CN110146370A - A kind of the load measuring device and method of small power - Google Patents
A kind of the load measuring device and method of small power Download PDFInfo
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- CN110146370A CN110146370A CN201910461694.1A CN201910461694A CN110146370A CN 110146370 A CN110146370 A CN 110146370A CN 201910461694 A CN201910461694 A CN 201910461694A CN 110146370 A CN110146370 A CN 110146370A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0016—Tensile or compressive
- G01N2203/0019—Compressive
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/003—Generation of the force
- G01N2203/0032—Generation of the force using mechanical means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/003—Generation of the force
- G01N2203/005—Electromagnetic means
- G01N2203/0051—Piezoelectric means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/0069—Fatigue, creep, strain-stress relations or elastic constants
- G01N2203/0075—Strain-stress relations or elastic constants
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Abstract
The present invention provides a kind of load measuring device of small power and methods, including piezoelectric element, moving assembly, the first loading module, the second loading module, the first measurement module and processing module；First loading module is used to apply mechanical force to the moving assembly by the deformation of the piezoelectric element, and drives the moving assembly mobile by the mechanical force；Second loading module is used to apply to the moving assembly electrostatic force, and drives the moving assembly mobile by the electrostatic force；First measurement module is used to measure the displacement of the moving assembly；The processing module is used to obtain the size for the power that the moving assembly is born according to the displacement of the moving assembly, and the power includes the mechanical force, the electrostatic force and adhesion strength, to realize the coupling measurement of mechanical load and electricity load.
Description
Technical field
The present invention relates to micro-nano field of measuring technique, a kind of load measuring device more specifically to small power and
Method.
Background technique
With the continuous development of precision instrument technology, scientific research and industrial circle are to material in milli machine power, small electrostatic
More stringent requirements are proposed for mechanical behavior characterization under power.Due to micro-nano sample size and corresponding force value range compared with
It is small, therefore, cause the milli machine power of micro-nano sample and the load of electrostatic force and measurement all relatively difficult.
Wherein, the load of small power mainly has mechanical load and electricity load, for conducting sample, it is often necessary to simultaneously
The mechanical performance and electric property of sample, the i.e. mechanical force of measurement sample and electrostatic force etc. are measured, it is still, mechanical in the prior art
Load and electricity load cannot simultaneously coupling measurement, significantly limit application range.
Summary of the invention
In view of this, the present invention provides a kind of load measuring device of small power and method, to solve in the prior art
Different the problem of realizing mechanical load and electricity load simultaneously.
To achieve the above object, the invention provides the following technical scheme:
A kind of load measuring device of small power, including piezoelectric element, moving assembly, the first loading module, the second load
Module, the first measurement module and processing module；
First loading module generates deformation for controlling the piezoelectric element, and passes through the deformation of the piezoelectric element
Apply mechanical force to the moving assembly, drives the moving assembly mobile by the mechanical force；
Second loading module is used to apply to the moving assembly electrostatic force, and by described in electrostatic force drive
Moving assembly is mobile；
First measurement module is used to measure the displacement of the moving assembly；
The processing module is used to obtain the power that the moving assembly is born according to the displacement of the moving assembly
Size, the power include the mechanical force and the electrostatic force.
Optionally, one end of the piezoelectric element towards the moving assembly carries sample to be tested, the piezoelectric element
For driving the sample to be tested mobile；
The first end of the moving assembly is located on the moving direction of the sample to be tested and between the sample to be tested
With pre-determined distance；
The sample to be tested has first electrode towards one end of the piezoelectric element；The second end of the moving assembly is solid
The second end of the fixed and described moving assembly has second electrode, and the second end is oppositely arranged with the first end；
Second loading module by applying voltage to the first electrode and second electrode, make the first electrode and
Electrostatic force is generated between the second electrode, and the electrostatic force is applied on the moving assembly；
The processing module be also used to be obtained according to the displacement of the moving assembly moving assembly with it is described to be measured
Adhesion strength between sample.
It optionally, further include the second measurement module；
Second measurement module is used to measure the displacement of the piezoelectric element；
The processing module is also used to be obtained according to the displacement of the piezoelectric element and the displacement of the moving assembly
The deformation quantity of the sample to be tested, and the sample to be tested is obtained according to the deformation quantity of the sample to be tested and the mechanical force
Young's modulus.
