CN110085207A - Honeycomb-micropunch film composite structure design method - Google Patents
Honeycomb-micropunch film composite structure design method Download PDFInfo
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- CN110085207A CN110085207A CN201910365851.9A CN201910365851A CN110085207A CN 110085207 A CN110085207 A CN 110085207A CN 201910365851 A CN201910365851 A CN 201910365851A CN 110085207 A CN110085207 A CN 110085207A
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- microperforated panel
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- micropunch
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- 239000002131 composite material Substances 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000004080 punching Methods 0.000 claims abstract description 22
- 238000010521 absorption reaction Methods 0.000 claims abstract description 18
- 238000004364 calculation method Methods 0.000 claims description 3
- 230000035515 penetration Effects 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 238000004088 simulation Methods 0.000 abstract description 2
- 241000264877 Hippospongia communis Species 0.000 description 30
- 229920002595 Dielectric elastomer Polymers 0.000 description 29
- 238000010276 construction Methods 0.000 description 15
- 239000010410 layer Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 230000001413 cellular effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 229920001746 electroactive polymer Polymers 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000036314 physical performance Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/162—Selection of materials
- G10K11/168—Plural layers of different materials, e.g. sandwiches
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/172—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using resonance effects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/10—Properties of the layers or laminate having particular acoustical properties
- B32B2307/102—Insulating
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Soundproofing, Sound Blocking, And Sound Damping (AREA)
- Building Environments (AREA)
Abstract
The present invention is based on honeycomb-micropunch film composite structure that composite material honeycomb plate structure devises a kind of adjustable sound absorbing performance of Novel electric, design procedure is as follows: being carried out that the influence of piercing aperture and punching rate to structure sound absorbing performance is calculated according to the double-deck microperforated panel theoretical model；Devise a kind of DE micropunch film that can change micropunch parameter by control external voltage；The punching rate adjustable range than conveniently adjusting is found in numerical simulation and calculating.Design method principle of the present invention is simple, and the characteristics of structure can play adjustable sound absorption peak value only need to be partially added in traditional honeycomb.It is practical, popularization easy to operate.
Description
Technical field
The invention belongs to honeycomb-micropunch film composite structure Low Noise Design method, in particular to a kind of electricity is adjustable
Honeycomb-micropunch film composite structure design method of section sound absorption frequency.
Background technique
Honeycomb interlayer composite construction be it is a kind of while remaining respective physical performance with the extensive of lightweight nature
Applied to aviation, the structure of building engineering field.Common honeycomb sandwich panel structure have sound insulation characteristic, in order to reach inhale every
The integrated design of sound, it is necessary to achieve the purpose that sound absorption using the porous material additionally added, this has resulted in a large amount of volumes
Outer construction weight is undoubtedly a fatal disadvantage for aviation, building field.Therefore research honeycomb interlayer composite plate
Low Noise Design method of structure under the premise of keeping light has for the research of honeycomb interlayer composite plate structure vibration and noise reducing
Important meaning.Existing typical circular honeycomb sandwich panel structure (as shown in Figure 1) is by among upper surface panel 1 and lower face plate 2
It accompanies honeycomb core 6 and combines and constitute.
Since honeycomb interlayer composite construction itself has sound insulation property, then by microperforated absorber, so that it may form bee
Nest-micropunch composite construction is the effective way for improving honeycomb low frequency absorption performance.In recent years, numerous scholars are to this exhibition
Further investigation is opened.By microperforated panel absorb sound principle it is found that the plate thickness of microperforated panel structure, cavity depth, piercing aperture and
Punching rate size can influence structure sound absorbing performance, i.e. frequency at acoustic absorptivity and sound absorption peak value.Come from existing research achievement
It sees, once assembly is completed, honeycomb sandwich construction just has fixation for the absorption of noise to traditional honeycomb-micropunch composite construction
Property, do not change honeycomb-micropunch composite construction interior shape, it is difficult to realize and composite construction acoustic absorptivity and sound absorption are adjusted at any time
Frequency band.It is not suitable for the modern life and produces ambient noise changeable in each field.
