CN110126372A - A kind of preparation method of multiple layer metal layers of foil structure copper-clad plate - Google Patents
A kind of preparation method of multiple layer metal layers of foil structure copper-clad plate Download PDFInfo
- Publication number
- CN110126372A CN110126372A CN201910486765.3A CN201910486765A CN110126372A CN 110126372 A CN110126372 A CN 110126372A CN 201910486765 A CN201910486765 A CN 201910486765A CN 110126372 A CN110126372 A CN 110126372A
- Authority
- CN
- China
- Prior art keywords
- metal layers
- layer metal
- copper
- multiple layer
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/08—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer the fibres or filaments of a layer being of different substances, e.g. conjugate fibres, mixture of different fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0253—Polyolefin fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
Abstract
The present invention relates to a kind of preparation methods of multiple layer metal layers of foil structure copper-clad plate, and by substituting the single-layer metal layers of foil of existing copper-clad plate using multiple layer metal layers of foil, copper-clad plate dielectric properties obtained are good, and mechanical property is more preferably.Specific preparation step includes: S1, prepreg preparation；S2, multiple layer metal layers of foil preparation: by layers of copper and alloy-layer congruent form at overlapping layers, overlapping layers is put into milling train and carries out composite rolling, obtain multiple layer metal layers of foil；S3, multiple layer metal layers of foil structure copper-clad plate preparation: the prepreg is overlapped, and single or double is compound coated with the multiple layer metal layers of foil, then by the prepreg progress hot pressing for being covered with multiple layer metal layers of foil, obtains the copper-clad plate of multiple layer metal layers of foil structure.
Description
Technical field
The present invention relates to the preparations of copper-clad plate, more particularly, to the preparation method of multiple layer metal layers of foil structure copper-clad plate.
Background technique
With electric, information industry development, copper-clad plate becomes the important set of basic material in electronic and electrical equipment
At part, have broad prospects.Copper-clad plate is mainly using fibrous paper, glass fabric or glass fibre non-woven etc. as increasing
Strong material is soaked with resin, and single or double is coated with metal foil, through a kind of product made of hot pressing.Last 100 years electronic industrial technology
Development course shows that copper-clad plate technology is often to push one of the key technology of electronics industry development.
The invention and application of integrated circuit, electronic product " light and short ", multifunction, densification make the skill of copper-clad plate
Art and production are pulled on the track developed towards high performance direction.This requires copper-clad plate must have it is more preferably comprehensive
Can, higher demand is especially proposed in terms of dimensional stability.Dimensional stability is directly related to the signal of high-frequency electronic product
Transmission, thermal stability, use reliability and service life etc..The composite material that copper-clad plate is made of copper foil, resin, reinforcing material.
Their mutual mechanical properties differ greatly, such as: copper foil layer is rigid elastomer, and adhesive is then elastomer, glue
Connector stress distribution when bearing external force is extremely complex.And since the thermal expansion coefficient of each material, solidification are received
Shrinkage is different, and heat transfer, thermal expansion coefficient, chemical shrinkage rate differ greatly, in curing molding, heated dampness and welding, clothes
Under the different conditions such as labour, internal stress can be all generated, and internal stress is unevenly distributed, easily cause deformation, warpage even
Interface Cracking etc.；In addition, single-side coated copper plate is a kind of material of unsymmetric structure, more Stress non-homogeneity existing for inside is caused to be made
It is deformed at anisotropy.Since copper-clad plate size instability problem is more complicated, influence factor is perhaps various.It includes metal
The preparation of layers of foil, reinforcing material, main resin formula, semi-finished product impregnation drying, compacting, the storage of post-processing and product
Deng.Wherein preparation process and performance (such as thickness of copper foil elongation size, copper foil, the gel content for gluing copper foil of metal copper foil
Deng) it is highly important to the comprehensive performance of copper-clad plate.
Difference of the copper-clad plate with copper foil according to the production process, can be divided into rolled copper foil and electrolytic copper foil two major classes.Calendering
Copper foil is to be processed into copper sheet for copper is first smelting, then former foil is made by rolling is repeated several times in copper sheet, is then roughened
A series of surface treatments such as processing, refractory layer processing and anti-oxidation processing.Due to the limitation of processing technology, rolled copper foil is multi-purpose greatly
In on flexible printed-circuit board.Electrolytic copper foil is that first copper sulfate electrolyte is made through dissolution in copper, will in electrolysis special equipment
Copper sulfate electrolyte is electrodeposited and copper foil is made under direct current electro ultrafiltration.It is generally used on rigid printed circuit boards.
