CN110137093A - A kind of high protectiveness sealed in unit of silicon base chip group - Google Patents
A kind of high protectiveness sealed in unit of silicon base chip group Download PDFInfo
- Publication number
- CN110137093A CN110137093A CN201910542883.1A CN201910542883A CN110137093A CN 110137093 A CN110137093 A CN 110137093A CN 201910542883 A CN201910542883 A CN 201910542883A CN 110137093 A CN110137093 A CN 110137093A
- Authority
- CN
- China
- Prior art keywords
- control
- bevel gear
- gear
- connecting rod
- rack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 33
- 239000010703 silicon Substances 0.000 title claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 43
- 238000005538 encapsulation Methods 0.000 claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims description 93
- 239000000758 substrate Substances 0.000 claims description 18
- 238000003860 storage Methods 0.000 claims description 17
- 230000007723 transport mechanism Effects 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 6
- 230000006870 function Effects 0.000 claims description 3
- 230000008450 motivation Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000006378 damage Effects 0.000 abstract description 4
- 208000027418 Wounds and injury Diseases 0.000 abstract description 3
- 208000014674 injury Diseases 0.000 abstract description 3
- 230000003993 interaction Effects 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000306 component Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Transmission Devices (AREA)
Abstract
A kind of high protectiveness sealed in unit of silicon base chip group disclosed by the invention, including cabinet, power cavity is equipped in the box top wall, the power mechanism of power can be provided for device by being equipped in the power cavity, control chamber is equipped in the cabinet lower wall, control mechanism is equipped in the control chamber, the configuration of the present invention is simple, maintenance convenience, it is easy to use, it can make silicon base chip in closed environment, processing encapsulation, extraneous factor interference is not will receive, and whole process is automatical and efficient, without human interaction, device internal structure is stablized simultaneously, injury will not be generated to chip, it is capable of being packaged silicon base chip of safety and stability, greatly improve product qualified rate, the production cost of factory is saved, improve the utilization rate of raw material.
Description
Technical field
The present invention relates to silicon base chip encapsulation technology field, the high protectiveness encapsulation of specially a kind of silicon base chip group is set
It is standby.
Background technique
With the development of science and technology, electronic chip uses more and more extensive in every field, this also causes in various industries
A large amount of silicon base chip is needed, and since the particularity of material and manufacture craft is made in silicon base chip, generally add to it
Working hour needs dustless environment, and chip core position itself is more fragile, unbearable external environment to its intense impact,
It therefore, can be to silicon base chip core if the interference or processing unit (plant) itself by extraneous factor are unstable when encapsulating chip
Component damages, and then it is made to lose use value, therefore needs to develop one kind in encapsulation process, and chip can be kept static steady
Automatic packaging device that is fixed, and not interfered by extraneous factor.
Summary of the invention
Technical problem: the silicon base chip sealed in unit of traditional open needs to run under dustless environment, and chip core
Center portion position itself is more fragile, therefore when encapsulating chip, if the interference or processing unit (plant) itself by extraneous factor are unstable,
Silicon base chip core component can then be damaged, and then it is made to lose use value.
To solve the above problems, this example devises a kind of high protectiveness sealed in unit of silicon base chip group, one kind of this example
The high protectiveness sealed in unit of silicon base chip group, including cabinet, the box top wall is interior to be equipped with power cavity, sets in the power cavity
The power mechanism of power can be provided for device by having, and control chamber is equipped in the cabinet lower wall, is equipped with control machine in the control chamber
Structure, the power cavity lower wall is interior to be equipped with drive cavity, and push transmission mechanism is equipped in the drive cavity, is set in the drive cavity lower wall
There is push chamber, the push is intracavitary to be equipped with delivery device, is equipped with package board storage chamber, the package board in the drive cavity left wall
The cushion that can provide buffer function is equipped at left and right sides of storage chamber in wall, is stacked with cap in the package board storage chamber
Plate, the package board storage chamber left wall connection are equipped with working chamber, are equipped with cam mechanism, the working chamber in the working chamber roof
It is interior and be located at the cam mechanism lower end be equipped with pressing mechanism, and then can to chip carry out punching press encapsulation, the working chamber lower wall
Equipped with transport mechanism, it is equipped with chip substrate above the transport mechanism, is equipped with the institute that can be fixedly clamped in the working chamber left wall
The clamp system of chip substrate is stated, is equipped with linkage transmission chamber in the cabinet left wall, the linkage transmission is intracavitary to be set
There is link mechanism.
Wherein, the power mechanism includes the main motor in the power cavity, and the main motor, which is equipped with, can be rotated
Main shaft, the main shaft right end is installed with first bevel gear, rotatable first transmission is equipped in the power cavity
Axis, first transmission shaft top and is located in the power cavity and is installed with second bevel gear, the second bevel gear with it is described
First bevel gear engagement, first transmission shaft bottom end are installed with third hand tap gear, and the third hand tap gear can transmit power
To the control mechanism, it is installed with the first control bevel gear in the power cavity and on the main shaft outer wall, it is described
It is installed with the second control bevel gear in power cavity and on the main shaft outer wall, is equipped in the power cavity rotatable
Second driving shaft, the second driving shaft top and is located in the power cavity and is installed with the 4th bevel gear, the 4th cone tooth
Wheel can alternately be engaged with the second control bevel gear or the first control bevel gear.
