CN110073472A - Substrate processing method using same, feeding method and substrate board treatment - Google Patents

Substrate processing method using same, feeding method and substrate board treatment Download PDF

Info

Publication number
CN110073472A
CN110073472A CN201780077433.9A CN201780077433A CN110073472A CN 110073472 A CN110073472 A CN 110073472A CN 201780077433 A CN201780077433 A CN 201780077433A CN 110073472 A CN110073472 A CN 110073472A
Authority
CN
China
Prior art keywords
flushing liquor
purity
substrate
low
medical fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201780077433.9A
Other languages
Chinese (zh)
Other versions
CN110073472B (en
Inventor
辻川裕贵
三浦淳靖
藤田和宏
土桥裕也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of CN110073472A publication Critical patent/CN110073472A/en
Application granted granted Critical
Publication of CN110073472B publication Critical patent/CN110073472B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02296Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02296Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02343Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A kind of substrate processing method using same includes: medical fluid supplying step supplies the medical fluid containing ion to the surface of substrate;Low-purity flushing liquor supplying step executes after the medical fluid supplying step, and the low-purity flushing liquor containing impurity is supplied to the surface of the substrate, and the ionic interaction of the impurity contained by with medical fluid and forms precipitate;And high-purity flushing liquor supplying step, it is executed between the medical fluid supplying step and the low-purity flushing liquor supplying step, the amount of the contained impurity high-purity flushing liquor fewer than the low-purity flushing liquor is supplied to the surface of the substrate.