As printed circuit board develops to high density graph thinning, multiple stratification, slimming and high frequency, promote high performance copper
Foil manufacturing technology is constantly brought forth new ideas, is continued to develop.High-performance copper foil show with excellent tensile strength and elongation percentage (normality,
It is hot)；The advantages that high thermal stability, uniform high rigidity and thickness；Exploitation and development extra thin copper foil, manufacture fine circuits PCB
Play vital mating reaction etc..Build-up multi layer board has started the multilayer of high density interconnection in the appearance of Japan
The new period of plate manufacturing technology, and it is since size limits and the problems such as interface stability, significantly limits multiple-plate answer
With.
Currently, the design of copper-clad plate product, manufacture, application technology have broken a kind of material separately as basic electronic material
The traditional concept of material.Existing copper-clad plate respectively has difference due to manufacture raw material and the otherness of structure, the technical performance of copper-clad plate
It is different.Single material is no longer satisfied higher and higher performance requirement.Therefore, from the design and preparation of copper-clad plate metal foil layer
Start with, exploitation preparation multiple layer metal layers of foil composite material can be in conjunction with the performance advantage of multiple material, to make up homogenous material
Deficiency in performance meets development the copper-clad plate of the high-frequency high-speed market demand, obtains dimensional performance stabilization and comprehensive performance
Excellent product has important practical significance.
Summary of the invention
The metal foil layer of existing copper-clad plate is generally single-layer metal, and structure is single, and copper clad laminate mechanical properties obtained are general,
It is not able to satisfy demand of the market development to copper-clad plate.It is an object of the invention to overcome the deficiency of the above-mentioned prior art, one is provided
The preparation method of kind of multiple layer metal layers of foil structure copper-clad plate, copper-clad plate obtained under the premise of guaranteeing good dielectric properties,
The mechanical property of copper-clad plate can effectively be optimized.
The purpose of the present invention is achieved by the following technical programs:
A kind of preparation method of multiple layer metal layers of foil structure copper-clad plate, comprising the following steps:
S1, prepreg preparation；
S2, multiple layer metal layers of foil preparation: by layers of copper and alloy-layer congruent form at overlapping layers, by overlapping layers be put into milling train into
Row composite rolling obtains multiple layer metal layers of foil；
S3, multiple layer metal layers of foil structure copper-clad plate preparation: the prepreg is overlapped, single or double is coated with described more
Layer metal foil layer, then the prepreg progress hot pressing for being covered with multiple layer metal layers of foil is compound, obtain multiple layer metal layers of foil knot
Structure copper-clad plate.
Further, the composite rolling technique includes hot rolling and cold rolling.It is closed by hot rolling and cold ligation, carries out hot rolling energy
Enough make different metal layer good combinations, guarantee its bond strength, reusing cold rolling can allow multilayer metal foil to be formed, and guarantee to roll
It is high to make resulting multiple layer metal layers of foil bond strength, good stability of the dimension.
Further, the hot rolling technology rolling temperature is 350-500 DEG C, and each percentage pass reduction is 30-50%；It is described
The each percentage pass reduction of cold-rolling process is 20-40%.
Further, the number of plies of the overlapping layers is 2-6 layers.
Preferably, the number of plies of the overlapping layers is 3-5 layers.
Further, the alloy-layer is any one or more in copper alloy, aluminium alloy or nickel alloy.
Further, the hot pressing temperature of the hot pressing combination process is 200-230 DEG C, hot pressing pressure 25-32Kg/cm2,
Hot pressing time is 90-120min.
Further, prepreg preparation specifically includes the following steps:
A. prepared by glue: matrix resin, crosslinking agent and initiator are added in reaction kettle after completely dissolution, filler is added,
Then it mixes at room temperature, stirring accelerates dissolution, stops stirring after solution is uniform, seals with spare；
B. prepared by prepreg: reinforcing material being impregnated the glue, is then toasted in 150-180 DEG C of baking oven solid
Change, finally obtains dry prepreg by cutting.
