CN110109004A - A kind of multiconductor locating test device - Google Patents
A kind of multiconductor locating test device Download PDFInfo
- Publication number
- CN110109004A CN110109004A CN201910495343.2A CN201910495343A CN110109004A CN 110109004 A CN110109004 A CN 110109004A CN 201910495343 A CN201910495343 A CN 201910495343A CN 110109004 A CN110109004 A CN 110109004A
- Authority
- CN
- China
- Prior art keywords
- sliding block
- multiconductor
- slot
- fixed
- package module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 61
- 239000013307 optical fiber Substances 0.000 claims abstract description 10
- 239000000835 fiber Substances 0.000 claims description 5
- 210000001503 joint Anatomy 0.000 claims description 3
- 238000003032 molecular docking Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 4
- 230000008054 signal transmission Effects 0.000 abstract description 3
- 238000004891 communication Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Structure Of Telephone Exchanges (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a kind of multiconductor locating test devices, the device includes multiconductor signal acquisition structure and MT optical fiber alignment structure, the multiconductor signal acquisition structure includes test board, the signal picker and package module that are fixed on the test board, and the MT optical fiber alignment structure includes firm banking, the fixed sliding block of the MT of installation on the fixed base and MT test fibre-optical splice.The present invention is acquired by signal picker and elastic current for test signal, so that electric current needle is well contacted with the pad of package module, ensure that the stability of signal transmission；MIT connector is fixed using adjustable MT fixed sliding block simultaneously, testing efficiency is provided significantly, reduces production cost.
Description
Technical field
The invention belongs to optical communication module testing technical fields, and in particular to a kind of multiconductor locating test device.
Background technique
With the arrival of internet big data era and the fast development of optical communication technology, optical module is as information light
The opto-electronic device of electronic technology field core is the basis for constructing high speed information network；Country attaches great importance to the row in recent years
The development of industry, either national defence section work or civil telecommunications are to low-power consumption, confidentiality height and high-low temperature resistant weatherability
The optical communication module demand haveing excellent performance increases at multiple, and application environment and market are constantly expanding.
However since the such package module of PLCC is different from the module of conventional plug type, need PLCC module contact direct
SMT is welded to server board, since more than contact and be pad form, the soft easy scratch of the gold-plated quality in surface layer is surveyed in production
The problems such as be easy to causeing jitter during examination, there is that testing efficiency is low, consistency is poor, product first-pass yield is low all the time
The problems such as, seriously affect production efficiency and cost.
Summary of the invention
The main purpose of the present invention is to provide a kind of multiconductor locating test devices, it is intended to solve existing method and test
What is occurred in link cannot stablize the technical problems such as power-up communication, the poor contact of MT fiber alignment, the scratch of product communication contacts.
To achieve the above object, the present invention provides a kind of multiconductor locating test device, including multiconductor signal acquisition knot
Structure and MT optical fiber alignment structure；
The multiconductor signal acquisition structure includes test board, the signal picker being fixed on the test board and encapsulation
Module, the signal picker middle part are provided with signal acquisition slot, and the signal acquisition trench bottom is provided with electric current needle, the envelope
Die-filling piece is mounted in the signal acquisition slot and the pad of the package module is contacted with electric current needle one-to-one correspondence respectively
Connection；
The MT optical fiber alignment structure includes that firm banking, the fixed sliding block of the MT of installation on the fixed base and MT are surveyed
Fibre-optical splice is tried, the sliding slot being arranged on the fixed slider bottom of the MT and the firm banking is slidably connected, and the MT that states is fixed
Slider top is provided with locating slot, and the MT test fibre-optical splice is docked with the MIT connector of the package module and butt joint is pacified
In the locating slot.
Preferably, the signal picker side is provided with elastic capping, and the elastic capping passes through buckle and the letter
Number collector other side is fastened and connected.
Preferably, package module briquetting, the package module briquetting and the envelope are additionally provided in the middle part of the elastic capping
Die-filling piece of Elastic Contact.
Preferably, the signal acquisition trench bottom surrounding is respectively arranged with elastic current needle, under each elastic current needle
End connects one to one with each pad that test board is arranged, the upper end of each elastic current needle and each contact of package module
It connects one to one.
Preferably, be provided with inverted T shaped sliding slot on the firm banking, the fixed slider bottom of the MT be provided with it is described fall
The matched inverted T shaped sliding block of T-type sliding slot, the inverted T shaped sliding block of the fixed sliding block of the MT and the inverted T shaped sliding slot of the firm banking slide
Connection.
Preferably, the inverted T shaped sliding slot two sidewalls of the firm banking be respectively arranged with location hole and with the location hole
The sliding block set screw matched, the sliding block set screw pass through the fixed sliding block of the fixed MT of the location hole.
