CN110118533B - Three-dimensional detection method and detection device - Google Patents
Three-dimensional detection method and detection device Download PDFInfo
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- CN110118533B CN110118533B CN201810112454.6A CN201810112454A CN110118533B CN 110118533 B CN110118533 B CN 110118533B CN 201810112454 A CN201810112454 A CN 201810112454A CN 110118533 B CN110118533 B CN 110118533B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
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Abstract
The invention discloses a three-dimensional detection method and a detection device. The method comprises the following steps: the light source module emits a first light beam with adjustable wavelength; reflecting part of the first light beam on the upper surface and the lower surface of the transparent film layer respectively; the detection module receives the reflected first light beam, and the two light beams interfere with each other to generate a first interference fringe; determining the thickness of the transparent film layer according to the first interference fringes; the light source module emits a second light beam to the beam splitter, and the second light beam is split into a third light beam and a fourth light beam by the beam splitter; the third light beam is emitted to the surface of the device to be detected, reflected and then emitted to the detection module; transmitting the fourth light beam to the reference unit, converting the fourth light beam into a reference light beam and transmitting the reference light beam to the detection module; the detection module receives the reflected third light beam and the reference light beam and generates interference to generate a second interference fringe; and performing three-dimensional detection on the surface of the device to be detected according to the second interference fringes and the thickness of the transparent film layer. The invention can realize the accurate three-dimensional measurement of the surface of the device to be measured.
Description
Technical Field
The embodiment of the invention relates to a semiconductor technology, in particular to a three-dimensional detection method and a detection device.
Background
The concepts such as "superman law" lead the Integrated Circuit (IC) industry from an era of pursuing process technology nodes to a completely new era of relying more on the development of chip packaging technology. Compared with the traditional Packaging, Wafer Level Packaging (WLP) has obvious advantages in the aspects of reducing the Packaging size and saving the process cost. Therefore, WLP will be one of the major technologies that will support the continued development of ICs in the future.
WLP mainly comprises Pillar/Gold/Solder Bump, redistribution layer (RDL), Through Silicon Via (TSV) and other process technologies. In order to increase the yield of chip manufacturing, the chip needs to be inspected for defects in the whole packaging process, and early devices mainly focused on two-dimensional surface defect inspection, such as contamination, scratches, particles, etc. As process control requirements increase, there is an increasing need to detect three-dimensional features of the surface, such as Bump height, RDL thickness, via depth of TSVs, and the like.
At present, the three-dimensional measurement of the chip can be carried out by adopting an optical interference method, but when a transparent film layer exists on the surface of a device to be measured, the interference fringes are greatly influenced by the reflected light of the upper surface and the lower surface of the transparent film layer, so that a large measurement error is easily generated.
Disclosure of Invention
The embodiment of the invention provides a three-dimensional detection method and a detection device, which can measure the thickness of a transparent film layer on one hand; on the other hand, the influence of the transparent film layer on the measurement result can be corrected according to the thickness of the transparent film layer, and accurate three-dimensional measurement of the surface of the device to be measured is achieved.
In a first aspect, an embodiment of the present invention provides a three-dimensional detection method, where a transparent film layer is formed on a surface of a device to be detected, and the method includes:
the light source module emits a first light beam with adjustable wavelength, and the wavelength of the first light beam is adjusted;
emitting at least part of the first light beam to the surface of the device to be tested, wherein the part of the first light beam emitted to the surface of the device to be tested is reflected on the upper surface and the lower surface of the transparent film layer respectively;
the detection module receives first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer, and the first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer interfere at a detection surface of the detection module and generate first interference fringes;
determining the thickness of a transparent film layer on the surface of the device to be tested according to the first interference fringes;
the light source module emits a second light beam and emits the second light beam to the beam splitter, and the beam splitter splits the second light beam into a third light beam and a fourth light beam;
the third light beam is vertically emitted to the surface of a device to be detected, and the third light beam is reflected by the surface of the device to be detected and then emitted to a detection module through the beam splitter;
transmitting the fourth beam of light to a reference unit, and the reference unit converting the fourth beam of light to a reference beam of light, the reference beam of light being transmitted to a detection module via the beam splitter;
the detection module receives the third light beam reflected by the surface of the device to be detected and the reference light beam, and the third light beam reflected by the surface of the device to be detected and the reference light beam interfere with each other on a detection surface of the detection module to generate a second interference fringe;
and performing three-dimensional detection on the surface of the device to be detected according to the second interference fringes and the thickness of the transparent film layer.
In a second aspect, an embodiment of the present invention further provides a three-dimensional inspection apparatus, where a transparent film layer is formed on a surface of a device to be inspected, and the apparatus includes:
the light source module is used for emitting a first light beam with adjustable wavelength and adjusting the wavelength of the first light beam, at least part of the first light beam is emitted to the surface of the device to be tested, and the part of the first light beam emitted to the surface of the device to be tested is reflected on the upper surface and the lower surface of the transparent film layer respectively;
the detection module is used for receiving the first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer, the first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer interfere on a detection surface of the detection module to generate first interference fringes, and the thickness of the transparent film layer on the surface of the device to be detected is determined according to the first interference fringes;
the light source module is also used for emitting a second light beam and transmitting the second light beam to the beam splitter;
the beam splitter is used for splitting the second light beam into a third light beam and a fourth light beam, the third light beam is vertically emitted to the surface of the device to be tested, and the fourth light beam is emitted to the reference unit;
the reference unit is used for converting the fourth light beam into a reference light beam, and the reference light beam is emitted to the detection module through the beam splitter;
the detection module is further used for receiving the reference beam, reflecting the reference beam on the surface of the device to be detected, passing through the third beam transmitted by the beam splitter, interfering the third beam transmitted by the beam splitter with the reference beam on a detection surface of the detection module to generate a second interference fringe, and performing three-dimensional detection on the surface of the device to be detected according to the second interference fringe and the thickness of the transparent film layer.
