CN110120469A - High-resolution organic light emitting diode device - Google Patents

Abstract

Disclose high-resolution organic light emitting diode device.According to an exemplary embodiment of the present disclosure, a kind of method manufacturing organic light emitting display can be provided.Multiple electrodes can be provided on substrate.Above multiple electrodes on substrate, the first hole-conductive layer can be deposited via ink jet printing.The liquid compatibility property of the selected surface portion of the first hole-conductive layer can be changed, to limit emission layer restricted area.Each emission layer restricted area can have respectively with the corresponding part of each of the multiple electrodes that are provided on substrate.In each emission layer restricted area, organic luminous layer can be deposited via ink jet printing.

Description

High-resolution organic light emitting diode device

The application is entitled " the high-resolution organic light emitting diode device " that national application number is 201480016484.7 Chinese patent application divisional application.The parent application requirement of the application is temporarily special in the U.S. submitted on January 17th, 2013 The priority of benefit application No.61/753,692 and the U.S. Provisional Patent Application No.61/ submitted on January 17th, 2013 753,713 priority.

Technical field

Relate generally to electronic console and the method for electronic console to be made in terms of the disclosure.More specifically, this Disclosed aspect is related to that active organic LED (OLED) display material is deposited and limited on substrate to prepare OLED display.

Background technique

Paragraph heading as used herein is only used for organizational goal and should not be construed in any way as limiting described Theme.

Electronic console is present in many different types of electronic equipments, such as video screen, computer monitor Device, mobile phone, smart phone, tablet computer, handheld game machine etc..A type of electronic console depends on organic light emission Diode (OLED) technology.OLED technology utilizes the organic luminous layer being interposed between the electrode that two are disposed on the substrate.Electricity Pressure can be applied to electrode both ends, so that carrier be made to be excited and be injected into organic luminous layer.Light emitting can carry It flows when sub- relaxation returns to normal energy state and is occurred by photoemission.OLED technology can provide relatively high to display Contrast because each pixel can address individually only to generate light emitting in the pixel addressed.Due to the hair of pixel Essence is penetrated, OLED display can also provide wide viewing angle.Relative to other display technologies, the power efficiency of OLED display can be with It improves, because OLED pixel only just consumes power when being driven directly.In addition, being given birth to due to the photogenerated essence of the technology The panel of production can be significantly less thick than the panel in other display technologies, to eliminate in thin apparatus structure and display itself The needs of light source.Due to the compliance essence of active OLED layer, OLED display can also be prepared as flexible and flexible.

Ink jet printing is the technology that can be applied in OLED manufacture, and can reduce manufacturing cost.Ink jet printing makes With the drop of the ink comprising oled layer material and the one or more carrier liquids sprayed from nozzle with high speed to generate one A or multiple active OLED layers comprising such as hole injection layer, hole transmission layer, electronic barrier layer, organic luminous layer, electronics Transport layer, electron injecting layer and/or hole blocking layer.

The limiting structure of such as bank (bank) is provided usually on substrate to limit limitation trap, wherein each limitation trap Can be associated with one or more sub-pixels, such as different colours or the sub-pixel of wavelength transmitting.Limitation trap can prevent institute (multiple) active OLED material of deposition dispenses between nearby subpixels.Ink jet printing method can require quite high essence Degree.Particularly, as pixel density increases and/or as size of display reduces, the restricted area for limiting trap is reduced and liquid The small error that drop is placed may cause drop and be deposited over outside be intended to trap.Also, droplet size may be relative to limitation Too big and drop may undesirably be spilt into neighbouring sub-pixel for trap.

In addition, the heterogeneity in active OLED layer may be formed as at edge and limit knot due to the defect of film drying Structure contact.The dry defect of film may the material by manufacturing process and/or for limiting structure cause.As limitation trap area subtracts Small, the heterogeneity of layer may occupy the active emission area of pixel, thus in the light for carrying out pixel caused by free heterogeneity Undesirable visual artifact is created in transmitting.Layer uniformity associated with the active emission area of pixel it is obtained opposite Reduce the efficiency that can also adversely affect display, because electrode must more difficulty drive to realize the defeated of relative luminance Out.When the Effect of Materials film seasoning defect drying defect for limiting structure, active OLED material may need to be re-formed.

In addition, the reduction of the ratio of active area and the gross area is likely to reduced the service life of display, wherein the gross area includes The active and non-active area of each pixel as caused by limiting structure and non-homogeneous active emission area.This is because every A electrode must be driven using bigger electric current to realize equal display brightness level, and is driven using more high current Each electrode is known to reduce the pixel service life.The ratio of active area and the gross area is referred to as " fill factor ".

Although conventional ink ejecting method, which is solved, shows the associated some challenges of manufacture with OLED, still have after Continue improved needs.For example, in the presence of the needs for continuing droplet deposition precision in improvement OLED manufacture, especially for high score The OLED display of resolution (that is, high pixel density).Also, exists and reduce by the organic luminous layer in high resolution display Deposit the needs of the undesirable visual artifact of creation.There is also improve the device longevity by the fill factor for increasing each pixel The needs of life.Additionally, there are in terms of realizing acceptable resolution ratio, power efficiency, display life and manufacturing cost There are make in the high resolution display of challenge application (including but not limited to such as high-resolution mobile phone and tablet computer) With with manufacture OLED display in terms of improved needs.

Summary of the invention

The disclosure one or more of can solve the above problem and/or realize one or more of above-mentioned desired character It is a.According to being described below, other features and/or advantages can become obvious.

According to an exemplary embodiment of the present disclosure, the method for manufacture organic light emitting display can be provided.It can be in substrate Upper offer multiple electrodes.It can be via multiple electrodes disposed thereon first hole-conductive layer of the ink jet printing on substrate.It can be with The liquid compatibility property of the selection surface portion of the first hole-conductive layer is changed to limit emission layer restricted area.Each transmitting Layer restricted area can have part corresponding with each of the multiple electrodes that provide on substrate electrode respectively.It can be via Ink jet printing deposits organic luminous layer in each emission layer restricted area.

According to the another exemplary embodiment of the disclosure, a kind of organic light emitting display can be provided.Multiple electrodes can be with It is arranged on substrate.Multiple electrodes can be arranged with array configuration.Limiting structure can be arranged on substrate.Limiting structure Multiple electrodes can be surrounded.First hole-conductive layer can be arranged in limiting structure above multiple electrodes.First hole passes The liquid compatibility property of the surface portion of conducting shell can be changed to limit emission layer restricted area in the first hole-conductive layer Domain.Organic luminous layer can be arranged in each emission layer restricted area.

In another exemplary embodiment of the present disclosure, organic light emitting display can be made by the technique such as provided.It can To provide substrate, which includes the multiple electrodes being disposed on the substrate.Via ink jet printing, in the multiple electrodes on substrate Side deposits at least one hole-conductive layer.The liquid compatibility property of the selected section of at least one hole-conductive layer can be changed To limit emission layer restricted area on the surface of at least one hole-conductive layer.It, can be at least one via ink jet printing Organic luminous layer is deposited in each emission layer restricted area limited in hole-conductive layer.

Additional target and advantage will state partially in the following description, and according to the description will be partially it will be evident that Or it can be recognized and practicing this introduction.It, can by means of the element particularly pointed out in the following claims and combination With at least some of target and the advantage that the disclosure is achieved and obtained.

It should be understood that aforementioned general description and the two described in detail below are only exemplary and explanatory, and do not limit Claim.It should be understood that various embodiments of the present invention, it in its broadest sense, can be in these no illustrative aspects It is practiced in the case where the one or more features of embodiment.

Detailed description of the invention

Merge in the description and the attached drawing for constituting specification a part illustrates some of the disclosure together with the description Exemplary embodiment, for explaining specific principle.In the accompanying drawings,

Fig. 1 is the partial plan layout of normal pixels arrangement；

Fig. 2 is the partial plan layout arranged according to the exemplary pixels of the disclosure；

Fig. 3 A is viewgraph of cross-section of the limitation trap according to the exemplary embodiment of the disclosure along the line 3A-3A in Fig. 1；

Fig. 3 B is viewgraph of cross-section of the multiple limitation traps according to the exemplary embodiment of the disclosure along the line 3B-3B in Fig. 1；

Fig. 4 is the viewgraph of cross-section according to the view similar to Fig. 3 A of the another exemplary embodiment of the limitation trap of the disclosure；

Fig. 5 A is the viewgraph of cross-section according to the view similar to Fig. 3 A of the another exemplary embodiment of the limitation trap of the disclosure；

Fig. 5 B is the viewgraph of cross-section according to the view similar to Fig. 3 B of another embodiment of the limitation trap of the disclosure；

Fig. 6 is the viewgraph of cross-section according to the another exemplary embodiment again of the limitation trap of the disclosure；

Fig. 7 is the viewgraph of cross-section according to the another exemplary embodiment again of the limitation trap of the disclosure；

Fig. 8-11 is according to the another exemplary embodiment of the limitation trap of the disclosure and the example for creating OLED display The viewgraph of cross-section of property step；

Figure 12-19 is the partial plan layout arranged according to the various exemplary pixels of the disclosure；

Figure 20 is the front view according to the exemplary means including electronic console of the disclosure；

Figure 21 is the front view according to the another exemplary device including electronic console of the disclosure；

Figure 22 is the plan view according to the exemplary embodiment of the OLED display of the disclosure；

Figure 23 is viewgraph of cross-section of the OLED according to the exemplary embodiment of the disclosure along the line 23-23 in Figure 22；

Figure 24-29 is depicted and is used for according to the viewgraph of cross-section of the another exemplary embodiment of the OLED display of the disclosure Create the illustrative steps of OLED display；

Figure 30 is the viewgraph of cross-section of the amplifier section M illustrated in Figure 29；

Figure 31 is the plan view of the amplifier section M illustrated in Figure 29；

Figure 32 is another plan view according to the amplifier section of the another exemplary embodiment of the OLED display of the disclosure；

Figure 33 is the replacement exemplary embodiment of the cross section of the amplifier section M illustrated in Figure 29；

Figure 34-36 is depicted and is used for according to the viewgraph of cross-section of the another exemplary embodiment of the OLED display of the disclosure Create the illustrative steps of OLED display；

Figure 37 is another replacement exemplary embodiment of the cross section of the amplifier section M illustrated in Figure 29 according to the disclosure；

Figure 38 and 39 is depicted and is used for according to the viewgraph of cross-section of the another exemplary embodiment of the OLED display of the disclosure Create the illustrative steps of OLED display；

Figure 40 is the cross of the amplifier section illustrated in Figure 39 according to the another exemplary embodiment of the OLED display of the disclosure Section；And

Figure 41 is the partial plan layout arranged according to the exemplary pixels of the disclosure.

Specific embodiment

It reference will now be made in detail the various exemplary embodiments of the disclosure, example illustrates in the accompanying drawings.As long as possible, identical Appended drawing reference will be used to refer to same or similar part in entire attached drawing.

For the purpose of this specification and the appended claims, unless otherwise directed, in specification and claims Used in expression quantity, all numbers of percentage or ratio and other numerical value should be understood in all examples by Term " about " is modified, for they are modified so not yet.Therefore, unless contrary instructions, in following description and The numerical parameter stated in appended claims is can to depend on seeking the desirable properties that will be obtained and the approximation changed. At least, it and is not intended to limitation doctrine of equivalents and is applied to the scope of the claims, each numerical parameter should be according at least to It the numerical value for the effective digital reported and is explained by the common rounding-off method of application.

It should be noted that as used in the specification and the appended claims, singular " one ", "one" and Any odd number of "the" and any word is using including plural referents, unless understanding and being clearly limited to an instruction Object.As used herein, term " includes " and its phraseological modification are not intended to be restrictive, so that in lists The other similar project that can substitute or be added to listed project is not precluded in the project of record.

In addition, the term of this description is not intended to limit the present invention.For example, spatially relative term, such as " under ", " under Side ", " lower ", " top ", " bottom ", " on ", " higher ", "horizontal", " vertical " etc. can be used for as illustrated in the accompanying drawings As the relationship with another elements or features an of elements or features is described.In addition to the position being shown in the accompanying drawings and orientation In addition, these spatially relative terms are intended to encompass the different location (that is, place) and orientation of device in use or operation (that is, rotation is placed).For example, if the device in attached drawing is reversed, be described as other elements or features " under " or " under Side " element will then the other elements or features " on " or " top ".Therefore, exemplary term " lower section " depends on being somebody's turn to do The overall orientation of device may include above and below two kinds of positions and orientation.Device can also be orientated (rotation in other ways 90 degree or in other orientation positions) and space relative descriptors as used herein be interpreted accordingly.

As used herein, " pixel " is intended to mean the minimum fully functional and repetitive unit of luminescence pixel array.Term " sub-pixel " is intended to mean the part of the discrete light-emitting component for constituting the pixel in pixel, but is not necessarily intended luminous component Whole.For example, pixel may include three primary color sub-pixels in full color display, such as red, green and blue. In monochrome display, term sub-pixel and pixel are equivalent, and are used with can be interchanged.

Term " coupling " for be intended to mean when referring to electronic building brick two or more electronic building bricks, circuit, system or Any combination below is connected, links or is closed in such a way that signal (for example, electric current, voltage or optical signal) can transmit each other Connection: (1) at least one electronic building brick, (2) at least one circuit, or (3) at least one system.Two or more electronic building bricks, Connection, link or the association of circuit or system can be direct；Alternatively there may be intermediate connection, link or associations, and And therefore coupling is not necessarily required to physical connection.

Those skilled in the art will generally receive term " high-resolution " and mean to be greater than 100 pixel of per inch (ppi) resolution ratio, wherein 300ppi is considered very high resolution ratio sometimes.Those of ordinary skill in the art will also Recognize that pixel density is not directly related to size of display.Various exemplary embodiments disclosed herein can be used for small High-resolution is realized in big size of display.For example, the display with about 3 inches to about 11 inches of size can To be implemented as high resolution display.Also, the display with larger size, such as until 55 ' ' or more TV Machine display can also be used together with various exemplary embodiments described herein to realize high resolution display.

As used herein, the layer or structure in surface "upper" include following two situation: the layer be directly adjacent to and The surface that it is formed on above it is directly contacted, and exists between the layer or the structure for being formed in the surface and is situated between Enter layer or structure.

Term " reaction surface active material " is intended to mean can be used for be applied in this during manufacturing OLED display The material of at least one property of this layer is modified when the surface of the layer of display.For example, when reaction surface active material is processed When for the material being for example exposed to radiation, physics, the chemistry of layer associated with the reaction surface active material can be changed And/or at least one of electrical properties.In the exemplary embodiment, term " lyophilic regions " and " lyophobic areas " can be used In reference in layer associated with the reaction surface active material before or after reaction surface active material is processed Surface on obtained apparent surface's energy for generating.For example, " lyophilic regions " can be used for referring to the tool on the surface of this layer There is the part of surface energy, which tends to attract liquid so that lyophilic regions part when liquid is water-based fluid It may, for example, be relative hydropathic.Term " lyophobic areas " can be used for referring to the portion with surface energy on the surface of this layer Point, which tends to repel when liquid is water-based fluid liquid so that lyophobic moieties may, for example, be relative hydrophobic 's.However, lyophobic moieties need not be entirely lyophoby.In other words, lyophobic moieties do not have the surface energy of complete repelling fluid, But on the contrary, liquid will tend to migrate far from lyophobic moieties and be attracted to when lyophobic moieties are adjacent to lyophilic regions Lyophilic regions.

Various factors can influence the deposition accuracy of organic luminous layer in OLED display manufacturing technology.Such factor packet Include for example monitor resolution, droplet size, object droplet area, drop placement error, with oled layer material (for example, active OLED material) the deposited speed of the associated fluid properties of ink (for example, surface tension, viscosity, boiling point) and drop, The ink is combined by the group of oled layer material and one or more carrier fluids.As monitor resolution increases, such as Greater than 100ppi or it is greater than 300ppi, various ask occurs when using the ink-jet printing technology manufactured for OLED display Topic.The high-precision ink gun used in usual printing techniques can produce from about 1 picoliters (pL) to about 50 picoliters (pL) Droplet size, wherein about 10pL be for high-precision ink jet printing application relatively common size.Typical inkjet printing The drop placement precision of system is about ± 10 μm.In various exemplary embodiments, can be provided on substrate limitation trap with Compensate drop placement error.Limitation trap can be the structure for preventing OLED material from migrating out except desired sub-pixel area.In order to Ensure that desired position of the drop accurately on substrate is landed, such as completely in limitation trap, various exemplary embodiments will Limitation trap is configured to wide as the system drop placement error that liquid-drop diameter adds twice.For example, the diameter of 10pL drop is About 15 μm and therefore before parameter instruction is used at least 45 μm in its minimum dimension (25 μm+(2 × 10 μm)) Limit trap.Even for the drop of 1pL, liquid-drop diameter is 12 μm, this indicates at least 32 μm in its minimum dimension of limitation trap.

Dependent in its minimum dimension at least 45 μm limitation trap various pixel layouts can have until It is used in the OLED display of the resolution ratio of 100ppi.However, in the high resolution display greater than 100ppi, for example, 10 PL drop is too big and drop placement precision is too poor and reliably can not unanimously land the limit arrived around each sub-pixel for drop Trap processed is prepared.In addition, being increased as described previously for high resolution display using the structure covering for limiting limitation trap Display surface accumulated amount may negatively affect the fill factor of each pixel, wherein fill factor is defined as the light-emitting area of pixel With total the ratio between elemental area.As fill factor reduces, each pixel must more hardy be driven to realize identical totality Display brightness, to reduce service life and the performance of each pixel of display.

In order to further illustrate with very high-resolution display above-mentioned challenge in it is some, Fig. 1 illustrates one A conventional pixel layout 1700.Pixel 1750 may include the sub-pixel 1720,1730,1740 to be arranged side-by-side arrangement, sub- picture Element 1720 is associated with the light emitting in red color spectrum range, and sub-pixel 1730 is related to the light emitting in green spectral range Connection and sub-pixel 1740 are associated with the light emitting in blue spectral range.Each sub-pixel can be wrapped by limiting structure 1704 It encloses, which forms the limitation trap for corresponding directly to sub-pixel 1720,1730,1740.One pixel electrode can With associated with each limitation trap, so that electrode 1726 corresponds to sub-pixel 1720, electrode 1736 corresponds to sub-pixel 1730, with And electrode 1746 corresponds to sub-pixel 1740.Sub-pixel 1720 can have width D, and sub-pixel 1730 can have width C, with And sub-pixel 1740 can have width B, they can be identical or different from each other.As shown, all sub-pixels can have There is length A.In addition, size E, F and G can indicate the spacing between limitation trap opening.The value of size E, F, G are distributed to some Can be very big in example, 100 μm are greater than, especially in the display of low resolution.However, for compared with high-resolution Rate display, it may be desirable to minimize these sizes to maximize active pixel area, and therefore maximize fill factor. As shown in Figure 1, being the gross area in each of sub-pixel limitation trap by the active pixel area that shadow region indicates.

Various factors can influence size E, F, G, and such as, the minimum value of these sizes may be limited by processing method.Example Such as, in various illustrative embodimentss described herein, E=F=G=12 μm are used as minimum dimension.For example, with 326ppi points In the display of resolution, pixel pitch can be equal to 78 μm and E=F=G=12 μm.In sub-pixel 1720,1730,1740 Each associated limitation trap can have the object droplet area (that is, size B × A, C × A and D × A) of 66 μm of 14 μ m, Wherein it is significantly less than 45 μm of the minimum dimension about the ink-jet drop for using the volume with 10pL being discussed above for 14 μm.It Again smaller than 32 μ m in size for 1pL drop being discussed above.In addition, it is (i.e. related to light emitting to be defined as active pixel area The area of connection) it with the fill factor of the pixel of the ratio between total elemental area is 46%.In other words, the 54% of elemental area corresponds to limit Structure 1704 processed.Along same route, in the display with 440ppi resolution ratio, pixel pitch P can be equal to 58 μm And E=F=G=12 μm.It can have such as 7 μ with each of transmitting sub-pixel 1720,1730,1740 associated limitation trap The object droplet area of m × 46 μm, wherein 7 μm of size be significantly less than be discussed above for 10pL and 1pL ink-jet drop two The minimum dimension that the accurate drop of person is placed.In this case, the fill factor of the display with 440ppi is 30% left side It is right.

It can be aobvious for such as high-resolution according to the deposition technique of various exemplary embodiments described herein Show the deposition of the active OLED layer of the electronic console of device and the improved reliability of landing aspect offer of trap is provided.Active OLED Layer may include for example with one or more of lower layer: hole injection layer, hole transmission layer, electronic barrier layer, organic light emission Layer, electron transfer layer, electron injecting layer and hole blocking layer.The some realizations in active OLED layer being identified above are excellent The realization of active OLED layers select and some is optional for electronic console.For example, at least one hole-conductive layer, such as Hole injection layer or hole transmission layer must exist together with organic luminous layer.The every other layer being identified above can be such as expectation Be included with the light emitting and power efficiency of the electronic console of change (for example, improve) such as OLED display.

The various exemplary embodiments of limitation trap configuration described herein can increase the size of limitation trap, while keep high Pixel resolution.For example, various exemplary embodiments use the relatively large limitation trap across multiple sub-pixels, so that energy It is enough that relatively available droplet size and conventional printing systems precision are used when depositing active oled layer, while also realizing opposite High pixel density.Therefore, it is possible to use it is deposited on the inkjet nozzle of the droplet size from 1pL to 50pL in range, without The print head for having the special configuration of smaller droplet volume and new print system or reconfiguring may be available, It may not be available.Also, by using such biggish limitation trap, small foozle will not have to deposition accuracy Significant negative effect, and the active OLED layer deposited can be remained and is included in limitation trap.

