CN110137224B - Display screen and display device - Google Patents
Display screen and display device Download PDFInfo
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- CN110137224B CN110137224B CN201910357862.2A CN201910357862A CN110137224B CN 110137224 B CN110137224 B CN 110137224B CN 201910357862 A CN201910357862 A CN 201910357862A CN 110137224 B CN110137224 B CN 110137224B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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Abstract
The invention discloses a display screen and display equipment, wherein the display screen comprises: the substrate comprises a display area and a wiring area positioned outside the display area, wherein a lead is arranged in the wiring area; and the insulating layer is positioned in the wiring area and covers the conducting wire. The insulating layer is arranged on the wiring area in the display screen, the insulating layer covers the wires, adjacent line short circuits caused by fine particles or impurities falling between the leads in the manufacturing process are avoided, the production yield of the display screen is improved, and the reliability of the display screen is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display screen and display equipment.
Background
The narrow frame design has basically replaced the frame design of traditional size on electronic display product, and for small-size wearing type OLED product, the design of narrow frame, super narrow frame, have higher requirement to technological capability and product reliability.
Disclosure of Invention
Based on this, the invention provides a display screen and a display device with higher reliability.
According to a first aspect, an embodiment of the present invention provides a display screen, including:
the substrate comprises a display area and a wiring area positioned outside the display area, wherein a lead is arranged in the wiring area; and the insulating layer is positioned in the wiring area and covers the conducting wire.
In one embodiment, the insulating layer partially covers the conductive wires, and the conductive wires covered by the insulating layer form covered conductive wires. The insulating layer partially covers the wires, the exposed wires can increase the adhesive force between the substrate and the packaging adhesive in the subsequent preparation process, and further increase the adhesive force between the substrate and the packaging cover plate arranged on the packaging adhesive, so that the substrate and the packaging cover plate are not easy to separate, the reliability of the display screen is improved, and the service life of the display screen is prolonged.
In one embodiment, the wires not covered by the insulating layer constitute exposed wires, which are not adjacent to each other. The wires which are not covered by the insulating layer are not adjacent to each other, namely the wires adjacent to the exposed wires are covered by the insulating layer, so that the exposed wires and the adjacent wires are effectively prevented from short circuit caused by fine particles or impurities falling between the leads, the wires can be exposed as much as possible, and the adhesion force is increased.
In one embodiment, the exposed wires space the covered wires into a plurality of wire sets; the number of the conducting wires in the conducting wire group is gradually reduced along the direction from the display area to the wiring area. The wiring area is positioned at the outer side, and more wires are exposed on the wiring area which is farther away from the display area, so that the contact is increased.
In one embodiment, the outermost wires on one side of the trace area away from the substrate are exposed wires. The conducting wires at the outermost side of the wiring area are not covered with an insulating layer, so that the contact area is increased, and the adhesion is improved.
In one embodiment, the insulating layer entirely covers the conductive lines. The entire covered wire can protect the wire as much as possible, and can completely avoid short circuit of the wire due to fine particles or impurities.
In one embodiment, the covered wire is provided with an exposing hole exposing the wire. And forming a packaging cover plate on the substrate in the subsequent preparation process under the condition of ensuring that short circuit is not caused on the exposed part of the lead, wherein the substrate and the packaging cover plate are bonded by packaging adhesive, and the adhesive force between the packaging adhesive and the metal layer is greater than that between the sealing adhesive layer and the insulating layer.
In one embodiment, the exposure holes on adjacent wires are distributed in a staggered manner. Even if particles with larger particle sizes or impurities fall on the substrate, short circuit between circuits can not be caused, and reliability is effectively ensured.
In one embodiment, the insulating layer covers the routing area. The insulating layer covers the whole wiring area, so that the insulating layer can completely cover the wires and the space between the wires, and short circuit between adjacent lines caused by fine particles or impurities falling between the wires in the manufacturing process can be further avoided; and the insulating layer covering the whole wiring area is simpler, more convenient and more controllable in the preparation process.
In one embodiment, the insulating layer has an exposing hole connected to a surface of the conductive line facing away from the substrate. The exposure hole runs through the insulating layer, make and expose the wire that the hole position corresponds and expose, guarantee not arousing the partial wire that exposes under the condition of short circuit, form the encapsulation apron on the base plate in follow-up preparation process, bond through the encapsulation glue between base plate and the encapsulation apron, the adhesion between encapsulation glue and the metal level is greater than the adhesion between sealing compound layer and the insulating layer, so the metal level that exposes can increase the adhesion of base plate and encapsulation glue, and then increase the adhesion of base plate and the encapsulation apron that sets up on the encapsulation glue, make both difficult emergence separation, the reliability of display screen is improved, the life of display screen is prolonged.