Optionally, the load measuring device of the small power include light source, it is the first semi-transparent semi-reflecting lens, second semi-transparent semi-reflecting
Mirror, the first reflecting mirror to the 6th reflecting mirror, the 5th reflecting mirror be located at second piezoelectric element and the sample to be tested it
Between, and it is mobile with the piezoelectric element；
The light source is for being emitted measurement light；
First semi-transparent semi-reflecting lens are used to for the measurement light being divided into the first measurement light and the second measurement light；
First reflecting mirror is used to reflex to the first measurement light the first end of the moving assembly；
The first measurement light that second reflecting mirror is used to reflect the first end of the moving assembly reflexes to described the
One measurement module；
The third reflecting mirror and the 4th reflecting mirror are used to the second measurement light reflexing to described second semi-transparent semi-reflecting
Mirror；
Second semi-transparent semi-reflecting lens are used to the second measurement light being divided into third measurement light and the 4th measurement light, by institute
It states third measurement light and reflexes to the 5th reflecting mirror, the 4th measurement light is reflexed into the 6th reflecting mirror, so that institute
4th measurement light of the third measurement light and the 6th reflecting mirror reflection of stating the reflection of the 5th reflecting mirror interferes to form interference
Light；
The displacement for the first measurement light that first measurement module is used to be reflected according to the first end of the moving assembly
And the corresponding relationship of the displacement of the displacement and moving assembly for the first measurement light being previously obtained, it obtains described
The displacement of moving assembly；
Second measurement module is used for the wavelength of fringe number and the measurement light according to the interference light, obtains institute
State the displacement of piezoelectric element.
Optionally, first measurement module includes beam quality analysis instrument and the first computing module；
The beam quality analysis instrument is used to measure the first measurement light of the first end for obtaining moving assembly reflection
Displacement；
The displacement for the first measurement light that first computing module is used to be reflected according to the first end of the moving assembly
And the corresponding relationship of the displacement of the displacement and moving assembly for the first measurement light being previously obtained, it obtains described
The displacement of moving assembly.
Optionally, second measurement module includes photodetector and the second computing module；
The interference light signal is converted to electric signal for detecting the interference light by the photodetector；
Second computing module is used to obtain the fringe number of the interference light according to the electric signal, and according to the item
The half of the wavelength of line number and the measurement light, obtains the displacement of the piezoelectric element；
Alternatively, second measurement module includes photodetector and oscillograph；
The interference light signal is converted to electric signal for detecting the interference light by the photodetector；
The oscillograph is used to obtain the light intensity of the interference light according to the electric signal with the curve of voltage change, with root
The fringe number of the interference light is obtained according to the curve, and according to the fringe number and the half of the wavelength of the measurement light,
Obtain the displacement of the piezoelectric element.
It optionally, further include microscope；
The microscope is for observing the sample to be tested and the moving assembly.
A kind of load measurement method of small power, comprising:
Second loading module applies electrostatic force to the moving assembly, and drives the moving assembly by the electrostatic force
It is mobile；
First measurement module measures the displacement of the moving assembly, and processing module is according to the displacement of the moving assembly
Obtain the electrostatic force；
First loading module applies mechanical force to the moving assembly by the piezoelectric element, drives the moving assembly
It is mobile；
First measurement module measures the displacement of the moving assembly, and the processing module is according to the moving assembly
Displacement obtain the mechanical force.
Optionally, further includes:
First loading module stops working, and moves backward the moving assembly；
First measurement module measures the displacement of the moving assembly, and the processing module is according to the moving assembly
Displacement obtain the adhesion strength that the moving assembly is born.
Optionally, further includes:
Second measurement module measures the displacement of the piezoelectric element；
The processing module obtains the pressure according to the displacement of the piezoelectric element and the displacement of the moving assembly
The deformation quantity of the sample to be tested of electrical component carrying, and obtained according to the deformation quantity of the sample to be tested and the mechanical force described
The Young's modulus of sample to be tested.
Compared with prior art, the technical scheme provided by the invention has the following advantages:
The load measuring device and method of small power provided by the present invention, the first loading module pass through piezoelectric element deformation
Apply mechanical force to moving assembly, and drive moving assembly mobile by mechanical force, the second loading module applies to moving assembly
Electrostatic force, and drive moving assembly mobile by electrostatic force, the first measurement module measures the displacement of moving assembly, processing module
The size of mechanical force and electrostatic force is obtained according to the displacement of moving assembly, to realize the coupling of mechanical load and electricity load
Measurement, expands the application range of device.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of structural schematic diagram of the load measuring device of small power provided in an embodiment of the present invention；
Fig. 2 is a kind of partial structure diagram for loading measuring device provided in an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of the load measuring device of the small power of another kind provided in an embodiment of the present invention；
Fig. 4 is the partial structure diagram of another load measuring device provided in an embodiment of the present invention；
Fig. 5 is a kind of flow chart of the load measurement method of small power provided in an embodiment of the present invention；
Fig. 6 is piezoelectric ceramics output displacement-driving voltage curve graph provided in an embodiment of the present invention；
Fig. 7 is that a kind of electrostatic force measurement pattern provided in an embodiment of the present invention pushes electrical component and the position of moving assembly is closed
It is schematic diagram；
Fig. 8 is the variation relation curve graph of capacitor provided in an embodiment of the present invention and electrode spacing；
Fig. 9 is the variation relation curve graph of electrostatic force provided in an embodiment of the present invention and electrode spacing；
Figure 10 is the position that a kind of mechanical force measurement pattern provided in an embodiment of the present invention pushes electrical component and moving assembly
Relation schematic diagram；
Figure 11 is the position that a kind of adhesion strength measurement pattern provided in an embodiment of the present invention pushes electrical component and moving assembly
Relation schematic diagram.
Specific embodiment
It is core of the invention thought above, to keep the above objects, features and advantages of the present invention more obvious easily
Understand, following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention is clearly and completely retouched
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a kind of load measuring devices of small power, as shown in Figure 1, include piezoelectric element 10,
Moving assembly 11, the first loading module 12, the second loading module 13, the first measurement module 14 and processing module 15.
Wherein, the first loading module 12 is for controlling 10 deformation of piezoelectric element, and by the deformation of piezoelectric element 10 to shifting
Dynamic component 11 applies mechanical force, drives moving assembly 11 mobile by mechanical force；Second loading module 13 is used for moving assembly
10 apply electrostatic force, and drive moving assembly 11 mobile by electrostatic force；First measurement module 14 is for measuring moving assembly 11
Displacement；Processing module 15 is used to obtain the size for the power that moving assembly 11 is born according to the displacement of moving assembly 11,
The power includes mechanical force and electrostatic force.
Optionally, as shown in Fig. 2, the piezoelectric element 10 in the embodiment of the present invention is piezoelectric ceramics, moving assembly 11 is outstanding
The first end of arm beam, the cantilever beam is fixed, and second end, that is, mobile terminal of the cantilever beam is located at 10 top certain distance of piezoelectric element
It is interior.First loading module 12 is first voltage source, and the second loading module 13 is the second voltage source.Processing module 15 includes computer
Deng.
When the second voltage source applies electrostatic force on a cantilever beam, i.e., under electrostatic force measurement pattern, the movement of cantilever beam
End can move under the action of electrostatic force, after the measurement of the first measurement module 14 obtains the displacement of cantilever beam, processing module 15
The size of electrostatic force is obtained according to the displacement of cantilever beam.
When first voltage source applies voltage on piezoelectric ceramics, i.e., under mechanical force measurement pattern, piezoelectric ceramics can be sent out
Raw miniature deformation, piezoelectric ceramics can be moved upward, when the moving distance of piezoelectric ceramics is greater than the distance between itself and cantilever beam
When, the mobile terminal that piezoelectric ceramics will drive cantilever beam moves together, i.e., piezoelectric ceramics can pass through the mechanical force of self-deformation generation
Cantilever beam is driven to move together.After the measurement of first measurement module 14 obtains the displacement of cantilever beam, processing module 15 is according to outstanding
The displacement of arm beam obtains the size of mechanical force.
Further, as shown in Figure 3 and Figure 4, one end of piezoelectric element 10 towards moving assembly 11 carries sample to be tested
20, piezoelectric element 10 is for driving sample to be tested 20 mobile；First end, that is, mobile terminal of moving assembly 11 is located at sample to be tested 20
Moving direction on and between sample to be tested 20 have pre-determined distance；One end of sample to be tested 20 towards piezoelectric element 10 has
First electrode 16；The second end of moving assembly 11 fix and the second end of moving assembly 11 have second electrode 17, second end with
First end is oppositely arranged.Wherein, the second loading module 13 makes first by applying voltage to first electrode 16 and second electrode 17
Electrostatic force is generated between electrode 16 and second electrode 17, and electrostatic force is applied on moving assembly 11.Processing module 15 is also used
In obtaining the size of adhesion strength between moving assembly 11 and sample to be tested 20 according to the displacement of moving assembly 11.
That is, when first voltage source applies voltage on piezoelectric ceramics, i.e., under mechanical force measurement pattern, piezoelectricity
Miniature deformation occurs for ceramics, and piezoelectric ceramics drives the mobile terminal of sample to be tested 20 and cantilever beam to move jointly, later, the first measurement
The measurement of module 14 obtains the displacement of cantilever beam, and processing module 15 obtains the machinery of cantilever beam receiving according to the displacement of cantilever beam
The size of power.