According to various exemplary embodiments, ink-jet printing technology can provide the full and uniform deposition of active oled layer. For example, various assemblies usually used in OLED display lead to the pattern of the height changed in the top surface layer for limiting trap, example Such as, about 100 nanometers of difference in height (nm) or more.For example, the component of such as electrode can be deposited on substrate, so that adjacent Gap is formed between electrode each associated with different subpixel separates addressable electrode to be formed.Either which has Source oled layer is deposited on above the electrode being arranged on the substrate of display, the top surface of electrode in region between adjacent electrodes Plane and display substrate top surface between difference in height may make tribute to the pattern of the oled layer then deposited It offers.Allow active OLED layer to be deposited as according to the exemplary ink jet printing technology of the disclosure and obtained display so that Such as the thickness of the active OLED layer above active electrode area is full and uniform, wherein active electrode area can be and light by The region of the associated electrode in active sub-pixel area of this transmitting.In the exemplary embodiment, at least on active electrode area The thickness of the oled layer of side can be less than the thickness of pixel electrode.Oled layer above active electrode area it is full and uniform Thickness can reduce undesirable visual artifact.For example, OLED ink formed and printing technology can be done to minimize to Determine the heterogeneity of the film thickness deposited in crystallizing field, or even when the area includes both electrode and non-electrode region.Change speech It, can not contribute to the pattern of oled layer by the part that electrode structure covers in crystallizing field, so that oled layer can be with Sufficiently it is consistent with the structure of lower section, the superstructure below this is deposited in crystallizing field.Minimize deposited film thickness It prepares when the heterogeneity of degree can be addressed and activate in particular sub-pixel electrode for substantially uniform light emitting.

According to another exemplary embodiment again, the pixel layout configuration imagined by the disclosure can increase active region face Product.For example, limiting structure can limit limitation trap, there is the continuous area across multiple sub-pixels, so that display is non- Active part (for example, substrate area associated with limiting structure) is reduced.For example, substitution is shown around such as various routine OLED Show that the limiting structure of each pixel electrode in device, multiple pixel electrodes addressed individually can be surrounded by limiting structure, Wherein each pixel electrode can be associated with different pixels.By reducing the area occupied by limiting structure, fill factor It can be maximized, because the ratio between the non-active area of each pixel and active region are increasing.Realize fill factor in this way Increase can enable to realize high-resolution in smaller big small displays, and improve display service life.

Organic hair of the limiting structure including being disposed on the substrate is contemplated according to another exemplary embodiment, the disclosure again Optical display unit, wherein limiting structure is limited to multiple traps in array configuration.Display further include be arranged in each trap and The multiple electrodes being separated from each other.Display can also include first, second and at least one trap in multiple traps Three organic luminous layers, each layer are respectively provided with the first, second, and third light emitting wave-length coverage.Setting has with first and second Multiple electrodes in the associated trap of machine luminescent layer are different from being arranged in multiple in trap associated with third organic luminous layer Electrode.

According to another exemplary embodiment, the disclosure contemplates the organic light emission of the limiting structure including being disposed on the substrate Display, wherein limiting structure is limited to multiple traps in array configuration, including the first trap, the second trap and third trap.Display Can also include being arranged in the first trap and the first multiple electrodes associated with different pixels, be arranged in the second trap and The second multiple electrodes associated with different pixels and at least one the third electrode being arranged in third trap, are provided with Multiple electrodes in each of first and second traps are different from the multiple electrodes being arranged in third trap.Display can also wrap It includes setting the first organic luminous layer with the first light emitting wave-length coverage in the first trap, having in the second trap is set Second organic luminous layer of the second light emitting wave-length coverage and be arranged in third trap have third light emitting wave-length coverage Third organic luminous layer.

According to various other exemplary embodiments, pixel layout configuration may be arranged to extend the service life of device.For example, sub Pixel electrode size can be based on corresponding organic luminous layer wave-length coverage.For example, with the light emitting phase in blue wavelength region Associated pixel electrode can be respectively greater than pixel electrode associated with the light emitting in red or green color wavelength range. Organic layer associated with the blue light emissive in OLED device is relative to organic layer associated with red or green light emitting Usually there is the service life shortened.In addition, operation OLED device is to realize that the luminance level of reduction can increase the service life of device.In addition to Driving blue subpixels are to realize the relative luminance smaller than red and green sub-pixels brightness (for example, by as this field is general The electric current that adjustment known to logical technical staff is provided in addressed sub-pixel) other than, phase is distinguished by increasing blue subpixels For red and green sub-pixels emission area, blue subpixels can be used for being better balanced the longevity of different colours sub-pixel Life, while the suitable overall color balance for remaining as display is prepared.The balance in the improved service life can pass through extension The service life of blue subpixels and the overall life for increasing display.

Fig. 2 illustrates one of organic light emitting diode (OLED) display 100 according to the exemplary embodiment of the disclosure The partial plan layout of exemplary pixels arrangement.Fig. 3 A illustrate substrate an exemplary embodiment along the section identified in Fig. 2 The viewgraph of cross-section of 3A-3A depicts the various structures for being used to form OLED display.One of Fig. 3 B diagram substrate is exemplary The viewgraph of cross-section along the section 3B-3B identified in Fig. 2 of embodiment depicts the various knots for being used to form OLED display Structure.

OLED display 100 generally includes the multiple pixels for example such as limited by dashed boundaries 150,151,152, Transmitting can be created the light of the image shown to user when selectively being driven.In full color display, pixel 150, 151,152 may include multiple and different colors sub-pixel.For example, as shown in Fig. 2, pixel 150 may include red sub-pixel R, green sub-pixels G and blue subpixels B.Such as can be visible in the exemplary embodiment of Fig. 2, sub-pixel needs not be identical Size, although in the exemplary embodiment, they can be same size.Pixel 150,151,152 can be by driving electricity Road limits, driving circuit causes light emitting, so that unnecessary additional structure limits pixel.Alternatively, the disclosure is shown Example property embodiment imagines the various new arrangements of pixel limiting structure, can be included in multiple to describe in display 100 Pixel 150,151,152.Those of ordinary skill in the art are familiar with for providing the ripple shape between pixel and sub-pixel (crisper) arrangement and material for the normal pixels limiting structure described.

Fig. 3 A and 3B are also referred to other than Fig. 2, OLED display 100 may include substrate 102.Substrate 102 can be Any may include the rigidity or flexible structure of one or more layers of one or more materials.Substrate 102 may include for example Glass, polymer, metal, ceramics or combinations thereof.Although not shown in order to simplify, substrate 102 may include that this field is common Additional electronic building brick, circuit or conducting parts known to technical staff.For example, deposit it is any will be in further detail below Before the other structures of discussion, thin film transistor (TFT) (TFT) (not shown) can be formed on substrate.TFT may include for example having At least one of the film of source semiconductor layer, dielectric layer and hard contact, wherein those of ordinary skill in the art will be familiar with making Make material used in such TFT.As discussed below, any layer of active OLED layer can be deposited as and by being formed in base TFT or any pattern of other structures creation are consistent on plate 102.

Limiting structure 104 can be set on substrate 102, so that limiting structure 104 limits multiple limitation traps.Example Such as, limiting structure 104 can be bank structure.Multiple sub-pixels can be associated with each limitation trap and be deposited on each The luminous organic material limited in trap allows all sub-pixel light emitting colors having the same associated with the limitation trap.Example Such as, in the arrangement of fig. 2, limitation trap 120 can receive and emit the associated OLED ink of sub-pixel by the R feux rouges indicated Drop, limitation trap 130 can receive and emit by the drop of the associated OLED ink of sub-pixel of the G green light indicated, with And limitation trap 140 can receive and emit by the drop of the associated OLED ink of sub-pixel of the B blue light indicated.This field is general It is logical the skilled person will understand that, such as by explained further below, limitation trap also can receive various other active OLED layers, packet It includes but is not limited to for example, additional luminous organic material and hole-conductive layer.

Limiting structure 104 can limit limitation trap 120,130,140 to limit material associated with multiple sub-pixels.Separately Outside, limiting structure 104 can prevent OLED ink to be diffused into adjacent trap, and/or can contribute to (by suitable geometric form Shape and surface chemistry) land and drying process so that the film deposited is in the region demarcated by limiting structure 104 Continuously.For example, the edge of the film deposited can contact the limiting structure 104 around limitation trap 120,130,140.Limitation knot Structure 104 can be single structure, or can be made of multiple separated structures of formation limiting structure 104.

Limiting structure 104 can be formed by a variety of materials, and such as, such as light can imaging copolymer or photosensitive silicone resin Dielectric photo anti-corrosion agent material.Limiting structure 104 may include one or more organic principles, after the treatment, base Be for the corrosiveness of OLED ink in sheet it is inert, there is low degasification, there are shallow (such as < 25 degree) at limitation trap edge Side wall inclined plane, and/or with the high repulsion towards one or more inks in the OLED ink that will be deposited in limitation trap Property (phobicity), and can application based on expectations select.The example of suitable material include but is not limited to PMMA(it is more- Methyl methacrylate), PMGI(it is more-polydimethyl glutarimide), DNQ-. novolaks (Novolacs) (chemical diazo naphthoquinone (diazonaphithoquinone) from the combination of different phenol formaldehyde resins), SU-8 resist it is (a series of to be widely used , the exclusive epoxy resin-matrix resist manufactured by MicroChem company), standard resist and/or it is listed here before State the fluorination variant and organic siliconresin resist of any one of material, each of which can further with that This combines or is combined with one or more additives to be further tuned the desired characteristic of limiting structure 104.

Limiting structure 104 can limit the limitation trap with any shape, configuration or arrangement.For example, limitation trap 120, 130,140 any shape that can have rectangle, square, circle, hexagon etc..Limit in individual monitor substrate Trap processed can have same shape and/or size or different shape and/or size.It is associated from different light emitting colors Limitation trap can have similar and different shape and/or size.Also, neighbouring limitation trap can be with alternate light emitting color Associated or neighbouring limitation trap can be associated with identical light emitting color.In addition, limitation trap can column and/or It is arranged in row, wherein column and/row can have alignment uniform or heterogeneous.

Can be used in a variety of manufacturing methods it is any form limitation trap, such as ink jet printing, nozzle print, Slot coated, rotary coating, spraying, silk-screen printing, vacuum thermal evaporation, sputtering (or other physical gas-phase deposite methods), chemistry Vapor deposition etc., and realized not otherwise during deposition technique it is any it is additional patterned can be by using net Plate, one or more lithography steps (for example, photoresist coating, exposure, development and removing), dry ecthing, strip wet etching Etc. realizing.

It as shown in Figure 2, can be by limiting structure 104 according to the limitation trap of various exemplary embodiments 120,130,140 It limits, so that they are across multiple pixels 150,151,152.For example, pixel 150 includes red sub-pixel R, green sub-pixels G and blue subpixels B, they are the parts of different limitation traps 120,130,140.Each limitation trap 120,130,140 can be with Including multiple electrodes, such as 106,107,108,109,136,137,138,139,142,144, wherein limitation trap 120,130, Electrode in 140 can be separated from each other, so that gap S is formed between the neighbouring electrode in limitation trap.In exemplary reality It applies in example, gap S has enough sizes electrode and any neighbouring electrode to be electrically isolated, and in particular, adjacent to electrode Active electrode area can be isolated from each other.Gap or space S can reduce current leakage and improve sub-pixel restriction and totality Pixel limits.

Although for clarity and being easy explanation and being omitted, driving circuit can be set on substrate 102, and in this way Circuit can be arranged below active pixel area (that is, light emitting region) or in non-active pixel region (that is, non-light-emitting area Domain) in.In addition, though not shown, circuit can also be arranged under limiting structure 104.Driving circuit may be coupled to each Electrode addresses each electrode selectively independently of other electrodes in limitation trap.Between between electrode It is being described in detail further below in the region of non-homogeneous pattern caused by gap S.

Limit each electrode 106,107,108,109,136,137,138,139,142,144 in trap 120,130,140 It can be associated with different subpixel.For example, as shown in Fig. 2, limitation trap 120 can be associated with red light emission.Electrode 106,107,108,109 can be located in limitation trap 120 in, wherein each electrode be operable as addressing different pixels (for example, The pixel 151 that is just being illustrated and sub-pixel 152).At least two electrodes can be located in each limitation trap 120,130,140 It is interior.The number for being positioned at the electrode in each limitation trap 120,130,140 can be identical or different from other limitation traps.Example Such as, it as shown in Fig. 2, limitation trap 140 may include two sub-pixels electrode 142,144 associated with blue light emissive, and limits Trap 130 processed may include four sub-pixels 136,137,138,139 associated with green light emitting.

In the exemplary embodiment, limiting structure 104 can be arranged on electrode 106,107,108,109,136,137, 138, in 139,142,144 a part.As shown in figs.3 a and 3b, limitation trap 120 can be limited by limiting structure 104, wherein Limiting structure 104 be partially arranged in above a part of electrode 106,108 and part directly on substrate 102 side without Above electrode.Alternatively, limiting structure 104 can be arranged on 102 top of substrate between the electrode of neighbouring limitation trap.Example Such as, limiting structure 104 can be set on substrate 102 be formed in the associated electrode of different subpixel transmitting color it Between space in so that limiting structure 104 is set directly on substrate 102 and is not set in any part of electrode Side.(not shown) in such a configuration, the electrode corresponding to sub-pixel can be set to be directly adjacent to and (be adjacent to) limit Structure 104 processed or electrode can be spaced apart with limiting structure 104, so as to realize that sub-pixel limits.

It, can when voltage is selectively applied to electrode 106,107,108,109,136,137,138,139,142,144 To generate light emitting in such as sub-pixel of the pixel of pixel 150,151,152.Electrode 106,107,108,109,136, 137,138,139,142,144 can be it is transparent or reflexive, and can by such as metal, mixed metal, alloy, The conductive material of metal oxide, mixed oxide or combinations thereof is formed.For example, in various exemplary embodiments, electrode can To be made of tin indium oxide, magnesium silver or aluminium.Electrode 106,107,108,109,136,137,138,139,142,144 can have Any shape, arrangement or configuration.For example, referring to Fig. 3 A, electrode 106,107,108,109,136,137,138,139,142,144 It can have profile, allow top surface 106a, 108a substantially planar and be parallel to the surface of substrate 102, while electricity Side edge 106b, 108b of pole may be substantially perpendicular to or can be at an angle of relative to the surface of substrate and/or at fillet.

It shall yet further be noted that electrode active part, i.e., part associated with light emitting, be in electrode electrode surface with Do not have between oled layer it is any intervention insulating substrate structure in the case where be set up directly on deposited oled layer lower section that A little parts.By way of example, referring again to Fig. 3 A, the part of electrode 106 and 108 being arranged in below limiting structure 104 It is excluded from the active part of electrode district, and the remainder in the region of electrode 106 and 108 is included in the active portion of electrode district In point.

Electrode can deposit in various ways, such as pass through thermal evaporation, chemical vapor deposition or sputtering method.Such as using The patterning of electrode may be implemented in web plate or photoetching.As described above, electrode 106,107,108,109,136,137,138,139, 142,144 it can have thickness and be spaced apart, so that pattern is formed on substrate 102, such as in figure 3 a with various transversal Face view is preferably shown.In the exemplary embodiment, electrode 106,107,108,109,136,137,138,139,142,144 It can have the thickness of the range from 60nm to 120nm, although this range and unrestricted and larger or smaller thickness It is also possible.

One or more active OLED layers can be provided in each limitation trap 120,130,140, in such as Fig. 3 A and 3B The hole-conductive layer 110 and organic luminous layer 112 shown.Active OLED layer can be deposited so that they can with by Limit trap 120,130,140 in electrode 106,107,108,109,136,137,138,139,142,144 between spacing and Thickness, and the pattern that respectively thickness of active OLED layer generates fully are consistent.For example, active OLED layer can be in trap Gained that is continuous and fully meeting and follow the underlying electrode structures being arranged in each limitation trap with thickness The pattern arrived.

Therefore deposited oled layer can lead to surface topography, be not located parallel to substrate and limit trap across entire Single plane in.For example, due to include setting any surface characteristics of electrode on substrate 102 it is associated relatively under It falls into or raised, the one or both in oled layer 110,112, which can be in nonplanar and single plane in display, is Discontinuous (wherein the plane of display is intended to be parallel to the plane of substrate 102).As indicated, oled layer 110,112 can be with Sufficiently it is consistent with the surface characteristics pattern of lower section, so that the top surface of oled layer can have the shape for following underlying surfaces feature The obtained pattern of looks.In other words, the oled layer of each deposition and setting all underlying layer on substrate 102 and/or table Region feature is sufficiently consistent, so that those underlying layer are after they are deposited to the obtained non-planar top surface of oled layer Pattern contributes.In this way, in the plane across limitation trap for the plane for being parallel to display, have by limiting It, may in layer 110 or 112 or both in the case where the existing surface characteristics of the offers such as electrode, circuit, pixel confining layer in trap Since there is discontinuity relative to rising and/or the decline of plane in (multiple) layers.Although active OLED layer 110 and/ Or 112 do not need ideally to be consistent with underlying surfaces pattern (for example, as explained below, it may be deposited around edge region etc. Thickness non-uniformities in part), but wherein there is no the significant of material to accumulate or the coating of consumption being sufficiently consistent can be with Promote more smooth, consistent and repeatable coating.

As shown in Figure 3A, each layer 110,112 can be substantially continuous in entirely limitation trap 120, so that each layer It is arranged in the essentially all surface characteristics (for example, pixel electrode, circuit, pixel confining layer etc.) in limitation trap 120 Side, wherein limiting structure 104 of each layer of the EDGE CONTACT around limitation trap 120.In various exemplary embodiments, active Oled layer material can be deposited as forming discrete pantostrat in limitation trap completely to basically prevent appointing for the layer in trap Why not continuity (in other words, the region for lacking active OLED layer material in trap).Such discontinuity may cause sub- picture Undesirable visual artifact in the emitting area of element.It is worth noting that, although each layer 110,112 is basic in limitation trap It is upper continuous, as noted above, it is in single plane since layer is because of the limit with the layer side of being deposited thereon even so The existing pattern for the feature being arranged in trap processed be sufficiently consistent and rise/fall and can be discontinuous.For example, in exemplary reality It applies in example, if such rising and/or decline are the amounts of such as 100nm, greater than the thinnest part of the layer that is deposited in trap Thickness, such as 50nm are not then continuous in the plane parallel with display of the OLED material layer in trap.

Layer 110,112 can have substantially uniform thickness in each limitation trap, this can be more uniform light Transmitting is prepared.For the purpose of the application, substantially uniform thickness be may refer to above planar surface region, such as be existed The average thickness of oled layer above active electrode area, but also may include minor change or the office of thickness as described below Portion's inhomogeneities.It, can be pre- above planar surface region in figure 3 a, such as the bottom surface in 106a, 108a and gap Material, for substantially uniform OLED coating, the thickness change of the average thickness away from oled layer can be less than ± 20%, is all Such as less than ± 10% or be less than ± 5%.

However, as noted above, it is contemplated that, surface topography and/or surface chemistry are surrounded in layer 110,112 Change part in be likely to occur the local inhomogeneities of thickness, and in such areas, film thickness can be locally It is deviated substantially from parameter ± 20% defined above, ± 10% or ± 5%.For example, the local inhomogeneities of the thickness of pantostrat is such as In the limitation edge of well structure 104, the edge of pixel confining layer (following discussion), (such as the edge on electrode edge side wall 106b, 108b), or may be due to special with the surface of setting on substrate 102 in the place that electrode and substrate surface meet It levies the change of the surface chemistry between the surface characteristics of associated pattern and/or setting on substrate 102 and occurs.Office The inhomogeneities in portion may cause the deviation of film thickness.For example, local inhomogeneities may deviate in the active of electrode 106,108 The thickness for the layer 110,112 that (for example, along 106a, 108a) is provided above electrode zone.Inhomogeneities may create setting and exist Limit " the edge usually to localize in about 5 μm of -10 μ ms around such surface characteristics in trap on substrate 102 Effect " deviation, in the edge of electrode, circuit, pixel confining layer etc..For the purpose of this application, by OLED film When coating is described as having " substantially uniform thickness " in trap, it is intended that including such " edge effect " deviation.

In the exemplary embodiment, the thickness of each layer 110,112 can be equal to or less than the thickness of electrode, so that often A layer of upper surface is since the sinking formed in the film when gap between the active region of this layer of trans-electrode is without position In the single plane of plane (being parallel to the plane of substrate) for being parallel to display.This is illustrated in such as Fig. 3 A, wherein Dotted line is provided to illustrate the plane P for the plane for being parallel to substrate 102.As indicated, layer 110,112 can have average thickness Degree, it is substantially equal in the region of the layer 110,112 of (over) above the active electrode area of electrode 106,108 Even.However, floor 110,112 can also be in area associated with the change of the pattern as caused by surface characteristics, such as at these It include small and localization uneven thickness around the edge (such as edge adjacent to gap of electrode 106,108) of surface characteristics Degree.

Any manufacturing method can be used and carry out sedimentary 110,112.In the exemplary embodiment, 110 He of hole-conductive layer Ink-jet printing technology can be used to deposit in organic luminous layer 112.For example, the material of hole-conductive layer 110 can be with carrier current Body is mixed to form ink-jet ink, is configured to provide the reliable and uniform landing in limitation trap.For deposition of hole The ink of conducting shell 110 can be delivered to substrate from inkjet nozzle with high speed and enter in each limitation trap.Various exemplary In embodiment, identical hole transport material may be delivered into all limitation traps 120,130,140, to be identical hole Deposition of the conducting shell 110 in all limitation traps 120,130,140 is prepared.It is loaded onto limitation trap in material to be formed After hole-conductive layer 110, display 100 can be dried to allow any carrier fluid to evaporate, the technique may include by Display is exposed to one set period of time of heat, vacuum or ambient enviroment.After drying, display can be in raised temperature The lower baking of degree is to handle deposited membrane material, for example to induce the quality of film for being deposited or have for overall craft The chemical reaction of benefit or the change of film form.Material associated with each organic luminous layer 112 can similarly with Zhu Ruyou The carrier fluid of the mixture of solvent or solvent mixes, and to form ink-jet ink, is configured to provide in limitation trap Reliable and uniform landing.Using ink-jetting process, these inks can be then by inkjet deposited to related to each transmitting color In the suitable limitation trap 120,130,140 of connection.For example, ink associated with red organic luminous layer and the organic hair of green The associated ink of photosphere and with the associated ink of blue organic luminous layer be respectively deposited on corresponding limitation trap 120, 130, in 140.Different organic luminous layers 112 can be deposited simultaneously or sequentially.It is associated with organic luminous layer loading After one or more of ink, for hole-conductive layer, as set forth above, it is possible to similarly dry and baking display.

Although it is not shown, material add active oled layer can be arranged on limitation trap in.For example, OLED display 100 can also include hole injection layer, hole transmission layer, electronic barrier layer, hole blocking layer, electron transfer layer, electron injection Layer, damp-proof layer, encapsulated layer etc., it is all these to be known to those of ordinary skill in the art, and be not discussed in detail herein.

