CN110136586B - Backlight assembly, display module and electronic equipment - Google Patents
Backlight assembly, display module and electronic equipment Download PDFInfo
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- CN110136586B CN110136586B CN201910447951.6A CN201910447951A CN110136586B CN 110136586 B CN110136586 B CN 110136586B CN 201910447951 A CN201910447951 A CN 201910447951A CN 110136586 B CN110136586 B CN 110136586B
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- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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Abstract
The application provides a backlight assembly for electronic equipment, which comprises a back plate, a light source, a wiring structure and a screen group FPC, wherein the back plate is provided with a through hole; the light source is arranged on one side of the back plate; the routing structure is filled in the through hole; the screen group FPC is arranged on one side of the back plate far away from the light source; the wiring structure is connected with the light source and the FPC of the screen group. The backlight assembly provided by the application has better heat dissipation capability and is lighter and thinner. In addition, this application still provides a display module assembly and electronic equipment.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a backlight assembly, a display module and electronic equipment.
Background
The backlight assembly is used as an important component in the display module assembly and provides a light source for normal display of the electronic equipment, the light source in the backlight assembly can generate a large amount of heat in the working process, and the heat is discharged in time, so that the temperature of the display module assembly of the electronic equipment is too high, and the service life of the whole display module assembly is influenced.
Disclosure of Invention
The embodiment of the application provides a backlight assembly for electronic equipment, which comprises a back plate, a light source, a wiring structure and a screen assembly FPC, wherein the back plate is provided with a through hole; the light source is arranged on one side of the back plate; the routing structure is filled in the through hole; the screen group FPC is arranged on one side of the back plate far away from the light source; the wiring structure is connected with the light source and the FPC of the screen group.
On the other hand, the embodiment of the application provides a display module assembly for electronic equipment, the display module assembly includes display module and above backlight unit, display module assembly includes array substrate and driver chip, array substrate reaches driver chip with the light source is located same one side of backplate.
In addition, this application embodiment still provides an electronic equipment, electronic equipment includes the casing and above the display module assembly, the casing with the display module assembly encloses jointly and establishes a accommodation space, accommodation space is used for the holding electronic equipment's other subassemblies.
The backlight assembly provided by the embodiment of the application does not need to arrange the FPC and the double faced adhesive tape between the light source and the back plate, but directly arranges the light source on the back plate, so that heat generated by the light source in the working process can be timely discharged from the back plate, the heat dissipation effect is good, and the backlight assembly is lighter and thinner.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a backlight assembly provided in an embodiment of the present application;
FIG. 2 is a schematic top view of the backlight assembly of FIG. 1;
FIG. 3 is another schematic top view of the backlight assembly of FIG. 1;
FIG. 4 is a schematic view of the connection relationship between the light source and the FPC of the panel assembly of FIG. 1;
FIG. 5 is an enlarged schematic view of a portion of the structure of FIG. 1;
FIG. 6 is another schematic structural view of a portion of the structure of FIG. 1;
FIG. 7 is another schematic structural view of a portion of the structure of FIG. 1;
FIG. 8 is another schematic structural view of a portion of the structure of FIG. 1;
fig. 9 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;
fig. 10 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.
Detailed Description
It should be noted that "electronic device" in this application includes, but is not limited to, devices that are configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). Such as smart phones, tablets, laptops, wearable devices, and the like.
The inventor finds that in order to improve the heat dissipation effect of the backlight assembly, the light source can be reversely mounted, namely the light source is fixed on the FPC, and then the FPC is fixed on the back plate through the heat-conducting double-sided adhesive tape. Although the scheme is more favorable for heat dissipation than the light source is arranged normally (the light source is fixed on the supporting plate above the back plate, and an air gap exists between the light source and the back plate), the FPC and the double-sided adhesive tape still exist between the light source and the back plate to block heat transmission, and the heat dissipation capability of the backlight assembly needs to be further improved.
