CN110134209B - Protection process for CPU and slot - Google Patents
Protection process for CPU and slot Download PDFInfo
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- CN110134209B CN110134209B CN201910292861.4A CN201910292861A CN110134209B CN 110134209 B CN110134209 B CN 110134209B CN 201910292861 A CN201910292861 A CN 201910292861A CN 110134209 B CN110134209 B CN 110134209B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention relates to a protection process of a CPU and a slot, in particular to a process method for carrying out moisture-proof protection on a PGA (Pin Grid Array) desktop computer CPU and a slot. A protection process for a CPU and a slot, wherein the protection process coverage area comprises a CPU cover shell, a CPU body, a CPU slot and a mainboard, and the protection process comprises the following steps: (1) CPU pre-coating; (2) heating by a CPU; (3) sealing the CPU sealing structure; (4) pre-coating the slot; (5) heating integrally; (6) the slot is sealed by the sealant structure. The invention has the following advantages: 1. the electronic circuit part of the desktop computer CPU and the slot thereof is completely hermetically isolated from the outside, and the installation and the normal work of the CPU radiator are not influenced. 2. Through tests, the CPU treated by the protection process can normally work in a water vapor supersaturation environment with the relative humidity of 100% and liquid dewing in the air. 3. The protective material can be removed, and the protected components are not damaged in the protective removing process and the protective implementing process, so that the product repair is not influenced.
Description
Technical Field
The invention relates to a protection process of a CPU and a slot, in particular to a process method for carrying out moisture-proof protection on a PGA (Pin Grid Array) desktop computer CPU and a slot.
Background
The contact arrangement of a PGA (Pin Grid Array) desktop computer CPU and a slot is dense, the space in the slot is easy to store up water vapor in a humid environment, when the ambient temperature is reduced, the water vapor is condensed, a short circuit is easy to form between the contacts, and the CPU and other devices on a mainboard can be damaged in serious conditions.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provide a protection process for a CPU and a slot, which does not influence the normal work of the CPU and a mainboard.
In order to achieve the purpose, the invention adopts the following technical scheme: a protection process for a CPU and a slot, wherein the protection process coverage area comprises a CPU cover shell, a CPU body, a CPU slot and a mainboard, and the protection process comprises the following steps:
(1) pre-coating of CPU: coating a slit between the CPU cover shell and the CPU body with pouring sealant to form a CPU sealant structure, wherein a gap is reserved in the CPU sealant structure;
(2) heating by the CPU: heating the CPU, wherein the heating temperature is higher than the upper limit of the working temperature of the CPU, so that the gas below the CPU cover shell expands, and the redundant gas is emitted from the gap of the CPU sealing glue structure;
(3) sealing the CPU sealing glue structure: using the same pouring sealant to plug gaps of a CPU sealant structure under the condition of keeping the heating condition of the CPU, continuously preserving heat until the sealant is completely solidified, and then slowly cooling;
(4) pre-coating the slot: loading the processed CPU into a CPU slot, and sealing gaps among the CPU body, the CPU slot and the main board to form a slot sealing structure, wherein a gap is reserved in the slot sealing structure;
(5) integral heating: heating the mainboard, the CPU and the slot to a certain temperature, and keeping the temperature until the pouring sealant is solidified;
(6) sealing the slot glue sealing structure: and (3) plugging gaps of the slot adhesive structure by using the same pouring adhesive under the condition of keeping heating, continuously preserving heat until the adhesive is completely solidified, and slowly cooling to room temperature.
Preferably, in the step (1), the CPU sealant structure is a two-component silicone resin potting sealant, and the thermal conductivity is not lower than 1.5W/mK.
Preferably, in the step (1), the CPU molding compound structure is lower than the upper surface of the CPU lid and does not exceed the range of the CPU body.
Preferably, in step (2), the heating temperature of the CPU is 90-110 ℃.
Preferably, in step (2), the heating temperature of the CPU is 95 ℃.
Preferably, in the step (4), the encapsulating material is an insulating waterproof traceless heat-conducting heat-resisting organic silica gel tape with the thickness of 0.2-0.5 mm.
Preferably, in step (5), the temperature to which the motherboard, the CPU and the socket are heated as a whole is 50 to 55 ℃.
Further, the BIOS of the mainboard is provided with an automatic shutdown function when the CPU is overheated, and the temperature limit is set to be 80-85 ℃.
After the protection process is implemented, the computer CPU can normally work in an extreme environment with supersaturated water vapor. The implementation area of the protection process is lower than the upper surface of the CPU, the heat dissipation structure of the upper surface of the CPU is not changed, and the normal installation and use of the CPU heat sink are not influenced. Meanwhile, the protective material used in the process can also be manually removed, and the structure of the product is not damaged when the protective material is used or the protective material is removed, so that the product repair is not influenced.
