CN110087390A - Optical modulator - Google Patents

Optical modulator Download PDF

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Publication number
CN110087390A
CN110087390A CN201910203399.6A CN201910203399A CN110087390A CN 110087390 A CN110087390 A CN 110087390A CN 201910203399 A CN201910203399 A CN 201910203399A CN 110087390 A CN110087390 A CN 110087390A
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CN
China
Prior art keywords
optical modulator
circuit board
flexible circuit
mode
electric wiring
Prior art date
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Granted
Application number
CN201910203399.6A
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Chinese (zh)
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CN110087390B (en
Inventor
加藤圭
片冈利夫
市川润一郎
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Sumitomo Osaka Cement Co Ltd
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Sumitomo Osaka Cement Co Ltd
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Publication of CN110087390A publication Critical patent/CN110087390A/en
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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/0102—Constructional details, not otherwise provided for in this subclass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/0121—Operation of devices; Circuit arrangements, not otherwise provided for in this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/052—Branched

Abstract

A kind of optical modulator, optical modulation element is housed in shell, at least part of the electric wiring between the optical modulator and external circuit substrate is connected by flexible circuit board, and the optical modulator configures on the external circuit substrate, it is characterized in that, in the outside bottom surface of the shell, the recess portion (range shown in dotted line D) for accommodating the flexible circuit board is formed in the part that connection configures the flexible circuit board, in order to avoid the face A opposite with the flexible circuit board in the recess portion, the electric wiring part B of the flexible circuit board is overlapped and be set to face A in a top view and is overlapped and generates between the electric wiring part C of the external circuit substrate in a top view the mode of resonance or parallel plate mode of microwave/millimeter wave with face A, the optical modulator has the inhibition unit (example of mode of resonance etc. Such as concaveconvex shape).