Preferably, the sliding block set screw is socketed with retaining spring, and the sliding block set screw passes through the positioning bullet
Spring and the fixed sliding block Elastic Contact of the MT.
Preferably, the fixed slider top of the MT be provided with three rail sliding slots and with the matched MT connector pressure of the three rails sliding slot
The sliding slot of block, the three rails sliding slot two sides is triangle sliding slot, and the MT connector briquetting two sides are provided with trigonal slider, institute
It states MT connector briquetting to be slidably connected by the triangle sliding slot of the trigonal slider and the fixed sliding block of the MT, three rail is sliding
Sliding slot among slot is bar shaped sliding slot, and bar shaped sliding slot front end is provided with the locating slot.
The beneficial effects of the present invention are: the present invention is adopted by signal picker and elastic current for test signal
Collection ensure that the stability of signal transmission so that electric current needle is well contacted with the pad of package module；Simultaneously using adjustable
MIT connector is fixed in the fixed sliding block of MT, provides testing efficiency significantly, reduces production cost.
Detailed description of the invention
Fig. 1 is multiconductor locating test device structural schematic diagram of the invention；
Fig. 2 is multiconductor locating test device diagrammatic cross-section of the invention；
Fig. 3 is the enlarged diagram of package module and electric current needle of the invention；
Fig. 4 is MT optical fiber alignment structure schematic diagram of the invention；
Fig. 5 is that MT test fibre-optical splice of the invention docks schematic diagram with MIT connector；
Fig. 6 is the scheme of installation of the fixed sliding block of MT of the invention；
Fig. 7 is the scheme of installation of MT connector briquetting of the invention.
Wherein appended drawing reference are as follows: 1, firm banking, 2, the fixed sliding block of MT, 3, MT connector briquetting, 4, test board, 5, signal adopts
Storage, 6, package module, 7, electric current needle, 8, sliding block set screw, 9, MT test fibre-optical splice, 10, retaining spring.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that described herein, specific examples are only used to explain the present invention, not
For limiting the present invention.
As shown in Figure 1, being multiconductor locating test device structural schematic diagram of the invention；A kind of multiconductor assignment test dress
It sets, including multiconductor signal acquisition structure and MT optical fiber alignment structure；
The multiconductor signal acquisition structure include test board 4, the signal picker 5 being fixed on the test board 1 and
Package module 6 is provided with signal acquisition slot in the middle part of the signal picker 5, and the signal acquisition trench bottom is provided with electric current needle,
The package module 6 be mounted in the signal acquisition slot and the pad of the package module 6 respectively with the electric current needle 7 one by one
It is corresponding to connect；
The MT optical fiber alignment structure include firm banking 1, the fixed sliding block 2 of the MT being mounted on the firm banking 1 and
MT tests fibre-optical splice 9, and the sliding slot being arranged on fixed 2 bottom of sliding block the MT and the firm banking 1 is slidably connected, described to state
Is provided with locating slot at the top of the fixed sliding block 2 of MT, the MT test fibre-optical splice 9 docked with the MIT connector of the package module 6 and
Butt joint is mounted in the locating slot.
In an alternate embodiment of the present invention where, above-mentioned multiconductor signal acquisition structure is mainly used for collecting test number
According to, while guaranteeing that the signal communication in test process is stablized；Multiconductor signal acquisition structure specifically includes test board 4, signal is adopted
Storage 5 and package module 6.
Above-mentioned test board 4 uses pcb board, is fixedly mounted on 1 top of firm banking, branch in certain altitude by support column
Dagger is specifically configured to 4, enables test board is stable and firm to be fixed on firm banking 1；
Above-mentioned signal picker 5 uses square frame structure, and one side frame is provided with test through-hole, which uses
It passes through in the MIT connector of package module 6 and is docked with MT test fibre-optical splice 9；Other three frames of signal picker 5 pass through
Fixed screw is fixed on test board 4.
It is signal acquisition slot in the middle part of signal picker 5, is provided with electric current needle on the signal acquisition trench bottom, that is, test board 4,
Specially 54PIN elastic current needle, gold-plated 6~8 μ in electric current needle surface layer are respectively arranged in signal acquisition trench bottom surrounding ", elasticity
Fatigue limit 100,000 times；Each pad that the lower end of each elastic current needle is arranged with test board 4 connects one to one, each bullet
The upper end of property electric current needle and each contact of package module 6 connect one to one, so that obtained electric signal steadily be transmitted
Onto PCB test board 4, weighing wounded for product pad is efficiently solved, the problems such as the unstability of signal.
