CN111696926A - Manufacturing method of chip packaging structure and chip packaging structure - Google Patents
Manufacturing method of chip packaging structure and chip packaging structure Download PDFInfo
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- CN111696926A CN111696926A CN202010418945.0A CN202010418945A CN111696926A CN 111696926 A CN111696926 A CN 111696926A CN 202010418945 A CN202010418945 A CN 202010418945A CN 111696926 A CN111696926 A CN 111696926A
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- upper cover
- chip
- bottom shell
- heat dissipation
- sealing
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 238000007789 sealing Methods 0.000 claims abstract description 67
- 238000003825 pressing Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 9
- 230000006835 compression Effects 0.000 claims description 7
- 238000007906 compression Methods 0.000 claims description 7
- 238000001746 injection moulding Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 14
- 239000012535 impurity Substances 0.000 abstract description 5
- 239000000428 dust Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a manufacturing method of a chip packaging structure and the chip packaging structure, the chip packaging structure comprises a bottom shell and an upper cover, the bottom shell and the upper cover are assembled together, a cavity is formed inside the bottom shell and the upper cover, and a sealing element for sealing is arranged at the joint of the bottom shell and the upper cover. According to the manufacturing method of the chip packaging structure and the chip packaging structure, all structures in the sealing element are matched for use, so that the sealing performance of the joint of the upper cover and the bottom shell is better, impurities such as dust in air are prevented from entering the packaging structure to influence the normal use of the chip, the radiating fins in the radiating pieces are used for guiding heat and are matched with the radiating fan for use, the radiating effect of the packaging structure is improved, the service life of the chip is ensured, the pressing structure can further fix the chip, the stability of the packaged chip is ensured, and the packaging structure is prepared by adopting the method.
Description
Technical Field
The invention relates to the technical field of IC design, in particular to a manufacturing method of a chip packaging structure and the chip packaging structure.
Background
Chip acronyms IC, or microcircuit (microcircuit), microchip, chip/chip (chip), is a way in electronics to miniaturize circuits, including primarily semiconductor devices, as well as passive components, and the like, and is often fabricated on the surface of semiconductor wafers. The chip package is a package for mounting a semiconductor integrated circuit chip, plays a role in placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is also a bridge for communicating the internal world of the chip with an external circuit. Therefore, the package plays an important role for both the CPU and other LSI integrated circuits. Chip packaging is essential and critical to the chip. Because the chip must be isolated from the outside to prevent the electrical performance degradation caused by the corrosion of the chip circuit by impurities in the air. On the other hand, the packaged chip is more convenient to mount and transport; among the current packaging structure, packaging structure is simple utilizes the shell to encapsulate, and the leakproofness after the encapsulation is general, only leans on the heating panel cooperation that sets up on the shell to dispel the heat the radiator fan on the mainboard simultaneously, and the radiating effect is general, and the structure easy temperature after the encapsulation is too high, and among the current packaging structure, the chip is directly fixed, and stability is general, and the use is got up and is had certain limitation.
Disclosure of Invention
The invention mainly aims to provide a manufacturing method of a chip packaging structure and the chip packaging structure, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that:
a chip packaging structure comprises a bottom shell and an upper cover, wherein the bottom shell and the upper cover are assembled together, a cavity is formed inside the bottom shell and the upper cover, a sealing element used for sealing is arranged at the joint of the bottom shell and the upper cover, a processing chip is arranged on the bottom shell in the cavity, a radiating piece is mounted on the upper cover, a compressing structure is arranged inside the cavity, the compressing structure and the upper cover are fixedly connected, a connecting structure is arranged between the radiating piece and the upper cover, and the radiating piece is connected with the upper cover through the connecting structure.
Preferably, a groove is formed in the bottom shell, the processing chip is fixedly mounted on the bottom shell, and the contact piece on the processing chip is located at the groove.
Preferably, the sealing member includes first sealing strip, circular slot, second sealing strip, disk and assembly groove, first sealing strip is fixed in the inner wall of drain pan, the circular slot is seted up on first sealing strip, the disk is fixed in on the second sealing strip, and cooperatees between disk and the circular slot, the assembly groove is seted up on the upper cover, the upper end card of second sealing strip is gone into in the assembly groove.
Preferably, the heat dissipation member includes a fixing frame, heat dissipation fins, a connecting plate and an L-shaped block, the heat dissipation fins are arranged on the fixing frame in a penetrating manner, the connecting plate is fixed at the upper ends of the heat dissipation fins, and the L-shaped block is arranged on the fixing frame.
Preferably, compact structure includes fixed block, dead lever, inner chamber, activity post, spring and cushion, the fixed block is fixed in and covers, insert in the fixed block the upper end of dead lever, the inner chamber is seted up on the dead lever, the upper end of activity post sets up in the inner chamber, the spring sets up in the inner chamber, and the lower extreme of spring and the upper end fixed connection of activity post, the cushion is fixed in the lower extreme of activity post.
Preferably, the connecting structure comprises a first clamping groove, a second clamping groove, a first clamping block and a second clamping block, the first clamping groove and the second clamping groove are both arranged on the upper cover, the first clamping block and the second clamping block are both fixed on the heat radiating piece, the first clamping block is clamped with the first clamping groove, and the second clamping block is clamped with the second clamping groove.
The invention also provides a manufacturing method of the chip packaging structure, which comprises the following steps:
s1, preparing raw materials, and preparing materials required by manufacturing each part;
s2, manufacturing and preparing the shell, namely taking the relevant materials prepared in the step S1, and manufacturing the bottom shell and the upper cover which can be assembled together by using processing equipment;
s3, processing the sealing structure, after step S2 is completed, preparing each component in the sealing member by using the material for manufacturing the sealing structure in step S1, and storing the components;
s4, mounting and fixing the sealing structure, after step S3 is completed, fixing different parts of the sealing member to the bottom case and the upper cover, respectively;
s5, producing the heat dissipation component, processing each structure of the heat dissipation component by using production equipment, and fixing the structures together;
s6, manufacturing the pressing member, namely, after the step S5 is completed, manufacturing structures such as fixing rods, springs and the like required in the pressing member, and assembling the structures together to form the pressing structure;
s7, mounting and fixing the chip, wherein after the step S6 is completed, a worker fixes the processing chip on the bottom shell produced in the step S2 to ensure that the processing chip is stably mounted;
s8, packaging is performed, and after the processed chip is mounted on the bottom case, the final packaging process is started.
Preferably, the processing device in step S2 is an injection molding device, the bottom case and the upper cover are processed by the injection molding device, and in step S4, the unnecessary parts of the sealing member are fixed by glue.
Preferably, the step S8 is to perform the packaging, where the packaging includes the installation of the compressing structure, the assembly of the upper cover and the bottom case, and the fixing of the heat sink, and the compressing structure is firstly fixed on the upper cover, then the upper cover and the bottom case are assembled together, and finally the heat sink is fixed by the connecting structure.
Compared with the prior art, the invention has the following beneficial effects: according to the manufacturing method of the chip packaging structure and the chip packaging structure, the sealing element is arranged, and all structures in the sealing element are matched for use, so that the sealing property of the joint of the upper cover and the bottom shell is better, and the phenomenon that impurities such as dust in air enter the packaging structure to influence the normal use of a chip is avoided;
the heat dissipation structure has the advantages that the heat dissipation part is adopted, the heat dissipation fins in the heat dissipation part are used for guiding heat, and the heat dissipation structure is matched with a heat dissipation fan for use, so that the heat dissipation effect of the packaging structure is improved, and the service life of a chip is guaranteed;
through the arranged compression structure, the compression structure can further fix the chip, and the stability of the packaged chip is ensured;
by adopting the method to prepare the packaging structure, the prepared packaging structure has good use effect and long service life.
Drawings
Fig. 1 is a schematic overall structure diagram of a chip package structure according to the present invention;
fig. 2 is a schematic diagram of an internal structure of a chip package structure according to the present invention;
FIG. 3 is a schematic structural diagram of a chip package structure according to the present invention;
fig. 4 is a schematic structural diagram of a heat sink of a chip package structure according to the present invention;
FIG. 5 is a schematic structural diagram of a chip package structure according to the present invention;
fig. 6 is a schematic structural diagram of a pressing structure of a chip packaging structure according to the present invention.
In the figure: 1. a bottom case; 2. an upper cover; 3. a cavity; 4. a seal member; 401. a first seal strip; 402. a circular groove; 403. a second seal strip; 404. a round block; 405. assembling a groove; 5. processing the chip; 6. a heat sink; 601. a fixed mount; 602. a heat dissipating fin; 603. a connecting plate; 604. an L-shaped block; 7. a compression structure; 701. a fixed block; 702. fixing the rod; 703. an inner cavity; 704. a movable post; 705. a spring; 706. an elastic pad; 8. a groove; 9. a first card slot; 10. a second card slot; 11. a first clamping block; 12. and a second clamping block.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-6, a chip package structure includes a bottom case 1 and an upper cover 2, the bottom case 1 and the upper cover 2 are assembled together, a cavity 3 is formed inside the bottom case 1 and the upper cover 2, a sealing member 4 for sealing is disposed at a joint of the bottom case 1 and the upper cover 2, a processing chip 5 is disposed on the bottom case 1 inside the cavity 3, a heat sink 6 is mounted on the upper cover 2, a compressing structure 7 is disposed inside the cavity 3, the compressing structure 7 is fixedly connected to the upper cover 2, a connecting structure is disposed between the heat sink 6 and the upper cover 2, and the heat sink 6 is connected to the upper cover 2 through the connecting structure;
a groove 8 is formed in the bottom shell 1, the processing chip 5 is fixedly mounted on the bottom shell 1, and a contact piece on the processing chip 5 is positioned at the groove 8; the sealing element 4 comprises a first sealing strip 401, a circular groove 402, a second sealing strip 403, a circular block 404 and an assembling groove 405, the first sealing strip 401 is fixed on the inner wall of the bottom shell 1, the circular groove 402 is formed in the first sealing strip 401, the circular block 404 is fixed on the second sealing strip 403, the circular block 404 is matched with the circular groove 402, the assembling groove 405 is formed in the upper cover 2, and the upper end of the second sealing strip 403 is clamped in the assembling groove 405; the heat sink 6 includes a fixing frame 601, heat dissipation fins 602, a connecting plate 603 and an L-shaped block 604, the heat dissipation fins 602 are arranged on the fixing frame 601 in a penetrating manner, the connecting plate 603 is fixed at the upper ends of the heat dissipation fins 602, and the L-shaped block 604 is arranged on the fixing frame 601; the pressing structure 7 comprises a fixed block 701, a fixed rod 702, an inner cavity 703, a movable column 704, a spring 705 and an elastic pad 706, the fixed block 701 is fixed on the upper cover 2, the upper end of the fixed rod 702 is inserted into the fixed block 701, the inner cavity 703 is arranged on the fixed rod 702, the upper end of the movable column 704 is arranged in the inner cavity 703, the spring 705 is arranged in the inner cavity 703, the lower end of the spring 705 is fixedly connected with the upper end of the movable column 704, and the elastic pad 706 is fixed at the lower end of the movable column 704; the connecting structure comprises a first clamping groove 9, a second clamping groove 10, a first clamping block 11 and a second clamping block 12, the first clamping groove 9 and the second clamping groove 10 are both arranged on the upper cover 2, the first clamping block 11 and the second clamping block 12 are both fixed on the heat dissipation member 6, the first clamping block 11 is clamped with the first clamping groove 9, and the second clamping block 12 is clamped with the second clamping groove 10.
A manufacturing method of a chip packaging structure comprises the following steps:
s1, preparing raw materials, and preparing materials required by manufacturing each part;
s2, manufacturing and preparing the shell, namely taking the relevant materials prepared in the step S1, and manufacturing the bottom shell 1 and the upper cover 2 which can be assembled together by using processing equipment;
s3, processing of the sealing structure, after completion of step S2, preparing and housing the respective components in the sealing member 4 using the material for manufacturing the sealing structure in step S1;
s4, mounting and fixing of the sealing structure, after step S3 is completed, fixing the different components in the sealing member 4 to the bottom case 1 and the upper cover 2, respectively;
s5, producing the heat dissipation component, processing each structure of the heat dissipation component by using production equipment, and fixing the structures together;
s6, manufacturing the pressing member, and after the step S5 is completed, manufacturing the fixing rod 702, the spring 705 and other structures required in the pressing member, and assembling the structures together to form the pressing structure 7;
s7, mounting and fixing the chip, wherein after the step S6 is completed, a worker fixes the processing chip 5 on the bottom shell 1 produced in the step S2 to ensure that the processing chip 5 is stably mounted;
s8, packaging, and after the processing chip 5 is mounted on the bottom case 1, starting the final packaging processing;
wherein, the processing device in step S2 is an injection molding device, the bottom case 1 and the upper cover 2 are processed by the injection molding device, and in step S4, the unnecessary parts of the sealing element 4 are fixed by glue; in step S8, the packaging process includes the steps of mounting the compressing structure 7, assembling the upper cover 2 and the bottom case 1, and fixing the heat sink 6, in which the compressing structure 7 is first fixed to the upper cover 2, then the upper cover 2 and the bottom case 1 are assembled together, and finally the heat sink 6 is fixed by the connecting structure.
It should be noted that, the invention is a manufacturing method of a chip packaging structure and a chip packaging structure, firstly, manufacturing and processing of packaging structure components are carried out by using corresponding equipment, a worker respectively processes a bottom case 1 with a groove 8 and an upper cover 2 with a mounting port, then processes corresponding components in a sealing element 4, fixes a first sealing strip 401 in the sealing element 4 on the inner wall of the bottom case 1 through glue, fixes a second sealing strip 403 in a mounting groove 405 on the upper cover 2, at the same time, other processing equipment processes and manufactures a heat sink 6, combines and assembles various components in the heat sink 6, after the assembly is completed, the worker inserts the end of a fixing rod 702 in a pressing structure 7 which is manufactured and assembled together into the fixing block 701, thereby mounting structures such as the fixing rod 702 on the upper cover 2, then, the packaging work of the processing chip 5 is started, when the packaging work is performed, a worker installs the processing chip 5 in the installation groove on the bottom shell 1, so as to ensure the fixed installation of the processing chip 5, and simultaneously, the contact piece on the processing chip 5 is located at the groove 8, then the worker takes up the upper cover 2, covers the upper cover 2 on the bottom shell 1, so that the processing chip 5 is surrounded by the shell formed by the bottom shell 1 and the upper cover 2, in the process of installing the upper cover 2, the second sealing strip 403 in the sealing element 4 moves towards the direction of the first sealing strip 401 until the round block 404 at the lower end of the second sealing strip 403 is clamped into the round groove 402 on the first sealing strip 401, at this time, the first sealing strip 401 is used in cooperation with the second sealing strip 403, the place where the upper cover 2 is in contact with the bottom shell 1 is sealed, so as to ensure that the processing chip 5 cannot cause the electrical performance reduction due to the corrosion of the circuits on the processing chip 5 caused, the using effect of the processing chip 5 is ensured, meanwhile, in the process of installing the upper cover 2, the elastic pad 706 in the pressing structure 7 firstly contacts the processing chip 5, along with the downward pressing and assembling of the upper cover 2, the elastic pad 706 drives the movable column 704 to move on the fixed rod 702 together, so that the spring 705 in the inner cavity 703 is compressed, the spring 705 has certain elastic force after being compressed, the structures such as the elastic pad 706 have downward pressure, and simultaneously the structures such as the fixed block 701 have upward reasoning, because the upper cover 2 and the bottom shell 1 are firmly installed, the acting force towards the upper end and the lower end cannot influence the shell, further the elastic pad 706 generates certain acting force on the processing chip 5, the stability of the processing chip 5 is ensured, the firm degree of the processing chip 5 in use is improved, after the upper cover 2 and the bottom shell 1 are installed together, a worker starts to install the heat dissipation member 6, during installation, the connecting plate 603 in the heat sink 6 is clamped into the assembly hole of the upper cover 2 through the L-shaped block 604, so that the first clamping block 11 in the connecting structure is clamped into the first clamping groove 9 on the upper cover 2, so that the second clamping block 12 is clamped into the second clamping groove 10, the heat sink 6 is fixed, the lower end of the heat dissipation fin 602 is located in the cavity 3, after the whole packaging work is completed, the whole packaging structure can be used, during use, a worker installs the whole packaged structure on the control mainboard, so that the contact point on the mainboard is in contact with the contact point in the groove 8, thereby electrically connecting the processing chip 5 and the control mainboard together, fixing the whole packaging structure by using the related structures, and then installing a heat dissipation fan to dissipate heat, during installation, the worker applies heat dissipation silica gel on the upper surface of the connecting plate 603 in the heat sink 6, so that the silica gel is uniformly applied on the connecting plate 603, then the heat dissipation fan is fixedly installed on the control mainboard, the contact structure of the heat dissipation fan is ensured to be contacted with the connecting plate 603 through the heat dissipation silica gel, thus heat dissipation can be carried out, when the chip is used, the processing chip 5 can generate certain heat, the heat is conducted to the connecting plate 603 through the heat dissipation fins 602 in the cavity 3 and then conducted to the contact structure in the heat dissipation fan, finally the heat is dissipated out through the heat dissipation fan, the heat dissipation effect of the packaged structure can be improved by utilizing the structures of the heat dissipation fins 602 and the like in the heat dissipation part 6 through the arranged heat dissipation part 6 in cooperation with the heat dissipation fan, the use effect of the processing chip 5 is ensured, thereby the use environment of the processing chip 5 is in a more appropriate condition, the service life is prolonged, the sealing effect can be ensured by adopting the sealing part 4, the interior of the cavity 3 is in a sealed state, and impurities such as dust and the, the impurity is prevented from influencing the use of the processing chip 5, so that the using effect of the whole packaged structure is higher, and the use cost ratio is improved.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. A chip packaging structure is characterized in that: the sealing device comprises a bottom shell (1) and an upper cover (2), wherein the bottom shell (1) and the upper cover (2) are assembled together, a cavity (3) is formed inside the bottom shell (1) and the upper cover (2), a sealing element (4) for sealing is arranged at the joint of the bottom shell (1) and the upper cover (2), a processing chip (5) is arranged on the bottom shell (1) in the cavity (3), a heat dissipation piece (6) is installed on the upper cover (2), a compression structure (7) is arranged inside the cavity (3), the compression structure (7) is fixedly connected with the upper cover (2), a connection structure is arranged between the heat dissipation piece (6) and the upper cover (2), and the heat dissipation piece (6) is connected with the upper cover (2) through the connection structure.
2. The chip packaging structure according to claim 1, wherein: the bottom shell (1) is provided with a groove (8), the processing chip (5) is fixedly arranged on the bottom shell (1), and the contact piece on the processing chip (5) is positioned at the groove (8).
3. The chip packaging structure according to claim 1, wherein: sealing member (4) include first sealing strip (401), circular slot (402), second sealing strip (403), circle piece (404) and assembly groove (405), the inner wall of drain pan (1) is fixed in first sealing strip (401), circle piece (402) are seted up on first sealing strip (401), circle piece (404) are fixed in on second sealing strip (403), and cooperate between circle piece (404) and circular slot (402), assembly groove (405) are seted up on upper cover (2), the upper end card of second sealing strip (403) is gone into in assembly groove (405).
4. The chip packaging structure according to claim 1, wherein: the heat dissipation piece (6) comprises a fixing frame (601), heat dissipation fins (602), a connecting plate (603) and an L-shaped block (604), wherein the heat dissipation fins (602) are arranged on the fixing frame (601) in a penetrating mode, the connecting plate (603) is fixed at the upper ends of the heat dissipation fins (602), and the L-shaped block (604) is arranged on the fixing frame (601).
5. The chip packaging structure according to claim 1, wherein: the pressing structure (7) comprises a fixing block (701), a fixing rod (702), an inner cavity (703), a movable column (704), a spring (705) and an elastic pad (706), wherein the fixing block (701) is fixed on the upper cover (2), the upper end of the fixing rod (702) is inserted into the fixing block (701), the inner cavity (703) is arranged on the fixing rod (702), the upper end of the movable column (704) is arranged in the inner cavity (703), the spring (705) is arranged in the inner cavity (703), the lower end of the spring (705) is fixedly connected with the upper end of the movable column (704), and the elastic pad (706) is fixed at the lower end of the movable column (704).
6. The chip packaging structure according to claim 1, wherein: the connecting structure comprises a first clamping groove (9), a second clamping groove (10), a first clamping block (11) and a second clamping block (12), wherein the first clamping groove (9) and the second clamping groove (10) are arranged on the upper cover (2), the first clamping block (11) and the second clamping block (12) are fixed on the radiating piece (6), the first clamping block (11) is connected with the first clamping groove (9) in a clamped mode, and the second clamping block (12) is connected with the second clamping groove (10) in a clamped mode.
7. The manufacturing method of the chip packaging structure is characterized by comprising the following steps:
s1, preparing raw materials, and preparing materials required by manufacturing each part;
s2, manufacturing and preparing the shell, namely taking the relevant materials prepared in the step S1, and manufacturing the bottom shell (1) and the upper cover (2) which can be assembled together by using processing equipment;
s3, processing of the sealing structure, after completion of step S2, preparing each component in the sealing member (4) using the material for manufacturing the sealing structure in step S1, and housing the components;
s4, mounting and fixing the sealing structure, and fixing different parts in the sealing element (4) to the bottom shell (1) and the upper cover (2) respectively after the step S3 is completed;
s5, producing the heat dissipation component, processing each structure of the heat dissipation component by using production equipment, and fixing the structures together;
s6, manufacturing the pressing member, and after the step S5 is completed, manufacturing structures such as a fixing rod (702), a spring (705) and the like required in the pressing member, and assembling the structures together to form a pressing structure (7);
s7, mounting and fixing the chip, wherein after the step S6 is completed, a worker fixes the processing chip (5) on the bottom shell (1) produced in the step S2 to ensure that the processing chip (5) is stably mounted;
s8, packaging is carried out, and after the processing chip (5) is mounted on the bottom shell (1), the final packaging processing is started.
8. The method of claim 7, wherein: the processing device in the step S2 is an injection molding device, the bottom case (1) and the upper cover (2) are processed by the injection molding device, and in the step S4, the unnecessary parts of the sealing member (4) are fixed by glue.
9. The method of claim 7, wherein: and packaging in the step S8, wherein the packaging comprises the installation of the compression structure (7), the assembly of the upper cover (2) and the bottom shell (1) and the fixation of the heat dissipation member (6), the compression structure (7) is firstly fixed on the upper cover (2), then the upper cover (2) and the bottom shell (1) are assembled together, and finally the heat dissipation member (6) is fixed by using the connecting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010418945.0A CN111696926A (en) | 2020-05-18 | 2020-05-18 | Manufacturing method of chip packaging structure and chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113363169A (en) * | 2021-06-28 | 2021-09-07 | 常州港华半导体科技有限公司 | Automatic packaging hardware of rectifier shell |
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| CN113363169A (en) * | 2021-06-28 | 2021-09-07 | 常州港华半导体科技有限公司 | Automatic packaging hardware of rectifier shell |
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