CN110120410A - A kind of display unit, display panel and preparation method thereof and display equipment - Google Patents
A kind of display unit, display panel and preparation method thereof and display equipment Download PDFInfo
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- CN110120410A CN110120410A CN201910435283.5A CN201910435283A CN110120410A CN 110120410 A CN110120410 A CN 110120410A CN 201910435283 A CN201910435283 A CN 201910435283A CN 110120410 A CN110120410 A CN 110120410A
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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Abstract
The present invention discloses a kind of display unit, display panel and preparation method thereof and display equipment, is related to field of display technology, to guarantee the production yield of display panel while reducing IR pressure drop.The display unit includes: the first electrode layer being cascading, insulating layer, the second electrode lay and protective layer；The insulating layer offers insulation via hole; the first connecting line for being electrically connected first electrode layer and the second electrode lay is equipped in the insulation via hole; the protective layer is used to form the insulation via hole; the protective layer includes occlusion part and opening portion, and the opening portion is at least overlapped with the insulation via hole in the orthographic projection of insulating layer.The display panel includes above-mentioned display unit.Display unit provided by the invention, display panel and preparation method thereof and display equipment for showing in.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display unit, a display panel, a manufacturing method of the display panel and display equipment.
Background
An Organic electroluminescent (OLED) Display is a flexible Display with low power consumption, high color saturation, wide viewing angle and thin thickness, and can be widely applied to terminal products such as smart phones, tablet computers, televisions and the like.
As the resolution of the OLED display is higher and higher, the width of the conductive wires included in the OLED display is narrower and narrower, so that the resistance values of the conductive wires are larger and larger, and therefore, for the OLED display with high resolution, the equivalent resistance from the connection terminal to the working unit is particularly large, which results in a higher IR drop from the connection terminal to the working unit, thereby affecting the stable operation of the working unit. For example: when the IR drop between the electrode of the light emitting cell and the source and drain of the thin film transistor is relatively large, the luminance of the light emitting cell is affected.
In order to reduce the IR drop between the source and drain of the thin film transistor and the corresponding electrode of the light emitting unit, a hole is generally formed in the film layer between the electrode of the light emitting unit and the source and drain of the thin film transistor to shorten the length of the wire between the electrode of the light emitting unit and the source and drain of the thin film transistor, thereby reducing the IR drop between the electrode of the light emitting unit and the source and drain of the thin film transistor and further reducing the influence on the light emitting unit due to the IR drop. However, when a film layer between an electrode of a light emitting unit and a source/drain of a thin film transistor is formed with a hole, a large amount of products are generated by the hole, which may adversely affect the electrode of the light emitting unit, and further affect the yield of the OLED display.
Disclosure of Invention
The invention aims to provide a display unit, a display panel, a manufacturing method of the display panel and display equipment, which are used for reducing IR drop and ensuring the manufacturing yield of the display panel.
In order to achieve the above object, the present invention provides a display unit including: the electrode comprises a first electrode layer, an insulating layer, a second electrode layer and a protective layer which are sequentially stacked; insulating via hole has been seted up to the insulating layer, be equipped with the first connecting wire that is used for electric connection first electrode layer and second electrode layer in the insulating via hole, the protective layer is used for forming insulating via hole, the protective layer includes shielding part and opening, the orthographic projection of opening at the insulating layer at least with insulating via hole coincidence.
Compared with the prior art, in the display unit provided by the invention, the protective layer comprises the shielding part and the opening part, and the orthographic projection of the opening part on the substrate is at least superposed with the groove, so that when the insulating via hole is formed in the insulating layer, after the protective layer is formed on the second electrode layer and is far away from the surface of the substrate, holes are formed in the second electrode layer and the insulating layer, the first electrode layer forms the electrode via hole, the insulating via hole is formed in the insulating layer, and the conductive material is formed in the electrode via hole and the insulating via hole, so that the first electrode layer is electrically connected with the second electrode. Therefore, the display unit structure provided by the invention can ensure that the second electrode completes the process of opening the via hole of the second electrode layer and the insulating layer under the protection of the protective layer when the display panel is manufactured, so that the IR voltage drop between the first electrode layer and the second electrode layer is reduced. The second electrode is protected by the protective layer, and the via hole opening process of the second electrode layer and the insulating layer is completed, so that the protective layer can reduce the adverse effect of products generated when the via holes are formed in the second electrode layer and the insulating layer on the second electrode layer, and the manufacturing yield of the display panel is ensured.
The invention also provides a display panel which comprises at least one display unit.
Compared with the prior art, the beneficial effects of the display panel provided by the invention are the same as those of the display unit, and are not repeated herein.
The invention also provides a manufacturing method of the display panel, which is characterized by comprising the following steps:
providing a substrate base plate;
sequentially laminating a first electrode layer, an insulating layer, a second electrode layer and a protective layer on the substrate base plate, so that the protective layer comprises a shielding part and at least one opening part;
forming at least one electrode via hole in the second electrode layer; forming at least one insulating via hole in the insulating layer, so that the orthographic projection of the at least one opening part on the insulating layer is at least correspondingly superposed with the at least one insulating via hole one by one, and the at least one insulating via hole is correspondingly superposed with the at least one electrode via hole one by one;
forming a first connecting line electrically connected with the first electrode layer in the at least one insulated via hole; and forming second connecting lines in the at least one electrode through hole, so that the second connecting lines in the at least one electrode through hole are electrically connected with the first connecting lines in the at least one insulating through hole in a one-to-one correspondence manner.