According to the three-dimensional detection method provided by the embodiment of the invention, the light source module emits the first light beam with adjustable wavelength, and the wavelength of the first light beam is adjusted; emitting at least part of the first light beam to the surface of the device to be tested, wherein the part of the first light beam emitted to the surface of the device to be tested is reflected on the upper surface and the lower surface of the transparent film layer respectively; receiving, by a detection module, first light beams respectively reflected by an upper surface and a lower surface of a transparent film layer, the first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer interfering at a detection surface of the first detection module and generating first interference fringes; determining the thickness of a transparent film layer on the surface of the device to be tested according to the first interference fringes; emitting a second light beam through the light source module, emitting the second light beam to the beam splitter, and splitting the second light beam into a third light beam and a fourth light beam by the beam splitter; the third light beam is vertically emitted to the surface of the device to be detected, and is reflected by the surface of the device to be detected and then emitted to the detection module through the beam splitter; the fourth light beam is emitted to the reference unit, the fourth light beam is taken as the reference light beam by the reference unit, and the reference light beam is emitted to the detection module through the beam splitter; receiving a third light beam and a reference light beam reflected by the surface of the device to be detected through a detection module, wherein the third light beam and the reference light beam reflected by the surface of the device to be detected interfere with each other on a detection surface of the detection module and generate a second interference fringe; and performing three-dimensional detection on the surface of the device to be detected according to the second interference fringes and the thickness of the transparent film layer. According to the technical scheme provided by the embodiment of the invention, the thickness of the transparent film layer can be measured by using an optical interference method; on the other hand, the three-dimensional measurement of the surface of the device to be measured can be realized, and the influence of the transparent film layer on the measurement result is corrected according to the thickness of the transparent film layer, so that the measurement precision is improved.
Drawings
Fig. 1 is a flowchart of a three-dimensional detection method according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a three-dimensional detection apparatus according to a second embodiment of the present invention;
FIG. 3A is a schematic diagram of an interference light path for measuring the thickness of a transparent film according to a second embodiment of the present invention;
FIG. 3B is a schematic diagram of an interference optical path of a height of a surface of a device under test relative to a reference plane of a reference unit according to a second embodiment of the present invention;
fig. 4 is a schematic structural diagram of a three-dimensional detection apparatus according to a third embodiment of the present invention;
fig. 5 is a schematic diagram of the distribution of the interference intensity of the transparent film layer at different wavelengths in the third embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for convenience of description, only a part of structures related to the present invention, not all of the structures, are shown in the drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout.
Example one
Fig. 1 is a flowchart of a three-dimensional inspection method according to an embodiment of the present invention, where the embodiment is applicable to a case where a transparent film is formed on a surface of a device to be inspected, and the method includes the following steps:
The first light beam is coherent light, and may be laser, for example, and the light source module may include a laser and output continuous laser light with adjustable wavelength.
And 20, emitting at least part of the first light beam to the surface of the device to be tested, wherein the part of the first light beam emitted to the surface of the device to be tested is reflected on the upper surface and the lower surface of the transparent film layer respectively.
And step 30, the detection module receives the first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer, and the first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer interfere with each other on a detection surface of the detection module and generate first interference fringes.
It can be understood that the first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer satisfy the condition of interference, and the two light beams interfere at the detection surface of the detection module to generate a first interference fringe.
And step 40, determining the thickness of the transparent film layer on the surface of the device to be tested according to the first interference fringes.
According to the interference fringe maximum value formula: where n denotes the refractive index of the transparent film layer, m is a positive integer, λ denotes the wavelength of light, and h denotes the thickness of the transparent film layer, the refractive index n is known for a transparent film layer of a specific material, the positive integer m corresponding to the wavelength λ is determined, and the use of the refractive index n is determined
The thickness of the transparent film layer can be obtained.
And step 50, the light source module emits a second light beam and transmits the second light beam to the beam splitter, and the beam splitter splits the second light beam into a third light beam and a fourth light beam.
The second light beam is coherent light, for example, may be laser, and the light source module may include a laser, and output coherent light is emitted to the beam splitter and is split into two beams.
And step 60, vertically transmitting the third light beam to the surface of the device to be detected, and transmitting the third light beam to the detection module through the beam splitter after the third light beam is reflected by the surface of the device to be detected.
And step 70, transmitting the fourth light beam to the reference unit, converting the fourth light beam into a reference light beam by the reference unit, and transmitting the reference light beam to the detection module through the beam splitter.
And 80, receiving the third light beam and the reference light beam reflected by the surface of the device to be detected by the detection module, wherein the third light beam and the reference light beam reflected by the surface of the device to be detected interfere with each other on a detection surface of the detection module and generate a second interference fringe.
