CN110112076A - Circuit package method and encapsulating structure - Google Patents
Circuit package method and encapsulating structure Download PDFInfo
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- CN110112076A CN110112076A CN201910362608.1A CN201910362608A CN110112076A CN 110112076 A CN110112076 A CN 110112076A CN 201910362608 A CN201910362608 A CN 201910362608A CN 110112076 A CN110112076 A CN 110112076A
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 claims abstract description 232
- 239000007789 gas Substances 0.000 claims description 18
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 239000004411 aluminium Substances 0.000 claims description 13
- 210000000078 claw Anatomy 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 7
- 239000011231 conductive filler Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 15
- 238000005538 encapsulation Methods 0.000 abstract description 13
- 230000001681 protective effect Effects 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000013016 damping Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 150000001398 aluminium Chemical class 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present invention provides a kind of circuit package method and encapsulating structures, belong to circuit package technical field.Circuit package method provided by the invention is the following steps are included: connect input interface and output interface for functional circuit；Functional circuit is placed in the first packaging body；The first packaging body is sealed after being filled with stability gas；First packaging body is packed into and is fixed on the second packaging body, and the second packaging body is closed, and the outer end of input interface and the outer end of output interface is made to expose the second packaging body.Circuit encapsulating structure provided by the invention includes the first packaging body, the second packaging body, input interface and output interface.The present invention provides a kind of circuit package methods and encapsulating structure can be improved the comprehensive protection effect of functional circuit, the mode of the double-deck encapsulation and the form of coaxial packaging can play protective action by the higher layer structure of intensity simultaneously, and internal layer plays the role of air-tight packaging, to reduce the volume after encapsulation, and facilitate installation.
Description
Technical field
The invention belongs to circuit package technical fields, are to be related to a kind of circuit package method and encapsulation knot more specifically
Structure.
Background technique
High-Power Microwave (HPM) refers to that Instantaneous peak power is more than 100MW, and radiation wavelength is centimetre to millimeter range, i.e.,
Coherent electromagnetic radiation source of the frequency between 0.3GHz~300GHz.Fast development and electronic countermeasure in high power microwave weapon
In the case where the reaching its maturity of technology, the electromagnetic environment that current electronic equipment is faced is more complicated, and suffered threat is more
It is huge.High-Power Microwave is because of characteristics such as its power height, frequency height, interference to electronic equipment and very harmful, for high power
The protection requirements of microwave weapon are more more and more urgent.Traditional HPM limiter is in order to obtain preferable heat dissipation effect, mainly with naked base
Piece circuit is installed additional after aluminium box carries out simplified package and is used, due to this aluminium box there are intensity low, poor seismic behavior, intolerant to abrasion and
Burn into is difficult to the problem of carrying out air-tight packaging etc., tends in complex condition because of temperature humidity variation, acutely shake
Dynamic, corrosive liquids or gas infiltration etc. cause amplitude limiter circuit or functional module to damage, and protective performance is poor, if to guarantee
Its air-tightness, it is necessary to box body be thickeied and increased, cause its volume larger, be unable to satisfy the requirement of miniaturization；Meanwhile tradition
Two interfaces when carrying out air-tight packaging of HPM limiter must be positioned at the same end, but the interface of this form is when in use
It is not easy to install.
Summary of the invention
It is existing in the prior art to solve the purpose of the present invention is to provide a kind of circuit package method and encapsulating structure
The technical issues of cannot be considered in terms of miniaturization, air-tight packaging and strong protective performance after limiter encapsulation.
To achieve the above object, the technical solution adopted by the present invention is that: a kind of circuit package method, including following step are provided
It is rapid:
The input terminal of functional circuit is connected into input interface, output end connects output interface；
Functional circuit is placed in the first packaging body, and the outer end of input interface and the outer end of output interface is made to expose first
Packaging body；
The first packaging body is sealed after being filled with stability gas；
First packaging body is packed into and is fixed on the second packaging body, and the second packaging body is closed, and make input interface
Outer end and the coaxial arrangement of the outer end of output interface and the second packaging body of exposing.
Further, in circuit package method above-mentioned, the first packaging body is packed into and is fixed on the second packaging body and is incited somebody to action
The step of second packaging body is closed further include:
Be equipped with external screw thread outside first packaging body, it is being equipped in the second package interior, for cooperating with external screw thread in
Thermal conducting agent is coated on screw thread；
First packaging body is screwed in the second packaging body by helicitic texture；
Heat-conducting filler is filled between the first packaging body and the second packaging body.