After first voltage source power-off, under adhesion strength measurement pattern, piezoelectric ceramics reverse movement, at this point, sample to be tested
There is adhesion strength between 20 and cantilever beam, after obtaining the displacement of cantilever beam by the measurement of the first measurement module 14, processing module
15 obtain the size of adhesion strength between sample to be tested 20 and cantilever beam according to the displacement of cantilever beam.
Optionally, as shown in figure 3, the load measuring device of the small power in the embodiment of the present invention further includes the second measurement mould
Block 18.Second measurement module 18 is used to measure the displacement of piezoelectric element 10；Processing module 15 is also used to according to piezoelectric element 10
Displacement and the displacement of moving assembly 11 obtain the deformation quantity of sample to be tested 20, and according to the deformation quantity of sample to be tested 20 with
And mechanical force obtains the Young's modulus of sample to be tested 20.
Specifically, according to formula F=- 3EI δMoving assembly/l3Can calculate power output F size, wherein power F include mechanical force,
Electrostatic force and adhesion strength etc., δMoving assemblyFor the displacement of 11 mobile terminal of moving assembly, l is the length of moving assembly 11, and E is elasticity
Modulus, I are the moment of inertia.
When piezoelectric element 10, which drives sample to be tested 20 to squeeze to moving assembly 11, applies mechanical force, since power is mutual
, therefore, miniature deformation can also occur for sample to be tested 20.That is, it is first in mechanical force measurement pattern, according to formula δSample=
δPiezoelectric element-δMoving assemblyThe deformation quantity δ of sample to be tested 20 can be calculatedSample, wherein δPiezoelectric elementFor the displacement of piezoelectric element 10,
δMoving assemblyFor the displacement of moving assembly 11, i.e. the first measurement module 14 obtains the displacement of moving assembly 11, the second measurement module
After 18 obtain the displacement of piezoelectric element 10, processing module 15 can be according to formula δSample=δPiezoelectric element-δMoving assemblyIt obtains to test sample
The deformation quantity δ of product 20Sample, according to formula F=- 3EI δ/l3It, can be according to formula E after obtaining the size of mechanical forceYoung=(F/S)/
(δSample/ l) obtain the Young's modulus E of sample to be tested 20Young.Wherein, S be sample to be tested 20 and cantilever beam contact area, l for
The original of sample 20 is long.
In the embodiment of the present invention, as shown in figure 3, the load measuring device of small power includes that light source 19, first is semi-transparent semi-reflecting
Mirror 210, the second semi-transparent semi-reflecting lens 220, the first reflecting mirror 211, the second reflecting mirror 212, third reflecting mirror 213, the 4th reflecting mirror
214, the 5th reflecting mirror 215 and the 6th reflecting mirror 216, the 5th reflecting mirror 215 between piezoelectric element 10 and sample to be tested 20,
Such as between piezoelectric element 10 and first electrode 16, and it is mobile with piezoelectric element 10.That is, the 5th reflecting mirror 215
Amount of movement is equal to the amount of movement of piezoelectric element 10.
Wherein, light source 19 can be laser light source etc..Light source 19 is for being emitted measurement light；First semi-transparent semi-reflecting lens 210 are used
It is divided into the first measurement light and the second measurement light in light will be measured；First reflecting mirror 211 is used to the first measurement light reflexing to movement
The first end of component 11；The first measurement light that second reflecting mirror 212 is used to reflect the first end of moving assembly 11 reflexes to the
One measurement module 14；Third reflecting mirror 213 and the 4th reflecting mirror 214 are used to the second measurement light reflexing to the second semi-transparent semi-reflecting lens
220；Second semi-transparent semi-reflecting lens 220 are used to the second measurement light being divided into third measurement light and the 4th measurement light, and third is measured light
The 5th reflecting mirror 215 is reflexed to, the 4th measurement light is reflexed into the 6th reflecting mirror 216, so that the of the reflection of the 5th reflecting mirror 215
Three measurement light and the 4th measurement light of the 6th reflecting mirror 216 reflection interfere to form interference light.
In the embodiment of the present invention, first measurement of first measurement module 14 for being reflected according to the first end of piezoelectric element 10
The corresponding relationship of the displacement of the displacement and moving assembly 11 of the displacement of light and the first measurement light being previously obtained, obtains
The displacement of moving assembly 11；Second measurement module 18 is used for the one of the wavelength of the fringe number and measurement light according to interference light
Half, obtain the displacement of piezoelectric element 10.
Optionally, the first measurement module 14 includes beam quality analysis instrument and the first computing module；Beam quality analysis instrument
For measuring the displacement of the first measurement light of the first end reflection for obtaining moving assembly 11；First computing module is used for according to shifting
The displacement and shifting of the displacement of first measurement light of the first end reflection of dynamic component 11 and the first measurement light being previously obtained
The corresponding relationship of the displacement of dynamic component 11, obtains the displacement of moving assembly 11.