Hole-conductive layer 110 may include one or more for being conducive to the material that hole is injected into organic luminous layer 112 A layer.For example, hole-conductive layer 110 may include the single layer of hole transport material, such as hole injection layer.Alternatively Ground, hole-conductive layer 110 may include multiple layers, such as poly- (3,4-rthylene dioxythiophene): poly- (styrene sulfonic acid) (PEDOT: PSS hole injection layer and such as N, N'- bis--((1- naphthalene)-N, N'- diphenyl) -1,1'- biphenyl)) -4,4'- diamines (NPB) at least one of hole transmission layer.

Organic luminous layer 112 can be deposited over the top of hole-conductive layer 110 so that organic luminous layer 112 with by electricity The pattern of the pattern creation in space and hole-conductive layer between pole, electrode is sufficiently consistent.Organic luminous layer 112 may include Be conducive to photoemissive material, such as electroluminescent organic material.

In the exemplary embodiment, OLED stack (such as all active OLED layers being deposited in limitation trap above electrode) Thickness can be changed from 10nm to 250nm.For example, hole transmission layer can have the thickness of the range from 10nm to 40nm；It is empty Cave implanted layer can have the thickness of the range from 60nm to 150nm；Organic luminous layer can have the range from 30nm to 150nm Thickness；And optionally, hole blocking layer, electron transfer layer and electron injecting layer have the combination of the range from 10nm to 60nm Thickness.

In the exemplary embodiment, it is contemplated that, the drop with about 10pL or smaller volume can be used for generating Each of layer 110,112.In various exemplary embodiments, can be used 5pL or smaller, 3pL or smaller or 2pL or smaller droplet size.From 1 to 20 drop with above-mentioned volume can be used to form oled layer 110,112.

One exemplary and non-limiting embodiment in, the disclosure is imagined limitation trap and is arranged so that, and red, green The area of color or the associated trap 120,130,140 of blue light emissive can be 66 μm of 66 μ m, for 326ppi points The display (for example, pitch=78 μm) of resolution, wherein in this embodiment, the width between adjacent trap can be 12 μm.With tool There is the red being arranged so or the associated area of green sub-pixels light emitting to can be 31.5 μm of 31.5 μ m, and with blue The associated area of sub-pixel light emitting can be 30 μm of 66 μ m, thus with the conventional RGB side-by-side configuration that describes referring to Fig.1 46% fill factor is compared, and 65% overall pixel fill factor is caused.For another exemplary and non-limiting embodiment, Display (for example, pitch=58 μm) with 440ppi resolution ratio, it is contemplated that, will limitation trap be arranged so that with red, it is green The area of color or the associated trap 120,130,140 of blue light emissive can be 46 μm of 46 μ m, wherein similarly, in the implementation In example, the width between adjacent trap is 12 μm.With red or green sub-pixels light emitting phase with such display device structure Associated area can be 20.3 μm of 20.3 μ m, while area associated with blue subpixels light emitting can be 76 μ ms 49.1 μm, so that generation about 46% is filled out compared with 30% fill factor of the conventional RGB side-by-side configuration described referring to Fig.1 Fill the factor.In these embodiments, the width between neighbouring trap can be 12 μm, but as described above, this width can take Different value, although and lesser value can be it is desired (so as to the real estate to distribute to the larger proportion in active electrode area Product is prepared), but can be effectively for this ruler for the processing constraint of the formation of well structure and circuit layout constraint The very little lower boundary of setting.12 μm of value is selected as these exemplary representatives, but those of ordinary skill in the art will manage Solution, without departing from the disclosure and the scope of the claims, also can be used other sizes, such as larger size, such as 20 μm or smaller size, such as 8 μm, 6 μm or even 1 μm.Showing above although those of ordinary skill in the art are further appreciated that In example, red, green and blue limitation trap all has identical size, but other arrangements are also possible.For example, from different hairs Penetrating the associated two limitations trap of color can have identical size and limits from another associated one of different transmitting colors Trap can have different sizes, or can have different sizes from each associated limitation trap of transmitting color.

According to these illustrative, unrestricted arrangements of the disclosure even for the very high resolution ratio of 440ppi Situation be also prepare with the limitation trap greater than 45 μm of minimum trap size, and therefore can permit it is to be used for example The droplet size of about 10pL, to simplify manufacture and taking into account use available from existing ink jet printing droplet size. In addition, foregoing exemplary, it is unrestricted arrangement compared to conventional RGB side-by-side configuration, for the feelings of 326ppi and 440ppi Condition increases separately fill factor about 43% and 84%.More generally useful, being provided according to the various exemplary embodiments of the disclosure makes The enhancing of the fill factor of the high resolution display manufactured with ink-jet, such as very high-resolution display, for its 40% Or bigger enhancing is possible.

As known to those of ordinary skill in the art, after deposition, public electrode (not shown) can be arranged on 112 top of machine luminescent layer.After depositing public electrode, the pattern of obtained public electrode can be with organic luminous layer 112 Pattern be sufficiently consistent.Any manufacturing technology can be used to deposit public electrode, such as pass through vacuum thermal evaporation, sputtering, change Learn vapor deposition, spraying, ink jet printing or other technologies.Public electrode can be transparent or reflexive and can be by The conductive material of such as metal, mixed metal, alloy, metal oxide, mixed oxide or combinations thereof is formed.For example, oxidation The thin layer of indium tin or magnesium silver.The thickness of public electrode can be changed from about 30nm to 500nm.

In addition, public electrode can have any shape, arrangement or configuration.For example, public electrode can be set to Single sub-pixel or the associated discrete layers of single pixel.Alternatively, public electrode can be arranged on multiple sub-pixels or Above pixel, such as the top of the entire pixel arrangement in display 100.For example, public electrode can be deposited on limitation with blanket In trap 120,130,140 and above limiting structure 104.Before depositing public electrode, additional active OLED layer (in order to Simplify and be not shown) it can be deposited on organic luminous layer 112, such as electron transfer layer, electron injecting layer and/or hole barrier Layer.Such additional oled layer can be deposited by ink jet printing, by vacuum thermal evaporation or by another method.

Accoding to exemplary embodiment, OLED device 100 can have top emission configuration or bottom emission configuration.For example, As shown in Figure 3A, in top emission configuration, electrode 106,108 can be reflection electrode and be deposited on organic luminous layer The public electrode of side can be transparent electrode.Alternatively, in bottom emission configuration, electrode 106,108 can be transparent And public electrode can be reflexive.

In a further exemplary embodiment, OLED display 100 can be Activematric OLED (AMOLED).Compared to nothing Source matrix OLED(PMOLED) display, display performance can be enhanced in displayer, but depends on the packet on substrate The active driving circuit of thin film transistor (TFT) (TFT) is included, and such circuit is opaque.Although PMOLED display has Some elements of such as opaque conductive bus, but displayer has substantially more opaque elements.Cause This, for bottom emission displayer, fill factor can be reduced compared to PMOLED because light can only by It is emitted through the bottom of the substrate between opaque circuit element.For this reason, it may be desirable to, AMOLED is shown Device uses top emission configuration, because OLED device can be permitted to be built into active electricity opaque in this way using such configuration On the top of circuit component.Therefore, light can be transmitted through the top of OLED device, without considering the opaque of lower element Property.In general, the fill factor of each pixel 150 of display 100 can be increased using top emission structure, because light is sent out It penetrates not by the blocking for depositing additional opaque element (for example, TFT, drive circuit assembly etc.) on substrate 102.

In addition, the non-active area of each pixel can be limited to be formed limiting structure on substrate 102, surface characteristics And/or pixel confining layer (its example elaborated further below).Conductive grid (grid) can also be arranged on substrate 102 On to prevent the undesirable voltage drop in 100 both ends of display, which can be because of used in top-emitting OLED structure Transparent top electrode usually has low conductivity and occurs.When public electrode is blanket deposited in limitation trap 120,130,140 And when above limiting structure 104, conductive grid can be arranged on the non-active part of substrate 102 and pass through to be formed Via hole in the limiting structure 104 of selection is coupled in public electrode.However, the present disclosure is not limited to the active matrixs of top-emission OLED configuration.Technology discussed herein and arrangement can be with the displays of any other type, such as bottom emission and/or passive Display is used together, and those skilled in the art will appreciate that how to utilize suitable modification.

In the exemplary embodiment, as shown in Figure 3A, each limitation trap may include multiple active subpixel areas, they Respectively across W1 and W2, and separated by gap S, and be restricted in the trap with width C W.Size W1, W2 and CW are main Related with pixel pitch, pixel pitch is related to resolution ratio (for example, 326ppi, the 440ppi) of display.The size of gap S with Technology of preparing and technique it is associated limitation and be laid out related.In general, it may be desirable to minimizing related to gap S The size of connection.For example, 3 μm can be minimum dimension；However, it will be understood by one of ordinary skill in the art that from as low as 1 μm to being greater than 10 μm of size is also possible.The height H of limiting structure 104 is also limited with processing rather than specific display is laid out or divides Resolution is related.Although the example values of the height H of limiting structure 104 can be 1.5 μm, in various exemplary embodiments, Height H can μm variation from 0.5 μm to 5.Referring to the limit that Fig. 3 B, BW are between neighbouring trap (such as trap 120 and 130 in Fig. 3 B) The width of structure 104 processed.As discussed above, it is desired to minimize this size and example values are 12 μm.However, this Field ordinarily skilled artisan will understand that, in some cases, this value can arbitrarily large (for example, hundreds of microns), and depend on In the technology of preparing and technique that can permit the value small in this way for BW, 1 μm also can be as small as.

Referring now to Fig. 4, the viewgraph of cross-section of the exemplary embodiment of the limitation trap 220 of display 200 is shown.Fig. 4's Arrangement is similar to the arrangement described above by reference to Fig. 3 A, and wherein like numeral is for indicating similar components, in addition to using and 100 systems It arranges other than 200 opposite series.However, as shown, OLED display 200 further includes being arranged between electrode 206,208 Additional surface feature 216 in the S of gap.

Surface characteristics 216 can be any structure not directly being provided to electric current in the OLED film being disposed above, To include the non-active area of the pixel region between active region associated with electrode 206 and 208.For example, surface is special Sign 216 may further include opaque material.As depicted in fig. 4, hole-conductive layer 210 and organic luminous layer 212 can sink Product is such as the top of a part of circuit element as surface characteristics 216 with pattern expression.Include in surface characteristics 216 In the case where electrical component, such element can further be coated by electrically insulating material these elements and to be deposited on table OLED film on region feature 216 is electrically isolated.

In the exemplary embodiment, surface characteristics 216 may include driving circuit, including but not limited to for example, interconnecting, being total Other circuits known to line, transistor and those of ordinary skill in the art.In some displays, driving circuit is arranged to By minimizing complicated interconnection near the active region of the pixel of such circuit drives and reducing voltage drop.In some feelings Under condition, limitation trap will be around an other sub-pixel, and such circuit can be in the outside of limitation well area, so that circuit is not It can be coated by active OLED layer.However, in the exemplary embodiment of Fig. 4 and in other embodiments described herein, because Limitation trap 220 may include multiple sub-pixels associated with different pixels, and such driving circuit element may be provided in Limit trap in, this can optimize driving electronic device electric property, optimization driving electronic device layout and/or optimization filling because Son.

Hole-conductive layer 210 and organic luminous layer 212 can deposit (such as preceding discussion, referring for example to Fig. 3 A and 3B) to by It limits in the region that well structure 204 limits and above surface characteristics 216, so that the surface characteristics of layer 210,212 and lower section Pattern is sufficiently consistent, and has substantially uniform thickness in limitation trap, has so as to cause layer 210 and 212 non-planar Top surface.One or both of layer 210 and 212 is extended greater than above the plane of the top surface of electrode in surface characteristics 216 In the configuration of the distance of thickness, then one or both of these layers are in the plane parallel with the plane of display in trap 220 It also will be discontinuous.Therefore, one or two layer 210,212 in the plane parallel with the plane of display due to surface The associated protrusion of feature 216 and will be non-planar and discontinuous.Ibid, this is for example illustrated by dotted line, which illustrates with The coplanar plane P in 212 surface of 206,208 top of electrode is set.As indicated, layer 212 limits trap right and wrong across entire Plane, and be sufficiently consistent with the pattern of lower section instead, so that layer 212 has always due to gap area S and protrusion 216 The nonplanar top surface of body.In other words, before the deposition of layer 210,212, one or both of layer 210,212 will be across limitation trap Raising and lowering with existing pattern to be sufficiently consistent.

Although surface characteristics 216 is illustrated as the thickness for having greater than electrode in Fig. 4, surface characteristics 216 can be replaced There is the thickness less than or equal to electrode with changing.Although also, surface characteristics 216 is illustrated as being arranged in Fig. 4 in substrate 202 On, but surface characteristics 216 can also be arranged on above one or both of electrode 206,208.Surface characteristics 216 is for array In each limitation trap can it is different and and not all limitation trap must include surface characteristics.Surface characteristics 216 can also be used Make pixel confining layer, wherein the opaque property of surface characteristics 216 can be used for limiting the partially or totally pixel cloth of sub-pixel It sets.

Referring now to Fig. 5 A and 5B, the part that the another exemplary embodiment of trap is limited according to the display of the disclosure is illustrated Viewgraph of cross-section.The arrangement of Fig. 5 A and 5B are similar to the arrangement described above by reference to Fig. 3 A and 3B, and wherein like numeral is used for table Show similar components, other than using 300 series opposite with 100 series.However, as shown in Figure 5 A and 5B, OLED display 300 further include confining layers 314.Confining layers 314 can be deposited on substrate 302, and wherein limiting structure 304 can be arranged on limit 314 top of given layer.In addition, confining layers 314 can be arranged on the non-active upper of electrode 306,308.Confining layers 314 can To be any physical structure with electrical insulation property for limiting the part of OLED display 300.In embodiment, it limits Layer 314 can be pixel confining layer, can be any physical structure for describing pixel in pixel array.Confining layers 314 can also describe sub-pixel.

As shown, in the exemplary embodiment, confining layers 314 can extend beyond limiting structure 304 in electrode 306,308 a part top.Confining layers 314 can be made of resistance material, so that confining layers 314 prevent electric current flowing simultaneously And therefore undesired visual artifact can be reduced and basically preventing the light emitting via sub-pixel edge.Confining layers 314 may be provided with as with the non-homogeneous of the place for mitigating or preventing OLED film to be coated in above the edge of confining layers The structure and chemical action of the formation of property.In this way, confining layers 314 can contribute to around masking surface characteristics be formed Otherwise the heterogeneity of film will be included in the active region of pixel region and then to the heterogeneity of pixel and make tribute It offers；Such heterogeneity is likely to occur in the outer edge of such as each sub-pixel in the place of OLED film contact limitation trap, Or the inside edge of each sub-pixel in the place of OLED film contact substrate surface.

Hole-conductive layer 310 and organic luminous layer 312 can be deposited in the region limited by limiting structure 304 and To form pantostrat in limitation trap 320 above the pixel confining layer.As described in above with respect to Fig. 3 A and 3B, layer 310, 312 can sufficiently be consistent with the overall pattern of limitation trap, and therefore can have nonplanar surface and/or in display Be in plane it is discontinuous, as example as shown in the plane P in Fig. 5 A.As the exemplary embodiment above by reference to Fig. 3 A solves It releases, the thickness of hole-conductive layer 310 and organic luminous layer 312 can be basically uniform, as described above.

In the exemplary embodiment, as shown in Figure 5A, each limitation trap may include multiple active subpixel areas, including W1, W2 separated by gap S, and being comprised in the limitation trap with width C W, wherein W1, W2 and CW mainly with pixel section Away from related, as above by reference to being discussed Fig. 3 A.Similarly, the size of gap S and preparation and processing technique, and layout are related, Wherein in the exemplary embodiment, S can from 1 μm to be greater than 10 μm variation, wherein 3 μm be S exemplary dimensions.Limiting structure 304 height H can be as above by reference to described in Fig. 3 A.Referring to Fig. 5 B, as described above, BW is the limitation knot between neighbouring trap The width of structure 304, and can be selected referring to as described in Fig. 3 B.

Size T associated with the thickness of confining layers can be based on technology of preparing and treatment conditions and used Limit the type of layer material and variable.In various exemplary embodiments, size T associated with the thickness of confining layers can be with μm variation from 25nm to 2.5, but most typical range is considered from 100nm to 500nm.As desired, it can choose With confining layers be more than limit trap in the extension at edge of limiting structure 104 it is associated in fig. 5 labeled as B1, B2 with And in figure 5B be labeled as B1, B1 ' size.However, by the amount for reducing available active pixel electrode area, biggish ruler It is very little to contribute to the reduction of fill factor.Therefore, it may be desirable to, it selects the minimum dimension of service expectation function, This usually eliminates edge inhomogeneities from active electrode area.In various exemplary embodiments, this size can be from 1 μm It is changed to 20 μm, and can such as μm variation from 2 μm to 5.

Referring now to Fig. 6, the viewgraph of cross-section of the exemplary embodiment of the limitation trap 420 of display 400 is illustrated.Fig. 6's Arrangement is similar to the arrangement that describe above by reference to Fig. 5 A and 5B, and wherein like numeral is for indicating similar components, in addition to using and Other than 400 opposite series of 300 series.However, as indicated, OLED display 400 further includes being arranged between electrode 406,408 Gap S in additional confining layers 416.As shown in fig. 6, confining layers 416 can be surface characteristics, there is the surface with Fig. 4 The slightly different structure of feature, the difference is that, a part of additional confining layers 416 extends through on substrate 402 Gap S and in the upper of the electrode of adjacent gap 406,408.Additional confining layers 416 can have any pattern, The pattern illustrated in middle Fig. 6 is merely exemplary.As shown in Figure 6, recess 417 can reside in additional confining layers 416 With substrate 102 back to surface in.Various methods can be used to be formed in recess 417.For example, recess 417 can be by manufacture work Skill generates so that during the deposition of additional confining layers 416, layer 416 can usually with existing any pattern in limitation trap, Such as electrode 406,408 is sufficiently consistent, the substantially uniform thickness and tool that wherein recess 407 passes through 406,408 top of electrode There is the different-thickness between the thickness substantially heterogeneous on the surface unrelated to the top surface of electrode 406,407 and shape At.Alternatively, for example, additional confining layers 416 are deposited using non-conformal deposition method so that lower section surface topography In the case where being smoothed, recess 407 can be omitted and the top surface of additional confining layers 416 can have it is substantially planar Pattern.

In any configuration, hole-conductive layer 410 and/or organic luminous layer 412 can be deposited (as previously referring for example to What Fig. 3 A and 3B were discussed) so that layer 410,412 is sufficiently consistent with the pattern of additional confining layers 416, and have substantially Uniform thickness, as already described above.

The distance between the top surface (that is, back to surface of substrate) of additional confining layers 416 and substrate 402 can be greater than Or the distance between top surface less than electrode 406,408 and substrate 402.Alternatively, the top surface of additional confining layers 416 The distance between substrate 402 is substantially equal to the distance between top surface and substrate 402 of electrode 406,408.Change speech It, the thickness of additional confining layers 416 may be such that it from the top for the top surface and the limiting structure 404 surrounded for being located at substrate It is changed between surface, or it is located substantially in plane identical with the top surface of limiting structure 404.Alternatively Ground, additional confining layers 416 can be substantially with electrode 406,408 identical height so that additional confining layers 416 not with A part overlapping of electrode 406,408, and gap S between the two is filled on the contrary.

What hole-conductive layer 410 and organic luminous layer 412 can be arranged on confining layers 414 extends beyond limiting structure 404 and enter the upper in trap 420, and layer 410,412 can be in the limitation trap 420 limited by limiting structure 404 Extend above interior additional confining layers 416.Additional confining layers 416 can be made of resistance material, so that additional confining layers 416 can To prevent electric current flowing and therefore can be by preventing from reducing undesirable vision by the light emitting at the edge of sub-pixel Artifact.Confining layers 414 and additional confining layers 416 can be made from the same material or a different material.

In the exemplary embodiment, as shown in fig. 6, each limitation trap may include multiple active subpixel areas, including It by the gap S W1 separated and W2 and is comprised in the limitation trap with width C W, wherein W1, W2, CW and S be mainly and pixel Pitch is related, as described above.Ibid, 3 μm of minimum dimensions that can be S, but it will be appreciated by the skilled addressee that from as low as 1 μm to even greater than 10 μm of size is all possible.For example, the height H of limiting structure 404 can be selected and be had such as The range described above by reference to Fig. 3 A and 3B.

Size T1 associated with the thickness of confining layers and size T2 associated with the thickness of additional confining layers can be It is variable based on preparation techniques, treatment conditions and the used type for limiting layer material.Therefore, with the thickness phase of confining layers Associated size T1 and size T2 associated with the thickness of additional confining layers can be changed from 50nm to 2.5 μm, such as from 100nm to 500nm.Size associated with the extension of confining layers inside the edge of limitation trap can be selected as desired SB1, SB2 and B2.However, biggish size will be to fill factor by the amount for reducing available active pixel electrode area Reduction contributes.Therefore, it may be desirable to, it selects by the minimum dimension of the function of service expectation, usually from active electrode Edge non-uniformity is excluded in area.In various exemplary embodiments, this size can be changed from 1 μm to 20 μm, and can With such as μm variation from 2 μm to 5.

As those of ordinary skill in the art will be understood that based on the disclosure, any of disclosed confining layers configuration can Come with any combination in different ways using to realize that desired pixel limits configuration.For example, confining layers 414 and/or additional Confining layers 416, which can be configured as, limits any pixel and/or subpixel area or any local pixel and/or sub- picture Plain region, wherein confining layers 414 can be associated with the confining layers being deposited under any limiting structure 404, and additional restriction Layer 416 can be in the limitation trap of deposition between the electrodes, and any confining layers such as in limitation trap 420 are associated.Commonly It will be recognized that the cross section shown in the disclosure is only illustrative cross section and therefore the present disclosure is not limited to institutes The certain cross section shown.For example, although Fig. 3 A and 3B are illustrated respectively along line 3A-3A and 3B-3B, along difference Line, for example including also can reflect different confining layers from the varying cross-section view extracted on 3A-3A and 3B-3B orthogonal direction Configuration.In the exemplary embodiment, confining layers can be applied in combination to draw out pixel profile, all pixels as illustrated in Figure 2 150,151,152.Alternatively, confining layers are configurable to limit sub-pixel, so that confining layers completely or partially surround Limit the pixel electrode in trap.