Compared with the prior art, the invention has the following advantages:
1. the electronic circuit part of the desktop computer CPU and the slot thereof is completely hermetically isolated from the outside, and the installation and the normal work of the CPU radiator are not influenced.
2. Through tests, the CPU treated by the protection process can normally work in a water vapor supersaturation environment with the relative humidity of 100% and liquid dewing in the air.
3. The protective material can be removed, and the protected components are not damaged in the protective removing process and the protective implementing process, so that the product repair is not influenced.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is a view of embodiment A-A of the present invention;
in the figure, 1, a CPU cover shell; 2. a CPU body; 3. sealing the CPU with glue; 4. a CPU slot; 5. sealing glue for the slot; 6. the main board PCB.
Detailed Description
The invention is described in further detail below with reference to the accompanying figures 1-2: 1-2, a protection process for PGA packaged CPU and its socket, the protection process coverage area includes the structure: CPU lid case 1, CPU body 2, CPU socket 4 and motherboard PCB 6. The protection process comprises the following steps:
(1) pre-coating of CPU: and (3) coating the gap between the CPU cover shell 1 and the CPU body 2 by using the two-component organic silicon resin pouring sealant to form a CPU sealant 3 structure. When coating, a gap is left, and the gap cannot be completely blocked. The selected glue needs heat resistance, water resistance and insulation, and the heat conductivity coefficient is not lower than 1.5W/mK. The engineering chooses the RTVS189 bi-component organic silicon resin pouring sealant. In order to ensure that the glue used in each process can be better blended, the same glue type (better prepared in the same batch) should be used as much as possible in the protection process. Some single-component heat-conducting silica gel also has similar performance, but the single-component silica gel has curing depth limitation, and liquid colloid can be remained in a closed space, so that the single-component silica gel is not recommended. In addition, the organic silicon potting adhesive is soft after being cured, can be manually stripped, cannot damage the component body during stripping, and does not influence the future maintenance and replacement of a CPU;
(2) heating by the CPU: the CPU was placed in an oven at 95 deg.C (which is higher than the upper limit of the CPU operating temperature) and allowed to stand for 10 minutes. The heating process makes the gas under the CPU cover shell 1 expand, and the redundant gas is diffused from the gap of the CPU sealing glue 3. The curing process of the organic silicon pouring sealant can be accelerated by heating environment, and the organic silicon pouring sealant is completely cured after being heated;
(3) sealing the CPU sealing glue structure: under the condition of keeping heating, the CPU sealing glue 3 is sealed by the same-component pouring glue, and the internal space of the CPU is completely sealed. The sealing operation should be completed quickly to avoid CPU temperature loss. Continuously heating until the sealing compound is completely solidified, and slowly cooling to the operating temperature. At the moment, a certain negative pressure is formed in the internal space of the CPU, and the negative pressure can help the sealing glue to cling to the gap, so that the internal space of the CPU is hermetically isolated from the outside;
(4) pre-coating the slot: and (4) correctly installing the processed CPU in the CPU slot 4, checking that the placement is correct and the work is normal. The CPU socket 4 is an assembly composed of a plurality of parts, and there are mechanical displacement relations among the parts, and there are many openings at the joint of each part. The CPU slot can be sealed by using an insulating waterproof traceless heat-conducting heat-resisting organic silica gel tape with the thickness of 0.2-0.5mm for integral adhesion. The glass fiber substrate blue film white organic silicon double-sided heat conduction adhesive tape is selected in engineering. When the tape bonding is performed, it is necessary to ensure that the openings at various positions of the CPU socket 4 and the gaps between the openings and the structures such as the CPU body 2 and the motherboard PCB6 are covered, but a gap is also left for air to enter and exit. Coating the joint of the adhesive tape with pouring sealant after the adhesive tape is bonded, and ensuring sealing;
(5) integral heating: the motherboard PCB6 was heated to 50-55 c integrally with the CPU. This temperature value is located at the midpoint between room temperature and the temperature at which the CPU is operating at high load. The reason for heating to this temperature is: along with the temperature variation of the CPU, the air in the CPU slot expands and contracts. Although the space in the CPU slot is large and the gas variation amplitude is large, the fluctuation deformation of the sealing adhesive tape can offset the expansion and contraction of the gas to a certain extent because the sealing adhesive tape is made of soft material. The space in the CPU slot is heated to the middle point of high and low temperature before being completely sealed, so that the impact of gas expansion and contraction caused by temperature change on the sealing structure can be further reduced;
(6) sealing the slot glue sealing structure: and under the condition of keeping heating, sealing the slot sealing glue 5 by using the same-component pouring glue, and completely sealing the space in the CPU slot. And continuously preserving the temperature until the sealing glue is completely solidified, and slowly cooling to the room temperature. All the space below the CPU is hermetically isolated from the outside;
(7) and finally, entering a BIOS of a main board to set the CPU to be overheated and automatically shut down, wherein the upper temperature limit can be set to 80-85 ℃. This temperature is lower than the heating temperature in the CPU heating process of step (2), otherwise the internal air pressure may push the encapsulant open. This arrangement can improve the reliability of the present protection process while also giving the CPU additional protection.