Further, in circuit package method above-mentioned, the step of being filled with the sealing of the first packaging body after stability gas
Further include:
It pressurizes into the first packaging body；
The step of first packaging body is packed into and is fixed on the second packaging body further include:
Second packaging body is sealed, and the second packaging body is depressurized, makes the first packaging body is inside and outside to generate pressure difference.
Further, in circuit package method above-mentioned, the first packaging body is aluminium box, and functional circuit thermal conductivity is fixed on aluminium
In box, stability gas is nitrogen, and aluminium box carries out airtight sealing using laser welding.
The present invention provides a kind of circuit encapsulating structure, including the first packaging body, the second packaging body, input interface and output connect
Mouthful, the first packaging body is used for hermetically sealed functional circuit；Second package interior is equipped with the cavity for being packed into the first packaging body；
The connection of the input terminal of input interface one end and functional circuit, the other end passes through the first packaging body and the second packaging body extends to second
Outside one end of packaging body；The connection of the output end of output interface one end and functional circuit, the other end pass through the first packaging body and the
Two packaging bodies extend to outside the other end of the second packaging body；Input interface and output interface coaxial arrangement.
Further, in circuit encapsulating structure above-mentioned, external screw thread, the second package interior are equipped with outside the first packaging body
Equipped with the internal screw thread cooperated with external screw thread；External screw thread be set to the first packaging body middle part or one end, the first packaging body it is another
Cross sectional dimensions of the end cross-sectional size less than the second package interior cavity；Be equipped with outside first packaging body not with internal screw thread
The gap slot of contact.
Further, in circuit encapsulating structure above-mentioned, the second packaging body both ends are equipped with for connecting with equipment is used
Hickey, input interface includes that both ends are respectively used to connect with one end of the input terminal of functional circuit and the second packaging body
Input needle, output interface include both ends be respectively used to connect with the other end of the output end of functional circuit and the second packaging body it is defeated
Needle out, and input needle and be overlapped with the axis for exporting needle.
Further, in circuit encapsulating structure above-mentioned, the second packaging body includes sleeve body, the first closure connector and second
Connector is blocked, is equipped with cavity inside sleeve body；For connecting with equipment is used, the other end is used for and set for first closure connector one end
The connection of cylinder one end, middle part are equipped with the first through hole passed through for input interface；Second closure connector one end is used to set with using
Standby connection, for the other end for connecting with the sleeve body other end, middle part is equipped with the second through-hole passed through for output interface.
Further, in circuit encapsulating structure above-mentioned, first, which blocks connector, is equipped with the first rubber mat, sets on the first rubber mat
There is first through hole, both ends are equipped in first through hole and are respectively used to the first conducting connecting part connecting with using equipment and input needle；
Second, which blocks connector, is equipped with the second rubber mat, and the second rubber mat is equipped with the second through-hole, is respectively used in the second through-hole equipped with both ends
With the second conducting connecting part for using equipment and output needle to connect；First conducting connecting part both ends are equipped with several to be located in petaloid
First claw of first through hole inner wall；Second conducting connecting part both ends, which are equipped with, several is located at the of the second through-hole wall in petaloid
Two claws.
Further, in circuit encapsulating structure above-mentioned, the first closure connector and the second closure connector are logical with sleeve body
Cross screw thread auxiliary structure, connected structure connection or clamping structure connection；The axis of first through hole is overlapped with the axis of the second through-hole；Set
The clamping structure for being clamped with pliers is equipped on cylinder, the first closure connector and the second closure connector；First packaging body is
Aluminum sealed box body, it is steel structure that sleeve body, the first closure connector and second, which block connector,；Sleeve body and the first packaging body
Between be equipped with conductive filler body.Radiating fin is additionally provided with outside sleeve body, radiating fin is parallel with sleeve body axis.
