CN110108726A - A kind of Full-automatic optical detecting system for chip detection - Google Patents
A kind of Full-automatic optical detecting system for chip detection Download PDFInfo
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- CN110108726A CN110108726A CN201910367241.2A CN201910367241A CN110108726A CN 110108726 A CN110108726 A CN 110108726A CN 201910367241 A CN201910367241 A CN 201910367241A CN 110108726 A CN110108726 A CN 110108726A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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Abstract
The present invention discloses a kind of Full-automatic optical detecting system for chip detection, it include: objective table, handling equipment, acquisition device, detection system, chip image information on acquisition device shooting objective table is controlled, and whether qualified according to the solder joint of chip gold thread and pin in chip image information analysis and judgment chip；Logic control module, chip to be checked is placed in objective table for controlling handling equipment, control objective table is moved to the shooting area of acquisition device, the chip detected on objective table is removed, the object of the present invention is to provide a kind of methods for making to replace traditional visual inspection chip, it is moved by advanced machine learning software, control manipulator, objective table according to instruction using advanced computer technology and artificial intelligence technology；Product is scanned with high power camera, obtains the image information of solder joint on chip gold thread and pin, the quality of butt welding point is judged, full-automatic detection is realized.
Description
Technical field
The present invention relates to a kind of Full-automatic optical detecting systems for chip detection.
Background technique
The production process of carrier of the chip as integrated circuit, IC chip is designed into chip foundry from chip companies
The packaging and testing of Feng Ce factory are arrived in factory's production again, are finally purchased by complete machine quotient.Feng Ce factory determines core in the packaging and testing stage during this
The yield of piece, to influence product benefit.Therefore efficient chip detecting method is particularly important, traditional chip detection
Industry is labor-intensive production.Currently, chip detection mainly manually with the naked eye checks every gold thread pole under the microscope
The welding quality of its two end pad, traditional artificial detection need to put into the detection people that a large amount of man power and material goes culture profession
Member, and controllability when artificial detection is poor, operation can generate visual fatigue under long-time high-power microscope, and chip detection is implemented
Overall process is controllably more difficult.Also have at least partially through machine vision technique and carry out chip detection, such as public affairs on March 30th, 2016
A kind of patent of invention CN 105448782A " chip vision detection system " of cloth, compared with traditional artificial detection, though efficiency has
It is improved, but there are also shortcomings.Specific disadvantage is as follows:
1, specific chi frame is needed, chip cannot be placed arbitrarily；
2, sensor is needed to take pictures to trigger camera, it can not real-time display image information；
3, there is no chip grabbing device, need to manually replace chip；
4, there is no light source, camera can not shoot the image of high-resolution.
Summary of the invention
The object of the present invention is to provide a kind of Full-automatic optical detecting system for chip detection, solve by artificial next
Detection chip leads to the problem of inefficient and the deficiencies in the prior art.
In order to achieve the above object, the present invention uses following scheme:
A kind of Full-automatic optical detecting system for chip detection, comprising:
Objective table for chip placement and can realize the path planning of detection to any direction movement；
Chip to be checked is placed on objective table or removes from objective table for grabbing chip to be checked by handling equipment；
Acquisition device, for obtaining chip image information on objective table；
Detection system, control acquisition device shoot chip image information on objective table；Receive the chip that acquisition device is sent
Image information, and it is whether qualified according to the solder joint of chip gold thread and pin in chip image information analysis and judgment chip；
Chip to be checked is placed in objective table for controlling handling equipment by Logic control module, and control objective table moves
The shooting area for moving acquisition device, the movement routine of objective table is determined by the image information that detection system obtains, and control carries
Object platform detects chip in chip according to movement routine one by one, and after detection, control handling equipment will detect on objective table
Complete chip is removed；
The acquisition device is arranged above objective table；
The handling equipment is arranged in objective table side；
The Logic control module is connect with detection system, objective table, handling equipment, acquisition device signal respectively.