Referring now to Fig. 7, illustrate and the viewgraph of cross-section of another exemplary embodiment.OLED display 500 may include Surface characteristics 516 and confining layers 514.The arrangement of Fig. 7 is similar to the arrangement described above by reference to Fig. 4, and wherein like numeral is used for Similar components are indicated, other than using 500 series opposite with 200 series.However, as shown in fig. 7, OLED display 500 It further include the confining layers 514 being arranged under limiting structure 504.Confining layers 514 can be the portion for limiting OLED display 500 Any physical structure divided.In embodiment, confining layers 514 can be for describe the pixel in pixel array and/ Or the confining layers of any physical structure of the sub-pixel with pixel.As shown, in the exemplary embodiment, confining layers 514 can To extend beyond limiting structure 504 and above a part of electrode 506,508.Confining layers 514 can be by resistance material system At so that confining layers 514 prevent electric current flowing and therefore can be by preventing from subtracting by the light emitting at sub-pixel edge Few undesired visual artifact.In this way, confining layers 514, which can contribute to masking, to be sent out due to edge drying effect The film layer inhomogeneities that the raw edge in each sub-pixel is formed.Hole-conductive layer 510 and organic luminous layer 512 can be by Deposition (as previously discussed referring for example to Fig. 3 A and 3B), so that the abundant phase of surface characteristics pattern of layer 510,512 and lower section Symbol, and there is substantially uniform thickness, as already described above.

It will be appreciated by the skilled addressee that various arrangements and structure, such as surface characteristics, confining layers etc. are only to show Example property, and various other combinations and arrangement can be contemplated and fall within the scope of the disclosure.

Referring now to Fig. 8-11, the partial cross-sectional view of substrate is illustrated, which show showing for manufacture OLED display 600 Various illustrative steps during example property method.It is described although discussing manufacturing method hereinafter with reference to display 600 Either one or two of step and/or all can be used for manufacturing other OLED displays, for example, above-mentioned OLED display 100,200, 300,400 and 500.As shown in figure 8, electrode 606,608 and surface characteristics 616 may be provided in 602 top of substrate.Electrode 606,608 and surface characteristics 616 any manufacturing method can be used to be formed, such as ink jet printing, nozzle print, slit apply It covers, rotary coating, vacuum thermal evaporation, sputtering (or other physical gas-phase deposite methods), chemical vapor deposition etc., and not with it Its mode is included in any additional patterning in deposition technique can be by using web plate, photoetching (photoresist painting Cover, expose, develop and remove), wet etching, dry ecthing, strip etc. to realize.Electrode 606,608 can be same with surface characteristics 616 When formed, or be sequentially formed with the electrode or surface characteristics being initially formed.

As shown in figure 9, confining layers 614 and additional confining layers 618 can be subsequently deposited at surface characteristics 616 and electrode 606, 608 tops.Layer 614 and 618 can be used any manufacturing method and be formed, such as ink jet printing, nozzle print, slot coated, rotation Turn coating, vacuum thermal evaporation, sputtering (or other physical gas-phase deposite methods), chemical vapor deposition etc., and not with other sides Formula is included in any desired additional patterning in deposition technique can be by using web plate, photoetching (photoresist Coating, exposure, development and removing), wet etching, dry ecthing, strip etc. to realize.Confining layers 614 can be with additional confining layers 618 It is formed simultaneously or layer 614,618 can be sequentially formed with the layer 614 or 618 being initially formed.

Limiting structure 604 is provided at 614 top of confining layers.Limiting structure 604 can be formed to define limiting structure 620, which surrounds multiple pixel electrodes 606,608, while across multiple pixels.Limiting structure 604 can make Formed with any manufacturing method, such as ink jet printing, nozzle print, slot coated, rotary coating, vacuum thermal evaporation, sputtering (or Other physical gas-phase deposite methods), chemical vapor deposition etc., and be not included in other ways any in deposition technique Additional patterning can be by using web plate, photoetching (photoresist coating, exposure, development and removing), wet etching, dry corrosion It carves, strip etc. to realize.In an example technique, as shown in Figure 10, limiting structure material can be heavy with pantostrat 604 ' Product is above substrate 602 and the layer then can be used mask 607 and be patterned, so that a part 605 of layer 604 ' can To be removed to expose pixel electrode 606,608.Limiting structure 604 passes through the remaining layer after part 605 is removed 604 ' material is formed.Alternatively, limiting structure 604 can be formed by actively deposition materials, thus only shape At the limiting structure, so that the limiting structure 604 that is deposited with limited boundary and can limit trap and be formed on and deposited In the boundary of limiting structure 604.

In the exemplary embodiment, as shown in Figure 10, each limitation trap may include multiple active subpixel areas, including By the gap S W1 separated and W2.Ibid, size W1, W2 and CW is mainly related with pixel pitch.Also, the size of gap S and with Technology of preparing is related with associated limitation is handled, and can change from 1 μm to even greater than 10 μm, wherein 3 μm are examples Property minimum dimension.Size SB1 associated with extension of the confining layers inside the edge of limitation trap can be selected as desired And SB2.However, by the amount for reducing available active pixel electrode area, biggish size will do the reduction of fill factor It contributes out.Therefore, it may be desirable to, it selects usually to exclude the minimum dimension of service expectation function from active electrode area Edge non-uniformity.In various exemplary embodiments, this size can be changed from 1 μm to 20 μm, and can be such as μm variation from 2 μm to 5.

As shown in figure 11, hole-conductive layer 610 then can be used ink jet printing and be deposited in limitation trap 620.For example, spray (multiple) drop 651 of hole transport material is guided in the target area that injection nozzle 650 can limit in limitation trap 620.Hole Conducting shell 610 can also include two discrete layers, such as hole injection layer and hole transmission layer, and as described in this, this A little layers can be sequentially deposited by ink ejecting method.In addition, ink jet printing, which can be used, in organic luminous layer 612 is deposited on hole biography In the limitation trap 620 of 610 top of conducting shell.Inkjet nozzle 650 can guide organic in the target area above hole-conductive layer 610 (multiple) drop 651 of luminescent material.Although it will be appreciated by the skilled addressee that 1 discuss single-nozzle referring to Fig.1, But multiple nozzles may be implemented also to provide the liquid comprising hole transport material or luminous organic material in multiple limitation traps Drop.As known to those of ordinary skill in the art, in some embodiments, can from multiple inkjet nozzle heads simultaneously sedimentary facies it is same Or the luminous organic material of different colours.Further, it is possible to use technology known to persons of ordinary skill in the art is executed to mesh It marks the drop injection of substrate surface and places.

In the exemplary embodiment, single organic luminous layer 612 can be deposited in limitation trap 620, such as red, green Or cyan coloring layer.In the exemplary embodiment of replacement, multiple organic luminous layers can be deposited in limitation trap 620, and one another One top.Such arrangement can work when such as luminescent layer has different light emitting wave-length coverages, so that at one When luminescent layer is activated to emit light, another luminescent layer does not emit light or interferes with the light emitting of the first organic luminous layer.Example Such as, red organic luminous layer or green organic luminous layer can be deposited in limitation trap 620 and subsequent blue organic luminous layer It can be deposited on above red or green organic luminous layer.In this way, although limitation trap may include two different hairs Photosphere, but only one luminescent layer is configured as emitting light in limitation trap.

Layer 610 and 612 can be deposited, so as to confining layers 614, surface texture 616, additional confining layers 618 and electrode 606,608 pattern is sufficiently consistent, and as already described above, and can have substantially uniform thickness as described above Degree.

It can be used for various pixels and sub-pixel cloth according to the disclosure above by reference to Fig. 3 A-11 various aspects described Office, wherein Fig. 2 is only exemplary and unrestricted such layout.It depicts in Figure 12-18 and is set by the disclosure The various additional exemplaries layout thought.It is described herein exemplary to realize that various exemplary layouts have illustrated that there are many modes Embodiment；In many cases, the selection of any specified arrangement is driven by various factors, and such as electric circuit is basic Layout, desired primitive shape (are portrayed as rectangle and hexagonal shape but it is also possible to be other shapes in the illustrated embodiment Shape, herringbone, circle, hexagon, triangle etc.), and factor related with the visual appearance of display is (such as, right It is pseudo- in different configurations and the vision being observed that for the different types of display content of such as text, figure or mobile video Shadow).It will be appreciated by the skilled addressee that other a large amount of layouts fall within the scope of the disclosure and can by modification and It is obtained based on principle described herein.Although in addition, it will be appreciated by the skilled addressee that put it more simply, following The limiting structure for limiting limitation trap is only described in the description of Figure 12-18, but above by reference in the feature of Fig. 3 A-11 description Any feature, can be with any layout in pixel layout in this including surface characteristics, circuit, pixel confining layer and other layers It is applied in combination.

Figure 12 describes the part plan for the pixel of OLED display 700 and the exemplary embodiment of subpixel layouts Figure, and its layout for being similar to Fig. 2, wherein the further aspect of the layout will be described below.Limiting structure 704, such as Bank structure as discussed above may be provided on substrate, thus with array configuration limit multiple limitation traps 720,730, 740.Each limitation trap 720,730,740 may include the substantially continuous layer (being indicated by shadow region) of OLED material, with So that organic layer extend through limitation trap 720,730,740 to around limitation trap limiting structure 704, such as each trap 720, 730, the edge of the OLED material layer in 740 can contact limiting structure 704.Oled layer may include such as hole injection material Material, hole mobile material, electron transport material, electron injection material, hole barrier materials and be different light emitting wavelength models One or more of the luminous organic material that the transmitting enclosed is prepared.For example, limitation trap 720 may include and red wavelength model It the associated organic luminous layer of light emitting in enclosing and is indicated by R, limitation trap 730 may include by G instruction and green wave The associated organic luminous layer of light emitting in long range, and limitation trap 740 may include by B instruction with blue wavelength model Enclose the interior associated organic luminous layer of light emitting.Trap 720,730,740 can have including various arrangements relative to each other With configuration (such as layout).For example, as shown in figure 12, separately including the limit of red organic luminous layer R and green organic luminous layer G The R that is expert at is set to be alternately arranged in trap 720 processed and limitation trap 730₁、R₃In.With row R₁And R₃It is alternately comprising the organic hair of blue The row R of the limitation trap 740 of photosphere B₂、R₄.Limitation trap 720,730 can also alternatively arrange the R that is expert at₁、R₃It is interior.

Multiple electrodes 706,707,708,709；736,737,738,739；And 742,744 can be respectively set at it is every In a limitation trap 720,730,740, wherein each electrode can be sent out with the specific light with such as red, green or blue light emissive It is associated to penetrate the associated sub-pixel of color.It can be defined in Figure 12 by the pixel of broken line representation 750,751,752,753 Be include a sub-pixel with red light emission, one there is blue light with the photoemissive sub-pixel of green and one The sub-pixel of transmitting.For example, each limitation trap 720,730,740 can respectively include multiple electrodes 706,707,708,709； 736,737,738,739；And 742,744, it is configured such that their associated electrode active regions correspond to Figure 12 Shown in electrode shape, be separated from each other.Limitation trap 720,730,740 can have different numbers in the limitation trap And/or the electrode of arrangement.Alternatively, additional arrangement is possible, such as with the packet for being different from red, green and blue Include the arrangement for other color groups that the color comprising more than three sub-pixel colors combines.Other arrangements are also possible, wherein The sub-pixel of more than one single color is associated with specific pixel, for example, each pixel can have it is associated there Multiple sub-pixels of one red, a green and two blue subpixels or particular color other combination and it is more Other combinations of a color.Also, if multiple and different luminous material layers are located at top each other, it is contemplated that, different colours Sub-pixel can overlap each other.As shown in figure 12, pixel electrode can be opened with the spacing structure for limiting limitation trap.Implement in replacement In example, pixel electrode can be deposited as so that they are directly adjacent to limitation well structure, so that electrode and limiting structure Between it is very close to each other.In addition, limitation well structure can be arranged on a part top of pixel electrode.

In addition, neighbouring limitation trap can have different sub-pixel arrangements.For example, as shown in figure 12, limiting 720 He of trap 730 include that 2 × 2 active electrode areas are arranged, and are limited trap 740 and arranged including 1 × 2 active electrode area, wherein 2 × 2 cloth The active electrode area set be have same size square and 1 × 2 arrangement in active electrode area be with phase With the rectangle of size.As noted above, the electrode in different limitation traps can have the surface face of different active regions Product.

In an exemplary arrangement, with the electrode for being addressed to the photoemissive sub-pixel in blue wavelength region B Associated active region can have than with for the electricity to the light emitting addressing in red and/or green color wavelength range R, G The big surface area of extremely associated active region.It is to be expected that with the photoemissive son in blue wavelength region B The active region of the associated electrode of pixel has more associated than with the associated pixel electrode of red or green light emitting The big surface area of active region because when being operated under same area luminance level, son associated with blue light emissive Pixel usually has the service life substantially shorter than sub-pixel associated with red or green light emitting.Increase and blue light emissive The confronting active area of associated sub-pixel makes it possible to operate with relatively low area luminance level, still maintains simultaneously Identical overall display luminance, to increase the service life of sub-pixel associated with blue light emissive and the overall longevity of display Life.It should be noted that sub-pixel associated with red and green light emitting can be relative to sub- picture associated with blue light emissive Element accordingly reduces.This can cause to the red and green associated sub-pixel of light emitting relative to related with blue light emissive The sub-pixel of connection is driven with higher brightness levels, this can reduce the service life of red and green OLED device.However, with it is red and The service life of the green associated sub-pixel of light emitting can be considerably longer than the service life of sub-pixel associated with blue subpixels, make It obtains sub-pixel associated with blue light emissive and keeps limited sub-pixel relative to the overall display service life.Although limiting trap The active region of electrode in 740 is illustrated as in the case where having their prolonging direction horizontally extended in Figure 12 It is arranged, but electrode can also alternatively be arranged such that their prolonging direction extends vertically in Figure 12.

Interval between neighbouring limitation trap can be equal or can change throughout pixel layout.For example, referring to figure 12, limit the interval f ' that the interval b ' between trap 720,730 can be greater than or equal between limitation trap 720 or 730 and 740.It changes Yan Zhi, in the orientation of Figure 12, the horizontal interval between neighbouring limitation trap in a row be can be different from adjacent row Perpendicular separation between neighbouring limitation trap.Also, row R₁、R₃In horizontal interval b ' can be equal to or different from that R₂、R₄In water Flat interval a '.

Spacing (gap) between the active region of electrode in each of different limitation trap 720,730,740 Can be identical or different and it can be changed according to the direction (for example, horizontally or vertically) of spacing.In an exemplary implementation In example, gap d and e between the active region of the electrode in limitation trap 720,730 can be identical and can be different from limitation Gap between the active region of electrode in trap 740.Also, in various exemplary embodiments, limit in trap neighbouring has Gap between source electrode region is less than in adjacent limitation trap between the neighbouring active electrode area in identical or different row Gap.For example, c, d and e can be respectively less than a, b or f in Figure 12.

In Figure 12, each inward flange for limiting trap such as 720 and associated active electrode area in the limitation trap are shown Gap between each of domain, such as 706,707,708,709 outer edge.However, as shown in Figure 12, according to various Exemplary embodiment, such gap can be not present and the outer edge of each of active electrode area can be with limitation The inward flange of trap is identical.This configuration can be realized for example using the structure of the structure as shown in Fig. 3 A (wherein in Figure 12 In the configuration that wherein there is such gap is shown), can for example be realized using the structure of the structure as shown in Fig. 5 A.So And other structures are it is also possible that can be realized the same configuration illustrated in Fig. 2 and 12.

Pixel 750,751,752,753 can be limited based on limitation trap arrangement and corresponding subpixel layouts.Pixel 750,751,752,753 overall spacing or pitch can be based on the resolution ratio of display.For example, monitor resolution is higher, Pitch is smaller.In addition, neighborhood pixels can have different sub-pixel arrangements.For example, as shown in figure 12, pixel 750 is included in The big portion of red sub-pixel R in upper left, the green sub-pixels G in upper right portion and the bottom part across pixel The blue subpixels B divided.The subpixel layouts of pixel 751 are similar to the subpixel layouts of pixel 750, in addition to green sub-pixels G With the relative position of red sub-pixel R with green sub-pixels G in upper left and red sub-pixel is switched in upper right portion In addition.It is respectively adjacent to pixel 751,750 and the pixel 752 and 753 below them is the mirror image of pixel 751 and 750 respectively.Cause This, pixel 752 includes the blue subpixels B in top section, the green sub-pixels G in bottom left section and in right lower quadrant Red sub-pixel R in point.Also, pixel 753 includes the blue subpixels in top section, the green in bottom left section Sub-pixel and the red sub-pixel in lower right-most portion.

For according to Figure 12 and with 326 per inch pixels (ppi) high resolution display exemplary implementation In example, the pixel including red sub-pixel, green sub-pixels and blue subpixels can have the totality of 78 μm of about 78 μ m Size, the overall pitch corresponding to the display for needing to realize 326ppi.For this embodiment, it is assumed that reflect and discussed as preceding Minimum spacing a '=b '=f '=12 μm between the restricted area for the prior art stated are limiting it is also assumed that reflecting and wherein utilizing A=b of the case where confining layers of 3 μm of trap edge internal stretch=+ 6 μm of f=12 μm=18 μm, and finally assume that c=d=e=3 μm are made For the typical gap between the electrode active region in limitation trap, with the associated face of each of red and green sub-pixels Product can be 28.5 μm of 28.5 μ m, and area associated with blue subpixels can be 27 μm of 60 μ m.As described above, blue The surface area of sub-pixels can be greater than each of red and green sub-pixels to increase the overall display service life.In this way Layout can have limitation trap associated with 2 × 2 of the size with 66 μm of 66 μ m red and green sub-pixels groups, And limitation trap associated with having the group of 1 × 2 blue subpixels of size of 66 μm of 66 μ m.It is such having a size of utilization Typical inkjet print head and print system are directly loaded up active OLED material and prepare, at the same also for be greater than 50%, such as The high resolution display of 53% high fill factor is prepared.Such size is also this in the structure with confining layers The feature of sample is prepared, the confining layers by resistance shelves electric current flowing by with the diaphragm area that is directly adjacent to of limitation trap wall, can be with Film uniformity for the enhancing in active electrode area is prepared.

In the correspondence exemplary embodiment for the high resolution display with 440 per inch pixels (ppi), including The pixel of red sub-pixel, green sub-pixels and blue subpixels can have the overall dimension of 58 μm of about 58 μ m, wherein The identical value for assuming size a, b, c, d, e, f, a such as in a upper example ', b ' and f ', with red and green sub-pixels Each of associated area can be 18.5 μm of 18.5 μ m, and area associated with blue subpixels can be 40 μm×17μm.As described above, the surface area of blue subpixels can be greater than each of red and green sub-pixels to increase Add up body display life.Such layout can have 2 × 2 red and sub- pictures of green with the size with 46 μm of 46 μ m The associated limitation trap of group of element, and limit associated with having the group of 1 × 2 blue subpixels of size of 46 μm of 46 μ m Trap processed.It is such having a size of loading active OLED material using typical inkjet print head and print system are relatively direct and prepare, The high resolution display also for the high fill factor with 40% is prepared simultaneously.

In each of exemplary embodiment above, for size a, b, c, d, e, f, a ', b ', f ' may be implemented it is various Value.However, it will be appreciated by those of ordinary skill in the art that these change in size.For example, as previously discussed, for big ppi, The spacing (a ', b ', f ') limited between trap can be from as low as 1 μm to greatly to hundreds of microns variation.As explained above, it limits in trap Active electrode area between gap (c, d, e) can from as low as 1 μm to greatly to some tens of pm change.As explained above, have Source electrode region and limit trap edge between gap (effectively, respectively a ' and a, b ' and b ' and f ' and f between difference Different half) it can also be from as low as 1 μm to greatly to 10 μm of variations.Further, since these sizes are changed, they are together with (determining The overall pitch of display) ppi be applied with constraint, which limit for trap size and the active electrode area that is contained therein Permitted value range.In exemplary embodiment above, to put it more simply, the square limitation trap of identical size is used for institute There are three colors.It however, limitation trap needs not be square, and need not be entirely same size.In addition, provided in Figure 12 Size indicates various public sizes, for example, the gap between the active electrode area in red limitation trap and green limitation trap, but It is the uncommon size in these gaps in some exemplary embodiments, it is different from each other.

Figure 13 depicts the partial plan layout of the another exemplary pixel/sub-pixel layout of OLED display 800.With it is previous Feature common to the exemplary embodiment of discussion is not described.To put it more simply, being distinguished discussing.

The interval between active region associated with the pixel electrode in limitation trap that display 800 can have is big In the pixel electrode of display 700 for example as illustrated in Figure 12.With in respective limitation trap 820,830,840 electrode 806, 807,808,809；836,837,838,839；And 842,844 spacing between associated adjacent active regions domain can be greater than The interval between neighbouring active electrode area in neighbouring limitation trap.For example, active region associated with electrode 836 can be with that This is spaced apart predetermined distance g, and is similar for active region associated with electrode 838.In adjacent limitation The interval k between neighbouring active electrode area in trap 820,830 can be less than and electrode 836,838 associated active regions Between interval g, and with electrode 842(and similar, for electrode 844) interval m between associated active region The interval n that can be greater than between the neighbouring active electrode area in adjacent limitation trap 840 and limitation trap 820,830.It is such Spacing can for limitation trap in be arranged and between the identical associated pixel electrode of light emitting color it is bigger between It prepares away from preparing, while for the closer arrangement of pixel electrode associated with the pixel individually limited.This Away from undesirable visual artifact can be reduced, so that display shows as the ternary array of RGB of close arrangement, rather than RRRR tetrad, GGGG tetrad and BB pairs of the array of close arrangement.

