CN110085647B - Packaging method and packaging system - Google Patents

Packaging method and packaging system Download PDF

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Publication number
CN110085647B
CN110085647B CN201910394450.6A CN201910394450A CN110085647B CN 110085647 B CN110085647 B CN 110085647B CN 201910394450 A CN201910394450 A CN 201910394450A CN 110085647 B CN110085647 B CN 110085647B
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Prior art keywords
packaged
cover plates
preset number
substrate
packaging
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CN110085647A (en
Inventor
张亮
陈旭
包珊珊
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features

Abstract

The embodiment of the invention provides a packaging method and a packaging system, belongs to the technical field of display, and can solve the problems that the existing packaging process can only package a single type of display product, the production efficiency is influenced, and the cost control is not facilitated. The packaging method provided by the embodiment of the invention comprises the following steps: pre-storing a preset number of cover plates to be packaged; at least part of the preset number of cover plates to be packaged are different in type number; selecting cover plates to be packaged with corresponding models from pre-stored preset number of cover plates to be packaged according to the model information of the current base plate to be packaged; and carrying out box-to-box bonding on the current substrate to be packaged and the cover plate to be packaged of the corresponding type.

Description

Packaging method and packaging system
Technical Field
The invention belongs to the technical field of display, and particularly relates to a packaging method and a packaging system.
Background
With the continuous development of display panel packaging technology, the requirements of the industry on the production efficiency and cost control of display panel packages are more and more strict. The existing packaging process is mainly completed by matching a substrate production line and a cover plate production line together, a substrate to be packaged of one type is produced on the substrate production line, a cover plate to be packaged of a corresponding type is produced on the cover plate production line simultaneously, and the substrate of the type and the cover plate of the corresponding type are packaged to form a display product.
However, the current packaging process can only package a single type of display product, so that the substrate formed by the evaporation process on the substrate production line can only be produced in series, the flexibility is poor, the substrate cannot flexibly cope with small-batch production, and the production efficiency is affected. In addition, currently, a single-cavity double-machine table is mainly adopted to work simultaneously, two sets of mask plates are required to be used at one time, only a single-model display product is packaged, the utilization rate of the mask plates is low, and cost control of a packaging process is not facilitated.
Disclosure of Invention
The present invention is directed to at least one of the technical problems of the prior art, and provides a packaging method and a packaging system.
The technical scheme adopted for solving the technical problem of the invention is a packaging method, which comprises the following steps:
pre-storing a preset number of cover plates to be packaged; at least part of the preset number of cover plates to be packaged are different in type number;
selecting cover plates to be packaged with corresponding models from pre-stored preset number of cover plates to be packaged according to the model information of the current base plate to be packaged;
and carrying out box-to-box bonding on the current substrate to be packaged and the cover plate to be packaged of the corresponding type.
Optionally, the pre-storing a preset number of cover plates to be packaged includes:
obtaining the model information of a substrate to be packaged;
generating the model information of the corresponding cover plate to be packaged according to the model information of the substrate to be packaged;
and pre-storing the preset number of the cover plates to be packaged according to the generated model information of the cover plates to be packaged.
Optionally, after the box-to-box bonding is performed between the current substrate to be packaged and the cover plate to be packaged of the corresponding model, the method further includes:
acquiring a first number of the current cover plates to be packaged;
judging whether the first quantity is lower than a preset threshold value or not;
if the first quantity is lower than the preset threshold value, pre-storing a second quantity of cover plates to be packaged in various types; the sum of the first number and the second number is equal to the preset number.
Optionally, before the pre-storing the preset number of cover plates to be packaged, the method further includes:
and performing pre-packaging treatment on the preset number of cover plates to be packaged.
Optionally, the pre-packaging the preset number of cover plates to be packaged includes:
cleaning the preset number of cover plates to be packaged;
and coating the frame sealing glue on the preset number of cover plates to be packaged.
Optionally, after the attaching the target substrate and the target cover plate to each other, the method further includes:
and carrying out ultraviolet curing on the substrate to be packaged and the cover plate to be packaged, which are attached to the box, of the corresponding model.
The technical scheme adopted for solving the technical problem of the invention is a packaging system, which comprises:
the pre-storing unit is used for pre-storing a preset number of cover plates to be packaged; at least part of the preset number of cover plates to be packaged are different in type number;
the selecting unit is used for selecting cover plates to be packaged with corresponding models from pre-stored preset number of cover plates to be packaged according to the model information of the current base plate to be packaged;
and the attaching unit is used for attaching the current substrate to be packaged and the cover plate to be packaged of the corresponding type to the box.