The further detection system includes:
Image detection algorithm module reads acquisition device chip image information collected and by image detection for receiving
Algorithm judge whether the solder joint of gold thread and pin is qualified on chip in chip, and image detection algorithm module can also will test knot
Fruit stores, and prepares for rear road production process；
Study module, chip for will obtain through image detection algorithm module and detection routing information carry out storage and right
Algorithm in image detection algorithm module is updated, and updated information is exported to Logic control module, logic control mould
Block controls objective table and determines that the movement routine of objective table examines chip in chip one by one according to the image information that detection system obtains
It surveys, after detection, Logic control module control handling equipment removes the chip detected on objective table；
Output module, for showing the judging result made through image detection algorithm module to institute's detection chip.
The preferred handling equipment is manipulator.
The preferred acquisition device is high power camera, and the image information of camera lens shooting chip is connected with detection system, can
Image to be shown on a display screen in real time.
The lighting source of illumination can be provided by being preferably equipped on the acquisition device, and it is clear to provide for the shooting of high power camera
The visual field obtain the high-definition image information of chip, the high power camera lens with light source are located at the top of objective table, simultaneously
Adjustable focal length obtains high-definition image, and also the distance between the adjustable camera lens for having light source and objective table, more smart
The quasi- image information obtained at chip welding spot.
The preferred detection system is computer.
In conclusion the present invention compared with the existing technology the beneficial effect is that:
The present invention utilizes advanced meter using the method for replacing traditional visual inspection chip, the automatic checkout system
Calculation machine technology and artificial intelligence technology control manipulator, objective table by advanced machine learning software, control logic, according to
Instruction movement, is scanned product with high power camera, obtains the image information of solder joint on chip gold thread and pin, image detection
Algoritic module is judged by image detecting technique, the quality of butt welding point, realizes full-automatic detection, which can also
It will test result to store, prepare for rear road production process, compared to the mode of artificial detection, more efficiently, economic, essence
It is quasi-.
Detailed description of the invention
Fig. 1 is structure chart of the invention；
Fig. 2 is flow chart of the invention；
In figure: 1 objective table, 2 acquisition devices, 3 handling equipments, 4 detection systems, 5 chips to be checked, 6 control connecting lines, 7
Computer, 8 chips, 9 manipulators, 10 high power cameras, 11 high power cameras and computer connection wire, 22 lighting sources.
Specific embodiment
The invention will be further described with specific embodiment for explanation with reference to the accompanying drawing:
A kind of Full-automatic optical detecting system for chip detection as shown in Fig. 1 to 2, comprising:
Objective table 1 for chip placement 5 and can realize the path planning of detection, accurately to every to any direction movement
One chip 8 quickly detects；
Chip to be checked is placed on objective table 1 or takes from objective table 1 for grabbing chip to be checked by handling equipment 3
Under, in 1 side of objective table, the handling equipment 3 is manipulator 9 for the setting of handling equipment 3；
Acquisition device 2, for obtaining chip image information on objective table 1, the acquisition device 2 is arranged on objective table 1
Side, the acquisition device 2 are high power camera 10, and the lighting source 22 of illumination can be provided by being equipped on the acquisition device 2, illumination
Light source can provide brighter shooting environmental for high power camera 10, and the high power camera 10 is located at the top of objective table 1, while can
Obtain high-definition image to adjust 10 focal length of high power camera, also between adjustable high power camera 10 and objective table 1 away from
From, more accurately obtain chip 8 image information；
Detection system 4 is computer 7, and control acquisition device 2 shoots chip image information on objective table 1；Receive acquisition dress
The chip image information of 2 transmissions is set, detection system 4 is according to 8 gold thread of chip and pin in chip image information analysis and judgment chip 5
Solder joint it is whether qualified, the detection system 4 further includes having: image detection algorithm module, for receive read 2 institute of acquisition device
The chip image information of acquisition judge whether the solder joint of gold thread and pin is qualified on chip 8 in chip 5, study module, uses
Storage is carried out and in image detection algorithm module in the chip and detection routing information that will be obtained through image detection algorithm module
Algorithm be updated；
Chip to be checked is placed in objective table 1 for controlling handling equipment 3, controls objective table 1 by Logic control module
It is moved to the shooting area of acquisition device 2, the image information moving stage 1 obtained by detection system 4 is determined in chip
The movement routine of wafer inspection simultaneously controls the core that handling equipment 3 will have been detected by the movement routine detected on objective table 1
Piece is removed, and study module is exported updated through the routing information that algorithm obtains to Logic control module；
Detection system 4 is connect with manipulator 9, objective table 1 by control connecting line 6, determines the movement routine of chip detection
With the crawl of manipulator；Detection system 4 is connect by optical camera with computer connection wire 11 with high power camera 10, reads shooting
To image information and carried out judging whether qualification by image detection algorithm, wherein detection algorithm has the function of on-line training, i.e.,
The chip picture addition original database that will test carries out on-line training, to improve the accuracy of detection；
Output module, for will calculate through image detection algorithm module the judging result progress that institute's detection chip is made
It is shown on 7 screen of machine；
The Logic control module connects with detection system 4, objective table 1, handling equipment 3,2 signal of acquisition device respectively
It connects.
A kind of flow chart of the Full-automatic optical detecting system for chip detection of the present invention, comprising the following steps:
Step 1: chip 5 to be detected is placed on objective table by manipulator 9；
Step 2: the high-definition image shot high power camera 10 by using acquisition device 2 by optical camera with
The connecting line 11 of computer passes to the study module of computer 7, image detection algorithm module, Logic control module, and in real time
It is shown on computer screen；
Step 3: allowing high power camera 10 can be accurately according to setting by Logic control module moving stage 1
Motion profile reads the image information of each chip 8, and the image detection algorithm module then passed back to again in computer 7 carries out
Detection, judges whether each chip is qualified, and the picture tested is passed to study module and further trains detection model；
Step 4: taking the core detected away by Logic control module mobile manipulator 9 after all wafers 8 detect
Piece, then repeatedly above step.
Basic principles and main features and advantages of the present invention of the invention, the skill of the industry has been shown and described above
Art personnel it should be appreciated that the present invention is not limited to the above embodiments, the above embodiments and description only describe
The principle of the present invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these
Changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and
Its equivalent thereof.
Claims (6)
1. a kind of Full-automatic optical detecting system for chip detection characterized by comprising
Objective table (1) can be moved for chip placement and to any direction；
Chip to be checked is placed on objective table (1) or takes from objective table (1) for grabbing chip to be checked by handling equipment (3)
Under；
Acquisition device (2), for obtaining chip image information on objective table (1)；
Detection system, control acquisition device (2) shoot chip image information on objective table (1)；Receive acquisition device (2) transmission
Chip image information, and it is whether qualified according to the solder joint of chip gold thread and pin in chip image information analysis and judgment chip；
Chip to be checked is placed in objective table (1) by Logic control module for controlling handling equipment (3), controls objective table
(1) it is moved to the shooting area of acquisition device (2), the image information moving stage (1) obtained by detection system, determining pair
It the movement routine of wafer inspection and is controlled handling equipment (3) in chip, by the movement routine that detects to chip in chip
It detects one by one, after detection, handling equipment (3) removes the chip detected on objective table (1)；
Acquisition device (2) setting is above objective table (1)；
The handling equipment (3) is arranged in objective table (1) side；
The Logic control module connects with detection system, objective table (1), handling equipment (3), acquisition device (2) signal respectively
It connects.
2. a kind of Full-automatic optical detecting system for chip detection according to claim 1, it is characterised in that described
Detection system includes:
Image detection algorithm module carries out judgement chip for receiving reading acquisition device (2) chip image information collected
Whether the solder joint of gold thread and pin is qualified on middle chip；
Study module, chip and detection routing information for will obtain through image detection algorithm module carry out storage and to image
Algorithm in detection algorithm is updated, and updated information is exported to Logic control module；
Output module, for showing the judging result made through image detection algorithm module to institute's detection chip.
3. a kind of Full-automatic optical detecting system for chip detection according to claim 2, it is characterised in that described
Handling equipment (3) is manipulator (9).
4. a kind of Full-automatic optical detecting system for chip detection according to claim 1, it is characterised in that described
Acquisition device (2) is high power camera (10).