5 side of signal picker is provided with elastic capping, and the side of elastic capping passes through compressed spring and signal picker 5
The connection of a side wall, the other side of elastic capping is provided with buckle, passes through buckle and another side wall of signal picker 5 fastening
Connection；It is additionally provided with package module briquetting, package module briquetting and 6 top Elastic Contact of package module in the middle part of elastic capping, leads to
Crossing elastic capping and package module briquetting can be pressed on package module 6 in signal acquisition slot, guarantee electric current needle 7 and Encapsulation Moulds
The pad of block 6 well contacts, and is further ensured that stable signal transmission.
In an alternate embodiment of the present invention where, above-mentioned MT optical fiber alignment structure is for guaranteeing that the MIT of package module 6 connects
Head is stablized with MT test fibre-optical splice 9 dock and quick change, specifically includes firm banking 1, MT fixes sliding block 2 and MT tests optical fiber
Connector 9.
The inverted T shaped sliding slot of protrusion is provided on the middle line of above-mentioned firm banking 1, fixed 2 bottom of sliding block above-mentioned MT is provided with
It is sliding in the inverted T shaped sliding slot of firm banking 1 with the inverted T shaped sliding block of the matched inverted T shaped sliding block of inverted T shaped sliding slot, the fixed sliding block 2 of MT
It is dynamic, enable the fixed sliding block 2 of MT free to slide on firm banking 1, so as to adjust the fixed sliding block 2 of MT and signal picker 5
The distance between, and then the position of the fixed sliding block 2 of MT can be adjusted according to the MT fiber lengths of package module 6, reach test not
With the purpose of MT fiber lengths product.
On above-mentioned firm banking 1 two side walls of raised inverted T shaped sliding slot be respectively arranged with location hole and with the positioning
The matched sliding block set screw 8 in hole, location hole and sliding block set screw 8 are disposed as 4, i.e., in two sides of inverted T shaped sliding slot
Two groups of location holes and sliding block set screw 8 is respectively set in wall, and sliding block set screw 8 passes through the fixed sliding block 2 of the fixed MT of location hole；It is sliding
Retaining spring 10 is socketed on block set screw 8, sliding block set screw 8 passes through retaining spring 10 and fixed 2 elastic connecting of sliding block of MT
Touching finely tunes front and back and the left-right position of the fixed sliding block 2 of MT by sliding block set screw 8, so that two MT that docking is completed be connect
Head is accurately put into the locating slot of the fixed sliding block 2 of MT.
Be provided at the top of the fixed sliding block 2 of above-mentioned MT three rail sliding slots and with the matched MT connector briquetting 3 of three rail sliding slots, three rails are sliding
The sliding slot of slot two sides is triangle sliding slot, and 3 two sides of MT connector briquetting are provided with trigonal slider, and MT connector briquetting 3 passes through three
The triangle sliding slot of angular sliding block and the fixed sliding block 2 of MT is slidably connected, and MT connector briquetting 3 can the free skating in the fixed sliding block 2 of MT
Dynamic, the sliding slot among three rail sliding slots is bar shaped sliding slot, and bar shaped sliding slot front end is provided with locating slot.The present invention utilizes MT connector briquetting
3 slide into MT joint location, thereby may be ensured that MT connector will not be deviate from from upper end.
Present invention could apply to the contact assignment tests of PLCC and similar the mode communication module encapsulated, effectively
Solve that such package module of PLCC occurs in testing process cannot stablize power-up communication, the poor contact of MT fiber alignment,
The bad problems such as product communication contacts scratch, improve the reliability and efficiency of test, reduce manufacturing cost indirectly.
Those of ordinary skill in the art will understand that the embodiments described herein, which is to help reader, understands this hair
Bright principle, it should be understood that protection scope of the present invention is not limited to such specific embodiments and embodiments.This field
Those of ordinary skill disclosed the technical disclosures can make according to the present invention and various not depart from the other each of essence of the invention
The specific variations and combinations of kind, these variations and combinations are still within the scope of the present invention.
Claims (8)
1. a kind of multiconductor locating test device, which is characterized in that including multiconductor signal acquisition structure and MT fiber alignment knot
Structure；
The multiconductor signal acquisition structure includes test board (4), the signal picker (5) being fixed on the test board (4)
And package module (6), signal picker (5) middle part are provided with signal acquisition slot, the signal acquisition trench bottom is provided with
Electric current needle (7), the package module (6) be mounted in the signal acquisition slot and the pad of the package module (6) respectively with
The electric current needle (7), which corresponds, to be connected；
The MT optical fiber alignment structure includes firm banking (1), the MT being mounted on the firm banking (1) fixation sliding block (2)
And MT test fibre-optical splice (9), the MT fix the sliding slot sliding being arranged on sliding block (2) bottom and the firm banking (1) and connect
It connects, described state is provided with locating slot at the top of MT fixed sliding block (2), MT test fibre-optical splice (9) and the package module (6)
MIT connector docking and butt joint be mounted in the locating slot.