Optionally, the pre-storing unit includes:
the first acquisition unit is used for acquiring the model information of the substrate to be packaged;
the generating unit is used for generating the model information of the corresponding cover plate to be packaged according to the model information of the substrate to be packaged;
and the pre-storing subunit is used for pre-storing the preset number of the cover plates to be packaged according to the generated model information of the cover plates to be packaged.
Optionally, the packaging system further comprises:
the second obtaining unit is used for obtaining the first number of the current cover plates to be packaged;
the judging unit is used for judging whether the first quantity is lower than a preset threshold value or not;
the supplementing unit is used for pre-storing a second number of cover plates to be packaged in various types if the first number is lower than the preset threshold value; the sum of the first number and the second number is equal to the preset number.
Optionally, the packaging system further comprises:
and the curing unit is used for carrying out ultraviolet curing on the substrate to be packaged and the cover plate to be packaged, which are attached to the box, of the corresponding type.
Drawings
Fig. 1 is a schematic flow chart of a packaging method according to an embodiment of the present invention;
fig. 2 is a schematic flowchart illustrating a method for pre-storing a predetermined number of cover plates to be packaged according to an embodiment of the present invention;
fig. 3 is a schematic flow chart of another packaging method according to an embodiment of the present invention;
fig. 4 is a schematic flowchart of another packaging method according to an embodiment of the present invention;
fig. 5 is a schematic flowchart of a method for performing pre-package processing on a predetermined number of cover plates to be packaged according to an embodiment of the present invention;
fig. 6 is a schematic flowchart of another packaging method according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a packaging system according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a pre-storage unit according to an embodiment of the present invention;
FIG. 9 is a schematic structural diagram of another packaging system according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of another packaging system according to an embodiment of the present invention.
Description of reference numerals:
701-a pre-storing unit, 702-a selecting unit, 703-a bonding unit, 704-a second acquiring unit, 705-a judging unit, 706-a supplementing unit, 707-a curing unit, 7011-a first acquiring unit, 7012-a generating unit and 7013-a pre-storing subunit.
Detailed Description
In order to make the technical solutions of the present invention better understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Example one
The embodiment of the present invention provides a packaging method, which may be used for packaging a display panel, and may be an organic light emitting diode display panel (OLED), a liquid crystal display panel (LCD), or other types of display panels, which is not limited herein. In addition, the packaging method can also be used for packaging battery products such as photovoltaic devices. The following describes the packaging method in detail by taking the display panel as an example. Fig. 1 is a schematic flow chart of a packaging method according to an embodiment of the present invention, as shown in fig. 1, the packaging method includes:
s101, pre-storing a preset number of cover plates to be packaged; at least part of the preset number of cover plates to be packaged are different in type number.
S102, according to the model information of the current substrate to be packaged, selecting the cover plates to be packaged with corresponding models from the pre-stored preset number of cover plates to be packaged.
And S103, attaching the current substrate to be packaged and the cover plate to be packaged of the corresponding type to the box.
It should be noted that, in the above S101, by using the encapsulation method provided by the embodiment of the present invention, the upstream cover plate production line may simultaneously produce a plurality of types of cover plates to be encapsulated, and may temporarily pre-store the cover plates to be encapsulated produced by the upstream cover plate production line until the pre-stored number of the cover plates to be encapsulated reaches the preset number. The preset quantity can be the quantity required by one production batch, and can also be flexibly set according to the requirements of users so as to ensure the packaging efficiency.
In the above S102, the upstream substrate production line may transmit the model information of the produced substrate to be packaged downward, obtain the model information of the cover plate to be packaged, which is matched with the model information of the substrate to be packaged transmitted by the upstream substrate production line, and select the cover plate to be packaged, of the model corresponding to the current substrate to be packaged, from the pre-stored cover plates to be packaged.
In the above S103, the substrate to be packaged, which is provided with the display element, the driving circuit, and the like, is bonded to the selected corresponding cover plate to be packaged, and the thickness of the box can be set according to the product condition, so that the cover plate can protect the substrate, and the panel can be packaged.
According to the packaging method provided by the embodiment of the invention, the cover plates to be packaged of various types can be pre-stored, and the cover plate corresponding to the substrate to be packaged is selected from the pre-stored cover plates to be packaged during packaging, so that mixed flow production of display panels of various types can be simultaneously produced, the production flexibility is improved, the waste of only producing display products of one type is avoided, and the production efficiency is improved.