The beneficial effect of circuit package method provided by the invention is: compared with prior art, the present invention is by
It is hermetically sealed after injection stability gas in one packaging body 10, it can be avoided extraneous gas or liquid enter, to functional circuit 60
It impacts, to make functional circuit 60 always in steady-working state；The second envelope is packed into further through by the first packaging body 10
Body 20 is filled, is protected using dual packaged mode, the comprehensive protection of the progress to inner function circuit 60, and encapsulating
When input interface 30 and output interface 40 is exposed, so that functional circuit 60 is located at core, obtaining preferable protection effect
While, do not influence normal use.Second packaging body 20 can protect the first packaging body 10, avoid external corrosion, shock,
Friction etc. causes the air-tightness of the first packaging body 10 to damage；The mode of the double-deck encapsulation can also play certain vibration damper and make simultaneously
With, and in two layers of encapsulating structure specification and material difference, it can reduce influence of the covibration to functional circuit 60, finally
Improve the protection effect of functional circuit 60；The mode of the double-deck encapsulation and the form of coaxial packaging can be higher by intensity simultaneously
Layer structure plays the role of protective action, and internal layer plays air-tight packaging, to reduce the volume after encapsulation, and facilitates peace
Dress.
The beneficial effect of circuit encapsulating structure provided by the invention is: compared with prior art, the present invention passes through nesting
First packaging body and the second packaging body are set, functional circuit is made to be located at the core of protection, functional circuit passes through input interface
Signal is transmitted with output interface, does not influence to use, and the double protection of the first packaging body and the second packaging body acts on, and can be right
The comprehensive protection of the progress of inner function circuit.The sealing of first packaging body, can be avoided extraneous gas or liquid enters, to function
Energy circuit impacts, and the second encapsulation physical efficiency protects the first packaging body, and external corrosion, shock, friction etc. is avoided to make
It is damaged at the air-tightness of the first packaging body；The double-layer structure of the first packaging body and the second packaging body can also play certain subtract simultaneously
Shock-absorbing effect is shaken, and in the first packaging body and the second package body structure specification and material difference, can reduce covibration
Influence to functional circuit；Input interface and output interface coaxial arrangement simultaneously, can prevent the rotation of the second packaging body from causing
Input interface and output interface do not rotate coaxially, and then avoid because of damage caused by not rotating coaxially, while can be conveniently logical
It crosses and twists the second packaging body around axis, input interface and output interface are connect with using equipment.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without any creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the flow diagram for the circuit package method that an embodiment of the present invention provides；
Fig. 2 is the flow diagram for the circuit package method that another embodiment of the present invention provides；
Fig. 3 is the sectional structure along axis in the horizontal direction for the circuit encapsulating structure that an embodiment of the present invention provides
Schematic diagram；
Fig. 4 is that the vertical sectional structure along axis for the circuit encapsulating structure that another embodiment of the present invention provides is illustrated
Figure；
Fig. 5 is the section view on direction perpendicular to the axis for the circuit encapsulating structure that another embodiment of the present invention provides
Structural schematic diagram；
Fig. 6 is the second closure connector of the circuit encapsulating structure that Fig. 3 embodiment of the present invention provides in the direction of vertical axis
On schematic cross-sectional view.
Wherein, each appended drawing reference in figure:
The first packaging body of 10-；11- external screw thread；12- gap slot；
The second packaging body of 20-；
21- internal screw thread；22- sleeve body；23- first blocks connector；24- second blocks connector；
The first rubber mat of 25-；The second rubber mat of 26-；27- radiating fin；
The first conducting connecting part of 28-；The second conducting connecting part of 29-；
30- input interface；
40- output interface；
50- conductive filler body；
60- functional circuit.
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
Now a kind of circuit package method provided by the invention and encapsulating structure are illustrated.
Referring to Fig. 1, the circuit package method, comprising the following steps:
The input terminal of functional circuit 60 is connected into input interface 30, output end connects output interface 40；
Functional circuit 60 is placed in the first packaging body 10, and makes the outer end of input interface 30 and the outer end of output interface 40
Expose the first packaging body 10；
The first packaging body 10 is sealed after being filled with stability gas；
First packaging body 10 is packed into and is fixed on the second packaging body 20, and the second packaging body 20 is closed, and make to input
The outer end of interface 30 and the outer end coaxial arrangement of output interface 40 and the second packaging body 20 of exposing.
Functional circuit 60 referred herein is that amplitude limiter circuit etc. has certain function circuit, especially naked substrate circuit.
Stability gas refers to that nitrogen, inert gas etc. will not or be not easy the gas to react with functional circuit 60 and the first packaging body 10
Body.