5. a kind of Full-automatic optical detecting system for chip detection according to claim 1, it is characterised in that in institute
State acquisition device (2) be equipped with can provide illuminate lighting source (22).
6. a kind of Full-automatic optical detecting system for chip detection according to claim 2, it is characterised in that described
Detection system is computer (7).
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| CN201910367241.2A CN110108726A (en) | 2019-05-05 | 2019-05-05 | A kind of Full-automatic optical detecting system for chip detection |
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| CN201910367241.2A CN110108726A (en) | 2019-05-05 | 2019-05-05 | A kind of Full-automatic optical detecting system for chip detection |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110412043A (en) * | 2019-08-29 | 2019-11-05 | 武汉逸飞激光设备有限公司 | A kind of welding testing agency and welding detection method |
| CN112905440A (en) * | 2019-12-04 | 2021-06-04 | 泰科电子(上海)有限公司 | Test module and test method of artificial intelligence quality inspection system |
| CN113075231A (en) * | 2021-03-30 | 2021-07-06 | 博坤机电（苏州）有限公司 | Automatic intelligent detection method and system applied to chip DB and gold wire WB |
| CN113259591A (en) * | 2021-06-07 | 2021-08-13 | 上海聚跃检测技术有限公司 | Image acquisition method and system for chip failure analysis |
| CN113406087A (en) * | 2020-03-17 | 2021-09-17 | 广东善工科技有限公司 | Visual detection system |
| CN113433068A (en) * | 2021-07-02 | 2021-09-24 | 合肥图迅电子科技有限公司 | Detection device for detecting chip characters covered by film |
| WO2022062059A1 (en) * | 2020-09-25 | 2022-03-31 | 歌尔股份有限公司 | Nanoimprint process monitoring apparatus and method, and nanoimprinting device |
| CN114279371A (en) * | 2021-12-24 | 2022-04-05 | 中国科学院长春光学精密机械与物理研究所 | Method and device for measuring coplanarity of chip pins |
| WO2023124726A1 (en) * | 2021-12-31 | 2023-07-06 | 广东利元亨智能装备股份有限公司 | Operation control method for ccd photographic inspection, and inspection system and storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110412043A (en) * | 2019-08-29 | 2019-11-05 | 武汉逸飞激光设备有限公司 | A kind of welding testing agency and welding detection method |
| CN112905440A (en) * | 2019-12-04 | 2021-06-04 | 泰科电子(上海)有限公司 | Test module and test method of artificial intelligence quality inspection system |
| CN112905440B (en) * | 2019-12-04 | 2023-11-14 | 泰科电子(上海)有限公司 | Test module and test method of artificial intelligent quality inspection system |
| CN113406087A (en) * | 2020-03-17 | 2021-09-17 | 广东善工科技有限公司 | Visual detection system |
| WO2022062059A1 (en) * | 2020-09-25 | 2022-03-31 | 歌尔股份有限公司 | Nanoimprint process monitoring apparatus and method, and nanoimprinting device |
| CN113075231A (en) * | 2021-03-30 | 2021-07-06 | 博坤机电（苏州）有限公司 | Automatic intelligent detection method and system applied to chip DB and gold wire WB |
| CN113259591A (en) * | 2021-06-07 | 2021-08-13 | 上海聚跃检测技术有限公司 | Image acquisition method and system for chip failure analysis |
| CN113259591B (en) * | 2021-06-07 | 2021-11-05 | 上海聚跃检测技术有限公司 | Image acquisition method and system for chip failure analysis |
| CN113433068A (en) * | 2021-07-02 | 2021-09-24 | 合肥图迅电子科技有限公司 | Detection device for detecting chip characters covered by film |
| CN114279371A (en) * | 2021-12-24 | 2022-04-05 | 中国科学院长春光学精密机械与物理研究所 | Method and device for measuring coplanarity of chip pins |
| WO2023124726A1 (en) * | 2021-12-31 | 2023-07-06 | 广东利元亨智能装备股份有限公司 | Operation control method for ccd photographic inspection, and inspection system and storage medium |
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Application publication date: 20190809 |