Description

Substrate processing method using same, feeding method and substrate board treatment
Technical field
The substrate processing method using same that the present invention relates to a kind of to handle substrate, substrate board treatment and processing substrate is filled The feeding method of nozzle liquor charging used in setting.Substrate as process object is set for example including semiconductor crystal wafer, liquid crystal display Standby baseboard, organic EL (Electroluminescence;Electroluminescent) display equipment etc. FPD (Flat Panel Display;Flat-panel monitor) use substrate, light base-board for plate, substrate for magnetic disc, optomagnetic base-board for plate, photomask (photomask) with the substrate of substrate, ceramic substrate, substrate for solar cell etc..
Background technique
In the substrate processing method using same documented by following patent documents 1, medical fluid is supplied to substrate, in order to rinse attachment In the medical fluid of substrate, carbonated water is supplied to substrate.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2001-358109 bulletin
Summary of the invention
Problems to be solved by the invention
When generating particle (particle) on the substrate after processing substrate, the technique after processing substrate (half is had The manufacture of conductor device) etc. in generation act undesirable possibility.Therefore, back and forth by avoiding acid medical fluid and alkalinity The mixing of medical fluid implements preventive measure to the generation of particle with filter filtering liquid medicine or flushing (rinse) liquid.However, It has generation in technique after processing substrate (manufacture of semiconductor device) etc. and acts undesirable situation.
Inventors search out with flushing liquor rinse be attached to substrate surface medical fluid after on substrate produced by Precipitate be the technique after processing substrate the bad reason of movement.Due to such precipitate will not supply on substrate it It is detected in preceding flushing liquor as particle, therefore not undesirable by the movement as the technique after processing substrate up to now Reason attracts attention.The generation of such precipitate is not only on substrate, can also be made in the flow path that flushing liquor and medical fluid pass through At.
In order to avoid the generation of precipitate, although can consider to execute processing substrate using the flushing liquor of higher degree, The the frequency of use of such flushing liquor the high, cost needed for processing substrate more increases.
Therefore, it is an object of the present invention to provide it is a kind of can inhibit cost increase and can inhibit or prevent precipitate Substrate processing method using same, feeding method and the substrate board treatment of generation.
Means for solving the problems
In processing substrate, flushing liquor and medical fluid are will not pass through ingredient contained by medical fluid script and flushing liquor script institute The mode that the ingredient contained forms precipitate is selected.Nevertheless, still can be when rinsing the medical fluid on substrate with flushing liquor Form precipitate.
Therefore, the present inventors think become the precipitate the reason of object be even if be dissolved to flushing liquor or medical fluid or The undissolved diameter to the flushing liquor or medical fluid object is all than the boundary (example of the detection of particle collector (particle counter) Such as 18nm) also small object.Also, it is impurity and medical fluid because contained by flushing liquor that inventors, which search out the precipitate, Produced by interaction between contained ion.
Embodiments of the present invention provide a kind of substrate processing method using same, include: medical fluid supplying step, by the medicine containing ion Liquid is supplied to the surface of substrate;Low-purity flushing liquor supplying step executes after the medical fluid supplying step, and will contain miscellaneous The low-purity flushing liquor of matter is supplied to the surface of the substrate, and the impurity passes through the ion phase contained by with the medical fluid Interaction and form precipitate;And high-purity flushing liquor supplying step, it is rushed in the medical fluid supplying step and the low-purity It is executed between washing lotion supplying step, the amount of the contained impurity high-purity also fewer than the low-purity flushing liquor is rinsed Liquid is supplied to the surface of the substrate.
According to the method, high-purity is executed between medical fluid supplying step and low-purity flushing liquor supplying step and rinses step Suddenly.Therefore, it is supplied in medical fluid supplying step also fewer than low-purity flushing liquor by the amount of impurity to the medical fluid on substrate High-purity flushing liquor with after high-purity flushing liquor supply on substrate low-purity flushing liquor rinse.Therefore, and only with height The processing substrate of purity flushing liquor processing solution is compared, cost needed for reducing processing substrate.
In addition, in high-purity flushing liquor supplying step performed before low-purity flushing liquor supplying step, on substrate Part or all of medical fluid replaced by high-purity flushing liquor.As a result, before executing low-purity flushing liquor supplying step, base The concentration of the ion in medical fluid on plate is at least by high-purity flushing liquor thinning.Therefore, the ion contained by medical fluid is at least reduced With the interaction between the impurity contained by low-purity flushing liquor.In addition, in the ion contained by medical fluid completely from base In the situation excluded on plate, the interaction will not be generated.Therefore, inhibit or prevent the analysis in low-purity flushing liquor supplying step The formation of object out.
Therefore, the increase of cost can be inhibited and inhibit or prevent the generation of precipitate.
In an embodiment of the invention, the medical fluid includes acid aqueous solution, the low-purity flushing liquor Contain the organic matter as the impurity.
When acid aqueous solution is mixed with the flushing liquor containing the organic matter as impurity, the feelings to form precipitate are had Shape.Think the formation of the precipitate due to saltout (salting out).It saltouts and refers to the shape in having dispersed in the solvents such as water The organic matter of state is aggregated using the effect of salt.Specifically, hydrone be led to the anion in acid aqueous solution and Hydrone becomes the hydrate water (hydrated water) of the anion, to remove hydration in the hydrone of organic matter.In this way, The hydrone as needed for the hydration of organic matter is insufficient, organic matter agglutination.By the agglutination, precipitate is generated.As As the anion for the Producing reason saltoutd, can enumerate such as the chloride ion contained by hydrochloric acid.It saltouts as becoming Producing reason organic matter, can enumerate such as protein and the molecular weight organic compound also smaller than protein.
Therefore, in high-purity flushing liquor supplying step performed before low-purity flushing liquor supplying step, pass through height Thus part or all of the aqueous solution of acidity on purity flushing liquor displacement substrate is executing low-purity flushing liquor supply step The concentration of the anion in acid aqueous solution before rapid on substrate is at least by high-purity flushing liquor thinning.Therefore, it at least drops The interaction between organic matter contained by the low anion and low-purity flushing liquor.In addition, becoming the reason of saltouing Anion from the situation fully excluded on substrate, will not generate the interaction.Therefore, inhibit or prevent low-purity The formation of precipitate in flushing liquor supplying step.
In an embodiment of the invention, the low-purity flushing liquor also may include that the carbonic acid containing carbon dioxide contains There is liquid.
In an embodiment of the invention, the substrate processing method using same also includes: the supply of the second low-purity flushing liquor Step executes before the medical fluid supplying step, supplying the low-purity flushing liquor to the surface of the substrate;With And the second high-purity flushing liquor supplying step, the medical fluid supplying step and the second low-purity flushing liquor supplying step it Between execute, supplying the high-purity flushing liquor to the surface of the substrate.
According to the method, the second low-purity flushing liquor supplying step is executed before medical fluid supplying step, and is supplied in medical fluid To executing the second high-purity flushing liquor supplying step between step and the second low-purity flushing liquor supplying step.Therefore, to With in the processing substrate on the surface of flushing liquor cleaning base plate, the surface of substrate is by the amount of impurity before medical fluid supplying step The high-purity flushing liquor also fewer than low-purity flushing liquor is rinsed with the low-purity flushing liquor supplied after high-purity flushing liquor. Therefore, compared with the processing substrate on surface for only cleaning substrate with high-purity flushing liquor, cost needed for reducing processing substrate.
In addition, in the second high-purity flushing liquor supplying step performed before medical fluid supplying step, it is low on substrate Part or all of purity flushing liquor is replaced by high-purity flushing liquor.As a result, before executing medical fluid supplying step, at least drop The amount of the impurity in flushing liquor on low substrate.Therefore, it at least reduces contained by the ion and low-purity flushing liquor contained by medical fluid Interaction between some impurity.In addition, this will not be generated mutually in impurity completely from the situation excluded on substrate Effect.Therefore, inhibit or prevent the formation of the precipitate in medical fluid supplying step.
Therefore, in the processing substrate on the surface to clean substrate with flushing liquor before medical fluid supplying step, can press down This increase is made and inhibits or prevent the generation of precipitate.
An embodiment of the invention provides a kind of feeding method, to via common flow path liquor charging to nozzle, this is sent Liquid method includes: flow path medical fluid supplying step, and the medical fluid containing ion is supplied to the common flow path;Flow path low-purity is rinsed Liquid supplying step supplies the low-purity flushing liquor containing impurity to the common stream after the flow path medical fluid supplying step Road, the ionic interaction of the impurity contained by with medical fluid and, form precipitate;And flow path high-purity Flushing liquor supplying step, will be contained between the flow path medical fluid supplying step and the flow path low-purity flushing liquor supplying step The amount for the impurity the having high-purity flushing liquor also fewer than the low-purity flushing liquor is supplied to the common flow path.
According to the method, it is high that flow path is executed between flow path medical fluid supplying step and flow path low-purity flushing liquor supplying step Purity rinsing step.Therefore, in flow path medical fluid supplying step supply to common flow path medical fluid by the amount of impurity than low The also few high-purity flushing liquor of purity flushing liquor with after high-purity flushing liquor supply to common flow path low-purity flushing liquor It rinses.Therefore, with only with the feeding method of high-purity flushing liquor processing solution compared with, reduce required cost.
In addition, flow path high-purity flushing liquor supplying step performed before flow path low-purity flushing liquor supplying step In, part or all of medical fluid in common flow path is replaced by high-purity flushing liquor.Executing the flushing of flow path low-purity as a result, Before liquid supplying step, the concentration of the ion in medical fluid in common flow path is at least by high-purity flushing liquor thinning.Therefore, at least Reduce the interaction between the impurity contained by the ion and low-purity flushing liquor contained by medical fluid.In addition, contained by the medical fluid Some ions completely from the situation excluded in common flow path, will not generate the interaction.Therefore, inhibition or anti-fluid stopping The formation of precipitate in the low-purity flushing liquor supplying step of road.
Therefore, the increase of cost can be inhibited and inhibit or prevent the generation of precipitate.
In an embodiment of the invention, the medical fluid includes acid aqueous solution, the low-purity flushing liquor Contain the organic matter as the impurity.Therefore, flow path performed before flow path low-purity flushing liquor supplying step is high-purity It spends in flushing liquor supplying step, a part or complete of the acid aqueous solution in common flow path is replaced by high-purity flushing liquor Portion.The anion in the acid aqueous solution before executing flow path low-purity flushing liquor supplying step on substrate is dense as a result, Degree is at least by high-purity flushing liquor thinning.Therefore, at least reduce the anion and organic matter contained by low-purity flushing liquor it Between interaction.In addition, in the anion for becoming the reason of saltouing from the situation fully excluded in common flow path, The interaction will not be generated.Therefore, inhibit or prevent the formation of the precipitate in flow path low-purity flushing liquor supplying step.
In an embodiment of the invention, the low-purity flushing liquor also may include that the carbonic acid containing carbon dioxide contains There is liquid.
In the one of embodiments of the present invention, the feeding method includes: the supply of second flow path low-purity flushing liquor Step executes before the flow path medical fluid supplying step, supplying the low-purity flushing liquor to the common flow path; And second flow path high-purity flushing liquor supplying step, it is rushed in the flow path medical fluid supplying step and the second flow path low-purity It is executed between washing lotion supplying step, supplying the high-purity flushing liquor to the common flow path.
According to the method, second flow path low-purity flushing liquor supplying step is executed before flow path medical fluid supplying step, and Second flow path high-purity flushing liquor is executed between flow path medical fluid supplying step and second flow path low-purity flushing liquor supplying step Supplying step.Therefore, in the method to clean common flow path before flow path medical fluid supplying step with flushing liquor, common stream Road is supplied with after high-purity flushing liquor to base by the amount of the impurity high-purity flushing liquor also fewer than low-purity flushing liquor Low-purity flushing liquor on plate rinses.Therefore, it compared with the feeding method for only cleaning common flow path with high-purity flushing liquor, reduces Required cost.
In addition, in second flow path high-purity flushing liquor supplying step performed before flow path medical fluid supplying step, altogether Part or all of low-purity flushing liquor in through-flow road is replaced by high-purity flushing liquor.Executing the confession of flow path medical fluid as a result, Before step, the amount of the impurity in the flushing liquor in common flow path is at least reduced.Therefore, at least reduce medical fluid contained by from The interaction between impurity contained by son and low-purity flushing liquor.In addition, having been arranged out of common flow path completely in impurity In the situation removed, the interaction will not be generated.Therefore, inhibit or prevent the shape of the precipitate in flow path medical fluid supplying step At.
Therefore, in the method to clean common flow path before flow path medical fluid supplying step with flushing liquor, can inhibit The increase of cost and the generation for inhibiting or preventing precipitate.