Compared with the prior art, the beneficial effects of the manufacturing method of the display panel provided by the invention are the same as those of the display unit, and are not repeated herein.
The invention also provides a display device which comprises the display panel.
Compared with the prior art, the beneficial effects of the display device provided by the invention are the same as those of the display unit, and are not repeated herein.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a block diagram of a conventional display device;
FIG. 2 is a block diagram of a conventional display device;
FIG. 3 is a block diagram of a conventional display device;
FIG. 4 is a schematic structural diagram of a conventional OLED display panel;
FIG. 5 is a schematic diagram of a conventional LCD panel;
fig. 6 is a first schematic structural diagram of a display unit according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a display unit according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a display unit according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a display unit according to a fourth embodiment of the present invention;
fig. 10 is a first schematic layout diagram of display units in a display panel according to an embodiment of the present invention;
fig. 11 is a second schematic layout diagram of display units in the display panel according to the embodiment of the present invention;
fig. 12 is a third schematic layout diagram of display units in the display panel according to the embodiment of the present invention;
fig. 13 is a first flowchart illustrating a process of manufacturing a display panel according to an embodiment of the present invention;
FIG. 14 is a second flowchart illustrating a process of fabricating a display panel according to an embodiment of the present invention;
fig. 15 is a third flowchart illustrating a manufacturing process of the display panel according to the embodiment;
fig. 16 is a manufacturing process diagram of a display panel according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Before introducing the information related to the present application, the following explanations will be made for the related terms related to the embodiments of the present application.
IR drop refers to a phenomenon in which the voltage drops or rises on the power and ground networks that occur in a circuit, which increases as the equivalent resistance between the power and ground networks increases.
The OLED is an Organic Light-Emitting Diode (OLED), which is abbreviated as OLED, and chinese is an Organic electroluminescent device.
LCD is an abbreviation of Liquid Crystal Display, and chinese is a Liquid Crystal Display.
A one-to-one correspondence refers to a one-to-one correspondence of location and number. For example: the one-to-one correspondence between at least one A and at least one B means that the quantity of the A and the B is the same, the position of one A corresponds to the position of one B, and the position correspondence means the spatial correspondence.
Fig. 1 shows a schematic view of an associated display device. As shown in fig. 1, the display device may be an OLED display device or an LCD display device. The display device includes a display panel 100 and a display control apparatus 200.
As shown in fig. 2, the display control apparatus 200 mainly includes a central processing unit 210, a display controller 220 and a driving chip 230. As shown in fig. 3, the display controller 220 includes a frame memory control module 221, an image processing module 222, a timing control module 223, and a display memory 224; the driving chip 230 includes a scan driving unit 231 and a data driving unit 232. The frame memory control module 221 is electrically connected with the video memory 224, the central processing unit 210 is in communication connection with the frame memory control module 221, the image processing module 222 is connected with the frame memory control module 221, the image processing module 222 is in communication connection with the time sequence control module 223, and the time sequence control module 223 is connected with the scanning driving unit 231 and the data driving unit 232 through scanning control links. It should be understood that the conventional timing controller is only used to generate the sync signal and has no processing function for the video signal, but with the development of display control technology, the currently used timing controller has been integrated with an image processing function so that the timing controller can process the video signal.
As shown in fig. 3, the display panel 100 may be an OLED display panel or an LCD display panel. However, the display panel 100 includes an Array substrate Array on which a thin film transistor Array is formed. The display panel 100 includes a plurality of display units, and the plurality of display units are arranged in a matrix arrangement, but may be arranged in other manners. Each display cell may be defined as a pixel cell, and each display cell includes at least a thin film transistor TFT. The scan driving unit 231 is connected to a gate electrode of each thin film transistor TFT included in each display unit, and the data driving unit 232 is connected to a source electrode or a drain electrode of each thin film transistor TFT in the thin film transistor array.
As shown in fig. 4, when the display panel is an OLED display panel, each display unit should further include a light emitting unit EL formed on a surface of the thin film transistor TFT, and the light emitting unit EL is electrically connected to the thin film transistor TFT.
As shown in fig. 5, when the display panel is an LCD display panel, each display unit should further include a pixel electrode PIX, a liquid crystal layer CL, and a color film substrate CF, which are stacked, and the pixel electrode PIX is electrically connected to the thin film transistor TFT. Moreover, when the display panel is an LCD display panel, the display device further includes a backlight module.
Not only is the IR drop problem of each display unit of the display panel, but also the characteristics of the thin film transistors TFT included therein are different, so that the display luminance difference of different areas of the display device is relatively large. Taking an OLED display panel as an example, in order to reduce the IR drop of the OLED display panel, when the OLED display panel is manufactured, generally, after the electrode of the light emitting unit EL is formed, a via hole is formed in the electrode of the light emitting unit EL and a film layer between the electrode and the source/drain electrode by using an etching process, and then a conductive material is deposited therein, so that the light emitting unit EL is electrically connected to the thin film transistor TFT. In the manufacturing process of the OLED display panel, after the electrode is formed, the through hole is formed in the electrode and the film layer between the electrode and the source and drain electrodes, and then the conductive material is deposited into the through hole to electrically connect the light-emitting unit EL and the thin film transistor, so that a product formed in the process of forming the through hole has a certain influence on the formed film layer. For example: the materials of the required hole-opening area are removed by adopting laser, and the formed film layer is easily polluted by the products generated by the materials under the action of the laser, so that the manufacturing yield of the display equipment is influenced, and the film-forming chamber is polluted.