Circuit package method provided by the invention is stablized by injecting into the first packaging body 10 compared with prior art
Property gas after it is hermetically sealed, can be avoided extraneous gas or liquid enters, and impacts to functional circuit 60, to keep function electric
Road 60 is in steady-working state always；It is packed into the second packaging body 20 further through by the first packaging body 10, using dual packaged side
Formula is protected, the comprehensive protection of the progress to inner function circuit 60, and when packaged by input interface 30 and output
Interface 40 is exposed, and functional circuit 60 is made to be located at core, while obtaining preferable protection effect, does not influence normally to make
With；Second packaging body 20 can protect the first packaging body 10, and external corrosion, shock, friction etc. is avoided to cause the first encapsulation
The air-tightness of body 10 is damaged；And the mode of the double-deck encapsulation can also play the role of certain vibration damper, and encapsulate at two layers
When structure and specification and material difference, influence of the covibration to functional circuit 60 can reduce, final raising functional circuit 60
Protection effect；The mode of the double-deck encapsulation and the form of coaxial packaging can play protection by the higher layer structure of intensity simultaneously
Effect, and internal layer plays the role of air-tight packaging, to reduce the volume after encapsulation, and facilitates installation.
Referring to Fig. 2, a kind of specific embodiment as circuit package method provided by the invention, by the first packaging body
10 are packed into and are fixed on the second packaging body 20 and close the second packaging body 20, the step of further include:
External screw thread 11 is equipped with outside first packaging body 10, it is being equipped with inside the second packaging body 20, for matching with external screw thread
It is coated with thermal conducting agent on the internal screw thread 21 of conjunction, in order to which screw thread knot can be passed through between the first packaging body 10 and the second packaging body 20
Structure carries out effectively stable heat transmitting；
First packaging body 10 is screwed in the second packaging body 20 by helicitic texture, thermal conducting agent is made to be filled in helicitic texture
In；
Heat-conducting filler is filled between the first packaging body 10 and the second packaging body 20, to enhance the thermally conductive of other positions.
Since double-deck packaged type is unfavorable for radiating, carried out between the first packaging body 10 and the second packaging body 20
Conductive filler being capable of effective heat radiation performance.
Thermal conducting agent and heat-conducting filler can be after the first packaging body 10 is packed into the second packaging body 20 liquid filled or
Solid filling not only plays conductive force, but also plays filling and bonding effect, prevents the first packaging body 10 in the second packaging body 20
Interior shaking.
Referring to Fig. 2, a kind of specific embodiment as circuit package method provided by the invention, is filled with stability gas
The step of the first packaging body 10 is sealed after body further include:
It pressurizes into the first packaging body 10, pressure in the first packaging body 10 is made to be higher than standard atmospheric pressure；
The step of first packaging body 10 is packed into and is fixed on the second packaging body 20 further include:
Second packaging body 20 is sealed, and the second packaging body 20 is depressurized, pressure in the second packaging body 20 is made to be lower than standard
Atmospheric pressure, and then make the inside and outside generation pressure difference of the first packaging body 10.
Optionally, pressure is 120-180kPa in the first packaging body 10, and pressure is 20-80kPa in the second packaging body 20.?
Under the action of lesser pressure difference, the work of functional circuit 60 is unaffected, but aluminium box can generate small expansion and become
Shape, thus being capable of contact and fixation more closely with the second packaging body 20；Simultaneously to depressurizing and can make in the second packaging body 20
Heat-conducting filler expansion, volume increase, more fully contact with the first packaging body 10 and the second packaging body 20, enhance thermally conductive effect
Fruit.The pressure of other second packaging body 20 is less than external atmosphere pressure, is conducive to the compactness for keeping the second packaging body 20, keeps away simultaneously
The temperature rise for exempting to generate when functional circuit 60 works leads to 20 distending of the second packaging body.
Optionally, the first packaging body 10 is aluminium box, and 60 thermal conductivity of functional circuit is fixed in aluminium box, and stability gas is nitrogen
Gas, aluminium box carry out airtight sealing using laser welding.
Also referring to Fig. 3 to Fig. 5, the present invention provides a kind of circuit encapsulating structure, including the first packaging body 10, the second envelope
Body 20, input interface 30 and output interface 40 are filled, the first packaging body 10 is used for hermetically sealed functional circuit 60；Second packaging body 20
Inside is equipped with the cavity for being packed into the first packaging body 10；30 one end of input interface is connect with the input terminal of functional circuit 60, separately
One end passes through the first packaging body 10 and the second packaging body 20 extends to outside one end of the second packaging body 20；40 one end of output interface
It is connect with the output end of functional circuit 60, the other end passes through the first packaging body 10 and the second packaging body 20 extends to the second packaging body
Outside 20 other end；Input interface 30 and output interface 40 are coaxially disposed.Here coaxial arrangement refers to that interface is disposed opposite to each other
And its axis is identical.
