CN110112278A - A kind of installation base plate and its light emitting device - Google Patents
A kind of installation base plate and its light emitting device Download PDFInfo
- Publication number
- CN110112278A CN110112278A CN201910340708.4A CN201910340708A CN110112278A CN 110112278 A CN110112278 A CN 110112278A CN 201910340708 A CN201910340708 A CN 201910340708A CN 110112278 A CN110112278 A CN 110112278A
- Authority
- CN
- China
- Prior art keywords
- substrate
- radiator structure
- installation base
- base plate
- interarea
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
The embodiment of the present invention provides a kind of installation base plate and its light emitting device, the installation base plate includes substrate, a pair of connection pin, and radiator structure, the pair of connection pin is arranged in the end positions of the substrate and wraps up to the back of substrate, the radiator structure is arranged between the connection pin at the back side of the substrate and its height is equal with the height of connection pin overleaf, the radiator structure is used to guide the heat that the luminescent device for being mounted on substrate interarea generates, to increase the integral heat sink area of light emitting device, one layer of solder mask is further set also between the radiator structure and the connection pin, the solder mask is not connect with the radiator structure, to maintain the integrality of radiator structure, it will appear when also avoiding welding and connection pin be connected with radiator structure accidentally and loses radiator structure and is used to radiate Effect and avoiding there is the problem of short circuit.
Description
Technical field
The present invention relates to LED technology field more particularly to a kind of installation base plates and its light emitting device.
Background technique
It is also more and more more next especially for the needs of the energy-saving equipment of LED class with the continuous development of science and technology
More minimize, but the heat that its volume is the reduction of, and generates when its work is not reduced, heat dissipation is still presence
Problem, existing design method be the mounting plate of LED chip the back side be arranged a radiating terminal, by radiating terminal with
LED chip connection, by heat transfer caused by LED chip to the external world, thus realize the effect of heat dissipation, but this structure
Heat dissipation area it is still too small, especially also need to be arranged solder resist covering radiating terminal, preventing welding from being can be by radiating end
Son is also powered, and is also avoided that the light emitting device for welding energization accordingly, it is now desired to design one kind and can either improve radiating efficiency
Mounting plates structure.
Summary of the invention
Installation base plate and its light emitting device provided in an embodiment of the present invention, mainly solving the technical problems that: it is existing
Radiator structure setting solder mask and reduce the heat dissipation area of device, so as to cause the lower problem of radiating efficiency.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of installation base plate, comprising: substrate, be set to it is described
It wraps up on the both ends position of substrate and from the mounting surface of the substrate to a pair of of connection pin at the back side of the substrate, and
It is arranged between the connection pin at the back side of the substrate and is wrapped in the height at the back side with the connection pin
Radiator structure；Be additionally provided with solder mask between the radiator structure and the connection pin, the mounting surface of the substrate be with
The one side of contact pads on circuit board.
In other embodiments of the invention, the solder mask is formed membranaceous by the resin combination with insulating properties
Insulating layer.
In other embodiments of the invention, the solder mask be set to the radiator structure and the connection pin it
Between substrate on, or be set to the radiator structure and it is described connection pin between substrate and the connection pin on.
In other embodiments of the invention, the radiator structure includes heat dissipation interarea and interconnecting piece interconnected,
Wherein, the heat dissipation interarea is fixed on the back side of the substrate, and the interconnecting piece is provided close to the mounting surface one of the substrate
Side.
In other embodiments of the invention, the interconnecting piece is in the heat dissipation interarea formed by Heat Conduction Material
Extend package to the interarea of the substrate and in the master along the mounting surface close to the side of the mounting surface of the substrate
Face forms the extension bending part of a conductive structure.
In other embodiments of the invention, the installation base plate further includes connection terminal, the connection terminal and institute
Radiator structure physical connection is stated, and passes through the interarea that the substrate extends to the substrate.
In other embodiments of the invention, the interconnecting piece is by the heat dissipation interarea along its vertical direction protrusion
And the raised pin being bent to form to the mounting surface.
In other embodiments of the invention, it is additionally provided with connection through-hole on the substrate, the connection terminal is worn
It crosses the connection through-hole and extends package to the interarea of the substrate.
In order to solve the above technical problems, the embodiment of the invention provides a kind of light emitting device, including described in any one as above
Installation base plate, and the luminescent device on the interarea of the installation base plate, the luminescent device the back side with it is described
Heat-conducting layer is additionally provided between radiator structure, by the heat-conducting layer by generated heat in the luminescent device course of work
It is transferred on the radiator structure.