An embodiment of the invention provides a kind of substrate board treatment, includes: medical fluid feed unit will contain ion Medical fluid supply to the surface of substrate;Low-purity flushing liquor feed unit, will the low-purity flushing liquor containing impurity supply to The surface of the substrate, the impurity form precipitate and with ionic interaction contained by the medical fluid;High-purity Flushing liquor feed unit supplies the amount of the contained impurity high-purity flushing liquor also fewer than the low-purity flushing liquor To the surface of the substrate;And controller, control the medical fluid feed unit, the low-purity flushing liquor feed unit and The high-purity flushing liquor feed unit.
Also, the controller executes: medical fluid supplying step supplies the medical fluid to the surface of the substrate;And Low-purity flushing liquor supplying step supplies the low-purity flushing liquor to the substrate after the medical fluid supplying step Surface;Also, the controller executed between the medical fluid supplying step and the low-purity flushing liquor supplying step to The high-purity flushing liquor is supplied to the high-purity flushing liquor supplying step on the surface of the substrate.
According to this configuration, high-purity is executed between medical fluid supplying step and low-purity flushing liquor supplying step rinse step Suddenly.Therefore, it is supplied in medical fluid supplying step also fewer than low-purity flushing liquor by the amount of impurity to the medical fluid on substrate High-purity flushing liquor with after high-purity flushing liquor supply on substrate low-purity flushing liquor rinse.Therefore, and only with height The processing substrate of purity flushing liquor processing solution is compared, cost needed for reducing processing substrate.
In addition, in high-purity flushing liquor supplying step performed before low-purity flushing liquor supplying step, on substrate Part or all of medical fluid replaced by high-purity flushing liquor.As a result, before executing low-purity flushing liquor supplying step, base The concentration of the ion in medical fluid on plate is at least by high-purity flushing liquor thinning.Therefore, the ion contained by medical fluid is at least reduced With the interaction between the impurity contained by low-purity flushing liquor.In addition, in the ion contained by medical fluid completely from base In the situation excluded on plate, the interaction will not be generated.Therefore, inhibit or prevent the analysis in low-purity flushing liquor supplying step The formation of object out.
Therefore, the increase of cost can be inhibited and inhibit or prevent the generation of precipitate.
In an embodiment of the invention, the medical fluid feed unit include to by acid aqueous solution supply to The acidic aqueous solution feed unit on the surface of the substrate, the low-purity flushing liquor contain the organic matter as the impurity. Therefore, it in high-purity flushing liquor supplying step performed before low-purity flushing liquor supplying step, is rinsed by high-purity Part or all of the aqueous solution of acidity on liquid displacement substrate.As a result, before executing low-purity flushing liquor supplying step The concentration of the anion in acid aqueous solution on substrate is at least by high-purity flushing liquor thinning.Therefore, the yin is at least reduced The interaction between organic matter contained by ion and low-purity flushing liquor.In addition, in the anion for becoming the reason of saltouing From the situation fully excluded on substrate, the interaction will not be generated.Therefore, inhibit or prevent low-purity flushing liquor The formation of precipitate in supplying step.
In an embodiment of the invention, the low-purity flushing liquor feed unit also may include: carbonic acid contains liquid Feed unit is supplied the carbonic acid containing carbon dioxide is contained liquid to the surface of the substrate.
In an embodiment of the invention, the controller setting are as follows: execute the second low-purity flushing liquor supply step Suddenly, the low-purity flushing liquor is supplied to the surface of the substrate before the medical fluid supplying step;And execute second High-purity flushing liquor supplying step is held between the medical fluid supplying step and the second low-purity flushing liquor supplying step Row, supplying the high-purity flushing liquor to the surface of the substrate.
According to this configuration, the second low-purity flushing liquor supplying step is executed before medical fluid supplying step, and is supplied in medical fluid To executing the second high-purity flushing liquor supplying step between step and the second low-purity flushing liquor supplying step.Therefore, to With in the processing substrate on the surface of flushing liquor cleaning base plate, the surface of substrate is by the amount of impurity before medical fluid supplying step The high-purity flushing liquor also fewer than low-purity flushing liquor is rinsed with supplying after high-purity flushing liquor to the low-purity on substrate Liquid rinses.Therefore, it compared with the processing substrate on surface for only cleaning substrate with high-purity flushing liquor, reduces needed for processing substrate Cost.
In addition, in the second high-purity flushing liquor supplying step performed before medical fluid supplying step, it is low on substrate Part or all of purity flushing liquor is replaced by high-purity flushing liquor.As a result, before executing medical fluid supplying step, at least drop The amount of the impurity in flushing liquor on low substrate.Therefore, it at least reduces contained by the ion and low-purity flushing liquor contained by medical fluid Interaction between some impurity.In addition, this will not be generated mutually in impurity completely from the situation excluded on substrate Effect.Therefore, inhibit or prevent the formation of the precipitate in medical fluid supplying step.
Therefore, in the processing substrate on the surface to clean substrate with flushing liquor before medical fluid supplying step, can press down This increase is made and inhibits or prevent the generation of precipitate.
In an embodiment of the invention, the substrate board treatment also includes: nozzle;And common flow path, it send Liquid is to the nozzle.The medical fluid feed unit includes: medical fluid valve, whether supplies the medicine to the common flow path to switch Liquid.Whether the low-purity flushing liquor feed unit includes: low-purity rinse fluid valve, supply to the common flow path to switch The low-purity flushing liquor.Whether the high-purity flushing liquor feed unit includes: high-purity rinse fluid valve, to switch to institute It states common flow path and supplies the high-purity flushing liquor.
Also, the controller controls the medical fluid valve, the low-purity rinse fluid valve and the high-purity flushing liquor Valve.The controller executes: flow path medical fluid supplying step supplies the medical fluid to the common flow path;And flow path is low pure Flushing liquor supplying step is spent, supplies the low-purity flushing liquor to the common stream after the flow path medical fluid supplying step Road;Also, the controller is held between the flow path medical fluid supplying step and the flow path low-purity flushing liquor supplying step Row is supplying the high-purity flushing liquor to the flow path high-purity flushing liquor supplying step of the common flow path.
According to this configuration, it is high that flow path is executed between flow path medical fluid supplying step and flow path low-purity flushing liquor supplying step Purity rinsing step.Therefore, in flow path medical fluid supplying step supply to common flow path medical fluid by the amount of impurity than low The also few high-purity flushing liquor of purity flushing liquor with after high-purity flushing liquor supply to common flow path low-purity flushing liquor It rinses.Therefore, with only with the feeding method of high-purity flushing liquor processing solution compared with, reduce required cost.
In addition, flow path high-purity flushing liquor supplying step performed before flow path low-purity flushing liquor supplying step In, part or all of medical fluid in common flow path is replaced by high-purity flushing liquor.Executing the flushing of flow path low-purity as a result, Before liquid supplying step, the concentration of the ion in medical fluid in common flow path is at least by high-purity flushing liquor thinning.Therefore, at least Reduce the interaction between the impurity contained by the ion and low-purity flushing liquor contained by medical fluid.In addition, contained by the medical fluid Some ions completely from the situation excluded in common flow path, will not generate the interaction.Therefore, inhibition or anti-fluid stopping The formation of precipitate in the low-purity flushing liquor supplying step of road.
Therefore, the increase of cost can be inhibited and inhibit or prevent the generation of precipitate.
The purpose, feature and effect of the invention and other purposes, feature and effect energy referring to attached drawing and pass through The explanation of following embodiments and it is more than you know.
Detailed description of the invention
Fig. 1 is bowing for layout (layout) of the inside to illustrate the substrate board treatment of first embodiment of the invention View.
Fig. 2 is to illustrate the schematical vertical of a configuration example of processing unit that the substrate board treatment has Cross-sectional view.
Fig. 3 is the block diagram electrically constituted to illustrate the major part of the substrate board treatment.
Fig. 4 is the flow chart to an example for illustrating the processing substrate of the substrate board treatment.
Fig. 5 A is the schematic diagram on the periphery of the substrate in carbonated water flushing processing (the step S3 of Fig. 4).
Fig. 5 B is DIW (deionized water;Deionized water) flushing processing (the step S4 of Fig. 4) in substrate week The schematic diagram on side.
Fig. 5 C is the schematic diagram on the periphery of the substrate in SC2 (hydrochloric acid hydrogen peroxide solution) processing (the step S5 of Fig. 4).
Fig. 5 D is the schematic diagram on the periphery of the substrate in DIW flushing processing (the step S6 of Fig. 4).
Fig. 5 E is the schematic diagram on the periphery of the substrate in carbonated water flushing processing (the step S7 of Fig. 4).
Fig. 6 A is the periphery of mixing valve (mixing valve) unit in carbonated water flushing processing (the step S3 of Fig. 4) Schematic diagram.
Fig. 6 B is the schematic diagram on the periphery of the mixing valve cell in DIW flushing processing (the step S4 of Fig. 4).
Fig. 6 C is the schematic diagram on the periphery of the mixing valve cell in SC2 processing (the step S5 of Fig. 4).
Fig. 6 D is the schematic diagram on the periphery of the mixing valve cell in DIW flushing processing (the step S6 of Fig. 4).
Fig. 6 E is the schematic diagram on the periphery of the mixing valve cell in carbonated water flushing processing (the step S7 of Fig. 4).
Fig. 7 is the flow chart to the other examples for illustrating the processing substrate of the substrate board treatment.
Fig. 8 is the flow chart to another other examples for illustrating the processing substrate of the substrate board treatment.
Specific embodiment
< first embodiment >
Fig. 1 is the top view to the layout for the inside for illustrating the substrate board treatment 1 of first embodiment of the invention.Base Plate processing unit 1 is the device to handle the single sheet type of the substrates such as Silicon Wafer W one by one.In the present embodiment, substrate W is circle The substrate of shape.
Substrate board treatment 1 includes: multiple processing units 2, to handle substrate W;Multiple loading ports (load port) LP keeps carrier (carrier) C, carrier C to be housed in multiple substrates W that processing unit 2 is handled respectively; Conveying robot IR and conveying robot CR, to load handling substrate W between port LP and processing unit 2;And controller 3, to control base board processing unit 1.Conveying robot IR handling substrate W between carrier C and conveying robot CR.It carries Manipulator CR handling substrate W between conveying robot IR and processing unit 2.
Multiple processing units 2 are for example constituted with same.Processing unit 2 includes: chamber (chamber) 14, accommodates base Plate W, to handle substrate W using treatment fluid;And tubing is matched in fluid case portion 15, receiving, it should be with tubing to supply in chamber 14 The fluids such as the treatment fluid or gas that inside use handle substrate W.
Treatment fluid is, for example, medical fluid or flushing liquor etc..Medical fluid is, for example, to be formed in substrate W to the removal from the surface of substrate W Surface film or from the surface of substrate W removal be attached to substrate W surface particle or metallic pollution etc. liquid.Punching Washing lotion is the deionized water (DIW) etc. to rinse out medical fluid from the surface etc. of substrate W.
Although illustration omitted, it is formed in chamber 14 to move in substrate W in chamber 14 and out of chamber 14 Move out the entrance of substrate W.Also, has gear door (shutter) list the entrance to be opened and closed in chamber 14 Member.
Fig. 2 is the schematical longitudinal section view to illustrate processing unit 2 configuration example.
Processing unit 2 include rotary chuck (spin chuck) 5, the cup portion (cup) 8 of tubular, first jet 11 and Second nozzle 12.
Rotary chuck 5 makes substrate W around the center for passing through substrate W while keeping a substrate W with horizontal posture The rotation axis A1 of the vertical in portion rotates.Cup portion 8 surrounds rotary chuck 5.First jet 11 and second nozzle 12 are respectively by fluid It supplies to the upper surface (surface) of substrate W.
Rotary chuck 5 is an example that substrate keeps rotary unit.Rotary chuck 5 includes multiple chuck pin (chuck Pin) 20, rotating basis (spin base) 21, rotary shaft 22 and electric motor 23.
Rotary shaft 22 extends along rotation axis A1 in vertical direction.The upper end of rotary shaft 22 is bound to rotating basis 21 Lower surface center.Rotating basis 21 has the disc-shape along horizontal direction.Multiple chuck pins 20 are matched in circumferential direction across interval It is placed in the peripheral part of the upper surface of rotating basis 21.Electric motor 23 bestows rotary force to rotary shaft 22.Pass through electric motor 23 rotate rotary shaft 22, and thus substrate W is rotated around rotation axis A1.
First jet 11 has the ejiction opening 11a with the upper surface opposite direction of substrate W.First jet 11 is moved by first jet Motivation structure 24 is in the horizontal direction and vertical direction is mobile.First jet 11 can be in center and initial position (home Position it) is moved in the horizontal direction between (retreating position).First jet 11 is positioned at the upper of center Shi Huiyu substrate W The rotation center on surface is opposite.First jet 11 will not be opposite with the upper surface of substrate W when being located at initial position.
Under vertical view, initial position is the position in the outside of rotating basis 21.More specifically, initial position also can be cup portion The position in 8 outside.First jet 11 need not be the moving nozzle mobile by first jet mobile mechanism 24, also can be position Set fixed fixed nozzle.
Second nozzle 12 has the ejiction opening 12a with the upper surface opposite direction of substrate W.Second nozzle 12 is moved by second nozzle Motivation structure 25 is in the horizontal direction and vertical direction is mobile.Second nozzle 12 can center and initial position (retreating position) it Between move in the horizontal direction.Rotation center of the second nozzle 12 in the upper surface positioned at center Shi Huiyu substrate W is opposite.The Two nozzles 12 will not be opposite with the upper surface of substrate W when being located at initial position.