Wherein, the control mechanism includes the control transmission shaft in the control chamber, the control transmission shaft right end
It is installed with the first control bevel gear, the first control bevel gear engages with the third hand tap gear, and then can drive the control
Transmission shaft rotation processed, the control transmission shaft left end are installed with the second control bevel gear, are equipped in the control chamber rotatable
First control locating shaft is installed with the first control bevel gear on the first control locating shaft, the first control bevel gear with
The second control bevel gear engages, and is installed with the first control gear, the control chamber on the first control locating shaft outer wall
It is interior to be equipped with slidable second control locating shaft, the second control gear, second control are installed on the first control belt wheel
Gear processed is engaged with the first control gear, is installed with the first control belt wheel on the second control locating shaft outer wall, described
It is equipped with rotatable third in control chamber and controls locating shaft, is installed with the second control belt wheel, institute on the third control locating shaft
It states the second control belt wheel and is connected with the first control belt wheel by the first belt, it is fixed on the third control locating shaft outer wall
There is the second control bevel gear, rotatable second control transmission shaft is equipped in the working chamber, the second control transmission shaft is right
End is installed with third control bevel gear, and the third control bevel gear engages with the second control bevel gear, and then works as third
When controlling bevel gear rotation, the transport mechanism can be driven to run, described second controls transmission shaft outer wall and be located at the control
It is intracavitary to be installed with third control gear, it is equipped with rotatable third in the control chamber and controls transmission shaft, the third control passes
The 4th control gear is installed on moving axis, the 4th control gear is engaged with third control gear.
Wherein, the transport mechanism includes the second control transmission shaft in the working chamber, second control
Transmission shaft outer wall processed is equipped with transmission wheel, is equipped with feed belt in the transmission wheel, is placed on the feed belt described
Chip substrate.
Wherein, the link mechanism includes the link transmission axis intracavitary set on the linkage transmission, and the connecting rod passes
Moving axis bottom end is installed with first connecting rod bevel gear, and the third control transmission shaft right end is installed with second connecting rod bevel gear, described
Second connecting rod bevel gear engages with the first connecting rod bevel gear, and link transmission axis top is installed with third connecting rod cone tooth
Wheel, the linkage transmission is intracavitary to be equipped with rotatable first connecting rod locating shaft, is installed on the first connecting rod locating shaft
Fourth link bevel gear, the fourth link bevel gear engage with the third connecting rod bevel gear, the first connecting rod locating shaft
First connecting rod is installed on outer wall, the first connecting rod can drive the clamp system to rotate.
Wherein, the clamp system includes the second connecting rod in the working chamber, and the second connecting rod passes through second
Connecting rod locating shaft and the first connecting rod are hinged, and rotatable third connecting rod is equipped in the working chamber, and the third connecting rod is logical
It crosses third connecting rod locating shaft to be hinged in the cabinet left wall, the third connecting rod top is hinged on by fourth link locating shaft
On the second connecting rod, the second connecting rod right end is installed with fixture, and then for clamping the chip substrate.
Wherein, the push transmission mechanism includes the first rack-driving axis in the drive cavity, first tooth
Transmission shaft left end is installed with the first rack gear bevel gear, in the drive cavity and is located at the second driving shaft lower end and is installed with the
Two rack gear bevel gears, the second rack gear bevel gear can engage with the first rack gear bevel gear, the first rack-driving axis
Right end is installed with third rack gear bevel gear, is equipped with rotatable second rack-driving axis, second rack gear in the drive cavity
The 4th rack gear bevel gear is installed on transmission shaft, the 4th rack gear bevel gear can engage with the third rack gear bevel gear, institute
It states and is installed with the first rack gear belt wheel on the second rack-driving axis outer wall, be arranged with rack gear belt on the first rack gear belt wheel, into
And power is passed into the delivery device by the rack gear belt.
Wherein, the delivery device includes the third rack-driving axis intracavitary set on the push, and the third rack gear passes
The second rack gear belt wheel is installed on moving axis, the second rack gear belt wheel is connected with the rack gear belt, and the push chamber lower wall is set
There is slidable rack gear push plate, and then when the rack gear push plate horizontally slips, it can be by the encapsulation in the package board storage chamber
Cover board is pushed to above the chip substrate in the working chamber.
Wherein, the cam mechanism includes the camshaft in the working chamber, is installed with cam on the camshaft
Bevel gear, the main shaft left end and be located at the working chamber in be installed with the second cam bevel gear, the cam bevel gear
It is engaged with the second cam bevel gear, is installed with cam on the camshaft.