Description

Optical modulator
The application enters National Phase in China, Shen on December 12nd, 2017 for International Application Serial No. PCT/JP2016/078429 Please number for 201680034278.8, the divisional application of the application of entitled " optical modulator ".
Technical field
The present invention relates to optical modulators, are contained in the intracorporal optical modulator of shell more particularly to by optical modulation element, and logical It crosses flexible circuit board to connect at least part of the electric wiring between the optical modulator and external circuit substrate, and should Optical modulator configures the optical modulator on the external circuit substrate.
Background technique
In optical communication field, just utilized extensively using the transceiver of optical modulator.In recent years, it is since light transmits The small form factor requirements of system are also presented in terms of the RF interface connection for the optical modulator being equipped in transceiver module (transponder) The tendency that size shortens out.
Fig. 1 is shown the case where being configured with optical modulator on the external circuit substrate 7 for constituting module.As realization size contracting Short means, according to it is previous based on push away connect the coaxial connectors such as formula coaxial connector cable connect, as illustrated in fig. 1, benefit With having used the face of flexible circuit board (FPC) 6 and pin 4 to install (SMT:Surface Mount Technology) interface. About the optical modulator for having used flexible circuit board, there is disclosure in patent document 1.
Fig. 1 shows the cross-sectional view of the state by optical modulator configuration on external circuit substrate.Optical modulator 1 is by light modulation Element 2 is housed in made of metal shell 10, and is hermetically sealed.Label 11 is the cover of shell.It is intracorporal to be housed in shell Optical modulation element 2 and external circuit substrate 7 via flexible circuit board 6 and shell through hole (by the upper table of metal shell The vertical direction that face links with bottom surface) configuration pin 4 and be electrically connected.Moreover, flexible circuit board 6 is directly connected to pin 4. Wire bonding (50,5) are carried out by gold thread etc. via interposer 3 between pin 4 and optical modulation element 2.
Flexible circuit board 6 passes through the conduction materials such as Au, Cu on the one or both sides of substrate for having used polyimides etc. Material forms signal line (signal electrode) and ground path (grounding electrode).The grounding electrode of wide cut is formed on the face of side And the microstrip type route for being formed with the signal electrode of strip on the other surface is widely used.There is also not only for signal line It is signal electrode, and the case where configure grounding electrode in a manner of clamping signal electrode as coplanar type route.It can also be with Although still having the banding pattern route or ground connection coplanar type in the grounding electrode face of multilayer using the flexible decline of flexible circuit board 6 Route.
When flexible circuit board 6 is installed on optical modulator 1, in order to avoid flexible circuit board 6 is from optical modulator 1 Bottom surface is prominent, and as shown in the dotted line D of Fig. 1, recess portion (spot-facing portion) is formed in the external bottom surface of shell.
However, due to the shape of pin 4 between flexible circuit board 6 and the bottom surface (the face A opposite with FPC6) for forming recess portion Shape and being difficult to both makes closely to install completely.For example, pin 4 becomes the knot that signal wire and grounding electrode are configured in coaxial Structure, in the lower surface situation outstanding of front end from the shell of grounding electrode part, FPC6 can separate protrusion with the bottom surface A of recess portion Height amount.Therefore, gap S1 is generated therebetween.More specifically, in the signal electrode and ground connection electricity set on FPC6 Gap S1 is generated between extremely equal electric wiring part B and bottom surface A.
In addition, also generating gap S2 between FPC6 and external circuit substrate 7.More specifically, in the letter for being set to FPC6 The electric wiring part B of number electrode and grounding electrode etc. and between being generated between the electric wiring part C of external circuit substrate 7 Gap S2.As one of its reason, by pin 4 the lower face side of FPC6 carry out soldering it is fixed in the case where, the front end of pin 4 from The lower surface of FPC6 is prominent.The pin 4 outstanding adjusts the depth of recess portion with external circuit substrate 7 with contacting with meaning in order to prevent Degree is to generate gap S2.
Such gap S1 or S2 does not need as air layer.For example, in the surface (or two sides) of FPC6 setting insulating properties The case where protective film or external circuit substrate surface setting insulating properties protective film in the case where, protective film will necessarily be generated Thickness gap (such case be in gap filled with protective film material state).
In the case where gap S1 or S2 is parallel with the grounding electrode face of FPC6, become illustrated in fig. 2 such parallel Plate mode (Fig. 2A and Fig. 2 B) Producing reason.Shell 10 is configured Fig. 2 shows the upper surface side in FPC6 and is matched in lower face side Set the state in external circuit substrate 7 (electric conductivity such as grounding electrode face).In FPC6, it is formed in flexible insulating substrate 60 Upper surface configuration signal electrode 61 and lower surface configuration grounding electrode 62 microstripline.
Fig. 2A schematically shows the electric field of the signal of the signal line of stripline using dotted arrow.Fig. 2 B is to show Indicate that a part of electric field leaked from signal line makes to generate between the grounding electrode face of FPC6 and external circuit substrate 7 to meaning property The figure of the case where parallel plate mode, the dotted arrow in figure indicate the direction of electric field.Parallel plate mode is also in the ground connection electricity of FPC6 It is generated between pole 62 (electric wiring portion B) and the bottom surface A of recess portion.Even if being configured at external circuit substrate 7, recessed in grounding electrode 62 In the case where the either side of the bottom surface A in portion, as long as being parallel to each other, parallel plate mode will be generated.In the width of grounding electrode 62 In the case that narrow and the area that external circuit substrate 7 is opposite with the bottom surface A of recess portion ratio is big, external circuit substrate 7 with it is recessed Parallel plate mode can be generated between the bottom surface A in portion.