In order to more clearly explain the IR drop generation principle and solution of the related display panel, a top-emitting OLED display device is taken as an example and described in detail below.
For a large-area OLED display device, the top electrode (e.g., cathode) of the light emitting unit EL is a planar electrode, and the edge of the planar electrode is connected to the power supply terminal through the source/drain of the thin film transistor, so that signal electrons of the power supply terminal are gradually conducted from the periphery of the top electrode to the center, which leads to an increase in IR drop of the large-area OLED display device. Meanwhile, for the top-emission OLED display device, the top electrode is generally thinner to reduce the influence of the top electrode on the light-emitting efficiency of the light-emitting unit EL as much as possible, but this also increases the resistance of the top electrode to a great extent, and as the area of the light-emitting unit EL increases, the IR drop in the display panel further increases. In addition, due to the characteristic difference of different thin film transistors, the display effect of different areas of the display panel has a large difference, and thus the use experience of consumers is reduced.
In order to solve the above problem, in a display panel having a large area, the resistance of the top electrode is often reduced as much as possible by providing an auxiliary electrode therein. Meanwhile, a film layer below the top electrode is subjected to hole opening operation by adopting a laser removal or other removal modes to remove materials in a hole opening area, and then a conductive material is formed in the hole opening area, so that the top electrode is electrically connected with an electrode (such as a source/drain electrode or a conductive layer with smaller resistance) below the film layer, and the IR voltage drop between the top electrode and a power supply terminal can be reduced. When the top electrode is electrically connected with the electrode below the film layer, more products are generated by removing the material by laser, so that the formed film layer is polluted, and the subsequent packaging is easily adversely affected.
In view of the above problems, as shown in fig. 6 and 7, an embodiment of the present invention provides a display unit, which may be of a type of an OLED display unit or an LCD display unit, etc. The display unit includes: the first electrode layer 110, the insulating layer 140, the second electrode layer 120, and the protective layer 150 are sequentially stacked, and the material contained in the first electrode layer 110 and the second electrode layer 120 may be a conductive material such as indium tin oxide, a metal material, and the like, and is specifically selected according to the function of the first electrode layer 110 and the second electrode layer 120 in the display unit. The protective layer 150 and the insulating layer 140 can be made of any non-conductive material.
As shown in fig. 16 a to 16C, the insulating layer 140 is formed with an insulating via K1, and a first connection line X1 for electrically connecting the first electrode layer 110 and the second electrode layer 120 is disposed in the insulating via K1. The protective layer 150 is used to form the insulating via K1, and the protective layer 150 includes a shielding portion 152 and an opening portion 151, and an orthogonal projection of the opening portion 151 on the insulating layer 140 overlaps at least the insulating via K1.
In the display unit provided by the embodiment of the invention, the protection layer 150 includes the blocking portion 152 and the opening portion 151, and the orthographic projection of the opening portion 151 on the substrate at least coincides with the groove, so that when the insulating layer 140 is provided with the insulating via hole K1, after the protection layer 150 is formed on the second electrode layer 120 away from the substrate surface, holes are formed on the second electrode layer 120 and the insulating layer 140, so that the second electrode layer 120 forms the electrode via hole K2, the insulating layer 140 is provided with the insulating via hole K1, and a conductive material is formed in the electrode via hole K2 and the insulating via hole K1, thereby electrically connecting the first electrode layer 110 and the second electrode layer 120. Therefore, the display unit structure provided by the embodiment of the invention can ensure that the second electrode layer 120 completes the via opening process of the second electrode layer 120 and the insulating layer 140 under the protection of the protective layer 150 when the display panel is manufactured, so that the IR drop between the first electrode layer 110 and the second electrode layer 120 is reduced. Because the second electrode layer 120 completes the process of opening the via hole between the second electrode layer 120 and the insulating layer 140 under the protection of the protective layer 150, the protective layer 150 can reduce the adverse effect of the product generated when the via hole is opened between the second electrode layer 120 and the insulating layer 140 on the second electrode layer 120 and other formed film layers, thereby ensuring the production yield of the display panel.
It should be understood that the second electrode layer 120 is provided with an electrode via hole K2 communicating with the insulating via hole K1, and the electrode via hole K2 is provided with a second connecting line X2 electrically connected to the first connecting line X1, so that the second electrode layer 120 can be electrically connected to the first electrode layer 110 through the second connecting line X2 and the first connecting line X1. In addition, the thickness of the protective layer 150 may be set according to practical circumstances, such as 10nm to 200 nm.
In some embodiments, as shown in fig. 6 and 7, in order to improve the protection performance of the protection layer 150, the protection layer 150 is an inorganic protection layer having good corrosion resistance and high temperature resistance, which can effectively alleviate the adverse effect of the products formed in the laser opening or other openings on the protection layer 150. Meanwhile, when the inorganic protective layer is formed, the problems of solvent residue and the like are not involved, and the pollution is further reduced, so that the manufacturing yield and the reliability of the display device are better improved. The inorganic protective layer may be an aluminum oxide protective layer, a silicon oxide protective layer, or a silicon oxynitride protective layer, but may be other inorganic protective layers.