It depicts in Figure 14 and is laid out according to the another exemplary pixel/sub-pixel of the display of the disclosure.Limiting structure 904 It may be provided on substrate, to limit multiple limitation traps 920,930,940 with array configuration.Each limitation trap 920,930, 940 may include substantially continuous OLED material layer (being indicated by shadow region), so that the edge of organic layer extends through Trap 920,930,940 is limited to the limiting structure 904 around limitation trap, for example, the OLED material in each trap 920,930,940 The edge of layer can contact limiting structure 904.Active OLED layer can include but is not limited to such as hole-injecting material, hole biography Defeated material, electron transport material, electron injection material, hole barrier materials and the transmitting work for different light emitting wave-length coverages Prepare one or more of luminous organic material.For example, limitation trap 920 may include sending out with the light in red wavelength range R Associated organic luminous layer is penetrated, limitation trap 930 may include organic light emission associated with light emitting in green color wavelength range G Layer, and limitation trap 940 may include organic luminous layer associated with the light emitting in blue wavelength region B.Organic light emission Layer can be arranged in trap with any arrangement and/or configuration.For example, the organic light emission in limitation trap 920,930,940 is arranged in Layer arrangement is to have alternate arrangement in every row.Neighbouring row can have identical arrangement or different arrangements.In addition, though The adjacent row of limitation trap 920,930,940 is illustrated as having uniform alignment, but limits the adjacent row of trap 920,930,940 Can alternatively have alignment heterogeneous, such as arranged offset.Also, limiting trap 920 and 930 can be anti-with alternative patterns Turn.

The configuration of each trap 920,930,940 can have rectangular shape, so that each trap extends in vertical direction. Trap 920,930,940 can have the about the same width in the vertical direction of elongation.In addition, trap 920,930,940 can With about the same width.However, entire trap 940 associated with blue organic luminous layer can with single sub-pixel with And pixel thus is related, while trap 920,930 associated with red and green organic luminous layer can be with multiple sub-pixels And multiple pixels thus are related.For example, limitation trap 920,930 may include multiple electrodes so that each electrode from it is different The different subpixel of pixel is associated.As shown in figure 14, trap 920 include two electrodes 926,928 and with two different pixels 950,951 is associated.

Different number of electrode 926,928,936,938,946 can be arranged in different limitation traps.For example, some limits Trap 920,930 processed may include multiple electrodes 926,928；And 936,938, so that selectivity addressing is arranged in identical limitation trap In electrode, but in different pixels different subpixel generate light emitting, while other limitation traps 940 only include one Electrode 946 is to address the electrode being arranged in limitation trap associated with a pixel.Alternatively, setting is in limitation trap The number of electrode in 940 can be the half of the number for the electrode being arranged in other limitation traps 920,930.In addition, different Electrode in limitation trap can have different surface areas.For example, electricity associated with the light emitting in blue wavelength region Pole can have surface area more great than electricity associated with the light emitting in red and/or green wavelength, to improve The service life of display 900 and reduce power consumption.

Pixel 950,951 can be limited based on limitation trap arrangement and corresponding subpixel layouts.Pixel 950,951 it is total Body spacing or pitch can be based on the resolution ratio of display.For example, monitor resolution is higher, pitch is smaller.In addition, neighbouring picture Element can have different pixels arrangement.For example, as shown in figure 14, pixel 950 may include green sub-pixels G on left side, In intermediate blue subpixels B and the red sub-pixel R on right side.Pixel 951 may include red on left side Pixel R, blue subpixels B and the green sub-pixels G on right side in centre.

Figure 15 depicts the partial plan layout of the pixel of OLED display 1000 and the exemplary embodiment of subpixel layouts. It is not described with feature common to embodiment discussed above (although the similar mark with 1000 series can be found in Figure 15 Note).To put it more simply, being distinguished discussing.Limiting structure 1004 is configurable to limit multiple traps 1020,1030,1040.Trap 1020,1030,1040 can be laid out such that trap 1020,1030,1040 with uniform row alignment, wherein with red light emission and The green associated trap of light emitting (for example, 1020,1030) replaces in single row, and trap associated with blue light emissive (for example, 1040) are in single row.In addition, trap 1020,1030,1040 is configured such that trap 1020,1030,1040 exists Alignment in uniform column, so that the column of trap 1020,1040 replace with the column of trap 1030,1040.Limiting trap 1020 and 1030 can be with Alternatively it is arranged such that limiting trap 1030 starts alternate mode.

Each limitation trap 1020,1030,1040 can be about the same size.However, with each trap 1020,1030, The number of 1040 associated electrodes can be different.For example, as shown in figure 15, trap 1020 associated with red light emission can be with Including electrode 1026,1027,1028,1029, trap 1030 associated with green light emitting may include electrode 1036,1037, 1038,1039, and trap 1040 associated with blue light emissive may include electrode 1046,1048.Although limiting trap 1040 Interior electrode is illustrated as horizontally arranged for interval, but electrode can also be arranged alternatively, to be vertically interval.

Although electrode 1026,1027,1028,1029,1036,1037,1038,1039 is illustrated as having pros in Figure 15 Shape shape and electrode 1046,1048 is illustrated as with rectangular shape, but electrode with any shape be envisioned for this In scope of disclosure, such as circle, herringbone, hexagon, asymmetrical, irregular curvature etc..In individually limitation trap The electrode of multiple and different shapes may be implemented.In addition, different limitation traps can have electrode of different shapes.The size of electrode The distance between electrode can be influenced with shape and therefore influences the total arrangement of display.For example, when shape is complementary When, electrode can between be divided into closer to together, while still maintaining the electric isolution between neighbouring electrode.In addition, the shape of electrode Shape and spacing can influence the degree of created visual artifact.Electrode shape can be selected as reducing undesirable vision puppet Shadow and enhance image co-registration to generate consecutive image.

Pixel 1050,1051 shown in dotted line can be based on limiting based on limitation trap arrangement and corresponding subpixel layouts It is fixed.The overall spacing or pitch of pixel 1050,1051 can be based on the resolution ratio of display.For example, monitor resolution is higher, Pitch is smaller.In addition, pixel can be defined as with asymmetrical shape.For example, as shown in figure 15, pixel 1050,1051 can With L shape shape.

Figure 16 describes the partial plan layout of the pixel of OLED display 1100 and the exemplary embodiment of subpixel layouts.With Feature common to example discussed above embodiment will not be described (although can be found in Figure 16 with 1100 series Similar label).Limiting structure 1104 is configurable to multiple column C₁、C₂、C₃、C₄Limit multiple limitation traps 1120,1130, 1140.Arrange C₁、C₂、C₃、C₄It can be arranged to generate interlaced arrangement.For example, in column C₁And C₃In limitation trap can with column C₂ And C₄Offset to generate staggered row arrangement, while keeping uniform column arrangement.Pixel 1150,1151 can be based on limitation The pitch of trap arrangement limits.The pitch for limiting trap arrangement can be based on the resolution ratio of display.For example, pitch is smaller, display Device resolution ratio is higher.In addition, pixel can be defined as with asymmetrical shape.For example, as in Figure 16 as shown in dotted line, as Element 1150,1151 can have shape heterogeneous.

Figure 17 describes the partial plan layout of the pixel of OLED display 1200 and the exemplary embodiment of subpixel layouts.With Feature common to embodiment discussed above is not described (although can find the similar mark with 1200 series in Figure 17 Note).As shown in figure 17, limiting structure 1204 is configurable to limit multiple limitation traps 1220,1230,1240.Each limitation trap 1220,1230,1240 it can have different area.For example, trap 1220 associated with red light emission R can have than with it is green The big area of the associated trap 1230 of color emissions G.In addition, limitation trap 1220,1230,1240 can be with different number of pixel It is associated.For example, limitation trap 1220 can be associated with pixel 1251,1252,1254,1256, and limit trap 1230,1240 It can be associated with pixel 1251,1252.Trap 1220,1230,1240 can be with uniform row R₁、R₂、R₃、R₄、R₅Configuration.Row R₂、 R₃And R₅Can be associated with blue light emissive trap 1240, and row R₁And R₄Can with alternate red light emission trap 1220 and Green light emitting trap 1230 is associated.Limiting structure 1204 can have multiple dimension Ds₁、D₂、D₃、D₄.For example, D₁It can be greater than D₂、D₃Or D₄, D₂D can be less than₁、D₃Or D4, and D3 can be approximately equal to D4.

Figure 18 describes the partial plan layout of the pixel of OLED display 1300 and the exemplary embodiment of subpixel layouts.With Feature common to embodiment discussed above such as Figure 17 is not described (although can be found in Figure 18 with 1300 series Similar label).Limiting structure 1304 is configurable to limit multiple limitation traps 1320,1330,1340.Trap 1320,1330, 1340 can be laid out such that trap 1320,1330 associated with red light emission and green light emitting can have and indigo plant In the row of the associated trap 1340 of color emissions alternately.

Although exemplary embodiment is not limited in any way across such as the foregoing describe various pixels and sub-pixel Shape, arrangement and/or the configuration of the limitation trap of multiple pixels of description.On the contrary, being sprayed in conjunction with limitation trap associated with the disclosure Ink print manufacturing method takes into account together arranges the flexible pixel layout selected.

Various pixel layouts are conceived to, and can be enabled to realization and be shown using the high-resolution OLED of ink jet printing Device.For example, as shown in figure 19, limitation trap 1404 can create hexagonal shaped pattern, so that pixel 1450 may include sending out with red Penetrate the associated limitation trap 1420 of R, limitation trap 1430 associated with green emitted G and limit associated with blue emission B Trap 1440 processed.Due to pitch, the shape of limitation trap, and trap boil down to will be limited closer to ability together, can be used Ink jet printing creation has high-resolution OLED display.

Using various aspects according to the exemplary embodiment of the disclosure, some exemplary dimensions and parameter are had It can be in the high-resolution OLED display of increased fill factor useful.According to the resolution ratio with 326ppi The exemplary embodiment of the associated disclosure of OLED display, table 1-3 includes conventional size and parameter, and is predicted non- Limitative examples, wherein table 1 describes sub-pixel associated with red light emission, and the description of table 2 is associated with green light emitting Sub-pixel and table 3 describe sub-pixel associated with blue light emissive.According to the display with the resolution ratio with 440ppi The exemplary embodiment of the associated disclosure, table 4-6 include conventional size and parameter, and the non-limiting of precognition is shown Example, wherein table 4 describes associated with red light emission sub-pixel, the description of table 5 sub-pixel associated with green light emitting with And table 6 describes sub-pixel associated with blue emission.

Table 1

For sub-pixel associated with red emission in the display with 326 ppi resolution ratio	The length (μm) of sub-pixel	The width (μm) of sub-pixel	Limit trap area (μm2)
				Conventional sub-pixel	65.9	10.5	690.7
Such as Fig. 3 A, sub-pixel associated with limiting structure shown in 3B	31.5	31.5	989.5
				Conventional sub-pixel with pixel confining layer	59.9	9.0	537.9
Such as Fig. 5 A, sub-pixel associated with having the limiting structure of confining layers shown in 5B	28.5	28.5	809.8

Table 2

For sub-pixel associated with green emitted in the display with 326 ppi resolution ratio	The length (μm) of sub-pixel	The width (μm) of sub-pixel	Limit trap area (μm2)
				Conventional sub-pixel	65.9	10.5	690.7
Such as Fig. 3 A, sub-pixel associated with limiting structure shown in 3B	31.5	31.5	989.5
				Conventional sub-pixel with pixel confining layer	59.9	9.0	537.9
Such as Fig. 5 A, sub-pixel associated with having the limiting structure of confining layers shown in 5B	28.5	28.5	809.8

Table 3

For the sub-pixel associated with blue emission of the display with 326 ppi resolution ratio	The length (μm) of sub-pixel	The width (μm) of sub-pixel	Limit trap area (μm2)
				Conventional sub-pixel	65.9	21.0	1381.4
Such as Fig. 3 A, sub-pixel associated with limiting structure shown in 3B	30.0	65.9	1979.1
				Conventional sub-pixel with pixel confining layer	59.9	18.0	1075.9
Such as Fig. 5 A, sub-pixel associated with having the limiting structure of confining layers shown in 5B	27.0	59.9	1619.6

Table 4

For the sub-pixel associated with red emission of the display with 440 ppi resolution ratio	The length (μm) of sub-pixel	The width (μm) of sub-pixel	Limit trap area (μm2)
				Conventional sub-pixel	45.7	5.4	248.4
Such as Fig. 3 A, sub-pixel associated with limiting structure shown in 3B	21.4	21.4	456.4
				Conventional sub-pixel with pixel confining layer	39.7	3.9	159.2
Such as Fig. 5 A, sub-pixel associated with having the limiting structure of confining layers shown in 5B	18.4	18.4	337.2

Table 5

For the sub-pixel associated with green emitted of the display with 440 ppi resolution ratio	The length (μm) of sub-pixel	The width (μm) of sub-pixel	Limit trap area (μm2)
				Conventional sub-pixel	45.7	5.4	248.4
Such as Fig. 3 A, sub-pixel associated with limiting structure shown in 3B	21.4	21.4	456.4
				Conventional sub-pixel with pixel confining layer	39.7	3.9	156.2
Such as Fig. 5 A, sub-pixel associated with having the limiting structure of confining layers shown in 5B	18.4	18.4	337.2

Table 6

For the sub-pixel associated with blue emission of the display with 440 ppi resolution ratio	The length (μm) of sub-pixel	The width (μm) of sub-pixel	Limit trap area (μm2)
				Conventional sub-pixel	45.7	10.9	496.8
Such as Fig. 3 A, sub-pixel associated with limiting structure shown in 3B	20.0	45.7	912.8
				Conventional sub-pixel with pixel confining layer	39.7	7.9	312.4
Such as Fig. 5 A, sub-pixel associated with having the limiting structure of confining layers shown in 5B	17.0	39.7	674.4

Table 7 includes conventional size and parameter, and according to the pixel in the display of the resolution ratio with 326ppi The non-limiting example of the precognition of the exemplary embodiment of the associated disclosure, wherein the pixel include red sub-pixel, it is green Sub-pixels and green sub-pixels.

Table 7

For the display with 326 ppi resolution ratio	Pixel active area (μm2)	The gross area (μm) of pixel	Fill factor *
				Conventional limiting structure	2762.7	6070.6	46%
Such as Fig. 3 A, limiting structure shown in 3B	3958.2	6070.6	65%
				Conventional limit structure with pixel limiting layer	2151.8	6070.6	35%
With such as Fig. 5 A, the limiting structure of confining layers shown in 5B	3239.2	6070.6	53%

* it is that immediate percentage is counted that (active area/gross area), which is accepted or rejected,.

As shown in the above table 7, it is contemplated that, according to the various exemplary embodiments of the disclosure relative to conventional limitation knot Fill factor improvement may be implemented in structure.For example, for the limiting structure illustrated in imaginary picture of primitive people 3A and 3B display filling because Son can increase fill factor about 43% relative to conventional structure, to realize 65% overall fill factor.In another implementation In example, it can change for imagining the fill factor of display of the limiting structure as shown in Fig. 5 A and 5B relative to conventional structure Into fill factor about 51%, to realize 53% overall fill factor.

Table 8 includes conventional size and parameter, and according to the pixel in the display of the resolution ratio with 440ppi The non-limiting example of the precognition of the exemplary embodiment of the associated disclosure, wherein the pixel include red sub-pixel, it is green Sub-pixels and green sub-pixels.

Table 8

For the display with 440 ppi resolution ratio	Pixel active area (μm2)	The gross area (μm) of pixel	Fill factor *
				Conventional limiting structure	993.5	3332.4	30%
Such as Fig. 3 A, the limiting structure that is illustrated in 3B	1825.6	3332.4	55%
				Conventional limit structure with pixel limiting layer	624.8	3332.4	19%
With such as Fig. 5 A, the limiting structure of the confining layers illustrated in 5B	1348.9	3332.4	40%

* it is that immediate percentage is counted that (active area/gross area), which is accepted or rejected,.

As shown in the above table 8, it is contemplated that, according to the various exemplary embodiments of the disclosure relative to conventional limitation knot Fill factor improvement may be implemented in structure.For example, for the limiting structure illustrated in imaginary picture of primitive people 3A and 3B display filling because Son can improve fill factor about 84% relative to conventional structure, to realize 55% overall fill factor.In another implementation In example, it can change for imagining the fill factor of display of the limiting structure as shown in Fig. 5 A and 5B relative to conventional structure Into fill factor about 116%, to realize 40% overall fill factor.

As discussed above, in manufacturing technology of the OLED display based on ink-jet, various factors may influence to have The deposition accuracy and uniformity of machine luminescent layer.Such factor includes such as monitor resolution, droplet size, object droplet face Product, drop placement error, fluid properties associated with oled layer material (for example, active OLED material) ink are (for example, surface Tension, viscosity, boiling point) and the deposited speed of drop, the oled layer material ink is by oled layer material and one or more The group of a carrier fluid is combined into.

In various exemplary embodiments, as to provide around each pixel or sub-pixel by limiting structure (for example, Bank) limit multiple limitation traps substitution, using the pattered region of different surfaces energy (for example, lyophily and lyophoby area Domain) it can prepare to limit restricted area to simplify manufacturing process.It the use of bank structure may include that additional processing walks Suddenly with the bank layer of deposit patterned.In addition, when using bank structure, it is often necessary to patterned deposition method is used, Such as ink-jet, to deposit the various device layers shared with all sub-pixels in each sub-pixel.For example, in various embodiments In, before providing different red, green and blue EML coating into corresponding color sub-pixels, RGB OLED structure can To have disclosed HIL and public HTL coating in each of red, green and blue sub-pixel.When use dike shape When object structure, using ink-jet these HIT and HTL coatings are deposited in a manner of patterning method (patternwise) each In trap.However, in this case, manufacturing process can simplify to use uniform, blanket paint-on technique with by these HIL It is deposited in all pixels with htl layer, and then using the deposition technique of the patterning method for EML.Bank structure Presence can increase depositing homogeneous blanket coating difficulty.As explained above, in the coating of various superstructures, even It is including that there are various challenges for the coating of overlying regions of relatively small cluster pixel electrode.It is limited by eliminating bank It trap processed and substitutes using blanket deposition technique HIL and HTL coating is provided, and then on the top surface of HTL using changing Restriction scheme is learned to limit lyophily and lyophobic areas, to limit the EML ink for limiting sub-pixel colors layer, manufacturing process It can be simplified.

Such lyophily and lyophobic areas also can contribute to compensate OLED hair in a manner of being similar to bank structure Ink droplets placement error is penetrated, so that the acceptable drop of bigger surplus be permitted to put during the deposition of OLED luminescent material It sets, because before the drying, any borderline ink droplets that may partially fall between lyophily and lyophobic areas can be certainly So repelled and be attracted to lyophilic regions from lyophobic areas, this can make manufacturing process more robust.Also, it is such as following It explains in detail, lyophilic regions surplus can be used for further accommodating potential drop and place inexactness.As explained above, exist High-precision ink gun used in usual printing techniques can produce range from about 1 picoliters (pL) to about 50 picoliters (pL) Droplet size, wherein about 10pL is the relatively common size for high-precision ink jet printing application.Typical inkjet Department of Printing The drop placement precision of system is about ± 10 μm.

In various exemplary embodiments, hole-conductive layer is configurable to creation lyophilic regions and lyophobic areas, so that Emission layer restricted area can correspond to lyophilic regions, and lyophobic areas be used as boundary with comprising with prevent deposited material Migration.Emission layer restricted area can be defined as considering related to deposition luminous organic material and other active OLED materials The drying effect of connection.For example, the non-homogeneous edge in the active region of sub-pixel may create undesirable visual artifact.Hair Penetrating layer restricted area can the consideration when they are defined so that any non-homogeneous edge is outside the active region of sub-pixel Edge drying effect.In addition, emission layer restricted area can be based on luminous organic material and drying associated with each material Effect configures individually.And it is possible to not need additional material and manufacturing step (for example, formation of limiting structure) to provide Additional limiting structure is to limit limitation trap associated with each sub-pixel.In some cases, confining layers are added, such as Plain confining layers can be omitted, because the subsequent deposition of emission layer restricted area and organic luminous layer mentions sub-pixel and pixel Enough restrictions are supplied.However, it will be understood by one of ordinary skill in the art that pixel confining layer can be with disclosed use by not With the embodiment combined use for the restricted area that the region of surface energy limits.

According to various exemplary embodiments described herein, may be implemented to introduce significant flexibility in OLED manufacturing process Manufacturing technology.For example, pixel layout and sub-pixel arrangements are being limited according to by means of limiting lyophilic regions and lyophobic areas The flexibility realized in these layouts may include various shapes, arrangement and configuration.In general, electrical in OLED display Circuit is isolated with active OLED material, and wherein circuit is outside limitation trap and individually to pixel electrode addressing.However, according to The exemplary embodiments described herein, the electric circuit top that active OLED layer can be deposited in the active region of substrate is to change Into the electric property of driving electronic device, and increase the fill factor of each pixel.

Although can be taken in the active region of display with the limiting structure that pixel/sub-pixel rank limits limitation trap Disappear, but in the exemplary embodiment that the surface region via different surfaces energy limits restricted area, limiting structure is still The single active area display that the entire active region around substrate is formed on the non-active part of substrate can be arranged on Trap.For example, limiting structure can be set to around all electricity associated with the pixel in the image production section of display Pole.By the way that limiting structure is located in active pixel region exterior, active OLED layer contacted with limiting structure or adjacent to Heterogeneity caused by the edge of limiting structure can be limited in outside active display area, to minimize undesirable Visual artifact and the material used during preventing from reducing manufacture and material from moving in the non-active area of display.This The configuration of sample also can reduce the required precision during manufacture.For example, active organic material is deposited on specific and accurate description Area on precision be no longer crucial in depositing active oled layer.When drop be deposited to form hole-conductive layer, such as When hole injection layer and/or hole transmission layer, all drops being deposited in single active area display trap can merge to produce The raw pantostrat with substantially uniform thickness.

Also, realize single limiting structure to limit active area display in the non-active part of OLED display substrate Trap can improve being easy for manufacture OLED display.For example, inkjet nozzle can be used for depositing having in high resolution display The variation of source oled layer and any droplet size is due to together single continuous to be formed in restricted area by droplets mixing Hole-conductive film and the equalization that occurs, will not have the big influence to overall display quality deposition.For example, hole passes Conducting shell, such as at least one of hole injection layer and hole transmission layer can be deposited on active in the active region of substrate Above all electrodes in area's display trap.Due to all liq droplets mixing, can be conducive to deposit and increase uniformity, Because any variation of droplet size is inapparent and does not influence obtained layer.In addition, there is no additional manufactures to walk Suddenly to remove active OLED layer from the non-active part of display, to reduce overall fabrication process.

According to the above exemplary embodiments, the embodiment for the restricted area that the region by different surfaces energy limits is used The pixel arrangement for increasing active region area can be merged.For example, utilizing as above having with pixel/sub-pixel rank limit In the case where the limiting structure of definite limitation trap, (being limited by the surface region of different surfaces energy) luminescent layer restricted area can be with It is defined as including the area across multiple sub-pixels associated with different pixels, so that reducing the non-of each pixel has Source part.For example, luminescent layer restricted area can be limited at the top of multiple pixel electrodes addressed individually, wherein each Pixel electrode can be associated with different pixels.Pass through the area of luminescent layer restricted area defined by increase, fill factor It can be maximized, because the ratio between active area and total elemental area increase.Realize that such increase of fill factor can be with Make it possible to realize high-resolution with lesser size and improves the service life of display.

In addition, as above in regard to referring to Fig. 2 and 12-19 describe various pixels arrange described in, using in this way The embodiment of luminescent layer restricted area that combines of pixel layout arrangement can extend service life of device.For example, pixel electrode Size can be emitted based on corresponding organic luminous layer wavelength.For example, pixel electrode associated with blue light emissive can be with Greater than pixel electrode associated with red or green light emitting.It is associated with the blue light emissive in OLED device organic Layer can have the service life of shortening relative to organic layer associated with red or green light emitting.In addition, operation OLED device To realize that lower luminance level increases the service life of device.By increasing blue subpixels relative to red and green sub-pixels Emission area, and driving blue subpixels to be to realize relative luminance, while driving red and green sub-pixels to realize ratio The higher brightness of blue subpixels, can be used for being better balanced the service life of different colours sub-pixel, while remain as display Suitable overall color balance prepare.The improved service life makes it possible to the service life by extending blue pixel and realizes The improvement of the overall life of display.

Skilled addressee will further appreciate that the configuration of replacement is for extending the different subpixel other than blue The service life of color is possible.For example, red sub-pixel can have the area bigger than other sub-pixels to extend red son The service life of pixel.Alternatively, green sub-pixels can have the area bigger than other sub-pixels, to extend green sub-pixels Service life.It is such configuration also can be applied to include limit limitation trap limiting structure OLED display and use lyophily The OLED display of restricted area is limited with lyophobic areas.

Referring now to Figure 22-39, the OLED display and illustrative steps for manufacturing OLED display 1900 are illustrated.Though So manufacturing method will be discussed referring to display 1900, but described herein any and/or Overall Steps can be used for manufacturing it His OLED display, the OLED display 1500,1600 described referring for example to Figure 20 and 21.Such as the plan view and Figure 23 of Figure 22 In illustrate in the viewgraph of cross-section described along the line 23-23 of Figure 22, OLED display 1900 includes substrate 1902, limitation knot Structure 1904 and multiple electrodes 1906.

Substrate 1902 may include showing boundary by the dotted line in Figure 22,23 by encirclement electrode 1906() area limit Active region 1908 and non-active area 1910.Substrate 1902 can be any rigidity or flexible and usually plane knot Structure, and may include one or more layers of one or more materials.Substrate 1902 can be by such as glass, polymer, gold Category, ceramics or combinations thereof are made.

Limiting structure 1904(such as bank) it can be arranged on substrate 1902, so that limiting structure 1904 limits Single active area display trap W.Limiting structure 1904 can be formed by a variety of materials, and such as, such as Photoimageable gathers Close object or the dielectric photo anti-corrosion agent material of photosensitive silicon.Limiting structure 1904 may include one or more organic principles, it It is substantially inert for the corrosiveness of OLED ink after the treatment, have low degasification, in active area display trap Edge has the side wall slope of shallow (such as < 25 degree), and/or will be deposited in active area display trap with direction The high repellency of one or more of OLED ink, and can application based on expectations select.Suitable material is shown Example include but is not limited to PMMA(it is more-methyl methacrylate), PMGI(it is more-polydimethyl glutarimide), DNQ-. novolaks (Novolacs) (combination of chemical diazo naphthoquinone and different phenol formaldehyde resins), SU-8 resist are (a series of to be widely used The exclusive epoxy resin-matrix resist manufactured by MicroChem company), standard resist and/or it is listed here before The fluorination variant and organic siliconresin resist of any one of material are stated, each of which can further each other Combination, or combine with one or more additives to be further tuned the desired characteristic of limiting structure 1904.

In addition, limiting structure 1904 can facilitate active OLED by suitable geometry and surface chemistry The loading and drying process of material, to form continuous and uniform layer in the region of the trap W to be demarcated by limiting structure 1904.Limit Structure 1904 processed can be single structure, or can be by the multiple separate structure composition of formation limiting structure 1904.Limitation Structure 1904 can have any cross-sectional shape.In addition, though limiting structure 1904 is illustrated as having in Figure 22 and substrate 1902 vertical side edges, but limiting structure 1904 can alternatively have relative to substrate 1902 surface angulation and/ Or the edge at fillet.

Any manufacturing method can be used to be formed in limiting structure 1904, and such as ink jet printing, nozzle print, slit apply It covers, rotary coating, vacuum thermal evaporation, sputtering (or other physical gas-phase deposite methods), chemical vapor deposition etc..Not with its other party Formula be included in deposition technique it is any it is additional patterned can by using web plate, photoetching (photoresist coating, expose Light, development and removing), wet etching, dry ecthing, strip etc. to realize.

The limiting structure 1904 for limiting active area display trap W can limit the active OLED material being deposited on substrate 1902 Material.For example, limiting structure 1904 can be arranged on the non-active part 1910 of substrate 1902 and around active region 1908.In various exemplary embodiments, as shown in figs. 22-23, for example, limiting structure 1904 can be located in distance D Outside source region.D can determine and can choose to minimize the active region of substrate 1902 based on edge drying effect Undesirable visual artifact in 1908.For example, limiting structure 1904 can be positioned as being sufficiently far from any electrode 1906 to prevent The dry heterogeneity in any edge contributes to the observed light emitting from pixel and reduces in the manufacturing process phase Between active OLED material is deposited in trap needed for loading precision.Simultaneously, also it is desirable to minimize non-active outside display area It the width in region and prepares in the area to be formed to the external electrical connections of display.Minimize the width of non-active area Closer encapsulation for displays multiple on single substrate film is prepared, to increase manufacture efficiency.It is also reduction The width of the inclined-plane of outside display (bezel) is prepared, this for less wasting space be made it is lesser complete it is aobvious Show that device product is required.

In the exemplary embodiment, D can vary to about 500 μm from about 10 μm, for example, D can be about 50 μm. Limiting structure 1904 can have width B, and range is from about 10 μm to about 5mm, and wherein B can be about 20 μm.In addition, Limiting structure 1904 can have height T, and range is from about 0.3 μm to about 10 μm, wherein highly can be about 1.5 μ m。

Multiple electrodes 1906 may be provided on substrate 1902, in active region 1908, so that when electrode 1906 is selected When selecting property drives, light can be launched to create the image that will be shown to user.Electrode 1906 can be set to limit picture Pixel array so that each electrode 1906 is associated with different subpixel, such as, sub-pixel associated with red light emission, with The associated sub-pixel of green light emitting, sub-pixel associated with blue light emissive etc..Alternatively, each electrode 1906 can With alternatively associated with including the pixel of red sub-pixel, green sub-pixels and blue subpixels.Electrode 1906 can have Any shape, arrangement and/or configuration.For example, as shown in figure 22, electrode 1906 can have square shape.Alternatively, electric Pole 1906 can have rectangle, circle, herringbone, hexagon, asymmetric, irregular curvature shapes or combinations thereof.Electrode 1906 It can have profile, so that top surface is substantially major surfaces in parallel plane and with substrate, while the side edge of electrode Can be substantially vertical with the surface of substrate 1902, or can be at an angle of relative to the surface of substrate 1902 and/or at fillet.

Electrode 1906 can be it is transparent or reflexive, and can be by such as metal, mixed metal, alloy, metal The conductive material of oxide, mixed oxide or combinations thereof is formed.For example, in various exemplary embodiments, electrode can be by Tin indium oxide, magnesium silver or aluminium are made.

Any manufacturing method can be used to be formed in electrode 1906, such as ink jet printing, nozzle print, slot coated, rotation Turn coating, vacuum thermal evaporation, sputtering (or other physical gas-phase deposite methods), chemical vapor deposition etc..Not in other ways by Deposition technique provide it is any desired it is additional patterned can by using web plate, photoetching (photoresist coating, exposure, Development and removing), wet etching, dry ecthing, strip etc. to realize.

Pixel can be limited based on the pitch of electrode 1906.The pitch of electrode can be based on the resolution ratio of display.Example Such as, pitch is smaller, and monitor resolution is higher.Pixel can choose as with any kind of arrangement, such as symmetrical or non-right Claim, to reduce undesirable visual artifact and enhance image co-registration to generate consecutive image.

Although in order to illustrate it is clear and convenient and omits, further additional electric component, circuit and/or conductive component It can be arranged on substrate 1902.Electric component, circuit and/or conductive component may include driving circuit, including but unlimited In, such as other circuits known to interconnection, bus, transistor and those of ordinary skill in the art.Electric component, circuit and/or Conductive component can be coupled in each electrode 1906, and each electrode is selectively addressed independently of other electrodes. For example, thin film transistor (TFT) (TFT) (not shown) can be in the other structures of deposition such as limiting structure 1904 and/or electrode 1906 In any structure before or after be formed on substrate 1902.As discussed below, active OLED layer can be deposited on It is set to above any electric component in the active region 1908 of substrate 1902, circuit and/or conductive component.

As shown in figure 24, after electrode 1906 and other circuit (not shown) including such as TFT are deposited, first Hole transport material 1911 can be deposited in the active area display trap W limited by limiting structure 1904.First hole-conductive Material 1911 can be deposited as being conducive to the one or more layers for the material that hole is injected into organic luminous layer.For example, first Hole transport material 1911 can be deposited as the layer of the single hole transport material of such as hole-injecting material.Alternatively, empty Cave conductive material 1911 can be deposited as multiple and different conductive materials, have at least one hole-injecting material, such as poly- (3,4- ethene dioxythiophene): poly- (styrene sulfonic acid) (PEDOT:PSS).

Ink jet printing can be used to deposit in first hole transport material 1911.For example, inkjet nozzle 1914 can will wrap The multiple drops 1916 for including the fluid composition of hole transport material are directed in active area display trap W.The common skill in this field Art personnel will be understood that, although illustrating single-nozzle in Figure 24, multiple nozzles may be implemented simultaneously by hole transport material Multiple droplet depositions to active area display trap W in.

First hole transport material 1911 can be mixed to form ink-jet synthetic with carrier fluid, be configured to having Reliable and uniform loading is provided in source region display trap W.Drop for loading the first hole transport material 1911 can be with High speed is delivered to substrate from inkjet nozzle.The drop 1916 for forming the first hole-conductive layer can be heavy from all respective nozzles Product is in trap W, to mix, to generate the pantostrat with substantially uniform thickness, as shown in figure 24.It is dry and/ Or before baking, the first hole transport material 1911 can be deposited as that the height of material is allowed to be greater than limiting structure 1904 Highly；Although the height for being equal to or less than limiting structure 1904 also can be used.

As shown in figure 25, after hole transport material is loaded in active area display trap W, display 1900 can be by Processing is to form the first hole-conductive layer 1912.For example, display 1900 can be processed to allow any carrier fluid such as It is evaporated via drying process from the first hole transport material 1911.The technique may include that substrate 1902 is exposed to heat, true Empty and/or one period of ambient enviroment.After drying, substrate 1902 can be toasted at elevated temperatures to handle and to sink Long-pending membrane material, in the form of the quality of film or the chemical reaction beneficial for overall craft or the film for example induced for being deposited Change.

First hole-conductive layer 1912 can be in entire active area display trap W it is substantially continuous so that layer 1912 are arranged on all surface feature in active area display trap W (for example, electrode 1906, circuit (not shown) etc.) Side, and the EDGE CONTACT of layer 1912 surrounds the limiting structure 1904 of active area display trap W.Although layer 1912 is illustrated as having There is the top surface of plane, but hole-conductive layer 1912 can alternatively follow such as electrode 1906 and any circuit (not shown) Underlying surfaces feature pattern, thus to be similar to the exemplary embodiment (deposited in it above in regard to Fig. 3-11 Layer follow surface topography) description mode generate nonplanar top surface associated with underlying surfaces feature.

As shown in figure 26, the second hole transport material 1917 can be deposited on is shown by the active area that limiting structure 1904 limits Show in device trap W and above the first hole-conductive layer 1912.Second hole transport material 1917 may include hole transport material Material, such as, N, N'- bis--((1- naphthalene)-N, N'- diphenyl) -1,1'- biphenyl) -4,4'- diamines (NPB).

Such as the first hole transport material 1911, ink jet printing is can be used to deposit in the second hole transport material 1917, For example, multiple drops 1920 of the fluid composition including hole transport material can be directed to active area by inkjet nozzle 1914 In display trap W.Although may be implemented multiple it will be appreciated by the skilled addressee that illustrating single-nozzle in Figure 26 Nozzle with simultaneously will be in multiple droplet depositions of hole transport material 1920 to active area display trap W.In addition, though ink-jet is sprayed Mouth 1914 is illustrated as and the identical inkjet nozzle for depositing the first hole transport material 1911, but empty for depositing second The inkjet nozzle of cave conductive material 1917 can be different.Therefore, drop 1920 associated with the second hole transport material 1917 Droplet size can be identical or different with the droplet size of the first hole transport material 1916.

Second hole transport material 1917 can be mixed to form ink-jet synthetic with carrier fluid, be configured to having Reliable and uniform loading is provided in source region display trap W.Drop for loading the second hole transport material 1917 can be with High speed is delivered to substrate from inkjet nozzle 1914.The drop 1920 of second hole transport material 1917 can be from all respective Inkjet nozzle is deposited in trap W, to mix, to generate the pantostrat with substantially uniform thickness, as shown in figure 26. Before drying and/or baking, the second hole transport material 1917 can be deposited as that the height of material is allowed to be greater than limitation The height of structure 1904；Although the height for being equal to or less than limiting structure 1904 also can be used.

As shown in figure 27, after the second hole transport material 1917 is loaded in active area display trap W, display 1900 can be processed to form the hole-conductive layer 1918 after the second drying.For example, display 1900 can be processed to permit Perhaps any carrier fluid is such as evaporated via drying process from the second hole transport material 1917.The technique may include by substrate 1902 are exposed to one period of heat, vacuum and/or ambient enviroment.After drying, substrate 1902 can be in raised temperature Lower baking is to handle deposited material 1917, for example to induce the quality of film for being deposited or have for overall craft The chemical reaction of benefit or the change of film form.

Second hole-conductive layer 1918 can be in entire active area display trap W it is substantially continuous so that layer 1918 are deposited on all surface feature in active area display trap W (for example, electrode 206, circuit (not shown), the first hole Conducting shell 1912 etc.) top, and the EDGE CONTACT of layer 1918 surrounds the limiting structure 1904 of active area display trap W.

As shown in figure 28, the second hole-conductive layer 1918 can be processed to the portion of the second hole-conductive layer 1918 of modification The surface energy or compatibility divided, to limit emission layer restricted area.For example, reaction surface active material can be applied to layer 1918 surface.In the exemplary embodiment, reaction surface active material can be exposed to from radiation by mask 1922 The radiation in source 1923, wherein the opening (not shown) in mask can be used for the region of the different surfaces energy in confining layers 1918 (for example, lyophilic regions and lyophobic areas), so as to cause emission layer restricted area.In an alternate embodiment, layer 1918 can be with Including reaction surface active material, allow emission layer restricted area by using the second hole-conductive of exposure of radiation source 1923 Layer 1918 limits.In the exemplary embodiment, mask 1922 can be positioned relative to electrode 1906, so that in mask 1922 Width and length alignment of each opening based on each electrode 1906.

Reaction surface activity (RSA) material may include the synthetic of at least one radiation-sensitive materials.When RSA material is sudden and violent When being exposed to radiation, the surface energy or compatibility for being exposed to the associated layer of radiation can be modified.For example, with spoke is exposed to The part of the associated layer 1918 of the RSA material penetrated is from unrelated to RSA material and/or be not exposed to from light source 1923 The part of the layer 1918 of radiation can have the change of at least one physics, chemistry and/or electrical properties, so that being exposed to radiation Layer 1918 the surface energy that has of part or compatibility be different from being not exposed to the surface energy of the part of the layer 1918 of radiation Amount or compatibility.

Radiation source 1923 may include it is any can be used for modifying at least one physics in conjunction with RSA material, chemistry and/or The radiation source of electrical properties.For example, radiation source 1923 may include the source of infrared radiation, visible wavelength radiation source, UV source, A combination thereof etc..

The type of used radiation can depend on the sensibility of RSA.It exposes and can be blanket, total exposure, or Person's exposure can be patterning method.Term " patterning method " instruction as used herein only material or layer it is selected Part be exposed.Any of imaging technique can be used to realize in the exposure of patterning method.In one embodiment, Pattern is realized by mask exposure.In one embodiment, by the way that using laser exposure, only selected part is realized Pattern.The exposed time can change from the several seconds to several minutes, the specific chemical property depending on used RSA.Work as use When laser, depending on the power of laser, very short exposure duration is used for each individual areas.Depending on the sensibility of material, cruelly Dew step can execute in air or in an inert atmosphere.

In one embodiment, radiation can be selected from ultraviolet radioactive (10-390nm), visible radiation (390-770nm), red External radiation (770-10⁶Nm) and combinations thereof, including simultaneously and continuously handle.In another embodiment, radiation can be such as logical Cross the heat radiation that heating executes.The temperature of heating stepses and duration be so that at least one physical property of RSA is changed, Without damaging any underlying layer.In the exemplary embodiment, heating temperature can be less than 250 DEG C, and all such as less than 150 DEG C.

In the exemplary embodiment, radiation can be ultraviolet or visible radiation, wherein radiation can with patterning method be applied Add, so as to cause the exposed region of RSA and the unexposed region of RSA.Patterning method be exposed to radiation after, first layer Can be treated to remove RSA expose or unexposed region.

In a further exemplary embodiment, RSA, which is exposed to radiation, can lead to the solubility or dispersibility of RSA in solvent Change.It, can and then wet development treatment after exposure step for example, when patterning method executing exposed.Processing May include using dissolution, the solvent that disperses or strip a type of area cleaned.Patterning method is exposed to radiation It can lead to the insoluble of the exposed region of RSA and lead to the removal of the non-exposed region of RSA using the processing of solvent.

In a further exemplary embodiment, RSA is exposed to visible or UV radiation and can cause to reduce in exposed area Volatile reaction of RSA.When patterning method executing exposed, this can be followed by heat development processing.The processing can be with It is related to being heated on the volatilization or sublimation temperature of non-exposed material and under temperature locating for the material thermal response.For example, For polymerizable monomer, material can on sublimation temperature and under thermal polymerization temperature at a temperature of heat.However, answering Note that having the RSA material of the thermal response temperature close to volatilization temperature or under volatilization temperature may not be with this Mode is developed.

In a further exemplary embodiment, RSA is exposed to radiation and can cause locating for the material melts, softening or flowing The change of temperature.When patterning method executing exposed, this can be followed by dry development treatment.Dry development treatment may include The outmost surface of element is contacted with absorbent surface, to absorb or band rings off softer part through capillary action.This is dry aobvious Shadow can execute at elevated temperatures, as long as its property for not influencing just beginning and end exposed region further.

After RSA material is exposed to radiation, the physical property of layer 1918 can be modified so that expose portion can be with With from increasing or decreasing in the surface energy of unexposed portion.For example, institute's expose portion can make the part of layer 1918 in liquid Become more or less solvable or dispersible in body material, it is more or less tacky, more or less soften, it is more or less flowable, or More or few peelable, more or less absorbable, either large or small relative to specific solvent or ink contact angle, relative to specific molten Agent or the either large or small liquid compatibility etc. of ink.Any physical property of layer 1918 can be affected.

RSA material may include one or more radiation-sensitive materials.For example, RSA material may include having radiation can Polymer-based group, such as alkene, acrylic acid, methacrylate, vinyl ethers, polyacrylic acid, polymethacrylates, polyketone, The material of polysulfones, its copolymer and its mixture.RSA can also include two or more polymerizable groups.When RSA material includes When two or more polymerizable groups, available crosslinking.

In the exemplary embodiment, RSA material may include at least one reaction material and at least one radiosensitive material Material, wherein the active material for initiating the reaction of reaction material can be generated in radiation-sensitive materials when being exposed to radiation.Radiation-sensitive The example of sense material can include but is not limited to generate those of free radical, acid or combinations thereof material.In one embodiment, instead Material is answered to can be polymerizable or crosslinkable.Material polymerization or cross-linking reaction are initiated by active material or are catalyzed.Based on RSA Usually there is the amount from 0.001% to 10.0% in the total weight of material, radiation-sensitive materials.

In the exemplary embodiment, the reaction material of RSA material can be the unsaturated chemical combination of ethylene (ethylenically) Free radical can be generated when being exposed to radiation for the radiation-sensitive materials of object and RSA material.Olefinically unsaturated compounds can be with Including but not limited to acrylic acid, methacrylate, ethylene acid compound and combinations thereof.It can be used and generate any of free radical The radiation-sensitive materials of Known Species.For example, quinones, benzophenone, benzoin ether, aryl ketones, peroxide, imidazoles, benzyl Dimethyl ketal, hydroxyalkylphenyl acetophenone, alkoxy benzene ethyl ketone, trimethylbenzoyl phosphinoxide, amino ketones, benzyl Cyclohexanol, methylthiophenyi morpholone, morphlinophenyl amino ketones, α-halo acetophenone, oxygroup sulphonyl ketone, sulphonyl ketone, oxygen sulphur Acyl ketone, sulphonyl ketone, benzoyl oxime ester, thioxanthene, camphorquinone, ketocoumarin and Michler's keton.Alternatively, radiation-sensitive materials can To be the mixture of compound, one of them is providing freedom and the when to cause to do so of the sensitizer by radioactivation Base.In one embodiment, radiation-sensitive materials can be for visible or UV radiation-sensitive.

In the exemplary embodiment, reaction material can be subjected to the polymerization initiated by acid, so that radiation-sensitive materials are sudden and violent It is exposed to radiation and generates the acid.The example of such reaction material includes but is not limited to epoxy resin.Generate the radiosensitive material of acid The example of material includes but is not limited to sulfonium salt and salt compounded of iodine, such as hexafluorophosphoric acid diphenyl.In an alternate embodiment, reaction material can To include phenolic resin and radiation-sensitive materials can be azo naphthoquinones.