As shown in Figure 2 A, Quasi-TEM mode is generated between signal electrode 61 and grounding electrode 62.In gap S2, such as Fig. 2 B It is shown, parallel plate mode is generated between grounding electrode 62 and external circuit substrate 7.When such parallel plate mode generates, The broadband character deterioration of the modulated signal applied to optical modulator.Moreover, parallel plate mode with no cutoff frequency and no matter How the feature that the interval (gap of grounding electrode 62 and external circuit substrate 7) of constriction gap S2 can all generate.Certainly, about It is spaced S1, even if the interval of the upper surface A and FPC6 of the recess portion (spot-facing portion) of constriction shell 11 can also generate parallel plate mode.Example Such as, in microwave band or millimeter wave band, even if invalid such distance i.e. 25 μm of cavity resonance or so are narrowed to, in upper surface Also parallel plate mode can be generated between A and grounding electrode 62, although be not shown in Fig. 2, in insulating substrate 60 In the case that grounding electrode is arranged in upper surface, parallel plate mode is generated between the grounding electrode and upper surface A.
In addition, also being generated in the microwave/millimeter wave that gap S1 or S2 is released to space corresponding to the interval of gap S1 or S2 Cavity mode, under specific frequency occur modulated signal deterioration (sedimentation).In order to shorten wiring distance and ensure The easness of installation and need further constriction gap S1 or S2, in this case, be easy to produce parallel plate mode.
Such as DP-BPSK (dual-polarization binary phase shift keying) optical modulator, DQPSK (four phase RPSK relative phase shift keyings) light modulation Device or DP-QPSK (dual-polarization quadrature phase shift keying) optical modulator etc. are configured with the broadband of multiple signal wires like that, in FPC6 It is serious problem via the crosstalk between the signal wire of parallel plate mode in the case where optical modulator.Due to being self-confident because coming The leakage power of number line is transferred to crosstalk caused by other signal wires via the parallel plate mode of not cut-off frequency, therefore It is significant in extremely wide frequency range.
In the case where specific frequency, crosstalk can reduce by stub or choke circuits.However, in signal band From MHz band extend to the wide band modulation device to millimeter wave band in the case where be not effective countermeasure.As other means, wiring Crosstalk between crosstalk in substrate, such as adjacent multiple microstrip type routes between route by configuring guide hole or to line Dielectric base plate between road is added the means such as slot and can reduce.However, parallel plate mode is in the grounding electrode face of wiring substrate Formation between other grounding electrode faces with guide hole or slot etc. in substrate independently generates.Moreover, being leaked from signal wire Electric power not only transmitted to adjacent signal wire, also transmitted to other signal wires and cause crosstalk.It is not only micro-strip shape route, It is also the same in the route of other shapes.
In the present invention, phenomena such as cavity mode of microwave/millimeter wave or parallel plate mode, is expressed as " resonant mode Formula etc. ".
Citation
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2014-165289 bulletin
Summary of the invention
Subject to be solved by the invention
The problem to be solved by the present invention is to provide it is a kind of solve the problems, such as it is as described above, inhibit receiving flexible circuit Phenomena such as mode of resonance that the recess portion of the shell of substrate generates, improve the optical modulator of broadband character.
Solution for solving the problem
In order to solve the above problems, optical modulator of the invention has following technical characteristic.
(1) a kind of optical modulator, optical modulation element is housed in shell, by flexible circuit board by the optical modulator At least part of electric wiring between external circuit substrate is connect, and optical modulator configuration is in the external electrical roadbed On plate, which is characterized in that in the outside bottom surface of the shell, being formed with receiving in the part that connection configures the flexible circuit board should The recess portion of flexible circuit board, in order to avoid in the recess portion the face A opposite with the flexible circuit board, in a top view with this Face A is overlapped and is set to the electric wiring part B of the flexible circuit board and is overlapped and is set to outside this with face A in a top view The mode of resonance or parallel plate mode of microwave/millimeter wave, the light modulation utensil are generated between the electric wiring part C of circuit substrate The inhibition unit of standby mode of resonance etc..
(2) optical modulator according to above-mentioned (1), which is characterized in that the inhibition unit of the mode of resonance etc. is by face A Interval or dielectric constant, the electric wiring part B between the B of the electric wiring part and between the C of the electric wiring part At least one of interval or dielectric constant are set as locally different.
(3) optical modulator according to above-mentioned (1), which is characterized in that the inhibition unit of the mode of resonance etc. is equipped with will The pillar that is electrically connected point between face A and the electric wiring section and will be between the electric wiring part B and the electric wiring section point In the pillar of electrical connection at least any one.
(4) optical modulator according to any of above-mentioned (1) to (3), which is characterized in that in the flexible circuit board Two sides be formed with electric wiring, and be formed with the guide hole for being electrically connected to each other the ground connection wiring on two sides.
Invention effect