In some embodiments, as shown in fig. 6, 7 and C in fig. 16 a to 16C, in order to ensure the electrical connection stability of the first electrode layer 110 and the second electrode layer 120, it is necessary to make the reliability of the second connection line X2 lapped on the second electrode layer 120 higher. For this purpose, the insulating via K1 is located in the orthographic projection of the opening 151 on the insulating layer 140, and the insulating via K1 is located in the orthographic projection of the electrode via K2 on the insulating layer 140, so that the cross-sectional area of the electrode via K2 and the cross-sectional area of the opening 151 are both larger than the cross-sectional area of the insulating via K1; therefore, the process of opening the electrode via K2 in the second electrode layer 120 and the process of opening the insulating via K1 in the insulating layer 140 need to be performed twice. Namely, the second electrode layer 120 is provided with the electrode via hole K2 for the first time, so that the region of the insulating layer 140 corresponding to the electrode via hole K2 is exposed; and opening an insulating via hole K1 in the region of the insulating layer 140 corresponding to the electrode via hole K2 for the second time, wherein a part of the region of the insulating layer 140 corresponding to the electrode via hole K2 is removed to form an insulating via hole K1, and the other part of the region is not removed but is contaminated with products, but the regions contaminated with the products are not large, and the performance of the display unit is not greatly affected.
Meanwhile, when the cross-sectional area of the electrode via K2 and the cross-sectional area of the opening 151 are both larger than the cross-sectional area of the insulating via K1, the display unit further includes a third electrode layer 120 located in the opening 151, where the third electrode layer 120 is located on the surface of the second electrode layer 120 away from the insulating layer 140, so that the third electrode layer 120 can be electrically connected to the first connection line X1 through the second electrode layer 120, and therefore, the orthographic projection of the third electrode layer 120 on the insulating layer 140 not only covers the insulating via K1 region, but also covers the portion of the insulating layer 140 corresponding to the region of the electrode via K2 where no material is removed.
When the orthographic projection of the third electrode layer 120 on the insulating layer 140 covers not only the region of the insulating via hole K1 but also a portion of the insulating layer 140 corresponding to the region of the electrode via hole K2 from which no material is removed, the third electrode layer 120 can increase the connection strength between the first connection line X1 and the region of the second electrode layer 120 not corresponding to the region of the insulating via hole K1. Meanwhile, when the orthographic projection of the third electrode layer 120 on the insulating layer 140 covers not only the insulating via hole K1 region but also a portion of the insulating layer 140 where no material is removed from the region corresponding to the electrode via hole K2, the third electrode layer 120 also covers the region of the second electrode layer 120 where no corresponding insulating via hole K1 and the region corresponding to the insulating via hole K1 are present, and thus, even if the insulating layer 140 is too thick, the first connection line X1 is disconnected from the region of the second electrode where no corresponding insulating via hole is present, the third electrode layer 120 electrically connected to the first connection line X1 can be electrically connected to the region of the second electrode layer 120 where no corresponding insulating via hole is present.
It should be understood that, as shown in fig. 16 a to 16C, when the electrode via hole K2 is opened on the second electrode, the third electrode layer 120 is electrically connected to the first electrode layer 110 through the second connection line X2 in the electrode via hole K2 and the first connection line X1 in the insulating via hole K1, and at this time, the first electrode layer 110 and the second electrode layer 120 are electrically connected together by using a connection line lap joint method.
As can be seen from the above, forming the third electrode layer 120 on the surface of the second electrode layer 120 far from the insulating layer 140 can effectively improve the contact characteristic between the second electrode layer 120 and the connection line (the second connection line X2), so that the reliability of the second connection line X2 overlapped with the second electrode layer 120 is higher, thereby ensuring the stability of the electrical connection between the first electrode layer 110 and the second electrode layer 120, reducing the problem of overlapping failure caused by the excessively thick insulating layer 140, and further improving the manufacturing brightness of the display device. It should be understood that, when the orthographic projection of the third electrode layer 120 on the insulating layer 140 covers not only the insulating via hole K1 region, but also the part of the insulating layer 140 corresponding to the electrode via hole K2 where no material is removed, the shortest distance d (as shown in fig. 6) between the orthographic projection outer edge of the third electrode layer 120 on the insulating layer 140 and the outer edge of the insulating via hole K1 is 3 μm to 50 μm, so as to ensure that the area of the third electrode layer 120 is as small as possible, and at the same time, the contact characteristic between the second electrode layer 120 and the connecting wire can be effectively improved.
In addition, in the embodiment of the invention, the third electrode layer 130 is formed only in the opening portion, so that the light loss of the light emitting region by the third electrode layer can be reduced. In the actual process of manufacturing the display unit, the first connection line X1, the second connection line X2, and the third electrode layer 130 are manufactured in a single deposition process, and considering that a portion of the third electrode layer 130 corresponds to a region of the insulating layer 140 without an opening and another portion corresponds to the insulating via hole K1, when the first connection line X1, the second connection line X2, and the third electrode layer 130 are manufactured in a single deposition process, the finally formed third electrode layer 130 is a film with a thick peripheral region and a thin middle region, and the third electrode layer 130 is considered to be a film with an opening, and the depth of the third electrode layer 130 is determined by the depth of the insulating via hole. Of course, the third electrode layer 130 may also be a planar film layer as shown in fig. 7. It should be understood that the orthographic projection of the hole of the third electrode layer 130 is located in the insulated via hole K1, and at this time, the orthographic projection of the insulating layer 140 of the third electrode layer 120 covers the edge region of the insulated via hole K1, and at the same time, the orthographic projection of the insulating layer 140 still covers the portion of the region of the insulated via hole K1 corresponding to the electrode via hole K2 where no material is removed, so as to ensure that the third electrode layer 120 is in an improvement of the reliability of the electrical connection between the first electrode layer 110 and the second electrode.