Preferably, reinforcing material is any in glass fabric, non-woven fabrics, HMPP fiber, assorted fibre or COC fiber
It is a kind of.
Preferably, matrix resin is appointing in PTFE resin, PPO resin, epoxy resin, polyimide resin or CE resin
It anticipates one kind.
The invention has the following beneficial effects:
The present invention substitutes the monometallic layers of foil on traditional copper-clad plate surface with multi-layer metal structure layers of foil, to obtain good
Mechanical property, processing performance and electromagnetic shielding performance.Preparation process of the present invention is simple, and preparation cost is lower, to metal foil layer
Material and structure have very big controllable adjustment range, therefore prepare the copper-clad plate of optimal material structure proportion according to the usage requirement
Material.Multiple layer metal layers of foil structure dimensional stability of copper-clad plate provided by the invention is strong, and mechanical performance is higher, metal foil layer and gold
Belonging to has high bond strength between layer and layer of prepreg, meet different condition requirement.It is embodied in:
(1) rolling mill practice is simple, high degree of automation, and can realize good combination interface structure property.Composite rolling
The multilayer metal foil structure layer and prepreg of preparation form good combination, and multilayer metal foil structure structure is uniform, and thickness is adjustable,
It can be used for developing and preparing super thin metal layers of foil.
(2) multilayer metal foil is had excellent performance.Normality and Testing Tensile Strength at Elevated Temperature and elongation percentage are good, normality high-tensile and
High-elongation, can be improved the working process of copper foil, and enhancing rigidity avoids fold to improve dimensional stability.High-temperature extensibility
With Testing Tensile Strength at Elevated Temperature copper foil, thermal stability can be improved, avoid deformation and warpage.Furthermore the metal foil layer also has high fever steady
Qualitative, the advantages that high rigidity and thickness are uniform.
(3) copper-clad plate excellent combination property.The addition of multilayer metal foil structure layer is so that high-frequency copper-clad plate material has mechanics
The advantages that performance and good stability of the dimension, impact resistance are high, heat-resist, and dielectric loss is small, by adjusting the material of metal foil layer
Material and structure realize that copper-clad plate is optimal the matching of performance.
(4) application prospect is extensive.High-frequency copper-clad plate preparation method of the present invention has processing performance excellent, at low cost
The characteristics of, and the high frequency plate prepared has better dimensional stability and mechanical strength conservation rate, is able to satisfy high speed in recent years and sends out
The requirement of the electronic mounting high density interconnection of exhibition has broad application prospects in aerospace and communication transfer field.
Specific embodiment
Below with reference to the embodiment provided, invention is further described in detail.
Embodiment 1
A kind of multiple layer metal layers of foil structure copper-clad plate preparation method comprising following steps:
11,120g butadiene styrene resin, 15g polybutadiene, 8g Triallyl isocyanurate crosslinking agent and 10g are caused
Agent is dissolved in toluene, after completely dissolution, mass fraction 80%, the metatitanic acid lead stuffing that partial size degree is 10, then in room temperature is added
Lower be uniformly mixed stirs to get glue.NE- glass fabric is used to impregnate above-mentioned glue as reinforcing material, then in 160-
7min solidification is toasted in 170 DEG C of baking oven, obtains prepreg.
12, layers of copper/aluminium alloy layer/layers of copper is neatly overlapped, overlapping layers is then subjected to composite rolling, obtain three-decker
Metal foil layer.The composite rolling technique is the rolling of two steps, and the first step is hot rolling, and 350 DEG C of rolling temperature, every a time is depressed
Rate is 50%, repeatedly pushes the multilayered structure hot rolling complex laminate obtained with a thickness of 0.6mm；Second step is cold rolling, every a time pressure
Lower rate is 40%, repeatedly pushes the metal foil layer for obtaining the multilayered structure with a thickness of 60 μm；
13, prepreg prepared by above-mentioned steps 1 is neatly overlapped, the two-sided multilayered structure prepared coated with above-mentioned steps 2
Thin metal layer, then put it into vacuum hotpressing machine carry out hot pressing it is compound, hot pressing condition be pressure 32Kg/cm2, temperature 200
DEG C, time 90min.Obtain the copper-clad plate of multiple layer metal layers of foil structure.