The above examples are merely preferred embodiments of the present invention and are not to be construed as limiting the invention. It will be appreciated by those skilled in the art that any extension and modification made on the basis of the present invention are within the scope of the present invention.
Claims (7)
1. A protection process for a CPU and a slot is characterized in that: the protection process coverage area comprises a CPU cover shell, a CPU body, a CPU slot and a mainboard, and comprises the following steps:
(1) pre-coating of CPU: coating a slit between the CPU cover shell and the CPU body with pouring sealant to form a CPU sealant structure, wherein a gap is reserved in the CPU sealant structure;
(2) heating by the CPU: heating the CPU, wherein the heating temperature is higher than the upper limit of the working temperature of the CPU, so that the gas below the CPU cover shell expands, and the redundant gas is emitted from the gap of the CPU sealing glue structure;
(3) sealing the CPU sealing glue structure: using the same pouring sealant to plug gaps of a CPU sealant structure under the condition of keeping the heating condition of the CPU, continuously preserving heat until the sealant is completely solidified, and then slowly cooling;
(4) pre-coating the slot: loading the processed CPU into a CPU slot, and sealing gaps among the CPU body, the CPU slot and the main board to form a slot sealing structure, wherein a gap is reserved in the slot sealing structure;
(5) integral heating: heating the main board, the CPU and the slot to 50-55 ℃ integrally, and keeping the temperature until the pouring sealant is cured;
(6) sealing the slot glue sealing structure: and (3) plugging gaps of the slot adhesive structure by using the same pouring adhesive under the condition of keeping heating, continuously preserving heat until the adhesive is completely solidified, and slowly cooling to room temperature.
2. The protection process for the CPU and the slot according to claim 1, wherein: in the step (1), the CPU sealing compound structure is made of two-component organic silicon resin pouring sealing compound, and the heat conductivity coefficient is not lower than 1.5W/mK.
3. The protection process for the CPU and the slot according to claim 1 or 2, wherein: in the step (1), the sealing structure of the CPU is lower than the upper surface of the CPU cover shell and does not exceed the range of the CPU body.
4. The protection process for the CPU and the slot according to claim 1, wherein: in the step (2), the heating temperature of the CPU is 90-110 ℃.
5. The protection process for CPU and socket according to claim 1 or 4, wherein: in step (2), the heating temperature of the CPU was 95 ℃.
6. The protection process for the CPU and the slot according to claim 1, wherein: in the step (4), the sealant material is an insulating waterproof traceless heat-conducting heat-resisting organic silica gel tape with the thickness of 0.2-0.5 mm.
7. The protection process for the CPU and the slot according to claim 1, wherein: the BIOS of the mainboard is provided with an automatic shutdown device for the overheating of the CPU, and the temperature limit is set to be 80-85 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910292861.4A CN110134209B (en) | 2019-04-12 | 2019-04-12 | Protection process for CPU and slot |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910292861.4A CN110134209B (en) | 2019-04-12 | 2019-04-12 | Protection process for CPU and slot |
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| Publication Number | Publication Date |
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| CN110134209A CN110134209A (en) | 2019-08-16 |
| CN110134209B true CN110134209B (en) | 2020-11-17 |
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| CN201910292861.4A Active CN110134209B (en) | 2019-04-12 | 2019-04-12 | Protection process for CPU and slot |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102212325A (en) * | 2010-04-09 | 2011-10-12 | 航天材料及工艺研究所 | Polyurethane pouring sealant as well as preparation method and pouring process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9195281B2 (en) * | 2013-12-31 | 2015-11-24 | Ultravision Technologies, Llc | System and method for a modular multi-panel display |
| KR20150093394A (en) * | 2014-02-07 | 2015-08-18 | 김지수 | Heatsink |
| CN106824727A (en) * | 2016-12-30 | 2017-06-13 | 合肥华耀电子工业有限公司 | The pouring adhesive process method and power supply of a kind of power supply casting glue |
| CN107592772A (en) * | 2017-08-24 | 2018-01-16 | 深圳禾苗通信科技有限公司 | A kind of the CPU radiator structures and its manufacture craft in scolding tin filling gap |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102212325A (en) * | 2010-04-09 | 2011-10-12 | 航天材料及工艺研究所 | Polyurethane pouring sealant as well as preparation method and pouring process thereof |
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| CN110134209A (en) | 2019-08-16 |
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