The first packaging body 10 and the is arranged by nesting compared with prior art in circuit encapsulating structure provided by the invention
Two packaging bodies 20, make functional circuit 60 be located at the core of protection, and functional circuit 60 passes through input interface 30 and output interface
40 transmitting signals, do not influence to use, and the double protection of the first packaging body 10 and the second packaging body 20 acts on, and can be to inside
The comprehensive protection of the progress of functional circuit 60.The sealing of first packaging body 10, can be avoided extraneous gas or liquid enters, to function
Energy circuit 60 impacts, and the second packaging body 20 can protect the first packaging body 10, avoid external corrosion, hit, rub
Wiping etc. causes the air-tightness of the first packaging body 10 to damage；The double-layer structure of the first packaging body 10 and the second packaging body 20 can also simultaneously
Play the role of certain vibration damper, and when the first packaging body 10 is with 20 structure and specification of the second packaging body and material difference,
It can reduce influence of the covibration to functional circuit 60；Input interface 30 and output interface 40 are coaxially disposed simultaneously, Neng Goufang
Only the rotation of the second packaging body 20 causes not rotating coaxially for input interface 30 and output interface 40, and then avoids because not turning coaxially
It damages, while can facilitate by twisting the second packaging body 20 around axis, by input interface 30 and output interface 40 caused by dynamic
It is connect with equipment is used.
Also referring to Fig. 3 and Fig. 4, as a kind of specific embodiment of circuit encapsulating structure provided by the invention,
It is equipped with external screw thread 11 outside one packaging body 10, is equipped with the internal screw thread 21 cooperated with external screw thread inside the second packaging body 20.First envelope
Dress body 10 connect the fixation for not only improving the first packaging body 10 with the second packaging body 20 by helicitic texture, avoids the first packaging body
10 tamper in the second packaging body 20, and route is caused to damage, and not will lead to the first packaging body 10 and combined with the second packaging body 20
Closely, the first packaging body 10 can also carry out small movements relative to the second packaging body 20 under the action of vibration, avoid second
The vibration of packaging body 20 is all transferred to the first packaging body 10, thus has stronger cushioning effect, is conducive to be alleviated or avoided
It is damaged caused by strenuous vibration.In addition, helicitic texture is also beneficial to the steady contact of the first packaging body 10 and the second packaging body 20,
Be conducive to keep the stabilization of heat dissipation performance.
Optionally, external screw thread 11 is set to middle part or the one end of the first packaging body 10, the other end of the first packaging body 10
Cross sectional dimensions is encapsulated less than the cross sectional dimensions of 20 internal cavities of the second packaging body in order to which the first packaging body 10 screws in second
Body 20, and by the cantilever design of the first packaging body 10, further promote the effect of damping.
Optionally, the gap slot 12 not contacted with internal screw thread 21 is equipped with outside the first packaging body 10.Gap slot 12 can be square
Just it holds or clamps the first packaging body 10 using tool, to easily screw in the first packaging body 10；And reduce external screw thread
11, with the contact of internal screw thread 21, reduce frictional force, further promote the effect of damping, and mitigate that different materials expand with heat and contract with cold is
The problem of cooperating imprecision caused by number is different or being difficult to pack into, while filling heat-conductive obturator 50 can also be facilitated.
It is defeated as a kind of specific embodiment of circuit encapsulating structure provided by the invention also referring to Fig. 3 and Fig. 4
Incoming interface 30 includes that both ends are respectively used to the input needle connecting with one end of the input terminal of functional circuit 60 and the second packaging body 20,
Output interface 40 is respectively used to connect with the other end of the output end of functional circuit 60 and the second packaging body 20 defeated including both ends
Needle out, and input needle and be overlapped with the axis for exporting needle, to prevent the rotation of the second packaging body 20 from causing input interface 30 and output
Interface 40 does not rotate coaxially, and then avoids because of damage caused by not rotating coaxially, while can facilitate by twisting around axis
Second packaging body 20, input interface 30 and output interface 40 are connect with using equipment.Input needle and output needle can be stitch
Structure is also possible to solid rigid conductive needle.