It can be understood that the second light beam emitted by the light source module is divided into a third light beam and a fourth light beam by the beam splitter, wherein the third light beam is emitted to the surface of the device to be detected as probe light, the fourth light beam is emitted to the reference unit as reference light to form an interferometer structure, the third light beam (probe light beam) reflected by the surface of the device to be detected reaches the probe module after being transmitted by the beam splitter, the fourth light beam reflected by the reference unit reaches the probe module after being reflected by the beam splitter, and the two light beams interfere on the probe surface of the probe module to generate a second interference fringe.
And 90, performing three-dimensional detection on the surface of the device to be detected according to the second interference fringes and the thickness of the transparent film layer.
Wherein the three-dimensional inspection of the surface of the device under test measures the height of the surface of the device under test relative to a reference plane of the reference unit.
According to the technical scheme of the embodiment, the light source module emits the first light beam with adjustable wavelength, and the wavelength of the first light beam is adjusted; emitting at least part of the first light beam to the surface of the device to be tested, wherein the part of the first light beam emitted to the surface of the device to be tested is reflected on the upper surface and the lower surface of the transparent film layer respectively; receiving, by a detection module, first light beams respectively reflected by an upper surface and a lower surface of a transparent film layer, the first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer interfering at a detection surface of the detection module and generating first interference fringes; determining the thickness of a transparent film layer on the surface of the device to be tested according to the first interference fringes; emitting a second light beam through the light source module, emitting the second light beam to the beam splitter, and splitting the second light beam into a third light beam and a fourth light beam by the beam splitter; the third light beam is vertically emitted to the surface of the device to be detected, and is reflected by the surface of the device to be detected and then emitted to the detection module through the beam splitter; the fourth light beam is emitted to the reference unit, the fourth light beam is taken as the reference light beam by the reference unit, and the reference light beam is emitted to the detection module through the beam splitter; receiving a third light beam and a reference light beam reflected by the surface of the device to be detected through a detection module, wherein the third light beam and the reference light beam reflected by the surface of the device to be detected interfere with each other on a detection surface of the detection module and generate a second interference fringe; and performing three-dimensional detection on the surface of the device to be detected according to the second interference fringes and the thickness of the transparent film layer. According to the technical scheme provided by the embodiment of the invention, the thickness of the transparent film layer can be measured by using an optical interference method; on the other hand, the three-dimensional measurement of the surface of the device to be measured can be realized, and the influence of the transparent film layer on the measurement result is corrected according to the thickness of the transparent film layer, so that the measurement precision is improved.
On the basis of the above technical solution, optionally, the light source module may include a first light source and a second light source, where the first light source emits a first light beam, and the second light source emits a second light beam; the detection module may include a first detection module that receives the first interference fringes and a second detection module that receives the second interference fringes.
It can be understood that, in an implementation manner of the embodiment of the present invention, the interference optical path for measuring the thickness of the transparent film and the interference optical path for measuring the height of the surface of the device to be measured relative to the reference surface of the reference unit may be two optical paths, that is, the first light source emits a first light beam with adjustable wavelength, the first light beam is reflected by the upper surface and the lower surface of the transparent film and then received by the first detection module, and a first interference fringe is generated on the detection surface of the first detection module; the second light source emits a second light beam, the second light beam is divided into a third light beam and a fourth light beam through the beam splitter, and the third light beam and the fourth light beam are respectively used as detection light and reference light to generate second interference fringes on a detection surface of the second detection module.
Optionally, the light source module may include only a first light source, and the first light source emits a first light beam and/or a second light beam; the detection module may comprise only a first detection module, the first detection module receiving the first interference fringes and/or the second interference fringes; the first light beam emitted by the first light source is divided into a part emitted to the surface part of the device to be tested and a part emitted to the reference unit by the beam splitter, and the part emitted to the reference unit is absorbed by controlling an optical switch arranged in front of the reference unit.
It can be understood that, in another implementation manner of the embodiment of the present invention, an interference optical path for measuring the thickness of the transparent film layer and an interference optical path for measuring the height of the surface of the device to be measured relative to the reference surface of the reference unit can be multiplexed together, only the first light source and the first detection module are used, and by arranging an optical switch between the beam splitter and the reference unit, when the thickness of the transparent film is measured, the optical switch is turned off to block and absorb the light beam emitted to the reference unit, and only the light beams reflected by the upper surface and the lower surface of the transparent film layer are allowed to enter the first detection module; when the height of the surface of the device to be detected relative to the reference surface of the reference unit is measured, the optical switch is turned on, and both the light beam reflected by the surface of the device to be detected and the reference light beam generated by the reference unit can enter the first detection module. By only utilizing the first light source and the first detection module, the light path structure can be simplified, the cost is reduced, and the stability of the three-dimensional measurement of the surface of the device to be measured is improved.
Optionally, step 40 specifically includes:
step 401, the detection module records at least two wavelengths λ of the first light beam corresponding to the maximum value of the intensity of the first interference fringe according to the first interference fringe1、λ2；
Step 402, calculating the requirement of M lambda by using an iterative method1-Nλ2|<Positive integer M, N of ξ, and
and taking h corresponding to the minimum value as the thickness of the transparent film layer, wherein xi is a preset tolerance, p is 1, 2, and n is the refractive index of the transparent film layer.
