CN110142513A - Rotating mechanism and its application method, laser marking with station write method troactively and method is write in IC verification troactively - Google Patents
Rotating mechanism and its application method, laser marking with station write method troactively and method is write in IC verification troactively Download PDFInfo
- Publication number
- CN110142513A CN110142513A CN201810148188.2A CN201810148188A CN110142513A CN 110142513 A CN110142513 A CN 110142513A CN 201810148188 A CN201810148188 A CN 201810148188A CN 110142513 A CN110142513 A CN 110142513A
- Authority
- CN
- China
- Prior art keywords
- chip
- station
- verification
- laser marking
- entry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
The invention belongs to chip laser mark, visions to verify field, specifically a kind of rotating mechanism and its application method, laser marking with station writes method troactively and method is write in IC verification troactively, rotating mechanism includes rotating disc, cache slot, rotating driver and chip storage groove, rotating driver is mounted on the rack, and output end is connected with rotating disc, drives rotation disc spins;Multiple chip storage grooves are along the circumferential direction evenly arranged on rotating disc respectively and are evenly arranged with multiple for storing the cache slot for writing chip troactively, each chip storage groove and each cache slot, which are driven with rotating disc by rotating driver, to be rotated, and each chip storage groove and each cache slot recycle between entry/exit material station, laser marking station and OCR vision verification station.Transhipment and accurate positioning of the chip between each station may be implemented in the present invention, so that chip stamp and the efficiency of verification greatly improve, while may be implemented to write the chip of laser marking failure and IC verification failure troactively.
Description
Technical field
The invention belongs to chip laser mark, visions to verify field, specifically a kind of rotation with station
Mechanism and its application method, laser marking write method troactively and method is write in IC verification troactively.
Background technique
The principle of the laser marking mechanism of most semiconductor core sheet data write-in products is all roughly the same currently on the market, i.e.,
Laser marking mechanism is fixed, other mechanisms are in line with it or horizontal layout, by manipulator by chip by pallet or load
Band grabs in laser marking mechanism, and manipulator needs are removed above chip when laser marking, reserves mark space to chip;
Manipulator is moved back to again after the completion of mark, and chip is grabbed and is transported to next station.Due to manipulator arrangement, manipulator
Stroke and movement velocity influence, cause plant machinery movement complicated, overall throughput is lower, it is difficult to realize wanting for high production capacity
It asks, affects the efficiency of chip production.
Since the data of chip interior and the laser marking number on surface have stringent sequence requirement, common chip transmission
Work is all continuous;Once vision verification failure or IC verification failure, this chip can be worked as waste product jettisoning, can not be mended online
It writes, causes the number of chip discontinuous, can only individually be write troactively after the completion of production and manually put back to original chip array
In.The existing this mode that writes troactively seriously affects production efficiency, and since artificial participation causes error rate to increase significantly.
Summary of the invention
In order to improve the speed and production efficiency of equipment overall operation, and can be realized to vision verification failure chip and
The chip of IC verification failure is write troactively, the purpose of the present invention is to provide a kind of rotating mechanism with station and its is made
Method is write troactively with method, laser marking and method is write in IC verification troactively.
The purpose of the present invention is achieved through the following technical solutions:
Rotating mechanism of the invention includes rotating disc, cache slot, rotating driver and chip storage groove, wherein rotation driving
Device is mounted on the rack, and output end is connected with the rotating disc, drives the rotation disc spins;On the rotating disc along the circumferential direction
It is evenly arranged with multiple chip storage grooves respectively and is evenly arranged with multiple for storing the cache slot for writing chip troactively, each core
Piece storage groove and each cache slot, which are driven with rotating disc by rotating driver, to be rotated, each chip storage groove and each described slow
Slot is deposited to recycle between entry/exit material station, laser marking station and OCR vision verification station;
Wherein: the chip storage groove and cache slot interval are arranged, i.e., the centre of adjacent two chips storage groove is equipped with an institute
State cache slot;
The chip storage groove is identical as caching slot number, is four;
The application method of rotating mechanism of the present invention with station are as follows: specific step is as follows:
Step A, manipulator put first chip for completing write-in by IC written agency into core positioned at entry/exit material station
In piece storage groove, the rotating driver driving rotation disc spins are beaten first chip by entry/exit material station rotary to laser
Mark station starts to carry out laser marking;Simultaneously, manipulator will be completed second chip of write-in to laser marking by IC written agency
It puts into the chip storage groove of entry/exit material station;
Step B, after the completion of laser marking, the rotating driver driving rotation disc spins, by first chip by laser
Mark station rotary verifies station to OCR vision, and whether verify laser marking information by OCR correct;Meanwhile second chip
Laser marking is carried out by entry/exit material station rotary to laser marking station, also, manipulator will be completed by IC written agency
The supplied materials third of write-in chip is put into the chip storage groove of entry/exit material station;