In one embodiment, the orthographic projection of the exposure hole on the substrate at least partially coincides with the orthographic projection of only one lead on the substrate. Only one wire is exposed at the opening of the exposure hole, so that the exposure hole is arranged on the insulating layer corresponding to one wire, and even if particles or impurities fall at the opening of the exposure hole, short circuit between the wires cannot be caused.
In one embodiment, the orthographic projection of the exposure hole on the substrate is within the orthographic projection of the wire on the substrate. When the line width of the wire is larger, the exposure hole is arranged on the insulating layer corresponding to the wire, so that the preparation process is simpler.
In one embodiment, the orthographic projection of the exposure hole on the substrate spans the orthographic projection of the lead on the substrate; this arrangement makes it possible to increase the size of the exposure hole as much as possible, especially when the line width of the wire is small.
In one embodiment, the wiring area is arranged outside the display area, so that wires arranged on the wiring area can be directly connected with the controller without crossing the display area, the connection mode is simpler, and the layout and wiring are more convenient.
In one embodiment, the substrate further comprises a safety area disposed between the display area and the wiring area, and the safety area can effectively protect the display area.
In one embodiment, the method further comprises the following steps: the sealing adhesive layer is positioned on the insulating layer; and the packaging cover plate is positioned on the sealing adhesive layer. The display area is packaged in a closed space through the sealing glue layer, the packaging cover plate and the substrate, the light-emitting structure in the display area can be effectively prevented from being corroded by water and oxygen, and the service life of the light-emitting structure is prolonged.
According to a second aspect, embodiments of the present invention provide a display device, including a display screen according to any one of the first aspect of the present invention.
The technical scheme of the invention has the following beneficial effects:
the display screen provided by the embodiment of the invention comprises: the substrate comprises a display area and a wiring area positioned outside the display area, wherein a lead is arranged in the wiring area; and the insulating layer is positioned in the wiring area and covers the conducting wire. The insulating layer is arranged on the wiring area in the display screen, the insulating layer covers the wires, adjacent line short circuits caused by fine particles or impurities falling between the wires in the manufacturing process are avoided, the production yield of the display screen is improved, and the reliability of the display screen is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic diagram of a specific example of a display screen in an embodiment of the present invention;
fig. 2 is a schematic view showing another specific example of a display screen in the embodiment of the present invention;
fig. 3 is a schematic view showing another specific example of a display screen in the embodiment of the present invention;
fig. 4 is a schematic view showing another specific example of a display screen in the embodiment of the present invention;
fig. 5 is a schematic view showing another specific example of a display screen in the embodiment of the present invention;
fig. 6 is a schematic view showing another specific example of a display screen in the embodiment of the present invention;
fig. 7 is a schematic view showing another specific example of a display screen in the embodiment of the present invention;
fig. 8 is a schematic view showing another specific example of a display screen in the embodiment of the present invention;
fig. 9 is a schematic view showing another specific example of a display screen in the embodiment of the present invention;
fig. 10 is a schematic view showing another specific example of a display screen in the embodiment of the present invention;
fig. 11 is a schematic view showing another specific example of a display screen in the embodiment of the present invention;
fig. 12 is a schematic view showing another specific example of a display screen in the embodiment of the present invention;
fig. 13 is a schematic view showing another specific example of a display screen in the embodiment of the present invention;
fig. 14 is a schematic view showing another specific example of a display screen in the embodiment of the present invention;
fig. 15 is a schematic diagram of a specific example of a display device in the embodiment of the present invention.
Reference numerals:
1. a substrate; 11. a display area; 12. a wiring area; 13. a security zone; 2. a wire; 21. covering the wire; 22. exposing the wires; 23. a wire group; 3. an insulating layer; 4. an exposure hole; 5. a glue sealing layer; 6. and (6) packaging the cover plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
In order to realize the narrow frame design of the display screen, the width of the lead wires of the product is thinner and thinner, and the distance between the adjacent lead wires is smaller and smaller. However, the inventor found that, in a narrow frame product, since the leads are thinner and thinner, the leads are generally designed below 5um, and if the thinner leads are exposed outside without effective protection, fine particles or impurities fall between the leads during the manufacturing process, and adjacent lines are connected, so that adjacent leads are short-circuited, the product is connected in rows, the product does not display, and meanwhile, the yield and reliability of the product are reduced.