Wherein, the pressing mechanism includes the pressurizing piston in the working chamber, the pressurizing piston inner elastomeric
It is connected with reset spring.
The beneficial effects of the present invention are: the configuration of the present invention is simple, maintenance convenience is easy to use, silicon base chip can be made close
In the environment closed, processing encapsulation not will receive extraneous factor interference, and whole process is automatical and efficient, is not necessarily to human interaction, together
When device internal structure stablize, injury will not be generated to chip, be capable of being packaged silicon base chip of safety and stability, mention significantly
High product qualified rate has saved the production cost of factory, improves the utilization rate of raw material.
Detailed description of the invention
The present invention is described in detail by following specific embodiments and drawings for ease of explanation,.
Fig. 1 is a kind of overall structure diagram of the high protectiveness sealed in unit of silicon base chip group of the invention；
Fig. 2 is the enlarged structure schematic diagram of " A " of Fig. 1；
Fig. 3 is the enlarged structure schematic diagram of " B " of Fig. 1；
Fig. 4 is the enlarged structure schematic diagram of " C " of Fig. 1.
Specific embodiment
Below with reference to Fig. 1-Fig. 4, the present invention is described in detail, for sake of convenience, now provides to hereafter described orientation
As follows: hereafter described front-rear direction up and down is consistent with the front-rear direction up and down of Fig. 1 projection relation itself.
The present invention relates to a kind of high protectiveness sealed in unit of silicon base chip group, are mainly used in silicon base chip group encapsulation neck
Domain, below in conjunction with attached drawing of the present invention, the present invention will be further described:
A kind of high protectiveness sealed in unit of silicon base chip group of the present invention, including cabinet 10, in 10 roof of cabinet
Equipped with power cavity 300, the power mechanism 301 of power, 10 lower wall of cabinet can be provided for device by being equipped in the power cavity 300
It is interior to be equipped with control chamber 500, it is equipped with control mechanism 501 in the control chamber 500, is equipped with drive cavity in 300 lower wall of power cavity
400, the drive cavity 400 is interior to be equipped with push transmission mechanism 401, is equipped in 400 lower wall of drive cavity and pushes chamber 600, described
It pushes and is equipped with delivery device 601 in chamber 600, be equipped with package board storage chamber 900, the package board in 400 left wall of drive cavity
It is equipped with the cushion 24 that can provide buffer function in 900 left and right sides wall of storage chamber, is stacked in the package board storage chamber 900
Encapsulation cover plate 25,900 left wall of the package board storage chamber connection are equipped with working chamber 800, are equipped in 800 roof of working chamber
Cam mechanism 802, the working chamber 800 is interior and is located at 802 lower end of cam mechanism equipped with pressing mechanism 804, and then can be right
Chip carries out punching press encapsulation, and 800 lower wall of working chamber is equipped with transport mechanism 803, is equipped with core above the transport mechanism 803
Plate base 34, the interior clamp system 801 for being equipped with the chip substrate 34 that can be fixedly clamped of 800 left wall of working chamber, the case
It is equipped with linkage transmission chamber 700 in 10 left wall of body, is equipped with link mechanism 701 in the linkage transmission chamber 700.
According to embodiment, power mechanism 301 is described in detail below, the power mechanism 301 includes set on described
Main motor 19 in power cavity 300, the main motor 19 are equipped with rotatable main shaft 15,15 right end of main shaft
It is installed with first bevel gear 20, rotatable first transmission shaft 22 is equipped in the power cavity 300, first transmission shaft 22 pushes up
It holds and is located in the power cavity 300 and be installed with second bevel gear 21, the second bevel gear 21 and the first bevel gear 20
Engagement, 22 bottom end of the first transmission shaft are installed with third hand tap gear 26, and the third hand tap gear 26 drives the control mechanism
501 rotations, the power cavity 300 is interior and is installed with the first control bevel gear 18 on 15 outer wall of main shaft, described
It is installed with the second control bevel gear 16 in power cavity 300 and on 15 outer wall of main shaft, is set in the power cavity 300
There is a rotatable second driving shaft 23,23 top of second driving shaft and is located in the power cavity 300 and is installed with the 4th cone
Gear 17, the 4th bevel gear 17 can replace with the second control bevel gear 16 or the first control bevel gear 18 to nibble
It closes, and then the push transmission mechanism 401 can be driven to rotate.