In some embodiments, as shown in fig. 6 and 7, when the protection layer 150 is a part of the encapsulation layer 160 of the OLED display unit, the display unit further includes an encapsulation layer 160 formed on the surface of the protection layer 150 away from the second electrode layer 120, and the encapsulation layer 160 can cover the product originally falling on the surface of the protection layer 150 during the opening process, so as to ensure the reliability and the flatness of the encapsulation. The encapsulation layer 160 may be an inorganic encapsulation layer or an organic encapsulation layer. The material of the encapsulation layer 160 may be the same as or different from the material of the protection layer 150. Meanwhile, the protective layer 150 and the encapsulation layer 160 may serve as a barrier layer to prevent moisture from affecting the light emitting function layer EM.
Of course, the thickness of the encapsulation layer 160 may be increased to further enhance the encapsulation effect, and the number of layers of the encapsulation layer 160 may also be increased to further enhance the encapsulation effect.
In some embodiments, the first electrode layer 110 and the second electrode layer 120 may be any electrode in a display unit. For example: when the display unit is an OLED display unit, the first electrode layer 110 may be a source or a drain included in the source/drain layer 360 shown in fig. 8, or may be the conductive layer 180 shown in fig. 9. The second electrode layer 120 is an electrode layer of the light emitting device, and the electrode layer may be an anode layer or a cathode layer.
In one implementation, as shown in fig. 6 and 8, the first electrode layer 110 is a source drain layer 360, the insulating layer 140 includes a planarization layer 370 and a pixel definition layer stacked along a surface away from the first electrode layer 110, and the display unit further includes an encapsulation layer 160 formed on a surface of the protection layer 150 away from the second electrode layer 120. It should be understood that the display unit further includes an active layer 320, a gate insulating layer 330, a gate electrode layer 340, and an interlayer insulating layer 350, and also includes existing film layers such as a light emitting functional layer EM and a fourth electrode layer 170, and the fourth electrode layer 170 may cooperate with the second electrode layer 120 to cause the light emitting functional layer EM to emit light.
In another implementation manner, as shown in fig. 6 and fig. 9, the first electrode layer 110 is a conductive layer 180 electrically connected to the source drain layer 360, the insulating layer 140 includes a pixel defining layer 190, and the display unit further includes a planarization layer 370 and an encapsulation layer 160; the planarization layer 370 is formed on the surface of the first electrode layer 110 away from the pixel defining layer 190, and the encapsulation layer 160 is formed on the surface of the protection layer 150 away from the second electrode layer 120. It should be understood that the display unit further includes an active layer 320, a gate insulating layer 330, a gate layer 340, an interlayer insulating layer 350, a source drain layer 360 and a planarization layer 370, and also includes existing film layers such as a light emitting functional layer EM and a fourth electrode layer 170, and the fourth electrode layer 170 may cooperate with the second electrode layer 120 to make the light emitting functional layer EM emit light. The conductive layer 180 and the fourth electrode layer 170 may be formed on the same layer, but they are insulated from each other, so as to prevent the fourth electrode layer 170 and the second electrode layer 120 from being shorted together when the second electrode layer 120 is connected to the conductive layer 180.
As shown in fig. 10 to 12, an embodiment of the present invention further provides a display panel, which includes at least one display Cell as described above.
Compared with the prior art, the beneficial effects of the display panel provided by the embodiment of the invention are the same as those of the display unit, and are not repeated herein.
In some embodiments, as shown in fig. 10 to 12, the number of the display cells is multiple, and the arrangement of the multiple display cells may be set according to actual needs.
For example: the arrangement mode of the plurality of display unit cells is a matrix arrangement mode. At this time, the plurality of display cells form a display Cell matrix. The matrix of display cells includes a plurality of rows of display cells and a plurality of columns of display cells. The positions of two adjacent rows of display units can be in one-to-one correspondence or staggered; the positions of two adjacent rows of display units can be in one-to-one correspondence or staggered.
Fig. 10 shows a schematic diagram of a 3 row by 4 column matrix of display cells. As shown in fig. 10, the positions of two adjacent rows of display units are in one-to-one correspondence, and the positions of two adjacent columns of display units are in one-to-one correspondence. In the display Cell matrix shown in fig. 10, the geometric centers of every four display cells may form a square.
Fig. 11 shows a schematic diagram of a matrix of 5 rows by 7 columns of display cells. As shown in fig. 11, the display cells in two adjacent rows are shifted in position, and the display cells in two adjacent columns are shifted in position. In the display Cell matrix shown in fig. 11, the geometric centers of every three display cells may form a triangle.
Another example is: as shown in fig. 12, the second electrode layers 120 included in the respective display cells Cell are connected together, and in this case, the second electrode layers 120 are planar electrodes, and for the planar electrodes, the equivalent resistance of the planar electrodes gradually increases along the direction from the edge to the center of the planar electrodes; for this reason, as shown in fig. 12, the density of the display cells gradually increases from the edge of the display panel toward the geometric center of the display panel to offset the problem of an increase in IR drop due to the resistance problem.
It should be understood that when the display panel is an OLED display panel, the display panel may include the display unit completely, or may include some existing display units at the same time as the display unit. The display units in the prior art and the display units in the embodiment can be arranged alternately, so that the problem of high opening density of the protective layer caused by over concentration of the display units is solved, and the protective layer is ensured to have certain structural strength.