An embodiment of the present invention provides a display screen, as shown in fig. 1 and 2, including: the substrate 1 comprises a display area 11 and a wiring area 12 positioned outside the display area 11, wherein a lead 2 is arranged in the wiring area 12; and the insulating layer 3 is positioned in the wiring area 12, and the insulating layer 3 covers the lead 2.
In one embodiment, the substrate 1 may be a rigid substrate, such as a transparent substrate like a glass substrate, a quartz substrate, or a plastic substrate; the substrate 1 may also be a flexible substrate, such as a PI film, to improve the transparency of the device.
In an embodiment, the display area 11 of the substrate 1 is used for disposing a pixel circuit and a Light Emitting structure, and the Light Emitting structure may be an Organic Light-Emitting Diode (OLED) or a Liquid Crystal Display (LCD); the pixel circuit may include only a thin film transistor, and may also include a transistor and a capacitor; the embodiment is only schematically illustrated, and is not limited thereto, and can be reasonably arranged as required in the practical application process.
In an embodiment, the wiring area 12 of the substrate 1 is used for disposing a plurality of wires 2, the wires 2 may be one or a combination of signal lines such as data lines, scan lines, power lines, ground lines, and reset lines, and the signal lines are connected to the pixel circuits and the light-emitting structures in the display area 11, and are further connected to the controller, so that the controller realizes the light emission of the pixel circuits driving the light-emitting structures through the wires, and further the display screen realizes the image display.
In an embodiment, the material of the insulating layer may be an inorganic insulating material, such as silicon oxide or silicon nitride, or an organic insulating material, such as polyvinyl chloride, polyethylene, cross-linked polyethylene, polymethyl methacrylate (PMMA), or an organic-inorganic hybrid insulating material. The present embodiment is only illustrated schematically, and not limited thereto, and in practical applications, the material of the insulating layer may also be an insulating material in the prior art. For convenience of description and understanding, the insulating layer in this embodiment is illustrated as one layer, in other embodiments, the insulating layer may be one layer or multiple layers, and the insulating layer of the multilayer stack may be an organic insulating layer, an inorganic insulating layer, or an organic insulating layer and an inorganic insulating layer stacked on each other, and may be specifically and reasonably disposed as required.
The insulating layer is arranged in the wiring area in the display screen, so that adjacent line short circuits caused by fine particles or impurities falling between the wires in the manufacturing process are avoided, the production yield of the display screen is improved, and the reliability of the display screen is improved. The insulating layer in the wiring area can be arranged on the surface of the lead and can also be arranged between the leads, namely the insulating layer can cover the leads and can also cover the gaps between the leads, when the insulating layer covers the gaps between the leads, the short circuit of the leads caused by fine particles or impurities falling between the leads can be further reduced, and the reliability of the screen body is improved.
In one embodiment, as shown in fig. 3 and 4, the insulating layer 3 partially covers the conductive wires 2, and the conductive wires covered with the insulating layer 3 in the conductive wires 2 form covered conductive wires 21. The insulating layer covers part of the lead, the exposed lead can increase the adhesive force between the substrate and the packaging adhesive in the subsequent preparation process, and then the adhesive force between the substrate and the packaging cover plate arranged on the packaging adhesive is increased, so that the substrate and the packaging cover plate are not easy to separate, the reliability of the display screen is improved, and the service life of the display screen is prolonged.
In one embodiment, as shown in fig. 4, the wires 2 not covered by the insulating layer 3 constitute exposed wires 22, and the exposed wires 22 are not adjacent to each other. The wires which are not covered by the insulating layer are not adjacent to each other, namely the wires adjacent to the exposed wires are covered by the insulating layer, so that the exposed wires and the adjacent wires are effectively prevented from short circuit caused by fine particles or impurities falling between the leads, the wires can be exposed as much as possible, and the adhesion force is increased.
In one embodiment, as shown in fig. 5 and 6, the exposed wires 22 space the covered wires 21 into a plurality of wire groups 23; the number of wires in the wire group 23 gradually decreases in a direction from the display area 11 to the wiring area 12. The wiring area is located on the outer side, more wires are exposed on the wiring area which is farther away from the display area, namely more wires in the edge area of the screen body are exposed, in the subsequent preparation process, the exposed wires can increase the contact area between the wires and the packaging glue, so that the adhesion force of the substrate and the packaging cover plate arranged on the packaging glue is increased, the packaging effectiveness of the edge area of the screen body is ensured, and the probability of water oxygen invasion is reduced.
