechanical force and micro electrostatic force. Due to the fact that the size of the micro-nano sample and the range of the corresponding force value are small, loading and measurement of micro mechanical force and electrostatic force of the micro-nano sample are difficult.
The micro force loading mainly comprises mechanical loading and electrical loading, and for a conductive sample, the mechanical property and the electrical property of the sample are often required to be measured simultaneously, that is, the mechanical force, the electrostatic force and the like of the sample are measured, but the mechanical loading and the electrical loading in the prior art cannot be simultaneously coupled for measurement, so that the application range is greatly limited.
Disclosure of Invention
In view of this, the present invention provides a device and a method for measuring a micro force loading, so as to solve the problem in the prior art that a mechanical loading and an electrical loading are realized at the same time.
In order to achieve the purpose, the invention provides the following technical scheme:
a micro-force loading measuring device comprises a piezoelectric component, a moving component, a first loading module, a second loading module, a first measuring module and a processing module;
the first loading module is used for controlling the piezoelectric assembly to deform, applying mechanical force to the moving assembly through the deformation of the piezoelectric assembly and driving the moving assembly to move through the mechanical force;
the second loading module is used for applying electrostatic force to the moving assembly and driving the moving assembly to move through the electrostatic force;
the first measuring module is used for measuring the displacement of the moving component;
the processing module is used for obtaining the magnitude of the force borne by the moving component according to the displacement of the moving component, wherein the force comprises the mechanical force and the electrostatic force.
Optionally, a sample to be detected is carried by one end of the piezoelectric assembly facing the moving assembly, and the piezoelectric assembly is used for driving the sample to be detected to move;
the first end of the moving assembly is positioned in the moving direction of the sample to be detected and has a preset distance with the sample to be detected;
one end of the sample to be detected, which faces the piezoelectric component, is provided with a first electrode; the second end of the moving component is fixed and is provided with a second electrode, and the second end is opposite to the first end;
the second loading module generates an electrostatic force between the first electrode and the second electrode by applying a voltage to the first electrode and the second electrode, and applies the electrostatic force to the moving assembly;
the processing module is also used for obtaining the adhesive force between the moving component and the sample to be detected according to the displacement of the moving component.
Optionally, a second measurement module is further included;
the second measuring module is used for measuring the displacement of the piezoelectric component;
the processing module is further used for obtaining the deformation quantity of the sample to be detected according to the displacement quantity of the piezoelectric component and the displacement quantity of the moving component, and obtaining the Young modulus of the sample to be detected according to the deformation quantity of the sample to be detected and the mechanical force.
Optionally, the micro-force loading measuring device includes a light source, a first half mirror, a second half mirror, a first reflector to a sixth reflector, and the fifth reflector is located between the second piezoelectric component and the sample to be measured and moves along with the piezoelectric component;
the light source is used for emitting measuring light;
the first half mirror is used for dividing the measuring light into first measuring light and second measuring light;
the first reflector is used for reflecting the first measuring light to the first end of the moving component;
the second reflector is used for reflecting the first measuring light reflected by the first end of the moving component to the first measuring module;
the third reflector and the fourth reflector are used for reflecting the second measuring light to the second half mirror;
the second half mirror is used for dividing the second measuring light into third measuring light and fourth measuring light, reflecting the third measuring light to the fifth reflector, and reflecting the fourth measuring light to the sixth reflector, so that the third measuring light reflected by the fifth reflector and the fourth measuring light reflected by the sixth reflector interfere to form interference light;
the first measuring module is used for obtaining the displacement of the moving component according to the displacement of the first measuring light reflected by the first end of the moving component and the corresponding relation between the displacement of the first measuring light and the displacement of the moving component, which is obtained in advance;
the second measuring module is used for obtaining the displacement of the piezoelectric component according to the number of the interference light fringes and the wavelength of the measuring light.
Optionally, the first measurement module comprises a beam quality analyzer and a first calculation module;
the beam quality analyzer is used for measuring and obtaining the displacement of the first measuring light reflected by the first end of the moving component;
the first calculation module is used for obtaining the displacement of the mobile component according to the displacement of the first measuring light reflected by the first end of the mobile component and the corresponding relation between the displacement of the first measuring light and the displacement of the mobile component, wherein the corresponding relation is obtained in advance.