According to the formula of the interference fringe maximum value: when the detection module records the lambda corresponding to the maximum value of the first interference fringe, the 2nh is equal to m lambda1、λ2Satisfies the following conditions:
2nh＝Mλ1 (1)
2nh＝Nλ2 (2)
m, N are all positive integers, and an iterative algorithm is used to solve the following conditions:
|Mλ1-Nλ2|<ξ (3)
is given, wherein ξ is a preset tolerance, which may be, for example, ξ ═ 5nm, and then 2nh is made to be in the interval [ M λ [ ]1-λ1/2,Mλ1+λ1/2]Search within range such that
And obtaining the thickness h of the transparent film layer which is 2nh/n when the value is the minimum corresponding to 2 nh. Wherein λ ispAnd NpThe corresponding extreme wavelengths and integer multiples of the extreme wavelengths are represented.
It should be noted that, in the following description,the above solution process of the thickness of the transparent film layer can be executed by a computer program, and a reverse checking algorithm can be further included in the program to eliminate error solutions. For example, at a certain measurement at a wavelength λ1、λ2Only two wavelengths corresponding to the maximum values of the interference fringes are obtained, and a plurality of values of the transparent film thickness h are solved according to the formulas (3) and (4), for example, h is obtained1And h2Two solutions, wherein h1H is obtained by solving for the actual film thickness1And h2Reverse checking is carried out to obtain that when the thickness of the film is h2Time, wavelength lambda1、λ2Other wavelengths can also appear in the process, the condition that the interference fringes are extremely large is met, but the actual measurement does not have the wavelength, and h can be calculated2And (4) excluding.
Optionally, step 90 specifically includes:
determining the height of the surface of the device under test relative to the reference surface of the reference unit according to the following formula:
I＝|A1exp(ik2Δz)+A2exp(ik2(Δz+nh))+Bexp(iksinθx)|2(ii) a Wherein I denotes a second interference fringe intensity of the detection surface of the detection module, A1Denotes the reflection correlation coefficient of the upper surface of the transparent film layer, A2The reflection correlation coefficient of the lower surface of the transparent film layer is represented, n represents the refractive index of the transparent film layer, h represents the thickness of the transparent film layer, k is 2 pi/lambda, lambda represents the wavelength of light, deltaz represents the height difference between the surface of the device to be measured and the reference surface, and theta represents the included angle between the probe beam and the reference beam.
Example two
Fig. 2 is a schematic structural diagram of a three-dimensional inspection apparatus according to a second embodiment of the present invention, which is applicable to a case where a transparent film is formed on a surface of a device to be inspected, and includes:
the light source module 10 is configured to emit a first light beam with an adjustable wavelength, and adjust the wavelength of the first light beam, at least a part of the first light beam is emitted to the surface of the device to be tested, and the part of the first light beam emitted to the surface of the device to be tested is reflected on the upper surface and the lower surface of the transparent film layer respectively; the detection module 20 is configured to receive the first light beams respectively reflected by the upper surface and the lower surface of the transparent film, and the first light beams respectively reflected by the upper surface and the lower surface of the transparent film interfere with each other on a detection surface of the detection module 20 to generate first interference fringes; the light source module 10 is further configured to emit a second light beam and emit the second light beam onto the beam splitter 30; the beam splitter 30 is used for splitting the second light beam into a third light beam and a fourth light beam, the third light beam is vertically emitted to the surface of the device to be tested, and the fourth light beam is emitted to the reference unit 40; a reference unit 40 for converting the fourth light beam into a reference light beam, which is transmitted to the detection module 20 via the beam splitter 30; the detection module 20 is further configured to receive the reference light beam, and the third light beam transmitted by the beam splitter 30 after being reflected by the surface of the device to be detected, where the third light beam transmitted by the beam splitter 30 interferes with the reference light beam on the detection surface of the detection module 20 to generate a second interference fringe, and the three-dimensional detection of the surface of the device to be detected is performed according to the second interference fringe and the thickness of the transparent film.
The first light beam is coherent light, and may be laser, for example, and the light source module 10 may include a laser and output continuous laser light with adjustable wavelength. The first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer satisfy the interference condition, and the two light beams interfere with each other on the detection surface of the detection module 20 to generate a first interference fringe. According to the interference fringe maximum value formula: where n denotes the refractive index of the transparent film layer, m is a positive integer, λ denotes the wavelength of light, and h denotes the thickness of the transparent film layer, the refractive index n is known for a transparent film layer of a specific material, the positive integer m corresponding to the wavelength λ is determined, and the use of the refractive index n is determined
The thickness of the transparent film layer can be obtained. The second light beam is coherent light, such as laser, the light source module 10 may include a laser, the second light beam emitted by the light source module 10 is split into a third light beam and a fourth light beam by the beam splitter 30, wherein the third light beam is emitted to the surface of the device under test as probe light, the fourth light beam is emitted to the reference unit 40 as reference light, an interferometer structure is formed, and the device under test is configured to be a laserThe third light beam (detection light beam) reflected by the surface of the workpiece is transmitted by the beam splitter 30 and reaches the detection module 20, the fourth light beam reflected by the reference unit 40 is reflected by the beam splitter 30 and reaches the detection module 20, and the two light beams interfere with each other on the detection surface of the detection module 20 to generate a second interference fringe. The three-dimensional inspection of the dut surface measures the height of the dut surface relative to the reference plane of reference cell 40.
According to the technical scheme of the embodiment, the thickness of the transparent film layer can be measured by using an optical interference method; on the other hand, the three-dimensional measurement of the surface of the device to be measured can be realized, and the influence of the transparent film layer on the measurement result is corrected according to the thickness of the transparent film layer, so that the measurement precision is improved.
