CN110066978A - 一种铁酸铋薄膜的制备方法及其用途 - Google Patents
一种铁酸铋薄膜的制备方法及其用途 Download PDFInfo
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Abstract
本发明提供了一种铁酸铋薄膜的制备方法,涉及功能薄膜器件制备技术领域。包括步骤一、选取大小为10mm×10mm二氧化硅材料为基底;步骤二、将步骤一选取的基底材料依次用去离子水,乙醇,丙酮,乙醇,去离子水清洗干净,备用;步骤三、在清洗干净的基底材料上直流溅射沉积金属钛作为下电极;步骤四、使用模具掩盖20%的下电极并用高温胶带固定,备用;步骤五、将经过步骤四处理的样品采用FLJ450型多靶多功能溅射系统,在真空度为10‑5Pa,工作气压为0.6Pa,采用射频溅射Bi2O3和直流溅射Fe各30分钟,制备得到铁酸铋薄膜介电层的样品;得到的样品用圆形掩膜板掩盖,用同样的工艺沉积金属钛作为器件的上电极,得到具有钛/铁酸铋/钛/二氧化硅结构的电子器件。
Description
技术领域
本发明涉及功能薄膜器件制备技术领域。
背景技术
近年来,随着设备制造技术的不断改进和半导体技术的不断革新,功能器件的制备更加的多元化。同时,信息技术的更新换代引起了电子产品的迅速发展。然而,存储设备是大多数电子产品的主要组成部分之一。为此,存储设备需要更高的存储空间密度,超快读写速度,小型化存储单位才能满足当今社会的发展进程。考虑到上述问题,具有可靠的电气性能的存储器件已成为研究的焦点。
目前使用的存储器可以分为两类,即易失性的随机存储器和非易失性存储器。前者主要产品有动态随机存取存储器和静态随机存储器,数据存储速度快,但当结束供电后,所存储的信息将会很快消失,因此易失性存储器存储的信息需要不断刷新。后者主要有ROM(只读存储器)、PROM(可编程存储器)、EEPROM(电可擦除存储器)、Flash(闪存)等,它们的存储速度相对较慢,但是具有断电后仍然能够继续保持存储数据的特性,已经广泛应用于许多小型电子设备中,其中Flash已经成为目前最为成熟的非易失性存储器。
自提出忆阻存储器的概念以来,忆阻随机存储器已经成为电子技术学,物理学,材料学,物理化学与信息技术领域的研究热点。忆阻器具有上下电极和介电层的三明治结构。介电层薄膜中的导电机制主要包括了肖特基发射、空间电荷限制传导、欧姆传导、Poole-Frenkele发射、热场发射、Fowler-Nordheim隧穿、直接隧穿、跳跃传导和离子传导等模型。这些传导模型对于我们研究忆阻器中的电荷传导具有很好的理论依据。制备忆阻器的介电层材料主要是半导体,如ZnO,TiO2,ZrO2,NiO,SrTiO3,Fe2O3,BiFeO3等,BiFeO3是一种重要的p型半导体材料,属于多铁材料的一种,具有铁电性和反铁磁性,并伴随弱的铁磁性,是当前多铁材料研究的热点之一。其铁电居里点在820℃,反铁磁奈尔点位370℃,因此在室温下具有多铁性,其具有广阔的应用前景。铁电性是指铁电体在特定的温度下发生自发极化的现象,且在极化过程中,极化方向会随着外电场方向的改变而改变。由于BiFeO3有合适的禁带宽度,光响应范围较宽等优点成为继TiO2后最具有应用前景的光催化材料之一。室温多铁性的材料拥有许多潜在的性质,体现出基于BiFeO3材料具有潜在的应用性能,特别提供了具有制备多功能器件的潜在可能。