RSA material can also include fluorinated material.For example, RSA material may include having one or more fluothane groups, The unsaturated material of such as fluorinated acrylate, fluorinated ester or fluoroalkene monomer.In the exemplary embodiment, fluothane group With from 2 to 20 carbon atom.

Figure 29 is shown in shape after the second hole-conductive layer 1918 that radiation source 1923 passes through the irradiation RSA processing of mask 1922 At lyophilic regions 1924 and lyophobic areas 1926.Figure 30 be the amplifier section M illustrated in Figure 29 exemplary cross section and Figure 31 is the exemplary plan view of the amplifier section M illustrated in Figure 29.It should be noted that lyophilic regions 1924 and lyophobic areas 1926 exist It is illustrated as in Figure 29 in the whole thickness for being limited to the second hole-conductive layer 1918.However, those of ordinary skill in the art will manage Solution, region 1924 and/or 1926 can only be formed in a part of layer 1918, such as on the top surface of layer 1918.

In the exemplary embodiment, lyophilic regions 1924 can be limited between lyophobic areas 1926.Lyophobic areas can be with With the range between lyophilic regions in about 3 μm to more than 100 μm of width.Lyophilic regions 1924 can be defined so that Lyophilic regions 1924 have the surface area for the surface area for being slightly larger than each electrode 1906, and the limit of lyophilic regions 1924 It is scheduled on the part outside the active area of electrode 1906 and lyophilic regions surplus 1930 is provided.For example, as shown in figs. 30 and 31, lyophily area Domain 1924 can be limited to consider drying effect associated with deposition luminous organic material, allow lyophilic regions 1924 will Luminous organic material is limited in lyophilic regions 1924.Each lyophilic regions 1924 may include the active region with electrode 1906 Associated region 1928(is indicated in Figure 30 by dash area) and the parent outside the active region of electrode 1906 is set Liquid zone domain surplus 1930(if there is).When luminous organic material is deposited in the second hole-conductive layer 1918, organic light emission Material can be substantially limited in the lyophilic regions surplus 1930 of area 1928 and each lyophilic regions 1924.For example, when having When machine luminescent material (for example, dry) processed, heterogeneity may be created in the edge of each organic luminous layer, so that non- Uniformity is included in lyophilic regions surplus 1930.In other words, when luminous organic material is processed, the material in lyophily area Part in the area 1928 in domain 1924 has uniform top surface, to reduce perceived visual artifact.Lyophilic regions 1924 are defined so that distance of any non-homogeneous edge outside the active area of electrode 1906 can be based on edge at them Edge drying effect can be considered in drying effect and while changing.Such side can also be considered when limiting the shape of lyophilic regions Edge drying effect.For example, luminous organic material can lead to rounded edges rather than attached in various embodiment (not shown) The sharp corner being illustrated schematically in figure, to prepare for more uniform desciccator diaphragm.In addition, lyophilic regions 1924 can be with It is configured flexibly based on luminous organic material and drying effect associated with each material.In various exemplary embodiments In, it may be implemented about 20 μm or smaller or about 10 μm or smaller, or about 5 μm or smaller or about 3 μm or smaller lyophilic regions surplus 1930(are provided so that the influence to the edge drying effect of luminous zone is minimized). Increase lyophilic regions also can help compensate for pair during the radioactive exposure of patterning method relative to the size of light emitting region Quasi- error.For example, in one exemplary embodiment, the process-exposed of the radiation of patterning method can have about 2 μm Alignment precision.Therefore, the increased size of lyophilic regions can count and relative to lower section light emitting region about ± 2 μm of possibility Mis-alignment.

As described above, electrode 1906 can have different shape, arrangement and/or configuration.For example, related to blue light emissive The electrode of connection can be greater than electrode associated with red or green light emitting, because related to blue light emissive in OLED device The organic luminous layer of connection usually has the service life of shortening relative to organic luminous layer associated with red and green light emitting.Separately Outside, OLED device is operated to realize that the luminance level of reduction increases the service life of device.It is related to blue light emissive by increasing Emission area of the electrode of connection relative to electrode associated with red and green light emitting, electricity associated with blue light emissive It can extremely be actuated to realize the brightness lower than the brightness of electrode associated with red and green light emitting, thus different Preferably balance is created in the luminous organic material service life, and the suitable overall color balance of display is provided.This improvement Lifetime balanced further improve the overall life of display, because of associated with blue light emissive luminous organic material Service life can extend.In addition, lyophilic regions can correspond to the different shape, arrangement and/or configuration of electrode 1906.For example, In the another exemplary embodiment for showing the view similar with Figure 31, Figure 32 shows lyophilic regions 1924r, 1924g, 1924b can With associated with each self-electrode of different shapes, so that lyophilic regions 1924r is related to for realizing the electrode of red light emission Connection, lyophilic regions 1924g with for realizing the photoemissive electrode of green is associated and lyophilic regions 1924b and for realizing The electrode of blue light emissive is associated.

In the alternative embodiment (it is also the exemplary embodiment of amplifier section M shown in Figure 29) shown in Figure 33, Pixel deposition confining layers 1938 later can be arranged on substrate 1902 in electrode 1906.Pixel confining layer 1938 can deposit Above a part of electrode 1906, and lyophilic regions 1924 can be defined so that lyophilic regions surplus 1930 can cover At least part of pixel confining layer 1938.Pixel confining layer 1938 can be for the active region 1908 in display 1900 Pixel array in describe pixel any physical structure.Pixel confining layer 1938 can be made of resistance material, so that limit Given layer 1938 prevents electric current flowing and therefore can be by basically preventing subtracting by the light emitting at the edge of electrode 1906 Small undesired visual artifact.In the exemplary embodiment, pixel confining layer 1938 can have in about 50nm to about Thickness in the range of 1500nm.

As shown in figure 34, luminous organic material 1932 can be deposited on the active area display limited by limiting structure 1904 In trap W.For example, luminous organic material 1932 can be used ink jet printing be deposited on it is patterned in the second hole-conductive layer 1918 Above emission layer restricted area.Inkjet nozzle 1914 can be by the drop 1934 of the ink comprising luminous organic material via for example The relative scanning motion of nozzle 1914 and/or substrate 1902 and be directed to the top of lyophilic regions 1924.The liquid of luminous organic material Drop 1934 can be equably spread in lyophilic regions 1924 so that material be fixed on lyophilic regions 1924 edge (for example, In lyophilic regions surplus 1930).It will be appreciated by the skilled addressee that although single spray is discussed and shown referring to Figure 34 Mouth, but multiple nozzles can be implemented for providing the ink comprising luminous organic material.Comprising from different light emitting colors The ink of associated identical or different luminous organic material can simultaneously or sequentially be deposited from multiple inkjet nozzle heads.

The luminous organic material 1932 deposited may include being conducive to photoemissive material, such as with red, green and/ Or the associated electroluminescent organic material of blue light emissive.However, organic electroluminescence hair associated with other light emitting colors Luminescent material also can be used, electroluminescent organic material such as associated with yellow and/or white light emitting.

Electroluminescent organic material can be mixed to form ink-jet ink with carrier fluid, be configured in lyophilic regions Reliable and uniform loading is provided in 1924.The ink for being deposited as generating luminous organic material 1932 can be sprayed with high speed from ink-jet Mouth 1914 is delivered on lyophilic regions 1924.

Luminous organic material 1932 can usually remain in the surface district limited by lyophilic regions 1924.For example, organic Luminescent material 1932 can be loaded on substrate 1902 and the drop 1934 of ink is deposited in lyophilic regions 1924.By The drop of surface energy characteristic in lyophilic regions 1924, luminous organic material 1932 can equably be spread in lyophilic regions In the 1924 and edge be fixed in lyophilic regions surplus 1930.

In various exemplary embodiments, it is contemplated that multiple ink droplets with about 10pL or smaller volume can For depositing luminous organic material 1932.In various exemplary embodiments, about 5pL or smaller, about 3pL can be used Or smaller or about 2pL or smaller ink droplets volume.By using the patterned lyophilic regions according to the disclosure 1924 and lyophobic areas 1926, it can use and the consistent relatively large drop volume size of existing inkjet nozzle technology.Separately Outside, there is the additional margin for drop placement precision created due to lyophilic regions surplus 1930.

After ink 1934 is loaded on lyophilic regions 1924, display 1900 can be processed to allow any carrier Fluid evaporation as shown in figure 35, to create organic luminous layer 1933.Drying process may include display is exposed to heat, Vacuum and/or the predetermined period of ambient enviroment one.After drying, display 1900 can at elevated temperatures into One step is toasted to handle deposited membrane material, for example to induce the quality of film for being deposited or have for overall craft The chemical reaction of benefit or the change of film form.Any edge during drying and/or baking process in organic luminous layer 1933 Deformation can be contained in as relative to Figure 30 and 31 discuss and shown in lyophilic regions surplus 1930 in.

As shown in figure 36, the second electrode lay 1936 can next be deposited on 1933 top of dry organic luminous layer, by In the active area display trap W that limiting structure 1904 limits.In an alternate embodiment, the second electrode lay 1936 can also extend super Cross limiting structure 1904.For example, the second electrode lay 1936 (can not scheme with the external conductive path being arranged on substrate 1902 Show) contact, to supply or draw the electric current carried by the second electrode lay 1936.The second electrode lay 1936 can be transparent or anti- Penetrating property, and can be by the conduction material of such as metal, mixed metal, alloy, metal oxide, mixed oxide or combinations thereof Material is formed.For example, the second electrode lay 1936 can be tin indium oxide or magnesium silver.Although being shown in FIG. 36 as single layer, The second electrode lay 1936 can have any shape, arrangement and/or configuration, including multiple conductive layers.In an exemplary implementation In example, blanket technology is can be used to be formed in the second electrode lay 1936, so that electrode 1936 causes in the entire of display 1900 The single electrode of 1908 top of active region (see Figure 22 and 23).In an alternate embodiment, the second electrode lay 1936 may include Multiple electrodes, one of second electrode are associated with each electrode 1906 respectively (for example, overlapping).In addition, though the second electricity Pole layer 1936 is shown in FIG. 36 as the top surface with plane, and the second electrode lay 1936 can be deposited as so that layer 1936 reflects Lead to the lower section pattern of non-planar top surface out.

Any manufacturing method can be used to be formed in the second electrode lay 1936, and such as ink jet printing, nozzle print, slit apply It covers, rotary coating, vacuum thermal evaporation, sputtering (or other physical gas-phase deposite methods), chemical vapor deposition etc..Not with other sides Any additional patterning that formula executes during deposition can be by using web plate, photoetching (photoresist after deposition Coating, exposure, development and removing), wet etching, dry ecthing, strip etc. to realize.

When the second electrode lay 1936 is across the pantostrat of active area display trap W, layer 1936 can with blanket cover by The pattern that previously positioned layer is formed.For example, the second electrode lay 1936 can contact the biography of the second hole in lyophobic areas 1926 Conducting shell 1918 and the organic luminous layer 1933 formed above the lyophilic regions 1924 of the second hole-conductive layer 1918.

Additional oled layer can be deposited on above organic luminous layer 1933 before providing the second electrode lay 1936, such as Additional oled layer may include electron transfer layer, electron injecting layer, hole blocking layer, damp course and/or protective layer.For example, Such additional oled layer can pass through Vacuum Heat by various technologies well known by persons skilled in the art, such as ink jet printing Evaporation, or deposited by another method.

In the exemplary embodiment of replacement, display 1900 may include single hole-conductive layer as shown in Figure 37 1913, rather than the first hole-conductive layer 1912 and the second hole-conductive layer 1918 shown in such as Figure 28.Lyophilic regions 1924 can be limited in single hole-conductive layer 1913, so that lyophilic regions surplus 1930 is limited to single hole-conductive layer 1913 in the part outside the active region of electrode 1906.Hole-conductive layer 1913 may include that one or more holes pass Lead material.For example, hole-conductive layer 1913 may include hole-injecting material and/or hole transmission layer.

In addition, as shown in figure 37, hole-conductive layer 1913 and the second electrode lay 1936 can be consistent with the pattern of lower section, make It is nonplanar for obtaining the top surface of hole-conductive layer 1913 and/or the second electrode lay 1936.For example, the oled layer deposited can be with Lead to the surface topography not in the single plane with substrate-parallel and across entire active area display trap W.For example, layer 1913, the one or both in 1936 due to include that any surface characteristics of electrode for being arranged on substrate 1902 is associated Relatively sink or protrusion and in the single plane of display can be nonplanar and discontinuous (wherein, display Plane is intended to be parallel to the plane of substrate 1902).As shown, layer 1913,1936 can be with the shape of the surface characteristics of lower section Looks are sufficiently consistent, so that the top surface of oled layer can have the obtained pattern for the pattern for following underlying surfaces feature.It changes Yan Zhi, each deposited oled layer are sufficiently consistent with all underlying layer and/or surface characteristics being arranged on substrate 1902, make These underlying layer they deposit after contribute to the non-planar top surface pattern of obtained oled layer.With this side Formula, across active area display trap the plane parallel with the plane of display in, layer 1913 or 1936, or both in not Continuity can be generated with (multiple) layer relative to rising and/or the decline of plane, wherein existing surface characteristics is by having Electrode, circuit, pixel confining layer in source region display trap etc. provide.Although layer 1913 and/or 1936 do not need ideally with The pattern of lower section is consistent (for example, as explained above, there may be the thickness offsets of part around edge region etc.), But it wherein can be promoted more uniform, consistent there is no the significant full and uniform coating accumulated or consumed of material and can weighed Multiple coating.It will be appreciated by the skilled addressee that above-mentioned identical consideration can be applied to include hole injection layer and sky The hole-conductive layer of both cave transport layers, so that the pattern of the surface characteristics of one or both and lower section in such layer is abundant It is consistent, any layer of top surface can have the obtained pattern for the pattern for meeting underlying surfaces feature.

In various embodiments, limiting structure 1904 can be omitted, and alternatively, and ink formulation and printing technology can Be conducive to repel and be deposited on display to be designed such as in the region that lyophobic areas is formed in outside display active area Any fluid in non-active area.For example, as shown in figures 38 and 39, the first hole-conductive layer 1912 and the second hole-conductive layer 1918 can be deposited on the upper in the non-active area 1910 of display 1900 of electrode 1906 and substrate 1902. In the exemplary embodiment, layer 1912 and 1918 can be coated in above entire substrate with blanket.Second hole-conductive layer 1918 can Be processed to modification the second hole-conductive layer 1918 for limit emission layer restricted area part surface energy or Compatibility.In addition, the lyophobic areas 1925 in the non-active area 1910 of display can limit restricted area CA, wherein lyophoby Region 1925 can surround active area 1908.Ibid, radiation source 1926 can be provided by mask 1922 and is incident on by RSA material Expect the radiation on the surface of the second hole-conductive layer 1918 of processing.Radiation from radiation source 1926 can modify RSA material At least one characteristic to form lyophilic regions 1924.Lyophobic moieties 1925 can have leads to lyophobic areas in these sections Surface energy.In this embodiment, there is no limiting structures (for example, without active around the entire active area of display Area's display trap), from may be not present by all printing layers be limited in including and just in the active region of display The structure in region.This can provide specific processing and simplify, although potentially require simultaneously additional subsequent processing steps with from At least part material is removed in non-active viewing area.Luminous organic material 1932 can be deposited in lyophilic regions 1924.And And luminous organic material 1932 can be substantially limited in the active area 1908 of display 1900 due to lyophobic moieties 1925 It is interior.

Figure 40 is the cross section of amplifier section shown in Figure 39 and shows including related to the active area of electrode 1906 The lyophilic regions 1924 and lyophily surplus region 1930 of the part 1928 of connection.The lyophobic moieties 1925 of second hole-conductive layer can Between the associated lyophily surplus of each electrode 1906 region 1930 in the active area 1908 of non-active area 1910 It separates.Lyophobic moieties 1925 can prevent any luminous organic material from moving in the non-active part 1910 of display 1900.

Accoding to exemplary embodiment, the OLED device of Figure 22-40 can have top emission configuration or bottom emission configuration. For example, multiple electrodes 1906 shown in Figure 22-40 can be reflecting electrode and in Figure 36 and 37 in top emission configuration The second electrode lay 1936 shown can be transparent electrode.Alternatively, in bottom emission configuration, multiple electrodes 1906 can be with Transparent and the second electrode lay 1936 can be it is reflexive.

In a further exemplary embodiment, the OLED display of Figure 22-40 can be Activematric OLED (AMOLED).Phase Than in passive matrix OLED (PMOLED) display, display performance is can be improved in displayer, but needs to be included in base The active driving circuit of thin film transistor (TFT) (TFT) on plate, and such circuit is opaque.Although PMOLED display With some elements, such as opaque conductive bus, displayer substantially has more opaque elements.Cause This, for bottom emission displayer, fill factor is reduced compared to PMOLED, because light only can be by non- The bottom of substrate between transparent circuit element is launched.For this reason, it may be desirable that at the top of AMOLED use Transmitting configuration, because OLED device can be constructed on the top of such active circuit element, and light can pass through The top-emission of OLED device, the opacity without considering lower element.In general, can be increased using top emission structure Add the fill factor of each pixel limited in display 1900, because light emitting is not additional on substrate 1902 by being deposited on Nontransparent element (for example, TFT, drive circuit assembly etc.) blocking.However, the present disclosure is not limited to top-emission active matrixs OLED configuration.Technology discussed herein and arrangement can be used together with the display of any other type, such as bottom emission And/or passive matrix displays, and those skilled in the art will appreciate that how to make suitable modifications.

A variety of pixels and sub-pixel can be used for according to the disclosure above by reference to Figure 22-40 various aspects described.Figure 41 In depict the disclosure imagination an exemplary layout.

In the exemplary embodiment, emission layer restricted area can be limited to include across the area of multiple sub-pixels so that The non-active part of pixel is reduced.For example, as shown in figure 41, emission layer restricted area, which can be limited to, multiple to be addressed individually Above pixel electrode, wherein each pixel electrode can be associated with different pixels.By increasing emission layer limiting structure Area, fill factor can be maximized, because active region increases relative to the ratio of total elemental area.Realize filling Such increase of the factor can enable to realize the longevity of high-resolution and raising display in smaller big small displays Life.

Figure 41 shows the partial plan layout of display 2000, the display include for example such as by dashed boundaries 2050, 2051, the 2052 multiple pixels limited, they emit when selectively being driven can create the light for being shown to the image of user. In full color display, pixel 2050,2051,2052 may include multiple sub-pixels of different colours.For example, pixel 2050 It may include red sub-pixel R, green sub-pixels G and blue subpixels B.Emission layer restricted area 2034,2036,2038 can To be limited in the second hole-conductive layer 2026, wherein emission layer restricted area 2034 can with have in red wavelength range Transmitting luminous organic material it is associated, emission layer restricted area 2036 can with there is the transmitting in green color wavelength range Luminous organic material is associated and emission layer restricted area 2036 can with there is transmitting in blue wavelength region Luminous organic material is associated.Each emission layer restricted area 2034,2036,2038 can with multiple electrodes 2006,2007, 2008,2009,2016,2017,2018,2019,2022,2024 is associated.By by emission layer restricted area 2034,2036, 2038 are configured to, the total fill factor of display 2000 such as in high resolution display associated with multiple electrodes It can be improved.

The exemplary layout of Figure 41 is not intended to restrictive, there are various ways on the contrary to realize the disclosure.Permitted In more situations, the specific choice of specified arrangement can be by the basic layout of circuit, such as rectangle, herringbone, circle, six sides The expectation primitive shape of shape, triangle etc. and factor related from the visual appearance of display are (such as different configurations And for visual artifact that the different types of display content of such as text, figure or mobile video is observed that) pact The driving of beam.It will be appreciated by the skilled addressee that other multiple layouts fall within the scope of the disclosure and can pass through It modifies and is obtained based on principle described herein.Although in addition, it will be appreciated by the skilled addressee that put it more simply, Only describe emission layer restricted area in the description of the exemplary layout of Figure 41, but including electrode, surface characteristics, circuit, Any feature in pixel confining layer and the feature described above by reference to Figure 22-40 of other layers, can be with pixel in this Any layout of layout is used in combination.

Using various aspects according to the exemplary embodiment of the disclosure, some exemplary dimensions and parameter are had It can be when the high-resolution OLED display of increased fill factor useful.Table 9-11 include according to with 326ppi's The non-limiting example of the precognition of the exemplary embodiment of the associated disclosure of the OLED display of resolution ratio, wherein table 9 is retouched State sub-pixel associated with red light emission, the description of table 10 sub-pixel associated with green light emitting and the description of table 11 and The associated sub-pixel of blue light emissive., table 12-14 includes stock size and parameter, and according to point with 440ppi The non-limiting example of the precognition of the exemplary embodiment of the associated disclosure of the display of resolution, wherein table 12 description with it is red The associated sub-pixel of color emissions, the description of table 13 sub-pixel associated with green light emitting and the description of table 14 and blue light Emit associated sub-pixel.

Table 9

For the sub-pixel associated with red light emission in the display of the resolution ratio with 326 ppi	The length (μm) of sub-pixel	The width (μm) of sub-pixel	Emit restricted area area (μm2)
				Sub-pixel associated with emission layer restricted area as shown in Figure 41	31.5	31.5	989.5
Sub-pixel associated with the emission layer restricted area as shown in Figure 41 with confining layers as shown in Figure 34	28.5	28.5	809.8

Table 10

For the sub-pixel associated with green light emitting in the display of the resolution ratio with 326 ppi	The length (μm) of sub-pixel	The width (μm) of sub-pixel	Emit restricted area area (μm2)
				Sub-pixel associated with emission layer restricted area as shown in Figure 41	31.5	31.5	989.5
Sub-pixel associated with the emission layer restricted area as shown in Figure 41 with confining layers as shown in Figure 34	28.5	28.5	809.8

Table 11

For the sub-pixel associated with blue light emissive in the display of the resolution ratio with 326 ppi	The length (μm) of sub-pixel	The width (μm) of sub-pixel	Emit restricted area area (μm2)
				Sub-pixel associated with emission layer restricted area as shown in Figure 41	30.0	65.9	1979.1
Sub-pixel associated with the emission layer restricted area as shown in Figure 41 with confining layers as shown in Figure 34	27.0	59.9	1619.6

Table 12

For the sub-pixel associated with red light emission in the display of the resolution ratio with 440 ppi	The length (μm) of sub-pixel	The width (μm) of sub-pixel	Emit restricted area area (μm2)
				Sub-pixel associated with emission layer restricted area as shown in Figure 41	21.4	21.4	456.4
Sub-pixel associated with the emission layer restricted area as shown in Figure 41 with confining layers as shown in Figure 34	18.4	18.4	337.2

Table 13

For the sub-pixel associated with green light emitting in the display of the resolution ratio with 440 ppi	The length (μm) of sub-pixel	The width (μm) of sub-pixel	Emit restricted area area (μm2)
				Sub-pixel associated with emission layer restricted area as shown in Figure 41	21.4	21.4	456.4
Sub-pixel associated with the emission layer restricted area as shown in Figure 41 with confining layers as shown in Figure 34	18.4	18.4	337.2

The embodiment disclosed herein can be used for realizing high-resolution in any OLED display.Therefore, it is described herein Device, system and technology can be applied to various electronic display units.Such electronic display unit it is some non-limiting Example includes television indicator, video camera, digital camera, head-mounted display, Vehicular navigation system, the audio including display System, notebook personal computer, numbers game equipment, portable information terminal (such as plate, mobile computer, mobile phone, shifting Dynamic game station or e-book), be provided with the image playing device of recording medium.Two electron-likes are shown in Figure 20 and 21 to show The exemplary embodiment of equipment.