It further include encapsulation glue-line in other embodiments of the invention, the encapsulation glue-line is set to the substrate
On interarea, and cover the luminescent device.
The beneficial effects of the present invention are:
The installation base plate and its light emitting device provided according to embodiments of the present invention, the installation base plate include substrate, Yi Duilian
Pin and radiator structure are connect, the pair of connection pin is arranged in the end positions of the substrate and wraps up to substrate
Back, the radiator structure is arranged between the connection pin at the back side of the substrate and its height is equal with the height at the back side,
The radiator structure is used to guide the heat that the luminescent device for being mounted on substrate interarea generates, to increase light emitting device
Integral heat sink area, further also between the radiator structure and the connection pin be arranged one layer of solder mask, the resistance
Layer is not connect with the radiator structure, to maintain the integrality of radiator structure, it is thus also avoided that accidentally will will appear when welding
Connection pin be connected with radiator structure and loses the effect and avoiding that radiator structure is used for heat dissipation and short-circuit problem occur.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of light emitting device provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of installation base plate provided in an embodiment of the present invention；
Fig. 3 is second of structural schematic diagram of installation base plate provided in an embodiment of the present invention；
Fig. 4 is the third structural schematic diagram of installation base plate provided in an embodiment of the present invention.
Wherein, 1 in attached drawing is light emitting device, and 10 be installation base plate, and 11 be substrate, and 12 be connection pin, and 13 be scattered
Heat structure, 14 be solder mask, and 15 be connection terminal, and 101 be the interarea of substrate, and 102 be the back side of substrate, and 131 be heat dissipation interarea,
132 be interconnecting piece, and 20 be luminescent device, and 21 be encapsulation glue-line.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, below by specific embodiment knot
Attached drawing is closed to be described in further detail the embodiment of the present invention.It should be appreciated that specific embodiment described herein is only used to
It explains the present invention, is not intended to limit the present invention.
Embodiment:
Referring to FIG. 1, Fig. 1 is the structural schematic diagram of light emitting device provided in an embodiment of the present invention, which includes
Installation base plate 10 and luminescent device 20, wherein the installation base plate 10 includes the interarea 101 for installing the luminescent device 20
With the back side 102, luminescent device 20 is mounted on interarea 101.
As shown in Fig. 2, in the present embodiment, the installation base plate 10 specifically includes substrate 11, a pair of of connection 12 and of pin
Radiator structure 13, wherein the pair of connection pin 12 is set on the both ends position of the substrate 11 and wraps up to the base
The back side 102 of material 11, the radiator structure 13 is arranged on the back side 102 of the substrate 11, for that will be set to interarea 101
Luminescent device 20 generate heat diffusion come out, thus realize accelerate heat dissipation effect.
In the present embodiment, the radiator structure 13 is arranged between the connection pin at the back side of the substrate,
In a kind of embodiment, it is equal that height and the connection pin 12 are wrapped in the height at the back side, in another embodiment, dissipates
The height of heat structure 13 can also be directly disposed as equal with the height at the back side.
In practical applications, the shape of the connection pin 12 is similar inverted " t " font, and inverse-T-shaped vertical
A small protrusion is additionally provided on side, which is used for provide contact surface when welding LED component, and in inverse-T-shaped level
Extension is provided on side, which bends from the interarea 101 of substrate 11 to the side of substrate 11, and wraps substrate 11
Side extends on the back side 102.
In practical applications, the middle position at the back side 102 of the substrate 11 is arranged in the radiator structure 13, preferably
, the area of the radiator structure 13 should select overleaf between the half of 102 entire area and 2/3rds more
Properly, the maximization that can realize heat dissipation area to the greatest extent in this way, is also able to achieve and leaves certain setting for solder mask 14
Space, while the whole height of radiator structure 13 is suitable with the whole height of light emitting device 100, or even can also be and be slightly larger than
Can be with, and the part being higher by can be used for and the heat dissipation setting on substrate 11 connects, it is further to increase heat dissipation area and heat dissipation
Speed.
In the present embodiment, the radiator structure 13 is specifically made of heat dissipation interarea 131 and interconnecting piece 132, the connection
Portion 132 is disposed in proximity to the mounting surface side of the substrate 11, and mounting surface here refers to installing the method light emitting device
When 100, the one side contacted with mainboard, specifically one of them of the side between the interarea and the back side of light emitting device 100
Face.
