CN218160350U

CN218160350U - SOP chip of broad body

Info

Publication number: CN218160350U
Application number: CN202222196280.0U
Authority: CN
Inventors: 艾育林
Original assignee: Jiangxi Wannianxin Microelectronics Co Ltd
Current assignee: Jiangxi Wannianxin Microelectronics Co Ltd
Priority date: 2022-08-19
Filing date: 2022-08-19
Publication date: 2022-12-27
Anticipated expiration: 2032-08-19

Abstract

The utility model relates to the technical field of electronic elements, in particular to a wide SOP chip, which comprises a chip body, wherein a protection mechanism is arranged at the pin position of the chip body, and a heat dissipation plate is arranged at the top of the chip body; protection machanism includes the protective sheath of fixedly connected with in chip body pin position department, the outer wall of protective sheath just keeps away from chip body position department sliding connection and has sealed lid, the inside of sealed lid and the top sliding connection at chip body pin have the fixed pin, the bottom fixedly connected with pressure spring of fixed pin, the top of fixed pin just keeps away from protective sheath position department fixedly connected with clamp plate, and through designing the SOP chip of a wide body, utilize protection machanism in the device to protect the pin of chip body, when having solved current wide body SOP chip when the installation, the pin of SOP chip is mostly exposed outside, the easy problem of damaging of pin of wide body SOP chip.

Description

SOP chip of broad body

Technical Field

The utility model relates to an electronic component technical field specifically is a SOP chip of broad body.

Background

The wide Sop chip is an electronic component, but the existing wide Sop chip still has the following defects: when the conventional broad sop chip is installed, most of pins of the sop chip are exposed outside, and the pins of the broad sop chip are easy to damage.

Therefore, a broad SOP chip is needed to solve the above problems in the background art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a SOP chip of broad body to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above purpose, the utility model provides a following technical scheme:

a wide SOP chip comprises a chip body, wherein a protection mechanism is arranged at the position of a pin of the chip body, and a heat dissipation plate is arranged at the top of the chip body;

protection machanism includes the protective sheath of fixedly connected with in chip body pin position department, the outer wall of protective sheath and keeping away from chip body position department sliding connection have sealed lid, the inside of sealed lid and the top sliding connection at chip body pin have the fixed pin, the bottom fixedly connected with pressure spring of fixed pin, the top of fixed pin and keeping away from protective sheath position department fixedly connected with clamp plate, the outer wall of sealed lid and in the below fixedly connected with guide bar of chip body pin, the outer wall of sealed lid just is being sealed the pad near protective sheath position department fixedly connected with.

As the utility model discloses preferred scheme, the heating panel is made by red copper, the multiunit radiating groove has been seted up to the outer wall of heating panel.

As the utility model discloses preferred scheme, protective sheath, sealed lid, fixed pin, clamp plate and guide bar are made by ABS plastics, sealed the pad is made by silica gel.

As the utility model discloses preferred scheme, the fixed pin is J font structural design, the fixed pin runs through sealed lid and extends to in the protective sheath.

As the utility model discloses preferred scheme, fixed pin, pressure spring and guide bar all are provided with the multiunit, the guide bar is sliding connection with the connected mode of protective sheath and fixed pin and protective sheath.

As a preferred embodiment of the present invention, the shape of the sealing pad is adapted to the shape of the sealing cover, and the pressing plate penetrates the sealing cover and extends to the upper side of the sealing cover.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses in, SOP chip through designing a broad body, utilize the protection machanism among the device to protect the pin of chip body, the workman presses the clamp plate, the clamp plate can drive the fixed pin downstream, the fixed pin breaks away from the protective sheath, the sealed lid of pulling, sealed lid can drive the fixed pin and outwards remove, the fixed pin withdraws from the protective sheath, the workman uses the tin soldering rifle with chip body pin bottom tin welding on the circuit board, other positions of chip body pin are sealed up by the protective sheath, be difficult to damage, current broad body SOP chip has been solved when the installation, the pin majority of SOP chip exposes outside, the easy problem of damaging of pin of broad body SOP chip.

Drawings

Fig. 1 is a front view of the present invention;

FIG. 2 is a partial front sectional view of the protection mechanism of the present invention;

fig. 3 is an enlarged view of a portion a in fig. 2 according to the present invention.

In the figure: 1. a chip body; 2. a protection mechanism; 3. a heat dissipation plate; 201. a protective sleeve; 202. a sealing cover; 203. a fixing pin; 204. a compression spring; 205. pressing a plate; 206. a guide rod; 207. and a gasket.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the scope of protection of the present invention.

To facilitate understanding of the invention, the invention will be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which can be embodied in many different forms and are not limited to the embodiments described herein, but rather are provided for the purpose of making the disclosure more thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present, and when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present, as the terms "vertical", "horizontal", "left", "right" and the like are used herein for descriptive purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and the use of the terms herein in the specification of the present invention are for the purpose of describing particular embodiments only and are not intended to limit the present invention, and the use of the term "and/or" herein includes any and all combinations of one or more of the associated listed items.

In an embodiment, please refer to fig. 1-3, the present invention provides a technical solution:

a wide SOP chip comprises a chip body 1, wherein a protection mechanism 2 is arranged at a pin position of the chip body 1, and a heat dissipation plate 3 is arranged at the top of the chip body 1;

the heat dissipation plate 3 is made of red copper, a plurality of groups of heat dissipation grooves are formed in the outer wall of the heat dissipation plate 3, the heat dissipation plate 3 made of red copper is high in heat conductivity coefficient, and heat in the chip body 1 can be transferred out in time;

in this embodiment, referring to fig. 2 and 3, the protection mechanism 2 includes a protection sleeve 201 fixedly connected to a pin of the chip body 1, a sealing cover 202 slidably connected to an outer wall of the protection sleeve 201 at a position away from the chip body 1, a fixing pin 203 slidably connected to an inside of the sealing cover 202 and above the pin of the chip body 1, a pressing spring 204 fixedly connected to a bottom of the fixing pin 203, a pressing plate 205 fixedly connected to a top of the fixing pin 203 and at a position away from the protection sleeve 201, a guide rod 206 fixedly connected to an outer wall of the sealing cover 202 and below the pin of the chip body 1, and a sealing pad 207 fixedly connected to an outer wall of the sealing cover 202 and at a position close to the protection sleeve 201;

the protection cover 201, the sealing cover 202, the fixing pin 203, the pressing plate 205 and the guide rod 206 are all made of ABS plastic, the sealing pad 207 is made of silica gel, the sealing pad 207 can block a gap between the sealing cover 202 and the protection cover 201, dust is prevented from entering the protection cover 201 through the gap, the fixing pin 203 is in a J-shaped structural design, the fixing pin 203 penetrates through the sealing cover 202 and extends into the protection cover 201, the fixing pin 203, the compression spring 204 and the guide rod 206 are provided with multiple sets, the connection modes of the guide rod 206 and the protection cover 201 and the fixing pin 203 and the protection cover 201 are both in sliding connection, the shape of the sealing pad 207 is matched with the shape of the sealing cover 202, the pressing plate 205 penetrates through the sealing cover 202 and extends to the upper side of the sealing cover 202, a worker presses the pressing plate 205, the pressing plate 205 can drive the fixing pin 203 to move downwards, the fixing pin 203 breaks away from the protection cover 201, the sealing cover 202 is pulled, the fixing pin 203 can drive the fixing pin 203 to move outwards, the fixing pin 203 exits from the protection cover 201, the worker welds the bottom end of the pin of the chip body 1 on a circuit board using a soldering gun, other parts of the chip body 1 pin are sealed by the protection cover 201, and are not easy to be damaged.

The utility model discloses work flow: the SOP chip of the broad body of this scheme of use design is in the operation, the workman presses down clamp plate 205, clamp plate 205 can drive fixed pin 203 and move down, fixed pin 203 breaks away from protective sheath 201, sealed lid of pulling 202, sealed lid 202 can drive fixed pin 203 and outwards remove, fixed pin 203 withdraws from protective sheath 201, the workman uses the tin welder to weld 1 pin bottom of chip body tin on the circuit board, other positions of 1 pin of chip body are sealed by protective sheath 201, be difficult to damage, the heating panel 3 at 1 top of chip body can distribute out the heat fast, avoid 1 overheated of chip body.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A broad-body SOP chip comprises a chip body (1), and is characterized in that: a protection mechanism (2) is arranged at the pin position of the chip body (1), and a heat dissipation plate (3) is arranged at the top of the chip body (1);

protection machanism (2) include protective sheath (201) of fixedly connected with in chip body (1) pin position department, the outer wall of protective sheath (201) just keeps away from chip body (1) position department sliding connection has sealed lid (202), the inside of sealed lid (202) and the top sliding connection at chip body (1) pin have fixed pin (203), the bottom fixedly connected with pressure spring (204) of fixed pin (203), the top of fixed pin (203) just keeps away from protective sheath (201) position department fixedly connected with clamp plate (205), the outer wall of sealed lid (202) just is at the below fixedly connected with guide bar (206) of chip body (1) pin, the outer wall of sealed lid (202) just is being close to sealed pad (207) of protective sheath (201) position department fixedly connected with.

2. The wide SOP chip of claim 1, wherein: the heat dissipation plate (3) is made of red copper, and a plurality of groups of heat dissipation grooves are formed in the outer wall of the heat dissipation plate (3).

3. The broad SOP chip of claim 1, wherein: protective sheath (201), sealed lid (202), fixed pin (203), clamp plate (205) and guide bar (206) are made by ABS plastics, sealed pad (207) are made by silica gel.

4. The wide SOP chip of claim 1, wherein: the fixing pin (203) is designed to be of a J-shaped structure, and the fixing pin (203) penetrates through the sealing cover (202) and extends into the protective sleeve (201).

5. The broad SOP chip of claim 1, wherein: the fixing pin (203), the compression spring (204) and the guide rod (206) are all provided with multiple groups, and the guide rod (206) is connected with the protective sleeve (201) in a sliding mode, and the fixing pin (203) is connected with the protective sleeve (201) in a sliding mode.

6. The wide SOP chip of claim 1, wherein: the shape of the sealing gasket (207) is matched with that of the sealing cover (202), and the pressing plate (205) penetrates through the sealing cover (202) and extends to the upper part of the sealing cover (202).