Optionally, the second measurement module 18 includes photodetector and the second computing module；Photodetector is for detecting
Interference light, and interference light signal is converted into electric signal；Second computing module is used to obtain the striped of interference light according to electric signal
Number, and according to fringe number and the half for the wavelength for measuring light, obtain the displacement of piezoelectric element 10.
Alternatively, the second measurement module 18 includes photodetector and oscillograph；Photodetector is used to detect interference light, and
Interference light signal is converted into electric signal；Oscillograph is used to obtain the light intensity of interference light with the song of voltage change according to electric signal
Line so that user obtains the fringe number of interference light according to curve, and according to fringe number and the half for the wavelength for measuring light, obtains
The displacement of piezoelectric element 10.
It should be noted that the load measuring device of small power provided in an embodiment of the present invention further includes optical microscopy,
The optical microscopy is used to observe the mechanical behavior of sample to be tested 20 and moving assembly 11 etc..
Specifically, the camera lens of optical microscopy is located at the top of first electrode 16 and second electrode 17, for observing electrode
The mechanical behavior of material under electrostatic forces, and the state for contacting and being desorbed with cantilever beam for determining sample to be tested 20.Alternatively,
When carrying out electrostatic force and mechanical force loads, sample to be tested 20 can be observed in real time by optical microscopy.Certainly, exist
Before optical microscopy, suitable multiplying power should be selected, and adjusts corresponding focal length, details are not described herein.
The embodiment of the invention also provides a kind of load measurement methods of small power, as shown in Figure 5, comprising:
S101: the second loading module applies electrostatic force to moving assembly, and drives moving assembly mobile by electrostatic force；
S102: the first measurement module measures the displacement of moving assembly, and processing module is obtained according to the displacement of moving assembly
To electrostatic force；
Optionally, with reference to Fig. 2, the piezoelectric element 10 in the embodiment of the present invention is piezoelectric ceramics, and moving assembly 11 is cantilever
The first end of beam, the cantilever beam is fixed, and second end, that is, mobile terminal of the cantilever beam is located in 10 top certain distance of piezoelectric element.
First loading module 12 is first voltage source, and the second loading module 13 is the second voltage source.Processing module 15 is including computer etc..
When the second voltage source applies electrostatic force on a cantilever beam, the mobile terminal of cantilever beam can be moved under the action of electrostatic force
Dynamic, after the measurement of the first measurement module 14 obtains the displacement of cantilever beam, processing module 15 is obtained according to the displacement of cantilever beam
The size of electrostatic force.
S103: the first loading module applies mechanical force to moving assembly by piezoelectric element, and is driven and moved by mechanical force
Dynamic component is mobile；
S104: the first measurement module measures the displacement of moving assembly, and processing module is obtained according to the displacement of moving assembly
To mechanical force.
When first voltage source applies voltage on piezoelectric ceramics, miniature deformation, piezoelectric ceramics meeting can occur for piezoelectric ceramics
It is moved upward, when the moving distance of piezoelectric ceramics is greater than the distance between itself and cantilever beam, piezoelectric ceramics will drive cantilever
The mobile terminal of beam moves together, i.e., the mechanical force that piezoelectric ceramics can be generated by self-deformation drives cantilever beam to move together.The
After the measurement of one measurement module 14 obtains the displacement of cantilever beam, processing module 15 obtains mechanical force according to the displacement of cantilever beam
Size.
Optionally, when carrying sample to be tested on piezoelectric element, method provided in an embodiment of the present invention further include:
First loading module stops working, moving assembly reverse movement；
First measurement module measures the displacement of moving assembly, and processing module is moved according to the displacement of moving assembly
Adhesion strength between component and sample to be tested；
After first voltage source power-off, piezoelectric ceramics restores to the original state, that is, moves backward, at this point, sample to be tested and cantilever beam
Between have adhesion strength, by the first measurement module 14 measurement obtain the displacement of cantilever beam after, processing module 15 is according to cantilever
The displacement of beam obtains the size of adhesion strength.
Optionally, load measurement method provided in an embodiment of the present invention further include:
The displacement of second measurement module measurement piezoelectric element；
Processing module obtains the to be measured of piezoelectric element carrying according to the displacement of piezoelectric element and the displacement of moving assembly
The deformation quantity of sample, and the Young's modulus of sample to be tested is obtained according to the deformation quantity of sample to be tested and mechanical force.