According to embodiment, control mechanism 501 is described in detail below, the control mechanism 501 includes set on described
Control transmission shaft 28 in control chamber 500,28 right end of control transmission shaft are installed with the first control bevel gear 27, and described first
Control bevel gear 27 engages with the third hand tap gear 26, and then the control transmission shaft 28 can be driven to rotate, and the control passes
28 left end of moving axis is installed with the second control bevel gear 53, and rotatable first control locating shaft 54 is equipped in the control chamber 500,
The first control bevel gear 55 is installed on first control, 54 outer wall of locating shaft, the first control bevel gear 55 and described the
Two control bevel gears 53 engage, and are installed with the first control gear 56, the control chamber on the first control 54 outer wall of locating shaft
It is equipped with slidable second control locating shaft 59 in 500, is installed with the second control gear 57, institute on the first control belt wheel 58
It states the second control gear 57 to engage with the first control gear 56, is installed with first on the second control 59 outer wall of locating shaft
Belt wheel 58 is controlled, rotatable third is equipped in the control chamber 500 and controls locating shaft 62, the third controls on locating shaft 62
It is installed with the second control belt wheel 61, the second control belt wheel 61 passes through 60 phase of the first belt with the first control belt wheel 58
Even, it is installed with the second control bevel gear 63 on third control 62 outer wall of locating shaft, being equipped in the working chamber 800 can be rotated
Second control transmission shaft 32, it is described second control 32 right end of transmission shaft is installed with third control bevel gear 64, the third control
Bevel gear 64 processed engages with the second control bevel gear 63, and then when third control bevel gear 64 rotates, can drive described
Transport mechanism 803 rotates, and described second controls 32 outer wall of transmission shaft and be installed with third control tooth in the control chamber 500
Wheel 65, the control chamber 500 is interior to be equipped with rotatable third control transmission shaft 29, is installed on the third control transmission shaft 29
4th control gear 66, the 4th control gear 66 are engaged with third control gear 65.
According to embodiment, transport mechanism 803 is described in detail below, the transport mechanism 803 includes that front and back is symmetrical
Be set to the working chamber 800 in it is described second control transmission shaft 32, it is described second control 32 outer wall of transmission shaft be equipped with pass
Wheel 33 is sent, feed belt 31 is equipped between the transmission wheel 33 of front and rear sides, is placed with the core on the feed belt 31
Plate base 34.
According to embodiment, following linkage 701 is described in detail, and the link mechanism 701 includes set on described
Link transmission axis 37 in linkage transmission chamber 700,37 bottom end of link transmission axis are installed with first connecting rod bevel gear 36,
Third control 29 right end of transmission shaft is installed with second connecting rod bevel gear 35, the second connecting rod bevel gear 35 and described first
Connecting rod bevel gear 36 engages, and 37 top of link transmission axis is installed with third connecting rod bevel gear 67, the linkage transmission
It is equipped with rotatable first connecting rod locating shaft 71 in chamber 700, fourth link cone tooth is installed on the first connecting rod locating shaft 71
Wheel 68, the fourth link bevel gear 68 engages with the third connecting rod bevel gear 67,71 outer wall of first connecting rod locating shaft
On be installed with first connecting rod 72, the first connecting rod 72 can drive the clamp system 801 to rotate.
According to embodiment, clamp system 801 is described in detail below, the clamp system 801 includes set on described
Second connecting rod 74 in working chamber 800, the second connecting rod 74 are cut with scissors by second connecting rod locating shaft 73 and the first connecting rod 72
It connects, rotatable third connecting rod 76 is equipped in the working chamber 800, the third connecting rod 76 is cut with scissors by third connecting rod locating shaft 75
It connects on 800 bottom wall of working chamber, 76 top of third connecting rod is hinged on described second by fourth link locating shaft 77
On connecting rod 74,74 right end of second connecting rod is installed with fixture 78, and then for clamping the chip substrate 34.
According to embodiment, push transmission mechanism 401 is described in detail below, the push transmission mechanism 401 includes
The first rack-driving axis 43 in the drive cavity 400,43 left end of the first rack-driving axis are installed with the first rack gear
Bevel gear 42, the drive cavity 400 is interior and is installed with the second rack gear bevel gear 41 positioned at 23 lower end of second driving shaft, described
Second rack gear bevel gear 41 can engage with the first rack gear bevel gear 42, and 43 right end of the first rack-driving axis is installed with
Three rack gear bevel gears 44, the drive cavity 400 is interior to be equipped with rotatable second rack-driving axis 47, the second rack-driving axis
The 4th rack gear bevel gear 45 is installed on 47, the 4th rack gear bevel gear 45 can engage with the third rack gear bevel gear 44,
It is installed with the first rack gear belt wheel 46 on second rack-driving axis, 47 outer wall, is arranged with rack gear on the first rack gear belt wheel 46
Belt 48, and then power is passed into the delivery device 601 by the rack gear belt 48.
According to embodiment, delivery device 601 is described in detail below, the delivery device 601 includes set on described
The third rack-driving axis 51 in chamber 600 is pushed, is installed with the second rack gear belt wheel 49 on the third rack-driving axis 51, it is described
Second rack gear belt wheel 49 is connected with the rack gear belt 48, and 600 lower wall of push chamber is equipped with slidable rack gear push plate 52, into
And when the rack gear push plate 52 horizontally slips, the encapsulation cover plate 25 in the package board storage chamber 900 can be pushed to described
34 top of the chip substrate in working chamber 800.