In practical applications, the middle position of mounting surface, and the interconnecting piece is specifically arranged in the interconnecting piece 132
132 connect with luminescent device 20 and heat dissipation interarea 131 respectively, this kind of set-up mode makes during installation, and radiator structure 13 can
With directly with the mainboard face contact of equipment, heat can quickly pass to mainboard and radiate, and the specific structure is shown in FIG. 3, tool
Body is realized can be by by prolonging close to the side of the mounting surface of the substrate 11 along the mounting surface in the heat dissipation interarea 131
The extension bending part that the interarea 101 for stretching package to the substrate 11 is formed.
In the present embodiment, the installation base plate 10 further includes connection terminal 15, the connection terminal 15 and the heat dissipation
13 physical connection of structure, and pass through the interarea 101 that the substrate 11 extends to the substrate 11.
In order to cooperate the installation of the connection terminal 15, connection through-hole, the connecting pin are additionally provided on the substrate 11
Son 15 passes through the connection through-hole and extends package to the interarea 101 of the substrate 11.
Based on the basis of this kind of structure, interconnecting piece 132 should be set as by the heat dissipation interarea along its vertical direction
Protrusion and the raised pin being bent to form to the mounting surface.
In the present embodiment, the solder mask 14 is arranged between the radiator structure 13 and the connection pin 12, and
And still do not connect with the radiator structure 13, in practical applications, the solder mask 14, which specifically can be, is provided only on substrate
On 11 back side 102, it is on the substrate 11 being arranged between radiator structure 13 and the connection pin 12, it is preferred that setting exists
The both ends position of the radiator structure 13 at the back side 102, and be arranged close to pin side, further, the solder mask 14 is also
A part connection pin 12 can be covered, it is specific as shown in Figure 4.
In the present embodiment, the light emitting device 100 further includes encapsulation glue-line 21, and the encapsulation glue-line 21 is set to described
On the interarea 101 of substrate 11, and cover the luminescent device 20.The encapsulation glue-line 21 can also be processed by packaging film
It is formed, the interarea of the assembly substrate 11 processed is covered on particular by one layer that will have fluorescent material gummy film layer
On 101, it is melted in gummy film layer on interarea 101, so that luminescent device 20 be covered
Lid encapsulates.
In conclusion installation base plate provided in an embodiment of the present invention and its light emitting device, which includes substrate, one
Connection pin and radiator structure, the pair of connection pin are arranged in the end positions of the substrate and are wrapped up to base
The back side of the substrate is arranged in the back of material, the radiator structure, and is the heat dissipation between the connection pin being arranged overleaf
Structure is used to guide the heat that the luminescent device for being mounted on substrate interarea generates, to increase the entirety of light emitting device
Further one layer of solder mask is arranged on the substrate also between the radiator structure and the connection pin in heat dissipation area, should
Solder mask is not connect with the radiator structure, to maintain the integrality of radiator structure, it is thus also avoided that will appear mistake when welding
Connection pin is connected with radiator structure and loses the effect that radiator structure is used to radiate.
The LED provided in previous embodiment can be applied to various illumination fields, such as it can be fabricated to backlight module
Applied to display backlight field (backlight module that can be the terminals such as TV, display, mobile phone).It can be applied at this time
Backlight module.Other than it can be applied to display backlight field, key-press backlight field, shooting field, home lighting are applied also for
Field, lighting for medical use field, furnishing fields, automotive field, field of traffic etc..When applied to key-press backlight field, it can be used as
Mobile phone, calculator, keyboard etc. have the key-press backlight light source of press key equipment；When applied to shooting field, camera shooting can be fabricated to
The flash lamp of head；When applied to home lighting field, floor lamp, desk lamp, headlamp, ceiling lamp, downlight, projection can be fabricated to
Lamp etc.；When applied to lighting for medical use field, operating lamp, low electromagnetism headlamp etc. can be fabricated to；It can when applied to furnishing fields
To be fabricated to various ornament lamps, such as various color lamps, landscape spotlight, advertising lamp；When applied to automotive field, it can be fabricated to
Automobile lamp, automobile indicator etc.；When applied to field of traffic, various traffic lights can be made, various street lamps can also be made.
Above-mentioned application is only several applications exemplified by the present embodiment, it should be appreciated that the application of the LED in the present embodiment is not
It is limited to several fields of above-mentioned example.