As shown in fig. 13 and fig. 16, an embodiment of the present invention further provides a method for manufacturing a display panel, where the method for manufacturing a display panel includes:
step S100: providing a substrate base plate; the substrate may be a flexible substrate or a rigid substrate.
Step S200: sequentially laminating and forming a first electrode layer 110, an insulating layer 140, a second electrode layer 120 and a protective layer 150 on a substrate so that the protective layer 150 comprises a blocking portion 152 and at least one opening portion 151, and the specific structure is shown in a in fig. 16; the second electrode layer 120 may be a planar electrode or a patterned electrode, and the protection layer 150 is an inorganic protection layer to prevent damage to the protection layer 150 caused by laser drilling, etching drilling, and other processes.
Step S300: forming at least one electrode via K2 on the second electrode layer 120; at least one insulating via hole K1 is opened on the insulating layer 140, such that an orthographic projection of the at least one opening 151 on the insulating layer 140 at least coincides with the at least one insulating via hole K1 in a one-to-one correspondence manner, and the at least one insulating via hole K1 at least corresponds to the at least one electrode via hole K2 in a one-to-one correspondence manner, specifically, the structure is shown in fig. 16B.
Step S400: forming a first connection line X1 electrically connected to the first electrode layer 110 within the at least one insulating via K1; the second connection line X2 is formed in the at least one electrode via hole K2, so that the second connection line X2 in the at least one electrode via hole K2 is electrically connected with the first connection line X1 in the at least one insulating via hole K1 in a one-to-one correspondence, and the specific structure is shown in C in fig. 16.
Compared with the prior art, the beneficial effects of the manufacturing method of the display panel provided by the embodiment of the invention are the same as those of the display unit, and are not repeated herein.
In addition, as shown in a of fig. 16, when there are a plurality of the opening portions 151, the opening portions 151 may be arranged in the same manner as the display unit. Such as: the plurality of opening portions 151 are arranged in a matrix, and specifically, refer to fig. 10 and 11. Another example is: the density of the opening portions 151 gradually increases from the edge of the protective layer 150 toward the geometric center of the protective layer 150, as can be seen in fig. 12. It should be understood that when the arrangement of the opening portions 151 is fixed, the arrangement of the electrode via K2 opened in the second electrode layer 120 and the insulating via K1 opened in the insulating layer 140 is also fixed.
As shown in fig. 13 and 16, in order to ensure the stability of the electrical connection between the first electrode layer 110 and the second electrode layer 120, after at least one electrode via hole K2 is opened on the second electrode layer 120, the method for manufacturing the display unit further includes:
step S500: the third electrode layer 120 located on the surface of the second electrode layer 120 away from the insulating layer 140 is formed in the at least one opening 151, so that the at least one insulating via hole K1 is located in the orthogonal projection of the insulating layer 140, where the third electrode layer 120 is located in the at least one opening 151 in a one-to-one correspondence manner, and the specific structure is shown in fig. 16C, which achieves the effect as described above. It should be understood that the first connection line X1, the second connection line X2, and the third electrode layer 120 may be implemented in one deposition process, or may be sequentially formed.
It should be understood that when the at least one insulated via K1 is located in the orthographic projection of the at least one opening 151 in a one-to-one correspondence manner on the third electrode layer 120, the at least one insulated via K1 is located in the orthographic projection of the at least one opening 151 on the insulating layer 140, and the at least one insulated via K1 is located in the orthographic projection of the at least one electrode via K2 on the insulating layer 140 in a one-to-one correspondence manner.
In some embodiments, as shown in fig. 8 and 14, the providing a substrate base plate includes:
step S100 a: an active layer 320, a gate insulating layer 330, a gate layer 340, and an interlayer insulating layer 350 are sequentially formed on the surface of the backplate 310. The back plate 310 may be a hard substrate such as a glass substrate, or may be a flexible substrate such as a polyimide substrate.
As shown in fig. 8 and 14, the OLED display panel, in which the first electrode layer 110, the insulating layer 140, the second electrode layer 120, and the protective layer 150 are sequentially stacked on the substrate, includes:
step S210 a: a source/drain electrode layer 360 is formed on the surface of the interlayer insulating layer 350 away from the gate electrode layer 340 as the first electrode layer 110.
Step S220 a: forming a planarization layer 370 on the surface of the source drain layer 360 away from the interlayer insulating layer 350;
step S230 a: the pixel defining layer 190 is formed on the surface of the planarization layer 370 away from the source drain layer 360, so that the insulating layer 140 includes the planarization layer 370 and the pixel defining layer 190.
Step S240 a: the second electrode layer 120 is formed on the surface of the pixel defining layer 190 away from the planarization layer 370.
Step S250 a: a protective layer 150 is formed on the surface of the second electrode layer 120 away from the planarization layer 370.
It should be understood that, for the above-mentioned OLED display panel, between step S220a and step S230a, a film layer such as a fourth electrode layer 180 is further formed on the surface of the planarization layer 370 away from the source/drain layer 360, and between step S230a and step S240a, a film layer such as: a film layer such as a light emitting function layer EM is formed in a pixel region defined by the pixel defining layer 190.
In other embodiments, as shown in fig. 9 and 15, the providing a substrate base plate includes:
step S100 b: an active layer 320, a gate insulating layer 330, a gate layer 340, an interlayer insulating layer 350, a source drain layer 360, and a planarization layer 370 are sequentially formed on the surface of the backplate 310. The back plate 310 may be a hard substrate such as a glass substrate, or may be a flexible substrate such as a polyimide substrate.