According to embodiment, cam mechanism 802 is described in detail below, the cam mechanism 802 includes set on described
Camshaft 13 in working chamber 800 is installed with cam bevel gear 12,15 left end of main shaft and position on the camshaft 13
In being installed with the second cam bevel gear 14 in the working chamber 800, the cam bevel gear 12 and the second cam bevel gear
14 engage, and are installed with cam 11 on the camshaft 13.
According to embodiment, pressing mechanism 804 is described in detail below, the pressing mechanism 804 includes set on described
Pressurizing piston 38 in working chamber 800,38 inner elastomeric of pressurizing piston are connected with reset spring 39.
Below in conjunction with Fig. 1 to Fig. 4 to the use step of the high protectiveness sealed in unit of one of this paper silicon base chip group
It is described in detail:
The operation of main motor 19 drives main shaft 15 to rotate, and main shaft 15 drives the second cam bevel gear 14, second control cone
Gear 16, first controls bevel gear 18, first bevel gear 20 and rotates simultaneously, and first bevel gear 20 passes through second bevel gear 21, the
One transmission shaft 22, third hand tap gear 26, first control bevel gear 27, control transmission shaft 28, second controls bevel gear 53, first and controls
Bevel gear 55, first processed controls locating shaft 54 and the first control gear 56 is driven to rotate, the flank of tooth on the first control gear 56 and the
Two control gears 57 periodically engagements, and then drive the second control 57 periodic rotary of gear, the second control gear 57 pass through the
One control belt wheel 58, second controls locating shaft 59, the first belt 60, second control belt wheel 61 and then third is driven to control locating shaft
62 rotations, third control locating shaft 62 and the second control bevel gear 63 are driven to rotate, and the second control bevel gear 63 is controlled by third
Bevel gear 64 drives the second control transmission shaft 32 to rotate, and the second control transmission shaft 32 drives 31 turns of feed belt by transmission wheel 33
It is dynamic, and then chip substrate 34 may make to slide into designated position on feed belt 31, meanwhile, the second control transmission shaft 32 passes through
Third, which controls gear the 65, the 4th and controls gear 66, drives third control transmission shaft 29 to rotate, and third controls transmission shaft 29 by the
Two connecting rod bevel gears 35, first connecting rod bevel gear 36, link transmission axis 37, third connecting rod bevel gear 67 and then drive fourth link
Bevel gear 68 rotates, and fourth link bevel gear 68 drives first connecting rod locating shaft 71 and first connecting rod 72 to rotate, first connecting rod 72
Pass through second connecting rod locating shaft 73, third connecting rod locating shaft 75, third connecting rod 76, fourth link locating shaft 77, second connecting rod 74
And then fixture 78 is driven to clamp chip substrate 34 downwards, at this point, the first control gear 56 is separated with the second control gear 57, in turn
So that feed belt 31 stops operating, chip substrate 34 is by clamping to be processed in designated position etc., while the second control bevel gear
16 engage with the 4th bevel gear 17, and the 4th bevel gear 17 passes through second driving shaft 23, the second rack gear bevel gear 41, the first rack gear cone
Gear 42, the first rack-driving axis 43, third rack gear bevel gear 44 drive the rotation of the 4th rack gear bevel gear 45, and the 4th rack gear bores tooth
Wheel 45 drives third rack gear by the first rack gear belt wheel 46, the second rack-driving axis 47, rack gear belt 48, the second rack gear belt wheel 49
Transmission shaft 51 rotates counterclockwise, and third rack-driving axis 51 is slided with carry-over bar push plate 52 to the left in turn, and rack gear push plate 52 pushes
Encapsulation cover plate 25 in package board storage chamber 900 is slided into the left on chip substrate 34, while the second cam bevel gear 14 passes through
Cam bevel gear 12, camshaft 13, band moving cam 11 rotate, and 11 top of cam pushes pressurizing piston 38 to overcome reset spring 39
Pre set force slide downward, and then encapsulation cover plate 25 is pressed on chip substrate 34, then process finishing, pressurizing piston 38 pass through
Reset spring 39 resets, and the first control bevel gear 18 engages with the 4th bevel gear 17, and then passes through second driving shaft 23, the second tooth
Article bevel gear 41, the first rack gear bevel gear 42, the first rack-driving axis 43, third rack gear bevel gear 44, the 4th rack gear bevel gear
45, the first rack gear belt wheel 46, the second rack-driving axis 47, rack gear belt 48, the second rack gear belt wheel 49 drive third rack-driving
Axis 51 rotates clockwise, and third rack-driving axis 51 slides to the right with carry-over bar push plate 52, and retraction pushes in chamber 600, is stored in
Encapsulation cover plate 25 in package board storage chamber 900 slides down to 900 bottom end of package board storage chamber, the first control with gravity
Gear 56 processed is periodically engaged with the second control gear 57 again, and then passes through the first control control positioning of belt wheel 58, second
Axis 59, the first belt 60, second control belt wheel 61, third control locating shaft 62, second control bevel gear 63, third control cone tooth
Wheel 64 drives the second control transmission shaft 32 to rotate, and second controls transmission shaft 32 and then transmission wheel 33 and feed belt 31 is driven to continue
Rotation, meanwhile, the second control transmission shaft 32 controls the control of gear the 65, the 4th gear 66 by third, third controls transmission shaft 29,
Second connecting rod bevel gear 35, first connecting rod bevel gear 36, link transmission axis 37, third connecting rod bevel gear 67 drive fourth link cone
Gear 68 rotates, and fourth link bevel gear 68 drives clamp system 801 by first connecting rod locating shaft 71, first connecting rod 72
Operation, so that fixture 78 is separated with the chip substrate 34 processed, chip substrate 34 is transplanted on down together by feed belt 31
Process, whole device enter next fabrication cycles process.