Optical modulation element is housed in shell by optical modulator of the invention, by flexible circuit board by the optical modulator At least part of electric wiring between external circuit substrate is connect, and optical modulator configuration is in the external electrical roadbed On plate, wherein in the outside bottom surface of the shell, be formed in the part that connection configures the flexible circuit board and accommodate the flexible electrical The recess portion of base board, in order to avoid in the recess portion the face A opposite with the flexible circuit board, in a top view with the face A weight It closes and is set to the electric wiring part B of the flexible circuit board and be overlapped in a top view with face A and be set to the external circuit The mode of resonance or parallel plate mode of microwave/millimeter wave are generated between the electric wiring part C of substrate, which has humorous The inhibition unit of vibration mode etc., therefore it is capable of providing a kind of phenomena such as inhibiting mode of resonance and the light tune for improving broadband character Device processed.
Detailed description of the invention
Fig. 1 is the cross-sectional view for indicating to have an example of optical modulator of FPC.
Fig. 2A is the figure for illustrating Quasi-TEM mode.
Fig. 2 B is the figure for illustrating parallel plate mode.
Fig. 3 is the figure for illustrating the first embodiment of optical modulator of the invention.
Fig. 4 is the figure for illustrating the second embodiment of optical modulator of the invention.
Fig. 5 is the figure for illustrating the 3rd embodiment of optical modulator of the invention.
Fig. 6 is the figure for illustrating the fourth embodiment of optical modulator of the invention.
Fig. 7 is the figure for illustrating the 5th embodiment of optical modulator of the invention.
Fig. 8 is the figure for illustrating the sixth embodiment of optical modulator of the invention.
Specific embodiment
Hereinafter, being described in detail about optical modulator of the invention using preference.
As shown in Figure 1, the optical modulator of one embodiment of the present invention is that optical modulation element 2 is housed in shell (10,11) Optical modulator 1 made of interior, by flexible circuit board 6 by the electric wiring between the optical modulator and external circuit substrate 7 At least part connection, and the optical modulator configuration on the external circuit substrate, which is characterized in that in the shell 10 Outside bottom surface is formed with the recess portion for accommodating the flexible circuit board, in the part that connection configures the flexible circuit board in order to keep away Exempt to be overlapped in the face A opposite with the flexible circuit board of the recess portion, in a top view with face A and is set to the flexible electrical roadbed The electric wiring part B of plate and the electric wiring part for being overlapped and being set in a top view the external circuit substrate with face A The mode of resonance or parallel plate mode of microwave/millimeter wave are generated between C, which has such resonance shown in Fig. 3 to 7 The inhibition unit of mode etc..
In optical modulator of the invention, optical modulation element 2 be can use in LiNbO3Substrate (LN substrate) etc. has electricity The optical modulation element of optical waveguide and modulator electrode is formed on the substrate of luminous effect.Moreover, being not limited thereto, also can use Semiconductor modulation element etc..The optical modulation element for especially applying the high-frequency signal of 25GHz or more in the present invention can be preferred Ground utilizes.
In Fig. 1, it is configured to be electrically connected from pin 4 via interposer 3 to optical modulation element 2, but can also be with It is directly electrically connected from pin 4 to optical modulation element 2.Moreover, the connection of pin 4 and interposer not only passes through the line of gold etc. Material 50 connects, and can be with the signal wiring soldering connection that is set to interposer.
About pin, pin can be accordingly used with each electrode of signal electrode and grounding electrode, but can also be as Shown in Fig. 1, the electric conductivity sleeve (cylinder electrode) of grounding electrode is configured in a manner of the pin for surrounding signal electrode.Certainly, Filled with insulating materials such as glass between pin and sleeve.By using the combination of such pin and sleeve, can will lead to It is set as defined value with crossing the impedance stabilization of the part of pin connection.
Polyimides is used in base substrate (substrate) by the flexible circuit board 6 that optical modulator of the invention uses, Electric wiring is formed by Au, Cu etc. in base substrate.The electrode of electric wiring with a thickness of 20 μm or more, more preferably 25 μm More than, at least on the face for being formed with signal electrode, ground connection wiring is formed with same thickness together with signal electrode.About The grounding electrode or G-CPW (coplanar waveguide ground) route of micro-strip (MS) route (form coplanar type route and another in one side On one side be equipped with grounding electrode structure) grounding electrode, even if also can fully be played as grounding electrode less than 20 μm Function, there is no need to be formed thick by electrode.
For the inhibition unit of mode of resonance of the invention etc., it is described in detail.Inhibition list as mode of resonance etc. Member can be implemented following 4 methods are appropriately combined.
(1) dielectric constant for constituting the space in gap the method for adjustment of cavity size: is adjusted corresponding to the frequency band used Or the distance between reflecting surface.Shielding reflecting surface can also be inserted into gap.It should be noted that this method is for parallel plate mode Effect it is weak.
(2) unevenness of cavity homogenizes: tilting FPC relative to the surface of recess portion inside surface A or external circuit substrate.Make FPC bends or is formed as waveform.Tilt the inner wall of recess portion relative to the surface of FPC or external circuit substrate.By the inner wall Face is formed as waveform, concaveconvex shape, stairstepping.
(3) reflection/absorption function: the roughening of the inner wall of recess portion is assigned.In gap or inner wall or external circuit Substrate surface configures nonmetallic materials or high dielectric constant material.