Fig. 3A is a schematic diagram of an interference light path for measuring the thickness of the transparent film, and fig. 3B is a schematic diagram of an interference light path for measuring the height of the surface of the device to be measured relative to the reference surface of the reference unit. Optionally, the light source module 10 includes a first light source 11 and a second light source 12, where the first light source 11 emits a first light beam, and the second light source 12 emits a second light beam; the detection module 20 includes a first detection module 21 and a second detection module 22, the first detection module 21 receives the first interference fringe, and the second detection module 22 receives the second interference fringe.
It can be understood that, in an implementation manner of the embodiment of the present invention, the interference optical path for measuring the thickness of the transparent film and the interference optical path for measuring the height of the surface of the device under test relative to the reference surface of the reference unit may be two optical paths, that is, the first light source 11 emits a first light beam with adjustable wavelength, the first light beam is received by the first detection module 21 after being reflected by the upper surface and the lower surface of the transparent film, and a first interference fringe is generated on the detection surface of the first detection module 21; the second light source 12 emits a second light beam, which is split into a third light beam and a fourth light beam by the beam splitter 30, and the third light beam and the fourth light beam are respectively used as the detection light and the reference light to generate a second interference fringe on the detection surface of the second detection module 22.
Alternatively, the first light source 11 and/or the second light source 12 may be an optical parametric oscillation laser that outputs signal light and idler light whose wavelengths are continuously changed. The output wavelength range of the optical parametric oscillation laser can be 450-900 nm.
Alternatively, the light source module 10 may include only the first light source 11, and the first light source 11 emits the first light beam and the second light beam; the detection module 20 may include only the first detection module 21, and the first detection module 21 receives the first interference fringe and the second interference fringe; the three-dimensional detection device further comprises: and an optical switch 50 for absorbing a portion emitted toward the reference cell 40 when the first light beam emitted from the first light source 11 is split into a portion emitted toward the device under test surface portion and a portion emitted toward the reference cell 40 by the beam splitter 30.
It is understood that, in another real-time manner of the embodiment of the present invention, an interference optical path for measuring the thickness of the transparent film and an interference optical path for measuring the height of the surface of the device under test relative to the reference surface of the reference unit may be multiplexed together, only using the first light source 11 and the first detection module 20, by disposing the optical switch 50 between the beam splitter 30 and the reference unit 40, when measuring the thickness of the transparent film, the optical switch 50 is turned off to block and absorb the light beam emitted to the reference unit 40, and only allowing the light beams reflected by the upper surface and the lower surface of the transparent film to enter the first detection module 20; when measuring the height of the surface of the device under test with respect to the reference surface of the reference unit 40, the optical switch 50 is turned on, and both the light beam reflected by the surface of the device under test and the reference light beam generated by the reference unit 40 can enter the first detection module 20. The light path structure can be simplified by only using the first light source 11 and the first detection module 21, the cost is reduced, and the stability of the three-dimensional measurement of the surface of the device to be measured is improved.
With continued reference to fig. 2, optionally, the detection module 20 includes a photodetector 201 and a computing unit 202; the photodetector 201 is used for receiving the first interference fringe and/or the second interference fringe; the calculation unit 202 is used to calculate the thickness of the transparent film layer and/or the height of the surface of the device under test with respect to the reference plane of the reference unit 40.
Optionally, the calculating unit 202 is specifically configured to:
according to the first interference fringe received by the photodetector 201, at least two wavelengths λ outputted by the light source module 10 corresponding to the maximum value of the intensity of the first interference fringe are recorded1、λ2；
Calculating a satisfying M lambda using an iterative method1-Nλ2|<Positive integer M, N of ξ, and
and taking h corresponding to the minimum value as the thickness of the transparent film layer, wherein xi is a preset tolerance, p is 1, 2, and n is the refractive index of the transparent film layer.
The specific method for calculating the thickness of the transparent film layer by the calculating unit 202 is described in the first embodiment, and will not be described herein again.
Optionally, the computing unit 202 is further configured to:
the height of the dut surface relative to the reference plane of reference cell 40 is determined according to the following equation:
I＝|A1exp(ik2Δz)+A2exp(ik2(Δz+nh))+Bexp(iksinθx)|2(ii) a Wherein I denotes the intensity of the second interference fringe of the detection surface of the detection module, A1Denotes the reflection correlation coefficient of the upper surface of the transparent film layer, A2The reflection correlation coefficient of the lower surface of the transparent film layer is represented, n represents the refractive index of the transparent film layer, h represents the thickness of the transparent film layer, k is 2 pi/lambda, lambda represents the wavelength of light, deltaz represents the height difference between the surface of the device to be measured and the reference surface, and theta represents the included angle between the probe beam and the reference beam.
EXAMPLE III
Fig. 4 is a schematic structural diagram of a three-dimensional detection device according to a third embodiment of the present invention, which can provide a specific example based on the above-described embodiments.
Referring to fig. 4, in the present embodiment, an interference optical path for measuring the thickness of the transparent film layer and an interference optical path for measuring the height of the surface of the device under test relative to the reference surface of the reference unit are multiplexed together, and only the first light source 11 and the first detection module 21 are used, where the first detection module 21 includes the first photodetector 211 and the first calculation unit 212. Specifically, the first photodetector 211 may be a cmos or ccd image sensor, and converts the interfered optical signal into an electrical signal.
Alternatively, the first light source 11 may be an optical parametric oscillation laser that outputs signal light and idler light whose wavelengths continuously vary.