The beneficial effects of the present invention are: the configuration of the present invention is simple, maintenance convenience is easy to use, silicon base chip can be made close
In the environment closed, processing encapsulation not will receive extraneous factor interference, and whole process is automatical and efficient, is not necessarily to human interaction, together
When device internal structure stablize, injury will not be generated to chip, be capable of being packaged silicon base chip of safety and stability, mention significantly
High product qualified rate has saved the production cost of factory, improves the utilization rate of raw material.
The above, the specific embodiment only invented, but invent protection scope be not limited thereto, it is any without
The change or replacement that creative work is expected are crossed, should all be covered within the protection scope of invention.Therefore, the protection scope of invention
It should be determined by the scope of protection defined in the claims.
Claims (10)
1. a kind of high protectiveness sealed in unit of silicon base chip group of the invention, including cabinet, interior be equipped with of the box top wall is moved
Power chamber, interior be equipped with of the power cavity can provide the power mechanism of power for device, control chamber is equipped in the cabinet lower wall, described
Control mechanism is equipped in control chamber；
It is equipped with drive cavity in the power cavity lower wall, is equipped in the drive cavity and pushes transmission mechanism, in the drive cavity lower wall
Equipped with push chamber, the push is intracavitary to be equipped with delivery device, is equipped with package board storage chamber, the encapsulation in the drive cavity left wall
The cushion that can provide buffer function is equipped at left and right sides of plate storage chamber in wall, is stacked with cap in the package board storage chamber
Plate；
The package board storage chamber left wall connection is equipped with working chamber, is equipped with cam mechanism, the work in the working chamber roof
It is intracavitary and be located at the cam mechanism lower end be equipped with pressing mechanism, the working chamber lower wall be equipped with transport mechanism, the conveyer
It is equipped with chip substrate above structure, the clamp system for the chip substrate that can be fixedly clamped is equipped in the working chamber left wall；
Linkage transmission chamber is equipped in the cabinet left wall, the linkage transmission is intracavitary to be equipped with link mechanism.
2. a kind of high protectiveness sealed in unit of silicon base chip group as described in claim 1, it is characterised in that: the engine
Structure includes the main motor in the power cavity, and the main motor is equipped with rotatable main shaft, the main shaft
Right end is installed with first bevel gear, is equipped with rotatable first transmission shaft in the power cavity, first transmission shaft top and
Second bevel gear is installed in the power cavity, the second bevel gear is engaged with the first bevel gear；
First transmission shaft bottom end is installed with third hand tap gear, and the third hand tap gear can impart power to the control machine
Structure, the power cavity is interior and the first control bevel gear is installed on the main shaft outer wall, in the power cavity and position
In being installed with the second control bevel gear on the main shaft outer wall, it is equipped with rotatable second driving shaft in the power cavity,
The second driving shaft top and it is located in the power cavity and is installed with the 4th bevel gear, the 4th bevel gear can be with described the
Two control bevel gears or the first control bevel gear alternately engage.
3. a kind of high protectiveness sealed in unit of silicon base chip group as described in claim 1, it is characterised in that: the control machine
Structure includes the control transmission shaft in the control chamber, and the control transmission shaft right end is installed with the first control bevel gear, institute
The first control bevel gear is stated to engage with the third hand tap gear；
The control transmission shaft left end is installed with the second control bevel gear, and it is fixed that rotatable first control is equipped in the control chamber
Position axis is installed with the first control bevel gear on the first control locating shaft, the first control bevel gear and second control
Bevel gear engagement processed；
It is installed with the first control gear on the first control locating shaft outer wall, slidable second control is equipped in the control chamber
Locating shaft processed is installed with the second control gear on the first control belt wheel, the second control gear and first control
Gear engagement；
It is installed with the first control belt wheel on the second control locating shaft outer wall, is equipped with rotatable third control in the control chamber
Locating shaft processed, the third control and are installed with the second control belt wheel on locating shaft, the second control belt wheel and first control
Belt wheel processed is connected by the first belt；
It is installed with the second control bevel gear on the third control locating shaft outer wall, is equipped with rotatable second in the working chamber
Transmission shaft is controlled, the second control transmission shaft right end is installed with third control bevel gear, the third control bevel gear and institute
State the engagement of the second control bevel gear；
Described second controls transmission shaft outer wall and is installed with third control gear in the control chamber, sets in the control chamber
There is rotatable third control transmission shaft, the 4th control gear, the 4th control are installed on the third control transmission shaft
Gear is engaged with third control gear.