Figure 20 shows the televimonitor and/or desktop personal computer for being combined with any OLED display according to the disclosure Monitor.Monitor 1500 may include frame 1502, bracket 1504 and display portion 1506.OLED disclosed herein is aobvious Show that device embodiment may be used as display portion 1506.Monitor 1500 can be the display of any size, such as until 55 ' ' Ji Geng great.

Figure 21, which is shown, to be combined with according to the mobile device 1600(of any OLED display of the disclosure such as, cellular phone, Plate, personal digital assistant etc.) exemplary embodiment.Mobile device 1600 may include main body 1062, display portion 1604 And Operation switch 1606.OLED display embodiment disclosed herein may be used as display portion 1604.

It will be appreciated by those of ordinary skill in the art that Fig. 1-41 is to schematically show and be considered as to be only representative. For example, although various limiting structures 1904 and other structures can be shown as having the parallel walls for being set perpendicularly to substrate simultaneously And there is sharp edge, but these structures can have including rounded edges and/or angled wall how shape.Separately Outside, any layer, trap and/or restricted area can have edge heterogeneous, fillet, angled etc..

Various exemplary embodiments described above and according to the disclosure can be by increasing OLED material drop dress Be loaded into limitation trap and/or the size and permitting of restricted area there is relatively high pixel density and increased fill factor The ink jet printing of OLED display, and according to the disclosure, it is enable to using available droplet size and can be obtained Ink-jet system drop placement precision.Due to biggish limitation trap and region, can be used sufficiently large ink-jet drop volume with And available placement precision manufactures high-resolution OLED display, without using may ink-jet apparatus be designed and be printed Brush technology bring huge challenge too small droplet size or excessively high drop placement precision.When using limiting structure, Do not implement according to various embodiments of the present disclosure across the limitation trap of multiple sub-pixels or restricted area in the case where, droplet size and System drop placement error, which can be dramatically increased, manufactures the problems in any high resolution display using existing ink gun, because Drop will have too big volume and will overflow each sub-pixel limitation trap or region and general drop placement precision general Causing drop to be completely or partly located in, target limits trap or misplacing for region exterior is set, this will lead to undesirable in film deposition The corresponding defects of vision in error and final display appearance.It is placed with existing droplet size and drop and realizes high pixel density Ability make various example techniques described herein can be used in manufacture for the relatively high-resolution aobvious of many applications Show device, from the display of the small size in such as smart phone and/or plate, the large scale to such as ultrahigh resolution TV is aobvious Show device.

Also, accoding to exemplary embodiment, realizing has substantially uniform thickness with what lower section pattern was sufficiently consistent (multiple) OLED material layer can promote overall OLED display performance and quality, and can especially permit will be in high-resolution The expected performance and quality realized in OLED display.

Increased fill factor also may be implemented in one or more of embodiments described above.In conventional pixel cloth In setting, the fill factor of the display with the resolution ratio in the range of 300-440ppi has the fill factor less than 40%, And usually less than 30%.In comparison, for having the display of the resolution ratio in the range of 300-440ppi, the disclosure Exemplary embodiment the fill factor greater than 40% may be implemented, and be up to 60% in some instances.Exemplary embodiment It can be used for any pixel size and arrangement, including the pixel arrangement in high resolution display.

Exemplary embodiment can be used for the display of any size and be more specifically for having high-resolution small Display.It is greater than for example, the exemplary embodiment of the disclosure can be used for diagonal line size in 3-70 inches and resolution ratio 100ppi is greater than the display of 300ppi.

Although described various exemplary embodiments, which are imagined, utilizes ink-jet printing technology, various pictures described herein Other manufacturing technologies also can be used in element and subpixel layouts and the mode for generating these layouts for OLED display, all Such as thermal evaporation, organic vapor phase deposition and organic vapors spray printing, to manufacture.In the exemplary embodiment, substitution can also be executed Organic layer pattern.For example, patterning method may include web plate (in conjunction with thermal evaporation) and organic vapors spray printing.Specifically Ground, although (wherein, multiple sub-pixel groups of same color are combined and/or are deposited pixel layout described herein OLED film layer is in groups of subpixel area across pattern) it has already envisaged for for ink jet printing application, such layout can also Valuably, to be applied to vacuum thermal evaporation technology alternatively (wherein, to realize and pattern using web plate for OLED film deposition Step).Such layout provides increased distance between biggish web plate hole and such hole as described in this, thus latent The overall mechanical stability and general practicability of such web plate are improved on ground.Although utilizing the vacuum thermal evaporation technology of web plate It is at high cost unlike ink-jet technology, using according to the pixel layout of the disclosure and use across it is associated with same color at The OLED film layer coating of pattern in group sub-pixel also represents the potential important application of the disclosure described herein.

It is described above and can be by making it possible to according to the various exemplary embodiments of the disclosure according to the disclosure Using conventional ink droplets size and conventional ink-jet system drop placement precision, the ink-jet of limitation luminous organic material is utilized The emission layer restricted area of drop and the non-active area for reducing pixel, realizing has relatively high pixel density and increased fills out Fill the ink jet printing of the OLED display of the factor.Sufficiently large ink-jet can be used in the emission layer restricted area as defined by Droplet size and conventional drop placement precision manufacture high-resolution OLED display, may be to ink-jet apparatus without utilizing Design and printing technology bring the too small droplet size or excessive high drop placement precision of huge challenge.Using conventional spray In any high-resolution display of black head manufacture, the requirement for droplet size and system drippage placement error may be significant Increase.Realize that the ability of high pixel density makes technology described herein using Conventional drop volume and Conventional drop placement precision It can be used in the relatively high-resolution display that manufacture is used for many applications, from such as smart phone and/or plate Small-size display to such as ultrahigh resolution TV large-sized monitor.When being arranged using normal pixels, retouch above Reduced fill factor may be implemented in one or more of embodiment stated.In normal pixels arrangement, due to limiting trap knot The contribution that structure makes non-active pixel region, the fill factor with resolving range in the display of 300-440ppi have There are the fill factor less than 40%, and usually less than 30%.In comparison, for resolving range 300-440ppi display Device, the exemplary embodiment of the disclosure can have the fill factor greater than 40%, and reach 60% in some instances.Example Property embodiment can be used for any pixel size and arrangement, and be used in particular for the pixel in high resolution display arrangement.

Exemplary embodiment can be used for the display of any size and be used in particular for having high-resolution small display Device.For example, the exemplary embodiment of the disclosure can be used for 3-70 inch range and with greater than 100ppi and more specifically The display of resolution ratio of the ground greater than 300ppi.

Although several exemplary embodiments are only described in detail above, one ordinarily skilled in the art will readily appreciate that In the case where not deviating substantially from the disclosure, many modifications are also possible in the exemplary embodiment.Therefore, all such Modification is intended to include in the scope of the present disclosure as defined by the following claims.

Further aspect discloses in following part.

First aspect is related to the method for manufacturing organic light emitting display.First aspect may include provided on substrate it is multiple Electrode.Above multiple electrodes on substrate, the first hole-conductive layer can be deposited via ink jet printing.The first sky can be changed The liquid compatibility property of the selection surface portion of cave conducting shell, to limit emission layer restricted area.Each emission layer restricted area Domain can have respectively with the corresponding part of each of the multiple electrodes that are provided on substrate.In each emission layer restricted area In domain, organic luminous layer can be deposited via ink jet printing.

According to the second aspect of first aspect, this method can also be included in multiple electrodes and the first hole-conductive layer it Between, the second hole-conductive layer is deposited via ink jet printing.

According to the third aspect of any of aforementioned aspects, this method can also include providing on substrate around multiple The limiting structure of electrode.

According to any foregoing aspects of fourth aspect, this method can also include that the active of display is arranged in multiple electrodes In area.

According to any foregoing aspects of 5th aspect, this method can also be included in each organic luminous layer disposed thereon the Two electrodes, plurality of electrode are multiple first electrodes.

According to any foregoing aspects of 6th aspect, this method can also include in each of multiple electrodes electrode A part of disposed thereon pixel confining layer.

According to any foregoing aspects of 7th aspect, this method can also include that pixel confining layer has from about 50 nm To the thickness of about 1500 nm.

According to any foregoing aspects of eighth aspect, this method can also include radiating the first hole by the opening of mask The selection surface portion of conducting shell changes the liquid compatibility property on surface.

According to any foregoing aspects of 9th aspect, this method can also include that radiation includes infra-red radiation, visible wavelength At least one of radiation and ultraviolet radioactive.

According to any foregoing aspects of tenth aspect, this method can also include that the first hole-conductive layer blanket is deposited on Above multiple electrodes, to form substantially continuous material layer, and wherein there is nonplanar pattern back to the surface of substrate.

On the one hand according to any foregoing aspects of tenth, this method can also include the first hole-conductive layer blanket deposition Above the second hole-conductive layer, to form substantially continuous material layer, and wherein the first hole-conductive layer back to The surface of two hole-conductive layers has nonplanar pattern.

12nd aspect is related to organic light emitting display.12nd aspect may include the multiple electricity being disposed on the substrate Pole.The multiple electrode can be arranged with array configuration.Limiting structure can be set on substrate.Limiting structure can surround more A electrode.First hole-conductive layer can be set above the multiple electrodes in limiting structure.The surface of first hole-conductive layer Partial liquid compatibility property can be changed to limit emission layer restricted area in the first hole-conductive layer.Organic light emission Layer can be set in each emission layer restricted area.

According to the 13rd aspect of the 12nd aspect, which can also include being arranged in multiple electrodes and the first hole The second hole-conductive layer between conducting shell.

According to the fourteenth aspect of the 12nd or 13 aspects, which can also include each emission layer restricted area Domain is surrounded by lyophobic areas.

According to the 15th aspect of the tenth two to ten four aspect, which can also include each emission layer restricted area Domain is not individually surrounded by limiting structure.

According to the 16th aspect of the tenth two to ten five aspect, which can also include that multiple electrodes setting is aobvious Show in the active area of device.

17th aspect is related to the organic light emitting display made of a technique.17th aspect may include providing base Plate, the substrate include the multiple electrodes of setting on the substrate.At least one hole-conductive layer can be via ink jet printing It is deposited on above the multiple electrodes on substrate.The liquid compatibility property of the selection surface portion of at least one hole-conductive layer can Emission layer restricted area is limited on the surface of at least one hole-conductive layer to be changed.Can be defined in it is described at least In each emission layer restricted area in one hole-conductive layer, organic luminous layer is deposited via ink jet printing.

According to the 18th aspect of the 17th aspect, the display made of the technique further includes the limit provided on substrate Structure processed, wherein limiting structure limits the trap for surrounding multiple electrodes.

Can also include according to the 17th aspect or the 19th aspect of the 18th aspect, the display made of the technique Above multiple electrodes on substrate, via the first hole-conductive layer that ink jet printing deposits, wherein emission layer restricted area is limited It is scheduled on the surface of the first hole-conductive layer.

According to the 20th aspect of the 17th to the 19th aspect, the display made of the technique can also be included in base Above multiple electrodes on plate, via the first hole-conductive layer of ink jet printing deposition and above a hole-conductive layer the Two hole-conductive layers, wherein emission layer restricted area can be limited on the surface of the second hole-conductive layer.

On the one hand according to the 20th of the 17th to the 20th aspect the, the display made of the technique may include setting Multiple electrodes in the active area of display.

It should be understood that various embodiments shown and described herein are considered illustrative.Understand description here it Afterwards, such as obvious for those of ordinary skill in the art, the arrangement of element and material and these elements and material can substitute It is shown and described herein.Without departing from the spirit and scope of the disclosure and following following claims (including their equivalent) In the case of, element described herein can be made a change.

It will be appreciated by those of ordinary skill in the art that without departing from the range of this introduction, it can be to public herein The arrangements and methods for the exemplary embodiment opened make various modifications.

Skilled addressee will further appreciate that relative to various features disclosed in an exemplary embodiment here It can be used in combination in the case where suitable modifications with other exemplary embodiments, even if such combination is not specific public herein It opens.

Those of ordinary skill in the art will be will be apparent from, without departing from the scope of the disclosure and the accompanying claims In the case of, various modifications and deformation can be made to the device, method and system of the disclosure.Consider the disclosure disclosed herein Specification and practice, what the other embodiments of the disclosure will be apparent to those skilled in the art.The specification and example It should be to be considered merely as illustrative.

Claims (48)

1. a kind of method for manufacturing organic light emitting display, comprising:

Luminous organic material is deposited in the hole-conductive layer above the multiple electrodes of setting on a surface of a substrate；

Wherein hole-conductive layer includes:

Multiple restricted areas with first surface energy, the multiple restricted area is by by having and first surface energy The borderline region of the different second surface energy properties of matter is separated from each other, one in each restricted area and the multiple electrode Or multiple electrodes are associated and across the region bigger than the active region of one or more of electrodes；And

Processing is deposited on the luminous organic material above hole-conductive layer to form organic luminous layer, different first surface energy Property and second surface energy properties cause organic luminous layer to be restricted to restricted area.

2. the method as described in claim 1 further comprises:

In the additional electrode of organic luminous layer disposed thereon being restricted in each restricted area.

3. method according to claim 2, wherein depositing additional electrode includes the organic luminous layer in all restricted areas Top blanket deposits additional electrode.

4. the method as described in claim 1 further comprises:

Processing hole-conductive layer is created with the surface energy property changed in the selection region of hole-conductive layer with first The restricted area of surface energy property and borderline region with second surface energy properties.

5. method as claimed in claim 4, wherein processing hole-conductive layer includes radiating hole-conductive by the opening of mask Layer.

6. method as claimed in claim 5, wherein processing hole-conductive layer will reaction before being included in radiation hole-conductive layer Surface active material is applied to hole-conductive layer.

7. method as claimed in claim 5, wherein radiation hole-conductive layer include using infra-red radiation, visible wavelength radiation and At least one of ultraviolet radioactive radiates hole-conductive layer.

8. the method as described in claim 1, wherein；

First surface energy properties are enough to attract the luminous organic material being deposited in hole-conductive layer, and

Second surface energy response is enough to repel the luminous organic material being deposited in hole-conductive layer.

9. the method as described in claim 1 further comprises:

The limiting structure around the multiple restricted area and borderline region on substrate is provided.

10. the method as described in claim 1 further comprises:

In the multiple electrode disposed thereon hole-conductive layer to form substantially continuous hole-conductive layer above substrate.

11. method as claimed in claim 9, further comprises:

Before deposition of hole conducting shell, via ink jet printing in other substantial continuous of the multiple electrode disposed thereon Hole-conductive layer.

12. the method as described in claim 1, wherein one or more of electrodes include associated with each restricted area Multiple electrodes, each electrode in multiple electrode are the individual addressing electrodes for limiting sub-pixel, and wherein by multiple electricity Each sub-pixel that each electrode in extremely limits is associated from different pixels.

13. the method as described in claim 1, wherein deposition luminous organic material includes that deposition has and feux rouges, green light and indigo plant The luminous organic material of an associated wavelength in light is so as to corresponding to for issuing the preparatory of feux rouges, green light and blue light Organic material layer is formed in the restricted area of determining pattern of pixels.

14. the method as described in claim 1, wherein processing luminous organic material includes from organic hair to form organic luminous layer Luminescent material evaporation of carrier fluid.

15. the method as described in claim 1, wherein processing luminous organic material includes dry and dry to form organic luminous layer At least one of roasting luminous organic material.

16. the method as described in claim 1, wherein the multiple electrode is arranged in the active area of display.

17. the method as described in claim 1, wherein the first hole transport material by via blanket coating deposition the multiple With the pantostrat of forming material above electrode.

18. the method as described in claim 1, wherein it includes by organic light emission that luminous organic material, which is deposited on restricted area, On ink-jet printing materials to restricted area.

19. a kind of method for manufacturing organic light emitting display, comprising:

Luminous organic material is deposited on the restricted area that hole-conductive layer square on a plurality of electrodes is arranged, the multiple electricity Pole is arranged on a surface of a substrate, and each of restricted area and one or more electrodes in the multiple electrode are associated simultaneously And across the region bigger than the active region of one or more of electrodes；

Wherein, due to the different surface energies of restricted area and the borderline region around restricted area of hole-conductive layer Matter, the luminous organic material deposited on restricted area are constrained from diffusion beyond restricted area；And

It handles the luminous organic material being deposited on the restricted area of hole-conductive layer and is limited in restricted area to be formed Organic luminous layer in each.

20. method as claimed in claim 19, further comprises:

Hole-conductive layer is handled to change the surface energy property of the selection region of hole-conductive layer, thus creation has different The restricted area and borderline region of surface energy property.

21. method as claimed in claim 19, wherein processing hole-conductive layer includes radiating hole by the opening of mask to pass Conducting shell.

22. method as claimed in claim 21, wherein radiation hole-conductive layer includes using infra-red radiation, visible wavelength radiation Hole-conductive layer is radiated at least one of ultraviolet radioactive.

23. method as claimed in claim 22, wherein processing hole-conductive layer will be anti-before being included in radiation hole-conductive layer Surface active material is answered to be applied to hole-conductive layer.

24. method as claimed in claim 19, wherein one or more of electrodes include associated with each restricted area Multiple electrodes, each electrode in multiple electrode is the individual addressing electrodes for limiting sub-pixel, and wherein by multiple Each sub-pixel that each electrode in electrode limits is associated from different pixels.

25. method as claimed in claim 19, further comprises:

In the multiple electrode disposed thereon hole-conductive layer to form substantially continuous hole-conductive layer above substrate.

26. method as claimed in claim 25, further comprises:

Before deposition of hole conducting shell, in the other substantial continuous hole-conductive layer of the multiple electrode disposed thereon.

27. method as claimed in claim 19, wherein it includes corresponding to that luminous organic material, which is deposited on restricted area, Issuing deposition in the corresponding restricted area of the predetermined pattern of pixels of feux rouges, green light and blue light has and feux rouges, green light With the luminous organic material of an associated wavelength in blue light.

28. method as claimed in claim 19, wherein processing luminous organic material includes from organic to form organic luminous layer Luminescent material evaporation of carrier fluid.

29. method as claimed in claim 19, wherein processing luminous organic material with formed organic luminous layer include it is dry and Toast at least one of luminous organic material.

30. method as claimed in claim 19, wherein the first hole transport material is by via talking formula coating deposition described more With the pantostrat of forming material above a electrode.

31. method as claimed in claim 19, wherein it includes by organic hair that luminous organic material, which is deposited on restricted area, In luminescent material ink jet printing to restricted area.

32. a kind of organic light emitting display, comprising:

Substrate；

The multiple electrodes being disposed on the substrate；

The first hole-conductive layer for covering the multiple electrode being disposed on the substrate, wherein the first hole-conductive layer includes:

It is covered each by the luminescent layer restricted area of one or more electrodes in the multiple electrode being disposed on the substrate, wherein The active area of each restricted area in restricted area across the corresponding one or more electrodes covered than each restricted area The big region in domain；And

The borderline region of luminescent layer restricted area is surrounded respectively,

Wherein luminescent layer restricted area is with the first liquid compatibility property and borderline region has and the first liquid compatibility The different second liquid compatibility property of property, and

Organic luminous layer at the position of covering luminescent layer restricted area is set, and organic luminous layer is limited in luminescent layer limitation In region.

33. display as claimed in claim 32, wherein when depositing luminous organic material in luminescent layer restricted area, side The second liquid compatibility property in battery limit (BL) domain forbids the migration of luminous organic material.

34. display as claimed in claim 32 further comprises being arranged in the multiple electrode and the first hole-conductive layer Between the second hole-conductive layer.

35. display as claimed in claim 32, wherein second liquid compatibility property causes borderline region to repel liquid.

36. display as claimed in claim 32, wherein each luminescent layer restricted area is not individually enclosed by limiting structure Around.

37. display as claimed in claim 32, wherein the multiple electrode is arranged in the active region of display.

38. display as claimed in claim 32 further comprises the organic hair being arranged in each luminescent layer restricted area Second electrode above photosphere, wherein the multiple electrode is multiple first electrodes.

39. display as claimed in claim 38, wherein the multiple first electrode is reflecting electrode and second electrode is Transparent electrode.

40. display as claimed in claim 39, wherein the multiple first electrode is transparent electrode and second electrode is Reflecting electrode.

41. display as claimed in claim 39, wherein second electrode is arranged in above all luminescent layer restricted areas Public electrode.

42. display as claimed in claim 32 further comprises setting a part in each of the multiple electrode The pixel confining layer of top.

43. display as claimed in claim 42, wherein pixel confining layer has range from about 50nm to about 1500nm Thickness.

44. display as claimed in claim 32, in which:

First hole-conductive layer is the substantial continuous layer of material, and

The surface back to substrate of first hole-conductive layer have follow the multiple electrode and the first hole-conductive layer covering The non-planar pattern of the pattern of substrate.

45. display as claimed in claim 44 further comprises be arranged between the first hole-conductive layer and substrate Two hole-conductive layers.

46. display as claimed in claim 32, wherein display is the active matrix for including the circuit being disposed on the substrate Display.

47. display as claimed in claim 32 further comprises being disposed on the substrate to surround the limit of the multiple electrode Structure processed.

48. display as claimed in claim 32, wherein the multiple electrode is arranged to array.