Step C, after confirming that first chip laser mark information is correct, the rotating driver driving rotation disc spins,
First chip is rotated into entry/exit material station by OCR vision verification station again, meanwhile, second chip is by laser marking
Station rotary verifies station to OCR vision, and whether verify laser marking information by OCR correct, and third chip by enter/
Discharging station rotary starts to carry out laser marking to laser marking station;
First chip is grabbed IC verification agency station by entry/exit material station by manipulator by step D, to
One chip interior information is verified;Then, manipulator puts the 4th chip of supplied materials for completing write-in by IC written agency
Carry is recycled in the chip storage groove of entry/exit material station according to step A~step D, until all chips are completed laser and beaten
Mark, and it is correct by OCR verification laser marking information, it numbers in order to form chip array;
The laser marking of rotating mechanism application method of the present invention with station writes method troactively are as follows:
It is along the circumferential direction uniformly distributed there are four chip storage groove and uniformly distributed there are four cache slot, adjacent two cores on the rotating disc
The centre of piece storage groove is equipped with a cache slot;When the chip in OCR vision verification station is detected chip surface laser
Mark information errors or it is unqualified when, into writing process troactively, the specific steps are as follows:
The chip is set to bad chip after the chip for being located at OCR vision verification station verifies failure by step E;
Step F, the rotating driver driving rotation disc spins, the chip that will be located at the previous serial number of the bad chip turn
To entry/exit material station, and station at IC verification agency is grabbed by manipulator, then again by manipulator by IC written agency
The next chip to number in order for completing write-in is put into the chip storage groove at entry/exit material station;The IC writing machine
Structure suspends the write-in of subsequent number chip, writes a chip identical with the bad chip serial number again;
The bad chip is gone to entry/exit material station, passes through machine by step G, the rotating driver driving rotation disc spins
Tool hand crawls out bad chip and jettisoning, at the same by the same serial number chip for re-writing completion pass through again manipulator put into/
In chip storage groove at discharging station;
The same serial number chip for re-writing completion is gone to laser by step H, the rotating driver driving rotation disc spins
Mark station carries out laser marking;
Step I, after the completion of laser marking, the rotating driver driving rotation disc spins are completed laser marking same
Serial number chip goes to OCR vision verification station and is verified, if verified successfully, return to normal production process again, described
IC written agency starts that subsequent chip is written, meanwhile, rotating disc restores normal rotary work, completes to re-writing
The later each chip of same serial number chip successively carry out laser marking and vision verification;
Method is write in the IC verification of rotating mechanism application method of the present invention with station troactively are as follows:
It is along the circumferential direction uniformly distributed there are four chip storage groove and uniformly distributed there are four cache slot, adjacent two cores on the rotating disc
The centre of piece storage groove is equipped with a cache slot;When the chip of the station locating for the IC verification agency verifies failure, need pair
The chip of this number re-starts IC write-in, laser marking, vision checking procedure, and the chip mended is reentered into the IC
Station locating for verification agency is verified, and verification is further continued for carrying out after passing through;All chips of the period after current number chip
Stop entering verification station locating for IC verification agency, just be needed at this time using four cache slots on rotating disc;Specific step
It is rapid as follows:
Step J, the chip of the station locating for the IC verification agency, by the IC verification agency to Data within the chip
It is verified, the subsequent chip on the rotating disc in four chip storage grooves successively waits discharging at this time;In IC collator
The chip of station locating for structure verifies failure, which is set to bad chip;
Step K, 45 degree of disc spins of rotation of the rotating driver driving, by the cache slot nearest apart from entry/exit material station
Entry/exit material station is gone to, the chip to number in order that the IC written agency completes write-in is put into entry/exit by manipulator
Expect in the cache slot at station, while the chip of verification failure being dished out from station from the IC verification agency, the IC write-in
Mechanism suspends write-in to subsequent number chip, writes a chip identical with the bad chip serial number again;
Step L, after the completion of the same serial number chip for re-starting IC write-in, the rotating disc is rotated by 90 °, will be next
Cache slot goes to entry/exit material station, will re-write the same serial number chip of completion from station from IC written agency by manipulator
It takes out, puts into the cache slot at entry/exit material station;
Step M, the rotating driver driving rotation disc spins will successively be gone at laser marking station with serial number chip
Station carry out laser marking, go to OCR vision verification station at station carry out printout surface information checking, finally go to again into
Station at entry/exit material station;
Step N will be taken out from station from entry/exit material station with serial number chip by manipulator, and be put into the IC collator
Station re-starts verification at structure, and after verification passes through, then return to normal production process again, and the chip on rotating disc successively carries out
Laser marking and the verification of OCR vision, the IC written agency start that subsequent chip is written.