(4) make guide hole or blind hole short-circuit between the grounding electrode face of FPC, pillar or the grounding electrode for making PFC Ball bar, the conductive sponge etc. that face, recess portion inside surface A or external circuit substrate short cut with each other, make electric short circuit between opposite face.
(5) incised notch is formed in the grounding electrode of FPC, reduces grounding electrode relative to recess portion inside surface A or external electrical roadbed The area of plate.
Next, illustrating specific embodiment using Fig. 3 to 8.
Fig. 3 is first embodiment, is obliquely to configure FPC6 and keep the shape unevenness of cavity (gap S1, S2) homogenized Example.The supporting part (20,21) of the different convex of height is set in the inner surface of recess portion in order to obliquely keep FPC6.When So, supporting part is not limited to be illustrated in figure 32, can also form 3 or more.
Fig. 4 is second embodiment, is the inside surface A formation concaveconvex shape in recess portion and makes the uneven homogenized example of cavity. Furthermore, it is also possible to be roughened to the inner wall of recess portion and avoid generating mode of resonance.It is formed in Fig. 4 periodically concave-convex Shape, but do not need mode of resonance in order to prevent and be formed as periodic shape.
Fig. 5 is 3rd embodiment, is locally to be configured with the example of dielectric constant material (30,31) in gap S1 or S2 Son.Cavity size can not only be changed as a result, and can realize that the unevenness of cavity homogenizes together.As a result, can not only Inhibit mode of resonance, and is able to suppress the generation of parallel plate mode.
As shown in Fig. 3 to 5, the inside surface A of recess portion and the electric wiring part of FPC6 (configure on the surface of FPC or the back side Wiring) between interval or between dielectric constant or FPC6 electric wiring part and external circuit substrate 7 electricity Interval between gas wiring part (wiring on the surface of circuit substrate) or between the setting of at least one of dielectric constant To be locally different, thus, it is possible to inhibit mode of resonance etc..
Fig. 6 is fourth embodiment, be recess portion inner wall configured with absorb microwave/millimeter wave and so that it is subtracted the material to decline The example of (nonmetallic materials, high dielectric constant material) 40.Thereby, it is possible to inhibit the generation of mode of resonance etc..Certainly, in outside The a part (part opposite with FPC6) on the surface of circuit substrate 7 can also configure absorption or subtract the material that declines.
In addition, being configured to not exist as the method for generating parallel plate mode between FPC6 and external circuit substrate 7 is inhibited The case where electrodes such as the surface configuration grounding electrode of external circuit substrate 7 opposite with FPC6, is also effective.
Fig. 7 is the 5th embodiment, be using the pillar 50 formed by conductive materials such as gold by the inside surface A of recess portion and The electric wiring part (being especially formed at the grounding electrode of the surface side of FPC) of FPC6 is electrically connected and carries out the short circuit between face Example.Also it can use electric wiring part (be especially formed at the grounding electrode of the back side of FPC) of the pillar 51 by FPC6 It is electrically connected with the electric wiring part (being especially formed at the grounding electrode on the surface of circuit substrate) of external circuit substrate.? In the case that FPC6 is equipped with multiple signal wires, if forming pillar, crosstalk reduction effect in the two sides of signal wire along signal wire Fruit further increases.
The configuration space of multiple pillars and the relationship of amount of suppression are, such as the microwave/millimeter wave of 75GHz, make phase In the case where being divided into 500 μm between adjacent pillar, the inhibition of about 10dB can be realized, the case where making 100 μm of pillar spacer Under, it can be realized the inhibition of about 40dB.
In addition, in the case where the two sides of FPC6 is formed with grounding electrode (ground connection wiring), it can be in the ground connection electricity of two sides Extremely opposite region configures conductive material at the hole of perforation FPC, and the guide hole that the grounding electrode of two sides is connected is arranged.
Fig. 8 is sixth embodiment, be formed in FPC6 grounding electrode 62 be arranged incised notch (63~65), by reduce with it is recessed The area of the inside surface A in portion or the opposite grounding electrode of the electric wiring part C of external circuit substrate, is able to suppress parallel template die The generation of formula.Crosstalk between signal electrode is also greatly reduced.The label 60 of Fig. 8 is the insulating substrate of FPC, and 61 be in insulating substrate Surface (the nearby side of paper) formed signal electrode, 62 be insulating substrate the back side (inboard of paper) formed ground connection Electrode.The region of incised notch (63~65) is wider, then the reducing effect of the effect and crosstalk that inhibit the generation of parallel plate mode is higher. In addition, being improved by the flexibility of incised notch FPC6.Therefore, if carrying out wiring with making FPC6 flexure, inhibit parallel-plate The effect and crosstalk reduction effect of the generation of mode further increase.
More than, referring to attached drawing, illustrate the preferred embodiments of the present invention example, but the present invention is not limited to certainly Above-mentioned example.The various shape of each structural elements shown in the above example or combination etc. are an examples, are not departing from this Various changes are able to carry out according to design requirement etc. in the range of the purport of invention.If the embodiment by shown in is appropriately combined, Then effect further increases certainly.
Industry applications
As described above, in accordance with the invention it is possible to provide a kind of shell inhibited in receiving flexible circuit board Phenomena such as mode of resonance that recess portion generates and the optical modulator for improving broadband character.
Label declaration
1 optical modulator
2 optical modulation elements
3 interposers
4 pins
5,50 wire bonding
6 flexible circuit boards
7 external circuit substrates
10 shells
11 shells (lid).