Optionally, the second measurement module comprises a photodetector and a second calculation module;
the photoelectric detector is used for detecting the interference light and converting the interference light signal into an electric signal;
the second calculation module is used for obtaining the number of fringes of the interference light according to the electric signal and obtaining the displacement of the piezoelectric component according to the number of the fringes and half of the wavelength of the measuring light;
or, the second measurement module comprises a photoelectric detector and an oscilloscope;
the photoelectric detector is used for detecting the interference light and converting the interference light signal into an electric signal;
the oscilloscope is used for obtaining a curve of the light intensity of the interference light changing along with the voltage according to the electric signal, obtaining the number of fringes of the interference light according to the curve, and obtaining the displacement of the piezoelectric component according to the number of the fringes and half of the wavelength of the measuring light.
Optionally, a microscope is also included;
the microscope is used for observing the sample to be detected and the moving assembly.
A method of measuring micro-force loading, comprising:
the second loading module applies electrostatic force to the moving assembly and drives the moving assembly to move through the electrostatic force;
the first measuring module measures the displacement of the moving component, and the processing module obtains the electrostatic force according to the displacement of the moving component;
the first loading module applies mechanical force to the moving assembly through the piezoelectric assembly to drive the moving assembly to move;
the first measuring module measures the displacement of the moving component, and the processing module obtains the mechanical force according to the displacement of the moving component.
Optionally, the method further comprises:
the first loading module stops working, so that the moving assembly moves reversely;
the first measuring module measures the displacement of the moving component, and the processing module obtains the adhesive force born by the moving component according to the displacement of the moving component.
Optionally, the method further comprises:
the second measuring module measures the displacement of the piezoelectric component;
the processing module obtains the deformation quantity of the sample to be tested borne by the piezoelectric component according to the displacement quantity of the piezoelectric component and the displacement quantity of the moving component, and obtains the Young modulus of the sample to be tested according to the deformation quantity of the sample to be tested and the mechanical force.
Compared with the prior art, the technical scheme provided by the invention has the following advantages:
the device and the method for measuring the micro-force loading provided by the invention have the advantages that the first loading module applies mechanical force to the moving component through the piezoelectric component shape and drives the moving component to move through the mechanical force, the second loading module applies electrostatic force to the moving component and drives the moving component to move through the electrostatic force, the first measuring module measures the displacement of the moving component, and the processing module obtains the mechanical force and the electrostatic force according to the displacement of the moving component, so that the coupling measurement of mechanical loading and electric loading is realized, and the application range of the device is expanded.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a micro-force loading measurement apparatus according to an embodiment of the present invention;
fig. 2 is a schematic partial structural diagram of a loading measuring device according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of another loading measurement device for measuring a minute force according to an embodiment of the present invention;
FIG. 4 is a schematic partial structural diagram of another loading measuring device according to an embodiment of the present invention;
FIG. 5 is a flowchart of a method for measuring a micro-force loading according to an embodiment of the present invention;
FIG. 6 is a graph of output displacement versus driving voltage of a piezoelectric ceramic according to an embodiment of the present invention;
fig. 7 is a schematic diagram illustrating a positional relationship between a piezoelectric element and a movable element in an electrostatic force measurement mode according to an embodiment of the present invention;
FIG. 8 is a graph illustrating the variation of capacitance with electrode spacing according to an embodiment of the present invention;
FIG. 9 is a graph illustrating the variation of electrostatic force versus electrode spacing provided by an embodiment of the present invention;
fig. 10 is a schematic diagram illustrating a positional relationship between a piezoelectric element and a movable element in a mechanical force measurement mode according to an embodiment of the present invention;
fig. 11 is a schematic diagram illustrating a positional relationship between a piezoelectric element and a movable element in an adhesion measurement mode according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the above is the core idea of the present invention, and the above objects, features and advantages of the present invention can be more clearly understood. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a micro-force loading measuring device, which comprises a piezoelectric component 10, a moving component 11, a first loading module 12, a second loading module 13, a first measuring module 14 and a processing module 15, as shown in fig. 1.
The first loading module 12 is configured to control deformation of the piezoelectric component 10, apply a mechanical force to the moving component 11 through the deformation of the piezoelectric component 10, and drive the moving component 11 to move through the mechanical force; the second loading module 13 is used for applying an electrostatic force to the moving assembly 10 and driving the moving assembly 11 to move through the electrostatic force; the first measuring module 14 is used for measuring the displacement of the moving component 11; the processing module 15 is configured to obtain the magnitude of the force applied to the moving component 11 according to the displacement of the moving component 11, where the force includes a mechanical force and an electrostatic force.
Alternatively, as shown in fig. 2, the piezoelectric element 10 in the embodiment of the present invention is a piezoelectric ceramic, and the moving element 11 is a cantilever beam, a first end of the cantilever beam is fixed, and a second end, i.e., a moving end, of the cantilever beam is located at a certain distance above the piezoelectric element 10. The first loading module 12 is a first voltage source, and the second loading module 13 is a second voltage source. The processing module 15 includes a computer and the like.
When the second voltage source applies an electrostatic force to the cantilever, that is, in the electrostatic force measurement mode, the moving end of the cantilever moves under the action of the electrostatic force, and after the first measurement module 14 measures the displacement of the cantilever, the processing module 15 obtains the magnitude of the electrostatic force according to the displacement of the cantilever.
When first voltage source applyed the voltage on piezoceramics, under mechanical force measurement mode promptly, piezoceramics can take place small deformation, and piezoceramics can move to the top, and when piezoceramics's displacement was greater than its and the cantilever beam between apart from, piezoceramics can drive the removal end of cantilever beam and move together, and piezoceramics can drive the cantilever beam through the mechanical force that self deformation produced and move together promptly. After the first measurement module 14 measures the displacement of the cantilever beam, the processing module 15 obtains the magnitude of the mechanical force according to the displacement of the cantilever beam.
Further, as shown in fig. 3 and 4, one end of the piezoelectric assembly 10 facing the moving assembly 11 carries a sample 20 to be measured, and the piezoelectric assembly 10 is configured to drive the sample 20 to be measured to move; the first end, i.e. the moving end, of the moving assembly 11 is located in the moving direction of the sample 20 to be measured and has a preset distance with the sample 20 to be measured; the end of the sample 20 to be tested, which faces the piezoelectric component 10, is provided with a first electrode 16; the second end of the moving element 11 is fixed and the second end of the moving element 11 has a second electrode 17, the second end being disposed opposite to the first end. Wherein, the second loading module 13 generates an electrostatic force between the first electrode 16 and the second electrode 17 by applying a voltage to the first electrode 16 and the second electrode 17, and applies the electrostatic force on the moving assembly 11. The processing module 15 is further configured to obtain the magnitude of the adhesion between the moving component 11 and the sample 20 according to the displacement of the moving component 11.
That is to say, when the first voltage source applies a voltage to the piezoelectric ceramic, that is, in the mechanical force measurement mode, the piezoelectric ceramic deforms slightly, the piezoelectric ceramic drives the sample 20 to be measured and the movable end of the cantilever beam to move together, then, the first measurement module 14 measures the displacement of the cantilever beam, and the processing module 15 obtains the magnitude of the mechanical force borne by the cantilever beam according to the displacement of the cantilever beam.
After the first voltage source is powered off, the piezoelectric ceramic moves in the reverse direction in the adhesion force measurement mode, at this time, there is adhesion force between the sample 20 to be measured and the cantilever beam, and after the displacement of the cantilever beam is measured by the first measurement module 14, the processing module 15 obtains the magnitude of the adhesion force between the sample 20 to be measured and the cantilever beam according to the displacement of the cantilever beam.
Optionally, as shown in fig. 3, the device for measuring the loading of the micro-force in the embodiment of the present invention further includes a second measuring module 18. The second measuring module 18 is used for measuring the displacement of the piezoelectric component 10; the processing module 15 is further configured to obtain a deformation amount of the sample 20 to be measured according to the displacement amount of the piezoelectric element 10 and the displacement amount of the moving element 11, and obtain the young's modulus of the sample 20 to be measured according to the deformation amount of the sample 20 to be measured and the mechanical force.
In particular, according to the formula F-3 EIMoving assembly/l3The magnitude of the force F can be calculated, wherein the force F includes mechanical force, electrostatic force, adhesive force, and the like,moving assemblyThe displacement of the moving end of the moving element 11, I is the length of the moving element 11, E is the elastic modulus, and I is the moment of inertia.
When the piezoelectric element 10 drives the sample 20 to be measured to press the moving element 11 to apply a mechanical force, the sample 20 to be measured will also be slightly deformed because the forces are mutually different. That is, in the mechanical force measuring mode, according to the formulaSample (I)＝Piezoelectric component-Moving assemblyThe deformation quantity of the sample 20 to be measured can be calculatedSample (I)Wherein, in the step (A),piezoelectric componentAs the amount of displacement of the piezoelectric element 10,moving assemblyAfter the displacement of the moving component 11 is obtained by the first measuring module 14 and the displacement of the piezoelectric component 10 is obtained by the second measuring module 18, the processing module 15 can use the formulaSample (I)＝Piezoelectric component-Moving assemblyObtaining the deformation quantity of the sample 20 to be measuredSample (I)According to the formula F ═ 3EI/l3After obtaining the magnitude of the mechanical force, the method can be based on the formula EYoung's disease＝(F/S)/(Sample (I)/l) obtaining the Young modulus E of the sample 20 to be measuredYoung's disease. Wherein S is the contact area between the sample 20 to be measured and the cantilever beam, and l is the original length of the sample 20 to be measured.
In the embodiment of the present invention, as shown in fig. 3, the device for measuring the loading of the micro-force includes a light source 19, a first half mirror 210, a second half mirror 220, a first reflecting mirror 211, a second reflecting mirror 212, a third reflecting mirror 213, a fourth reflecting mirror 214, a fifth reflecting mirror 215, and a sixth reflecting mirror 216, where the fifth reflecting mirror 215 is located between the piezoelectric assembly 10 and the sample 20 to be measured, for example, between the piezoelectric assembly 10 and the first electrode 16, and moves along with the piezoelectric assembly 10. That is, the amount of movement of the fifth mirror 215 is equal to the amount of movement of the piezoelectric assembly 10.
The light source 19 may be a laser light source or the like. The light source 19 is used for emitting measuring light; the first half mirror 210 is used for dividing the measuring light into a first measuring light and a second measuring light; the first reflector 211 is used for reflecting the first measuring light to the first end of the moving assembly 11; the second reflector 212 is used for reflecting the first measuring light reflected by the first end of the moving assembly 11 to the first measuring module 14; the third reflector 213 and the fourth reflector 214 are used for reflecting the second measuring light to the second half mirror 220; the second half mirror 220 is used for dividing the second measuring light into a third measuring light and a fourth measuring light, reflecting the third measuring light to the fifth reflecting mirror 215, and reflecting the fourth measuring light to the sixth reflecting mirror 216, so that the third measuring light reflected by the fifth reflecting mirror 215 and the fourth measuring light reflected by the sixth reflecting mirror 216 interfere with each other to form interference light.
In the embodiment of the present invention, the first measuring module 14 is configured to obtain the displacement of the moving component 11 according to the displacement of the first measuring light reflected by the first end of the piezoelectric component 10 and a pre-obtained corresponding relationship between the displacement of the first measuring light and the displacement of the moving component 11; the second measuring module 18 is configured to obtain a displacement of the piezoelectric element 10 according to the number of fringes of the interference light and a half of the wavelength of the measuring light.
Optionally, the first measurement module 14 comprises a beam quality analyzer and a first calculation module; the beam quality analyzer is used for measuring and obtaining the displacement of the first measuring light reflected by the first end of the moving component 11; the first calculating module is configured to obtain a displacement amount of the moving component 11 according to a displacement amount of the first measuring light reflected by the first end of the moving component 11 and a pre-obtained correspondence relationship between the displacement amount of the first measuring light and the displacement amount of the moving component 11.
Optionally, the second measurement module 18 comprises a photodetector and a second calculation module; the photoelectric detector is used for detecting interference light and converting an interference light signal into an electric signal; the second calculation module is used for obtaining the number of fringes of the interference light according to the electric signal and obtaining the displacement of the piezoelectric component 10 according to the number of fringes and half of the wavelength of the measuring light.
Alternatively, the second measurement module 18 includes a photodetector and an oscilloscope; the photoelectric detector is used for detecting interference light and converting an interference light signal into an electric signal; the oscilloscope is used for obtaining a curve of the light intensity of the interference light along with the voltage change according to the electric signal, so that a user can obtain the number of fringes of the interference light according to the curve, and obtain the displacement of the piezoelectric component 10 according to the number of the fringes and half of the wavelength of the measuring light.
It should be noted that the device for measuring the loading of the micro force provided by the embodiment of the present invention further includes an optical microscope, which is used for observing the mechanical behavior of the sample 20 to be measured, the moving assembly 11, and the like.