Advantages of the present invention and good effect are as follows:
1. the configuration of the present invention is simple, improves the speed and production efficiency of equipment overall operation, and can be realized to vision
The chip of the chip and IC verification failure that verify failure is write troactively.
2. chip may be implemented between rotating disc pan feeding-laser marking-OCR vision verify-discharges each station in the present invention
Transhipment and accurate positioning so that chip marking and the efficiency of verification greatly improve;Four cache slots are set on rotating disc simultaneously,
It may be implemented to write the chip of laser marking failure and IC verification failure troactively.
Detailed description of the invention
Figure 1A is the structural front view of rotating mechanism of the present invention;
Figure 1B is the structure top view of rotating mechanism of the present invention;
Fig. 2A is one of the working state figure of rotating mechanism of the present invention;
Fig. 2 B is the two of the working state figure of rotating mechanism of the present invention;
Fig. 2 C is the three of the working state figure of rotating mechanism of the present invention;
Fig. 2 D is the four of the working state figure of rotating mechanism of the present invention;
Fig. 2 E is the five of the working state figure of rotating mechanism of the present invention;
Fig. 3 A is one of the working state figure that rotating mechanism laser marking of the present invention writes troactively;
Fig. 3 B is the two of the working state figure that rotating mechanism laser marking of the present invention writes troactively;
Fig. 3 C is the three of the working state figure that rotating mechanism laser marking of the present invention writes troactively;
Fig. 3 D is the four of the working state figure that rotating mechanism laser marking of the present invention writes troactively;
Fig. 3 E is the five of the working state figure that rotating mechanism laser marking of the present invention writes troactively;
Fig. 4 A is that rotating mechanism IC of the present invention verifies one of the working state figure write troactively;
Fig. 4 B is the two of the working state figure that rotating mechanism IC of the present invention verification is write troactively;
Fig. 4 C is the three of the working state figure that rotating mechanism IC of the present invention verification is write troactively;
Fig. 4 D is the four of the working state figure that rotating mechanism IC of the present invention verification is write troactively;
Fig. 4 E is the five of the working state figure that rotating mechanism IC of the present invention verification is write troactively;
Wherein: 1 is rotating disc, and 2 be cache slot, and 3 be rotating driver, and 4 be chip storage groove, and A is entry/exit material station, B
For laser marking station, C is that OCR vision verifies station, and D is IC written agency, and E is IC verification agency, and F is reserved station.
Specific embodiment
The invention will be further described with reference to the accompanying drawing.
As shown in Figure 1A, Figure 1B, rotating mechanism front end of the invention is connect with IC written agency D, rear end and IC collator
Structure E connection, including rotating disc 1, cache slot 2, rotating driver 3 and chip storage groove 4, wherein rotating driver 3 is mounted on machine
On frame, output end is connected with rotating disc 1, the rotating disc 1 is driven to rotate.It is along the circumferential direction evenly arranged with respectively on rotating disc 1
It multiple chip storage grooves 4 and is evenly arranged with and multiple writes the cache slots 2 of chip, each chip storage groove 4 troactively for storage when writing troactively
It is driven and is rotated by rotating driver 3 with rotating disc 1 with each cache slot 2, each chip storage groove 4 and each cache slot 2 are in entry/exit material work
It is recycled between position A, laser marking station B and OCR (optical character identification) vision verification station C.
IC written agency D and IC verification agency E of the invention is the prior art, and details are not described herein.
The application method of rotating mechanism of the present invention with station, specific step is as follows for normal workflow:
Step A, manipulator put first chip for completing write-in by IC written agency D positioned at entry/exit material station A's into
In chip storage groove 4, rotating driver 3 drives rotating disc 1 to rotate, and first chip is rotated to laser by entry/exit material station A
Mark station B starts to carry out laser marking;Simultaneously, manipulator will be completed the supplied materials the of write-in to laser marking by IC written agency D
Two chips are put into the chip storage groove 4 of entry/exit material station A;
Step B, after the completion of laser marking, rotating driver 3 drives rotating disc 1 to rotate, and first chip is beaten by laser
Mark station B rotates to OCR vision verification station C, and whether verify laser marking information by OCR correct;Meanwhile second chip
Laser marking is carried out rotating to laser marking station B by entry/exit material station A, also, manipulator will be by IC written agency D
The supplied materials third chip for completing write-in is put into the chip storage groove 4 of entry/exit material station A;
Step C, after confirming that first chip laser mark information is correct, rotating driver 3 drives rotating disc 1 to rotate, will
First chip rotates to entry/exit material station A by OCR vision verification station C again, meanwhile, second chip is by laser marking
Station B rotates to OCR vision verification station C, and whether verify laser marking information by OCR correct, and third chip by
Entry/exit material station A rotates to laser marking station B and starts to carry out laser marking;
First chip is grabbed IC verification agency E station by entry/exit material station A by manipulator by step D, right
First chip interior information is verified;Then, manipulator will be completed the 4th chip of supplied materials of write-in by IC written agency D
It puts into the chip storage groove 4 of entry/exit material station A;
After confirming that second chip laser mark information is correct, rotating disc 1 is driven to rotate again by rotating driver 3,
Second chip is rotated into entry/exit material station A by OCR vision verification station C again, meanwhile, third chip is beaten by laser
Whether mark station B rotates to OCR vision verification station C, correct by OCR verification laser marking information, and the 4th chip
Laser marking is carried out rotating to laser marking station B by entry/exit material station A;
Second chip is grabbed into IC verification agency E station by entry/exit material station A by manipulator, to second
Chip interior information is verified;Meanwhile manipulator puts the 5th chip of supplied materials for completing write-in by IC written agency D into position
In in the chip storage groove 4 of entry/exit material station A;
According to above-mentioned circulation, until all chips complete laser marking, and correct by OCR verification laser marking information,
It numbers in order to form chip array.
The chip storage groove 4 of rotating mechanism of the present invention is identical as 2 quantity of cache slot, the chip storage groove 4 of the present embodiment and
Cache slot 2 is four;That is, eight stations are shared on the rotating disc 1 of rotating mechanism of the present invention, wherein four are chip storage groove
4 (one of them is reserved station F), for storing chip during normal production, four additional is cache slot 2, when for writing troactively
Chip when storage is write troactively.Chip storage groove 4 and the interval of cache slot 2 are arranged, i.e., the centre of adjacent two chips storage groove 4 is equipped with one
Cache slot 2.
In Fig. 2A~2E, Fig. 3 A~3E and Fig. 4 A~4E, 1.~represent number 10. as 1~10 chip, numerically band is oblique
The bad chip that the representative of line needs to write troactively again.
By taking four chip storage grooves 4 and four cache slots 2 as an example, as shown in Fig. 2A~2E, manipulator by finished chip 2.
Next station (i.e. station locating for IC verification agency E) is grabbed from entry/exit material station A, while 6. the chip of supplied materials chip being put
Into/discharging station A at chip storage groove 4 in;Then, rotating driver 3 rotates clockwise 90 degree clockwise, 6. by chip
Since entry/exit material station A rotate to laser marking station B, carry out laser marking;Meanwhile 4. chip verifies work by OCR vision
Position C rotate to reserved station F, complete laser marking chip 5. by laser marking station B rotate to OCR vision verification station C,
It is whether correct that laser marking information is verified by OCR;After the completion of laser marking, rotating driver 3 rotates clockwise 90 degree, by core
6. piece rotates to OCR vision verification station C from laser marking station B, whether verify laser marking information by OCR correct;Together
When, 4. chip rotates to entry/exit material station A by reserved station F, 4. manipulator grabs finished chip from entry/exit material station A
Next station (i.e. station locating for IC verification agency E), 8. chip that the chip of supplied materials chip is put at entry/exit material station A is deposited
It puts in slot 4,5. chip rotates to reserved station F by OCR vision verification station C;After confirming that chip laser mark information is correct, rotation
Turn driver 3 and rotate clockwise (every time 90 degree) twice, 6. chip is rotated into entry/exit material from OCR vision verification station C again
Station A catches station locating for the subsequent IC verification agency E of rotating disc 1 by manipulator, verifies to chip interior information,
Complete entire working cycles.
Laser marking of the invention writes method troactively are as follows:
When the chip in OCR vision verification station C station is detected chip surface laser marking information errors or not
When qualified, into writing process troactively, the specific steps are as follows:
The chip is set to bad core after 4. the chip for being located at OCR vision verification station C station verifies failure by step E
Piece, as shown in Figure 3A;
Step F, rotating driver 3 drive rotating disc 1 to rotate clockwise 90 degree, 3. the chip before being located at bad chip 4. is turned
Station at IC verification agency E is grabbed to entry/exit material station A, and by manipulator, while by manipulator by IC written agency
7. the chip to number in order that D completes write-in is put into the chip storage groove 4 at entry/exit material station A;IC written agency D is temporary
Stop the write-in of subsequent number chip, writes one and the bad chip 4. identical chip of serial number again, as shown in Figure 3B;
Step G, rotating driver 3 drive rotating disc 1 to rotate clockwise 90 degree, 4. bad chip are gone to entry/exit material station
Bad chip is crawled out simultaneously jettisoning by manipulator, while 4. the same serial number chip for re-writing completion is passed through machinery again by A
Hand is put into the chip storage groove 4 at entry/exit material station A, as shown in Figure 3 C;
Step H, rotating driver 3 drive rotating disc 1 to continue to rotate clockwise 90 degree, will re-write the same serial number of completion
4. chip goes to laser marking station B and carries out laser marking, as shown in Figure 3D;
Step I, after the completion of laser marking, rotating driver 3 drives rotating disc 1 to rotate clockwise 90 degree, by laser marking
4. the same serial number chip completed goes to OCR vision verification station C and is verified, if verified successfully, restore normal raw again
Process is produced, IC written agency D starts that subsequent chip is written, meanwhile, rotating disc 1 restores normal rotary work, counterweight
4. later each chip successively carries out laser marking and vision verification to the same serial number chip that new write-in is completed, as shown in FIGURE 3 E.
Method is write in IC verification of the invention troactively are as follows:
When the chip for being in station locating for IC verification agency E verifies failure, the chip to this number is needed to re-start
A series of processes such as IC write-in, laser marking, vision verification, and the chip mended is reentered into work locating for IC verification agency E
Position is verified, and verification is further continued for normally being produced after passing through;All chips of the period after current number chip stop
Into verification station locating for IC verification agency E, just needed at this time using four cache slots 2 on rotating disc 1;Specific steps are such as
Under:
Step J, the chip of the station locating for the IC verification agency E 2., by IC verification agency E to Data within the chip
Verified, at this time the subsequent chip on rotating disc 1 in four chip storage grooves 4 (i.e. chip 3., chip 4., chip 5., chip
6.) successively wait discharging;2. the chip of the station locating for the IC verification agency E verifies failure, 2. which is set to bad chip,
Process is write in enlightenment troactively simultaneously, as shown in Figure 4 A;
Step K, rotating driver 3 drive rotating disc 1 to rotate clockwise 45 degree, will be apart from nearest slow of entry/exit material station A
It deposits slot 2 and goes to entry/exit material station A, 7. the IC written agency D chip to number in order for completing write-in is put by manipulator
In cache slot 2 at entry/exit material station A, while the chip of verification failure being dished out from station from IC verification agency E, IC write-in
To chip, 7. later subsequent number chip is written for mechanism D pause, writes a chip identical with bad chip serial number again
2. as shown in Figure 4 B;
Step L, when re-start IC write-in same serial number chip 2. after the completion of, rotating disc 1 rotates clockwise 90 degree, will under
One cache slot 2 goes to entry/exit material station A, will re-write the same serial number chip of completion 2. from IC writing machine by manipulator
Station takes out at structure D, puts into the cache slot 2 at entry/exit material station A, as shown in Figure 4 C;
Step M, rotating driver 3 drive rotating disc 1 to rotate, laser marking station B 2. will be successively gone to serial number chip
Place's station carries out laser marking, goes to station progress printout surface information checking at OCR vision verification station C, finally goes to again
Into/discharging station A at station, as shown in Figure 4 D;
2. step N will be taken out from station from entry/exit material station A with serial number chip by manipulator, and be put into IC verification agency
Station re-starts verification at E, and after verification passes through, then return to normal production process again, and the chip on rotating disc 1 successively carries out
Laser marking and the verification of OCR vision, IC written agency D start that subsequent chip is written, as shown in Figure 4 E.
Claims (6)
1. a kind of rotating mechanism with station, it is characterised in that: including rotating disc (1), cache slot (2), rotation driving
Device (3) and chip storage groove (4), wherein rotating driver (3) is mounted on the rack, output end is connected with the rotating disc (1),
The rotating disc (1) is driven to rotate;Multiple chip storage grooves (4) are along the circumferential direction evenly arranged on the rotating disc (1) respectively
And it is evenly arranged with multiple for storing the cache slot (2) for writing chip troactively, each chip storage groove (4) and each cache slot
(2) it is driven and is rotated by rotating driver (3) with rotating disc (1), each chip storage groove (4) and each cache slot (2) exist
It is recycled between entry/exit material station (A), laser marking station (B) and OCR vision verification station (C).
2. according to claim 1 have station rotating mechanism, it is characterised in that: the chip storage groove (4) with
The centre of the setting of cache slot (2) interval, i.e., adjacent two chips storage groove (4) is equipped with a cache slot (2).
3. according to claim 1 have station rotating mechanism, it is characterised in that: the chip storage groove (4) with
Cache slot (2) quantity is identical, is four.
4. a kind of application method of the rotating mechanism described in claims 1 to 3 any claim with station, feature
Be: specific step is as follows:
Step A, manipulator will be put by first chip that IC written agency (D) completes write-in positioned at entry/exit material station (A)
In chip storage groove (4), rotating driver (3) driving rotating disc (1) rotation, by first chip by entry/exit material station
(A) laser marking station (B) is rotated to start to carry out laser marking;Simultaneously, manipulator will be by IC written agency (D) for laser marking
Second chip for completing write-in is put into the chip storage groove (4) of entry/exit material station (A);
Step B, after the completion of laser marking, rotating driver (3) driving rotating disc (1) rotation, by first chip by swashing
Light mark station (B) rotates to OCR vision verification station (C), and whether verify laser marking information by OCR correct;Meanwhile the
Two chips carry out laser marking rotating to laser marking station (B) by entry/exit material station (A), also, manipulator will be by
The supplied materials third chip that IC written agency (D) completes write-in is put into the chip storage groove (4) of entry/exit material station (A);
Step C, after confirming that first chip laser mark information is correct, rotating driver (3) driving rotating disc (1) rotation
Turn, by first chip by OCR vision verification station (C) rotate to entry/exit material station (A) again, meanwhile, second chip by
Whether laser marking station (B) rotates to OCR vision verification station (C), correct by OCR verification laser marking information, and
Third chip carries out laser marking rotating to laser marking station (B) by entry/exit material station (A);
First chip is grabbed IC verification agency (E) station by entry/exit material station (A) by manipulator by step D, right
First chip interior information is verified;Then, manipulator will be completed the 4th Zhang Xin of supplied materials of write-in by IC written agency (D)
Piece is put into the chip storage groove (4) of entry/exit material station (A), is recycled according to step A~step D, until all chips are complete
At laser marking, and it is correct by OCR verification laser marking information, it numbers in order to form chip array.
5. a kind of laser marking of the rotating mechanism application method described in claim 4 with station writes method troactively, special
Sign is: it is along the circumferential direction evenly distributed on the rotating disc (1) there are four chip storage groove (4) and is evenly distributed with there are four cache slot (2),
The centre of adjacent two chips storage groove (4) is equipped with a cache slot (2);When the chip in OCR vision verification station (C) is tested
Measure chip surface laser marking information errors or it is unqualified when, into writing process troactively, the specific steps are as follows:
The chip is set to bad chip after the chip for being located at OCR vision verification station (C) verifies failure by step E;
Step F, rotating driver (3) driving rotating disc (1) rotation will be located at the chip of the previous serial number of the bad chip
Entry/exit material station (A) is gone to, and station at IC verification agency (E) is grabbed by manipulator, then passes through manipulator again for IC
Next chip to number in order that written agency (D) completes write-in puts the chip storage groove at entry/exit material station (A) into
(4) in;The write-in of the IC written agency (D) pause subsequent number chip, write again one it is identical as the bad chip serial number
Chip;
The bad chip is gone to entry/exit material station (A) by step G, rotating driver (3) driving rotating disc (1) rotation,
Bad chip is crawled out into simultaneously jettisoning by manipulator, while the same serial number chip for re-writing completion being put by manipulator again
Into/discharging station
(A) in the chip storage groove (4) at;
Step H, rotating driver (3) driving rotating disc (1) rotation go to the same serial number chip for re-writing completion sharp
Light mark station (B) carries out laser marking;
Step I, after the completion of laser marking, laser marking is completed in rotating driver (3) driving rotating disc (1) rotation
OCR vision verification station (C) is gone to serial number chip to be verified, if verified successfully, return to normal production process again,
The IC written agency (D) starts that subsequent chip is written, meanwhile, rotating disc (1) restores normal rotary work, counterweight
The later each chip of the same serial number chip that new write-in is completed successively carries out laser marking and vision verification.
6. method, feature are write in a kind of IC verification of the rotating mechanism application method described in claim 4 with station troactively
It is: along the circumferential direction uniformly distributed there are four chip storage groove (4) and uniformly distributed there are four cache slot (2), phases on the rotating disc (1)
The centre of adjacent two chip storage grooves (4) is equipped with a cache slot (2);When the chip school for being in station locating for IC verification agency (E)
When testing unsuccessfully, the chip to this number is needed to re-start IC write-in, laser marking, vision checking procedure, and the core that will be mended
Piece is reentered into station locating for the IC verification agency (E) and is verified, and verification is further continued for carrying out after passing through;Period compiles currently
All chips after number chip stop entering verification station locating for IC verification agency (E), just need using rotating disc at this time
(1) four cache slots (2) on;Specific step is as follows:
Step J is in the chip of station locating for the IC verification agency (E), by the IC verification agency (E) to chip interior number
According to being verified, the subsequent chip in the upper four chip storage grooves (4) of the rotating disc (1) successively waits discharging at this time;It is in
The chip of station locating for IC verification agency (E) verifies failure, which is set to bad chip;
Step K, rotating driver (3) driving rotating disc (1) rotate 45 degree, will be apart from entry/exit material station (A) delaying recently
It deposits slot (2) and goes to entry/exit material station (A), the chip to number in order that the IC written agency (D) completes write-in is passed through into machine
Tool hand is put into the cache slot (2) at entry/exit material station (A), while by the chip of verification failure from the IC verification agency (E)
Place's station is dished out, and the IC written agency (D) suspends the write-in to subsequent number chip, writes one and the bad chip sequence again
Number identical chip;
Step L, after the completion of the same serial number chip for re-starting IC write-in, the rotating disc (1) is rotated by 90 °, will be next slow
It deposits slot (2) and goes to entry/exit material station (A), the same serial number chip of completion will be re-write from IC written agency (D) by manipulator
Locate station to take out, put into the cache slot (2) at entry/exit material station (A);
Step M, rotating driver (3) driving rotating disc (1) rotation will successively go to laser marking station with serial number chip
(B) station carries out laser marking, goes to station progress printout surface information checking at OCR vision verification station (C) at, finally again
Go to station at entrance/discharging station (A);
Step N will be taken out from station at entry/exit material station (A) with serial number chip by manipulator, and be put into the IC verification agency
(E) station re-starts verification at, and after verification passes through, then return to normal production process again, and the chip on rotating disc (1) is successively
Laser marking and the verification of OCR vision are carried out, the IC written agency (D) starts that subsequent chip is written.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810148188.2A CN110142513A (en) | 2018-02-13 | 2018-02-13 | Rotating mechanism and its application method, laser marking with station write method troactively and method is write in IC verification troactively |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810148188.2A CN110142513A (en) | 2018-02-13 | 2018-02-13 | Rotating mechanism and its application method, laser marking with station write method troactively and method is write in IC verification troactively |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110142513A true CN110142513A (en) | 2019-08-20 |
Family
ID=67589204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810148188.2A Pending CN110142513A (en) | 2018-02-13 | 2018-02-13 | Rotating mechanism and its application method, laser marking with station write method troactively and method is write in IC verification troactively |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110142513A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114091633A (en) * | 2021-11-08 | 2022-02-25 | 武汉天喻信息产业股份有限公司 | Manufacturing method and device applied to special-shaped card |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07121466B2 (en) * | 1988-11-29 | 1995-12-25 | 日本電気株式会社 | Laser trimming device |
KR20090067392A (en) * | 2007-12-21 | 2009-06-25 | 삼성중공업 주식회사 | Point connection laser marking device |
CN202508296U (en) * | 2012-02-22 | 2012-10-31 | 格兰达技术(深圳)有限公司 | Station system disk device of rotary testing marking braider of IC (integrated circuit) material block |
CN202934240U (en) * | 2012-10-31 | 2013-05-15 | 深圳市大族激光科技股份有限公司 | Laser marking system |
CN104741795A (en) * | 2015-03-31 | 2015-07-01 | 武汉先河激光技术有限公司 | Efficient laser etching device for small OGS |
CN204954173U (en) * | 2015-09-25 | 2016-01-13 | 苏州赛嘉激光科技有限公司 | High -efficient laser marking machine |
CN106156817A (en) * | 2016-07-12 | 2016-11-23 | 沈阳友联电子装备有限公司 | The write of a kind of IC-card data and the Apparatus for () and method therefor of laser marking |
CN205834556U (en) * | 2016-07-04 | 2016-12-28 | 彭歆雅 | Laser marking machine rotary disk working table |
CN205989123U (en) * | 2016-08-24 | 2017-03-01 | 广州码清机电有限公司 | A kind of laser marking system of multistation |
CN206425694U (en) * | 2017-01-11 | 2017-08-22 | 春兴精工(常熟)有限公司 | A kind of swinging multi-station laser marking device |
-
2018
- 2018-02-13 CN CN201810148188.2A patent/CN110142513A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07121466B2 (en) * | 1988-11-29 | 1995-12-25 | 日本電気株式会社 | Laser trimming device |
KR20090067392A (en) * | 2007-12-21 | 2009-06-25 | 삼성중공업 주식회사 | Point connection laser marking device |
CN202508296U (en) * | 2012-02-22 | 2012-10-31 | 格兰达技术(深圳)有限公司 | Station system disk device of rotary testing marking braider of IC (integrated circuit) material block |
CN202934240U (en) * | 2012-10-31 | 2013-05-15 | 深圳市大族激光科技股份有限公司 | Laser marking system |
CN104741795A (en) * | 2015-03-31 | 2015-07-01 | 武汉先河激光技术有限公司 | Efficient laser etching device for small OGS |
CN204954173U (en) * | 2015-09-25 | 2016-01-13 | 苏州赛嘉激光科技有限公司 | High -efficient laser marking machine |
CN205834556U (en) * | 2016-07-04 | 2016-12-28 | 彭歆雅 | Laser marking machine rotary disk working table |
CN106156817A (en) * | 2016-07-12 | 2016-11-23 | 沈阳友联电子装备有限公司 | The write of a kind of IC-card data and the Apparatus for () and method therefor of laser marking |
CN205989123U (en) * | 2016-08-24 | 2017-03-01 | 广州码清机电有限公司 | A kind of laser marking system of multistation |
CN206425694U (en) * | 2017-01-11 | 2017-08-22 | 春兴精工(常熟)有限公司 | A kind of swinging multi-station laser marking device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114091633A (en) * | 2021-11-08 | 2022-02-25 | 武汉天喻信息产业股份有限公司 | Manufacturing method and device applied to special-shaped card |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3583561A (en) | Die sorting system | |
US3785507A (en) | Die sorting system | |
DE69308804T2 (en) | Test procedure for elements of integrated circuits and associated integrated element | |
DE3519986C2 (en) | ||
CN100578733C (en) | Substrate processing apparatus | |
CN101672800B (en) | Detection system and detection method for chips in carrier tray | |
CN101517703B (en) | Coating/developing apparatus, coating/developing apparatus control method | |
CN109676280A (en) | Auto-body manufacturing generalization system and Auto-body manufacturing generalization intelligent plant system | |
EP3846964B1 (en) | Machining system for machining spectacle lenses | |
US3695414A (en) | Die sorting system | |
US20170348857A1 (en) | Methods and systems for kitting parts for manufacturing processes | |
DE19616809A1 (en) | Test manipulator with rotating table for testing integrated circuits | |
CN108573899A (en) | Semiconductor manufacturing device and control method thereof | |
CN110142513A (en) | Rotating mechanism and its application method, laser marking with station write method troactively and method is write in IC verification troactively | |
CN105242161B (en) | A kind of electronic components test system with pin | |
CN209598437U (en) | Full-automatic double position laser index carving device | |
US3847284A (en) | Magnetic tape die sorting system | |
CN107745123A (en) | A kind of 3D printing system and method imitated towards equipment part | |
DE102011112214B4 (en) | Method and device for sorting identification objects | |
EP3847416B1 (en) | Apparatus for lens processing | |
CN112276508A (en) | Memory card assembling equipment and assembling method | |
CN208894657U (en) | A kind of full-automatic aerosol agent aluminium pot weighing leak test plant | |
US3702923A (en) | Die sorting system | |
CN109284641B (en) | Smart card tower type chip writing device | |
CN109092706A (en) | A kind of full-automatic aerosol agent aluminium pot weighing leak test plant |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190820 |
|
WD01 | Invention patent application deemed withdrawn after publication |