Embodiment 2
A kind of multiple layer metal layers of foil structure copper-clad plate preparation method comprising following steps:
21,120g butadiene styrene resin, 15g polybutadiene, 8g Triallyl isocyanurate crosslinking agent and 10g are caused
Agent is dissolved in toluene, after completely dissolution, mass fraction 80%, the metatitanic acid lead stuffing that partial size degree is 10, then in room temperature is added
Lower be uniformly mixed stirs to get glue.NE- glass fabric is used to impregnate above-mentioned glue as reinforcing material, then in 160-
7min solidification is toasted in 170 DEG C of baking oven, obtains prepreg.
22, layers of copper/nickel alloy layer/layers of copper/nickel alloy layer is neatly overlapped, overlapping layers is then subjected to composite rolling, is obtained
Obtain the metal foil layer of four-layer structure.The composite rolling technique is the rolling of two steps, and the first step is hot rolling, 500 DEG C of rolling temperature, often
A time reduction ratio is 30%, repeatedly pushes the multilayered structure hot rolling complex laminate obtained with a thickness of 0.9mm；Second step is cold rolling,
Each percentage pass reduction is 20%, repeatedly pushes the metal foil layer for obtaining the multilayered structure with a thickness of 90 μm.
23, prepreg prepared by above-mentioned steps 1 is neatly overlapped, two-sided or single side prepares more coated with above-mentioned steps 2
Then layer structural metal thin layer puts it into vacuum hotpressing machine and carries out that hot pressing is compound, and hot pressing condition is pressure 30Kg/cm2, temperature
It is 220 DEG C, time 100min.Obtain the copper-clad plate of multiple layer metal layers of foil structure.
Embodiment 3
A kind of multiple layer metal layers of foil structure copper-clad plate preparation method comprising following steps:
31,120g butadiene styrene resin, 15g polybutadiene, 8g Triallyl isocyanurate crosslinking agent and 10g are caused
Agent is dissolved in toluene, after completely dissolution, mass fraction 80%, the metatitanic acid lead stuffing that partial size degree is 10, then in room temperature is added
Lower be uniformly mixed stirs to get glue.NE- glass fabric is used to impregnate above-mentioned glue as reinforcing material, then in 160-
7min solidification is toasted in 170 DEG C of baking oven, obtains prepreg.
32, layers of copper/aluminium alloy layer/layers of copper/aluminium alloy layer/layers of copper is neatly overlapped, overlapping layers is then subjected to compound roll
System, obtains the metal foil layer of five-layer structure.The composite rolling technique is the rolling of two steps, and the first step is hot rolling, rolling temperature 420
DEG C, each percentage pass reduction is 45%, repeatedly pushes the multilayered structure hot rolling complex laminate obtained with a thickness of 0.8mm；Second step is
Cold rolling, reduction ratio is 30% each time in road, repeatedly pushes the metal foil layer for obtaining the multilayered structure with a thickness of 80 μm.
33, prepreg prepared by above-mentioned steps 1 is neatly overlapped, the two-sided multilayered structure prepared coated with above-mentioned steps 2
Thin metal layer, then put it into vacuum hotpressing machine carry out hot pressing it is compound, hot pressing condition be pressure 32Kg/cm2, temperature 230
DEG C, time 120min.Obtain the copper-clad plate of multiple layer metal layers of foil structure.
The performance test knot of the multiple layer metal layers of foil structure copper-clad plate as obtained by embodiment 1-3 and single layer copper copper-clad plate
Fruit is as follows:
Compared by the above test result it can be concluded that, compared to single layer layers of copper copper-clad plate, as obtained by embodiment 1-3
In the case where guaranteeing good dielectric properties, bending strength has obviously to be mentioned the copper-clad plate of multiple layer metal layers of foil structure
It rises, mechanical property is optimized.
As described above, only presently preferred embodiments of the present invention, when cannot be limited the scope of implementation of the present invention with this,
All still belong to this hair according to simple equivalent changes and modifications made by scope of the present invention patent and invention description content generally
In the range of bright patent covers.