Specifically, the lens of the optical microscope is located above the first electrode 16 and the second electrode 17, and is used for observing the mechanical behavior of the electrode material under the electrostatic force, and determining the contact and desorption states of the sample 20 to be measured and the cantilever. Alternatively, the sample 20 to be measured may be observed in real time by an optical microscope when the electrostatic force and the mechanical force are applied. Of course, before using the optical microscope, an appropriate magnification should be selected and the corresponding focal length should be adjusted, which is not described herein again.
The embodiment of the present invention further provides a method for measuring a micro force loading, as shown in fig. 5, including:
s101: the second loading module applies electrostatic force to the moving assembly and drives the moving assembly to move through the electrostatic force;
s102: the first measuring module measures the displacement of the moving component, and the processing module obtains electrostatic force according to the displacement of the moving component;
alternatively, referring to fig. 2, the piezoelectric element 10 in the embodiment of the present invention is a piezoelectric ceramic, and the moving element 11 is a cantilever beam, a first end of which is fixed, and a second end, i.e., a moving end, of which is located at a certain distance above the piezoelectric element 10. The first loading module 12 is a first voltage source, and the second loading module 13 is a second voltage source. The processing module 15 includes a computer and the like.
When the second voltage source applies an electrostatic force to the cantilever, the moving end of the cantilever moves under the action of the electrostatic force, and after the first measuring module 14 measures the displacement of the cantilever, the processing module 15 obtains the magnitude of the electrostatic force according to the displacement of the cantilever.
S103: the first loading module applies mechanical force to the moving assembly through the piezoelectric assembly and drives the moving assembly to move through the mechanical force;
s104: the first measuring module measures the displacement of the moving component, and the processing module obtains mechanical force according to the displacement of the moving component.
When first voltage source applyed voltage on piezoceramics, piezoceramics can take place small deformation, and piezoceramics can move to the top, and when piezoceramics's displacement was greater than its and the cantilever beam between the distance, piezoceramics can drive the removal end of cantilever beam and move together, and piezoceramics can drive the cantilever beam through the mechanical force that self deformation produced and move together promptly. After the first measurement module 14 measures the displacement of the cantilever beam, the processing module 15 obtains the magnitude of the mechanical force according to the displacement of the cantilever beam.
Optionally, when the sample to be tested is carried on the piezoelectric assembly, the method provided in the embodiment of the present invention further includes:
the first loading module stops working, and the moving assembly moves reversely;
the first measuring module measures the displacement of the moving component, and the processing module obtains the adhesion between the moving component and the sample to be measured according to the displacement of the moving component;
after the first voltage source is powered off, the piezoelectric ceramic is restored, namely, moves reversely, at the moment, the adhesion force exists between the sample to be measured and the cantilever beam, and after the displacement of the cantilever beam is measured through the first measuring module 14, the processing module 15 obtains the size of the adhesion force according to the displacement of the cantilever beam.
Optionally, the load measurement method provided in the embodiment of the present invention further includes:
the second measuring module measures the displacement of the piezoelectric component;
the processing module obtains the deformation quantity of the sample to be tested borne by the piezoelectric component according to the displacement quantity of the piezoelectric component and the displacement quantity of the moving component, and obtains the Young modulus of the sample to be tested according to the deformation quantity of the sample to be tested and mechanical force.
That is, in the mechanical force measuring mode, the first measuring module 14 obtains the displacement of the movable component 11, and the second measuring module 18 obtains the displacementAfter the displacement of the piezoelectric element 10, the processing module 15 can be based on the formulaSample (I)＝Piezoelectric component-Moving assemblyObtaining the deformation quantity of the sample 20 to be measuredSample (I)According to the formula F ═ 3EI/l3After obtaining the magnitude of the mechanical force, the method can be based on the formula EYoung's disease＝(F/S)/(Sample (I)/l) obtaining the Young modulus E of the sample 20 to be measuredYoung's disease。
Next, a process of measuring the application of a small force will be described by taking the structure shown in fig. 3 and 4 as an example.
Before the micro-force measurement is performed, an appropriate moving component 11, i.e. a cantilever beam, needs to be selected according to the range of the required measurement force, so as to ensure that the moving range of the light spot of the first measurement light is within the receiving range of the first measurement module 14.