Because the light source required by the embodiment of the invention is a coherent light source with continuously adjustable wavelength, the Optical Parametric Oscillation (OPO) laser is a coherent light source with tunable wavelength, can convert laser with one frequency into coherent output of signal light and idler frequency light, can realize tuning in a wide frequency range, and is a coherent light source meeting the requirements of the embodiment.
Optionally, the output wavelength range of the optical parametric oscillation laser may be 450 to 900 nm.
Alternatively, the optical switch 50 may be an optical shutter, which is closed when the thickness of the transparent film layer is measured, and absorbs the portion of the first light beam emitted toward the reference unit 40; and opening the device to be detected during three-dimensional detection of the surface of the device to be detected, and enabling the fourth light beam and the reference light beam to penetrate through the device to be detected.
Optionally, the reference unit 40 is a reflector, and a preset included angle is formed between the surface of the reflector and the surface of the device to be measured.
Referring to fig. 4, the surface of the dut is parallel to the horizontal plane, and the surface of the reflector and the surface of the dut have a predetermined included angle, which may be 89 °, for example, so that the light beam reflected by the surface of the dut received by the first detection module 21 and the reference light beam have an included angle θ.
Optionally, the three-dimensional inspection apparatus further includes a magnifying objective 60, and the magnifying objective 60 is located between the beam splitter 30 and the surface of the device under test.
Optionally, the three-dimensional detecting apparatus further includes a reflecting mirror 70 and an illumination lens group 80, the reflecting mirror 70 is disposed between the light source module 10 and the illumination lens group 80, and is configured to emit the first light beam emitted from the light source module 10 to the illumination lens group 80, and the illumination lens group 80 is disposed between the reflecting mirror 70 and the beam splitter 30.
Optionally, the three-dimensional detection apparatus further includes a tube mirror 90, located between the beam splitter 30 and the detection module 20, for collecting the light beam emitted to the detection module 20.
The specific process for measuring the thickness h of the transparent film layer in the embodiment is as follows:
the first light source 11 is an OPO laser which can output a signal light (signal light) and an idler light (idler light) simultaneously, and the signal light (and idler light) wavelength of which can be continuously changed by adjusting the resonant crystal.
When the transparent film layer is formed on the surface of the device to be tested, the optical switch 50 is closed, and blocks and absorbs the fourth light beam, and only the light beams reflected by the upper surface and the lower surface of the transparent film layer are allowed to enter the first detection module 21, and at this time, the signallight and the idle light respectively generate interference on the detection surface of the first detection module 21:
Is＝|A1s+A2s exp(iks2nh)|2 (5)
Ii＝|A1i+A2iexp(iki2nh)|2 (6)
wherein A is1sAnd A2sRespectively representing the reflection coefficients of signal light on the upper surface and the lower surface of the transparent film layer, A1iAnd A2iRespectively representing the reflection coefficients of idle light on the upper surface and the lower surface of the transparent film layer. For general media, the reflection coefficient A1s、A2s、A1iAnd A2iMay be considered to be continuously graded.
The OPO resonant crystal is adjusted to make the signal light and idle light output by the OPO laser continuously change, so as to obtain the change curve of the interference signal on the detection surface of the first detection module 21 along with the wavelength. The output wavelength of the OPO laser used in this embodiment varies in the range of 450-900nm, and FIG. 5 is a schematic diagram illustrating the distribution of the interference intensity of the transparent film at different wavelengths. The wavelengths corresponding to the interference maximum obtained by signal light are 478nm, 515nm, 558nm, 608nm and 669 nm; the wavelengths corresponding to the interference maxima obtained by the idle light are 744nm and 837 nm. As can be seen from the formulas (5) and (6), when the interference signal has a maximum value, the thickness of the transparent film layer must satisfy 2nh ═ m1λsOr 2nh ═ m2λiWherein m is1，m2Is a positive integer, λs，λiWavelengths of signal light and idle light, respectively.
Thus, for a range of wavelengths, where there are and only a few maxima, 2nh is necessarily an integer multiple of the wavelength corresponding to all maxima. The method for obtaining 2nh is as follows:
first, the corresponding minimum wavelength (e.g., 478nm) in the extreme value is used as the base λminM is a positive integer such that M λminNearest to integer multiples of other wavelengths
|Mλmin-Nλothers|<ξ (7)
Where N is also a positive integer and ξ is a tolerance allowed by definition, for example ξ ═ 5nm can be set.
Then let 2nh be in the interval [ M lambda ]1-λ1/2,Mλ1+λ1/2]Range search is performed such that
And obtaining the thickness h of the transparent film layer which is 2nh/n when the value is the minimum corresponding to 2 nh. Wherein λ ispAnd NpThe corresponding extreme wavelengths and integer multiples of the extreme wavelengths are represented.
For the interference signal shown in fig. 5, the wavelengths corresponding to the extrema are 478nm, 515nm, 558nm, 608nm, 669nm, 744nm and 837nm, and according to the formulas (7) and (8), the computer program iterates to obtain 2 nh-6693.3 nm, and if the refractive index n of the transparent film layer is 1.5, the thickness h-2231.1 nm of the transparent medium.
After the thickness h of the transparent film layer is solved, the optical switch 50 is turned on, the detection surface of the first detection module 21 receives the second interference fringes, and the height of the surface of the device to be detected relative to the reference surface of the reference unit is determined according to the following formula:
I＝|A1exp(ik2Δz)+A2exp(ik2(Δz+nh))+Bexp(iksinθx)|2(ii) a Wherein I denotes a second interference fringe intensity of the detection surface of the detection module, A1Denotes the reflection correlation coefficient of the upper surface of the transparent film layer, A2Expressing the reflection correlation coefficient of the lower surface of the transparent film layer, n expressing the refractive index of the transparent film layer, h expressing the thickness of the transparent film layer, k being 2 pi/lambda, lambda expressing the wavelength of light, and deltaz expressing the device under testThe height difference between the surface of the piece and the reference surface, and theta represents the angle between the probe beam and the reference beam.
In addition, when the transparent film layer is not present on the surface of the dut, the interference fringes of the probe light and the reference light of a single wavelength λ are described as follows
I＝|Aexp(ik2Δz)+Bexp(iksinθx)|2 (9)
Where k is 2 pi/λ, Δ z represents a height difference between the device surface to be measured and the reference surface of the reference unit, θ represents an angle between the probe beam and the reference beam, and A, B represents reflection (or transmission) coefficients of the probe optical path and the reference optical path, respectively. The height of the device under test surface relative to the reference plane of the reference cell can be determined according to equation (9).
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (18)
1. A three-dimensional detection method is characterized in that a transparent film layer is formed on the surface of a device to be detected, and the method comprises the following steps:
the light source module emits a first light beam with adjustable wavelength, and the wavelength of the first light beam is adjusted;
emitting at least part of the first light beam to the surface of the device to be tested, wherein the part of the first light beam emitted to the surface of the device to be tested is reflected on the upper surface and the lower surface of the transparent film layer respectively;
the detection module receives first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer, and the first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer interfere at a detection surface of the detection module and generate first interference fringes;
determining the thickness of a transparent film layer on the surface of the device to be tested according to the first interference fringes;
the light source module emits a second light beam and emits the second light beam to the beam splitter, and the beam splitter splits the second light beam into a third light beam and a fourth light beam;
the third light beam is vertically emitted to the surface of a device to be detected, and the third light beam is reflected by the surface of the device to be detected and then emitted to a detection module through the beam splitter;
transmitting the fourth beam of light to a reference unit, and the reference unit converting the fourth beam of light to a reference beam of light, the reference beam of light being transmitted to a detection module via the beam splitter;
the detection module receives the third light beam reflected by the surface of the device to be detected and the reference light beam, and the third light beam reflected by the surface of the device to be detected and the reference light beam interfere with each other on a detection surface of the detection module to generate a second interference fringe;
performing three-dimensional detection on the surface of the device to be detected according to the second interference fringes and the thickness of the transparent film layer;
the three-dimensional detection of the surface of the device to be detected is carried out according to the second interference fringes and the thickness of the transparent film layer, and the three-dimensional detection comprises the following steps:
correcting the measurement result of the three-dimensional detection of the surface of the device to be detected according to the thickness of the transparent film layer;
determining the height of the surface of the device under test relative to the reference surface of the reference unit according to the following formula:
I＝|A1exp(ik2Δz)+A2exp(ik2(Δz+nh))+Bexp(iksinθx)|2(ii) a Wherein I represents a second interference fringe intensity of a detection surface of the detection module, A1Denotes the reflection correlation coefficient of the upper surface of the transparent film layer, A2Expressing the reflection correlation coefficient of the lower surface of the transparent film layer, n expressing the refractive index of the transparent film layer, h expressing the thickness of the transparent film layer, k being 2 pi/lambda, lambda expressing the wavelength of light, delta z expressing the height difference between the surface of the device to be measured and the reference surface, and theta expressing the height difference between the surface of the device to be measured and the reference surfaceAnd measuring the included angle between the third light beam reflected by the surface of the device and the reference light beam.
2. The three-dimensional detection method according to claim 1, wherein the light source module comprises a first light source and a second light source, the first light source emits a first light beam, and the second light source emits a second light beam; the detection module comprises a first detection module and a second detection module, the first detection module receives the first interference fringe, and the second detection module receives the second interference fringe.
3. The three-dimensional detection method according to claim 1, wherein the light source module comprises a first light source, and the first light source emits a first light beam and/or a second light beam; the detection module comprises a first detection module which receives the first interference fringe and/or the second interference fringe;
the first light beam emitted by the first light source is divided into a part which is emitted to the surface part of the device to be tested and a part which is emitted to the reference unit by the beam splitter, and the part which is emitted to the reference unit is absorbed by controlling an optical switch arranged in front of the reference unit.
4. The three-dimensional detection method according to claim 1, wherein the determining the thickness of the transparent film layer on the surface of the dut according to the first interference fringes comprises:
the detection module records at least two wavelengths lambda of the first light beam corresponding to the maximum value of the intensity of the first interference fringe according to the first interference fringe1、λ2；
Calculating a satisfying M lambda using an iterative method1-Nλ2A positive integer M, N of | < ξ, and
and taking h corresponding to the minimum value as the thickness of the transparent film layer, wherein xi is a preset tolerance, p is 1, 2, and n is the refractive index of the transparent film layer.
5. The utility model provides a three-dimensional detection device, await measuring the device surface and be formed with transparent rete, its characterized in that includes:
the light source module is used for emitting a first light beam with adjustable wavelength and adjusting the wavelength of the first light beam, at least part of the first light beam is emitted to the surface of the device to be tested, and the part of the first light beam emitted to the surface of the device to be tested is reflected on the upper surface and the lower surface of the transparent film layer respectively;
the detection module is used for receiving the first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer, the first light beams respectively reflected by the upper surface and the lower surface of the transparent film layer interfere on a detection surface of the detection module to generate first interference fringes, and the thickness of the transparent film layer on the surface of the device to be detected is determined according to the first interference fringes;
the light source module is also used for emitting a second light beam and transmitting the second light beam to the beam splitter;
the beam splitter is used for splitting the second light beam into a third light beam and a fourth light beam, the third light beam is vertically emitted to the surface of the device to be tested, and the fourth light beam is emitted to the reference unit;
the reference unit is used for converting the fourth light beam into a reference light beam, and the reference light beam is emitted to the detection module through the beam splitter;
the detection module is further configured to receive the reference beam, and a third beam transmitted by the beam splitter after being reflected by the surface of the device to be detected, where the third beam transmitted by the beam splitter interferes with the reference beam on a detection surface of the detection module to generate a second interference fringe, and the three-dimensional detection of the surface of the device to be detected is performed according to the second interference fringe and the thickness of the transparent film layer;
the detection module is further used for correcting the measurement result of the three-dimensional detection of the surface of the device to be detected according to the thickness of the transparent film layer;
the detection module comprises a calculation unit, and the calculation unit is used for determining the height of the surface of the device to be detected relative to the reference surface of the reference unit according to the following formula:
I＝|A1exp(ik2Δz)+A2exp(ik2(Δz+nh))+Bexp(iksinθx)|2(ii) a Wherein I denotes a second interference fringe intensity of the detection face of the detection module, A1Denotes the reflection correlation coefficient of the upper surface of the transparent film layer, A2The reflection correlation coefficient of the lower surface of the transparent film layer is represented, n represents the refractive index of the transparent film layer, h represents the thickness of the transparent film layer, k is 2 pi/lambda, lambda represents the wavelength of light, deltaz represents the height difference between the surface of the device to be measured and the reference surface, and theta represents the included angle between the third light beam reflected by the surface of the device to be measured and the reference light beam.
6. The three-dimensional detection device according to claim 5, wherein the light source module comprises a first light source and a second light source, the first light source emits a first light beam, and the second light source emits a second light beam; the detection module comprises a first detection module and a second detection module, the first detection module receives the first interference fringe, and the second detection module receives the second interference fringe.
7. The three-dimensional detection device according to claim 5, wherein the light source module comprises a first light source, the first light source emitting a first light beam and/or a second light beam; the detection module comprises a first detection module which receives the first interference fringe and/or the second interference fringe; further comprising:
and the optical switch is used for absorbing the part emitted to the reference unit when the first light beam emitted by the first light source is divided into the part emitted to the surface of the device to be tested and the part emitted to the reference unit by the beam splitter.
8. The three-dimensional inspection apparatus of claim 5, wherein the detection module further comprises a photodetector;
the photoelectric detector is used for receiving the first interference fringe and/or the second interference fringe;
the calculation unit is also used for calculating the thickness of the transparent film layer.
9. The three-dimensional inspection apparatus according to claim 8, wherein the computing unit is specifically configured to:
according to the first interference fringe received by the photoelectric detector, recording at least two wavelengths lambda output by the light source module corresponding to the maximum value of the intensity of the first interference fringe1、λ2；
Calculating a satisfying M lambda using an iterative method1-Nλ2A positive integer M, N of | < ξ, and
and taking h corresponding to the minimum value as the thickness of the transparent film layer, wherein xi is a preset tolerance, p is 1, 2, and n is the refractive index of the transparent film layer.
10. The three-dimensional inspection apparatus of claim 8, wherein the photodetector is a cmos or ccd image sensor.
11. The three-dimensional inspection device of claim 6, wherein the first and/or second light source is an optical parametric oscillator laser that outputs signal and idler light of continuously varying wavelengths.
12. The three-dimensional inspection device of claim 7, wherein the first light source is an optical parametric oscillator laser that outputs a signal light and an idler light having continuously varying wavelengths.
13. The three-dimensional inspection device according to claim 11 or 12, wherein the output wavelength of the optical parametric oscillation laser is in a range of 450 to 900 nm.
14. The three-dimensional detection device according to claim 7, wherein the optical switch is an optical shutter, and the optical shutter is used for closing when the thickness of the transparent film layer is measured, and absorbing the part of the first light beam emitted to the reference unit;
and opening the device to be detected during the three-dimensional detection of the surface of the device to be detected, and enabling the fourth light beam and the reference light beam to penetrate through the device to be detected.
15. The three-dimensional detection device according to claim 5, wherein the reference unit is a mirror, and a predetermined included angle is formed between the surface of the mirror and the surface of the dut.
16. The three-dimensional detection device according to any one of claims 7 to 12 and 14 to 15, further comprising a magnifying objective lens, wherein the magnifying objective lens is located between the beam splitter and the surface of the device under test.
17. The three-dimensional detection device according to claim 16, further comprising a reflector and an illumination lens set, wherein the reflector is disposed between the light source module and the illumination lens set for emitting the first light beam emitted from the light source module onto the illumination lens set, and the illumination lens set is disposed between the reflector and the beam splitter.
18. The three-dimensional inspection apparatus according to claim 17, further comprising a tube mirror disposed between the beam splitter and the detection module for collecting the light beam emitted to the detection module.
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