In order to further improve the heat dissipation capability of the backlight assembly, the embodiment of the application provides the backlight assembly. The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a backlight assembly 100 according to an embodiment of the present disclosure. The embodiment of the application provides a backlight assembly 100 for an electronic device 1000, where the backlight assembly 100 includes a back plate 10, a light source 20, a routing structure 30, and a screen assembly FPC40, and the back plate 10 is provided with a through hole 13; the light source 20 is arranged on one side of the back plate 10; the routing structure 30 is filled in the through hole 13; the screen group FPC40 is arranged on one side of the back plate 10 far away from the light source 20; the routing structure 30 connects the light source 20 and the panel group FPC 40. It is noted that the terms "comprises" and "comprising," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
Specifically, the back plate 10 may include a bottom plate 11 and a side plate 12, and the bottom plate 11 and the side plate 12 jointly enclose to form an accommodating space (not shown in the drawings). The back plate 10 mainly plays a bearing role, and the material of the back plate can be plastic or metal. Optionally, in this embodiment of the application, the material of the back plate 10 is metal, and the heat conductivity is better. For example, the material of the back plate 10 may be stainless steel. The number of the through holes 13 may be one or more, and in the description of the present application, "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. It should be understood that, although the backlight assembly 100 in fig. 1 only shows one through hole 13, fig. 1 is only a schematic diagram of the embodiment of the present application, the number of the through holes 13 may be two, three, four, etc., or even more, and the embodiment of the present application does not limit the number of the through holes 13, and may be selected according to actual requirements.
Referring to fig. 1, fig. 2 and fig. 3, the light source 20 is disposed in the accommodating space, and the light source 20 may be fixed on the bottom plate 11 or the side plate 12. Optionally, in the embodiment of the present application, the light source 20 is fixed on the bottom plate 11. The light source 20 may include one or more LED light bars, each of which may include one or more LED light beads. As shown in fig. 1 and 2, the light source 20 may include an LED light bar; as shown in fig. 3, the light source 20 may include two LED light bars; it can be understood that fig. 1, fig. 2 and fig. 3 are only schematic diagrams of the embodiment of the present application, and the light source 20 may also include three LED light bars, four LED light bars, five LED light bars, and the like, or even more, and the number of the LED light bars in the light source 20 is not limited in the embodiment of the present application, and may be selected according to actual requirements. In addition, this application embodiment does not do the restriction to the number of the LED lamp pearl that every LED lamp strip includes, for example, can be that every LED lamp strip can include four LED lamp pearls, five LED lamp pearls, six LED lamp pearls and so on, can select according to actual demand.
It should be noted that the number of the through holes 13 is at least equal to the number of the LED light bars, so as to ensure that the LED light bars are controlled independently. For example, if the light source 20 includes four LED light bars, the number of the through holes 13 is at least four; if the light source 20 includes five LED light bars, the number of the through holes 13 is at least five.
Referring to fig. 1, fig. 2 and fig. 3, the routing structure 30 is filled in the through hole 13, and the routing structure 30 and the light source 20 are connected to each other. The number of the routing structures 30 may be one or more. As shown in fig. 1 and fig. 2, the number of the routing structures 30 is one; as shown in fig. 3, the number of the routing structures 30 is two, and the two routing structures 30 are separated from each other, so that the two corresponding LED light bars can be independently controlled. It can be understood that fig. 1, fig. 2 and fig. 3 are only schematic diagrams of the present application, the number of the routing structures 30 may also be three, four, five, and the like, or even more, and the number of the routing structures 30 in the present application is not limited, and can be selected according to actual requirements.
It should be noted that the number of the routing structures 30 is equal to the number of the LED light bars, and when the number of the routing structures 30 is multiple, each routing structure 30 is separately arranged, so that the corresponding LED light bars can be independently controlled. For example, if the light source 20 includes four LED light bars, the number of the routing structures 30 is four, and the routing structures 30 are separated from each other; if the light source 20 includes five LED light bars, the number of the routing structures 30 is five, and the routing structures 30 are separated from each other.
Specifically, the routing structure 30 may be formed by first providing a metal film and then etching, or formed by using a local metal plating method, that is, a metal plating layer is formed at a position where the routing structure 30 is needed. The routing structure 30 may be made of a metal material with good conductivity, such as molybdenum, aluminum, silver, and the like. For example, in the embodiment of the present application, the material of the trace structure 30 is silver. It can be understood that the routing structure 30 may also be made of other materials, and the material of the routing structure 30 is not limited in this embodiment, and may be selected according to actual requirements.
The screen group FPC40 is disposed outside the accommodating space, specifically on one side of the bottom plate 11 away from the light source 20. The panel group FPC40 is connected to the routing structure 30. The substrate of the FPC40 may be at least one of polyimide, polyethylene terephthalate, aramid fiber ester and polyvinyl chloride, and the surface of the substrate is covered with a conductive pattern formed by a chemical etching method. The screen group FPC40 can be a single-layer FPC or a multi-layer FPC, and the size, thickness, softness and specific type of the screen group FPC40 are not limited in the embodiment of the application and can be selected according to actual requirements.