The piezoelectric assembly 10, i.e., the piezoelectric ceramic, is then brought into light proximity with the cantilever under an optical microscope without displacing the cantilever. Then, through adjusting different voltage values, the piezoelectric ceramics are controlled to reach different displacement amounts, and the cantilever beam is controlled to reach different displacement amounts. It should be noted that, at this time, the piezoelectric ceramic is regarded as a rigid body, and then the displacement amount of the piezoelectric ceramic is equal to the displacement amount of the cantilever beam, so that a one-to-one correspondence relationship between the displacement amount of the cantilever beam and the spot movement amount of the first measurement light can be established.
Fixing the sample 20 to be measured on the sample stage, and adjusting the multiplying power and the working distance of the optical microscope to enable the sample 20 to be measured to be imaged clearly. Under an optical microscope, the sample 20 to be tested is kept parallel to the cantilever beam, and the distance between the two is larger than the required testing distance D.
Then, the light source 19 is turned on, the measuring light emitted from the light source 19 is split into a first measuring light and a second measuring light by the first half mirror 210, the first reflecting mirror 211 reflects the first measuring light to the first end of the movable assembly 11, and the second reflecting mirror 212 reflects the first measuring light reflected by the first end of the movable assembly 11 to the first measuring module 14. The third mirror 213 and the fourth mirror 214 reflect the second measuring light to the second half mirror 220, the second half mirror 220 divides the second measuring light into third measuring light and fourth measuring light, the third measuring light is reflected to the fifth mirror 215, the fourth measuring light is reflected to the sixth mirror 216, and the third measuring light reflected by the fifth mirror 215 and the fourth measuring light reflected by the sixth mirror 216 interfere with each other to form interference light.
Then, the first loading module 12 is turned on, that is, the first voltage source is turned on, and the voltage value of the first voltage source is adjusted to move the piezoelectric ceramic, wherein a graph of the output displacement and the driving voltage of the piezoelectric ceramic is shown in fig. 6, an upper curve in fig. 6 represents a step-up process, and a lower curve represents a step-down process. The displacement of the piezoelectric ceramic is obtained by the second measuring module 18, so that the distance between the sample 20 to be tested and the cantilever reaches the required testing distance D.
Then, the second loading module 13 is turned on, that is, the second voltage source is turned on, the voltage value between the first electrode 16 and the second electrode 17 is set, and the electrostatic force between the first electrode 16 and the second electrode 17 is applied to the cantilever beam located between the first electrode 16 and the second electrode 17 by applying a voltage to the first electrode 16 and the second electrode 17, as shown in fig. 7, the cantilever beam will move towards the sample 20 to be measured under the action of the electrostatic force. At this time, the mechanical behavior of the sample 20 to be measured and the like can be observed by an optical microscope.
After the cantilever beam moves, the light spot position of the first measuring light reflected by the cantilever beam also moves, and after the first measuring module 14 collects the position movement amount of the light spot of the first measuring light, the displacement amount of the cantilever beam is obtained according to the one-to-one correspondence relationship between the cantilever beam displacement amount and the light spot movement amount of the first measuring lightMoving assembly. The processing module 15 may then process the signal according to the formula F-3 EIMoving assembly/l3And obtaining the electrostatic force borne by the cantilever beam.
It should be noted that the first electrode 16 and the second electrode 17 have a constant potential difference V and a constant capacitance C therebetween. Capacitance C, electrostatic potential energy W, electrostatic force FEThe following formulas (1), (2) and (3). Wherein the dielectric constant is defined as a relative dielectric constant,0a dielectric constant in vacuum, a capacitance C, and an electrostatic force FEThe curves according to the distance between the first electrode 16 and the second electrode 17 are shown in fig. 8 and 9.
Then, the second voltage source is turned off, after the cantilever beam is stabilized, the first voltage source is adjusted to control the piezoelectric ceramic to move continuously, so that the piezoelectric ceramic drives the sample 20 to be measured to contact with the cantilever beam arm, but the light spot of the first measuring light is not moved, that is, no mechanical force or pressure is applied to the cantilever beam, and then the first voltage source is adjusted continuously, so that the sample 20 to be measured applies mechanical force or pressure to the cantilever beam, as shown in fig. 10, the cantilever beam moves in a direction away from the sample 20 to be measured.