4. a kind of high protectiveness sealed in unit of silicon base chip group as described in claim 1, it is characterised in that: the conveyer
Structure includes the second control transmission shaft in the working chamber, and the second control transmission shaft outer wall is equipped with transmission
It takes turns, is equipped with feed belt in the transmission wheel, the chip substrate is placed on the feed belt.
5. a kind of high protectiveness sealed in unit of silicon base chip group as described in claim 1, it is characterised in that: the connecting rod machine
Structure includes the link transmission axis intracavitary set on the linkage transmission, and link transmission axis bottom end is installed with first connecting rod cone
Gear, the third control transmission shaft right end are installed with second connecting rod bevel gear, the second connecting rod bevel gear and described first
The engagement of connecting rod bevel gear；
Link transmission axis top is installed with third connecting rod bevel gear, and the linkage transmission is intracavitary to be equipped with rotatable the
One connecting rod locating shaft is installed with fourth link bevel gear, the fourth link bevel gear and institute on the first connecting rod locating shaft
The engagement of third connecting rod bevel gear is stated, is installed with first connecting rod on the first connecting rod locating shaft outer wall.
6. a kind of high protectiveness sealed in unit of silicon base chip group as described in claim 1, it is characterised in that: the clamping machine
Structure includes the second connecting rod in the working chamber, and the second connecting rod passes through second connecting rod locating shaft and the first connecting rod
Hingedly, rotatable third connecting rod is equipped in the working chamber, the third connecting rod is hinged on institute by third connecting rod locating shaft
It states in cabinet left wall, the third connecting rod top is hinged on the second connecting rod by fourth link locating shaft, and described second
Connecting rod right end is installed with fixture.
7. a kind of high protectiveness sealed in unit of silicon base chip group as described in claim 1, it is characterised in that: the push passes
Motivation structure includes the first rack-driving axis in the drive cavity, and the first rack-driving axis left end is installed with the first tooth
Bevel gear in the drive cavity and is located at the second driving shaft lower end and is installed with the second rack gear bevel gear, second tooth
Bevel gear can engage with the first rack gear bevel gear；
The first rack-driving axis right end is installed with third rack gear bevel gear, is equipped with rotatable second tooth in the drive cavity
Transmission shaft, is installed with the 4th rack gear bevel gear on the second rack-driving axis, the 4th rack gear bevel gear can with it is described
Third rack gear bevel gear engages, and is installed with the first rack gear belt wheel, the first rack gear band on the second rack-driving axis outer wall
Rack gear belt is arranged on wheel.
8. a kind of high protectiveness sealed in unit of silicon base chip group as described in claim 1, it is characterised in that: the pusher
Structure includes the third rack-driving axis intracavitary set on the push, is installed with the second rack gear band on the third rack-driving axis
Wheel, the second rack gear belt wheel are connected with the rack gear belt, and the push chamber lower wall is equipped with slidable rack gear push plate.
9. a kind of high protectiveness sealed in unit of silicon base chip group as described in claim 1, it is characterised in that: the cam machine
Structure includes the camshaft in the working chamber, is installed with cam bevel gear, the main shaft left end on the camshaft
And be located in the working chamber and be installed with the second cam bevel gear, the cam bevel gear nibbles with the second cam bevel gear
It closes, is installed with cam on the camshaft.
