CN110137224A - Display screen and display equipment - Google Patents
Display screen and display equipment Download PDFInfo
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- CN110137224A CN110137224A CN201910357862.2A CN201910357862A CN110137224A CN 110137224 A CN110137224 A CN 110137224A CN 201910357862 A CN201910357862 A CN 201910357862A CN 110137224 A CN110137224 A CN 110137224A
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- conducting wire
- insulating layer
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- Microelectronics & Electronic Packaging (AREA)
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- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
The invention discloses a kind of display screens and display equipment, wherein the display screen, comprising: substrate, the cabling area including viewing area and on the outside of viewing area are provided with conducting wire in the cabling area；Insulating layer in the cabling area, the insulating layer cover the conducting wire.Insulating layer is provided in above-mentioned display screen in cabling area, insulating layer covers conducting wire, avoids the short circuit of adjacent lines caused by subtle in the production process particle or impurity are fallen between lead, improves the production yield of display screen, increase the reliability of display screen.
Description
Technical field
The present invention relates to field of display technology, and in particular to a kind of display screen and display equipment.
Background technique
Narrow frame design on electronical display product substantially instead of the frame design of conventional size, for small size
It dresses for class OLED product, the design of narrow frame, ultra-narrow frame, technological ability and product reliability is required higher.
Summary of the invention
Based on this, the present invention provides a kind of higher display screen of reliability and display equipment.
According in a first aspect, the embodiment of the invention provides a kind of display screens, comprising:
Substrate, the cabling area including viewing area and on the outside of viewing area are provided with conducting wire in the cabling area；It is in
Insulating layer in the cabling area, the insulating layer cover the conducting wire.
The insulating layer part covers the conducting wire in one of the embodiments, by the insulating layer in the conducting wire
The conducting wire of covering forms capped conducting wire.Insulating layer part covers conducting wire, and the conducting wire of exposing can increase substrate and subsequent preparation
The adhesion strength between packaging plastic in the process, and then increase the adhesion strength of substrate with the encapsulation cover plate being set on packaging plastic, make
The two is not susceptible to separate, and improves the reliability of display screen, extends the service life of display screen.
The conducting wire not covered in one of the embodiments, by the insulating layer constitutes exposure conducting wire, the exposed conducting wire
It is not adjacent to each other.The conducting wire not covered by insulating layer is not adjacent to each other, i.e., the conducting wire adjacent with conducting wire is exposed is covered by insulating layer,
Can be both effectively ensured between the conducting wire of exposing and adjacent wires in this way will not draw since subtle particle or impurity etc. are fallen in
Cause short circuit between line, but can exposing conducting wire as much as possible, increase adhesion strength.
The exposed conducting wire is by the covering conductor spacing at multiple conducting wire groups in one of the embodiments,；Along from institute
Viewing area is stated to the direction in the cabling area, the quantity of the conducting wire in conducting wire group gradually decreases.Cabling area is located at outside, from display
The conducting wire exposed in the cabling area of Qu Yueyuan is more, increases contact.
Outermost conducting wire of the routing region far from the substrate side is that exposure is led in one of the embodiments,
Line.Insulating layer is not covered on the outermost conducting wire in cabling area, to increase contact area, improves adhesion strength.
The insulating layer all covers the conducting wire in one of the embodiments,.All covering conducting wire can be as far as possible
Conducting wire mostly is protected, line short caused by subtle particle or impurity etc. can be avoided completely.
The covering conducting wire is equipped with the exposed hole for exposing the conducting wire in one of the embodiments,.Guaranteeing not draw
The part conducting wire exposed in the case where playing short circuit, forms encapsulation cover plate, substrate and encapsulation in subsequent preparation process on substrate
It is bonded between cover board by packaging plastic, the adhesion strength between packaging plastic and metal layer is greater than between adhesive layer and insulating layer
Adhesion strength.
The exposed hole on the adjacent conducting wire is in and is dislocatedly distributed in one of the embodiments,.Dislocation is arranged sudden and violent
Reveal hole, even if the biggish particle of partial size or impurity are fallen on substrate, short circuit between route will not be caused, be effectively ensured reliable
Property.
The insulating layer covers the cabling area in one of the embodiments,.The insulating layer for covering entire cabling area, makes
It obtains insulating layer conducting wire had not only been completely covered but also the spacing between conducting wire is completely covered, can further avoid subtle in the production process
Short circuit between adjacent lines caused by particle or impurity are fallen between the conductors；Also, the insulating layer for covering entire cabling area exists
It is simpler in preparation process, convenient, controllability is high.
Have on the insulating layer in one of the embodiments, and is connected to the conducting wire away from one side surface of substrate
Exposed hole.Exposed hole runs through insulating layer, so that exposing with conducting wire corresponding to exposure hole site, is guaranteeing not causing short circuit
In the case of the part conducting wire that exposes, encapsulation cover plate is formed on substrate in subsequent preparation process, between substrate and encapsulation cover plate
It being bonded by packaging plastic, the adhesion strength between packaging plastic and metal layer is greater than the adhesion strength between adhesive layer and insulating layer,
Therefore the metal layer exposed can increase the adhesion strength of substrate and packaging plastic, and then the encapsulation for increasing substrate and being set on packaging plastic
The adhesion strength of cover board makes the two be not susceptible to separate, improves the reliability of display screen, extend the service life of display screen.
The orthographic projection of the exposed hole on the substrate is only with a conducting wire in institute in one of the embodiments,
The orthographic projection stated on substrate is at least partly overlapped.Exposed hole opening only exposes a conducting wire, so that exposed hole is arranged at one
On the corresponding insulating layer of conducting wire, the short circuit between conducting wire will not be caused particle or impurity fall in the opening of exposed hole.
The orthographic projection of the exposed hole on the substrate is in the conducting wire in the substrate in one of the embodiments,
On orthographic projection in.When the line width of conducting wire is larger, exposed hole is set on the corresponding insulating layer of conducting wire, so that preparation process
It is simpler.
The orthographic projection of the exposed hole on the substrate is across the conducting wire in the base in one of the embodiments,
Orthographic projection on plate；Especially when the line width of conducting wire is smaller, setting being capable of increase exposed hole size as much as possible in this way.
The cabling area is set to the outside of the viewing area in one of the embodiments, so that being arranged in cabling area
On conducting wire be not necessarily to cross over viewing area, can directly be connect with controller, connection type is simpler, and placement-and-routing is more just
It is prompt.
The substrate further includes safety zone in one of the embodiments, is set to the viewing area and the cabling area
Between, safety zone can effective protection viewing area.
In one of the embodiments, further include: adhesive layer is located on the insulating layer；Encapsulation cover plate is located at the envelope
On glue-line.Viewing area is encapsulated in a confined space by adhesive layer, encapsulation cover plate and substrate, can effectively be obstructed water oxygen and be invaded
The light emitting structure in viewing area is lost, the service life of light emitting structure is extended.
According to second aspect, the embodiment of the invention provides a kind of display equipment, including as appointed in first aspect present invention
Display screen described in one.
Technical solution of the present invention has the advantages that
Display screen provided in an embodiment of the present invention, comprising: substrate, the cabling including viewing area and on the outside of viewing area
Area is provided with conducting wire in the cabling area；Insulating layer in the cabling area, the insulating layer cover the conducting wire.On
State and be provided with insulating layer in display screen in cabling area, insulating layer covers conducting wire, avoid subtle in the production process particle or
The short circuit of adjacent lines caused by person's impurity is fallen between the conductors, improves the production yield of display screen, and increase display screen can
By property.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the schematic diagram of a specific example of display screen in the embodiment of the present invention；
Fig. 2 is the schematic diagram of another specific example of display screen in the embodiment of the present invention；
Fig. 3 is the schematic diagram of another specific example of display screen in the embodiment of the present invention；
Fig. 4 is the schematic diagram of another specific example of display screen in the embodiment of the present invention；
Fig. 5 is the schematic diagram of another specific example of display screen in the embodiment of the present invention；
Fig. 6 is the schematic diagram of another specific example of display screen in the embodiment of the present invention；
Fig. 7 is the schematic diagram of another specific example of display screen in the embodiment of the present invention；
Fig. 8 is the schematic diagram of another specific example of display screen in the embodiment of the present invention；
Fig. 9 is the schematic diagram of another specific example of display screen in the embodiment of the present invention；
Figure 10 is the schematic diagram of another specific example of display screen in the embodiment of the present invention；
Figure 11 is the schematic diagram of another specific example of display screen in the embodiment of the present invention；
Figure 12 is the schematic diagram of another specific example of display screen in the embodiment of the present invention；
Figure 13 is the schematic diagram of another specific example of display screen in the embodiment of the present invention；
Figure 14 is the schematic diagram of another specific example of display screen in the embodiment of the present invention；
Figure 15 is the schematic diagram that a specific example of equipment is shown in the embodiment of the present invention.