That is, under mechanical force measurement pattern, the first measurement module 14 obtains the displacement of moving assembly 11, second
After measurement module 18 obtains the displacement of piezoelectric element 10, processing module 15 can be according to formula δSample=δPiezoelectric element-δMoving assembly?
To the deformation quantity δ of sample to be tested 20Sample, according to formula F=- 3EI δ/l3It, can be according to formula E after obtaining the size of mechanical forceYoung
=(F/S)/(δSample/ l) obtain the Young's modulus E of sample to be tested 20Young。
Below by taking Fig. 3 and structure shown in Fig. 4 as an example, the load measurement process of small power is illustrated.
Before carrying out small power measurement, it is cantilever that suitable moving assembly 11 need to be selected according to the range of required measuring force
Beam, it is ensured that the moving range of the luminous point of the first measurement light is in the range of receiving of the first measurement module 14.
Later, make piezoelectric element 10 i.e. piezoelectric ceramics gently close to cantilever beam under an optical microscope, without making cantilever beam
Generate displacement.Then, by adjusting different voltage values, control piezoelectric ceramics reaches different displacements, and control cantilever beam reaches
To different displacements.It should be noted that needing for piezoelectric ceramics to be considered as rigid body at this time, then the displacement of piezoelectric ceramics is equal to outstanding
The displacement of arm beam then can establish the one-to-one relationship of the luminous point amount of movement of cantilever beam displacement and the first measurement light.
Sample to be tested 20 is fixed on sample stage, the multiplying power and operating distance of optical microscopy is adjusted, makes sample to be tested
20 being capable of blur-free imaging.Under an optical microscope, it keeps sample to be tested 20 parallel with cantilever beam, and is greater than the spacing of the two
Required test space D.
Later, open light source 19, light source 19 issue measurement light by the first semi-transparent semi-reflecting lens 210 be divided into the first measurement light and
First measurement light is reflexed to the first end of moving assembly 11 by the second measurement light, the first reflecting mirror 211, and the second reflecting mirror 212 will
First measurement light of the first end reflection of moving assembly 11 reflexes to the first measurement module 14.Third reflecting mirror 213 and the 4th is instead
It penetrates mirror 214 and second measurement light is reflexed into the second semi-transparent semi-reflecting lens 220, the second measurement light is divided by the second semi-transparent semi-reflecting lens 220
Third measures light and the 4th measurement light, and third measurement light is reflexed to the 5th reflecting mirror 215, and the 4th measurement light is reflexed to the
Six reflecting mirrors 216, the third measurement light of the 5th reflecting mirror 215 reflection and the 4th of the 6th reflecting mirror 216 reflection measure light
Interference forms interference light.
Later, it opens the first loading module 12 and opens first voltage source, adjust the voltage value of first voltage source, make piezoelectricity
Ceramics are mobile, wherein output displacement and the driving voltage curve graph of piezoelectric ceramics are as shown in fig. 6, the middle and upper part Fig. 6 curve represents liter
Journey is pressed through, lower curve represents pressure reduction.The displacement that piezoelectric ceramics is obtained by the second measurement module 18, so as to test sample
The spacing of product 20 and cantilever beam reaches required test space D.
Later, it opens the second loading module 13 and opens the second voltage source, and first electrode 16 and second electrode 17 are set
Between voltage value, by applying voltage to first electrode 16 and second electrode 17, by first electrode 16 and second electrode 17 it
Between electrostatic force be applied on the cantilever beam between first electrode 16 and second electrode 17, as shown in fig. 7, in electrostatic masterpiece
Under, cantilever beam can be mobile to sample to be tested 20.At this point it is possible to pass through the mechanics row of optical microphotograph sem observation sample to be tested 20 etc.
For.
After cantilever beam is mobile, the light spot position of the first measurement light of cantilever beam reflection can also be moved, the first measurement module 14
After the position amount of movement for collecting the luminous point of the first measurement light, according to the luminous point amount of movement of cantilever beam displacement and the first measurement light
One-to-one relationship obtain the displacement δ of cantilever beamMoving assembly.Post-processing module 15 can be according to formula F=- 3EI δMoving assembly/
l3Obtain the size of the electrostatic force of cantilever beam receiving.
It should be noted that having constant potential difference V and capacitor C between first electrode 16 and second electrode 17.Capacitor
C, electrostatic potential energy W, electrostatic force FEAs follows (1), (2), shown in (3) formula.ε is relative dielectric constant, ε in formula0It is normal for vacuum dielectric
Number, capacitor C, electrostatic force FEChange curve with first electrode 16 and the spacing of second electrode 17 is as shown in Figure 8,9.