Also referring to Fig. 3 and Fig. 4, as a kind of specific embodiment of circuit encapsulating structure provided by the invention,
Two packaging bodies 20 include: that sleeve body 22, first blocks connector 23 and the second closure connector 24, are equipped with cavity inside sleeve body 22；
First closure 23 one end of connector with equipment is used for connecting, and for connecting with 22 one end of sleeve body, middle part is equipped with to be used the other end
In the first through hole that input interface 30 passes through；Second closure 24 one end of connector for being connect with equipment is used, the other end be used for
The connection of 22 other end of sleeve body, middle part are equipped with the second through-hole passed through for output interface 40.First blocks connector 23 and second
Blocking connector 24 can be detachably connected with sleeve body 22 respectively, can also make one of them and 22 integral type knot of sleeve body
Structure.It the use of equipment also include test equipment.
Optionally, the first closure connector 23 and the second closure connector 24 pass through screw thread auxiliary structure, grafting with sleeve body 22
Structure connection or clamping structure connection；The axis of first through hole is overlapped with the axis of the second through-hole, in order to keep input interface
30 and output interface 40 coaxial state.
Also referring to Fig. 3 and Fig. 4, as a kind of specific embodiment of circuit encapsulating structure provided by the invention,
One, which blocks connector 23, is equipped with the first rubber mat 25, and the first rubber mat 25 is equipped with first through hole, and first through hole and input interface 30 (can
To be input needle) interference fit, in order to by 30 clamping of input interface and junction be sealed；Second closure connector 24 is equipped with
Second rubber mat 26, the second rubber mat 26 are equipped with the second through-hole, and the second through-hole is matched with output interface 40 (can be output needle) interference
It closes, in order to by 40 clamping of output interface and seal junction.
Also referring to Fig. 3 and Fig. 6, as a kind of specific embodiment of circuit encapsulating structure provided by the invention,
One, which blocks connector 22, is equipped with the first rubber mat 24, and the first rubber mat 24 is equipped with first through hole, is equipped with both ends in first through hole and distinguishes
For with use equipment and input the first conducting connecting part 28 for connecting of needle；Second, which blocks connector 23, is equipped with the second rubber mat 25,
Second rubber mat 25 is equipped with the second through-hole, is respectively used to connect with using equipment and output needle the equipped with both ends in the second through-hole
Two conducting connecting parts 29.
Also referring to Fig. 3 and Fig. 6, as a kind of specific embodiment of circuit encapsulating structure provided by the invention,
One conducting connecting part, 28 both ends are equipped with several the first claws that first through hole inner wall is located in petaloid.First conducting connecting part 28
The first claw and input needle interference fit of inside, to clamp input needle, at this point, the first conducting connecting part 28 and input needle are constituted
Input interface 30, first claw in 28 outside of the first conducting connecting part with equipment is used for connecting.Second conducting connecting part 29
Both ends are equipped with several the second claws that the second through-hole wall is located in petaloid.Second claw of 29 inside of the second conducting connecting part
It is interference fitted with input needle, to clamp input needle, at this point, the second conducting connecting part 29 and input needle constitute input interface 30, the
Second claw in two conducting connecting parts, 29 outside with equipment is used for connecting.First rubber mat 25 and the second rubber mat 26 can be poly-
Tetrafluoro medium.The elastic construction that polytetrafluoro medium and the first claw, the second claw are formed is by needle clamping.
Also referring to Fig. 3 to Fig. 5, as a kind of specific embodiment of circuit encapsulating structure provided by the invention, set
Cylinder 22, first blocks the clamping structure being equipped on connector 23 and the second closure connector 24 for being clamped with pliers；First envelope
Dress body 10 is aluminum sealed box body, and it is steel structure that sleeve body 22, first, which blocks connector 23 and the second closure connector 24,；Sleeve
Conductive filler body 50 is equipped between body 22 and the first packaging body 10.Conductive filler body 50, which can be, is packed into the in the first packaging body 10
The liquid or solid filling filled after two packaging bodies 20, not only play conductive force, but also play filling and bonding effect, prevent
One packaging body 10 shakes in the second packaging body 20.
Referring to Fig. 5, a kind of specific embodiment as circuit encapsulating structure provided by the invention, outside sleeve body 22
It is additionally provided with radiating fin 27, radiating fin 27 is parallel with 22 axis of sleeve body.Radiating fin 27 can promote whole thermal diffusivity
Can, and can facilitate and twist the second packaging body 20 around axis, input interface 30 and output interface 40 are connect with using equipment,
The intensity of the second packaging body 20 of enhancing is also helped simultaneously, is promoted the second packaging body 20 and is supported shock proof ability.In addition radiating fin
When piece 27 is cantilever design, moreover it is possible to it generates and shakes in the environment of strenuous vibration, and and windage, it plays certain antidetonation and disappears
It can effect.