Based on the packaging method provided by the above embodiments, the packaging method will be further described in detail with reference to the accompanying drawings.
Example two
An embodiment of the present invention provides a method for pre-storing a preset number of cover plates to be packaged, and fig. 2 is a schematic flow chart of the method for pre-storing the preset number of cover plates to be packaged according to the embodiment of the present invention, as shown in fig. 2, the method includes:
s201, obtaining the model information of the substrate to be packaged.
S202, generating corresponding model information of the cover plate to be packaged according to the model information of the substrate to be packaged.
And S203, pre-storing a preset number of cover plates to be packaged according to the generated model information of the cover plates to be packaged.
It should be noted that, the model information of the substrate to be packaged, which is transmitted downward by the upstream substrate production line, is obtained, and since the model of the substrate in one display product corresponds to the model of the cover plate, the model information of the substrate to be packaged is obtained, and then the corresponding model information of the cover plate to be packaged can be generated according to the model information of the substrate to be packaged, that is, the model of the cover plate to be packaged, which needs to be prestored, is obtained. And pre-storing the cover plates to be packaged with the specified models until the number of the pre-stored cover plates to be packaged reaches a preset number.
By utilizing the method for pre-storing the cover plate to be packaged, the cover plate to be packaged can be pre-stored according to the demand of the substrate to be packaged, so that mixed flow production of display products is realized, waste caused by production of a single type of display product is avoided, and the production efficiency is improved.
EXAMPLE III
An embodiment of the present invention provides another encapsulation method, and fig. 3 is a schematic flow chart of the another encapsulation method provided in the embodiment of the present invention, and as shown in fig. 3, the encapsulation method includes:
s101, pre-storing a preset number of cover plates to be packaged; at least part of the preset number of cover plates to be packaged are different in type number.
S102, according to the model information of the current substrate to be packaged, selecting the cover plates to be packaged with corresponding models from the pre-stored preset number of cover plates to be packaged.
And S103, attaching the current substrate to be packaged and the cover plate to be packaged of the corresponding type to the box.
S104, acquiring a first number of the current cover plates to be packaged.
And S105, judging whether the first quantity is lower than a preset threshold value.
If the first number is lower than the preset threshold, executing S106; if the first number is not lower than the preset threshold, S102 is performed.
S106, pre-storing a second number of cover plates to be packaged in various types; the sum of the first number and the second number is equal to a preset number.
It should be noted that, in the above S104, along with the use of the cover plates to be packaged in the production, the pre-stored number of the cover plates to be packaged is gradually reduced, and in order to avoid production interruption caused by too small number of the cover plates to be packaged, the current first number of the cover plates to be packaged needs to be monitored in real time to obtain the current first number of the cover plates to be packaged.
In the above S105, a threshold, that is, a lower limit of the number of the cover plates to be packaged, may be preset for the pre-stored number of the cover plates to be packaged. And when the number of the cover plates to be packaged is higher than the threshold value, normally executing the packaging production process. When the number of the cover plates to be packaged is lower than the threshold value, the rest cover plates to be packaged need to be supplemented in order to ensure the normal packaging production process.
In the above S106, the second number of the cover plates to be packaged may be supplemented, so that the number of the cover plates to be packaged reaches the preset number after the number of the cover plates to be packaged is supplemented, thereby realizing the automatic continuous production and ensuring the production efficiency.
Example four
An embodiment of the present invention provides another packaging method, and fig. 4 is a schematic flow chart of the another packaging method provided in the embodiment of the present invention, where the packaging method includes:
s401, pre-packaging the cover plates to be packaged in a preset number.
S101, pre-storing a preset number of cover plates to be packaged; at least part of the preset number of cover plates to be packaged are different in type number.
S102, according to the model information of the current substrate to be packaged, selecting the cover plates to be packaged with corresponding models from the pre-stored preset number of cover plates to be packaged.
And S103, attaching the current substrate to be packaged and the cover plate to be packaged of the corresponding type to the box.
It should be noted that, before pre-storing the cover plate to be packaged, pre-packaging the cover plate to be packaged is required to ensure that the pre-stored cover plate to be packaged meets the requirement of matching with the substrate to be packaged, which facilitates the subsequent box-to-box bonding of the cover plate to be packaged and the substrate to be packaged, and improves the production efficiency.
EXAMPLE five
An embodiment of the present invention provides a method for performing pre-package processing on a preset number of cover plates to be packaged, and fig. 5 is a schematic flow chart of the method for performing pre-package processing on the preset number of cover plates to be packaged, as shown in fig. 5, the method includes:
s501, cleaning a preset number of cover plates to be packaged.
