KR20130088916A - Thickness measuring method using laser interferometer - Google Patents

Abstract

The present invention relates to a method for measuring thickness using a laser interferometer, the method comprising: irradiating a laser beam to the measurement object and detecting a reflected laser beam to measure an interference signal of a laser beam according to a measurement position, the measured Selecting an interference signal corresponding to a location section spaced by a specific distance based on a location corresponding to a maximum value of the interference signal, and a state in which there is no measurement object corresponding to the selected location section for the interference signal in the selected location section Disclosed is a thickness measuring method comprising calculating a phase difference of an interference signal in comparison with a reference interference signal in.

Description

Thickness Measuring Method Using Laser Interferometer

The present invention relates to a thickness measuring method using a laser interferometer, and more particularly, a laser interferometer for measuring a thickness of a measuring object by measuring an interference signal of a reflected laser beam by irradiating a laser beam to a measuring object having a fine thickness. It relates to the thickness measurement method used.

A lot of products using semiconductors are developed in our lives, and accordingly, technologies according to semiconductor processes are being developed.

In particular, the thickness of the thin film used in the semiconductor process is getting thinner, and there are various methods for measuring the thickness of the thin film used in the semiconductor process and other application processes.

Among them, the optical method is to determine the characteristics of the thin film by using the interference phenomenon caused by the reflected light and the reflected light from the interface below the thin film surface or the phase difference of the light. Therefore, this method can measure the thickness and roughness of the thin film as well as the optical constant. Compared to the mechanical method using the probe, the optical measurement method has excellent accuracy and measurement speed.

In particular, any type of sample can be measured as long as the thin film is transparent and can maintain optical coherence, and even the multilayer thin film structure can measure the thickness of each thin film by mathematical calculation. In recent years, optical measurement methods, which are easy to install without damaging the surface of a sample to be measured and are easy to measure from extremely thin to thick films at a fast measuring speed, have become mainstream.

This is becoming thinner and thinner with the development of semiconductor production process technology. It is necessary to measure not only thickness but also optical constants such as refractive index, extinction coefficient, and reflectance at the same time. In the pre-treatment process, we are going to measure non-destructively fast, because we can meet this demand. In addition, the demand for thin film measurement for various materials such as photoregister is increasing, and substrates are used not only for wafers, but also for glass, metal, and polymer. In particular, the display industry is demanding a measurement technology for a variety of materials.

As optical measuring methods, spectral reflectometers and ellipsometers are widely used. Techniques for measuring using interferometers have recently attracted attention.

The reflection photometer measures the intensity of light reflected from the thin film according to the wavelength when the measurement light is incident perpendicularly to the surface of the sample.

The ellipsometer is similar in terms of analyzing the interference of reflected light, but the polarization state and the incident angle of the measured light are different.

The method using the interferometer is to enter the parallel light of the laser into the spectrometer and divide the light into two beams in the spectrometer to measure the interference phenomenon and the intensity of light generated by the light reflected by the mirror and the reflected light of the measurement sample.

Among such methods, various methods and apparatuses for measuring the thickness of a fine thin film using an interferometer have been developed.

A general laser interferometer includes an irradiating unit for irradiating a laser beam, a polarizing lens for reflecting a part of the laser beam irradiated from the irradiating unit, and transmitting a remainder, a work table to which the laser beam passing through the polarizing lens is irradiated, and a laser beam reflected from the polarizing lens A reflection mirror for reflecting the beam back, and a measuring sensor for detecting the interference signal of the detected laser beam by detecting the two laser beams reflected from the work table and the reflection mirror.

The thickness of the measurement object seated on the work table may be measured through the interference signal measured by the measurement sensor.

However, in the conventional method of measuring the thickness of a thin film by using a laser interferometer, a resolution is determined according to a wavelength of a laser beam to be irradiated, and a problem occurs when a thickness of a minute unit cannot be measured according to the determined resolution. There is this.

In addition, there is a problem that the focal length control of the laser beam to be irradiated according to the distance between the interferometer and the measurement object.

An object of the present invention is to solve the problem of the conventional thickness measuring method using a laser interferometer, when the laser beam irradiated to the measuring object is reflected and the interference signal is measured in the measuring sensor, depending on the presence or absence of the measuring object The present invention provides a method for measuring thickness by comparing median values of intervals spaced by the same distance based on a point where the measured interference signals have the maximum intensity.

In order to solve the above problems, the present invention, in the thickness measurement method for measuring the thickness of the measurement object using a laser interferometer, by irradiating a laser beam to the measurement object and detecting the reflected laser beam laser according to the measurement position Measuring an interference signal of a beam, selecting an interference signal corresponding to a position section spaced apart by a specific distance based on a position corresponding to the maximum value of the measured interference signal, and an interference signal in the selected position section, Comprising a step of calculating the phase difference of the interference signal in comparison with the reference interference signal in the absence of the measurement object corresponding to the selected position section.