2. multiconductor locating test device as described in claim 1, which is characterized in that signal picker (5) side is set
It is equipped with elastic capping, the elastic capping is fastened and connected by buckling with the signal picker (5) other side.
3. multiconductor locating test device as claimed in claim 2, which is characterized in that be additionally provided in the middle part of the elastic capping
Package module briquetting, the package module briquetting and the package module (6) Elastic Contact.
4. multiconductor locating test device as claimed in claim 3, which is characterized in that the signal acquisition trench bottom surrounding point
It is not provided with elastic current needle, each pad that the lower end of each elastic current needle is arranged with test board (4) connects one to one,
The upper end of each elastic current needle and each contact of package module (6) connect one to one.
5. multiconductor locating test device as claimed in claim 4, which is characterized in that be provided on the firm banking (1)
Inverted T shaped sliding slot, fixed sliding block (2) bottom the MT is provided with to be consolidated with the inverted T shaped matched inverted T shaped sliding block of sliding slot, the MT
The inverted T shaped sliding block of fixed slider (2) and the inverted T shaped sliding slot of the firm banking (1) are slidably connected.
6. multiconductor locating test device as claimed in claim 5, which is characterized in that the inverted T shaped cunning of the firm banking (1)
Slot two sidewalls be respectively arranged with location hole and with the matched sliding block set screw (8) of the location hole, the sliding block set screw
(8) it is fixed sliding block (2) to pass through the fixed MT of the location hole.
7. multiconductor locating test device as claimed in claim 6, which is characterized in that sliding block set screw (8) socket
Have retaining spring (10), the sliding block set screw (8) passes through the retaining spring (10) and the MT fixed sliding block (2) elasticity
Contact.
8. multiconductor locating test device as claimed in claim 7, which is characterized in that the MT is set at the top of fixed sliding block (2)
Be equipped with three rail sliding slots and with the matched MT connector briquetting (3) of the three rails sliding slot, the sliding slot of the three rails sliding slot two sides is three
Angular sliding slot, MT connector briquetting (3) two sides are provided with trigonal slider, and the MT connector briquetting (3) passes through the triangle
Shape sliding block and the triangle sliding slot of the MT fixed sliding block (2) are slidably connected, and the sliding slot among the three rails sliding slot is sliding for bar shaped
Slot, bar shaped sliding slot front end are provided with the locating slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910495343.2A CN110109004B (en) | 2019-06-10 | 2019-06-10 | Multi-contact positioning testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910495343.2A CN110109004B (en) | 2019-06-10 | 2019-06-10 | Multi-contact positioning testing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110109004A true CN110109004A (en) | 2019-08-09 |
| CN110109004B CN110109004B (en) | 2024-06-18 |
Family
ID=67494370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910495343.2A Active CN110109004B (en) | 2019-06-10 | 2019-06-10 | Multi-contact positioning testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110109004B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0305951A1 (en) * | 1987-08-31 | 1989-03-08 | Everett/Charles Contact Products Inc. | Testing of integrated circuit devices on loaded printed circuit boards |
| DE19638402A1 (en) * | 1995-09-19 | 1997-03-20 | Unitechno Inc | Test component for semiconductor chip in multi-contact integrated circuit |
| CN204154753U (en) * | 2014-09-17 | 2015-02-11 | 常熟实盈光学科技有限公司 | A kind of novel encapsulated chip testing jig |
| CN105158524A (en) * | 2015-08-25 | 2015-12-16 | 贵州航天计量测试技术研究所 | Universal test fixture for surface mounted technology (SMT)-based diode components |
| CN210142165U (en) * | 2019-06-10 | 2020-03-13 | 成都鸿芯光电通信有限公司 | Multi-contact positioning testing device |
-
2019
- 2019-06-10 CN CN201910495343.2A patent/CN110109004B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0305951A1 (en) * | 1987-08-31 | 1989-03-08 | Everett/Charles Contact Products Inc. | Testing of integrated circuit devices on loaded printed circuit boards |
| DE19638402A1 (en) * | 1995-09-19 | 1997-03-20 | Unitechno Inc | Test component for semiconductor chip in multi-contact integrated circuit |
| CN204154753U (en) * | 2014-09-17 | 2015-02-11 | 常熟实盈光学科技有限公司 | A kind of novel encapsulated chip testing jig |
| CN105158524A (en) * | 2015-08-25 | 2015-12-16 | 贵州航天计量测试技术研究所 | Universal test fixture for surface mounted technology (SMT)-based diode components |
| CN210142165U (en) * | 2019-06-10 | 2020-03-13 | 成都鸿芯光电通信有限公司 | Multi-contact positioning testing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110109004B (en) | 2024-06-18 |
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