The double-layer coaxial air-tight packaging of circuit encapsulating structure provided by the invention, form is simple, conveniently, high reliablity,
Different functions can also be realized by changing inner function circuit 60, can be used for air-tightness coaxial attenuator, coaxial clipping
The encapsulation of the products such as device.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of circuit package method, which comprises the following steps:
The input terminal of functional circuit (60) is connected into input interface (30), output end connects output interface (40)；
Functional circuit (60) are placed in the first packaging body (10), and make outer end and the output interface (40) of input interface (30)
Expose first packaging body (10) in outer end；
First packaging body (10) is sealed after being filled with stability gas；
First packaging body (10) is packed into and is fixed on the second packaging body (20), and second packaging body (20) is sealed
It closes, and makes the outer end of input interface (30) and the outer end coaxial arrangement of output interface (40) and expose second packaging body
(20)。
2. circuit package method as described in claim 1, which is characterized in that first packaging body (10) to be packed into and fix
In the second packaging body (20) and by second packaging body (20) close the step of, further includes:
External screw thread (11) are equipped with outside first packaging body (10), it is being equipped with inside second packaging body (20), be used for
Thermal conducting agent is coated with on the internal screw thread (21) of external screw thread cooperation；
First packaging body (10) is screwed in second packaging body (20) by helicitic texture；
Heat-conducting filler is filled between first packaging body (10) and second packaging body (20).
3. circuit package method as claimed in claim 2, which is characterized in that encapsulated after being filled with stability gas by described first
The step of body (10) seals, further includes:
The pressurization into first packaging body (10)；
The step of first packaging body (10) is packed into and is fixed on the second packaging body (20) further include:
Second packaging body (20) is sealed, and second packaging body (20) is depressurized, keeps the first packaging body (10) inside and outside
Generate pressure difference.
4. circuit package method as described in claim 1, it is characterised in that: first packaging body (10) is aluminium box, described
Functional circuit (60) thermal conductivity is fixed in the aluminium box, and the stability gas is nitrogen, and the aluminium box uses laser welding
Carry out airtight sealing.
5. a kind of circuit encapsulating structure being packaged using circuit package method according to any one of claims 1-4,
It is characterized in that, comprising:
First packaging body (10) is used for hermetically sealed functional circuit (60)；
Second packaging body (20), inside are equipped with the cavity for being packed into first packaging body (10)；
Input interface (30), one end are connect with the input terminal of the functional circuit (60), and the other end passes through first packaging body
(10) it is extended to outside one end of second packaging body (20) with second packaging body (20)；And
Output interface (40), one end are connect with the output end of the functional circuit (60), and the other end passes through first packaging body
(10) it is extended to outside the other end of second packaging body (20) with second packaging body (20)；
The input interface (30) and the output interface (40) coaxial arrangement.
6. circuit encapsulating structure as claimed in claim 5, it is characterised in that: be equipped with outer spiral shell outside first packaging body (10)
Line (11), second packaging body (20) is internal to be equipped with the internal screw thread (21) cooperated with the external screw thread；The external screw thread (11)
Middle part or one end set on first packaging body (10), the other end cross sectional dimensions of first packaging body (10) are small
In the cross sectional dimensions of the second packaging body (20) internal cavities；Be equipped with outside first packaging body (10) not with it is described interior
The gap slot (12) of screw thread (21) contact.
7. circuit encapsulating structure as claimed in claim 5, it is characterised in that: the second packaging body (20) both ends are all provided with useful
In with the hickey that uses equipment to connect, the input interface (30) includes that both ends are respectively used to and the functional circuit (60)
The input needle that is connected with one end of second packaging body (20) of input terminal, the output interface (40) includes that both ends are used respectively
In the output needle being connect with the other end of the output end of the functional circuit (60) and second packaging body (20), and it is described defeated
Enter needle to be overlapped with the axis of the output needle.
8. circuit encapsulating structure as claimed in claim 7, which is characterized in that second packaging body (20) includes:
Sleeve body (22), inside are equipped with the cavity；
First blocks connector (23), and for connecting with equipment is used, the other end is used to connect with the sleeve body (22) one end for one end
It connects, middle part is equipped with the first through hole passed through for the input interface (30)；And
Second blocks connector (24), and for connecting with equipment is used, the other end is used for and the sleeve body (22) other end for one end
Connection, middle part are equipped with the second through-hole passed through for the output interface (40).