The method may further include detecting a thickness of the measurement object corresponding to a phase difference of the measured interference signal based on a geometric correlation according to an incident angle of the laser beam corresponding to the selected location section and a refractive index value of the measurement object. It may be characterized in that it further comprises.

In addition, the step of calculating the phase difference of the interference signal with respect to the interference signal in the selected position section, compared to the reference interference signal in the absence of the measurement object corresponding to the selected position section, the interference measured in the selected position section The median value of the signal may be selected to calculate a difference between the median values.

In addition, the step of irradiating the laser beam to the measurement object and detecting the reflected laser beam to measure the interference signal of the laser beam according to the measurement position, the step of irradiating a laser beam of a single wavelength in the irradiation unit, the irradiated laser beam A part of the light beam is focused through the spectroscope and is irradiated to the measurement object and then reflected, and a part of the light beam is reflected by the mirror and then reflected by a mirror, and the laser beam reflected from the work table and the laser beam reflected from the mirror are reflected. And detecting the interference signal generated by the path difference of the detected laser beam.

The selected location section may be an area that is irradiated and measured in an area spaced outside a predetermined distance from the center of the detected laser beam.

In addition, the laser beam focused through the spectroscope may be characterized in that the laser beam irradiated through the center and the laser beam irradiated through the selected location section have different movement paths.

In addition, the maximum value of the measured interference signal may be characterized in that the point of the largest intensity among the measured interference signal.

The method may further include adjusting the position according to the maximum value of the interference signal measured in the absence of the measurement object to coincide with the position according to the maximum value of the measured interference signal in the presence of the measurement object. You can do

The method may further include adjusting a distance between the laser interferometer and the measurement object.

In addition, adjusting the distance between the laser interferometer and the measurement object may be characterized in that the measurement object is raised and lowered along the vertical direction of the laser interferometer.

On the other hand, the step of adjusting the distance between the laser interferometer and the measurement object may be characterized in that the laser interferometer is raised and lowered along the vertical direction at the top of the measurement object.

In order to solve the above problems, the present invention has the following effects.

First, in the laser interferometer, measure the maximum value point of each of the interference signals measured from the measuring sensor in accordance with the presence or absence of the object to be measured, select the location interval spaced by the same distance from each maximum point, in the selected position section By comparing the measured interference signals, by measuring the thickness of the measurement object using this, there is an effect that can be adjusted to a fine unit, not the half-wavelength of the laser beam irradiated to measure the thickness measurement unit of the measurement object.

Second, by providing a separate control unit, by adjusting to match the maximum value point of the interference signal measured by the measuring sensor when the measurement object is present and the maximum value point of the interference signal measured by the measurement sensor when there is no measurement object, In addition to the convenience of comparing the distance between the position spaced from the value point by a predetermined distance, the error range is also reduced.

Third, when comparing the phase difference according to the interference signal of the selected location section among the interference signals measured according to the presence or absence of the measurement object, by measuring the median of the interference signals of the selected location section, and comparing the intermediate values with each other, There is an effect that can know the thickness measurement results of the object.

1 is a perspective view showing a schematic configuration of a laser interferometer according to an embodiment of the present invention;
2 is a view illustrating a process of generating an interference signal by irradiation of a laser beam in the laser interferometer of FIG. 1;
3 is a view showing microscopically the generation of the interference signal measured by the measurement sensor by the focusing lens of FIG.
4 is a view showing that interference occurs in a laser beam measured by the measuring sensor according to each laser beam passing through the focusing lens of FIG. 3;
FIG. 5 is a view illustrating a state in which a laser beam passing through the focusing lens of FIG. 3 is reflected through a measurement object;
FIG. 6 is a diagram illustrating an interference signal measured by the measuring sensor according to the presence or absence of a measuring object of FIG. 3; FIG.
7 is a view showing an interference signal measured according to the presence or absence of a measurement object by the process of FIG.
FIG. 8 is a diagram illustrating an interference signal of a location section selected according to each interference signal of FIG. 6; FIG. And
FIG. 9 is a diagram illustrating a center of gravity method for obtaining an intermediate value of an interference signal in a selected location section of FIG. 8.

A preferred embodiment of the thickness measuring method using the laser interferometer according to the present invention configured as described above will be described with reference to the accompanying drawings. However, it is not intended to limit the invention to any particular form but to facilitate a more thorough understanding of the present invention.

In the following description of the present embodiment, the same components are denoted by the same reference numerals and symbols, and further description thereof will be omitted.

First, referring to FIGS. 1 and 2, a schematic configuration of a laser interferometer according to an embodiment of the present invention will be described.

1 is a perspective view showing a schematic configuration of a laser interferometer according to an embodiment of the present invention and FIG. 2 is a view showing a process of generating an interference signal by irradiation of a laser beam in the laser interferometer of FIG.