10. a kind of high protectiveness sealed in unit of silicon base chip group as described in claim 1, it is characterised in that: the pressurization
Mechanism includes the pressurizing piston in the working chamber, and the pressurizing piston inner elastomeric is connected with reset spring.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910542883.1A CN110137093B (en) | 2019-06-21 | 2019-06-21 | High-protectiveness packaging equipment for silicon-based chip set |
| GBGB1912208.4A GB201912208D0 (en) | 2019-06-21 | 2019-08-27 | A high protective packaging device for silicon-based chipsets |
| GBGB1912210.0A GB201912210D0 (en) | 2019-06-21 | 2019-08-27 | A high protective packaging device for silicon-based chipsets |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910542883.1A CN110137093B (en) | 2019-06-21 | 2019-06-21 | High-protectiveness packaging equipment for silicon-based chip set |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110137093A true CN110137093A (en) | 2019-08-16 |
| CN110137093B CN110137093B (en) | 2020-11-03 |
Family
ID=67579038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910542883.1A Active CN110137093B (en) | 2019-06-21 | 2019-06-21 | High-protectiveness packaging equipment for silicon-based chip set |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110137093B (en) |
| GB (2) | GB201912210D0 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110970377A (en) * | 2019-12-18 | 2020-04-07 | 冯聪 | Packaging device convenient for packaging integrated circuit chip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108376650A (en) * | 2018-01-29 | 2018-08-07 | 梁瑞城 | A kind of small outline integrated circuit packaging system |
| CN108417513A (en) * | 2018-03-13 | 2018-08-17 | 南安泉鸿孵化器管理有限公司 | A kind of integrated chip package equipment |
| CN108565240A (en) * | 2018-05-06 | 2018-09-21 | 莆田市长吉贸易有限公司 | The tube supplying device of expects pipe in integrated antenna package equipment |
| CN208240716U (en) * | 2018-04-04 | 2018-12-14 | 南安艺同工业产品设计有限公司 | A kind of LED sealed in unit |
-
2019
- 2019-06-21 CN CN201910542883.1A patent/CN110137093B/en active Active
- 2019-08-27 GB GBGB1912210.0A patent/GB201912210D0/en not_active Ceased
- 2019-08-27 GB GBGB1912208.4A patent/GB201912208D0/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108376650A (en) * | 2018-01-29 | 2018-08-07 | 梁瑞城 | A kind of small outline integrated circuit packaging system |
| CN108417513A (en) * | 2018-03-13 | 2018-08-17 | 南安泉鸿孵化器管理有限公司 | A kind of integrated chip package equipment |
| CN208240716U (en) * | 2018-04-04 | 2018-12-14 | 南安艺同工业产品设计有限公司 | A kind of LED sealed in unit |
| CN108565240A (en) * | 2018-05-06 | 2018-09-21 | 莆田市长吉贸易有限公司 | The tube supplying device of expects pipe in integrated antenna package equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110970377A (en) * | 2019-12-18 | 2020-04-07 | 冯聪 | Packaging device convenient for packaging integrated circuit chip |
Also Published As
| Publication number | Publication date |
|---|---|
| GB201912210D0 (en) | 2019-10-09 |
| GB201912208D0 (en) | 2019-10-09 |
| CN110137093B (en) | 2020-11-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106043827B (en) | A kind of packed in cases device and packing method for different specification size | |
| CN204727591U (en) | A kind of automatic filling sealing machine | |
| CN203439323U (en) | Full-automatic plastic uptake sealing packing machine | |
| CN202244163U (en) | Electronic component feeding device for braider and full-automatic braider comprising electronic component feeding device | |
| CN105346748B (en) | A kind of adjustable babinet automatic cover-folding molding machine | |
| CN110137093A (en) | A kind of high protectiveness sealed in unit of silicon base chip group | |
| CN202593892U (en) | Rotary-type blister shell sealing machine | |
| CN203094490U (en) | Candy packing machine | |
| CN106044248B (en) | It is a kind of to divide lid arrangement for gift box | |
| CN101708782B (en) | Tea bag horizontal intermittent movement mechanism and tea bag horizontal position transfer method | |
| CN202923924U (en) | Bag upper portion opening device of bag feeding type full-automatic packaging machine | |
| CN101417716B (en) | Sub clip space length once automatic regulation mechanism | |
| CN208359578U (en) | A kind of mold cavity forming device of type chamber unit and its composition | |
| CN108820316B (en) | Intermittent type formula is from pressing from both sides material loading mobile device | |
| CN101016092A (en) | Sub-clip distance regulating mechanism for bag feeding type full automatic packaging machine | |
| CN215707563U (en) | Fixing device of packing carton with rotation function | |
| CN1986379A (en) | Mixed driven cover turning apparatus suitable for different bottle mouth threads | |
| CN211309148U (en) | Carton production is with joint sealing device of fixed carton of being convenient for | |
| CN109305416A (en) | A kind of advanced tea packaging machine | |
| CN202624703U (en) | Bag supply type packaging machine | |
| CN206766473U (en) | The storing mechanism of automatic packaging machine | |
| CN207089781U (en) | Take case shaping mechanism | |
| CN203032970U (en) | Controllable adjustable material pushing mechanism | |
| CN104442041A (en) | Self-service printer for packaging carton | |
| CN109397748A (en) | A kind of advanced carton customization machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20201012 Address after: 322000 1st floor, No.1-2, building 9, Beiyuan business district, Beiyuan street, Yiwu City, Jinhua City, Zhejiang Province Applicant after: Zhejiang Jinguo Intellectual Property Co.,Ltd. Address before: Room 602-B595, Comprehensive Office Building, Fuzhou Export Processing Zone, 177 Changyang Road, Tingjiang Town, Mawei District, Fuzhou City, Fujian Province Applicant before: Fuzhou Economic and Technological Development Zone Meimexuan Stationery Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A high protective packaging device for silicon-based chipset Effective date of registration: 20211222 Granted publication date: 20201103 Pledgee: Zhejiang Yiwu Rural Commercial Bank Co.,Ltd. Pledgor: Zhejiang Jinguo Intellectual Property Co.,Ltd. Registration number: Y2021330002594 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230915 Granted publication date: 20201103 Pledgee: Zhejiang Yiwu Rural Commercial Bank Co.,Ltd. Pledgor: Zhejiang Jinguo Intellectual Property Co.,Ltd. Registration number: Y2021330002594 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |