CN110062528B - Automatic heating device for circuit board electroplating pressing plate - Google Patents

Automatic heating device for circuit board electroplating pressing plate Download PDF

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Publication number
CN110062528B
CN110062528B CN201910242272.5A CN201910242272A CN110062528B CN 110062528 B CN110062528 B CN 110062528B CN 201910242272 A CN201910242272 A CN 201910242272A CN 110062528 B CN110062528 B CN 110062528B
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China
Prior art keywords
pcb
temperature
heating
box body
heating device
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CN201910242272.5A
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CN110062528A (en
Inventor
文伟峰
刘长松
何立发
查红平
庞煜
刘绚
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Jiangxi Redboard Technology Co Ltd
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Red Board Jiangxi Co ltd
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Priority to CN201910242272.5A priority Critical patent/CN110062528B/en
Publication of CN110062528A publication Critical patent/CN110062528A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0014Shaping of the substrate, e.g. by moulding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Abstract

An automatic heating device for an electroplating pressing plate of a circuit board comprises a box body, a box cover, a heating device and a temperature detection device, wherein the heating device comprises a contact part and a plurality of heating pipes connected to the contact part; the two adjacent heating pipes can move in opposite directions and are inserted and overlapped in an interpenetration mode, the temperature detection device comprises a plurality of temperature detectors, and each temperature detector is arranged on the corresponding side wall of the PCB and is contacted with the corresponding side wall of the PCB; a plurality of through holes which penetrate through the box cover up and down are formed in the box cover, and opening and closing sealing doors are arranged in the through holes; the invention can not only improve the uniformity of heating of each part of the PCB, but also ensure the uniformity of the heating temperature of each PCB, thereby improving the uniformity of heating of the PCB. In addition, the invention has high safety, is suitable for processing PCBs with various specifications, has strong practicability and has stronger popularization significance.

Description

Automatic heating device for circuit board electroplating pressing plate
Technical Field
The invention relates to circuit board processing equipment, in particular to an automatic heating device for a circuit board electroplating pressing plate.
Background
In the prior art, a PCB, which is called Printed Circuit Board in english, is also called Printed Circuit Board, and is an important electronic component, a support body of the electronic component, and a carrier for electrical connection of the electronic component. Before the PCB is stamped or plated with the press plate, the PCB generally needs to be heated to raise the temperature of the plate so that the edge exposure is not caused during stamping (or pressing). But the heating device that present enterprise used only comes to carry out the heating of uniform temperature to the circuit board according to technical staff experience, often causes panel heating inhomogeneous, influences later stage processing effect, and the yields is low, and just my traditional each heating device can only be suitable for the PCB heating of a specification to need be equipped with the heating device of multiple specification simultaneously, not only increased equipment cost, and need occupy too much space.
Disclosure of Invention
Therefore, in order to overcome the defects in the prior art, the invention aims to provide an automatic heating device for a circuit board electroplating pressing plate.
An automatic heating device for an electroplating pressing plate of a circuit board comprises a box body, a box cover, a heating device and a temperature detection device, wherein the heating device comprises a contact part and a plurality of heating pipes connected to the contact part, and the contact part is arranged on the inner side of the bottom of the box body and is annularly arranged along the side wall of the box bottom; the contact part is also provided with a connecting groove at the outer side of the box body, and the outer side of the outermost side end of the connecting groove is higher than the position of the bottom surface at the inner side of the box body; the electric connection parts are respectively arranged at the bottom end parts of the two sides of the heating pipe, are electrically connected with the contact part and can freely move along the horizontal extension direction of the connection groove; the heating pipes are arranged in a circular bending shape, and two adjacent heating pipes can move in opposite directions and are inserted and overlapped in an interpenetrating mode; the temperature detection device comprises a plurality of temperature detectors, and each temperature detector is arranged on the side wall of the box body which is in contact with the PCB; a plurality of through holes which penetrate through the box cover up and down are formed in the box cover, and the through holes and the space between two adjacent heating pipes are arranged in an up-down opposite mode; an opening and closing sealing door is arranged in the through hole; inserting the PCB into two adjacent heating pipes from the box cover, pushing the heating pipes to two sides by the PCB, and sealing the through holes by the sealing door; the temperature detection device detects the temperature of the PCB, when the temperature of the PCB reaches a set value, the sealing door is opened, and the lifting device drives the PCB to move upwards out of the box body.
Furthermore, the sealing door comprises a main body part, a scroll and a driving device, wherein the scroll and the driving device are arranged in the box body, and the main body part is wound on the scroll; two opposite side walls of the through hole, which are vertical to the installation side of the sealing door, are respectively provided with a guide rod, the other end of the main body part, which is far away from the scroll, is provided with a transmission rod, and two ends of the transmission rod are installed on the two guide rods and can move along the two guide rods.
Furthermore, the left side and the right side of the top end of each heating pipe are obliquely arranged, a material guiding structure is formed by adjacent inclined surfaces between every two adjacent heating pipes, and the PCB is inserted into the material guiding structure.
Furthermore, the through hole wall of the box cover is provided with corresponding clamping grooves corresponding to the positions of the sealing doors, the two guide rods respectively extend into the two clamping grooves, and the extending direction of the guide rods is the same as that of the clamping grooves.
And the temperature sensor, the scroll of the sealing door and the lifting drive of the ejection device are all connected to the main control device.
Further, a constant temperature device is arranged in the box body, the constant temperature device detects the temperature in the box body in real time, and the temperature of the heating device is adjusted in real time according to the detected temperature.
Furthermore, an elastic wall is arranged on the side face of the box body, a compression spring is arranged between the elastic wall and the side wall of the corresponding side of the box body, and the side edge of the PCB is in contact with the outer side face of the elastic wall.
In conclusion, the ejection device and the closed door are arranged, so that heat energy can be fully utilized, and the safety risk of scalding can be avoided; each part of each PCB is heated uniformly by arranging the heating device; the temperature of each PCB can be ensured to reach a required value by arranging a single temperature sensor to detect the temperature of the corresponding PCB; in addition, due to the design of the movable and staggered overlapped heating pipes and the elastic wall, the heating device disclosed by the invention is suitable for processing PCBs (printed circuit boards) with various specifications, and has strong practicability and stronger popularization significance.
Drawings
FIG. 1 is a schematic structural view of an automatic heating device for a circuit board electroplating platen according to the present invention;
FIG. 2 is a schematic cross-sectional view of the heating apparatus of FIG. 1;
FIG. 3 is a top view of the heating apparatus of FIG. 1, with the cover not shown;
fig. 4 is a schematic view illustrating the installation of the heating apparatus and the cabinet in fig. 1.
Detailed Description
In order to clearly show the technical scheme of the invention, the invention is further described with reference to the accompanying drawings.
As shown in fig. 1 to 4, an automatic heating device for a circuit board electroplating pressing plate is provided, which includes a box body 10, a box cover 20, a heating device 30 and a temperature detection device 40, wherein the box cover 20 is covered on the box body 10 and encloses with the box body to form a heating space, a plurality of external PCBs 50 are installed in the heating space, the heating device 30 and the temperature detection device 40 are both installed in the box body 10, and the temperature detection device 40 detects the temperature on the PCB50 in real time.
The heating device 30 comprises a contact part 31 and a plurality of heating pipes 32 connected to the contact part 31, wherein the contact part 31 is installed on the inner side of the bottom of the box body 10 and is annularly arranged along the side wall of the box bottom. The contact portion 31 is further provided with a connecting groove 33 on the outer side of the case 10, and the outer side of the outermost end of the connecting groove 33 is higher than the position of the inner side of the case 10, which is the bottom surface. The connecting slot 33 is bent to provide dust-proof and water-proof functions. The heating pipe 32 is provided with an electrical connection portion 34 at each of two bottom ends thereof, and the electrical connection portion 34 and the contact portion 31 can be electrically connected. In this embodiment, the electrical connection portion 34 can freely move along the horizontal extending direction of the connection groove 33, so that not only the position of the heating device 30 can be adjusted, but also the heating tube 32 and the contact portion 31 can be electrically connected all the time.
The heating pipe 32 is arranged in a circular bending shape, so that the heating area can be increased, and the contact uniformity of heat on the heating pipe 32 and the PCB is improved. Two adjacent heating pipes 32 can move in opposite directions and interpenetrate, insert and overlap, thus PCB of various dimensions can be inserted according to actual demand, application range is wide, and applicability is strong. In addition, the left side and the right side of the top end of the heating pipe are both obliquely arranged, and the adjacent oblique surfaces between two adjacent heating pipes 32 form a material guiding structure, so that the PCB can be conveniently inserted.
The box body 10 is also internally provided with a constant temperature device, the constant temperature device can detect the temperature in the box body in real time and adjust the temperature of the heating device 30 in real time according to the detected temperature so as to avoid the over-high or over-low temperature of the heating device 30 and further cause poor heating. In addition, a guide rail (not shown) is further disposed in the middle of the bottom surface of the box 10, the direction of the guide rail extends perpendicular to the PCB mounting direction, and a plurality of ejection devices are disposed on the guide rail, and each ejection device includes an ejection plate and an ejection cylinder disposed at the bottom of the ejection plate.
Buffer layers are arranged on the two opposite side faces of the box body 10, which are in contact with the PCB, and on the two outer side faces of the heating pipe 32 in a protruding mode, and the buffer layers are made of soft rubber materials which are high-temperature resistant, anti-aging and good in flexibility. The design of this buffer layer can avoid PCB and heating pipe 32 direct contact, leads to PCB to be scraped the flower. In addition, the box body is also provided with an elastic wall on one side surface in the PCB inserting direction, and a compression spring is arranged between the elastic wall and the inner side wall of the box body, so that the transverse width adjustment of the PCB can be adjusted.
The case cover 20 is provided with a plurality of through holes 21 which penetrate through the case cover from top to bottom, and the through holes 21 and the PCB installation grooves 11 are arranged oppositely from top to bottom. A sealing door 22 is arranged in one side wall of the through hole 21, and a corresponding clamping groove (not shown) is arranged on the hole wall of the through hole 21 corresponding to the sealing door 22. Specifically, the sealing door 22 includes a main body, a roller (not shown) disposed in the casing 20, and a driving device for driving the roller to rotate. The main body part is made of flexible high-temperature-resistant materials and is wound on the reel. Two guide rods (not shown) are respectively arranged in the two clamping grooves, a transmission rod is arranged at the other end, far away from the reel, of the main body part, two ends of the transmission rod are respectively installed on the two guide rods, and the transmission rod drives the main body part to move along the two guide rods so as to unfold, cover and seal the main body part on the through hole 21 or open the through hole 21.
In addition, the number of the temperature detecting devices 40 is provided with a plurality of temperature detecting devices 40, the temperature detecting devices 40 are arranged on the side wall of the mounting groove 11, and the temperature detecting devices 40 are used for detecting the temperature of the PCB in the corresponding mounting groove 11. The automatic heating device for the circuit board electroplating pressing plate further comprises a main control device, and the temperature sensor 40, the scroll of the sealing door 22 and the lifting drive of the ejection device 12 are all connected to the main control device.
The box body 10 comprises a heating area and a material waiting area, the heating device is arranged in the heating area, an elastic wall is arranged on the side surface of the heating area, a compression spring is arranged between the elastic wall and the side wall of the corresponding side of the box body, and the side edge of the PCB is contacted with the outer side surface of the elastic wall. When the PCB is inserted, the PCB is clamped in from the material guiding structure, and the heating pipe is extruded to two sides, so that the heating pipe moves to two sides. And a guide groove is arranged in the box body of the material waiting area, and the guide groove is connected with the contact part 31 of the heating device 30 end to end. Therefore, the heating pipe which is not needed to be used can move into the material waiting area along the contact part 31, the heating pipe is disconnected with the contact part 31, and the redundant heating pipes stop working, so that uneven heating cannot be caused. Meanwhile, the redundant heating pipes can be overlapped and folded, so that the space is saved.
The heating device 30 is further provided with a returning device, and when the PCB is taken out, the returning device can drive the heating tube 32 to move back to the original position. That is, the gap between two adjacent heating tubes 32 is set right opposite to the through hole of the case cover 20, and the distance between two adjacent heating tubes 32 is the width of the thinnest PCB within the normal processing range, so as to facilitate the insertion positioning.
During operation, the PCB is inserted into the ejection device from the hole through hole 21, so that the problem of collision damage caused by the fact that the PCB falls off the bottom of the box body 10 can be avoided, and the hands of workers can be prevented from being scalded. In addition, the design of the heating pipes which are movable and overlapped in a staggered mode and the arrangement of the elastic wall enable the heating device to be applicable to heating operation of PCBs with various specifications, and the application range is wide. The pressure sensor is arranged in the clamping groove of the ejection device, and when the pressure sensor senses pressure, the closed door is closed, so that hot air can be prevented from leaking, and heat can be fully utilized. When the temperature detection device detects that the temperature of the corresponding PCB reaches the temperature needing to be heated, the temperature detection device sends a signal to the main control device, the main control device drives the sealing door to be opened, and meanwhile, the ejection device moves upwards to send out the PCB.
In conclusion, the ejection device and the closed door are arranged, so that heat energy can be fully utilized, and the safety risk of scalding can be avoided; each part of each PCB is heated uniformly by arranging the heating device; the temperature of each PCB can be ensured to reach a required value by arranging a single temperature sensor to detect the temperature of the corresponding PCB; in addition, due to the design of the movable and staggered overlapped heating pipes and the elastic wall, the heating device disclosed by the invention is suitable for processing PCBs (printed circuit boards) with various specifications, and has strong practicability and stronger popularization significance.
The above-mentioned embodiments only express one embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (7)

1. The utility model provides a circuit board electroplates clamp plate self-heating device which characterized in that: the heating device comprises a contact part and a plurality of heating pipes connected to the contact part, wherein the contact part is arranged on the inner side of the bottom of the box body and is annularly arranged along the side wall of the box bottom; the contact part is also provided with a connecting groove at the outer side of the box body, and the outer side of the outermost side end of the connecting groove is higher than the position of the bottom surface at the inner side of the box body; the electric connection parts are respectively arranged at the bottom end parts of the two sides of the heating pipe, are electrically connected with the contact part and can freely move along the horizontal extension direction of the connection groove; the heating pipes are arranged in a circular bending shape, and two adjacent heating pipes can move in opposite directions and are inserted and overlapped in an interpenetrating mode; the temperature detection device comprises a plurality of temperature detectors, and each temperature detector is arranged on the side wall of the box body which is in contact with the PCB; a plurality of through holes which penetrate through the box cover up and down are formed in the box cover, and the through holes and the space between two adjacent heating pipes are arranged in an up-down opposite mode; an opening and closing sealing door is arranged in the through hole; inserting the PCB into two adjacent heating pipes from the box cover, pushing the heating pipes to two sides by the PCB, and sealing the through holes by the sealing door; the temperature detection device detects the temperature of the PCB, when the temperature of the PCB reaches a set value, the sealing door is opened, and the lifting device drives the PCB to move upwards out of the box body.
2. The automatic heating device for the electroplating press plate of the circuit board as claimed in claim 1, wherein: the sealing door comprises a main body part, a scroll and a driving device, wherein the scroll and the driving device are arranged in the box body, and the main body part is wound on the scroll; two opposite side walls of the through hole, which are vertical to the installation side of the sealing door, are respectively provided with a guide rod, the other end of the main body part, which is far away from the scroll, is provided with a transmission rod, and two ends of the transmission rod are installed on the two guide rods and can move along the two guide rods.
3. The automatic heating device for the electroplating pressing plate of the circuit board as claimed in claim 2, wherein: the through hole wall of the box cover is provided with corresponding clamping grooves corresponding to the positions of the sealing doors, the two guide rods respectively extend into the two clamping grooves, and the extending direction of the guide rods is the same as that of the clamping grooves.
4. The automatic heating device for the electroplating pressing plate of the circuit board as claimed in claim 2, wherein: the temperature sensor, the scroll of the sealing door and the ejection device are all connected to the main control device.
5. The automatic heating device for the electroplating press plate of the circuit board as claimed in claim 1, wherein: the left side and the right side of the top end of each heating pipe are obliquely arranged, a material guiding structure is formed by adjacent inclined surfaces between every two adjacent heating pipes, and the PCB is inserted into the material guiding structure.
6. The automatic heating device for the electroplating press plate of the circuit board as claimed in claim 1, wherein: the box body is also internally provided with a constant temperature device which detects the temperature in the box body in real time and adjusts the temperature of the heating device in real time according to the detected temperature.
7. The automatic heating device for the electroplating press plate of the circuit board as claimed in claim 1, wherein: an elastic wall is arranged on the side face of the box body, a compression spring is arranged between the elastic wall and the side wall of the corresponding side of the box body, and the side edge of the PCB is in contact with the outer side face of the elastic wall.
CN201910242272.5A 2019-03-28 2019-03-28 Automatic heating device for circuit board electroplating pressing plate Active CN110062528B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910242272.5A CN110062528B (en) 2019-03-28 2019-03-28 Automatic heating device for circuit board electroplating pressing plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910242272.5A CN110062528B (en) 2019-03-28 2019-03-28 Automatic heating device for circuit board electroplating pressing plate

Publications (2)

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CN110062528A CN110062528A (en) 2019-07-26
CN110062528B true CN110062528B (en) 2020-08-14

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Application Number Title Priority Date Filing Date
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4817652U (en) * 1971-07-07 1973-02-28
EP0061158A1 (en) * 1981-03-23 1982-09-29 Radiant Technology Corporation Method for firing thick film electronic circuits
US4973243A (en) * 1988-06-08 1990-11-27 Electrovert Ltd. Heating system in the manufacture of printed circuit boards, assemblies and the like
CN203409389U (en) * 2013-08-05 2014-01-29 深圳市联合超越电子设备有限公司 Longitudinal arrangement structure of preheating tank heating pipe of wave soldering machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4817652U (en) * 1971-07-07 1973-02-28
EP0061158A1 (en) * 1981-03-23 1982-09-29 Radiant Technology Corporation Method for firing thick film electronic circuits
US4973243A (en) * 1988-06-08 1990-11-27 Electrovert Ltd. Heating system in the manufacture of printed circuit boards, assemblies and the like
CN203409389U (en) * 2013-08-05 2014-01-29 深圳市联合超越电子设备有限公司 Longitudinal arrangement structure of preheating tank heating pipe of wave soldering machine

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Effective date of registration: 20191010

Address after: 343100 Jinggangshan national economic and Technological Development Zone, Jiangxi, Ji'an

Applicant after: Red Plate (Jiangxi) Co., Ltd.

Address before: 343100 Jinggangshan economic and Technological Development Zone, Jiangxi, Ji'an

Applicant before: Ji'an City Jun Map Technology Co. Ltd.

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Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100

Patentee after: Jiangxi hongban Technology Co.,Ltd.

Address before: 343100 national Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province

Patentee before: RED BOARD (JIANGXI) Co.,Ltd.

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