Specifically, as shown in fig. 6, four wire groups are included in the direction from the display area to the wiring area, and the number of the covered wires included in the wire group 23 is 5, 4, 3, and 2 in this order.
In one embodiment, as shown in fig. 5, the outermost wires on the side of the trace area away from the substrate are exposed wires 22. The conducting wires at the outermost side of the wiring area are not covered with an insulating layer, so that the contact area is increased, and the adhesion is improved.
In one embodiment, as shown in fig. 7, the insulating layer 3 entirely covers the conductive lines 2. The entire covered wire can protect the wire as much as possible, and can completely avoid short circuit of the wire due to fine particles or impurities.
In an embodiment, the insulating layer 3 covers the wiring region 12, specifically, the insulating layer 3 covers the entire wiring region 12, and the insulating layer 3 covering the entire wiring region 12 is formed, so that the insulating layer 3 completely covers the wires 2 and completely covers the space between the wires 2, thereby further avoiding short circuit between adjacent wires caused by fine particles or impurities falling between the wires 2 in the manufacturing process, and effectively preventing poor display caused by short circuit between two adjacent wires caused by exposed wires, falling particles or impurities and the like in the manufacturing process; moreover, the insulating layer 3 covering the whole wiring area 12 is simpler, more convenient and more controllable in the preparation process.
In one embodiment, the covered wire is provided with an exposing hole exposing the wire 2.
Specifically, as shown in fig. 8, the insulating layer 3 has an exposure hole connected to a surface of the lead 2 facing away from the substrate 1, and the exposure hole is an exposure hole 4. The exposure hole 4 runs through the insulation layer 3, so that the lead 2 corresponding to the position of the exposure hole 4 is exposed, the insulation layer 3 is still covered on the space between the exposed lead 2 and the adjacent lead 2, part of the exposed lead 2 under the condition of ensuring no short circuit is ensured, a packaging cover plate is formed on the substrate in the subsequent preparation process, the substrate and the packaging cover plate are bonded through packaging glue, the adhesion force between the packaging glue and the metal layer is greater than that between the packaging glue layer and the insulation layer, so the exposed metal layer can increase the adhesion force between the substrate 1 and the packaging glue, further the adhesion force between the substrate and the packaging cover plate arranged on the packaging glue is increased, the substrate and the packaging cover plate are not easy to separate, the reliability of the display screen is improved, and the service life of the display screen is prolonged. Specifically, the exposure holes in fig. 8 include two types of exposure holes, projections of the exposure holes on the substrate are squares arranged at intervals when the line width of the conductive wire is wide, and projections of the exposure holes on the substrate are long strips when the line width of the conductive wire is narrow, so as to ensure that a sufficient metal area is exposed, so that the subsequent contact area with the encapsulation adhesive is large, the adhesion between the substrate and the encapsulation plate is increased, and meanwhile, the process difficulty of forming the exposure void when the line width of the conductive wire is narrow can be avoided.
In one embodiment, as shown in fig. 9, the exposure holes on the adjacent wires 2 are offset. Even if particles or impurities with larger particle sizes fall on the substrate, short circuit between lines can not be caused, and reliability is effectively ensured.
In an embodiment, the shape of the orthographic projection of the exposure holes 4 on the substrate 1 may be one or a combination of more than one of a rectangle, a circle, an ellipse, a triangle, a hexagon, or a diamond, and the embodiment is only for illustrative purposes and is not limited thereto. It should be noted that the length of the exposing hole 4 along the extending direction of the lead 2 can be reasonably set according to actual needs, and the embodiment does not limit this.
In one embodiment, the orthographic projection of the exposure hole 4 on the substrate 1 at least partially coincides with the orthographic projection of only one lead 2 on the substrate 1. Only one wire is exposed at the opening of the exposure hole, and even if particles or impurities fall at the opening of the exposure hole, short circuit between the wires is not caused.
In one embodiment, as shown in fig. 10, the orthographic projection of the exposure hole 4 on the substrate 1 coincides with the orthographic projection of one of the wires 2 on the substrate 1. Specifically, the orthographic projection of the exposure hole 4 on the substrate 1 falls on the conductive wires 2 along one side in the extending direction of the conductive wires 2 and the other side falls on the space between the conductive wires, i.e., the exposure hole exposes the conductive wires and the space between the conductive wires.