After the first measurement module 14 collects the position movement amount of the light spot of the first measurement light, that is, the position movement amounts of the light spot before and after applying pressure, the displacement amount of the cantilever beam is obtained according to the one-to-one correspondence relationship between the displacement amount of the cantilever beam and the light spot movement amount of the first measurement lightMoving assembly. The processing module 15 may then process the signal according to the formula F-3 EIMoving assembly/l3The magnitude of the mechanical force or pressure borne by the cantilever beam is obtained.
After the second measuring module 18 collects the interference light, the displacement of the piezoelectric ceramic is obtained according to the number of fringes of the interference light and half of the wavelength of the measuring lightPiezoelectric component. Displacement of piezoelectric ceramicPiezoelectric componentEqual to the number of fringes of the interference light multiplied by half the wavelength of the measurement light. The processing module 15 can then follow the formulaSample (I)＝Piezoelectric component-Moving assemblyThe deformation quantity of the sample 20 to be measured can be calculatedSample (I)According to formula EYoung's disease＝(F/S)/(Sample (I)/l) obtaining the Young modulus E of the sample 20 to be measuredYoung's disease. It should be noted that, when the piezoelectric ceramic and the fifth reflecting mirror 215 move, the optical path difference between the third measuring light and the fourth measuring light may occurThe number of the interference light spot light and dark fringes can be changed.
Then, the first voltage source is turned off, the piezoelectric ceramic moves in a reverse direction, as shown in fig. 11, the sample 20 to be measured and the cantilever beam are desorbed, the cantilever beam is reversely displaced by the adhesive force, and after the position and the movement amount of the light spot of the first measuring light are collected by the first measuring module 14, the displacement amount of the cantilever beam is obtained according to the one-to-one correspondence relationship between the displacement amount of the cantilever beam and the movement amount of the light spot of the first measuring lightMoving assembly. The processing module 15 may then process the signal according to the formula F-3 EIMoving assembly/l3The magnitude of the adhesive force borne by the cantilever beam is obtained.
According to the device and the method for measuring the micro-force loading, the first loading module enables the piezoelectric assembly to deform, the moving assembly is driven to move by mechanical force generated by the deformation of the piezoelectric assembly, the second loading module applies electrostatic force to the moving assembly and drives the moving assembly to move by the electrostatic force, the first measuring module measures the displacement of the moving assembly, and the processing module obtains the mechanical force and the electrostatic force according to the displacement of the moving assembly, so that the coupling measurement of mechanical loading and electrical loading is realized, the application range of the device is expanded, and the problems of sample transfer, measurement precision difference and test point change caused by the fact that the electrostatic force and the mechanical force are measured on different instruments are effectively solved. In addition, the micro-force loading measurement device and the micro-force loading measurement method provided by the embodiment of the invention solve the problem of in-situ real-time observation of the mechanical behavior of the sample to be measured, and are beneficial to associating the mechanical and electrical test curve with the actual motion change of the sample to be measured.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A micro-force loading measuring device is characterized by comprising a piezoelectric component, a moving component, a first loading module, a second loading module, a first measuring module, a second measuring module, a processing module, a light source, a first semi-transparent semi-reflective mirror, a second semi-transparent semi-reflective mirror, a first reflector to a sixth reflector, wherein the fifth reflector is positioned between the piezoelectric component and a sample to be measured and moves along with the piezoelectric component;
one end of the piezoelectric component, which faces the moving component, is loaded with a sample to be detected, and the piezoelectric component is used for driving the sample to be detected to move;
the first end of the moving assembly is positioned in the moving direction of the sample to be detected and has a preset distance with the sample to be detected;
one end of the sample to be detected, which faces the piezoelectric component, is provided with a first electrode; the second end of the moving component is fixed and is provided with a second electrode, and the second end is opposite to the first end;
the first loading module is used for controlling the piezoelectric assembly to deform, applying mechanical force to the moving assembly through the deformation, and driving the moving assembly to move through the mechanical force;
the second loading module applies voltage to the first electrode and the second electrode to generate electrostatic force between the first electrode and the second electrode, the electrostatic force is applied to the moving assembly, and the moving assembly is driven to move through the electrostatic force;
the light source is used for emitting measuring light;
the first half mirror is used for dividing the measuring light into first measuring light and second measuring light;
the first reflector is used for reflecting the first measuring light to the first end of the moving component;
the second reflector is used for reflecting the first measuring light reflected by the first end of the moving component to the first measuring module;
the third reflector and the fourth reflector are used for reflecting the second measuring light to the second half mirror;
the second half mirror is used for dividing the second measuring light into third measuring light and fourth measuring light, reflecting the third measuring light to the fifth reflector, and reflecting the fourth measuring light to the sixth reflector, so that the third measuring light reflected by the fifth reflector and the fourth measuring light reflected by the sixth reflector interfere to form interference light;
the first measuring module is used for obtaining the displacement of the moving component according to the displacement of the first measuring light reflected by the first end of the moving component and the corresponding relation between the displacement of the first measuring light and the displacement of the moving component, which is obtained in advance;
the second measuring module is used for obtaining the displacement of the piezoelectric component according to the number of the interference light fringes and the wavelength of the measuring light;
the processing module is used for obtaining the magnitude of a force borne by the moving component according to the displacement of the moving component, wherein the force comprises the mechanical force and the electrostatic force; the processing module is also used for obtaining the adhesive force between the moving component and the sample to be detected according to the displacement of the moving component; the processing module is further used for obtaining the deformation quantity of the sample to be detected according to the displacement quantity of the piezoelectric component and the displacement quantity of the moving component, and obtaining the Young modulus of the sample to be detected according to the deformation quantity of the sample to be detected and the mechanical force.