Appended drawing reference:
1, substrate；11, viewing area；12, cabling area；13, safety zone；2, conducting wire；21, conducting wire is covered；22, exposure conducting wire；
23, conducting wire group；3, insulating layer；4, exposed hole；5, adhesive layer；6, encapsulation cover plate.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those skilled in the art are not having
Every other embodiment obtained under the premise of creative work is made, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also indirectly connected through an intermediary, it can be with
It is the connection inside two elements, can be wireless connection, be also possible to wired connection.For those of ordinary skill in the art
For, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
As long as in addition, the non-structure each other of technical characteristic involved in invention described below different embodiments
It can be combined with each other at conflict.
In order to realize the narrow frame design of display screen, the wire widths of product are also increasingly thinner, between adjacent legs between
Away from also smaller and smaller.But inventors have found that narrow frame product, because lead is more and more thinner, general lead design in 5um hereinafter,
If thinner lead is exposed outside, and is not effectively protected, subtle particle or impurity etc. are fallen in the production process
Between lead, adjacent connection can be got up, cause adjacent legs short-circuit, product column connect, and product occur and do not show now
As, while the yield of product can be reduced with reliability.
The embodiment of the present invention provides a kind of display screen, as illustrated in fig. 1 and 2, comprising: substrate 1, including viewing area 11 and place
In the cabling area 12 in 11 outside of viewing area, conducting wire 2 is provided in cabling area 12；Insulating layer 3 in cabling area 12, insulating layer
3 covering conducting wires 2.
In one embodiment, substrate 1 can be rigid substrates, such as glass substrate, quartz base plate or plastic base are thoroughly
Bright substrate；Substrate 1 can also be flexible base board, such as PI film, to improve the transparency of device.
In one embodiment, for pixel circuit and light emitting structure to be arranged, above-mentioned light emitting structure can for the viewing area 11 of substrate 1
To be Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED), it is also possible to liquid crystal display LCD；Picture
Plain circuit may include only thin film transistor (TFT), also may include transistor and capacitor；The present embodiment only schematically illustrates, not
As limit, can rationally be arranged as needed in actual application.
In one embodiment, the cabling area 12 of substrate 1 can be data line, scanning for several conducting wires 2, conducting wire 2 to be arranged
In the combination of one or more of line, power supply line, ground wire, reset line equisignal line, these signal wires and viewing area 11
Pixel circuit is connected with light emitting structure, is also connect with controller, so that controller realizes that pixel circuit driving shines by conducting wire
Structure shines, so that display screen realizes that picture is shown.
In one embodiment, the material of insulating layer can be inorganic insulating material, such as silica or silicon nitride etc.,
It can be organic insulating material, such as polyvinyl chloride, polyethylene, crosslinked polyethylene, polymethyl methacrylate (PMMA) etc., also
It can be the insulating materials of organic-inorganic mixing.The present embodiment only schematically illustrates, and is not limited thereto, in practical application mistake
Cheng Zhong, the material of insulating layer are also possible to insulating materials in the prior art.For ease of description and understand, in the present embodiment
Insulating layer is illustrated for one layer, and in other embodiments, insulating layer can be one layer, be also possible to multilayer, more
The insulating layer of layer laminate can be organic insulator or inorganic insulation layer or organic insulator and inorganic insulation layer is mutual
Lamination setting, specifically can be rationally arranged as needed.