Claims (3)

1. a kind of optical modulator, optical modulation element is housed in shell, by flexible circuit board by the optical modulator and outside At least part of electric wiring between portion's circuit substrate connects, and optical modulator configuration is in the external circuit substrate On, which is characterized in that
In the outside bottom surface of the shell, it is formed in the part that connection configures the flexible circuit board and accommodates the flexible circuit board Recess portion,
Multiple signal wires are configured in the flexible circuit board,
In order to avoid in the recess portion the face A opposite with the flexible circuit board, be overlapped with face A and be set in a top view should It is generated between the electric wiring part B of flexible circuit board and the external circuit substrate being overlapped in a top view with face A micro- Wave/millimeter wave mode of resonance or parallel plate mode, the optical modulator have the inhibition unit of mode of resonance or parallel plate mode,
The inhibition unit of the mode of resonance or parallel plate mode is set as, and is overlapped in a top view with electric wiring part B The electric conductor including electric wiring part, and face A and electric wiring part B are not configured on the surface of the external circuit substrate Between interval or at least one of dielectric constant it is locally different.
2. optical modulator according to claim 1, which is characterized in that
The inhibition unit of the mode of resonance or parallel plate mode, which is equipped with, to be electrically connected between face A and electric wiring part B Pillar.
3. optical modulator according to claim 1 or 2, which is characterized in that
It is formed with electric wiring on the two sides of the flexible circuit board, and is formed with and is electrically connected to each other the ground connection wiring on two sides Guide hole.
CN201910203399.6A 2015-09-30 2016-09-27 Optical modulator Active CN110087390B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015-192597 2015-09-30
JP2015192597A JP6203802B2 (en) 2015-09-30 2015-09-30 Light modulator
PCT/JP2016/078429 WO2017057351A1 (en) 2015-09-30 2016-09-27 Optical modulator
CN201680034278.8A CN107636515B (en) 2015-09-30 2016-09-27 Optical modulator

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201680034278.8A Division CN107636515B (en) 2015-09-30 2016-09-27 Optical modulator

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Publication Number Publication Date
CN110087390A true CN110087390A (en) 2019-08-02
CN110087390B CN110087390B (en) 2022-04-29

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US10365506B2 (en) 2019-07-30
WO2017057351A1 (en) 2017-04-06
CN107636515B (en) 2019-04-23
US10502982B2 (en) 2019-12-10
CN107636515A (en) 2018-01-26
CN110087390B (en) 2022-04-29
US20190258089A1 (en) 2019-08-22
JP6203802B2 (en) 2017-09-27
US20190025612A1 (en) 2019-01-24

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