Under vertical view, initial position is the position in the outside of rotating basis 21.More specifically, initial position also can be cup portion The position in 8 outside.Second nozzle 12 need not be the moving nozzle mobile by second nozzle mobile mechanism 25, also can be position Set fixed fixed nozzle.
The first treatment fluid feed path P61 is combined in first jet 11.Second processing liquid is combined in second nozzle 12 Feed path P62.First treatment fluid feed path P61 and second processing liquid feed path P62 is for example all piping.First processing Liquid feed path P61 and second processing liquid feed path P62 is connected to mixing valve cell 6.First treatment fluid feed path P61 and Second processing liquid feed path P62 receives the supply for the treatment of fluid from mixing valve cell 6.
Mixing valve cell 6 include to the common flow path 60 of liquor charging to nozzle 11,12, outflow side multiple valve V61, V62, inflow side multiple valve V63~V67 and tapping valve V68.Multiple valve V61~V68 are all open and close valve.First treatment fluid Feed path P61 is bound to common flow path 60.The first treatment fluid feed path P61 be equipped with outflow side multiple valve V61, The first treatment fluid valve V61 in V62.In multiple valve V61, V62 that second processing liquid feed path P62 is equipped with outflow side Second processing liquid valve V62.In second processing liquid feed path P62, also can second processing liquid valve V62 together through-flow road 60 it Between filter 45 is installed.
Common flow path 60 be combined with to apply the fluid to common flow path 60 multiple fluid delivery path P63~ P67.Multiple fluid delivery path P63~P67 are for example all piping.It is separately installed in multiple fluid delivery path P63~P67 Multiple valve V63~V67 of inflow side.By the way that valve V63~V67 to be opened and closed, whether switching supplies treatment fluid to common flow path 60.
Multiple fluid delivery path P63~P67 include first fluid feed path P63, second fluid feed path P64, third fluid delivery path P65, the 4th fluid delivery path P66 and the 5th fluid delivery path P67.Multiple valve V63 ~V67 includes first fluid valve V63, second fluid valve V64, third fluid valve V65, the stream of the 4th fluid valve V66 and the 5th Body valve V67.
In the present embodiment, first fluid feed path P63 is connected to carbonated water supply source 70.Second fluid supplies road Diameter P64 is connected to DIW supply source 71.Third fluid delivery path P65 is connected to ammonium hydroxide supply source (NH4OH supply source) 72.The Four fluid delivery path P66 are connected to peracid hydrogen water supply source (H2O2Supply source) 73.5th fluid delivery path P67 connection To hydrochloric acid supply source (HCI supply source) 74.The carbonated water of carbonated water supply source 70 also can be for by dissolving carbon dioxide gas In the DIW supplied from DIW supply source 71 and ready carbonated water.
Drain path P68 is combined in common flow path 60.Drain path P68 is, for example, to be piped.It is installed in drain path P68 There is tapping valve V68.Drain path P68 is connected to attracting mechanism 80.Attracting mechanism 80 is, for example, vacuum pump etc..
In first jet 11 other than being combined with the first treatment fluid feed path P61, gas supplying path is also incorporated 30.Gas trap 40 is installed in gas supplying path 30.Gas supply source 75 is connected in gas supplying path 30.It is supplied from gas To source 75 via gas supplying path 30 by nitrogen (N2) gases such as gas supply to first jet 11.In the present embodiment, first Nozzle 11 is that can supply the fluid for being mixed with treatment fluid and gas to the two-fluid spray nozzle of the upper surface of substrate W.
As the gas from the supply of gas supply source 75 to first jet 11, preferably using nonactive gas as nitrogen Body.Non-active gas is inactive gas for the upper surface relative to substrate W.Non-active gas in addition to include nitrogen with It outside, also may include the rare gas class for having such as argon.Gas trap 40 is contained in fluid case portion 15 with valve cell 6 is mixed together.Gas Body supply source 75 is configured at the outside of fluid case portion 15 with fluid feed sources 70~74, attracting mechanism 80 together.
The a certain treatment fluid flowed into common flow path 60 can be supplied to first jet 11 and second nozzle 12, and energy The mixed treating liquid for being mixed with any two kinds of the treatment fluid flowed into common flow path 60 is supplied to first jet 11 and Second nozzle 12.
As a kind for the treatment of fluid, the flushing liquors such as carbonated water and DIW can be enumerated.As flushing liquor, in addition to carbonated water and DIW with Outside, electrolytic ionic water, Ozone Water, the hydrochloric acid water of diluted concentration (such as 1ppm~100ppm or so), reductive water (hydrogen can also be used Water), ammonium hydroxide etc..
In the present embodiment, first jet 11 and the second spray can be respectively fed to using DIW and carbonated water as flushing liquor Mouth 12.As flushing liquor, the liquid and DIW that are also dissolved in carbon dioxide gas other than the DIW of organic solvent etc. Mixed liquor liquid to replace carbonated water.Such mixed liquor containing carbon dioxide gas and carbonated water are collectively referred to as carbonic acid Contain liquid.
As mixed treating liquid, SC1 (ammonium hydroxide hydrogen peroxide mixed liquor) or SC2 (hydrochloric acid hydrogen peroxide solution) can be used Equal medical fluids.So-called SC1 refers to the mixed liquor of ammonium hydroxide, aquae hydrogenii dioxidi and DIW, and is the aqueous solution of alkalinity.So-called SC2 refers to hydrochloric acid It and is acid aqueous solution with the mixed liquor of aquae hydrogenii dioxidi.SC2 is an example that the hydrochloric acid containing hydrochloric acid contains liquid.In this reality It applies in mode, first jet 11 and second nozzle 12 can be respectively fed to using SC1 and SC2 as medical fluid.
There is the situation for containing impurity in flushing liquor.Such as have to constitute first fluid feed path P63, common flow path 60, the organic matter of the first treatment fluid feed path P61 and second processing liquid feed path P62 are dissolved in the situation of carbonated water. The organic matter contained as impurity is being supplied to the carbonated water of first jet 11 or second nozzle 12 as a result,.It is organic as this Object can be enumerated such as protein and organic compound also more low molecular than protein.
As another example, it is given birth to by being dissolved in carbon dioxide gas from the DIW that DIW supply source 71 is supplied At in the situation of carbonated water, the impurity such as organic matter contained by carbon dioxide gas are incorporated together with carbon dioxide to DIW.Herein In situation, supply also contains the organic matter as impurity to the carbonated water of first jet 11 or second nozzle 12.
In this way, in the present embodiment, compared with DIW, carbonated water contains the impurity of volume.With regard to flushing liquor purity and Speech, the amount containing impurity the few then higher, and the amount containing impurity the how then lower.Therefore, in the present embodiment, carbonated water is Low-purity flushing liquor.Also, DIW is the amount of the contained impurity high-purity flushing liquor fewer than carbonated water.With regard in flushing liquor For the amount of impurity, the molal quantity for being present in the impurity in the flushing liquor of per unit volume the big then bigger, is present in every The molal quantity of impurity in the flushing liquor of unit volume is smaller then smaller.
When mixing the flushing liquor containing impurity with containing the medical fluid of scheduled ion, have due to the ion and impurity Between interaction and generate the situation of precipitate (sediment).Even if the impurity of the reason of as the precipitate is dissolved in punching Washing lotion is undissolved in flushing liquor, and the diameter of impurity is also than the boundary (such as 18nm) of the detection of particle collector (not shown) It is also small.Therefore, which can not be detected by particle collector.The impurity becomes energy and the interaction between ion The precipitate of the size of the degree detected by particle collector.In the situation that impurity is organic matter, it is believed that the precipitate rises Because in saltouing.
Saltout finger using the effect of salt make the organic matter being scattered in the solvents such as water agglutination.Specifically, hydrone The scheduled ion and hydrone being led in medical fluid become the hydrate water of the scheduled ion, to remove hydration in organic The hydrone of object.In this way, the hydrone as needed for the hydration of organic matter is insufficient, organic matter agglutination.By the agglutination, Generate precipitate.
As become saltout the reason of scheduled ion, can enumerate: citrate ions, winestone acid ion, sulfate ion, The anion such as chloride ion, bromide ion, iodide ion, carbonate ions, acetato-, nitrate ion;Ammonium ion, potassium The cations such as ion, sodium ion, calcium ion, magnesium ion.As the acid aqueous solution (medical fluid) containing sulfate ion, can enumerate SPM (sulfuric acid hydrogen peroxide solution).The the concentration of these ions in solvent the thin more is difficult to cause to saltout.In other words, solvent PH (power of hydrogen;PH-value) it is more difficult to cause to saltout closer to 7.
Fig. 3 is the block diagram electrically constituted to illustrate the major part of substrate board treatment 1.Controller 3 has micro- Type computer (microcomputer), and the control pair having according to scheduled control process control substrate board treatment 1 As.More specifically, controller 3 includes processor (processor) CPU (Central Processing Unit;Center Processor)) 3A and store control program memory 3B, by processor 3A execute control program execute to carry out The various controls of processing substrate.Especially, controller 3 controls conveying robot IR, conveying robot CR, electric motor 23, spray The movement of mouth mobile mechanism 24, nozzle moving mechanism 25 and valve class 40, V61~V68 etc..
In fig. 4 to fig. 6 below, illustrate to inhibit or prevent the mixing due to carbonated water and SC2 and form precipitation The substrate processing method using same of object and an example of feeding method.
Fig. 4 is the flow chart to an example for illustrating the processing substrate of substrate board treatment 1.Fig. 4, which is mainly shown, to be passed through Controller 3 executes the processing that operation program is realized.
As shown in figure 4, sequentially executing in the processing substrate of substrate board treatment 1 and moving in substrate (step 1), SC1 processing (step S2), carbonated water flushing handle (step S3), DIW flushing processing (step S4), SC2 processing (step S5), at DIW flushing Reason (step S6), carbonated water flushing handle (step S7), dry (step S8) and move out substrate W (step S9).
In the processing substrate of present embodiment, SC1 is supplied from first jet 11.Also, it supplies and makees from second nozzle 12 For SC2, the DIW as high-purity flushing liquor and the carbonated water as low-purity flushing liquor of acid aqueous solution.
Also that is, in the present embodiment, second nozzle 12, second processing liquid feed path P62, second processing liquid valve V62, Second fluid feed path P64, second fluid valve V64 and common flow path 60 constitute high-purity flushing liquor feed unit.Second Fluid valve V64 is an example to switch the high-purity rinse fluid valve towards common 60 supplying high purity flushing liquor of flow path.
Also, second nozzle 12, second processing liquid feed path P62, second processing liquid valve V62, first fluid supply road Diameter P63, first fluid valve V63 and common flow path 60 constitute carbonic acid and contain liquid feed unit (low-purity flushing liquor supply list Member).An example of first fluid valve V63 to switch the low-purity rinse fluid valve towards common flow path 60 supply low-purity flushing liquor.
Also, second nozzle 12, second processing liquid feed path P62, fluid valve V66, fluid valve V67, fluid supply road Diameter P66, fluid delivery path P67 and common flow path 60 constitute hydrochloric acid contain liquid feed unit (acidic aqueous solution feed unit, Medical fluid feed unit).In the present embodiment, fluid valve V66, V67 is to switch the medical fluid towards common flow path 60 supply medical fluid An example of valve.
Processing substrate (the step S1 to step S9) of substrate board treatment 1 is described in detail.
Firstly, untreated substrate W is moved in processing unit 2 from carrier C by conveying robot IR, CR and is handed over to rotation Turn chuck 5 (step S1).Later, substrate W up to being handled upside down manipulator CR during moving out, by chuck pin 20 across compartment of terrain Horizontally it is held in the top (substrate holding step) of the upper surface of rotating basis 21.
Electric motor 23 makes substrate W rotate (substrate spin step) together with rotating basis 21.It is carried out with rotation speed Substrate spin step also may persist to until aftermentioned drying process (step S8) starts.In processing substrate, supply to rotation The liquid turned on the substrate W of state is dispersed from the periphery of substrate W to outside by centrifugal force, and is caught by cup portion 8.
Then, SC1 processing (step S2) is executed, in SC1 processing, the substrate W kept by chuck pin 20 is handled with SC1 Upper surface.
Specifically, first jet 11 is configured at the processing position of the top of substrate W by first jet mobile mechanism 24.Place Reason position also can be the position that the rotation center of upper surface of substrate W can be supplied to from the medical fluid that first jet 11 sprays.It connects , SC1 is supplied from first jet 11 towards the upper surface of the substrate W of rotation status.It is supplied to the upper table of the substrate W of rotation status The SC1 in face flows to radial outside along the upper surface of substrate W by centrifugal force.Cleaning solution spreads the upper surface of substrate W as a result, It is whole.Also can with while being initially supplied SC1 or be initially supplied after SC1 and open gas trap 40.It has been mixed with SC1 as a result, It is sprayed with the fluid of nitrogen towards the upper surface of substrate W.
Then, after the SC1 of certain time handles (step S2), carbonated water flushing processing (step S3) is executed, at this In carbonated water flushing processing, the SC1 of the upper surface of substrate W is rinsed out with carbonated water.Fig. 5 A is carbonated water flushing processing (Fig. 4 Step S3) in substrate W periphery schematic diagram.
Specifically, second nozzle 12 is configured at the processing position of the top of substrate W by second nozzle mobile mechanism 25.Place Reason position also can be the position that the rotation center of upper surface of substrate W can be supplied to from the carbonated water that second nozzle 12 sprays. Then, from second nozzle 12 towards the upper surface of the substrate W of rotation status supply carbonated water (the second low-purity flushing liquor supply step Suddenly).On the other hand, stop supplying SC1 from first jet 11.First jet mobile mechanism 24 retreats to first jet 11 to keep out of the way Position.Centrifugal force acts on the carbonated water landed to the upper surface of the substrate W of rotation status.It has been landed as a result, to substrate W's The carbonated water of upper surface is flowed in the upper surface of substrate W towards the periphery of substrate W.The SC1 on substrate W is carbonated water displacement as a result,. Carbonated water is supplied by the upper surface to second nozzle 12 and substrate W, the upper surface of second nozzle 12 and substrate W can be removed Electrostatic.
Then, after the carbonated water flushing of certain time handles (step S3), DIW flushing processing (step S4) is executed, In DIW flushing processing, the carbonated water of the upper surface of substrate W is rinsed out with DIW.Fig. 5 B is the DIW flushing processing (step of Fig. 4 Rapid S4) in substrate W periphery schematic diagram.