It is provided with insulating layer in cabling area in above-mentioned display screen, avoids subtle in the production process particle or impurity
The short circuit of adjacent lines caused by falling between the conductors, improves the production yield of display screen, increases the reliability of display screen.It walks
Insulating layer in line area can be set also can be set between the conductors in conductive line surfaces, i.e., insulating layer can both cover conducting wire or
The gap between conducting wire can be covered, when insulating layer simultaneously cover gap between conducting wire and conducting wire when, can further decrease because
Subtle particle or impurity etc., which are fallen between lead, causes conducting wire short-circuit, improves screen body reliability.
In one embodiment, as shown in Figures 3 and 4,3 part of insulating layer covers conducting wire 2, is covered in conducting wire 2 by insulating layer 3
Conducting wire forms capped conducting wire 21.The conducting wire of insulating layer covering part conducting wire, exposing can increase substrate and subsequent preparation process
In packaging plastic between adhesion strength, and then increase substrate and the adhesion strength of encapsulation cover plate that is set on packaging plastic, both make
It is not susceptible to separate, improves the reliability of display screen, extend the service life of display screen.
In one embodiment, as shown in figure 4, the conducting wire 2 not covered by insulating layer 3 constitutes exposure conducting wire 22, exposure conducting wire
22 is not adjacent to each other.The conducting wire not covered by insulating layer is not adjacent to each other, i.e., the conducting wire adjacent with conducting wire is exposed is covered by insulating layer
Lid, can be both effectively ensured between the conducting wire of exposing and adjacent wires in this way will not be since subtle particle or impurity etc. be fallen in
Cause short circuit between lead, but can exposing conducting wire as much as possible, increase adhesion strength.
In one embodiment, as it can be seen in figures 5 and 6, exposure conducting wire 22 is partitioned into multiple conducting wire groups 23 for conducting wire 21 is covered；Edge
From viewing area 11 to the direction in cabling area 12, the quantity of the conducting wire in conducting wire group 23 is gradually decreased.Cabling area is located at outside, from aobvious
Show that the conducting wire exposed in the cabling area of Qu Yueyuan is more, i.e. the conducting wire of screen body fringe region is more exposed, in subsequent system
During standby, the conducting wire exposed can increase the contact area between conducting wire and packaging plastic, and then increase substrate and be set to
The adhesion strength of encapsulation cover plate on packaging plastic, it is ensured that the encapsulation validity of screen body fringe region reduces the probability of water oxygen invasion.
Specifically, as shown in fig. 6, along from viewing area to the direction in cabling area, including four conducting wire groups, institute in conducting wire group 23
The number for the covering conducting wire for including is followed successively by 5,4,3 and 2.
In one embodiment, as shown in figure 5, outermost conducting wire of the routing region far from substrate side is exposure conducting wire
22.Insulating layer is not covered on the outermost conducting wire in cabling area, to increase contact area, improves adhesion strength.
In one embodiment, as shown in fig. 7, insulating layer 3 all covers conducting wire 2.All covering conducting wire can be as more as possible
Conducting wire is protected on ground, can avoid line short caused by subtle particle or impurity etc. completely.
In one embodiment, insulating layer 3 covers cabling area 12, and specifically, insulating layer 3 covers entire cabling area 12, is formed
The insulating layer 3 in entire cabling area 12 is covered, so that between insulating layer 3 had not only been completely covered conducting wire 2 but also had been completely covered between conducting wire 2
Away from can further avoid fine particle in the production process or impurity is fallen between conducting wire 2 between caused adjacent lines
Short circuit, effectively prevent because conducting wire is exposed in the production process, by the particle fallen or impurity etc. cause two adjacent wires it
Between show bad phenomenon caused by short circuit；Also, the insulating layer 3 for covering entire cabling area 12 is simpler during the preparation process
It is single, convenient, controllability is high.
In one embodiment, covering conducting wire is equipped with the exposed hole for exposing conducting wire 2.
Specifically, it is connected to the exposed hole that conducting wire 2 deviates from 1 one side surface of substrate as shown in figure 8, having on insulating layer 3, it should
Exposed hole is exposed hole 4.Exposed hole 4 runs through insulating layer 3, so that expose with conducting wire 2 corresponding to 4 position of exposed hole, exposing
Insulating layer 3 is still covered in spacing between conducting wire 2 and adjacent wires 2, in the portion for guaranteeing to expose in the case where not causing short circuit
Intraphase conductor 2 forms encapsulation cover plate in subsequent preparation process on substrate, is carried out between substrate and encapsulation cover plate by packaging plastic
Bonding, the adhesion strength between packaging plastic and metal layer is greater than the adhesion strength between adhesive layer and insulating layer, therefore the metal layer exposed
The adhesion strength of substrate 1 Yu packaging plastic can be increased, and then increase the adhesion strength of substrate with the encapsulation cover plate being set on packaging plastic,
Make the two be not susceptible to separate, improves the reliability of display screen, extend the service life of display screen.Specifically, in Fig. 8
Exposed hole includes two kinds of exposed hole, and when the line width of conducting wire is wider, exposed hole being projected as on substrate is spaced
Rectangular, when the line width of conducting wire is relatively narrow, exposed hole is projected as relatively long strip on substrate, enough to guarantee to expose
Metallic area increase the adhesion strength between substrate and package board, while again may be used so that subsequent big with the contact area of packaging plastic
To avoid the technology difficulty for forming exposure sky when the line width of conducting wire is relatively narrow, the present embodiment is only schematically illustrated, not with this
It is limited.
In one embodiment, as shown in figure 9, the exposed hole on adjacent wires 2 is in be dislocatedly distributed.Misplace the exposed hole arranged
4, even if the biggish particle of partial size or impurity are fallen on substrate, short circuit between route will not be caused, reliability is effectively ensured.
In one embodiment, the shape of the orthographic projection of exposed hole 4 on substrate 1 can be rectangle, circle, ellipse, three
The combination of one or more of the shapes such as angular, hexagon or diamond shape, the present embodiment only schematically illustrate, not with
This is limited.It should be noted that length of the exposed hole 4 on 2 extending direction of conducting wire can be rationally arranged according to actual needs, this reality
It applies example and this is not intended to be limited in any.
In one embodiment, the orthographic projection of exposed hole 4 on substrate 1 only with the orthographic projection on substrate 1 of a conducting wire 2 extremely
Small part is overlapped.Exposed hole opening only exposes a conducting wire, particle or impurity fall in the opening of exposed hole not
It will cause the short circuit between conducting wire.
In one embodiment, as shown in Figure 10, the orthographic projection of exposed hole 4 on substrate 1 and a conducting wire 2 be on substrate 1
Orthographic projection partially overlap.Specifically, a line of the orthographic projection of exposed hole 4 on substrate 1 on 2 extending direction of conducting wire is fallen in
On conducting wire 2, another a line is fallen in interval between the conductors, i.e., exposes the spacing between conducting wire and conducting wire at exposed hole.
In one embodiment, as shown in figure 11, the orthographic projection of exposed hole 4 on substrate 1 conducting wire 2 on substrate 1 just
In projection.When the line width of conducting wire is larger, exposed hole is formed on the corresponding insulating layer of conducting wire 2, so that preparation process is simpler
It is single.
Specifically, the line width of conducting wire is not less than 30um, and the width of exposed hole is less than 20um；Certainly, in other embodiments,
The width of conducting wire and exposed hole can be rationally arranged as needed, be not limited thereto.
In one embodiment, as shown in figure 12, the orthographic projection of exposed hole 4 on substrate 1 across conducting wire 2 on substrate 1
Orthographic projection.Especially when the line width of conducting wire is smaller, for increase exposed hole size as much as possible, expose one at exposed hole
Conducting wire and the interval for exposing the conducting wire both sides；I.e. exposed hole includes two parts on conducting wire between plain conductor at this time.