S502, frame sealing glue coating is carried out on a preset number of cover plates to be packaged.
It should be noted that the preprocessing of the cover plate to be packaged may include cleaning the cover plate to be packaged, applying frame sealing adhesive to the cover plate to be packaged, or performing other preprocessing in the prior art on the cover plate to be packaged, where a specific preprocessing mode is not limited.
EXAMPLE six
Fig. 6 is a schematic flow chart of another packaging method provided in an embodiment of the present invention, and as shown in fig. 6, the packaging method includes:
s101, pre-storing a preset number of cover plates to be packaged; at least part of the preset number of cover plates to be packaged are different in type number.
S102, according to the model information of the current substrate to be packaged, selecting the cover plates to be packaged with corresponding models from the pre-stored preset number of cover plates to be packaged.
And S103, attaching the current substrate to be packaged and the cover plate to be packaged of the corresponding type to the box.
S601, carrying out ultraviolet curing on the substrate to be packaged and the cover plate to be packaged, which are bonded to the box, of the corresponding model.
It should be noted that, after the pair of boxes is bonded, the substrate to be packaged and the cover plate to be packaged of the corresponding type are cured by means of ultraviolet irradiation or the like, so that the frame sealing glue between the substrate to be packaged and the cover plate to be packaged is cured, and the bonding between the substrate to be packaged and the cover plate to be packaged is realized. It is to be understood that the curing may be performed by heating or natural curing, and the curing is not limited herein.
Based on the same inventive concept, the embodiment of the present invention further provides a packaging system, which will be described in further detail with reference to the accompanying drawings.
EXAMPLE seven
An embodiment of the present invention provides a package system, and fig. 7 is a schematic structural diagram of the package system provided in the embodiment of the present invention, and as shown in fig. 7, the package system includes: a pre-storing unit 701, a selecting unit 702 and a bonding unit 703.
A pre-storing unit 701, configured to pre-store a preset number of cover plates to be packaged; at least part of the preset number of cover plates to be packaged are different in type number;
a selecting unit 702, configured to select a cover plate to be packaged with a corresponding model from pre-stored cover plates to be packaged in a preset number according to model information of a current substrate to be packaged;
and the attaching unit 703 is configured to attach the current substrate to be packaged to the cover plate to be packaged of the corresponding model to the box.
It can be understood that the packaging system provided in the embodiment of the present invention is similar to the implementation manner of the packaging method provided in the first embodiment, and is not described herein again.
Example eight
An embodiment of the present invention provides a pre-storage unit, and fig. 8 is a schematic structural diagram of the pre-storage unit provided in the embodiment of the present invention, as shown in fig. 8, the pre-storage unit includes: a first obtaining unit 7011, a generating unit 7012, and a pre-storing subunit 7013.
A first obtaining unit 7011, configured to obtain model information of a substrate to be packaged;
the generating unit 7012 is configured to generate model information of a corresponding cover plate to be packaged according to the model information of the substrate to be packaged;
a pre-storing subunit 7013, configured to pre-store a preset number of cover plates to be packaged according to the generated model information of the cover plates to be packaged.
It can be understood that the pre-storing unit provided in the embodiment of the present invention is similar to the implementation principle of the pre-storing method for the cover plate to be packaged provided in the second embodiment, and is not described herein again.
Example nine
An embodiment of the present invention provides another packaging system, and fig. 9 is a schematic structural diagram of another packaging system provided in an embodiment of the present invention, as shown in fig. 9, the packaging system includes: a pre-storing unit 701, a selecting unit 702, a pasting unit 703, a second acquiring unit 704, a judging unit 705 and a supplementing unit 706.
A pre-storing unit 701, configured to pre-store a preset number of cover plates to be packaged; at least part of the preset number of cover plates to be packaged are different in type number;
a selecting unit 702, configured to select a cover plate to be packaged with a corresponding model from pre-stored cover plates to be packaged in a preset number according to model information of a current substrate to be packaged;
and the attaching unit 703 is configured to attach the current substrate to be packaged to the cover plate to be packaged of the corresponding model to the box.
A second obtaining unit 704, configured to obtain a first number of current cover plates to be packaged.
The determining unit 705 is configured to determine whether the first number is lower than a preset threshold.
A supplementing unit 706, configured to pre-store a second number of cover plates to be packaged in multiple models if the first number is lower than a preset threshold; the sum of the first number and the second number is equal to a preset number.
The implementation principle of the encapsulation system provided by the embodiment of the present invention is similar to that of the encapsulation method provided by the third embodiment, and details are not described herein again.
Example ten
An embodiment of the present invention provides another packaging system, and fig. 10 is a schematic structural diagram of another packaging system provided in an embodiment of the present invention, and as shown in fig. 10, the packaging system includes: a pre-storing unit 701, a selecting unit 702, a bonding unit 703 and a curing unit 707.
A pre-storing unit 701, configured to pre-store a preset number of cover plates to be packaged; at least part of the preset number of cover plates to be packaged are different in type number;
a selecting unit 702, configured to select a cover plate to be packaged with a corresponding model from pre-stored cover plates to be packaged in a preset number according to model information of a current substrate to be packaged;
and the attaching unit 703 is configured to attach the current substrate to be packaged to the cover plate to be packaged of the corresponding model to the box.
And a curing unit 707 for performing ultraviolet curing on the substrate to be packaged and the cover plate to be packaged of the corresponding model, which are attached to the cassette.
The implementation principle of the encapsulation system provided by the embodiment of the present invention is similar to that of the encapsulation method provided by the sixth embodiment, and details are not described herein again.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims (10)

1. A method of packaging, comprising:
pre-storing a preset number of cover plates to be packaged; at least part of the preset number of cover plates to be packaged are different in type number;
selecting cover plates to be packaged with corresponding models from pre-stored preset number of cover plates to be packaged according to the model information of the current base plate to be packaged;
and carrying out box-to-box bonding on the current substrate to be packaged and the cover plate to be packaged of the corresponding type.
2. The packaging method according to claim 1, wherein the pre-storing a preset number of cover plates to be packaged comprises:
obtaining the model information of a substrate to be packaged;
generating the model information of the corresponding cover plate to be packaged according to the model information of the substrate to be packaged;
and pre-storing the preset number of the cover plates to be packaged according to the generated model information of the cover plates to be packaged.
3. The packaging method according to claim 1, wherein after the box-to-box bonding of the current substrate to be packaged and the cover plate to be packaged of the corresponding model, the packaging method further comprises:
acquiring a first number of the current cover plates to be packaged;
judging whether the first quantity is lower than a preset threshold value or not;
if the first quantity is lower than the preset threshold value, pre-storing a second quantity of cover plates to be packaged in various types; the sum of the first number and the second number is equal to the preset number.
4. The packaging method according to claim 1, wherein before the pre-storing the preset number of cover plates to be packaged, the method further comprises:
and performing pre-packaging treatment on the preset number of cover plates to be packaged.
5. The packaging method according to claim 4, wherein the pre-packaging a predetermined number of cover plates to be packaged comprises:
cleaning the preset number of cover plates to be packaged;
and coating the frame sealing glue on the preset number of cover plates to be packaged.
6. The packaging method according to claim 4, wherein after the box-to-box bonding is performed on the current substrate to be packaged and the cover plate to be packaged of a corresponding model, the packaging method further comprises:
and carrying out ultraviolet curing on the substrate to be packaged and the cover plate to be packaged, which are attached to the box, of the corresponding model.
7. A packaging system, comprising:
the pre-storing unit is used for pre-storing a preset number of cover plates to be packaged; at least part of the preset number of cover plates to be packaged are different in type number;
the selecting unit is used for selecting cover plates to be packaged with corresponding models from pre-stored preset number of cover plates to be packaged according to the model information of the current base plate to be packaged;
and the attaching unit is used for attaching the current substrate to be packaged and the cover plate to be packaged of the corresponding type to the box.
8. The packaging system of claim 7, wherein the pre-storage unit comprises:
the first acquisition unit is used for acquiring the model information of the substrate to be packaged;
the generating unit is used for generating the model information of the corresponding cover plate to be packaged according to the model information of the substrate to be packaged;
and the pre-storing subunit is used for pre-storing the preset number of the cover plates to be packaged according to the generated model information of the cover plates to be packaged.
9. The packaging system of claim 7, further comprising:
the second obtaining unit is used for obtaining the first number of the current cover plates to be packaged;
the judging unit is used for judging whether the first quantity is lower than a preset threshold value or not;
the supplementing unit is used for pre-storing a second number of cover plates to be packaged in various types if the first number is lower than the preset threshold value; the sum of the first number and the second number is equal to the preset number.
10. The packaging system of claim 7, further comprising:
and the curing unit is used for carrying out ultraviolet curing on the substrate to be packaged and the cover plate to be packaged, which are attached to the box, of the corresponding type.
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Citations (7)

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