Specifically, second nozzle 12 maintains the state of the processing position for the top for being configured at substrate W.Then, from second The upper surface of nozzle 12 towards the substrate W of rotation status supply DIW (the second high-purity flushing liquor supplying step).Centrifugal force acts on It has landed to the DIW of the upper surface of the substrate W of rotation status.It has been landed as a result, to the DIW of the upper surface of substrate W in the upper of substrate W It is flowed towards the periphery of substrate W on surface.The carbonated water on substrate W is replaced by DIW as a result,.At this point, the carbonated water on substrate W is different It is fixed to need fully to be replaced by DIW.The journey that can be also replaced for a part of the carbonated water on substrate W by DIW during supply DIW During degree.
Then, after the DIW flushing of certain time handles (step S4), SC2 processing (step S5) is executed, in the SC2 In processing, the upper surface of substrate W is handled by SC2.Fig. 5 C is showing for the periphery of the substrate W in SC2 processing (the step S5 of Fig. 4) It is intended to.
Specifically, second nozzle 12 maintains the state of the processing position for the top for being configured at substrate W.Then, from second The upper surface of nozzle 12 towards the substrate W of rotation status supply SC2, and (medical fluid supplying step, acidic aqueous solution supplying step, hydrochloric acid contain There is liquid supplying step).Centrifugal force acts on the SC2 landed to the upper surface of the substrate W of rotation status.It has been landed as a result, to base The SC2 of the upper surface of plate W is flowed in the upper surface of substrate W towards the periphery of substrate W.The DIW on substrate W is replaced by SC2 as a result,.
In the situation that remaining has carbonated water on substrate W after DIW flushing processing (step S4) is rigid, on substrate W DIW and the mixed liquor of carbonated water are replaced by SC2.After DIW on substrate W is replaced by SC2, persistently the upper surface of substrate W is supplied To SC2, the metallic pollution of the upper surface of substrate W is thus removed.
In the processing substrate, the second low-purity flushing liquor supplying step in carbonated water flushing processing (step S3) exists SC2 is executed before handling the medical fluid supplying step in (step S5).In the processing substrate, DIW flushing is handled in (step S4) The second high-purity cleaning supplying step carbonated water flushing processing (step S3) in the second low-purity flushing liquor supplying step It is executed between the medical fluid supplying step in SC2 processing (step S5).
Then, after the SC2 of certain time handles (step S5), DIW flushing processing (step S6), DIW punching are executed It washes in processing, the SC2 of the upper surface of substrate W is rinsed out with DIW.Fig. 5 D is the substrate in DIW flushing processing (the step S6 of Fig. 4) The schematic diagram on the periphery of W.
Specifically, second nozzle 12 maintains the state of the processing position for the top for being configured at substrate W.Then, from second The upper surface of nozzle 12 towards the substrate W of rotation status supply DIW (high-purity flushing liquor supplying step).Centrifugal force acts on Drop down onto the DIW of the upper surface of substrate W of rotation status.It has been landed as a result, to the DIW of the upper surface of substrate W in the upper surface of substrate W It is flowed towards the periphery of substrate W.The SC2 on substrate W is replaced by DIW as a result,.At this point, the SC2 on substrate W is not necessarily required to by DIW Fully replace.During the degree that can be also replaced for a part of the SC2 on substrate W by DIW during supply DIW.
Then, after the DIW flushing of certain time handles (step S6), carbonated water flushing processing (step S7) is executed, In carbonated water flushing processing, the DIW of the upper surface of substrate W is rinsed out with carbonated water.Fig. 5 E is carbonated water flushing processing (figure 4 step S7) in substrate W periphery schematic diagram.
Specifically, second nozzle 12 maintains the state of the processing position for the top for being configured at substrate W.Then, from second The upper surface of nozzle 12 towards the substrate W of rotation status supply carbonated water (low-purity flushing liquor supplying step).Centrifugal force acts on It has landed to the carbonated water of the upper surface of the substrate W of rotation status.The carbonated water to the upper surface of substrate W has been landed as a result, in base It is flowed towards the periphery of substrate W the upper surface of plate W.The DIW on substrate W is carbonated water displacement as a result,.(step is handled in DIW flushing S6) just after on substrate W remaining have SC2 situation in, the mixed liquor of DIW and SC2 on substrate W are carbonated water and set It changes.
In the processing substrate, DIW flushing handles the high-purity flushing liquor supplying step in (step S6) in SC2 processing Between low-purity flushing liquor supplying step in medical fluid supplying step in (step S5) and carbonated water flushing processing (step S7) It executes.
Then, the drying process (step S8) to keep substrate W dry is carried out.
Specifically, stopping supplying carbonated water from second nozzle 12.Second nozzle mobile mechanism 25 moves back second nozzle 12 It keeps away to retreating position.Then, electric motor 23 is to handle the substrate W of (step S2) to carbonic acid water process (step S7) than SC1 Rotation speed also quick high rotation speed (such as 500rpm to 3000rpm) rotates substrate W.Big centrifugation masterpiece as a result, For the carbonated water on substrate W, the carbonated water on substrate W is thrown off to around substrate W.In this way, removing carbonated water from substrate W And keep substrate W dry.Then, when passing through the predetermined time from the high speed rotation for starting substrate W, controller 3 stops rotating pedestal The rotation of 21 couples of substrate W.
Later, conveying robot CR enters to processing unit 2, and the substrate W finished from 5 pickup processing of rotary chuck is simultaneously moved out To the outside (step S9) of processing unit 2.Substrate W is transferred to conveying robot IR from conveying robot CR, and passes through carrying Manipulator IR is contained in carrier C.
Then, illustrate the feeding method in aforesaid substrate processing via common 60 liquor charging of flow path to second nozzle 12.
Fig. 6 A is the schematic diagram on the periphery of the mixing valve cell 6 in carbonated water flushing processing (the step S3 of Fig. 4).In Fig. 6 A In, show feed path P61~P67 for fluid flowing using thick line (aftermentioned Fig. 6 B to Fig. 6 E is also same).In carbonated water Flushing is handled in (step S3), supplies carbonated water to second nozzle 12 via common flow path 60.
In carbonated water flushing processing (step S3), firstly, stopping supplying SC1 towards substrate W as described above.In order to stop court Substrate W supplies SC1, closes the first treatment fluid valve V61 in mixing valve cell 6.Also, close second fluid valve V64, third stream Body valve V65 and the 4th fluid valve V66.As a result, due to stopping towards common flow path 60 supply DIW, ammonium hydroxide and aquae hydrogenii dioxidi, Therefore also stop towards first jet 11 and substrate W supply SC1.
Then, as described above, starting to supply carbonated water towards substrate W.In order to start to supply carbonated water towards substrate W, mixing First fluid valve V63 is opened in valve cell 6.Start to supply carbon towards common flow path 60 via first fluid feed path P63 as a result, Sour water (second flow path low-purity flushing liquor supplying step).Then, second processing liquid valve V62 is opened, thus from common flow path 60 Carbonated water is supplied to second nozzle 12 via second processing liquid feed path P62.As a result, also starting to supply carbonated water towards substrate W.
Also can be remained on altogether before starting to supply carbonated water to second nozzle 12 from common flow path 60 with carbonated water displacement The SC1 on through-flow road 60.
Specifically, being not that unlatching is first-class when the fluid supplied towards common flow path 60 switches to carbonated water from SC1 Body valve V63 and second processing liquid valve V62, but open first fluid valve V63 and tapping valve V68.It is rinsed out as a result, with carbonated water Remain on the SC1 of common flow path 60.After the SC1 in common flow path 60 is carbonated water displacement, tapping valve V68 is closed, such as previously It is illustrated such to open second processing liquid valve V62.As a result, from common flow path 60 via second processing liquid feed path P62 to Two nozzles 12 convey carbonated water.
Fig. 6 B is the schematic diagram on the periphery of the mixing valve cell 6 in DIW flushing processing (the step S4 of Fig. 4).It is rinsed in DIW It handles in (step S4), DIW is supplied to second nozzle 12 via common flow path 60.
In DIW flushing processing (step S4), firstly, stopping supplying carbonated water towards substrate W as described above.In order to stop court Substrate W supplies carbonated water, closes first fluid valve V63 in mixing valve cell 6.As a result, due to stopping supplying towards common flow path 60 To carbonated water, therefore also stop towards second nozzle 12 and substrate W supply carbonated water.
Then, as described above, starting to supply DIW towards substrate W.In order to start to supply DIW towards substrate W, in mixing valve cell 6 Middle unlatching second fluid valve V64.Start to supply DIW (second towards common flow path 60 via second fluid feed path P64 as a result, Flow path high-purity flushing liquor supplying step).Then, the state for maintaining unlatching second processing liquid valve V62, thus from common flow path 60 DIW is supplied to second nozzle 12 via second processing liquid feed path P62.As a result, also starting to supply DIW towards substrate W.
Also common flow path can be remained on DIW displacement before starting to supply DIW to second nozzle 12 from common flow path 60 60 carbonated water.
It is not to maintain to open the specifically, when the fluid supplied towards common flow path 60 switches to DIW from carbonated water The state of two fluid valve V62, but temporary close second processing liquid valve V62, instead open second fluid valve V64 and Tapping valve V68.The carbonated water for remaining on common flow path 60 is rinsed out with DIW as a result,.Carbonated water quilt in common flow path 60 After DIW displacement, tapping valve V68 is closed, second processing liquid valve V62 is again turned on.As a result, from common flow path 60 via second processing Liquid feed path P62 supplies DIW to second nozzle 12.
At this point, the carbonated water in common flow path 60 is not necessarily required to fully be replaced by DIW.Also may be used during supply DIW During the degree replaced for a part of the carbonated water in common flow path 60 by DIW.Conversely, being supplied to second nozzle 12 Before DIW, the carbonated water for remaining on common flow path 60 also can fully be replaced by DIW.
Fig. 6 C is the schematic diagram on the periphery of the mixing valve cell 6 in SC2 processing (the step S5 of Fig. 4).In SC2 processing (step Rapid S5) in, SC2 is supplied to second nozzle 12 via common flow path 60.
In SC2 processing (step S5), firstly, stopping supplying DIW towards substrate W as described above.In order to stop supplying towards substrate W To DIW, second processing liquid valve V64 is closed in mixing valve cell 6.As a result, due to stopping supplying DIW towards common flow path 60, because This also stops towards second nozzle 12 and substrate W supply DIW.
Then, as described above, starting to supply SC2 towards substrate W.In order to start to supply SC2 towards substrate W, in mixing valve cell 6 Middle unlatching the 4th fluid valve V66 and the 5th fluid valve V67.It is supplied as a result, via the 4th fluid delivery path P66 towards common flow path 60 Hydrochloric acid is supplied to common flow path 60 to aquae hydrogenii dioxidi, and via the 5th treatment fluid feed path P67.It is mixed in common flow path 60 Aquae hydrogenii dioxidi and hydrochloric acid.As a result, towards common flow path 60 supply SC2 (flow path medical fluid supplying step, the supply of flow path acidic aqueous solution Step, flow path hydrochloric acid contain liquid supplying step).Then, the state for maintaining unlatching second processing liquid valve V62, thus from common stream Road 60 supplies SC2 to second nozzle 12 via second processing liquid feed path P62.As a result, also starting to supply SC2 towards substrate W.
It also can be by remaining on common flow path before opening tapping valve V68 to supply SC2 to second nozzle 12 with SC2 displacement 60 DIW.
Fig. 6 D is the schematic diagram on the periphery of the mixing valve cell 6 in DIW flushing processing (the step S6 of Fig. 4).It is rinsed in DIW It handles in (step S6), DIW is supplied to second nozzle 12 via common flow path 60.
In DIW flushing processing (step S6), firstly, stopping supplying SC2 towards substrate W as described above.In order to stop towards base Plate W supplies SC2, closes the 4th fluid valve V66 and the 5th fluid valve V67 in mixing valve cell 6.As a result, due to stopping towards altogether Through-flow road 60 supplies aquae hydrogenii dioxidi and hydrochloric acid, therefore also stops towards second nozzle 12 and substrate W supply SC2.
Then, as described above, starting to supply DIW towards substrate W.In order to start to supply DIW towards substrate W, in mixing valve cell 6 Middle unlatching second fluid valve V64.Start to supply DIW (flow path towards common flow path 60 via second fluid feed path P64 as a result, High-purity flushing liquor supplying step).Then, maintain open second processing liquid valve V62 state, thus from common flow path 60 via Second processing liquid feed path P62 supplies DIW to second nozzle 12.As a result, also starting to supply DIW towards substrate W.It is rinsed with DIW Handle (step S4) similarly, it also can be complete by DIW before supplying DIW to second nozzle 12 by opening tapping valve V68 The SC2 for remaining on common flow path 60 is replaced entirely.At this point, the SC2 in common flow path 60 is not necessarily required to fully be set by DIW It changes.During the degree that can be also replaced for a part of the SC2 in common flow path 60 by DIW during supply DIW.
Fig. 6 E is the schematic diagram on the periphery of the mixing valve cell 6 in carbonated water flushing processing (the step S7 of Fig. 4).In carbonic acid Water flushing is handled in (step S7), supplies carbonated water to second nozzle 12 via common flow path 60.
In carbonated water flushing processing (step S7), firstly, stopping supplying DIW towards substrate W as described above.In order to stop court Substrate W supplies DIW, closes second processing liquid valve V64 in mixing valve cell 6.As a result, due to stopping supplying towards common flow path 60 DIW, therefore also stop towards second nozzle 12 and substrate W supply DIW.
Then, as described above, starting to supply carbonated water towards substrate W.At this point, opening first fluid in mixing valve cell 6 Valve V63.Start to supply carbonated water (flow path low-purity flushing liquor towards common flow path 60 via first fluid feed path P63 as a result, Supplying step).Then, second processing liquid valve V62 is opened, thus from common flow path 60 via second processing liquid feed path P62 Carbonated water is supplied to second nozzle 12.As a result, also starting to supply carbonated water towards substrate W.
Also can be remained on by opening tapping valve V68 before supplying carbonated water to second nozzle 12 with carbonated water displacement The DIW of common flow path 60.
According to present embodiment, high-purity is executed between medical fluid supplying step and low-purity flushing liquor supplying step and is rinsed Step.Therefore, it supplies to the medical fluid (SC2) on substrate W by the amount of impurity (organic matter) in medical fluid supplying step than low The also few high-purity flushing liquor (DIW) of purity flushing liquor (carbonated water) is supplied with after high-purity flushing liquor to low on substrate Purity flushing liquor (carbonated water) rinses.Therefore, with only with the processing substrate of high-purity flushing liquor processing solution compared with, reduce substrate Cost needed for processing.
In addition, in high-purity flushing liquor supplying step performed before low-purity flushing liquor supplying step, on substrate W Part or all of medical fluid replaced by high-purity flushing liquor.As a result, before executing low-purity flushing liquor supplying step, base The concentration of ion (as the chloride ion for belonging to anion the reason of saltouing) in medical fluid (SC2) on plate W at least by High-purity flushing liquor thinning.Therefore, it at least reduces between the impurity contained by the ion and low-purity flushing liquor contained by medical fluid Interaction.In addition, the interaction will not be generated completely from the situation excluded on substrate W in chloride ion. Therefore, inhibit or prevent the formation of the precipitate in low-purity flushing liquor supplying step.
Therefore, the increase of cost can be inhibited and inhibit or prevent the generation of precipitate.
In addition, the second low-purity flushing liquor supplying step is executed before medical fluid supplying step according to present embodiment, and The second high-purity flushing liquor supplying step is executed between medical fluid supplying step and the second low-purity flushing liquor supplying step.Cause This, to before medical fluid supplying step in the processing substrate of the upper surface of flushing liquor cleaning base plate W, the upper table of substrate W Face by the amount of impurity (organic matter) the high-purity flushing liquor (DIW) also fewer than low-purity flushing liquor (carbonated water) with high-purity Supply to the low-purity flushing liquor on substrate W rinses after spending flushing liquor.Therefore, and only with high-purity flushing liquor cleaning base plate W The processing substrate of upper surface compare, cost needed for reducing processing substrate.
In addition, in the second high-purity flushing liquor supplying step performed before medical fluid supplying step, it is low on substrate W Part or all of purity flushing liquor (carbonated water) is replaced by high-purity flushing liquor.As a result, execute medical fluid supplying step it Before, the amount of the impurity (organic matter) in flushing liquor at least reduction substrate W.Therefore, it at least reduces contained by medical fluid (SC2) The interaction between impurity contained by ion (chloride ion) and low-purity flushing liquor (carbonated water).In addition, in impurity Completely from the situation excluded on substrate W, the interaction will not be generated.Therefore, inhibit or prevent medical fluid supplying step In precipitate formation.
Therefore, to before medical fluid supplying step in the processing substrate of the upper surface of flushing liquor cleaning base plate W, energy Inhibit the increase of cost and inhibits or prevent the generation of precipitate.
In addition, according to present embodiment, between flow path medical fluid supplying step and flow path low-purity flushing liquor supplying step Execute flow path high purity rinse step.Therefore, the medical fluid (SC2) of common flow path 60 is supplied in flow path medical fluid supplying step By the amount of impurity (organic matter) the high-purity flushing liquor (DIW) also fewer than low-purity flushing liquor (carbonated water) and in high-purity It is supplied after flushing liquor to the low-purity flushing liquor (carbonated water) of common flow path 60 and is rinsed.Therefore, and only with high-purity flushing liquor The feeding method for rinsing out medical fluid is compared, and required cost is reduced.
In addition, supplying step by performed flow path high-purity flushing liquor before flow path low-purity flushing liquor supplying step Suddenly, part or all of the medical fluid (SC2) in common flow path 60 is replaced by high-purity flushing liquor (DIW).Executing stream as a result, Before the low-purity flushing liquor supplying step of road, the concentration of the ion (chloride ion) in medical fluid (SC2) on substrate W at least by High-purity flushing liquor (DIW) thinning.Therefore, the impurity contained by the ion and low-purity flushing liquor contained by medical fluid is at least reduced Interaction between (organic matter).In addition, in chloride ion completely from the situation excluded in common flow path 60, no The interaction can be generated.Therefore, inhibit or prevent the formation of the precipitate in flow path low-purity flushing liquor supplying step.
Therefore, the generation that the increase of cost can be inhibited and inhibit or prevent the mixing of medical fluid and flushing liquor from leading to precipitate.
In addition, executing second flow path low-purity flushing liquor according to present embodiment before flow path medical fluid supplying step and supplying To step, and between flow path medical fluid supplying step and second flow path low-purity flushing liquor supplying step, execution second flow path is high-purity Spend flushing liquor supplying step.Therefore, in the side to clean common flow path 60 with flushing liquor before flow path medical fluid supplying step In method, the common flow path 60 high-purity flushing liquor also fewer than low-purity flushing liquor (carbonated water) by the amount of impurity (organic matter) (DIW) it and supplies after high-purity flushing liquor to the low-purity flushing liquor on substrate W and cleans.Therefore, with only rushed with high-purity The feeding method that washing lotion cleans common flow path 60 is compared, and required cost is reduced.
In addition, in second flow path high-purity flushing liquor supplying step performed before flow path medical fluid supplying step, altogether Part or all of low-purity flushing liquor (carbonated water) in through-flow road 60 is replaced by high-purity flushing liquor (DIW).Exist as a result, Before executing flow path medical fluid supplying step, the amount of the impurity (organic matter) in the flushing liquor of common flow path 60 is at least reduced.Therefore, It at least reduces mutual between the impurity contained by the ion (chloride ion) and low-purity flushing liquor contained by medical fluid (SC2) Effect.In addition, the interaction will not be generated completely from the situation excluded in common flow path 60 in impurity.Therefore, press down Make or prevent the formation of the precipitate in flow path medical fluid supplying step.
Therefore, in the method to clean common flow path 60 with flushing liquor before flow path medical fluid supplying step, can press down This increase is made and inhibits or prevents medical fluid from mixing the generation for leading to precipitate with flushing liquor.
The present invention is not limited to the implementation described above, also can further implement in other manners.
For example, in the processing substrate of above embodiment, although being configured to supply SC1 from first jet 11 and from second Nozzle 12 supplies SC2, DIW and carbonated water, but also may be configured as supplying these processing from 11,12 couples of substrate W of any one nozzle Liquid.Also it may be configured as supplying these treatment fluids to substrate W from the nozzle being in addition separately provided with nozzle 11,12.
In the processing substrate of above embodiment, carbonated water is low-purity flushing liquor, and DIW is high-purity flushing liquor.So And also can be different from the processing substrate of above embodiment, to use general using the DIW for containing impurity as low-purity flushing liquor The amount of the contained impurity DIW also fewer than the DIW as high-purity flushing liquor come using.
In this case, it executes at the DIW flushing to replace the SC1 on substrate W by DIW (low-purity flushing liquor) Reason, to replace the carbonated water flushing of Fig. 4 to handle (step S3).Also, it executes and replaces substrate with by DIW (low-purity flushing liquor) The DIW flushing of DIW (high-purity flushing liquor) on W is handled, to replace the carbonated water flushing of Fig. 4 to handle (step S7).
In addition, also can be different from the processing substrate of above embodiment, the carbonated water for containing impurity is rushed as low-purity Washing lotion come using, using the amount of the contained impurity carbonated water also fewer than the carbonated water as high-purity flushing liquor come using.
In this case, it executes to by carbonated water (high-purity flushing liquor) displacement carbonated water (low-purity flushing liquor) Carbonated water flushing processing, to replace the DIW flushing of Fig. 4 to handle (step S4).Also, it executes to pass through carbonated water (high-purity Flushing liquor) the carbonated water flushing processing of SC2 (medical fluid) is replaced, to replace the DIW flushing of Fig. 4 to handle (step S6).
In addition, also can be different from the processing substrate of above embodiment, the DIW of impurity will be contained as low-purity flushing liquor Use, and using the amount of the contained impurity carbonated water also fewer than the DIW as high-purity flushing liquor come using.
In this case, the DIW flushing processing to replace the SC1 on substrate W by DIW (low-purity flushing liquor) is executed To replace the carbonated water flushing of Fig. 4 to handle (step S3).Also, it executes to be replaced by carbonated water (high-purity flushing liquor) The carbonated water of DIW (low-purity flushing liquor) rinses processing to replace the DIW flushing of Fig. 4 to handle (step S4).Then, execute to By the carbonated water cleaning reason of carbonated water (high-purity flushing liquor) displacement SC2 (medical fluid) to replace the DIW flushing of Fig. 4 to handle (step Rapid S6).Then, it executes to replace the carbonated water (high-purity flushing liquor) on substrate W by DIW (low-purity flushing liquor) DIW rinses processing to replace the carbonated water flushing of Fig. 4 to handle (step S7).
Also can be different from the processing substrate of above embodiment, it will be (above-mentioned with DIW or the different types of flushing liquor of carbonated water Flushing liquor cited by embodiment) as low-purity flushing liquor or high-purity flushing liquor come using.
It is not carried out in the processing substrate (referring to Fig. 4) of above embodiment in the situation of SC1 processing (step S2), such as schemes Shown in 7, carbonated water flushing processing (step S3) and DIW flushing processing (step S4) can not be also executed later.It also that is, also can be in base Plate moves in (step S1) and executes SC2 processing (step S5) afterwards.In this case, stop court when SC2 processing (step S5) starts Substrate W supplies DIW or carbonated water, and also stops supplying DIW or carbonated water towards common flow path 60.
As described above, saltouing can also generate in the situation for the aqueous solution that medical fluid is the alkalinity containing scheduled cation. In the situation for using the SC1 (alkaline aqueous solution) containing ammonium ion the processing substrate such as above embodiment, such as Fig. 8 Shown can also handle in SC1 executes DIW flushing processing (step between (step S2) and carbonated water flushing processing (step S3) S10)。
In DIW flushing processing (step S10), DIW is supplied to the upper surface of substrate W, from there through DIW displacement substrate W Upper surface SC1 (high-purity flushing liquor supplying step).At this point, supplying DIW to common flow path 60, replaced from there through DIW SC1 (flow path high-purity flushing liquor supplying step) in common flow path 60.Then, DIW flushing processing (step S10) is being connected Carbonated water flushing is handled in (step S3), supplies carbonated water to the upper surface of substrate W, and replace the upper of substrate W by carbonated water The DIW or DIW on surface and the mixed liquor (low-purity flushing liquor supplying step) of SC1.At this point, supplying carbonic acid to common flow path 60 Water replaces mixed liquor (the flow path low-purity flushing liquor supply of the DIW or DIW and SC1 in common flow path 60 from there through DIW Step).
Also can be different from the processing substrate of above embodiment, use the medical fluid other than SC2 or SC1 as containing ion Medical fluid, the ion form precipitate and with interaction and impurities contained by flushing liquor.For example, also can will containing sulfuric acid from The SPM of son is used as acid aqueous solution (medical fluid).In this case, such as following SPM processing (medical fluid supply step is executed Suddenly, acidic aqueous solution supplying step) to replace SC2 to handle (step S5): (step S4) is handled in the DIW flushing of certain time Afterwards, SPM is supplied to the upper surface of substrate W, from there through the upper surface of SPM processing substrate W.In this case, it needs to be arranged Sulfuric acid supply source is to replace hydrochloric acid supply source 74.
Although having explained embodiments of the present invention in detail, these embodiments are only skill of the invention is illustrated The concrete example of art content, the present invention should not be defined in these concrete examples, the power that the scope of the present invention is only appended with being confined Sharp claim is defined.
The application and proposed on December 19th, 2016 in the Japanese Patent Room Japanese Patent Application 2016-2425785 are right It answers, and Japanese Patent Application 2016-2425785 full content is quoted in the present specification.
[explanation of appended drawing reference]
1: substrate board treatment
3: controller
11: (nozzle, medical fluid feed unit, low-purity flushing liquor feed unit, the supply of high-purity flushing liquor are single for first jet Member)
12: (nozzle, medical fluid feed unit, low-purity flushing liquor feed unit, the supply of high-purity flushing liquor are single for second nozzle Member)
60: common flow path
(medical fluid feed unit, acidic aqueous solution feed unit, low-purity flushing liquor supply P61: the first treatment fluid feed path Contain liquid feed unit, high-purity flushing liquor feed unit to unit, carbonic acid)
P62: (medical fluid feed unit, acidic aqueous solution feed unit, low-purity flushing liquor supply second processing liquid feed path Contain liquid feed unit, high-purity flushing liquor feed unit to unit, carbonic acid)
P63: first fluid feed path (low-purity flushing liquor feed unit, carbonic acid contain liquid feed unit)
P64: second fluid feed path (high-purity flushing liquor feed unit)
P65: third fluid delivery path (medical fluid feed unit)
P66: the four fluid delivery path (medical fluid feed unit, acidic aqueous solution feed unit)
P67: the five fluid delivery path (medical fluid feed unit, acidic aqueous solution feed unit)
(medical fluid feed unit, acidic aqueous solution feed unit, the supply of low-purity flushing liquor are single for V61: the first treatment fluid valve Member, carbonic acid contain liquid feed unit, high-purity flushing liquor feed unit)
V62: (medical fluid feed unit, acidic aqueous solution feed unit, the supply of low-purity flushing liquor are single for second processing liquid valve Member, carbonic acid contain liquid feed unit, high-purity flushing liquor feed unit)
V63: (low-purity flushing liquor feed unit, carbonic acid contain liquid feed unit, low-purity flushing liquor to first fluid valve Valve)
V64: second fluid valve (high-purity flushing liquor feed unit, high-purity rinse fluid valve)
V65: third fluid valve (medical fluid feed unit, medical fluid valve)
V66: the four fluid valve (medical fluid feed unit, acidic aqueous solution feed unit, medical fluid valve)
V67: the five fluid valve (medical fluid feed unit, acidic aqueous solution feed unit, medical fluid valve)
W: substrate

Claims (16)

1. a kind of substrate processing method using same, includes:
Medical fluid supplying step supplies the medical fluid containing ion to the surface of substrate;
Low-purity flushing liquor supplying step executes after the medical fluid supplying step, and the low-purity containing impurity is rinsed Liquid is supplied to the surface of the substrate, and the ionic interaction of the impurity contained by with medical fluid and forms analysis Object out;And
High-purity flushing liquor supplying step is held between the medical fluid supplying step and the low-purity flushing liquor supplying step Row, the amount of the contained impurity high-purity flushing liquor fewer than the low-purity flushing liquor is supplied to the table of the substrate Face.
2. substrate processing method using same as claimed in claim 1, wherein, wherein
The medical fluid includes acid aqueous solution;
The low-purity flushing liquor contains the organic matter as the impurity.
3. the substrate processing method using same as documented by claim 2, wherein
The aqueous solution of the acidity contains hydrochloric acid.
4. the substrate processing method using same as documented by any one of claims 1 to 3, wherein
The low-purity flushing liquor includes that the carbonic acid containing carbon dioxide contains liquid.
5. the substrate processing method using same as documented by any one of claims 1 to 4 comprising:
Second low-purity flushing liquor supplying step, executes before the medical fluid supplying step, to rinse the low-purity Liquid is supplied to the surface of the substrate;And
Second high-purity flushing liquor supplying step, in the medical fluid supplying step and the second low-purity flushing liquor supplying step Between execute, supplying the high-purity flushing liquor to the surface of the substrate.
6. a kind of feeding method, to via common flow path liquor charging to nozzle, which includes:
Flow path medical fluid supplying step supplies the medical fluid containing ion to the common flow path;
Flow path low-purity flushing liquor supplying step rushes the low-purity containing impurity after the flow path medical fluid supplying step Washing lotion is supplied to the common flow path, and the ionic interaction of the impurity contained by with medical fluid and forms analysis Object out;And
Flow path high-purity flushing liquor supplying step is supplied in the flow path medical fluid supplying step and the flow path low-purity flushing liquor Between step, the amount of the contained impurity high-purity flushing liquor fewer than the low-purity flushing liquor is supplied to described total Through-flow road.
7. the feeding method as documented by claim 6, wherein
The medical fluid includes acid aqueous solution;
The low-purity flushing liquor contains the organic matter as the impurity.
8. the feeding method as documented by claim 7, wherein
The aqueous solution of the acidity contains hydrochloric acid.
9. the feeding method as documented by any one of claim 6 to 8, wherein
The low-purity flushing liquor includes that the carbonic acid containing carbon dioxide contains liquid.
10. the feeding method as documented by any one of claim 6 to 9 comprising:
Second flow path low-purity flushing liquor supplying step, executes before the flow path medical fluid supplying step, to will be described low Purity flushing liquor is supplied to the common flow path;And
Second flow path high-purity flushing liquor supplying step is rushed in the flow path medical fluid supplying step and the second flow path low-purity It is executed between washing lotion supplying step, supplying the high-purity flushing liquor to the common flow path.
11. a kind of substrate board treatment, includes:
Medical fluid feed unit supplies the medical fluid containing ion to the surface of substrate;
Low-purity flushing liquor feed unit, will the low-purity flushing liquor containing impurity supply to the surface of the substrate, it is described Impurity forms precipitate and with ionic interaction contained by the medical fluid;
High-purity flushing liquor feed unit rushes the amount of the contained impurity high-purity fewer than the low-purity flushing liquor Washing lotion is supplied to the surface of the substrate;And
Controller controls the medical fluid feed unit, the low-purity flushing liquor feed unit and the high-purity flushing liquor Feed unit,
The controller programming is to execute:
Medical fluid supplying step supplies the medical fluid to the surface of the substrate;And
Low-purity flushing liquor supplying step supplies the low-purity flushing liquor to the base after the medical fluid supplying step The surface of plate;
Also, the controller is executed between the medical fluid supplying step and the low-purity flushing liquor supplying step to incite somebody to action The high-purity flushing liquor is supplied to the high-purity flushing liquor supplying step on the surface of the substrate.
12. the substrate board treatment as documented by claim 11, wherein
The medical fluid feed unit includes supplying acid aqueous solution to the acidic aqueous solution on the surface of the substrate Feed unit;
The low-purity flushing liquor contains the organic matter as the impurity.
13. the substrate board treatment as documented by claim 12, wherein
The aqueous solution of the acidity contains hydrochloric acid.
14. the substrate board treatment as documented by any one of claim 11 to 13, wherein
The low-purity flushing liquor feed unit includes: carbonic acid contains liquid feed unit, will contain the carbonic acid of carbon dioxide It supplies containing liquid to the surface of the substrate.
15. the substrate board treatment as documented by any one of claim 11 to 14, wherein
The controller programming are as follows:
The second low-purity flushing liquor supplying step is executed, supplies the low-purity flushing liquor before the medical fluid supplying step To the surface of the substrate;And
The second high-purity flushing liquor supplying step is executed, is supplied in the medical fluid supplying step and the second low-purity flushing liquor Between step, the high-purity flushing liquor is supplied to the surface of the substrate.
16. the substrate board treatment as documented by any one of claim 11 to 15, wherein also include:
Nozzle;And
Common flow path, liquor charging to the nozzle;
The medical fluid feed unit includes: medical fluid valve, whether supplies the medical fluid to the common flow path to switch;
Whether the low-purity flushing liquor feed unit includes: low-purity rinse fluid valve, supply the common flow path to switch To the low-purity flushing liquor;
Whether the high-purity flushing liquor feed unit includes: high-purity rinse fluid valve, supply the common flow path to switch To the high-purity flushing liquor;
The controller controls the medical fluid valve, the low-purity rinse fluid valve and the high-purity rinse fluid valve;
The controller programming is to execute:
Flow path medical fluid supplying step supplies the medical fluid to the common flow path;And
Flow path low-purity flushing liquor supplying step supplies the low-purity flushing liquor after the flow path medical fluid supplying step To the common flow path;
Also, the controller is held between the flow path medical fluid supplying step and the flow path low-purity flushing liquor supplying step Row is supplying the high-purity flushing liquor to the flow path high-purity flushing liquor supplying step of the common flow path.
CN201780077433.9A 2016-12-19 2017-11-07 Substrate processing method, liquid feeding method, and substrate processing apparatus Active CN110073472B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016245785A JP6759087B2 (en) 2016-12-19 2016-12-19 Substrate processing method, liquid feeding method, and substrate processing equipment
JP2016-245785 2016-12-19
PCT/JP2017/040102 WO2018116671A1 (en) 2016-12-19 2017-11-07 Substrate processing method, liquid feeding method and substrate processing apparatus