磁控溅射沉积镀膜技术是利用辉光放电过程产生等离子体,让荷能粒子(如氩离子)对靶材表面进行轰击,将原子、分子等反应粒子从靶材的表面打出,最终沉积在基底的表面形成薄膜层,此过程中,由于在靶材的表面存在与电场方向正交的磁场,使等离子体的离化率和阴极溅射率得到有效提高。作为一种重要的沉积技术,磁控溅射镀膜技术与其他制备方法相比,具有以下优势:(1)装置性能稳定,操作方便;(2)工艺容易控制,重复性好,清洁污染性小;(3)可实现低温快速沉积,薄膜厚度均匀可控,与基体附着力较好;(4)选材灵活广泛,可溅射金属靶材、陶瓷靶材等多种靶材。研究制备BiFeO3薄膜的新方法具有重大的意义,有望发展成为以后功能器件的候选材料,为实现更优异的性能的电子器件提供新的途径。
发明内容
本发明的目的是提供一种铁酸铋薄膜的制备方法及其用途,它能有效地解决磁控溅射沉积技术制备铁酸铋薄膜的技术问题。
本发明的目的是通过以下技术方案来实现的:一种铁酸铋薄膜的制备方法,具体包括如下步骤:
步骤一、选取大小为10mm×10mm二氧化硅材料为基底材料;
步骤二、将步骤一选取的基底材料依次用去离子水,乙醇,丙酮,乙醇,去离子水清洗干净,备用;
步骤三、在清洗干净的基底材料上通过直流溅射沉积金属钛作为下电极;
步骤四、使用模具掩盖所述下电极20%的面积并用高温胶带固定,备用;
步骤五、将经过步骤四处理的下电极样品采用FLJ450型多靶多功能溅射系统,在真空度为10-5Pa,工作气压为0.6Pa,通过射频溅射Bi2O3和直流溅射Fe两种方法,同时溅射30分钟,制备得到具有铁酸铋薄膜介电层的下电极样品;
步骤六、将步骤五中得到的铁酸铋薄膜介电层的下电极样品用圆形掩膜板掩盖,再用步骤三的工艺沉积金属钛作为器件的上电极,得到具有钛/铁酸铋/钛/二氧化硅结构的电子器件。
所述基底材料采用具有硬质的载玻片、导电玻璃、Ti片均可。
所述射频溅射Bi2O3和直流溅射Fe的工艺步骤为两者同时进行;所述射频溅射工艺的功率为80瓦,直流溅射工艺的电流为0.2安培。
一种使用上述权利要求1至3所述的方法得到的铁酸铋薄膜的用途,所述铁酸铋薄膜制备得到的具有钛/铁酸铋/钛/二氧化硅结构的电子器件,通过测试所述电子器件的电学性能,展现了明显的忆阻特性,因此,所述铁酸铋薄膜在制造记忆存储设备领域具有实用效果。
本发明中选择磁控溅射沉积技术制备BiFeO3薄膜,针对BiFeO3中Bi的易挥发性难以制备纯相的问题,选择Bi2O3和Fe的靶材以及调控溅射工艺参数进行共溅射沉积制备BiFeO3薄膜。在这项工作中,通过磁控溅射的方法成功制备了BiFeO3薄膜,制备出具有简单的三明治结构的器件并在不同的测试条件下均能展现良好的忆阻行为。
本发明的有益效果是:
1、本发明利用磁控溅射的方法制备出的铁酸铋薄膜有望发展成为以后功能器件的候选材料,为实现更优异的性能的电子器件提供新的应用途径;
2、本发明对钛/铁酸铋/钛/二氧化硅结构的电子器件在不同的条件下测试电学性能均展现忆阻行为,说明铁酸铋材料存在的应用价值。
附图说明
图1为本发明的流程图;
图2为本发明铁酸铋薄膜X射线衍射(XRD)图谱;
图3为本发明利用铁酸铋薄膜制备的功能器件的电流—电压曲线(I-V曲线)。
具体实施方式
为了使本发明的目的、技术方案和优点更加清楚,下面将结合附图进一步说明本发明的技术方案。
如图1所示,一种铁酸铋(BiFeo3)薄膜的制备方法,结构为钛/铁酸铋/钛/二氧化硅的电子器件的制备方法,包括以下步骤:步骤一、选取大小为10mm×10mm二氧化硅材料为基底材料;
步骤二、将步骤一选取的基底材料依次用去离子水,乙醇,丙酮,乙醇,去离子水清洗干净,备用;
步骤三、在清洗干净的基底材料上通过直流溅射沉积金属钛作为下电极;
步骤四、使用模具掩盖所述下电极20%的面积并用高温胶带固定,备用;
步骤五、将经过步骤四处理的下电极样品采用FLJ450型多靶多功能溅射系统,在真空度为10-5Pa,工作气压为0.6Pa,通过射频溅射Bi2O3和直流溅射Fe两种方法,同时溅射30分钟,制备得到具有铁酸铋薄膜介电层的下电极样品;
步骤六、将步骤五中得到的铁酸铋薄膜介电层的下电极样品用圆形掩膜板掩盖,用步骤三相同的工艺沉积金属钛作为器件的上电极,得到具有钛/铁酸铋/钛/二氧化硅结构的电子器件。
所述基底材料采用具有硬质的载玻片、导电玻璃、Ti片均可。
所述射频溅射Bi2O3和直流溅射Fe的工艺步骤为两者同时进行;所述射频溅射工艺的功率为80瓦,直流溅射工艺的电流为0.2安培。
一种铁酸铋薄膜的用途,所述铁酸铋薄膜制备成具有钛/铁酸铋/钛/二氧化硅的三明治结构的电子器件,测试所述电子器件的电学性能,展现了明显的忆阻特性,所述铁酸铋薄膜在制造记忆存储设备领域得到应用。
图2为铁酸铋薄膜X射线衍射(XRD)图谱,由图谱可以看出制备薄膜的主要成分为铁酸铋。XRD图谱显示铁酸铋在(012)、(110)、(200)和(211)晶面。
图3为利用铁酸铋薄膜制备的器件的电流—电压曲线(I-V曲线)。当上电极加正电压下电极接地时,并且测试电路的电压扫描范围为-6.0V到6.0V。从图3(a)电流—电压曲线中可以看出当扫描速率为0.1V/s时在3.3V的电压处出现了Forming的过程;当扫描速率增加到0.2V/s时,器件的Forming过程出现在4.8V的电压处如图3(b);当扫描速率是0.5V/s和1.0V/s器件的Forming过程消失,是因为扫描速率增大时电压的施加时间减小,在器件内部还没有来得及发生Forming过程如图3(c)和(d)。
本发明中,基底不限于SiO2材料,其他硬质的载玻片、导电玻璃、Ti片均可用于本发明。
最后说明的是,以上实例仅用以说明本发明的技术方案而非限制,尽管通过参照本发明的优选实验已经对本发明进行了描述,可以在形式上和细节上对其做出各种各样的改变,而不偏离所附权利要求书所限定的本发明的范围。
Claims (4)
1.一种铁酸铋薄膜的制备方法,具体包括如下步骤:
步骤一、选取大小为10mm×10mm二氧化硅材料为基底材料;
步骤二、将步骤一选取的基底材料依次用去离子水,乙醇,丙酮,乙醇,去离子水清洗干净,备用;
步骤三、在清洗干净的基底材料上通过直流溅射沉积金属钛作为下电极;
步骤四、使用模具掩盖所述下电极20%的面积并用高温胶带固定,备用;
步骤五、将经过步骤四处理的下电极样品采用FLJ450型多靶多功能溅射系统,在真空度为10-5Pa,工作气压为0.6Pa,通过射频溅射Bi2O3和直流溅射Fe两种方法,同时溅射30分钟,制备得到具有铁酸铋薄膜介电层的下电极样品;
步骤六、将步骤五中得到的铁酸铋薄膜介电层的下电极样品用圆形掩膜板掩盖,再用步骤三的工艺沉积金属钛作为器件的上电极,得到具有钛/铁酸铋/钛/二氧化硅结构的电子器件。
2.根据权利要求书1中所述的一种铁酸铋薄膜的制备方法,其特征在于:所述基底材料采用具有硬质的载玻片、导电玻璃、Ti片均可。
3.根据权利要求书1中所述的一种铁酸铋薄膜的制备方法,其特征在于:所述射频溅射Bi2O3和直流溅射Fe的工艺步骤为两者同时进行;所述射频溅射工艺的功率为80瓦,直流溅射工艺的电流为0.2安培。
4.一种使用上述权利要求1至3所述的方法得到的铁酸铋薄膜的用途,其特征在于:所述铁酸铋薄膜制备得到的具有钛/铁酸铋/钛/二氧化硅结构的电子器件,通过测试所述电子器件的电学性能,展现了明显的忆阻特性,因此,所述铁酸铋薄膜在制造记忆存储设备领域具有实用效果。
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