It should be noted that insulating layer, after the completion of preparation, the thickness of insulating layer above conducting wire is less than the insulating layer between wire spacing
Thickness, due to needing to remove the insulating layer above conducting wire, therefore the insulating layer being located at conductor spacing can be with conducting wire far from substrate
The flush of side is also possible to can also be and completely remove at conductor spacing lower than surface of the conducting wire far from substrate side
Insulating layer, according to actual needs rationally setting.
Specifically, the orthographic projection of exposed hole 4 on substrate 1 covers a conducting wire, and also covers adjacent with the conducting wire walk
Line interval region, for example, covering the 1/2 of adjacent traces interval.Certainly, in other embodiments, adjacent traces interval is covered
Size can also be other numerical value, such as 1/3 or 2/3, the present embodiment only schematically illustrates, and is not limited thereto；It covers
The size at lid adjacent traces interval be also possible to it is asymmetric, if side covering alignment interval 1/2, the other side cover cabling between
Every 1/3, specifically can rationally be arranged as needed.
In one embodiment, the spacing between adjacent exposed hole include at least two conducting wires, i.e., two or two with
On conducting wire between exposed hole is set, the spacing of adjacent exposed hole is larger, and process operability is high, and manufacture difficulty reduces, and is produced into
This is lower.
In one embodiment, center line of the center of exposed hole 4 with conducting wire 2 in extending direction is overlapped, so that design is more
Simply.Certainly, in other embodiments, the center of exposed hole 4 can not also be overlapped with conducting wire 2 in the center line of extending direction,
The present embodiment only schematically illustrates, and is not limited thereto.
In one embodiment, the shape of the exposed hole 4 on same conducting wire 2 is identical and arrangement mode is identical, reduces
The setting difficulty of exposed hole.Certainly, in other embodiments, the shape of the exposed hole on same conducting wire can not also be identical, row
Column mode can not also be identical, specifically can rationally be arranged as needed.In further embodiments, the exposed hole on different conductor
Shape, size can be identical or not identical, according to the actual situation rationally setting, the present embodiment does not make this any
Limitation.
In one embodiment, the arrangement mode of the exposed hole on same conducting wire is consistent with conductive extending direction.
In one embodiment, the orthographic projection of exposed hole 4 on substrate 1 accounts for the area of the orthographic projection of insulating layer 3 on substrate 1
Can be 40%-60%, can either effective protection route, and can be improved the adhesion strength of packaging area, be particularly suitable for narrow side
Display screen, insulating layer effective protection conducting wire, reduce product show bad phenomenon, improve product yield；Exposed hole makes UV glue
Increase with upper and lower glass contact area, improve packaging area adhesion strength, promotes product reliability and service life.
In one embodiment, exposed hole can be prepared by etching mode, specifically, by mask plate to insulating layer figure
Caseization forms exposed hole, and preparation method is simple, without increasing additional processing step, it is only necessary to change the figure on mask plate
Exposed hole is prepared, production cost is reduced；It certainly, in other embodiments, can also be by other way in the prior art exhausted
Exposed hole is prepared in edge layer, such as prepares exposed hole on the insulating layer by way of laser irradiation.
In one embodiment, cabling area 12 is set to the outside of viewing area 11 so that the conducting wire being arranged in cabling area without
Viewing area need to be crossed over, can directly be connect with controller, connection type is simpler, and placement-and-routing is more convenient.
Specifically, cabling area 12 can be set the side in viewing area 11, two sides, three sides or all surround viewing area,
Can rationally it be arranged as needed.As shown in figure 13, cabling area 12 can be set in three sides of viewing area 11, the respectively left and right sides
And downside, the present embodiment only schematically illustrate, and are not limited thereto.
In one embodiment, as shown in figure 14, substrate 1 further includes safety zone 13, and safety zone 13 is set to 11 He of viewing area
Between cabling area 12 and cover close to the part cabling area of edge of display area, for protecting viewing area.Specifically, complete on safety zone
Portion is covered with insulating layer, and viewing area and cabling area are effectively isolated, and protects viewing area.