As shown in FIG. 1, the laser interferometer is largely composed of an irradiation unit 100, a spectroscope 200, a work table 500, a focusing lens 600, a mirror 300, and a measurement sensor 400.

The irradiation unit 100 is composed of a laser diode 110 and a directional lens 120 for irradiating a laser beam.

The laser diode 110 receives power and irradiates a laser beam having a single wavelength forward.

The directional lens 120 is disposed on the path of the laser beam irradiated by the electron gun, and the irradiated laser beam has a predetermined thickness and has directivity in the same direction.

The spectroscope 200 is provided on the movement path of the laser beam irradiated from the irradiator 100 and is disposed to be inclined at a predetermined angle. Thus, when the laser beam irradiated from the irradiator 100 touches the spectroscope 200, a part of the laser beam passes through the spectroscope 200 and is continuously irradiated along the traveling direction, and the other part is reflected It is turned to the side.

The work table 500 is disposed in the traveling direction of the laser beam irradiated from the irradiator 100, and the laser beam irradiated from the irradiator 100 is mounted on one surface by mounting the measurement object T on the surface. Is to be investigated. Here, one surface of the work table 500 is configured to reflect the laser beam to be irradiated.

The focusing lens 600 is disposed in a direction in which the laser beam irradiated from the irradiator 100 passes through the spectroscope 200 and is irradiated with a predetermined thickness through the directivity lens 120. The beam is focused to focus on the work table 500 or the measurement object T.

The laser beam located outside the center and the center of the laser beam irradiated while passing through the focusing lens 600 is focused to a point. Here, the focusing lens 600 adjusts the focusing point of the laser beam according to the distance from the work table 500 or the measurement target T.

The shape and movement path of the laser beam focused by the focusing lens 600 will be described later with reference to FIGS. 3 and 4.

The mirror 300 is disposed in the moving direction of the laser beam reflected from the spectroscope 200, and a part of the laser beam irradiated from the irradiator 100 is reflected by the spectroscope 200 by the mirror 300. The laser beam reflected and reflected in the direction is reflected back to the spectroscope 200. This is because the laser beam reflected through the mirror 300 is irradiated with the laser beam reflected after being irradiated to the work table 500 or the measurement object (T) to cause interference by the measurement sensor 400 Allow to measure.

In addition, the mirror 300 may be designed to be distorted at an angle of about 5-30 degrees, which enables the laser beam detected by the measuring sensor 400 to effectively create an interference signal for measuring. An effect caused by having the mirror 300 have an inclination angle will be described later with reference to FIG. 6.

The measurement sensor 400 is disposed in a direction in which the laser beam reflected from the mirror 300 passes through the spectroscope 200, and the laser beam reflected from the mirror 300 and the work table 500. Alternatively, the laser beam reflected after being irradiated to the measurement object T may be sensed to measure an interference signal generated by interference of two laser beams.

The measurement sensor 400 may be a commonly used Complementary Metal Oxide Semiconductor (CMOS) sensor.

By using the laser interferometer configured in this way it is possible to measure the thickness of the measurement object (T) by the method according to an embodiment of the present invention.

Next, referring to FIG. 2, the path of the laser beam moving by the irradiation of the laser beam in the laser interferometer will be described.

First, the laser beam is irradiated from the laser diode 110 toward the work table 500. The irradiated laser beam passes through the spectroscope 200 provided on the path, and a part of the irradiated laser beam is reflected from the spectroscope 200 toward the mirror 300, and the rest is the spectroscope 200. ) Is transmitted to the worktable 500.

At this time, the laser beam irradiated from the laser diode 110 is irradiated in parallel in the same direction by the directional lens 120 disposed between the laser diode 110 and the spectroscope 200. .

As described above, a part of the laser beam irradiated from the laser diode 110 by the spectroscope 200 is reflected toward the mirror 300 and then reflected by the mirror 300 to provide the spectroscope 200. After passing through, it is directed to the measurement sensor 400.

In addition, among the laser beams irradiated from the laser diode 110, the laser beam transmitted through the spectroscope 200 without being reflected toward the mirror 300 is directed toward the work table 500. The laser beam directed toward the workbench 500 is reflected by the workbench 500 and then moved in the direction of the spectroscope 200 and then reflected by the spectroscope 200 toward the measurement sensor 400.

As such, the laser beam reflected from the mirror 300 and the laser beam reflected from the work table 500 are directed to the measurement sensor. Here, each of the laser beams interfere with each other, and the measuring sensor 400 detects the laser beam in which the interference occurs and measures the interference signal.

That is, the thickness of the measurement target T may be measured through the interference signal measured by the measurement sensor 400 using interference according to the movement path of each of the laser beams spectroscope 200. .