9. circuit encapsulating structure as claimed in claim 8, it is characterised in that: described first, which blocks connector (22), is equipped with first
Rubber mat (24), first rubber mat (24) are equipped with the first through hole, be equipped in the first through hole both ends be respectively used to
The first conducting connecting part (28) connected using equipment with the input needle；Described second, which blocks connector (23), is equipped with the second glue
It pads (25), second rubber mat (25) is equipped with second through-hole, is equipped with both ends in second through-hole and is respectively used to and makes
The second conducting connecting part (29) connected with equipment with the output needle；First conducting connecting part (28) is if both ends are equipped with
Dry the first claw that the first through hole inner wall is located in petaloid；Second conducting connecting part (29) both ends, which are equipped with, several is in
Petaloid is located at the second claw of second through-hole wall.
10. circuit encapsulating structure as claimed in claim 8, it is characterised in that: described first blocks connector (23) and described the
Two closure connector (24) are connect with the sleeve body (22) by screw thread auxiliary structure, connected structure or clamping structure connection；Institute
The axis for stating first through hole is overlapped with the axis of second through-hole；The sleeve body (22), described first block connector (23)
The clamping structure being equipped on connector (24) for being clamped with pliers is blocked with described second；First packaging body (10) is aluminium
Matter sealed box body, it is steel that the sleeve body (22), first closure connector (23) and described second, which block connector (24),
Structure；Conductive filler body (50) are equipped between the sleeve body (22) and first packaging body (10).The sleeve body (22)
Outside is additionally provided with radiating fin (27), and the radiating fin (27) is parallel with the sleeve body (22) axis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910362608.1A CN110112076B (en) | 2019-04-30 | 2019-04-30 | Circuit packaging method and packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910362608.1A CN110112076B (en) | 2019-04-30 | 2019-04-30 | Circuit packaging method and packaging structure |
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| CN110112076B CN110112076B (en) | 2020-11-24 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101283490A (en) * | 2005-05-13 | 2008-10-08 | 红天海底有限公司 | Articulating optical repeater for an undersea optical transmission system |
| CN203116863U (en) * | 2013-03-05 | 2013-08-07 | 北京宝力马传感技术有限公司 | Temperature transmitter |
| CN204069577U (en) * | 2014-07-11 | 2014-12-31 | 国家电网公司 | A kind of Defend salt fog fault current limiter |
| CN205564733U (en) * | 2016-03-17 | 2016-09-07 | 台达电子电源(东莞)有限公司 | Insulating encapsulation semiconductor and lock attaches structure thereof |
| CN105977221A (en) * | 2016-04-28 | 2016-09-28 | 清华大学 | Airtight packaging structure and packaging method |
| CN206432962U (en) * | 2017-01-24 | 2017-08-22 | 南京华瓯电子科技有限公司 | Surface-mount type ultra wide band limiter |
| CN208589763U (en) * | 2018-07-08 | 2019-03-08 | 晋泽兵 | A kind of fixed device of communication cable joint |
-
2019
- 2019-04-30 CN CN201910362608.1A patent/CN110112076B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101283490A (en) * | 2005-05-13 | 2008-10-08 | 红天海底有限公司 | Articulating optical repeater for an undersea optical transmission system |
| CN203116863U (en) * | 2013-03-05 | 2013-08-07 | 北京宝力马传感技术有限公司 | Temperature transmitter |
| CN204069577U (en) * | 2014-07-11 | 2014-12-31 | 国家电网公司 | A kind of Defend salt fog fault current limiter |
| CN205564733U (en) * | 2016-03-17 | 2016-09-07 | 台达电子电源(东莞)有限公司 | Insulating encapsulation semiconductor and lock attaches structure thereof |
| CN105977221A (en) * | 2016-04-28 | 2016-09-28 | 清华大学 | Airtight packaging structure and packaging method |
| CN206432962U (en) * | 2017-01-24 | 2017-08-22 | 南京华瓯电子科技有限公司 | Surface-mount type ultra wide band limiter |
| CN208589763U (en) * | 2018-07-08 | 2019-03-08 | 晋泽兵 | A kind of fixed device of communication cable joint |
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|---|---|
| CN110112076B (en) | 2020-11-24 |
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