In one embodiment, as shown in fig. 11, the orthographic projection of the exposure hole 4 on the substrate 1 is within the orthographic projection of the lead 2 on the substrate 1. When the line width of the conductive line is large, an exposure hole is formed on the insulating layer corresponding to the conductive line 2, so that the manufacturing process is simpler.
Specifically, the line width of the conductive line is not less than 30um, and the width of the exposure hole is less than 20 um; of course, in other embodiments, the widths of the conductive wires and the exposing holes can be properly set according to the requirement, and are not limited thereto.
In one embodiment, as shown in fig. 12, the orthographic projection of the exposure holes 4 on the substrate 1 spans the orthographic projection of the wires 2 on the substrate 1. Especially when the line width of the conducting wire is small, in order to increase the size of the exposed hole as much as possible, one conducting wire is exposed at the exposed hole and the interval of two sides of the conducting wire is exposed; i.e. when the exposure hole comprises two portions above the conductor and between the metal conductors. It should be noted that, after the insulating layer is prepared, the thickness of the insulating layer above the wires is smaller than that between the wire intervals, and the insulating layer above the wires needs to be removed, so the insulating layer at the wire intervals can be flush with the surface of one side of the wires, which is far away from the substrate, or lower than the surface of one side of the wires, which is far away from the substrate, or completely remove the insulating layer at the wire intervals, and the insulating layer is reasonably arranged according to actual needs.
Specifically, the orthographic projection of the exposure hole 4 on the substrate 1 covers one conductive line and also covers the areas of the trace interval adjacent to the conductive line, for example, 1/2 each covering the adjacent trace interval. Of course, in other embodiments, the size of the space covering the adjacent traces may also be other values, such as 1/3 or 2/3, etc., and this embodiment is only for illustrative purposes and is not limited thereto; the size of the adjacent wiring gaps can also be asymmetrical, for example, 1/2 with one side covering the wiring gaps and 1/3 with the other side covering the wiring gaps can be reasonably set as required.
In one embodiment, the space between adjacent exposure holes at least comprises two wires, i.e. the exposure holes are arranged between two or more wires, the space between adjacent exposure holes is larger, the process operability is high, the manufacturing difficulty is reduced, and the production cost is lower.
In one embodiment, the center of the exposing hole 4 coincides with the center line of the wire 2 in the extending direction, so that the design is simpler. Of course, in other embodiments, the center of the exposing hole 4 may not coincide with the center line of the wire 2 in the extending direction, and this embodiment is merely illustrative and not limited thereto.
In one embodiment, the exposure holes 4 on the same wire 2 have the same shape and arrangement, which reduces the difficulty of disposing the exposure holes. Of course, in other embodiments, the shapes of the exposing holes on the same conductive wire may be different, and the arrangement may also be different, and may be properly arranged according to the needs. In other embodiments, the shape and size of the exposing holes on different wires may be the same or different, and may be set appropriately according to the actual situation, which is not limited in this embodiment.
In one embodiment, the exposed holes on the same conductive line are arranged in the same direction as the extending direction of the conductive line.
In an embodiment, the area of the orthographic projection of the exposure hole 4 on the substrate 1 accounts for 40% -60% of the area of the orthographic projection of the insulating layer 3 on the substrate 1, so that the circuit can be effectively protected, the adhesion of a packaging area can be improved, the packaging structure is particularly suitable for a display screen with narrow edges, the insulating layer effectively protects a wire, the phenomenon of poor product display is reduced, and the product yield is improved; the exposure hole enables the contact area of the UV glue and the upper glass and the lower glass to be increased, the adhesion force of the packaging area is improved, the reliability of the product is improved, and the service life of the product is prolonged.
In one embodiment, the exposure hole can be prepared by an etching mode, specifically, the exposure hole is formed by patterning the insulating layer through the mask plate, the preparation mode is simple, no additional process step is needed, the exposure hole can be prepared by only changing the graph on the mask plate, and the production cost is reduced; of course, in other embodiments, the exposure holes can be formed in the insulating layer by other means known in the art, such as by laser irradiation.
In an embodiment, the wiring area 12 is disposed outside the display area 11, so that the wires disposed on the wiring area can be directly connected to the controller without crossing the display area, the connection method is simpler, and the layout and wiring are more convenient.