The above content is combining specific embodiment to be further described to made by the embodiment of the present invention, cannot recognize
Fixed specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs,
Without departing from the inventive concept of the premise, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to the present invention
Protection scope.
Claims (10)
1. a kind of installation base plate characterized by comprising substrate is set on the positive both ends position of the substrate simultaneously
It wraps up from the mounting surface of the substrate to a pair of of connection pin at the back side of the substrate, and the back side of the substrate is set
The connection pin between and with the connection pin radiator structure that be wrapped in the height at the back side equal；It is dissipated described
Solder mask is additionally provided between heat structure and the connection pin, the mounting surface of the substrate is and the contact pads on circuit board
One side.
2. installation base plate according to claim 1, which is characterized in that the solder mask is by the resin combination with insulating properties
The film-shaped insulative layer that object is formed.
3. installation base plate according to claim 1 or 2, which is characterized in that the solder mask is set to the radiator structure
On substrate between the connection pin, or the substrate being set between the radiator structure and the connection pin and institute
It states on connection pin.
4. installation base plate according to claim 3, which is characterized in that the radiator structure includes heat dissipation master interconnected
Face and interconnecting piece, wherein the heat dissipation interarea is fixed on the back side of the substrate, and the interconnecting piece is set to the peace of the substrate
Dress face side.
5. installation base plate according to claim 4, which is characterized in that the interconnecting piece be formed as Heat Conduction Material described in
The side of the mounting surface close to the substrate in heat dissipation interarea extends the master of package to the substrate along the mounting surface
Face and the interarea formed a conductive structure extension bending part.
6. installation base plate according to claim 4, which is characterized in that the installation base plate further includes connection terminal, described
Connection terminal and the radiator structure physical connection, and pass through the interarea that the substrate extends to the substrate.
7. installation base plate according to claim 6, which is characterized in that the interconnecting piece is by the heat dissipation interarea along it
Raised pin vertical direction protrusion and be bent to form to the mounting surface.
8. installation base plate according to claim 7, which is characterized in that be additionally provided with connection through-hole, institute on the substrate
It states connection terminal and extends package to the interarea of the substrate across the connection through-hole.
9. a kind of light emitting device, which is characterized in that including such as described in any item installation base plates of claim 1-7, and be set to
Luminescent device on the interarea of the installation base plate is additionally provided between the back side and the radiator structure of the luminescent device
Heat-conducting layer, by the heat-conducting layer by generated heat transfer in the luminescent device course of work to the radiator structure
On.
10. light emitting device according to claim 9, which is characterized in that it further include encapsulation glue-line, the encapsulation glue-line setting
In on the interarea of the substrate, and cover the luminescent device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910340708.4A CN110112278A (en) | 2019-04-25 | 2019-04-25 | A kind of installation base plate and its light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910340708.4A CN110112278A (en) | 2019-04-25 | 2019-04-25 | A kind of installation base plate and its light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110112278A true CN110112278A (en) | 2019-08-09 |
Family
ID=67486716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910340708.4A Pending CN110112278A (en) | 2019-04-25 | 2019-04-25 | A kind of installation base plate and its light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110112278A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003188424A (en) * | 2001-12-18 | 2003-07-04 | Sharp Corp | Surface-mounted light-emitting diode |
| JP2008258233A (en) * | 2007-04-02 | 2008-10-23 | Toyoda Gosei Co Ltd | Light-emitting device |