The backlight assembly 100 provided in the embodiment of the present application does not need to set an FPC and a double-sided tape between the light source 20 and the back plate 10, but directly sets the light source 20 on the back plate 10, so that heat generated by the light source 20 in the working process can be timely discharged through the back plate 10, the heat dissipation effect is good, and the backlight assembly 100 is made thinner and lighter.
Referring to fig. 4, fig. 4 is a schematic diagram illustrating a connection relationship between the light source 20 and the FPC40 of the panel assembly in fig. 1. Optionally, the backlight assembly 100 further includes a connection FPC90, the connection FPC90 is disposed on a side of the rear panel 10 away from the light source 20, and the routing structure 30 is connected to the screen group FPC40 through the connection FPC 90. Specifically, the light source 20 and the routing structure 30 are connected to each other; the connection FPC90 has two exposed pins, one of which is connected to the panel FPC40, and the other of which is connected to the routing structure 30, so that the routing structure 30 and the panel FPC40 are connected to each other, and finally, the connection between the light source 20 and the panel FPC40 is achieved.
It is understood that when the light source 20 is fixed on the base plate 11, since the panel set FPC40 is provided on the side of the base plate 11 away from the light source 20, the connection between the light source 20 and the panel set FPC40 can be achieved without bending the connection FPC 90. When the light source 20 is fixed to the side plate 12, on one hand, an increase in thickness of the backlight assembly 100 may result; on the other hand, since the light source 20 is fixed on the side plate 12, and the panel group FPC40 is disposed on the side of the bottom plate 11 away from the light source 20, the connection FPC90 must be bent to connect the light source 20 and the panel group FPC40, the bending requires a certain space, which is not favorable for the light and thin backlight assembly 100, and the connection between the light source 20 and the panel group FPC40 using the bent connection FPC90 is not favorable for the reliability of the connection between the light source 20 and the panel group FPC 40.
Referring to fig. 1, optionally, the backlight assembly 100 further includes a light guide plate 50, an optical film set 60 and a reflective film 70, the light guide plate 50 and the light source 20 are disposed on the same side of the back plate 10, the light guide plate 50 includes a first surface 51, a second surface 52 and a side surface 53 connecting the first surface 51 and the second surface 52, the light emitted from the light source 20 enters the light guide plate 50 from the side surface 53 and is emitted out of the light guide plate 50 through the first surface 51; the optical film group 60 comprises a first antireflection film 61, a second antireflection film 62 and a diffusion film 63 which are sequentially stacked, wherein the diffusion film 63 covers the first surface 51; the reflective film 70 covers the second surface 52.
Specifically, the light guide plate 50 is disposed in the accommodating space, and the light source 20 is located at one side of the light guide plate 50. The light guide plate 50 is used for changing the transmission direction of light rays, so that the light rays incident from the side surface 53 are emitted from the first surface 51. The material of the light guide plate 50 may be any one or more of polyethylene, polycarbonate, polymethyl methacrylate, and cyclic olefin polymer, and may be selected according to actual needs.
The optical film set 60 is disposed in the accommodating space and covers the first surface 51, so that light emitted from the first surface 51 becomes more uniform and softer. The reflective film 70 is disposed in the accommodating space, covers the second surface 52, and is used for reflecting light reaching the second surface 52, so as to improve the utilization rate of the light source 20 and achieve the effects of light reflection and brightness enhancement.
It should be noted that, although the light source 20 is located at one side of the light guide plate 50 in fig. 1, the light emitted from the light source 20 enters the light guide plate 50 from the side surface 53 and is emitted out of the light guide plate 50 through the first surface 51, fig. 1 is only a schematic diagram of an embodiment of the present application. The light source 20 may also be located between the light guide plate 50 and the back plate 10, and the light emitted from the light source 20 enters the light guide plate 50 from the second surface 52 and is emitted out of the light guide plate 50 through the first surface 51. It is understood that the light sources 20 can also be located on two opposite sides of the light guide plate 50, and the light emitted from the light sources 20 enters the light guide plate 50 from two opposite sides 53 and is emitted out of the light guide plate 50 through the first surface 51. In summary, the relative position relationship between the light source 20 and the light guide plate 50 is not limited in the embodiments of the present application, and can be selected according to actual requirements.