In one embodiment, above-mentioned display screen, as shown in figure 15, further includes: adhesive layer 5 is located on insulating layer；Cap
Plate 6 is located on the adhesive layer 5.Viewing area is encapsulated in a confined space by adhesive layer, encapsulation cover plate and substrate, energy
Enough effectively barrier water oxygens corrode the light emitting structure in viewing area, extend the service life of light emitting structure.
In one embodiment, adhesive layer 5 can be UV glue, and certainly, in other embodiments, packaging plastic is also possible to existing
Other optical cements in technology, or it is also possible to the other types of film layer with adhesion strength.
In one embodiment, encapsulation cover plate 6 can be glass cover-plate, and certainly, in other embodiments, encapsulation cover plate can also
To be package board in the prior art, such as plastic cover plate, as needed rationally setting.
The present embodiment also provides a kind of display equipment, including mentioned display screen any in above-described embodiment.The display
Insulating layer is provided between the adjacent wires in the display screen cabling area in equipment, insulating layer covers the interval between conducting wire, keeps away
Exempt from the short circuit of adjacent lines caused by subtle in the production process particle or impurity are fallen between lead, improves display screen
Production yield, increase the reliability of display screen, so improve display equipment reliability.
In one embodiment, above-mentioned display equipment can mobile phone, plate, palm PC, ipad, digital camera, navigator etc.
Any equipment having a display function.
Although being described in conjunction with the accompanying the embodiment of the present invention, those skilled in the art can not depart from the present invention
Spirit and scope in the case where various modifications and variations can be made, such modifications and variations are each fallen within by appended claims institute
Within the scope of restriction.
Claims (10)
1. a kind of display screen characterized by comprising
Substrate, the cabling area including viewing area and on the outside of viewing area are provided with conducting wire in the cabling area；
Insulating layer in the cabling area, the insulating layer cover the conducting wire.
2. display screen shown according to claim 1, which is characterized in that the insulating layer part covers the conducting wire, described to lead
Capped conducting wire is formed by the conducting wire that the insulating layer covers in line.
3. display screen according to claim 2, which is characterized in that do not constitute exposure by the conducting wire that the insulating layer covers and lead
Line, the exposed conducting wire are not adjacent to each other.
4. display screen according to claim 3, which is characterized in that the exposed conducting wire is by the covering conductor spacing at more
A conducting wire group；
Along from the viewing area to the direction in the cabling area, the quantity of the conducting wire in conducting wire group is gradually decreased.
5. display screen according to claim 3, which is characterized in that the routing region is outermost far from the substrate side
The conducting wire of side is exposure conducting wire.
6. display screen according to claim 2, which is characterized in that the insulating layer all covers the conducting wire.
7. display screen according to claim 6, which is characterized in that the covering conducting wire, which is equipped with, exposes the sudden and violent of the conducting wire
Reveal hole.
8. display screen according to claim 7, which is characterized in that the exposed hole on the adjacent conducting wire is in dislocation point
Cloth.
9. any display screen in -8 according to claim 1, which is characterized in that further include:
Adhesive layer is located on the insulating layer；
Encapsulation cover plate is located on the adhesive layer.
10. a kind of display equipment, which is characterized in that including the display screen as described in any in claim 1-9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910357862.2A CN110137224B (en) | 2019-04-29 | 2019-04-29 | Display screen and display device |
| PCT/CN2019/113548 WO2020220617A1 (en) | 2019-04-29 | 2019-10-28 | Display screen and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910357862.2A CN110137224B (en) | 2019-04-29 | 2019-04-29 | Display screen and display device |
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| CN110137224A true CN110137224A (en) | 2019-08-16 |
| CN110137224B CN110137224B (en) | 2021-07-27 |
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| CN201910357862.2A Active CN110137224B (en) | 2019-04-29 | 2019-04-29 | Display screen and display device |
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| WO (1) | WO2020220617A1 (en) |
Cited By (1)
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| WO2020220617A1 (en) * | 2019-04-29 | 2020-11-05 | 昆山维信诺科技有限公司 | Display screen and display device |
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| Publication number | Publication date |
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| CN110137224B (en) | 2021-07-27 |
| WO2020220617A1 (en) | 2020-11-05 |
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