| CN101483213A (en) * | 2007-05-31 | 2009-07-15 | 安华高科技Ecbuip(新加坡)私人有限公司 | Side-emitting LED package with improved heat dissipation |
| EP2312660A2 (en) * | 2008-07-03 | 2011-04-20 | Samsung LED Co., Ltd. | An led package and a backlight unit comprising said led package |
| CN102368531A (en) * | 2011-10-26 | 2012-03-07 | 深圳市瑞丰光电子股份有限公司 | LED (light emitting diode) encapsulation structure |
| US20120120671A1 (en) * | 2010-11-11 | 2012-05-17 | Nichia Corporation | Light emitting device, and method for manufacturing circuit board |
| CN202930426U (en) * | 2012-11-21 | 2013-05-08 | 深圳市斯迈得光电子有限公司 | LED device capable of realizing application effect of different light-emitting directions |
| CN105098029A (en) * | 2014-05-21 | 2015-11-25 | 日亚化学工业株式会社 | Light emitting device |
| CN105090900A (en) * | 2014-05-21 | 2015-11-25 | 日亚化学工业株式会社 | Mounting structure for semiconductor device, backlight device and mounting substrate |
| US20150340550A1 (en) * | 2014-05-21 | 2015-11-26 | Nichia Corporation | Method of producing light emitting device |
| CN105470375A (en) * | 2014-08-26 | 2016-04-06 | 鸿富锦精密工业（深圳）有限公司 | LED package structure |
| CN208173618U (en) * | 2018-02-26 | 2018-11-30 | 东莞市华志光电科技有限公司 | A kind of bracket for slim lateral direction light emission LED |
-
2019
- 2019-04-25 CN CN201910340708.4A patent/CN110112278A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003188424A (en) * | 2001-12-18 | 2003-07-04 | Sharp Corp | Surface-mounted light-emitting diode |
| JP2008258233A (en) * | 2007-04-02 | 2008-10-23 | Toyoda Gosei Co Ltd | Light-emitting device |
| CN101483213A (en) * | 2007-05-31 | 2009-07-15 | 安华高科技Ecbuip(新加坡)私人有限公司 | Side-emitting LED package with improved heat dissipation |
| EP2312660A2 (en) * | 2008-07-03 | 2011-04-20 | Samsung LED Co., Ltd. | An led package and a backlight unit comprising said led package |
| US20120120671A1 (en) * | 2010-11-11 | 2012-05-17 | Nichia Corporation | Light emitting device, and method for manufacturing circuit board |
| CN102368531A (en) * | 2011-10-26 | 2012-03-07 | 深圳市瑞丰光电子股份有限公司 | LED (light emitting diode) encapsulation structure |
| CN202930426U (en) * | 2012-11-21 | 2013-05-08 | 深圳市斯迈得光电子有限公司 | LED device capable of realizing application effect of different light-emitting directions |
| CN105098029A (en) * | 2014-05-21 | 2015-11-25 | 日亚化学工业株式会社 | Light emitting device |
| CN105090900A (en) * | 2014-05-21 | 2015-11-25 | 日亚化学工业株式会社 | Mounting structure for semiconductor device, backlight device and mounting substrate |
| US20150340550A1 (en) * | 2014-05-21 | 2015-11-26 | Nichia Corporation | Method of producing light emitting device |
| CN105470375A (en) * | 2014-08-26 | 2016-04-06 | 鸿富锦精密工业（深圳）有限公司 | LED package structure |
| CN208173618U (en) * | 2018-02-26 | 2018-11-30 | 东莞市华志光电科技有限公司 | A kind of bracket for slim lateral direction light emission LED |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10190740B2 (en) | Light source unit and vehicle front lamp using the light source unit | |
| CN102095098B (en) | Lighting device | |
| KR100975970B1 (en) | The large illuminations with power led | |
| KR100962706B1 (en) | Manufacture method of the large illuminations with power led | |
| KR200449331Y1 (en) | Chip LED lighting device | |
| JP2006049026A (en) | Led illumination light source | |
| CN105006515B (en) | A kind of LED chip radiator structure | |
| KR101427121B1 (en) | Lighting fixture using lighting emitting diode | |
| US8872300B2 (en) | Light emitting device module | |
| CN110112278A (en) | A kind of installation base plate and its light emitting device | |
| JP3158243U (en) | Light emitting diode heat dissipation module | |
| KR101875499B1 (en) | Metal printed circuit board enhancing radiation of heat for outdoor led lighting | |
| EP2325557A1 (en) | Illumination device with heat dissipation structure | |
| CN207364920U (en) | It is a kind of can bending LED module light source board | |
| CN109994457A (en) | A kind of LED illuminating part | |
| US8333486B2 (en) | Illumination device with heat dissipation structure | |
| CN207334388U (en) | One kind is based on display device LED backlight module and display device | |
| CN219300677U (en) | Car light source and car | |
| CN101319773A (en) | Luminous module | |
| CN202229013U (en) | Light emitting diode (LED) street lamp | |
| CN218993310U (en) | High-power patch type light-emitting diode | |
| CN205048323U (en) | Two -sided light -emitting thin slice formula LED car headlight | |
| CN212874540U (en) | Thermoelectric separation type high-power surface-mounted LED raised head lamp bead | |
| CN215908904U (en) | Light source module, lighting device and display device | |
| CN216698411U (en) | Base plate assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190809 |
|
| RJ01 | Rejection of invention patent application after publication |