Referring to fig. 5, fig. 5 is an enlarged schematic structural diagram of a portion of the structure in fig. 1. Optionally, the routing structure 30 further includes a first routing layer 31, a second routing layer 32 and a connection routing 33, where the first routing layer 31 is disposed between the backplane 10 and the light source 20; the second wiring layer 32 is arranged between the back plate 10 and the FPC40 of the screen group; the connection trace 33 is disposed in the through hole 13, and the connection trace 33 connects the first routing layer 31 and the second routing layer 32. It should be noted that the terms "first", "second" and "third" in the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature.
Specifically, the first wiring layer 31 and the light source 20 are connected to each other; the second wiring layer 32 and the screen group FPC40 are connected with each other; the first routing layer 31 and the second routing layer 32 are connected with each other through the connecting routing 33; finally, the routing structure 30 connects the light source 20 and the panel group FPC 40.
Optionally, a projection of the first routing layer 31 on the backplane 10 overlaps or approximately overlaps a projection of the second routing layer 32 on the backplane 10, so as to facilitate the processing and shaping of the routing structure 30. Specifically, the embodiment of the present application does not limit the forming method of the trace structure 30. For example, the first routing layer 31 may be formed on one side of the backplane 10 by local electroplating, and then the second routing layer 32 may be formed on the other side of the backplane 10 by local electroplating; the first routing layer 31 and the second routing layer 32 may be formed by performing partial plating on both sides of the backplane 10 at the same time.
Referring to fig. 6, fig. 6 is another schematic structural diagram of a portion of the structure shown in fig. 1. Optionally, the backlight assembly 100 further includes a first insulating layer 81, and the first insulating layer 81 is sandwiched between the back plate 10 and the routing structure 30. The first insulating layer 81 is mainly used for isolating the interference of the back plate 10 to the electrical signals transmitted between the light source 20 and the screen group FPC 40. The material of the first insulating layer 81 is not limited in the embodiment of the present application, and the material of the first insulating layer 81 may be a non-conductive plastic, such as polyimide.
Referring to fig. 7, fig. 7 is another structural schematic diagram of a portion of the structure shown in fig. 1. Optionally, the backlight assembly 100 further includes a second insulating layer 82, and the second insulating layer 82 covers the first wiring layer 31. The second insulating layer 82 is mainly used for protecting the first routing layer 31 and preventing the first routing layer 31 from being corroded. The material of the second insulating layer 82 is not limited in the embodiment of the present application, and the material of the second insulating layer 82 may be a non-conductive plastic, such as polyimide.
Referring to fig. 1 and 7, optionally, the second insulating layer 82 further includes a first sub-insulating layer 821 corresponding to the second surface 52 and a second sub-insulating layer 822 far from the light guide plate 50. Further, the surface color of the first sub-insulating layer 821 may be white, and when the light emitted from the light source 20 enters the light guide plate 50 from the side surface 53 and is emitted out of the light guide plate 50 through the first surface 51, the surface color of the first sub-insulating layer 821 is white, which is favorable for reflecting the light reaching the surface of the first sub-insulating layer 821, improving the utilization rate of the light source 20, and playing a role of brightness enhancement.
Referring to fig. 8, fig. 8 is another structural schematic diagram of a portion of the structure in fig. 1. Optionally, the backlight assembly 100 further includes a third insulating layer 83, and the third insulating layer 83 covers the second routing layer 32. The third insulating layer 83 is mainly used to protect the second wiring layer 32 and prevent the second wiring layer 32 from being corroded. In the embodiment of the present disclosure, a material of the third insulating layer 83 is not limited, and the material of the third insulating layer 83 may be a non-conductive plastic, such as polyimide.
Referring to fig. 9, fig. 9 is a schematic structural diagram of a display module 200 according to an embodiment of the present disclosure. The embodiment of the present application further provides a display module 200, the display module 200 includes a display module 110 and the backlight assembly 100 described above, the display module 110 includes an array substrate 111 and a driving chip 112, the array substrate 111 and the driving chip 112 and the light source 20 are disposed on the same side of the back plate 10.
Specifically, the array substrate 111 may be a TFT array substrate 111. The embodiment of the present application does not limit the packaging method of the driving chip 112, and optionally, the packaging method of the driving chip 112 is cof (chip On film). Of course, the packaging method of the driving chip 112 may be any one of cob (chip On board), cog (chip On glass), tab (tape Automated bonding), and the like.
Referring to fig. 10, fig. 10 is a schematic structural diagram of an electronic device 1000 according to an embodiment of the present disclosure. The embodiment of the present application further provides an electronic device 1000, the electronic device 1000 includes a housing 300 and the display module 200, the housing 300 and the display module 200 together enclose to form an accommodating space 400, and the accommodating space 400 is used for accommodating other components of the electronic device 1000.