On the other hand, although not shown in the drawing may be provided with a separate lifting module (not shown) to adjust the distance between the laser interferometer and the measurement object (T).

When the laser beam irradiated from the laser interferometer is irradiated onto the measurement target T, the laser beam is focused while passing through the focusing lens 600. In this case, when the focus point where the laser beam is focused becomes the upper or lower portion of the measurement object T, the interference signal of the laser beam measured by the measuring sensor 400 may not be clearly shown.

Thus, by providing the elevating module, by selectively adjusting the distance between the laser interferometer and the measurement object (T) can be adjusted to suit the focus of the laser beam to be irradiated.

In this case, the method for adjusting the distance between the laser interferometer and the measurement target (T), the measurement target (T) can be raised and lowered along the vertical direction of the laser interferometer and the laser interferometer is the measurement target At the top of (T) it can be made to rise and fall along the vertical direction.

Next, referring to FIG. 3, a method of measuring the interference signal measured by the laser interferometer is as follows.

3 is a view showing microscopically the movement path of the laser beam measured by the measuring sensor 400 of FIG. 2.

The laser beam irradiated from the irradiator 100 and having a predetermined thickness by the directional lens 120 is partially transmitted through the spectroscope 200, and is partially reflected toward the mirror 300. The laser beam irradiated in the present embodiment is actually continuous, but for convenience, it is described by dividing into three regions.

The laser beam passing through the directional lens 120 has a first laser beam L1 irradiated from the right side outside the center axis and a second laser beam L2 irradiated along the center axis and the center axis. Next, the laser beam irradiated from the outside in the left direction is referred to as a third laser L3.

First, the first laser (L1) is irradiated toward the work table 500 passing through the directing lens 120. Here, the first laser (L1) is via the P1 point of the spectroscope 200 provided on the path to be irradiated, a portion of the first laser (L1) to be irradiated is reflected to the mirror 300 The second laser beam L1 is reflected by the light beam, and the remainder of the first laser L1 is irradiated through the spectroscope 200.

In addition, the first laser beam L1 transmitted through the spectroscope 200 is focused by the focusing lens 600 to the point F, which is a focusing point. At this time, the F point is the upper surface of the work table 500 and the first laser (L1) irradiated is reflected from the F point of the work table 500.

Here, the first laser (L1) is the same angle as the angle of incidence according to the law of reflection because the angle irradiated to the point F is inclined at a predetermined angle, not the vertical direction with respect to the work table 500 And reflected in the opposite direction.

The first laser L1 reflected at the point F is irradiated toward the spectroscope 200 again and is reflected at the point P3 of the spectroscope 200 and irradiated to the measurement sensor 400.

Meanwhile, a part of the first laser L1 reflected at the point P1 of the spectroscope 200 is reflected to the mirror 300. The first laser L1 reflected by the mirror 300 is reflected by the mirror 300 again to the spectroscope 200 and passes through the P1 point of the spectroscope 200 to measure the measurement sensor ( 400).

Through this process, each of the first lasers L1 spectroscopically measured by the spectroscope 200 is measured by the measurement sensor 400.

Here, the spectroscope 200 is continuously configured similarly to the laser beam irradiated from the irradiator 100, but is shown separately in three points (P1, P2, P3) for a clear explanation of the present invention. .

Subsequently, referring to the movement process of the second laser (L2), it is located on the central axis of the laser beam irradiated from the irradiation unit 100 and part of the reflection at the point P2 of the spectroscope 200 is reflected to the mirror 300 The remainder is transmitted through the P2 point of the spectroscope 200 and irradiated to the work table 500.

The second laser beam L2 passing through the spectroscope 200 is irradiated to the point F, which is the focusing point of the work table 500, through the focusing lens 600. At this time, since the second laser (L2) is located on the central axis of the laser beam to be irradiated, the path is not changed even through the focusing lens 600 is irradiated to the work table 500 in the vertical direction.

The second laser (L2) irradiated perpendicularly to the F point of the work table 500 is reflected in the same way as the irradiated path, the reflected second laser (L2) at the point P2 of the spectroscope 200 It is reflected and irradiated to the measuring sensor 400.

On the other hand, a part of the second laser (L2) reflected from the P2 point of the spectroscope 200 toward the mirror 300 is reflected back from the mirror 300 to the spectroscope 200, the minute The light passes through the P2 point of the light unit 200 and is irradiated to the measurement sensor 400.

Through this process, each of the second lasers L2 spectroscopically measured by the spectroscope 200 is measured by the measurement sensor 400. That is, the measurement sensor 400 measures the interference signal in which the second laser (L2) is spectroscopically reflected by the work table 500 and the mirror 300, and then merged together and interference with each other.

In addition, the moving process of the third laser (L3), it is irradiated from the left outer side of the laser beam irradiated from the irradiation unit 100 and part of the reflection at the point P3 of the spectroscope 200 is reflected to the mirror 300 The rest is transmitted to the work table 500 through the P3 point of the spectroscope 200.

The third laser beam L3 transmitted through the spectroscope 200 is focused by the focusing lens 600 to the point F, which is a focusing point located on the work table 500. At this time, the third laser (L3) is refracted through the process of focusing by the focusing lens 600 is irradiated to the point F. The F point is an upper surface of the work table 500, and the third laser L3 is reflected at the F point.

Here, the third laser (L3) has an angle equal to the angle of incidence according to the law of reflection because the angle irradiated to the point F is incident in an inclined state rather than the vertical direction relative to the work table 500 Reflected in the opposite direction.

The third laser L3 reflected at the point F is irradiated toward the spectroscope 200 again, and is reflected at the point P1 of the spectroscope 200 and irradiated to the measurement sensor 400.

Meanwhile, a part of the third laser L3 reflected at the point P3 of the spectroscope 200 is reflected by the mirror 300. The third laser L3 reflected by the mirror 300 is reflected by the mirror 300 again to the spectroscope 200 and passes through the P3 point of the spectroscope 200 to measure the measurement sensor ( 400).

In this way, each of the first laser (L1) to the third laser (L3) is separated from the spectroscope 200 is reflected from the mirror 300 and the work table 500 is the measurement sensor 400 Is measured in

Here, looking at the first laser (L1) to the third laser (L3) measured by separating the measuring sensor 400 to three points, the laser beam measured at the S1 point of the measuring sensor 400 is the first The first laser beam reflected from the mirror 300 at the point P1 of the spectroscope 200 in one laser beam L1 and then reflected from the mirror 300 and transmitted to the point P1 of the spectroscope 200 ( A part of L1) and the third laser, which is transmitted through the point P3 of the spectroscope 200 from the third laser L3 and reflected by the work table 500, and then reflected by the point P1 of the spectroscope 200. A part of L3 is mixed to measure laser beams that interfere with each other. That is, before the laser beam measured at the point S1 of the measuring sensor 400 is irradiated to the measuring sensor 400, an interference signal in which lasers via the point P1 interfere with each other is measured.

Similarly, the laser beam measured at the point P3 of the measuring sensor 400 is reflected from the point P3 of the spectroscope 200 to the mirror 300 of the first laser L1 and then the mirror 300. A portion of the third laser (L3) and the first laser (L1) that is reflected from the transmitted through the P3 point of the spectroscope 200 and the first laser beam (P1) of the spectroscope 200 through the work table 500 After reflecting at, a portion of the first laser L1 reflected at the point P3 of the spectroscope 200 is combined and a laser beam in which interference occurs is measured.

In addition, the laser beam measured at the point P2 of the measuring sensor 400 is the second laser (L2) is separated from the point P2 of the spectroscope 200, respectively in the mirror 300 and the work table 500 After the reflection, the laser beam, which is indirectly generated at the same time as being transmitted or reflected through the P2 point of the spectroscope 200 and merged, is measured.

Through this process, the interference signal of the laser beam is measured by the measuring sensor 400.

Next, the interference of the laser beam according to the path difference of each of the first laser L1 to the third laser L3 by the focusing lens 600 will be described with reference to FIG. 4.

FIG. 4 is a diagram illustrating that interference occurs in a laser beam measured by the measuring sensor according to each laser beam passing through the focusing lens of FIG. 3.

As shown, the first laser (L1) to the third laser (L3) transmitted through the focusing lens 600 is focused to the point F, which is a focusing point located on the upper surface of the work table (500).

The first laser L1 is refracted to the left through the focusing lens 600 to focus on the point F, and the third laser L3 is refracted to the right through the focusing lens 600. . Since the second laser beam L2 is located at the central axis of the laser beam, the second laser beam L2 is irradiated to the point F without being refracted.

As shown in FIG. 4A, each of the first to third laser beams L1 to L3 passing through the focusing lens 600 is irradiated to the point F of the work table 500 and then the reflection law Is reflected by. In this case, the second laser beam L2 is reflected by the path that the first laser beam L1 and the third laser beam L3 reflect to reach the focusing lens 600. It will be longer than the path to reach.

Since the focusing lens 600 positioned vertically with respect to the work table 500 is positioned in parallel with the work table 500, the focusing lens 600 is positioned in parallel with the work table 500, so that the focusing lens 600 is reflected from the work table 500 in the vertical direction. The moving paths of the first laser L1 and the third laser L3 that are reflected to be inclined become long, so that the second laser beam L2 reaches the focusing lens 600 at the shortest distance. The first laser L1 and the third laser L3 do not reach the focusing lens 600.

Therefore, the first laser L1 and the third laser L3 generate a path difference by ΔA from the second laser L2.

For this reason, as shown in FIG. 4B, each of the first laser L1 to the third laser L3 measured by the measurement sensor 400 has different strengths.

In more detail, when the wavelengths of the first laser beam L1 to the third laser beam L3 are connected to each other, the path difference of ΔA is shown in a curved shape as illustrated.

As such, each of the first laser L1 to the third laser L3 having a different path difference is reflected from the mirror 300 before being measured by the measuring sensor 400. ) And a laser beam which causes interference with the third laser L3 and thus interference is measured by the measuring sensor 400.

Here, since each of the first laser (L1) to the third laser (L3) has a different path difference, in the measuring sensor 400, the strength is different from each other by the reinforcement interference and the offset interference, the interval is not constant The interfering signal in the form is measured.

As such, by measuring interference signals having different types of intensities, the points at which the second laser beam L2 is measured can be clearly distinguished, and the points at which the second laser beam L2 is measured are Since it can be distinguished regardless of the presence or absence of the measurement object (T), the interference signal measured by the measurement sensor 400 while replacing the measurement object (T) based on the point where the second laser (L2) is measured. Can be compared.

Here, since the second laser (L2) is located on the central axis of the laser beam irradiated to the work table 500, the second laser beam (L2) is incident vertically regardless of the presence or absence of the measurement target (T), the movement path becomes the shortest distance, The point where the interference signal of the second laser beam L2 is measured may be the maximum value of the interference signal measured in the entire laser beam.

Next, referring to FIG. 5, a process of measuring the thickness of the measurement target T by the process of reflecting the laser beam passing through the focusing lens 600 through the measurement target T will be described. Is the same as

FIG. 5 is a diagram illustrating a state in which a laser beam passing through the focusing lens 600 of FIG. 3 is reflected through the measurement object T. Referring to FIG.

Referring to the figure shown, the first laser (L1) or the third laser (L3) incident to be inclined to the measurement object (T) penetrates into the interior of the measurement object (T), the refraction occurs and is generated by the refraction The thickness of the measurement target T can be known according to the movement path.

The incidence angle of the first laser L1 or the third laser L3 is α1 based on the normal of the measurement object T and is refracted in the measurement object T to be on the upper surface of the work table 500. The incident angle of incidence is α2.

The refractive index of the measurement object T is n ₂ and the refractive index of the external medium of the measurement object T is n ₁ . In addition, the thickness of the said measurement object T is represented by d.

When irradiated to the measurement object (T) at an angle of α1 which is an incident angle of the first laser (L1) and the third laser (L3), it is refracted by the measurement object (T) inside the measurement object (T) The bottom surface of the work table 500 is irradiated at an angle of α2. The first laser (L1) and the third laser (L3) irradiated at an angle of α2 is reflected at the same angle by the law of reflection, and the first laser (L1) reflected inside the measurement object (T) And the third laser L3 is refracted again while coming out of the measurement object T and proceeds.

However, when the measurement object T does not exist, the first laser L1 and the third laser L3 are incident at an angle of α1 without refracting and then reflected again from the upper surface of the work table 500. do.

Here, the area where the first laser (L1) and the third laser (L3) is refracted and moved in the measurement object (T) in the state that the measurement object (T), and the measurement object (T) In the absence of a state, a path difference of ΔL is generated between the moved paths of the region where the first laser L1 and the third laser L3 move.

Due to the path difference of ΔL, the phase difference of the interference signal measured by the measurement sensor 400 is generated.

When the path difference of ΔL is measured, d, which is the thickness of the measurement target T, may be calculated using Equation 1 below.

Through such Equation 1, the thickness of the measurement target T may be measured using ΔL.

Next, referring to FIG. 6, the interference signal of the laser beam measured by the measurement sensor 400 depending on the presence or absence of the measurement object T will be described.

FIG. 6 is a diagram illustrating an interference signal measured by the measuring sensor 400 depending on the presence or absence of the measuring object T of FIG. 3.

First, Figure 6 (a) is a diagram showing the interference signal measured by the measuring sensor 400 in the form of a parallel wave when the laser beam is irradiated without the measuring object on the work table in the laser interferometer.

As shown, the laser beam L11 irradiated and reflected on the work table 500 and the laser beam L21 reflected from the mirror 300 interfere with each other, and the interference occurs in the measurement sensor 400. Measure the interference signal of the laser beam.

Here, the mirror 300 is configured to be inclined at a predetermined angle and is incident to the measuring sensor 400. When the mirror 300 is not inclined at a predetermined angle, the laser beam L11 reflected from the work table 500 and the laser beam L21 reflected from the mirror 300 are parallel to each other and the measurement sensor 400 Since the mirror 300 is inclined by a predetermined angle because it is difficult to measure the interference signal, the interference signal measured by the measurement sensor 400 is measured in a non-uniform form.

As such, the mirror 300 is configured to be inclined at a predetermined angle so that the laser beam L21 reflected from the mirror 300 and the laser beam L11 reflected from the work table 500 cause interference with each other. By measuring the interference signal having a non-uniform image in the measurement sensor 400.

At this time, since the laser beam L11 reflected and measured by the work table 500 does not have a large path difference, the laser beam L11 is incident in the form of a parallel wave. In this case, since a small path difference is generated because it is actually focused by the focusing lens 600, it does not affect the measurement result.

Meanwhile, referring to FIG. 6B, when the measurement object T is present, as described with reference to FIG. 5, a path difference between the center and the outside of the laser beam emitted from the irradiator 100 may be different from each other. Since the laser beam L11 reflected from the measurement object T is incident on the measurement sensor 400 in the form of a spherical wave rather than a parallel wave.

In the measurement sensor 400, an interference signal in which the laser beam L21 reflected and incident from the mirror 300 and the laser beam L11 reflected and incident from the measurement object T interfere with each other are measured.

Here, the laser beam L21 reflected and incident from the mirror 300 forms a parallel wave, and the laser beam L11 reflected and incident from the measurement object T forms a spherical wave and causes interference with each other. When the laser beam L11 reflected from the measurement object T becomes spherical wave shape, when the interference occurs with the laser beam L21 reflected from the mirror 300, the interference signal measured in the state (a) of FIG. And other interfering signals are measured.

As a result, the interference signal in the state in which the measurement object T is absent and the interference signal in the state in which the measurement object T is present are different from each other. In this way, by comparing the interference signal according to the presence or absence of the measurement target (T) to measure the thickness of the measurement target (T).

Next, a process of measuring ΔL through the measuring sensor 400 will be described with reference to FIGS. 7 and 8 as follows.

FIG. 7 is a diagram illustrating an interference signal measured according to the presence or absence of a measurement object T by the process of FIG. 6, and FIG. 8 is a diagram illustrating an interference signal of a selected location section according to each interference signal of FIG. 6.

First, referring to FIG. 7, the interference signal measured by the measurement sensor 400 when the measurement object T is present or absent, and the two images are similar in shape but subtly different.

This is because interference signals generated by the path difference of the laser beam according to the thickness of the measurement target T are different from each other.

Thus, ΔL may be measured by comparing two interference signals, and accordingly, the thickness of the measurement object T may be known using Equation 1.

Meanwhile, a method of measuring ΔL through the two interference signals described above will be described with reference to FIG. 8.

8 (a) is the interference signal measured by the measurement sensor 400 when there is no measurement object (T) and FIG. 8 (b) is measured by the measurement sensor 400 when there is a measurement object (T) Interference signal.

Using FIG. 8A, the interference signal of a selected location section separated by a predetermined distance is measured based on the maximum value of the interference signal at which the second laser beam L2 is measured. The interference signal of the selected location section thus measured is taken to be the middle value by using the center of gravity method. The center of gravity method that takes the intermediate value will be described later with reference to FIG. 9.

And using the (b) of FIG. 8 based on the maximum value of the interference signal, the point where the second laser (L2) is measured as shown in (a) of FIG. Measure The median value of the interference signal of the selected location section thus measured is measured using the center of gravity method in the same manner as described above.

Thus, ΔL can be measured by comparing the median of FIG. 8A and the median of FIG.

The thickness d of the measurement object T may be found by Equation 1 using ΔL measured through the above method.

When the thickness of the measurement target T is measured by the above method, even if the surface of the measurement target T is not uniform, the median value of a specific area can be taken to measure the thickness, thereby affecting the uniformity of the surface. Not only does it receive?, The magnitude of? L can also have resolution in nm rather than half-wave integer times.

Meanwhile, the position at which the second laser L2 is measured by the measuring sensor 400 may be changed according to the presence or absence of the measuring object T and the thickness or type of the measuring object T. Since the maximum value of the interference signal measured by the measurement sensor 400 is changed when the position measured by the second laser (L2) in the measurement sensor 400 is changed to measure the thickness of the measurement target (T) This can be a problem.

Thus, a separate controller (not shown) may be provided to match the maximum value of each interference signal measured by the measurement sensor 400 depending on the presence or absence of the measurement target T.

Referring to the overall process of measuring the thickness of the measurement object (T) through such a method, first measuring the interference signal in the absence of the measurement object (T) and then measuring the maximum value and the measured interference signal The interference signal of the selected location section spaced a predetermined distance from the maximum value of the interference signal is measured.

Then, the measurement object (T) is mounted on the upper surface of the work table 500 to irradiate a laser beam. Measuring the interference signal of the laser beam measured by the measuring sensor 400 to measure the selected position section spaced apart by a distance equal to the maximum value of the measured interference signal and the selected position section in the absence of the measurement object (T) do.

The interference signal of the selected location section is compared with the measurement object T based on the interference signal of the selected location section in the absence of the measurement object T, and the respective interference signals are compared. Here, the interference signal measured in each selected location section is detected by using the center of gravity method to compare the respective median value.

Next, the center of gravity method will be described with reference to FIG. 9.

FIG. 9 is a diagram illustrating a center of gravity method for obtaining an intermediate value of an interference signal in a selected location section of FIG. 8.

Referring to the graph of the figure, the x-axis represents the interference signal measured by the measuring sensor 400 according to the position, and the y-axis represents the strength of the interference signal measured at each position.

As shown in the graph, since the values of the y-axis are different according to the values of the x-axis, the sum of the interference signal strengths of the respective positions measured as shown in Equation 2 is obtained, and then the sum of the measured positions is obtained. The median value can be calculated by dividing by.

The method using Equation 2 may calculate the median value of the selected location section based on the maximum value of the interference signal measured by the measurement sensor 400. Here,? L, which is the difference, may be obtained by comparing the intermediate values obtained through Equation 2 according to the presence or absence of the measurement object.

In other words, when the median value is represented by the center of gravity in the graph, the sum of the areas shown in the graph is summed, and the median value of the sum is calculated to find the point of the center.

The thickness of the measurement target T is calculated according to Equation 1 using ΔL obtained by comparing the respective median values measured as described above.

As described above, the preferred embodiments of the present invention have been described, and the present invention can be embodied in other forms without departing from the spirit or scope of the present invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the foregoing description, but may be modified within the scope and equivalence of the appended claims.

100: scanning unit 110: laser diode
120: directional lens 200: spectroscope
300: mirror 400: measuring sensor
500: workbench 600: focusing lens
T: measuring object

Claims (11)

In the thickness measurement method for measuring the thickness of the measurement object using a laser interferometer,
Irradiating a laser beam on the measurement object and sensing a reflected laser beam to measure an interference signal of the laser beam according to a measurement position;
Selecting an interference signal corresponding to a location section spaced apart by a specific distance based on the location corresponding to the maximum value of the measured interference signal; And
Calculating a phase difference of the interference signal by comparing the interference signal in the selected location section with a reference interference signal in the absence of the measurement object corresponding to the selected location section;
Thickness measurement method using a laser interferometer comprising a. The method of claim 1,
Detecting a thickness of the measurement object corresponding to a phase difference of the measured interference signal based on a geometric correlation according to an incident angle of the laser beam corresponding to the selected position section and a refractive index value of the measurement object; Thickness measurement method using a laser interferometer, characterized in that it comprises a. The method of claim 1,
Comprising the interference signal in the selected position section with respect to the reference interference signal in the absence of the measurement object corresponding to the selected position section, calculating the phase difference of the interference signal,
Thickness measurement method using a laser interferometer, characterized in that for calculating the difference between the median value by selecting the median value of the interference signal measured in the selected position section. The method of claim 1,
The selected location section,
Thickness measuring method using a laser interferometer, characterized in that the area is irradiated and measured in the area spaced out of a predetermined distance from the center of the detected laser beam. The method of claim 1,
Irradiating the laser beam to the measurement object and detecting the reflected laser beam to measure the interference signal of the laser beam according to the measurement position,
Irradiating a laser beam of a single wavelength on the irradiation unit;
A part of the irradiated laser beam passes through a spectroscopic part and is focused and irradiated onto the measurement object and then is reflected, and a part of the irradiated laser beam is reflected by a mirror after being reflected by the spectroscopic part;
Sensing the laser beam reflected from the workbench and the laser beam reflected from the mirror; And
Measuring an interference signal generated by the path difference of the sensed laser beam;
Thickness measurement method using a laser interferometer, characterized in that it comprises a. 6. The method of claim 5,
The laser beam focused by passing through the spectroscope, the laser beam irradiated through the center and the laser beam irradiated through the selected position section has a different movement path, characterized in that the laser interferometer. The method of claim 1,
The maximum value of the measured interference signal is,
Thickness measurement method using a laser interferometer, characterized in that the intensity point of the largest interference signal measured. The method of claim 1,
And adjusting the position according to the maximum value of the interference signal measured in the absence of the measurement object and the position according to the maximum value of the measured interference signal in the state where the measurement object is present. Thickness measurement method using laser interferometer. The method of claim 1,
Thickness measuring method using a laser interferometer, characterized in that further comprising the step of adjusting the distance between the laser interferometer and the measurement object. The method of claim 9,
Adjusting the distance between the laser interferometer and the measurement object,
Thickness measurement method using the laser interferometer, characterized in that the measuring object is raised and lowered in the vertical direction of the laser interferometer. The method of claim 9,
Adjusting the distance between the laser interferometer and the measurement object,
The laser interferometer is a thickness measuring method using a laser interferometer, characterized in that the rising and falling in the vertical direction at the top of the measurement object.

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