2. The apparatus of claim 1, wherein the first measurement module comprises a beam quality analyzer and a first calculation module;
the beam quality analyzer is used for measuring and obtaining the displacement of the first measuring light reflected by the first end of the moving component;
the first calculation module is used for obtaining the displacement of the mobile component according to the displacement of the first measuring light reflected by the first end of the mobile component and the corresponding relation between the displacement of the first measuring light and the displacement of the mobile component, wherein the corresponding relation is obtained in advance.
3. The apparatus of claim 2, wherein the second measurement module comprises a photodetector and a second calculation module;
the photoelectric detector is used for detecting the interference light and converting the interference light signal into an electric signal;
the second calculation module is used for obtaining the number of fringes of the interference light according to the electric signal and obtaining the displacement of the piezoelectric component according to the number of the fringes and half of the wavelength of the measuring light;
or, the second measurement module comprises a photoelectric detector and an oscilloscope;
the photoelectric detector is used for detecting the interference light and converting the interference light signal into an electric signal;
the oscilloscope is used for obtaining a curve of the light intensity of the interference light changing along with the voltage according to the electric signal, obtaining the number of fringes of the interference light according to the curve, and obtaining the displacement of the piezoelectric component according to the number of the fringes and half of the wavelength of the measuring light.
4. The apparatus of claim 1, further comprising a microscope;
the microscope is used for observing the sample to be detected and the moving assembly.
5. A micro-force loading measurement method applied to the micro-force loading measurement device according to any one of claims 1 to 4, the measurement method comprising:
the second loading module applies voltage to the first electrode and the second electrode to generate electrostatic force between the first electrode and the second electrode, the electrostatic force is applied to the moving assembly, and the moving assembly is driven to move through the electrostatic force;
the first measuring module obtains the displacement of the moving component according to the displacement of the first measuring light reflected by the first end of the moving component and the corresponding relation between the displacement of the first measuring light and the displacement of the moving component, and the processing module obtains the electrostatic force according to the displacement of the moving component;
the first loading module controls the piezoelectric assembly to deform, applies mechanical force to the moving assembly through the deformation, and drives the moving assembly to move through the mechanical force;
the first measuring module obtains the displacement of the moving component according to the displacement of the first measuring light reflected by the first end of the moving component and the corresponding relation between the displacement of the first measuring light and the displacement of the moving component, wherein the corresponding relation is obtained in advance, and the processing module obtains the mechanical force according to the displacement of the moving component.
6. The method of claim 5, further comprising:
the first loading module stops working, so that the moving assembly moves reversely;
the first measuring module measures the displacement of the moving component, and the processing module obtains the adhesive force born by the moving component according to the displacement of the moving component.
7. The method of claim 5, further comprising:
the second measuring module measures the displacement of the piezoelectric component;
the processing module obtains the deformation quantity of the sample to be tested borne by the piezoelectric component according to the displacement quantity of the piezoelectric component and the displacement quantity of the moving component, and obtains the Young modulus of the sample to be tested according to the deformation quantity of the sample to be tested and the mechanical force.
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