Specifically, the housing 300 refers to a rear case of the electronic device 1000. The display module 200 is mainly used for displaying, and further, the display module 200 may be further used for receiving an input instruction from a user. The housing 300 and the display module 200 are enclosed together to form an accommodating space 400, and the accommodating space 400 is used for accommodating other components (not shown) of the electronic device 1000, such as a printed circuit board, a chip, a battery, a camera, various sensors, and the like. It is understood that the electronic device 1000 may further include a middle frame, and the middle frame is located in the accommodating space 400 and is used for carrying a printed circuit board, a chip, a battery, a camera, various sensors, and the like, on one hand, and for connecting the housing 300 and the display module 200 on the other hand. Of course, the electronic device 1000 may not include a middle frame, and the housing 300 and the display module 200 are directly connected together.
The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A backlight assembly for an electronic device, the backlight assembly comprising:
the back plate is provided with a through hole;
the light sources are arranged on one side of the back plate;
the wiring structures are filled in the through holes, correspond to the light sources one by one, and are arranged in a separated mode;
the screen group FPC is arranged on one side of the back plate far away from the light source;
the wiring structure is connected with the light source and the FPC;
the connecting FPC is arranged on one side of the back plate far away from the light source;
the wiring structure is connected with the screen group FPC through the connection FPC.
2. The backlight assembly of claim 1, wherein the trace structure comprises:
the first wiring layer is arranged between the back plate and the light source;
the second wiring layer is arranged between the back plate and the FPC of the screen group;
and the connecting wires are arranged in the through holes and are connected with the first wiring layer and the second wiring layer.
3. The backlight assembly of claim 2, further comprising a first insulating layer sandwiched between the back plate and the trace structure.
4. The backlight assembly of claim 2, further comprising a second insulating layer covering the first routing layer.
5. The backlight assembly of claim 4, further comprising a light guide plate disposed on the same side of the back plate as the light source, wherein the light guide plate comprises a first surface, a second surface and a side surface connecting the first surface and the second surface, the first surface and the second surface being opposite to each other, the light source emits light into the light guide plate from the side surface and the light is emitted out of the light guide plate through the first surface, the second insulating layer comprises a first sub-insulating layer corresponding to the second surface and a second sub-insulating layer away from the light guide plate, and a surface of the first sub-insulating layer is white.
6. The backlight assembly of claim 5, further comprising a third insulating layer covering the second routing layer.
7. The backlight assembly of claim 1, further comprising:
the light guide plate and the light source are arranged on the same side of the back plate, the light guide plate comprises a first surface, a second surface and a side surface, the first surface and the second surface are arranged in a reverse mode, the side surface is connected with the first surface and the second surface, and light emitted by the light source enters the light guide plate from the side surface and is emitted out of the light guide plate through the first surface;
the optical film group comprises a first antireflection film, a second antireflection film and a diffusion film which are sequentially stacked, wherein the diffusion film is covered on the first surface;
and the reflective film is covered on the second surface.
8. The backlight assembly of claim 1, further comprising a graphite layer disposed between the back plate and the panel assembly FPC.
9. A display module for an electronic device, the display module comprising a display module and the backlight module of any one of claims 1 to 8, the display module comprising an array substrate and a driving chip, wherein the array substrate and the driving chip are disposed on the same side of the back plate as the light source.
10. An electronic device, comprising a housing and the display module of claim 9, wherein the housing and the display module together enclose a receiving space for receiving other components of the electronic device.
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| CN201910447951.6A CN110136586B (en) | 2019-05-27 | 2019-05-27 | Backlight assembly, display module and electronic equipment |
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| CN201910447951.6A CN110136586B (en) | 2019-05-27 | 2019-05-27 | Backlight assembly, display module and electronic equipment |
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| CN110136586A CN110136586A (en) | 2019-08-16 |
| CN110136586B true CN110136586B (en) | 2021-06-01 |
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| CN101042498A (en) * | 2006-03-21 | 2007-09-26 | 三星电机株式会社 | LED backlight unit without printed circuit board and method of manufacturing the same |
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| EP1884822A1 (en) * | 2006-08-01 | 2008-02-06 | Samsung Electronics Co., Ltd. | Side mold for backlight assembly, backlight assembly, assembly method thereof, and liquid crystal display |
| CN101013230A (en) * | 2007-01-18 | 2007-08-08 | 友达光电股份有限公司 | Display and backlight modular thereof |
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| CN110136586A (en) | 2019-08-16 |
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