Specifically, the routing area 12 may be disposed on one side, two sides, three sides, or all of the display area 11, and may be reasonably disposed as required. As shown in fig. 13, the routing area 12 may be disposed on three sides of the display area 11, namely, on the left side, the right side and the lower side, which is only illustrative in this embodiment and not limited thereto.
In an embodiment, as shown in fig. 14, the substrate 1 further includes a safety region 13, and the safety region 13 is disposed between the display region 11 and the routing region 12 and covers a portion of the routing region near the edge of the display region to protect the display region. Specifically, the safety area is completely covered with an insulating layer, so that the display area is effectively isolated from the wiring area, and the display area is protected.
In an embodiment, as shown in fig. 15, the display screen further includes: the adhesive sealing layer 5 is positioned on the insulating layer; and the packaging cover plate 6 is positioned on the sealing glue layer 5. The display area is packaged in a closed space through the sealing glue layer, the packaging cover plate and the substrate, the light-emitting structure in the display area can be effectively prevented from being corroded by water and oxygen, and the service life of the light-emitting structure is prolonged.
In one embodiment, the sealant layer 5 may be a UV glue, but in other embodiments, the sealant may be other optical glues in the prior art, or may be other types of films with adhesive force.
In one embodiment, the package cover 6 may be a glass cover, but in other embodiments, the package cover may also be a package plate in the prior art, such as a plastic cover, which may be appropriately configured as required.
The embodiment also provides a display device, which comprises the display screen mentioned in any one of the above embodiments. The insulating layer is arranged between the adjacent wires in the display screen wiring area in the display equipment, the insulating layer covers the interval between the wires, so that the short circuit of adjacent lines caused by fine particles or impurities falling between the leads in the manufacturing process is avoided, the production yield of the display screen is improved, the reliability of the display screen is improved, and the reliability of the display equipment is further improved.
In an embodiment, the display device may be any device with a display function, such as a mobile phone, a tablet, a palm computer, an ipad, a digital camera, and a navigator.
Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations fall within the scope defined by the appended claims.
Claims (4)
1. A display screen, comprising:
the substrate comprises a display area and a wiring area positioned outside the display area, wherein a lead is arranged in the wiring area;
an insulating layer in the wiring area, wherein the insulating layer partially covers the wires;
the whole single wire of the wires which is completely covered by the insulating layer forms a covered wire; the whole single conducting wire which is not covered by the insulating layer forms an exposed conducting wire;
the exposed wires are not adjacent to each other; the exposed wires space the covered wires into a plurality of wire groups;
the number of the conducting wires in the conducting wire group is gradually reduced along the direction from the display area to the wiring area.
2. The display screen of claim 1, wherein the outermost wires on the side of the routing area away from the display area are exposed wires.
3. The display screen according to claim 1 or 2, further comprising:
the sealing adhesive layer is positioned on the insulating layer;
and the packaging cover plate is positioned on the sealing adhesive layer.
4. A display device characterized by comprising a display screen according to any one of claims 1-3.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910357862.2A CN110137224B (en) | 2019-04-29 | 2019-04-29 | Display screen and display device |
| PCT/CN2019/113548 WO2020220617A1 (en) | 2019-04-29 | 2019-10-28 | Display screen and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910357862.2A CN110137224B (en) | 2019-04-29 | 2019-04-29 | Display screen and display device |
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| Publication Number | Publication Date |
|---|---|
| CN110137224A CN110137224A (en) | 2019-08-16 |
| CN110137224B true CN110137224B (en) | 2021-07-27 |
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| CN201910357862.2A Active CN110137224B (en) | 2019-04-29 | 2019-04-29 | Display screen and display device |
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| CN (1) | CN110137224B (en) |
| WO (1) | WO2020220617A1 (en) |
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| CN110137224B (en) * | 2019-04-29 | 2021-07-27 | 苏州清越光电科技股份有限公司 | Display screen and display device |
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| KR102195166B1 (en) * | 2013-12-26 | 2020-12-24 | 엘지디스플레이 주식회사 | Top emission organic light emitting display device and method of manufacturing the same |
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| CN110137224B (en) * | 2019-04-29 | 2021-07-27 | 苏州清越光电科技股份有限公司 | Display screen and display device |
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| CN110137224A (en) | 2019-08-16 |
| WO2020220617A1 (en) | 2020-11-05 |
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