As shown in fig. 9 and 15, the OLED display panel, in which the first electrode layer 110, the insulating layer 140, the second electrode layer 120, and the protective layer 150 are sequentially stacked on the substrate, includes:
step S210 b: a conductive layer 180 electrically connected to the source drain layer 360 is formed on the surface of the planarization layer 370 remote from the source drain, so that the first electrode layer 110 includes the conductive layer 180.
Step S220 b: a pixel defining layer is formed on the surface of the conductive layer 180 remote from the planarization layer 370 such that the insulating layer 140 includes the pixel defining layer 190.
Step S230 b: the second electrode layer 120 is formed on the surface of the pixel defining layer 190 away from the planarization layer 370.
Step S240 b: a protective layer 150 is formed on the surface of the second electrode layer 120 away from the planarization layer 370.
It should be understood that, for the above-mentioned OLED display panel, between step S220 and step S230, a film layer such as a fourth electrode layer 180 is further formed on the surface of the planarization layer 370 away from the source/drain layer 360, and between step S230a and step S240a, a film layer such as: a film layer such as a light emitting function layer EM is formed in a pixel region defined by the pixel defining layer 190.
In some embodiments, as shown in fig. 13 and D of fig. 16, for the OLED display panel, after forming the second connection line X2 in the at least one electrode via K2, the method for manufacturing the display panel further includes:
step S600: an encapsulation layer 160 is formed on the surface of the protection layer 150 away from the second electrode layer 120. It should be understood that if the above-mentioned manufacturing method of the display panel includes step S500, step S600 is executed after step S500.
In some embodiments, as shown in fig. 9 and 16, the present invention provides a method for manufacturing a display panel, and for convenience of the following description, the protection layer 150 having one opening 151 is described as an example.
Firstly, film layers such as an active layer 320, a gate insulating layer 330, a gate layer 340, an interlayer insulating layer 350, a source drain layer 360, a planarization layer 370, an anode layer (i.e., a fourth electrode layer 180), a pixel definition layer 190, and the like are sequentially stacked on the surface of a back plate 310; the film formation method is conventional and will not be described again.
In the second step, a light emitting function layer EM is formed in a pixel region defined by the pixel defining layer 190.
In the third step, a cathode layer (i.e., the second electrode layer 120) is formed on the surface of the light emission function layer EM away from the planarization layer 370 and the surface of the pixel defining layer 190 away from the planarization layer 370. It is to be understood that the anode layer essentially comprises two parts, one part being an anode of the light emitting functional layer EM and the other part being the above mentioned conductive layer 180 for electrical connection with the cathode layer.
Thirdly, forming a protective layer 150 with the thickness of 10 nm-200 nm on the surface of the cathode layer far away from the light-emitting functional layer EM by adopting a mask process and a chemical vapor deposition method, so that the protective layer 150 is provided with a blocking part 152 and an opening part 151, and the orthographic projection of the opening part 151 on the planarization layer 370 is positioned in the orthographic projection of the conductive layer 180 on the planarization layer 370; the material of the protection layer 150 is an inorganic material, such as silicon oxide, silicon nitride, or aluminum oxide. The corresponding cathode pattern is only remained in the connection area, and the rest areas are shielded.
A fourth step of forming an electrode via hole K2 by punching a region of the cathode layer corresponding to the opening 151 by laser punching or other means; a hole is punched in a region of the pixel defining layer 190 corresponding to the opening portion 151 to form an insulated via hole K1, and it is ensured that the electrode via hole K2 is larger than the insulated via hole K1. In the process of punching, the surface of the cathode layer away from the planarization layer 370 is covered by the protection layer 150, so that the products generated in the punching process, such as organic volatile, debris, etc., fall on the protection layer 150 and rarely on the cathode layer, and therefore, the protection layer 150 can protect the light emitting functional layer EM and the cathode layer from being contaminated by the punching products, thereby improving the manufacturing yield and reliability of the display panel.
Fifth, a conductive material is formed at the insulated via hole K1, the electrode via hole K2, and the opening portion 151, such that the conductive material in the insulated via hole K1 forms the first connection line X1, the conductive material in the electrode via hole K2 forms the second connection line X2, and the conductive material in the opening portion 151 forms the third electrode layer 120. Meanwhile, the shortest distance d between the orthographic projection outer edge of the third electrode layer 120 on the insulating layer 140 and the outer edge of the insulating via K1 is 3 μm to 50 μm.
Sixthly, forming an encapsulation layer 160 on the surface of the protection layer 150 far from the cathode layer, wherein the encapsulation layer 160 can cover the resultant falling on the surface of the protection layer 150 and ensure the moisture barrier property of the formed display panel.
The embodiment of the invention also provides display equipment, and the display device comprises the display panel.
Compared with the prior art, the beneficial effects of the display device provided by the invention are the same as those of the display unit, and are not repeated herein.
The display device provided by the above embodiment may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, or a navigator.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (13)
1. A display unit, comprising: the electrode comprises a first electrode layer, an insulating layer, a second electrode layer and a protective layer which are sequentially stacked; insulating via hole has been seted up to the insulating layer, be equipped with the first connecting wire that is used for electric connection first electrode layer and second electrode layer in the insulating via hole, the protective layer is used for forming insulating via hole, the protective layer includes shielding part and opening, the orthographic projection of opening at the insulating layer at least with insulating via hole coincidence.