And dielectric elastomer (DE) material, it is the one kind of electron type electroactive polymer (EAP), uses electric field or Coulomb force
As driving force.I.e. after the DE material two sides of upper and lower surface covering flexible electrode are subject to electrostatic pressure effect, material is in level side
Extension is extended up, shrinks become smaller in vertical direction.When being fabricated to micropunch film using a kind of DE material, by material
Applying certain voltage causes material deformation occurs, changes simultaneously so as to cause micropunch aperture and punching rate, finally
It can achieve the purpose that adjustable sound-absorbing frequency.
Honeycomb-micropunch composite construction is special compared with general structure, and mainly larger sound absorption is played in its micropunch part.Cause
This in the case where not changing honeycomb-micropunch composite construction integral layout, directly by change microperforated panel piercing aperture and
Punching rate can make honeycomb-micropunch composite plate structure realize adjustable sound-absorbing frequency, to effectively control noise.
Summary of the invention
The present invention, by top-down vertical drive situation, provides one kind for honeycomb-micropunch film composite structure
Novel honeycomb-micropunch film composite structure design method, makes DE film be fabricated to perforated microstructure, is installed in honeycomb
The heart applies certain voltage to perforated films two sides, film is caused to become in extension direction by the good dielectric properties of material
Change, so that piercing aperture be made to change, simultaneously because hole count is certain, the punching rate of DE micropunch film will also change,
The variation of aperture and punching rate plays adjustment structure sound absorbing performance, and achievees the purpose that composite construction is light.
The present invention solves its technical problem using following technical scheme.Honeycomb-microperforated panel composite structural design method, packet
The honeycomb core for including upper surface panel and lower face plate and its being sandwiched between, which is characterized in that be internally provided with that DE is micro- to be worn in honeycomb core
Hole film, two sides are coated with flexible electrode and are connected by lead with external voltage generation end the DE micropunch film up and down；
Its design procedure is as follows:
1) upper surface panel constitutes the double-deck microperforated panel structure using microperforated panel and DE micropunch film, is pushed away by geneva theory
The double-deck microperforated panel led is theoretical as follows:
It is above it is various in, riFor the opposite acoustic resistance of i-th layer of microperforated panel, miFor the opposite acoustic mass of i-th layer of microperforated panel,
tiFor the plate thickness of i-th layer of microperforated panel, diFor the penetration hole diameter of i-th layer of microperforated panel, piIt is the perforation face of i-th layer of microperforated panel
Product accounts for the percentage of full plate suqare, DiFor the cavity thickness after i-th layer of microperforated panel, kiPerforated plate for i-th layer of microperforated panel is normal
Number, μ are the kinematic coefficient of viscosity of air, and ρ is atmospheric density, and c is THE VELOCITY OF SOUND IN AIR under room temperature, f0For sound frequency, ω is sound
Sound circular frequency, α are the acoustic absorptivity of the double-deck microperforated panel；Z is total relative acoustic impedance of the double-deck microperforated panel；Wherein upper surface
Plate is first layer microperforated panel, and DE micropunch film is second layer microperforated panel；
As Im (z)=0, that is, when meeting following formula, the double-deck porous plate acoustic adsorption device reaches resonance:
Acoustic absorptivity when resonance are as follows:
By above-mentioned theory formula it is found that when piercing aperture d and punching rate p reduces, opposite acoustic resistance r and opposite acoustic mass
M increases, resonant frequency f0Reduce, maximum acoustic absorptivity α0Increase, i.e., absorption peak frequency is mobile to low frequency；
2) micropunch body micropore arrangement generally has rounded projections arranged (solid matter) and square arrangement (white-out) two kinds of forms,
Wherein punching rate calculation formula when rounded projections arranged are as follows:
And punching rate calculation formula when square arrangement are as follows:
In formula, B is pitch of holes, can be calculated the specific distributing position parameter of perforation；
3) numerical value calculating is carried out according to formula (2), (3), (4), (5), as hole diameter d=0.5mm, plate thickness t=0.5mm
When, when punching rate is calculated below 5.5%, maximum acoustic absorptivity of the microperforated panel in middle low frequency is maintained at 0.5 or more.
The present invention compares previous cellular board, has the advantage that cellular board can adjust it according to the needs of concrete scene
For the absorption peak of Middle and low frequency noise to reach optimal noise reduction effect；Use voltage that can reduce as control signal more
Mechanical control element, maintain the light characteristic of cellular board；Hybrid precast can be carried out with normal cellular plate in the form of unit,
Engineering manufacture is easier to realize；In the case where a plate is multi-purpose, the light feature that cellular board is possessed also is maintained, is being navigated
Very extensive application prospect is suffered from empty space flight.
Detailed description of the invention
Fig. 1 is typical circular honeycomb sandwich panel structural schematic diagram；
Fig. 2 is the honeycomb sandwich construction schematic diagram that upper surface is equipped with micropunch；
Fig. 3 is the longitudinal sectional view of honeycomb core 6 in the present invention；
Fig. 4 is embodiment top view in the present invention；
Fig. 5 is planar structure schematic diagram when 3 perforation means of DE perforated films are rounded projections arranged in the present invention；
Fig. 6 is embodiment numerical simulation calculated result figure in the present invention；
Fig. 7 is planar structure schematic diagram when 3 perforation means of DE perforated films are square arrangement in the present invention.
In figure: end, 6. honeycombs occur for 1. upper surface panels, 2. lower face plates, 3.DE micropunch film, 4. leads, 5. voltages
Core.
Specific implementation method
With reference to the accompanying drawing, the present invention will be described in detail.Referring to fig. 2 to Fig. 6.
The present invention is to obtain the preferable sound absorption characteristics of honeycomb sandwich construction, considers to be fabricated to microperforated panel in upper surface panel 1, such as
Shown in Fig. 2.
A honeycomb core 6 is taken out in honeycomb sandwich construction as shown in Figure 2, and one piece of Fig. 5 institute is added inside honeycomb core 6
The DE micropunch film 3 shown does not consider that film itself vibrates since DE micropunch 3 sizes of film installed in honeycomb core are smaller
Caused additional acoustic impedance, about 3 two sides of DE micropunch film are first plated with certain thickness conductive electrode respectively, then use lead
4, which occur end 5 with external voltage, is connected.Wherein, DE micropunch film 3 is fixed on 6 midpoint of honeycomb core, and punching rate should not mistake
High or too low, aperture also should not be too large or too small.In order to make DE micropunch film 3 generate bigger extension after powered up, pacifying
The mounting means of pretension should be taken DE micropunch film 3 when dress.
Embodiment: the solid matter honeycomb on cylinder boundary, top view such as Fig. 4, side view are as shown in Figure 3.Wherein honeycomb core 6
Size is as follows: honeycomb core 6 internal diameter 5.7mm, height 60mm, thickness 0.3mm；The size of upper and lower surfaces plate 1,2: radius 18mm is thick
1mm is spent, wherein upper surface panel 1 is to wear with the microperforated panel of the micropore of aperture 0.5mm, punching rate 5%；The present embodiment only exists
Center is arranged addition DE micropunch film 3 and subsidiary lead 4 and external voltage in single honeycomb core 6 and end 5 occurs.
Solution domain sizes when emulation are as follows: bound radius 18mm, boundary whole height 100mm, honeycomb sandwich construction are steady
It is placed in and solves domain lowermost end.
Fig. 5 is the DE micropunch film 3 that position is fixed in honeycomb core 6 of the present invention, using wearing for rounded projections arranged (solid matter)
Hole mode, in Fig. 5 middle punch diameter d=0.5mm, pitch of holes B=2.5mm, honeycomb core internal diameter R=5.7mm, DE micropunch film
3 initial perforated rate is 3.65%, and perforation number is 19.
Apply voltage in 3 external lead wire 4 of DE micropunch film and the certain voltage U that end 5 exports occurs1Afterwards, DE micropunch is thin
The piercing aperture of film 3 narrows down to 0.45mm, and punching rate is also reduced to 2.96% at this time；When output voltage is U2When, DE micropunch is thin
The aperture of film 3 narrows down to 0.4mm, and punching rate is reduced to 2.34% at this time；When output voltage is U3When, the hole of DE micropunch film 3
Diameter narrows down to 0.35mm, and punching rate is reduced to 1.79% at this time.
Above-described embodiment is emulated to obtain acoustic absorptivity using numerical simulation software COMSOL as shown in Figure 6.Center
When single honeycomb core 6 adds DE micropunch film 3, the acoustic absorptivity of structure has an absorption peak, absorption peak master in 950hz
It when aperture and punching rate reduce simultaneously, to be inhaled by 3 bring of DE micropunch film from the sound absorption of upper surface panel 1
It is mobile to low frequency to receive peak, meets notional result.Also, with the micropunch bring absorption peak of upper surface panel 1 and DE micropunch
The absorption peak of film 3 it is close, sound absorbing performance of the structure in the frequency range between two absorption peaks is also being obviously improved.
Since the calculating only takes into account maximum acoustic absorptivity, then lower punching rate should be chosen accordingly in actual design
So that bandwidth when acoustic absorptivity is 0.5 is wider, when design, is handled model according to this principle.Therefore the present invention is utilized,
Honeycomb-micropunch composite plate structure can be made to realize adjustable sound-absorbing frequency, to effectively control noise.
The spread pattern closed between micropore in the present invention has rounded projections arranged (solid matter) and square arrangement (white-out) two
Kind form.Above-described embodiment 1 is using the perforation means for being rounded projections arranged.And the as shown in Fig. 7 perforation of square arrangement
There is mode same laws of use to repeat no more.
Claims (1)
1. honeycomb-microperforated panel composite structural design method, including upper surface panel and lower face plate and its honeycomb being sandwiched between
Core, which is characterized in that be internally provided with DE micropunch film in honeycomb core, which is coated with flexible electrical in two sides up and down
Pole and end is occurred with external voltage by lead it is connected；Its design procedure is as follows:
1) upper surface panel constitutes the double-deck microperforated panel structure using microperforated panel and DE micropunch film, is obtained by geneva theory deduction
The double-deck microperforated panel arrived is theoretical as follows:
It is above it is various in, riFor the opposite acoustic resistance of i-th layer of microperforated panel, miFor the opposite acoustic mass of i-th layer of microperforated panel, tiFor
The plate thickness of i-th layer of microperforated panel, diFor the penetration hole diameter of i-th layer of microperforated panel, piIt is that the perforation field of i-th layer of microperforated panel accounts for
The percentage of full plate suqare, DiFor the cavity thickness after i-th layer of microperforated panel, kiFor the perforated plate constant of i-th layer of microperforated panel, μ
For the kinematic coefficient of viscosity of air, ρ is atmospheric density, and c is THE VELOCITY OF SOUND IN AIR under room temperature, f0For sound frequency, ω is sound circle
Frequency, α are the acoustic absorptivity of the double-deck microperforated panel；Z is total relative acoustic impedance of the double-deck microperforated panel；Wherein upper surface panel is
First layer microperforated panel, DE micropunch film are second layer microperforated panel；
As Im (z)=0, that is, when meeting following formula, the double-deck porous plate acoustic adsorption device reaches resonance:
Acoustic absorptivity when resonance are as follows:
By above-mentioned theory formula it is found that when piercing aperture d and punching rate p reduces, opposite acoustic resistance r and opposite acoustic mass m increase
Greatly, resonant frequency f0Reduce, maximum acoustic absorptivity α0Increase, i.e., absorption peak frequency is mobile to low frequency；
2) punching rate is obtained by punching rate calculation formula when micropore rounded projections arranged are as follows:
In formula, B is pitch of holes, can be calculated the specific distributing position parameter of perforation；
3) numerical value calculating is carried out according to formula (2), (3), (4), (5), as hole diameter d=0.5mm, plate thickness t=0.5mm,
When punching rate is calculated below 5.5%, maximum acoustic absorptivity of the microperforated panel in middle low frequency is maintained at 0.5 or more.
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| CN201910365851.9A CN110085207B (en) | 2019-05-05 | 2019-05-05 | Method for designing honeycomb-micro-perforated film composite structure |
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| CN201910365851.9A CN110085207B (en) | 2019-05-05 | 2019-05-05 | Method for designing honeycomb-micro-perforated film composite structure |
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| CN110085207B CN110085207B (en) | 2022-10-25 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110427731A (en) * | 2019-09-05 | 2019-11-08 | 南昌航空大学 | A kind of honeycomb and its design method of adjustable sound absorbing performance |
| CN112365872A (en) * | 2020-11-10 | 2021-02-12 | 国网北京市电力公司 | Noise reduction regulation and control method, device and system and processor |
| CN112687252A (en) * | 2020-12-18 | 2021-04-20 | 浙江大学 | Device for regulating and controlling low-frequency sound insulation performance of sandwich plate structure and parameter determination method thereof |
| CN112699574A (en) * | 2021-01-20 | 2021-04-23 | 南昌航空大学 | Adjustable dielectric elastomer sandwich honeycomb-micro perforated plate structure and design method |
| IT202100002015A1 (en) * | 2021-02-01 | 2021-05-01 | Aprea Vincenzo | OPTIMIZED SOUND-INSULATION DEVICE |
| CN114044013A (en) * | 2021-11-24 | 2022-02-15 | 中车南京浦镇车辆有限公司 | Local resonance system and vibration/noise reduction vehicle body section bar plate |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110427731A (en) * | 2019-09-05 | 2019-11-08 | 南昌航空大学 | A kind of honeycomb and its design method of adjustable sound absorbing performance |
| CN110427731B (en) * | 2019-09-05 | 2024-06-25 | 南昌航空大学 | Honeycomb structure with adjustable sound absorption performance and design method thereof |
| CN112365872A (en) * | 2020-11-10 | 2021-02-12 | 国网北京市电力公司 | Noise reduction regulation and control method, device and system and processor |
| CN112365872B (en) * | 2020-11-10 | 2024-05-28 | 国网北京市电力公司 | Noise reduction regulation method, device and system and processor |
| CN112687252A (en) * | 2020-12-18 | 2021-04-20 | 浙江大学 | Device for regulating and controlling low-frequency sound insulation performance of sandwich plate structure and parameter determination method thereof |
| CN112699574A (en) * | 2021-01-20 | 2021-04-23 | 南昌航空大学 | Adjustable dielectric elastomer sandwich honeycomb-micro perforated plate structure and design method |
| IT202100002015A1 (en) * | 2021-02-01 | 2021-05-01 | Aprea Vincenzo | OPTIMIZED SOUND-INSULATION DEVICE |
| CN114044013A (en) * | 2021-11-24 | 2022-02-15 | 中车南京浦镇车辆有限公司 | Local resonance system and vibration/noise reduction vehicle body section bar plate |
| CN114044013B (en) * | 2021-11-24 | 2023-08-15 | 中车南京浦镇车辆有限公司 | Local resonance system and damping and noise reduction vehicle body profile plate |
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| Publication number | Publication date |
|---|---|
| CN110085207B (en) | 2022-10-25 |
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