Later, the second voltage source is closed, after cantilever beam is stablized, controls piezoelectric ceramics continuation by adjusting first voltage source
It is mobile so that piezoelectric ceramics drives sample to be tested 20 and overarm arm contact, but does not make the luminous point of the first measurement light mobile, i.e., not to
Cantilever beam applies mechanical force or pressure, later, continues to adjust first voltage source, sample to be tested 20 is made to apply mechanical force to cantilever beam
Or pressure, as shown in Figure 10, cantilever beam can be mobile to the direction far from sample to be tested 20.
After first measurement module 14 collects the position amount of movement of the luminous point of the first measurement light, that is, collect apply pressure it
After preceding and light spot position amount of movement later, according to the one-to-one correspondence of cantilever beam displacement and the luminous point amount of movement of the first measurement light
Relationship obtains the displacement δ of cantilever beamMoving assembly.Post-processing module 15 can be according to formula F=- 3EI δMoving assembly/l3Obtain cantilever
The size of mechanical force or pressure that joist support is received.
After second measurement module 18 collects interference light, according to the fringe number of interference light and measure light wavelength one
Half, obtain the displacement δ of piezoelectric ceramicsPiezoelectric element.The displacement δ of piezoelectric ceramicsPiezoelectric elementEqual to interference light fringe number multiplied by measurement
The half of the wavelength of light.Post-processing module 15 can be according to formula δSample=δPiezoelectric element-δMoving assemblySample to be tested 20 can be calculated
Deformation quantity δSample, according to formula EYoung=(F/S)/(δSample/ l) obtain the Young's modulus E of sample to be tested 20Young.It needs to illustrate
It is that after piezoelectric ceramics and mobile the 5th reflecting mirror 215, the optical path difference of third measurement light and the 4th measurement light can change,
The item number of interference hot spot light and shade striped can also change.
Later, first voltage source is turned off, piezoelectric ceramics reverse movement, as shown in figure 11, sample to be tested 20 and cantilever beam are de-
Attached, adhesion strength makes cantilever beam that reversed displacement occur, and the position that the first measurement module 14 collects the luminous point of the first measurement light is mobile
After amount, the displacement of cantilever beam is obtained according to the one-to-one relationship of cantilever beam displacement and the luminous point amount of movement of the first measurement light
δMoving assembly.Post-processing module 15 can be according to formula F=- 3EI δMoving assembly/l3Obtain the size of the adhesion strength of cantilever beam receiving.
The load measuring device and method of small power provided by the present invention, the first loading module send out the piezoelectric element
Raw deformation, and drive the moving assembly mobile by the mechanical force that the piezoelectric element deformation generates, the second load mould
Block applies electrostatic force to the moving assembly, and drives the moving assembly mobile by the electrostatic force, first measurement
Module measures the displacement of the moving assembly, and the processing module obtains the machinery according to the displacement of the moving assembly
The size of power and the electrostatic force, to realize the coupling measurement of mechanical load and electricity load, expand device applies model
It encloses, effective solution measures on different instruments the transfer of sample brought by electrostatic force and mechanic stress respectively, and measurement accuracy is poor
The problem of different and test point changes.Also, the load measuring device and method of small power provided in an embodiment of the present invention solve
The problem of mechanical behavior of real-time observation sample to be tested in situ, facilitates mechanics and electrical testing curve and sample to be tested
Actual motion variation connects.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment
For, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (10)
1. a kind of load measuring device of small power, which is characterized in that including piezoelectric element, moving assembly, the first loading module,
Second loading module, the first measurement module and processing module；
First loading module generates deformation for controlling the piezoelectric element, and by the deformation to the moving assembly
Apply mechanical force, drives the moving assembly mobile by the mechanical force；
Second loading module is used to apply to the moving assembly electrostatic force, and drives the movement by the electrostatic force
Component is mobile；
First measurement module is used to measure the displacement of the moving assembly；
The processing module is used to obtain the size for the power that the moving assembly is born according to the displacement of the moving assembly,
The power includes the mechanical force and the electrostatic force.
2. the apparatus according to claim 1, which is characterized in that hold one end of the piezoelectric element towards the moving assembly
It is loaded with sample to be tested, the piezoelectric element is for driving the sample to be tested mobile；
The first end of the moving assembly is located on the moving direction of the sample to be tested and has between the sample to be tested
Pre-determined distance；
The sample to be tested has first electrode towards one end of the piezoelectric element；The second end of the moving assembly fix and
The second end of the moving assembly has second electrode, and the second end is oppositely arranged with the first end；
Second loading module makes the first electrode and described by applying voltage to the first electrode and second electrode
Electrostatic force is generated between second electrode, and the electrostatic force is applied on the moving assembly；
The processing module is also used to obtain the moving assembly and the sample to be tested according to the displacement of the moving assembly
Between adhesion strength.