2. The display unit according to claim 1, wherein the display unit further comprises a third electrode layer located in the opening portion, the third electrode layer is located on a surface of the second electrode layer away from the insulating layer, the third electrode layer is electrically connected to the first connecting line through the second electrode layer, the insulating via hole is located in an orthographic projection of the opening portion on the insulating layer, and the insulating via hole is located in an orthographic projection of the third electrode layer on the insulating layer.
3. The display unit according to claim 1, wherein the second electrode layer is provided with an electrode via hole communicated with the insulating via hole, and a second connecting line electrically connected with the first connecting line is arranged in the electrode via hole; and/or the presence of a gas in the gas,
a packaging layer is formed on the surface of the protection layer, which is far away from the second electrode layer; and/or the presence of a gas in the gas,
the protective layer is an inorganic protective layer.
4. The display unit according to claim 1, wherein the first electrode layer is a source drain layer; or the first electrode layer is a conductive layer electrically connected with the source drain electrode layer.
5. A display panel comprising at least one display unit according to any one of claims 1 to 4.
6. The display panel according to claim 5, wherein the display unit is plural in number; wherein,
the plurality of display units form a display unit matrix; or,
the second electrode layers included in the display units are connected together, and the density of the display units is gradually increased from the edge of the display panel to the geometric center of the display panel.
7. A method for manufacturing a display panel is characterized by comprising the following steps:
providing a substrate base plate;
sequentially laminating a first electrode layer, an insulating layer, a second electrode layer and a protective layer on the substrate base plate, so that the protective layer comprises a shielding part and at least one opening part;
forming at least one electrode via hole in the second electrode layer; forming at least one insulating via hole in the insulating layer, so that the orthographic projection of the at least one opening part on the insulating layer is at least correspondingly superposed with the at least one insulating via hole one by one, and the at least one insulating via hole is correspondingly superposed with the at least one electrode via hole one by one;
forming a first connecting line electrically connected with the first electrode layer in the at least one insulated via hole; and forming second connecting lines in the at least one electrode through hole, so that the second connecting lines in the at least one electrode through hole are electrically connected with the first connecting lines in the at least one insulating through hole in a one-to-one correspondence manner.
8. The method for manufacturing a display panel according to claim 7, wherein after the opening of the at least one electrode via hole in the second electrode layer, the method for manufacturing a display unit further comprises:
and forming a third electrode layer of the third electrode layer positioned on the second electrode layer and far away from the surface of the insulating layer in the at least one opening part, so that the third electrode layer positioned in the at least one opening part and corresponding to the at least one insulating via hole is positioned in the orthographic projection of the insulating layer.
9. The method for manufacturing a display panel according to claim 7,
the at least one insulating via hole is correspondingly positioned in the orthographic projection of the at least one opening part on the insulating layer; and/or
The at least one insulating via hole is correspondingly positioned in the orthographic projection of the at least one electrode via hole on the insulating layer; and/or the presence of a gas in the gas,
the protective layer is an inorganic protective layer; and/or the presence of a gas in the gas,
the second electrode layer is a planar electrode.
10. The method for manufacturing a display panel according to any one of claims 7 to 9, wherein the providing a substrate includes:
sequentially forming an active layer, a grid electrode insulating layer, a grid electrode layer and an interlayer insulating layer which are stacked on the surface of the backboard;
the sequentially laminating and forming a first electrode layer, an insulating layer, a second electrode layer and a protective layer on the substrate base plate comprises:
forming a source drain electrode layer serving as a first electrode layer on the surface, far away from the gate electrode layer, of the interlayer insulating layer;
forming a planarization layer on the surface of the source drain layer far away from the interlayer insulating layer;
forming a pixel defining layer on the surface of the planarization layer far away from the source drain layer, so that the insulation layer comprises the planarization layer and the pixel defining layer;
forming a second electrode layer on the surface of the pixel defining layer far away from the planarization layer;
forming a protective layer on the surface of the second electrode layer far away from the planarization layer;
after the second connection line is formed in the at least one electrode via hole, the manufacturing method of the display panel further includes:
and forming an encapsulation layer on the surface of the protection layer far away from the second electrode layer.
11. The method for manufacturing a display panel according to any one of claims 7 to 9, wherein the providing a substrate includes:
sequentially forming an active layer, a grid insulating layer, a grid layer, an interlayer insulating layer, a source drain layer and a planarization layer which are stacked on the surface of the backboard;
the sequentially laminating and forming a first electrode layer, an insulating layer, a second electrode layer and a protective layer on the substrate base plate comprises:
forming a conductive layer electrically connected with the source drain electrode layer on the surface of the planarization layer far away from the source drain electrode, so that the first electrode layer comprises the conductive layer;
forming a pixel defining layer on a surface of the conductive layer remote from the planarization layer such that the insulating layer comprises the pixel defining layer;
forming a second electrode layer on the surface of the pixel defining layer far away from the planarization layer;
forming a protective layer on the surface of the second electrode layer far away from the planarization layer;
after the second connection line is formed in the at least one electrode via hole, the manufacturing method of the display panel further includes:
and forming an encapsulation layer on the surface of the protection layer far away from the second electrode layer.
12. The method for manufacturing a display panel according to any one of claims 7 to 9, wherein the number of the opening portions is plural; wherein,
a plurality of openings are arranged in a matrix manner; or,
the density of the opening portions gradually increases from the edge of the protective layer toward the geometric center of the protective layer.
13. A display device comprising the display panel according to claim 5 or 6.
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