Claims (10)
1. a kind of preparation method of multiple layer metal layers of foil structure copper-clad plate, comprising the following steps:
S1, prepreg preparation；
S2, multiple layer metal layers of foil preparation: by layers of copper and alloy-layer congruent form at overlapping layers, overlapping layers is put into milling train and is answered
Rolling is closed, multiple layer metal layers of foil is obtained；
S3, multiple layer metal layers of foil structure copper-clad plate preparation: the prepreg is overlapped, and single or double is coated with the multilayer gold
Belong to layers of foil, then the prepreg progress hot pressing for being covered with multiple layer metal layers of foil is compound, obtains multiple layer metal layers of foil structure and cover
Copper sheet.
2. a kind of preparation method of multiple layer metal layers of foil structure copper-clad plate as described in claim 1, which is characterized in that described multiple
Closing rolling mill practice includes hot rolling and cold rolling.
3. a kind of preparation method of multiple layer metal layers of foil structure copper-clad plate as claimed in claim 2, which is characterized in that the heat
Roll process rolling temperature is 350-500 DEG C, and each percentage pass reduction is 30-50%；The each percentage pass reduction of cold-rolling process
For 20-40%.
4. a kind of preparation method of multiple layer metal layers of foil structure copper-clad plate as described in claim 1, which is characterized in that described folded
The number of plies for closing layer is 2-6 layers.
5. a kind of preparation method of multiple layer metal layers of foil structure copper-clad plate as claimed in claim 4, which is characterized in that described folded
The number of plies for closing layer is 3-5 layers.
6. a kind of preparation method of multiple layer metal layers of foil structure copper-clad plate as claimed in claim 4, which is characterized in that the conjunction
Layer gold is any one or more in copper alloy, aluminium alloy or nickel alloy.
7. a kind of preparation method of multiple layer metal layers of foil structure copper-clad plate as described in claim 1, which is characterized in that the heat
The hot pressing temperature for pressing combination process is 200-230 DEG C, hot pressing pressure 25-32Kg/cm2, hot pressing time 90-120min.
8. a kind of preparation method of multiple layer metal layers of foil structure copper-clad plate as described in claim 1, which is characterized in that described half
Cured sheets preparation specifically includes the following steps:
A. prepared by glue: matrix resin, crosslinking agent and initiator being added in reaction kettle after completely dissolution, filler is added, then
It mixes at room temperature, stirring accelerates dissolution, stops stirring after solution is uniform, seals with spare；
B. prepared by prepreg: reinforcing material being impregnated the glue, then the baking-curing in 150-180 DEG C of baking oven, most
Dry prepreg is obtained by cutting afterwards.
9. a kind of preparation method of multiple layer metal layers of foil structure copper-clad plate as claimed in claim 8, which is characterized in that the increasing
Strong material is any one in glass fabric, non-woven fabrics, HMPP fiber, assorted fibre or COC fiber.
10. a kind of preparation method of multiple layer metal layers of foil structure copper-clad plate as claimed in claim 8, which is characterized in that described
Matrix resin is any one in PTFE resin, PPO resin, epoxy resin, polyimide resin or CE resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910486765.3A CN110126372A (en) | 2019-06-05 | 2019-06-05 | A kind of preparation method of multiple layer metal layers of foil structure copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910486765.3A CN110126372A (en) | 2019-06-05 | 2019-06-05 | A kind of preparation method of multiple layer metal layers of foil structure copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110126372A true CN110126372A (en) | 2019-08-16 |
Family
ID=67580393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910486765.3A Pending CN110126372A (en) | 2019-06-05 | 2019-06-05 | A kind of preparation method of multiple layer metal layers of foil structure copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110126372A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114381782A (en) * | 2021-12-29 | 2022-04-22 | 江苏诺德新材料股份有限公司 | Environment-friendly high-Tg low-dielectric copper-clad plate and preparation process thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4781969A (en) * | 1986-10-03 | 1988-11-01 | Junkosha Co., Ltd. | Flexible printed circuit board |
| CN1868735A (en) * | 2006-04-13 | 2006-11-29 | 上海南亚覆铜箔板有限公司 | Non-halogen epoxide glass cloth base copper coated foil plate and its preparation method |
| KR20090072160A (en) * | 2007-12-28 | 2009-07-02 | 엘지전자 주식회사 | Flexible film |
| CN102264540A (en) * | 2008-12-24 | 2011-11-30 | 吉坤日矿日石金属株式会社 | metal foil with carrier |
| US20190017188A1 (en) * | 2017-07-13 | 2019-01-17 | Kcf Technologies Co., Ltd. | Copper foil with minimized bagginess, wrinkle or tear, electrode including the same, secondary battery including the same and method for manufacturing the same |
-
2019
- 2019-06-05 CN CN201910486765.3A patent/CN110126372A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4781969A (en) * | 1986-10-03 | 1988-11-01 | Junkosha Co., Ltd. | Flexible printed circuit board |
| CN1868735A (en) * | 2006-04-13 | 2006-11-29 | 上海南亚覆铜箔板有限公司 | Non-halogen epoxide glass cloth base copper coated foil plate and its preparation method |
| KR20090072160A (en) * | 2007-12-28 | 2009-07-02 | 엘지전자 주식회사 | Flexible film |
| CN102264540A (en) * | 2008-12-24 | 2011-11-30 | 吉坤日矿日石金属株式会社 | metal foil with carrier |
| US20190017188A1 (en) * | 2017-07-13 | 2019-01-17 | Kcf Technologies Co., Ltd. | Copper foil with minimized bagginess, wrinkle or tear, electrode including the same, secondary battery including the same and method for manufacturing the same |
Non-Patent Citations (1)
| Title |
|---|
| 程静等: "介电常数对PCB板性能影响的四个方面", 《印刷电路信息》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114381782A (en) * | 2021-12-29 | 2022-04-22 | 江苏诺德新材料股份有限公司 | Environment-friendly high-Tg low-dielectric copper-clad plate and preparation process thereof |
| CN114381782B (en) * | 2021-12-29 | 2022-10-21 | 江苏诺德新材料股份有限公司 | Environment-friendly high-Tg low-dielectric copper-clad plate and preparation process thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3897588A (en) | Process for the production of laminates utilizing pre-treating followed by impregnation | |
| CN114771050B (en) | High-frequency copper-clad plate and preparation method thereof | |
| WO2012100648A1 (en) | Prepreg comprising aromatic synthetic fiber paper and printed circuit board made using the prepreg | |
| CN107498952B (en) | Meta-aramid fibers/all-glass paper base copper-clad laminate and its manufacturing method | |
| CN113597121B (en) | Manufacturing method of glass fiber cloth reinforced copper-clad plate | |
| US4547408A (en) | Metal-clad laminate adapted for printed circuits | |
| CN202388871U (en) | Copper-clad plate | |
| CN114670512B (en) | Polytetrafluoroethylene flexible copper-clad plate containing glass fibre cloth and its preparation method | |
| CN110126372A (en) | A kind of preparation method of multiple layer metal layers of foil structure copper-clad plate | |
| CN101460013A (en) | Composite article for functional resin and metal foil and multilayered printed circuit board manufacturing method using the same | |
| CN111703171A (en) | Processing production process of 5G high-frequency microwave copper-clad plate | |
| CN219164807U (en) | Low dielectric and toughened liquid crystal polymer base circuit substrate | |
| CN114103307A (en) | Low-warpage thermosetting resin copper-clad plate and preparation method thereof | |
| CN114103306B (en) | Halogen-free lead-free high-Tg copper-clad plate and processing technology thereof | |
| CN102296488B (en) | Production method for low-warpage paper base laminating circuit board body paper and paper base laminating circuit board body paper | |
| CN201501140U (en) | Prepreg with resin beds of asymmetric thicknesses | |
| CN115028869B (en) | Polyimide paper-based prepreg and copper-clad plate prepared from same | |
| CN116080157B (en) | Copper foil-coated epoxy glass fiber laminated board for printed circuit | |
| CN106364070B (en) | A kind of high intensity copper-clad plate of symmetrical folded structure and preparation method thereof | |
| JPH0356583B2 (en) | ||
| JPH02258337A (en) | Manufacture of laminate for printed circuit | |
| JPH0414875B2 (en) | ||
| JPH0334677B2 (en) | ||
| JP2004051951A (en) | Aramid fiber nonwoven fabric prepreg, and laminated plate and printed-wiring board using it | |
| JPH0257018B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190816 |
|
| RJ01 | Rejection of invention patent application after publication |