3. the apparatus of claim 2, which is characterized in that further include the second measurement module；
Second measurement module is used to measure the displacement of the piezoelectric element；
The processing module is also used to be obtained according to the displacement of the piezoelectric element and the displacement of the moving assembly described
The deformation quantity of sample to be tested, and the poplar of the sample to be tested is obtained according to the deformation quantity of the sample to be tested and the mechanical force
Family name's modulus.
4. device according to claim 3, which is characterized in that the load measuring device of the small power includes light source,
One semi-transparent semi-reflecting lens, the second semi-transparent semi-reflecting lens, the first reflecting mirror to the 6th reflecting mirror, the 5th reflecting mirror are located at described second
Between piezoelectric element and the sample to be tested, and it is mobile with the piezoelectric element；
The light source is for being emitted measurement light；
First semi-transparent semi-reflecting lens are used to for the measurement light being divided into the first measurement light and the second measurement light；
First reflecting mirror is used to reflex to the first measurement light the first end of the moving assembly；
The first measurement light that second reflecting mirror is used to reflect the first end of the moving assembly reflexes to described first and surveys
Measure module；
The third reflecting mirror and the 4th reflecting mirror are used to the second measurement light reflexing to second semi-transparent semi-reflecting lens；
Second semi-transparent semi-reflecting lens are used to the second measurement light being divided into third measurement light and the 4th measurement light, by described the
Three measurement light reflex to the 5th reflecting mirror, the 4th measurement light are reflexed to the 6th reflecting mirror, so that described the
The third measurement light of five reflecting mirrors reflection and the 4th measurement light of the 6th reflecting mirror reflection interfere to form interference light；
First measurement module be used for according to the first end of the moving assembly reflect first measure light displacement and
The corresponding relationship of the displacement of the displacement and moving assembly for the first measurement light being previously obtained, obtains the movement
The displacement of component；
Second measurement module is used for the wavelength of fringe number and the measurement light according to the interference light, obtains the pressure
The displacement of electrical component.
5. device according to claim 4, which is characterized in that first measurement module include beam quality analysis instrument and
First computing module；
The beam quality analysis instrument is used to measure the displacement of the first measurement light of the first end for obtaining moving assembly reflection
Amount；
First computing module be used for according to the first end of the moving assembly reflect first measure light displacement and
The corresponding relationship of the displacement of the displacement and moving assembly for the first measurement light being previously obtained, obtains the movement
The displacement of component.
6. device according to claim 4, which is characterized in that second measurement module includes photodetector and second
Computing module；
The interference light signal is converted to electric signal for detecting the interference light by the photodetector；
Second computing module is used to obtain the fringe number of the interference light according to the electric signal, and according to the fringe number
And the half of the wavelength of the measurement light, obtain the displacement of the piezoelectric element；
Alternatively, second measurement module includes photodetector and oscillograph；
The interference light signal is converted to electric signal for detecting the interference light by the photodetector；
The oscillograph is used to obtain the light intensity of the interference light according to the electric signal with the curve of voltage change, according to institute
It states curve and obtains the fringe number of the interference light, and according to the fringe number and the half of the wavelength of the measurement light, obtain
The displacement of the piezoelectric element.
7. the apparatus according to claim 1, which is characterized in that further include microscope；
The microscope is for observing the sample to be tested and the moving assembly.
8. a kind of load measurement method of small power characterized by comprising
Second loading module applies electrostatic force to the moving assembly, and drives the moving assembly to move by the electrostatic force
It is dynamic；
First measurement module measures the displacement of the moving assembly, and processing module is obtained according to the displacement of the moving assembly
The electrostatic force；
First loading module applies mechanical force to the moving assembly by the piezoelectric element, and the moving assembly is driven to move
It is dynamic；
First measurement module measures the displacement of the moving assembly, and the processing module is according to the position of the moving assembly
Shifting measures the mechanical force.
9. according to the method described in claim 8, it is characterized by further comprising:
First loading module stops working, and moves backward the moving assembly；
First measurement module measures the displacement of the moving assembly, and the processing module is according to the position of the moving assembly
Shifting measures the adhesion strength that the moving assembly is born.
10. according to the method described in claim 8, it is characterized by further comprising:
Second measurement module measures the displacement of the piezoelectric element；
The processing module obtains the piezoelectricity group according to the displacement of the piezoelectric element and the displacement of the moving assembly
The deformation quantity of the sample to be tested of part carrying, and obtained according to the deformation quantity of the sample to be tested and the mechanical force described to be measured
The Young's modulus of sample.
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