Publications (2)

Publication Number Publication Date
CN110073472A true CN110073472A (en) 2019-07-30
CN110073472B CN110073472B (en) 2023-02-28

Family

ID=62627025

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780077433.9A Active CN110073472B (en) 2016-12-19 2017-11-07 Substrate processing method, liquid feeding method, and substrate processing apparatus

Country Status (5)

Country Link
JP (1) JP6759087B2 (en)
KR (1) KR102215990B1 (en)
CN (1) CN110073472B (en)
TW (1) TWI655974B (en)
WO (1) WO2018116671A1 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101101858A (en) * 2006-07-06 2008-01-09 大日本网目版制造株式会社 Substrate treatment method and substrate treatment apparatus
JP2008277576A (en) * 2007-04-27 2008-11-13 Dainippon Screen Mfg Co Ltd Method and apparatus for treating substrate
JP2009212407A (en) * 2008-03-06 2009-09-17 Dainippon Screen Mfg Co Ltd Method and apparatus for processing substrate
JP2010067636A (en) * 2008-09-08 2010-03-25 Dainippon Screen Mfg Co Ltd Substrate treatment apparatus
JP2013016594A (en) * 2011-07-01 2013-01-24 Tokyo Electron Ltd Substrate cleaning method, substrate cleaning device and memory medium
JP2013074114A (en) * 2011-09-28 2013-04-22 Renesas Electronics Corp Method and device for manufacturing semiconductor device
CN103210476A (en) * 2010-11-15 2013-07-17 栗田工业株式会社 Method for cleaning silicon wafer and apparatus for cleaning silicon wafer
JP2014143310A (en) * 2013-01-24 2014-08-07 Tokyo Electron Ltd Substrate processing apparatus, substrate processing method, and storage medium
JP2016042518A (en) * 2014-08-15 2016-03-31 株式会社Screenホールディングス Substrate processing apparatus and substrate processing method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358109A (en) 2000-06-14 2001-12-26 Semiconductor Leading Edge Technologies Inc Single-wafer cleaning device and wafer-cleaning method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101101858A (en) * 2006-07-06 2008-01-09 大日本网目版制造株式会社 Substrate treatment method and substrate treatment apparatus
JP2008277576A (en) * 2007-04-27 2008-11-13 Dainippon Screen Mfg Co Ltd Method and apparatus for treating substrate
JP2009212407A (en) * 2008-03-06 2009-09-17 Dainippon Screen Mfg Co Ltd Method and apparatus for processing substrate
JP2010067636A (en) * 2008-09-08 2010-03-25 Dainippon Screen Mfg Co Ltd Substrate treatment apparatus
CN103210476A (en) * 2010-11-15 2013-07-17 栗田工业株式会社 Method for cleaning silicon wafer and apparatus for cleaning silicon wafer
JP2013016594A (en) * 2011-07-01 2013-01-24 Tokyo Electron Ltd Substrate cleaning method, substrate cleaning device and memory medium
JP2013074114A (en) * 2011-09-28 2013-04-22 Renesas Electronics Corp Method and device for manufacturing semiconductor device
JP2014143310A (en) * 2013-01-24 2014-08-07 Tokyo Electron Ltd Substrate processing apparatus, substrate processing method, and storage medium
JP2016042518A (en) * 2014-08-15 2016-03-31 株式会社Screenホールディングス Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
CN110073472B (en) 2023-02-28
TWI655974B (en) 2019-04-11
KR20190086003A (en) 2019-07-19
JP6759087B2 (en) 2020-09-23
JP2018101670A (en) 2018-06-28
KR102215990B1 (en) 2021-02-16
WO2018116671A1 (en) 2018-06-28
TW201825199A (en) 2018-07-16

Similar Documents

Publication Publication Date Title
TWI709169B (en) Substrate processing method and substrate processing apparatus
TWI363393B (en) Recovery cup cleaning method and substrate treatment apparatus
CN106104762B (en) Base plate processing system and pipeline cleaning method
CN110537248A (en) Substrate processing method using same and substrate board treatment
TWI547765B (en) Substrate processing method and substrate processing apparatus
TW200915403A (en) Substrate processing apparatus
KR101838418B1 (en) Substrate processing method, and substrate processing device
CN110364453A (en) Substrate processing method using same and substrate board treatment
CN109564862A (en) Substrate board treatment and substrate processing method using same
US11590540B2 (en) Substrate treating apparatus and substrate transporting method
CN107658242A (en) Substrate processing method using same and substrate board treatment
TW201703874A (en) Substrate processing method and substrate processing device
TW202126394A (en) Substrate processing apparatus and brush container
CN109216229A (en) Substrate board treatment and substrate processing method using same
JP2007134600A (en) Device and method for processing substrate
US8197606B2 (en) Substrate cleaning method, substrate cleaning apparatus, control program, and computer-readable storage medium
CN110073472A (en) Substrate processing method using same, feeding method and substrate board treatment
JP2013207207A (en) Substrate liquid processing apparatus and substrate liquid processing method
CN109155247A (en) Substrate board treatment and substrate processing method using same
JP2004273799A (en) Rinsing liquid for substrate, and substrate treatment method and equipment
CN110508545A (en) Wafer cleaning device and method
CN110364454A (en) Substrate processing method using same and substrate board treatment
JP6831889B2 (en) Substrate processing equipment and substrate processing method
TWI813151B (en) Substrate processing apparatus and pipe attachable/detachable component cleaning method
JP5541627B2 (en) Processing liquid supply apparatus and substrate processing apparatus provided with the same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant