CN110058725A

CN110058725A - The preparation method of touch screen

Info

Publication number: CN110058725A
Application number: CN201910168587.XA
Authority: CN
Inventors: 谢自民; 冯波; 郭向阳; 陈春明; 平财明; 林涛
Original assignee: Suzhou Lanpei Photoelectric Technology Co Ltd
Current assignee: Suzhou Lanpei Photoelectric Technology Co Ltd
Priority date: 2019-03-06
Filing date: 2019-03-06
Publication date: 2019-07-26
Anticipated expiration: 2039-03-06
Also published as: CN110058725B; WO2020177736A1

Abstract

The present invention provides a kind of preparation method of touch screen, includes the following steps: to provide the printing work platform for being provided with soft cushioning；Prepare seed ink；In being scratched using blade coating tool to seed ink on soft cushioning in forming the first seed layer in each first groove structure；Based on the first seed layer in forming the first metal wire in the first groove structure；The first transparent optical glue-line is formed in the upper surface of driving layer structure；In carrying out scratching in each second groove structure to seed ink using blade coating tool on soft cushioning forming second of sublayer；Based on second of sublayer in forming the second metal wire in each second groove structure；Inductive layer structure is adhered on to the upper surface of the first transparent optical glue-line；The second transparent optical glue-line is formed in the upper surface of inductive layer structure；Cover transparent sheet is provided, cover transparent sheet is adhered on to the upper surface of the second transparent optical glue-line.The present invention does not need the step of additional precuring and cleaning, to simplify process flow, reduces production cost.

Description

The preparation method of touch screen

Technical field

The invention belongs to technical field of touch control, more particularly to a kind of preparation method of touch screen.

Background technique

Touch screen is usually to have metal grill to constitute channel and have function.Metal grill is mostly regular figure, as rectangle, Diamond shape or hexagon etc..Metal grill in existing touch screen generally passes through the shape in the groove structure of flexible material layer It is obtained at conductive layer, the obtained metal grill is connected via flexible circuit board (FPC) with processing chip.And existing skill In art, the method for conductive layer is formed as shown in Figure 1, generally folding the flexibility including flexible substrates 101 and flexible material layer 102 Layer structure 10 is placed in the upper surface of a printing work platform 12, after the upper surface drop coating silver paste 13 of the flexible material layer 102 Using scraper 14 scratch silver paste 13 so that silver paste 13 be filled in each groove structure 11 after solidified and Obtain conductive layer.

However, when carrying out the blade coating of silver paste 13 using above-mentioned process, due to the printing work platform 12 When the area of generally working metal platform, the especially described working metal platform is bigger, the printing work platform 12 The flatness of upper surface not can guarantee, i.e., the upper surface of the described printing work platform 12 has pit or protrusion exists, and carry out When the blade coating of silver paste 13, since there are the presence of pit or protrusion, silver paste in the upper surface of the printing work platform 12 13 while being filled in the groove structure 11, can remain in the upper surface of the flexible material layer 102；It is completed in blade coating It needs the upper surface to the flexible material layer 102 to clean afterwards, 102 upper surface of flexible material layer will be remained on Silver paste 13 removes, and silver paste 13 could be sintered to solidification to form the conductive layer after cleaning, so that touching The entire processing step of control screen preparation is complicated, higher cost.

Meanwhile existing silver paste 13 belongs to Precious Metal, it is excessively high that this just inevitably results in cost.

Summary of the invention

In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of preparation method of touch screen, For solving to will cause flexible material layer upper surface when the upper surface of flexible material layer carries out silver paste blade coating in the prior art and have Middle silver paste residual, so that the upper surface to the flexible material layer be needed to clean after the completion of blade coating, after cleaning could incite somebody to action Silver paste, which is sintered, is formed by curing conductive layer, so that entire processing step is more complicated, the higher problem of production cost, and make When making conductive layer with silver paste, since silver paste belongs to noble metal, the problem of so as to cause higher cost.

In order to achieve the above objects and other related objects, the present invention provides a kind of preparation method of touch screen, the touch-control The preparation method of screen comprising steps of

Printing work platform is provided, the upper surface of the printing work platform is provided with soft cushioning；

The first flexible overlapping structure is set in the upper surface of the soft cushioning, the first flexible overlapping structure includes first Flexible substrates and the first flexible material layer, first flexible substrates are located at the upper surface of the soft cushioning, and described first is flexible Material layer is located at the upper surface of first flexible substrates, and it is recessed that the upper surface of first flexible material layer is formed with multiple first Slot structure；

Seed ink is prepared, the preparation method of the seed ink includes the following steps:

Iron powder and the first organic solvent are provided, mix the iron powder and part first organic solvent under reducing atmosphere It closes uniformly, to obtain the first mixture；

High molecular polymer, the second organic solvent and deaeration agent are provided, by the high molecular polymer, described second organic Solvent and deaeration agent mixing are to obtain the second mixture；

Nano-silica powder is provided, by the nano-silica powder and part second mixture and described first Mixture is uniformly mixed, to obtain third mixture；

The third mixture is ground, so that the nano-silica powder comes into full contact with the iron powder, with Obtain include the iron powder of surface coated silica layer slurry；

First organic solvent, second mixture and auxiliary agent are continuously added into the slurry and are uniformly mixed i.e. Obtain the seed ink；

The seed ink is placed in the upper surface of first flexible material layer；Using blade coating tool to the seed oil Ink is scratched, so that the seed ink, which is filled in each first groove structure, forms the first seed layer；

Based on first seed layer in forming the first metal wire, the first metal wire phase in first groove structure It connects to form the first metal grill；The first flexible overlapping structure, first seed layer and first metal grill Collectively form driving layer structure；

The first transparent optical glue-line is formed in the upper surface of the driving layer structure；

The second flexible overlapping structure is set in the upper surface of the soft cushioning, the second flexible overlapping structure includes second Flexible substrates and the second flexible material layer, second flexible substrates are located at the upper surface of the soft cushioning, and described second is flexible Material layer is located at the upper surface of second flexible substrates, and it is recessed that the upper surface of second flexible material layer is formed with multiple second Slot structure；

The seed ink is placed in the upper surface of second flexible material layer, using the blade coating tool to described kind Seed oil ink is scratched, so that the seed ink, which is filled in each second groove structure, forms second of sublayer；

Based on second of sublayer in forming the second metal wire, second metal wire in each second groove structure It is interconnected to form the second metal grill；The second flexible overlapping structure, second of sublayer and second metal mesh Lattice collectively form inductive layer structure；

The inductive layer structure is adhered on to the upper surface of the first transparent optical glue-line；

The second transparent optical glue-line is formed in the upper surface of the inductive layer structure；

Cover transparent sheet is provided, the cover transparent sheet is adhered on to the upper surface of the second transparent optical glue-line.

Optionally, the printing work platform includes metallic work table；The soft cushioning include Shao A hardness between 30 degree~ Liner between 80 degree, the thickness of the soft cushioning include 0.5 millimeter~10 millimeters.

Optionally, the process scratched in the seed ink to the upper surface for being located at first flexible material layer In, the angle of the upper surface of the blade coating tool and first flexible material layer includes 30 °~70 °, and blade coating pressure includes 4 public Jin power it is every square centimeter~6 Kgfs it is every square centimeter, blade coating speed include 50 millimeters it is per second~260 millimeters it is per second；It is aligning During the seed ink of the upper surface of second flexible material layer is scratched, the blade coating tool with it is described The angle of the upper surface of second flexible material layer include 30 °~70 °, blade coating pressure include 4 Kgfs it is every square centimeter~6 kilograms Power is every square centimeter, blade coating speed include 50 millimeters it is per second~260 millimeters it is per second.

Optionally, the partial size of the iron powder includes 0.2 nanometer~5 microns, and the partial size of the nano-silica powder is less than 100 nanometers.

Optionally, in first mixture, the mass ratio of first organic solvent and the iron powder includes 0.5~ 10；In the third mixture, the mass ratio of the nano-silica powder and the iron powder includes 0.1~3.

Optionally, high molecular polymer, the second organic solvent and deaeration agent are provided, by the high molecular polymer, described Second organic solvent and deaeration agent mixing are included the following steps: with obtaining the second mixture

The high molecular polymer and second organic solvent are provided, the high molecular polymer is added to described It is stirred in two organic solvents and at least heating is until the high molecular polymer is completely dissolved to obtain mixed solution；

The deaeration agent is provided, the deaeration agent is added into the mixed solution, stirs and vacuumizes described in removal The oxygen dissolved in mixed solution.

Optionally, the temperature heated after the high molecular polymer being added into second organic solvent includes 40 DEG C ~90 DEG C；The high molecular polymer continues heating 5 hours~10 hours after being dissolved completely in second organic solvent.

Optionally, during removing the oxygen dissolved in the solution, environment where the solution is evacuated to negative pressure, and Pressure maintaining 2 hours~3 hours.

Optionally, first organic solvent and second organic solvent include: ethyl acetate, butanone, dipropyl two Alcohol methyl ether ester acid esters, butyl carbitol acetate, diethylene glycol ether, propylene glycol monomethyl ether ester acid esters, ethyl alcohol, α terpinol, butyl Carbitol, propylene glycol monomethyl ether, dipropylene glycol methyl ether, dipropylene glycol propyl ether, propylene glycol propyl ether, propandiol butyl ether, dipropylene glycol fourth Ether, tripropylene glycol butyl ether, propylene glycol phenylate, dimethyl ether, propylene glycol diacetate, amyl acetate mixture, acetic acid N-butyl, isobutyl acetate, n-propyl acetate, isopropyl acetate, n-butyl propionate, 3- ethoxyl ethyl propionate, O-phthalic Dibutyl phthalate, n-pentyl propionate, n propyl propionate, dibasic acid ester, acetone, beta-terpineol, hexylene glycol, amyl alcohol mixture, positive fourth Alcohol, isobutanol, isopropanol, diisobutyl carbinol (DIBC), methyl isobutyl carbinol, 2- methyl butanol, n-amyl alcohol, normal propyl alcohol or trimethyl Nonyl alcohol；The high molecular polymer include: polyurethane, polycarbonate, polyvinyl chloride, polymethyl methacrylate, phenoxy resin, Polyester, ethylene copolymer；The deaeration agent includes: that high-carbon alcohols organic compound, polyethers organic compound or silicon class are organic Compound；The auxiliary agent includes: Cationic aid, anionic auxiliary agent, non-ionic auxiliary agent or amphoteric auxiliary agent.

Optionally, the third mixture is ground by three-roll grinder, in process of lapping, spacing includes between roller 1 micron~25 microns.

Optionally, the depth of first groove structure includes 1 micron~20 microns, the width of first groove structure Including 1 micron~10 microns；It is recessed that the sum of first metal wire and the thickness of first seed layer are less than or equal to described first The depth of slot structure, the width of first metal wire are of same size with first groove structure；The second groove knot The depth of structure includes 1 micron~20 microns, and the width of second groove structure includes 1 micron~10 microns；Second gold medal Belong to the depth that the sum of thickness of line and second of sublayer is less than or equal to second groove structure, second metal wire Width is of same size with second groove structure.

Optionally, first transparent optical cement includes OCA optical cement, and second transparent optical cement includes OCA optics Glue, the cover transparent sheet include transparent glass.

Optionally, while the upper surface of the first flexible material layer of Yu Suoshu forms first groove structure, Yu Suoshu The upper surface of first flexible material layer forms first lead groove, and the first lead groove is connected with first groove structure It is logical；First seed layer is formed simultaneously in first groove structure and in the first lead groove；In described first While forming first metal wire in groove structure, formation first lead in Yu Suoshu first lead groove, described first Lead is connected with first metal wire；

While the upper surface of second flexible material layer forms second groove structure, Yu Suoshu second is flexible The upper surface of material layer forms the second lead groove, and the second lead groove is connected with second groove structure；It is described Second of sublayer is formed simultaneously in second groove structure and in the second lead groove；In second groove structure While interior formation second metal wire, the second lead, second lead and institute are formed in the second lead of Yu Suoshu groove The second metal wire is stated to be connected.

Optionally, the cover transparent sheet is adhered on behind the upper surface of the second transparent optical glue-line further includes walking as follows It is rapid:

Flexible circuit board and processing chip are provided；

The flexible circuit board is coupled with first metal grill, second metal grill and the processing chip Connection, so that first metal grill and second metal grill are via the flexible circuit board and the processing chip Electrical connection.

Optionally, the seed ink includes following component by mass percentage:

Surface is coated with silicon oxide the iron powder 10%~90% of layer；

High molecular polymer 5%~50%；

Organic solvent 10%~50%；

Auxiliary agent 0.1%~10%；

Defrother 0.01%~10%.

As described above, the preparation method of touch screen of the invention, has the advantages that

In the preparation method of touch screen of the invention, when preparing the first seed layer and second of sublayer, respectively by first Flexible overlapping structure and the second flexible overlapping structure are placed in the upper surface progress seed for being provided with the printing work platform of soft cushioning The blade coating of ink, due to the presence of soft cushioning, when carrying out the blade coating of seed ink using blade coating tool, in the work of blade coating pressure Under, soft cushioning can absorb the factor of printing work platform part out-of-flatness, to avoid seed ink in the first flexible material The residual of layer and the second flexible material layer surface, it is ensured that the upper surface of the first flexible material layer and the second flexibility after the completion of blade coating The cleannes of the upper surface of material layer do not need additional the step of carrying out precuring to seed ink and to the first flexible material The step of upper surface of layer and the upper surface of the second flexible material layer are cleaned, to simplify process flow, reduces life Produce cost；

Using iron powder as raw material in seed ink prepared by the present invention, iron dust can reduce production cost in base metal；

Iron powder surface in seed ink prepared by the present invention is coated with silicon oxide layer, i.e., the first seed layer of the invention And the iron powder surface in second of sublayer is coated with silicon oxide layer, silicon dioxide layer is adsorbed in iron powder by physisorption Surface, there is the characteristic that persistently coats, and silicon dioxide layer has repulsive interaction to oxygen, connecing for oxygen and iron powder can be prevented Touching, thus guarantee the zeroth order chemical valence state of iron powder, so that iron powder maintains higher reproducibility, it can be to avoid based on described first The first metal wire and the second metal wire broken string that seed layer and second of sublayer are formed, so that it is guaranteed that the first metal grill formed And second metal grill performance, and then ensure the performance of touch screen；

When preparing seed ink in the present invention, first iron powder is added in the first organic solvent and is stirred mixed under reducing atmosphere It closes uniformly, so that iron powder surface sufficiently infiltrates the first organic solvent, can be connect in subsequent preparation process to avoid iron powder and oxygen Touching, so that iron powder be avoided to be oxidized；

When preparing seed ink in the present invention, third mixture is ground using three-roll grinder, grinding rate compared with Fastly, yield is high, and energy consumption is lower；

When preparing seed ink in the present invention, first high molecular polymer is dissolved in after the second organic solvent then at nanometer two Silica powder is added together into the first mixture, will not since high molecular polymer has been dissolved in the second organic solvent The first organic solvent is destroyed to the cladding of iron powder, so as to avoid iron powder from being oxidized；

When preparing seed ink in the present invention, high molecular polymer is first dissolved in the second organic solvent and obtains mixed solution Afterwards, it adds the oxygen dissolved in deaeration agent removal mixed liquor and obtains the second mixture, later just by the second mixture and nanometer Silicon dioxide powder is added to the first mixture together and forms third mixture, so that it is guaranteed that not having oxygen to deposit in third mixture , and then iron powder is avoided to be oxidized.

Detailed description of the invention

Fig. 1 is shown as carrying out the structural schematic diagram of silver paste blade coating in the upper surface of flexible material layer in the prior art.

Fig. 2 is shown as the flow chart of the preparation method of touch screen provided by the invention.

Fig. 3 is shown as the cross section structure signal of step 1) resulting structures in the preparation method of touch screen provided by the invention Figure.

Fig. 4 is shown as the cross section structure signal of step 2) resulting structures in the preparation method of touch screen provided by the invention Figure.

Fig. 5 to Fig. 7 is shown as the cross section structure of step 4) resulting structures in the preparation method of touch screen provided by the invention Schematic diagram.

Fig. 8 is shown as the cross section structure signal of step 5) resulting structures in the preparation method of touch screen provided by the invention Figure.

Fig. 9 is shown as the cross section structure signal of step 6) resulting structures in the preparation method of touch screen provided by the invention Figure.

Figure 10 is shown as the cross section structure signal of step 7) resulting structures in the preparation method of touch screen provided by the invention Figure.

Figure 11 to Figure 13 is shown as the section knot of step 8) resulting structures in the preparation method of touch screen provided by the invention Structure schematic diagram.

Figure 14 is shown as the cross section structure signal of step 9) resulting structures in the preparation method of touch screen provided by the invention Figure.

Figure 15 is shown as the cross section structure signal of step 10) resulting structures in the preparation method of touch screen provided by the invention Figure.

Figure 16 is shown as the cross section structure signal of step 11) resulting structures in the preparation method of touch screen provided by the invention Figure.

Figure 17 is shown as the cross section structure signal of step 12) resulting structures in the preparation method of touch screen provided by the invention Figure.

Component label instructions

10 flexible overlapping structures

101 flexible substrates

102 flexible material layers

11 groove structures

12 printing work platforms

13 seed ink

14 scrapers

2 printing work platforms

3 soft cushionings

4 driving layer structure

41 first flexible overlapping structures

411 first flexible substrates

412 first flexible material layers

413 first groove structures

42 seed ink

43 first seed layers

44 first metal grills

441 first metal wires

5 blade coating tools

6 first optical adhesive layers

7 inductive layer structures

71 second flexible overlapping structures

711 second flexible substrates

712 second flexible material layers

713 second groove structures

72 second of sublayer

73 second metal grills

731 second metal wires

81 second transparent optical glue-lines

82 cover transparent sheets

Specific embodiment

Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from Various modifications or alterations are carried out under spirit of the invention.

Please refer to Fig. 2~Figure 17.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way The basic conception of invention, though only show in diagram with related component in the present invention rather than package count when according to actual implementation Mesh, shape and size are drawn, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its Assembly layout kenel may also be increasingly complex.

Referring to Fig. 2, the preparation method of the touch screen includes step the present embodiment provides a kind of preparation method of touch screen It is rapid:

1) printing work platform is provided, the upper surface of the printing work platform is provided with soft cushioning；

2) the first flexible overlapping structure is arranged in the upper surface of Yu Suoshu soft cushioning, and the first flexible overlapping structure includes the One flexible substrates and the first flexible material layer, first flexible substrates are located at the upper surface of the soft cushioning, and described first is soft Property material layer is located at the upper surface of first flexible substrates, and the upper surface of first flexible material layer is formed with multiple first Groove structure；

3) seed ink is prepared, the preparation method of the seed ink includes the following steps:

4) seed ink is placed in the upper surface of first flexible material layer；Using blade coating tool to the seed ink It is scratched, so that the seed ink, which is filled in each first groove structure, forms the first seed layer；

5) based on first seed layer in forming the first metal wire, first metal wire in first groove structure It is interconnected to form the first metal grill；The first flexible overlapping structure, first seed layer and first metal mesh Lattice collectively form driving layer structure；

6) the first transparent optical glue-line is formed in the upper surface of the driving layer structure；

7) the second flexible overlapping structure is arranged in the upper surface of Yu Suoshu soft cushioning, and the second flexible overlapping structure includes the Two flexible substrates and the second flexible material layer, second flexible substrates are located at the upper surface of the soft cushioning, and described second is soft Property material layer is located at the upper surface of second flexible substrates, and the upper surface of second flexible material layer is formed with multiple second Groove structure；

8) seed ink is placed in the upper surface of second flexible material layer, using the blade coating tool to the seed Ink is scratched, so that the seed ink, which is filled in each second groove structure, forms second of sublayer；

9) based on second of sublayer in forming the second metal wire, second metal in each second groove structure Line is interconnected to form the second metal grill；The second flexible overlapping structure, second of sublayer and second metal Grid collectively forms inductive layer structure；

10) the inductive layer structure is adhered on to the upper surface of the first transparent optical glue-line；

11) upper surface of Yu Suoshu inductive layer structure forms the second transparent optical glue-line；

12) cover transparent sheet is provided, the cover transparent sheet is adhered on to the upper surface of the second transparent optical glue-line.

In step 1), S1 step and Fig. 3 in Fig. 2 are please referred to, printing work platform 2 is provided, the printing work is flat The upper surface of platform 2 is provided with soft cushioning 3.

As an example, the printing work platform 2 may include working metal platform, specifically, the printing work is flat Platform 2 may include aluminium workbench, stainless steel workbench or aluminium alloy workbench etc..

As an example, the upper surface of the printing platform 2 is not absolutely smooth, i.e., the upper surface of the described printing platform 2 Flatness can be bad, that is, the upper surface part subregion of the printing platform 2 could be formed with pit (not shown) or protrusion Structure.

As an example, the cushion 3 can by but be not limited only to barbola work and be pasted on the printing work platform 2 Upper surface.

As an example, the soft cushioning 3 may include liner of Shao A hardness between 30 degree~80 degree.It needs to illustrate , described herein refers to " between 30 degree~80 degree " including all numerical value between 30 degree, 80 degree and 30 degree~80 degree Numberical range, i.e., described herein refers to the numberical range including endpoint " between 30 degree~80 degree ".

As an example, the soft cushioning 3 may include rubber pad, blanket, silicagel pad or silicone rubber pad etc..

As an example, the thickness of the soft cushioning 3 can be set according to actual needs, it is preferable that in the present embodiment, The thickness of the soft cushioning 3 may include 0.5 millimeter (mm)~10 millimeter.

Step 2), please refers to S2 step and Fig. 4 in Fig. 2, and the first flexible overlapping is arranged in the upper surface of Yu Suoshu soft cushioning 3 Structure 41, the first flexible overlapping structure 41 include the first flexible substrates 411 and the first flexible material layer 412, described first Flexible substrates 411 are located at the upper surface of the soft cushioning 3, and first flexible material layer 412 is located at first flexible substrates 411 upper surface, the upper surface of first flexible material layer 412 are formed with multiple first groove structures 413.

As an example, first groove structure 413 can be formed in first flexible material layer using imprint process 412 upper surface.

As an example, first flexible substrates 411 may include but be not limited only to polyethylene terephthalate (PET) substrate, polyimides (PI) substrate, polycarbonate (PC) substrate or polymethyl methacrylate (PMMA) substrate.

As an example, first flexible material layer 412 may include photoresist layer or UV (ultraviolet light) resin layer.It needs Illustrate, the UV resin layer is also known as photosensitive resin layer, UV-cured resin layer, it can be used as paint, coating, oil The sizing material of ink etc. uses.UV is the abbreviation of English Ultraviolet Rays, i.e. ultraviolet light.Ultraviolet light be it is invisible, It is one section of electromagnetic radiation other than visible light, range of the wavelength in 10nm~400nm.The principle of solidification of the UV resin layer is institute It states after the photoinitiator (or photosensitizer) in UV resin absorbs ultraviolet light under ultraviolet irradiation and generates living radical or sun Ion causes monomer polymerization, is crosslinked and connects branch chemical reaction, so that the UV resin layer is converted into admittedly within the several seconds by liquid State.

As an example, the width and depth of first groove structure 413 can be set according to actual needs, preferably Ground, the depth of first groove structure 413 may include 1 micron~20 microns, and the width of first groove structure 413 can To include 1 micron~10 microns.

As an example, each first groove structure 413 can be interconnected into it is latticed, specifically, described first is recessed Slot structure 413 can be interconnected, and rectangular latticed, rhombus net trellis, network of triangle trellis, pentagon be latticed or six sides Shape is latticed etc..

As an example, forming the same of first groove structure 413 in the upper surface of first flexible material layer 412 When, the upper surface of the first flexible material layer of Yu Suoshu 412 forms first lead groove (not shown), the first lead groove with First groove structure 413 is connected.Specifically, first lead groove one end and 413 phase of the first groove structure Connection, the other end extends to the side of first flexible material layer 412, by first groove structure 413 from described the It draws one flexible material layer 412 at least side.

In step 3), the S3 step in Fig. 2 is please referred to, seed ink 42 is prepared.

As an example, step 3) may include steps of:

Iron powder and the first organic solvent 3-1) are provided, it is under reducing atmosphere that the iron powder and part described first is organic molten Agent is uniformly mixed, to obtain the first mixture；

High molecular polymer, the second organic solvent and deaeration agent 3-2) are provided, by the high molecular polymer, described second Organic solvent and deaeration agent mixing are to obtain the second mixture；

3-3) provide nano-silica powder, by the nano-silica powder and part second mixture with it is described First mixture is uniformly mixed, to obtain third mixture；

3-4) the third mixture is ground, so that the nano-silica powder sufficiently connects with the iron powder Touching, with obtain include the iron powder of surface coated silica layer slurry；

First organic solvent, second mixture and auxiliary agent 3-5) are continuously added in Xiang Suoshu slurry and are mixed equal It is even to obtain the seed ink 42.

As an example, step 3-1) in provide the iron powder can be to be used under hot conditions, use reducing gas Iron oxide is reduced into iron powder obtained from the method for Zero-valent Iron by (for example hydrogen).It should be noted that " the high temperature item Part " refers to the temperature condition that reducing gas can be chemically reacted with iron oxide.

As an example, step 3-1) in, it can be in the iron powder is added into first organic solvent while progress Stirring, can also be stirred again after the iron powder is added into first organic solvent, the specific time of stirring and stir Mixing rate can select according to actual needs, herein without limitation.

As an example, step 3-1) in the partial size of the iron powder that provides can be selected according to actual needs, preferably Ground, in the present embodiment, the iron powder is nanometer iron powder, and the partial size of the iron powder includes 0.2 nanometer~5 microns.

As an example, step 3-1) described in reducing atmosphere may include hydrogen atmosphere, i.e., under hydrogen shield atmosphere will The iron powder is added in first organic solvent.First organic solvent is added in the iron powder under reducing atmosphere It is interior, it can be ensured that iron powder will not be contacted with oxygen during addition, and iron powder will not be oxidized.

As an example, step 3-1) in, first organic solvent may include that lipid solvent, ether solvent, alcohols are molten Agent or ketones solvent etc.；Specifically, first organic solvent may include but be not limited only to ethyl acetate, butanone, dipropyl Glycol methyl ether ester acid esters, butyl carbitol acetate, diethylene glycol ether, propylene glycol monomethyl ether ester acid esters, ethyl alcohol, α terpinol with And butyl carbitol；In addition to this, the first organic solvent can also use propylene glycol monomethyl ether, dipropylene glycol methyl ether, dipropylene glycol Propyl ether, propylene glycol propyl ether, propandiol butyl ether, dipropylene, tripropylene glycol butyl ether, propylene glycol phenylate, dipropylene glycol diformazan Ether, propylene glycol diacetate, amyl acetate mixture, n-butyl acetate, isobutyl acetate, n-propyl acetate, isopropyl acetate, N-butyl propionate, 3- ethoxyl ethyl propionate, dibutyl phthalate, n-pentyl propionate, n propyl propionate, dibasic acid ester, Acetone, beta-terpineol, hexylene glycol, amyl alcohol mixture, n-butanol, isobutanol, isopropanol, diisobutyl carbinol (DIBC), methyl-isobutyl Methanol, 2- methyl butanol, n-amyl alcohol, normal propyl alcohol or Exxal 12.

As an example, step 3-1) obtained in first mixture, first organic solvent and the iron powder Mass ratio may include 0.5~10, that is, the quality of first organic solvent used is into first organic solvent 0.5 times~10 times of the quality for the iron powder being added, it is preferable that in the present embodiment, first organic solvent and the iron The mass ratio of powder is 2, that is, the quality of first organic solvent used be added into first organic solvent described in 2 times of the quality of iron powder.

The iron powder is added in first organic solvent and is uniformly mixed under reducing atmosphere, so that the iron Powder surface sufficiently infiltrates first organic solvent, can contact to avoid the iron powder with oxygen in subsequent preparation process, from And the iron powder is avoided to be oxidized, so that the iron powder remains at reduction valence state, keep good reducing property.

As an example, step 3-2) high molecular polymer, the second organic solvent and deaeration agent are provided, by the polyphosphazene polymer Close object, second organic solvent and deaeration agent mixing may include steps of with obtaining the second mixture:

The high molecular polymer and second organic solvent 3-2-1) are provided, by the high molecular polymer be added to It is stirred in second organic solvent and at least heating is until the high molecular polymer is completely dissolved to obtain mixed solution；

The deaeration agent 3-2-2) is provided, the deaeration agent is added into the mixed solution, stirs and vacuumizes Except the oxygen dissolved in the mixed solution.

As an example, step 3-2-1) in, add after the high molecular polymer is added into second organic solvent The temperature of heat includes 40 DEG C~90 DEG C；The high molecular polymer continues to heat after being dissolved completely in second organic solvent 5 hours~10 hours, it is preferable that in the present embodiment, after the high molecular polymer is dissolved completely in second organic solvent Continue heating 8 hours.

As an example, can be heated using heating mantle to second organic solvent using oil bath, water-bath.

As an example, step 3-2-2) in, it, will be where the solution during removing the oxygen dissolved in the solution Environment is evacuated to negative pressure, and pressure maintaining 2 hours~3 hours；Environment where the solution can be pumped down to 0MPa~0.1MPa.

As an example, step 3-2) in provide second organic solvent may include: ethyl acetate, butanone, dipropyl Glycol methyl ether ester acid esters, butyl carbitol acetate, diethylene glycol ether, propylene glycol monomethyl ether ester acid esters, ethyl alcohol, α terpinol, fourth Base carbitol, propylene glycol monomethyl ether, dipropylene glycol methyl ether, dipropylene glycol propyl ether, propylene glycol propyl ether, propandiol butyl ether, dipropylene glycol Butyl ether, tripropylene glycol butyl ether, propylene glycol phenylate, dimethyl ether, propylene glycol diacetate, amyl acetate mixture, vinegar Sour N-butyl, isobutyl acetate, n-propyl acetate, isopropyl acetate, n-butyl propionate, 3- ethoxyl ethyl propionate, adjacent benzene two Formic acid dibutyl ester, n-pentyl propionate, n propyl propionate, dibasic acid ester, acetone, beta-terpineol, hexylene glycol, amyl alcohol mixture, just Butanol, isobutanol, isopropanol, diisobutyl carbinol (DIBC), methyl isobutyl carbinol, 2- methyl butanol, n-amyl alcohol, normal propyl alcohol or front three Base nonyl alcohol.

As an example, step 3-2) in the high molecular polymer that provides may include: polyurethane, it is polycarbonate, poly- Vinyl chloride, polymethyl methacrylate, phenoxy resin, polyester, ethylene copolymer；Wherein, the polyester includes poly- terephthaldehyde Sour second diester, polybutylene terephthalate, poly terephthalic acid diallyl, ekonol, unsaturated polyester (UP) Resin, phenolic resin or acrylic resin；The ethylene copolymer includes the monomer for containing vinyl by two or more Polymer made of copolymerization.

As an example, step 3-2) in provide the deaeration agent may include: high-carbon alcohols organic compound, polyethers Organic compound or silicon class organic compound.Specifically, the high-carbon alcohols organic compound may include benzyl carbinol oleate Or Laurate alcohol ester phenylacetate etc.；The polyethers organic compound may include: GP type defoaming agent, GPE type defoaming agent or GPES type defoaming agent etc.；The silicon class organic compound may include: dimethyl silicone polymer or polyether-modified silicon etc..

First the high molecular polymer is dissolved in after second organic solvent in subsequent step and nano-silica SiClx powder is added together into first mixture, since to be dissolved in described second organic molten for the high molecular polymer In agent, first organic solvent will not be destroyed to the cladding of the iron powder, so as to avoid the iron powder from being oxidized；Together When, the oxygen dissolved in the mixed liquor can be removed by the way that the deaeration agent is added, it can be ensured that subsequent the be mixed to form There is no oxygen presence in three mixtures, and then the iron powder is avoided to be oxidized.

As an example, step 3-3) in the partial size of the nano-silica powder that provides can carry out according to actual needs Selection, it is preferable that in the present embodiment, the partial size of the nano-silica powder is less than 100 nanometers.

As an example, step 3-3) in the resulting third mixture, the nano-silica powder and the iron powder Mass ratio may include 0.1~3, i.e., the quality for the nano-silica powder being added into first mixture is institute 0.1 times~3 times for stating the quality of iron powder described in the first mixture, it is preferable that in the present embodiment, the nano-silica powder Mass ratio with the iron powder is 0.5, i.e., the quality for the nano-silica powder being added into first mixture is 0.5 times of the quality of iron powder described in first mixture.

As an example, step 3-4) in can use but be not limited only to three-roll grinder and grind the third mixture Mill, during grinding, spacing between regulating roller, to ensure to have enough pressure to make the nano-silica powder and institute Iron powder is stated to come into full contact with, so that the nano-silica powder is adsorbed on the surface of the iron powder by physisorption, with Layer of silicon dioxide layer is coated on the surface of the iron powder；Since this layer of silicon dioxide layer is being interacting at by charge It attracts each other, there is lasting characteristic；And the silicon dioxide layer for being coated on the iron powder periphery has row to oxygen Reprimand effect, can prevent the contact of oxygen with the iron powder, will not react with the iron powder, so that it is guaranteed that the iron powder Zeroth order chemical valence state makes it have preferable reduction characteristic.The third mixture is ground using three-roll grinder, is ground It is very fast to grind rate, yield is high, and energy consumption is lower.

As an example, spacing may include 1 micron~25 microns between the three-roll grinder central roll in process of lapping.

As an example, the milling time ground to the third mixture can select according to actual needs, Preferably, in the present embodiment, the milling time ground to the third mixture may include 0.5 hour~24 hours.

As an example, step 3-5) in provide the auxiliary agent can be used as dispersing agent.

As an example, step 3-5) in, first organic solvent, second mixing are continuously added in Xiang Suoshu slurry First organic solvent, second mixture and institute are continuously added while object and the auxiliary agent or into the slurry It needs to be stirred after stating auxiliary agent.

As an example, the auxiliary agent may include: Cationic aid, anionic auxiliary agent, non-ionic auxiliary agent or two Property type auxiliary agent.

As an example, the Cationic aid may include polyethyleneimine, the double ammonio methacrylate of double octadecyls or Person's imidazoline quaternary ammonium salt；The anionic auxiliary agent may include soybean lecithin；The non-ionic auxiliary agent may include rouge Fat alcohol polyoxyethylene ether；The amphoteric auxiliary agent may include cocoyl azochlorosulfonate propyl lycine.

As an example, step 3-5) obtained in the seed ink 42 by mass percentage may include following component: Surface is coated with silicon oxide the iron powder 10%~90% of layer；High molecular polymer 5%~50%；Organic solvent 10%~ 50%；Auxiliary agent 0.1%~10%；Defrother 0.01%~10%.

Preferably, the component of the seed ink 42 by mass percentage may include: 50%~80% surface cladding Have the iron powder of silicon dioxide layer, 5%~15% high molecular polymer, 15%~35% organic solvent, 0.05%~1% Defrother and 0.1%~1% auxiliary agent；It is further preferable that the component of the seed ink 42 by mass percentage may include: 60%~70% surface be coated with silicon oxide the iron powder of layer, 8%~10% high molecular polymer, 25%~30% have Solvent, 0.05%~0.5% defrother and 0.1%~1% auxiliary agent；It is further preferable that in one example, the seed The component of ink 42 by mass percentage may include: that 63% surface is coated with silicon oxide the iron powder of layer, 9.4% high score Sub- polymer, 36% organic solvent, 0.1% defrother and 0.5% auxiliary agent.

Iron powder surface in the seed ink 42 prepared by the present invention is coated with silicon oxide layer, the silicon dioxide layer It is adsorbed in the surface of the iron powder by physisorption, there is the characteristic persistently coated, and the silicon dioxide layer is to oxygen Gas has repulsive interaction, can prevent the contact of oxygen with the iron powder, thus guarantee the zeroth order chemical valence state of the iron powder, so that The iron powder maintains higher reproducibility so that based on the seed ink 42 formed seed layer in iron powder maintain it is higher Reproducibility, to avoid the metal wire broken string formed based on the seed layer, and then first be subsequently formed for ensuring to be formed The performance of metal grill and the second metal grill.

It should be noted that the sequence of step 3) and step 2) can be interchanged, it can first carry out existing step 3) and hold again The existing step 2) of row, also i.e., it is possible to first prepare the seed ink 42, described in the setting of the upper surface of the soft cushioning 3 First flexible overlapping structure 41.

In step 4), the S4 step and Fig. 5 to Fig. 7 in Fig. 2 are please referred to, it is flexible that seed ink 42 is placed in described first The upper surface of material layer 412；The seed ink 42 is scratched using blade coating tool 5, so that the seed ink 42 It is filled in each first groove structure 413 and forms the first seed layer 43.

As an example, the seed ink 42 can be dripped to the upper surface for being placed in first flexible material layer 412.

As an example, the seed ink 42 can drip any position for being placed in 412 upper surface of the first flexible material layer Set place, it is preferable that in the present embodiment, the seed ink 42, which can drip, is placed in multiple first groove structure, 413 sides, with Convenient for that can be scratched from a laterally opposed other side of the upper surface of first flexible material layer 412 when subsequent blade coating.

As an example, the blade coating tool 5 may include but be not limited only to scraper；The structure of the scraper is this field skill Art personnel are known that this is not repeated.

As an example, the blade coating tool 5 is in knifing process with upper compared to first flexible material layer 412 The posture that surface is tilted a certain angle scratches the seed ink 42, it is preferable that in the present embodiment, the blade coating tool 5 can be configured according to actual needs with the angle of the upper surface of first flexible material layer 412, it is preferable that this implementation In example, the blade coating tool 5 and the angle of the upper surface of first flexible material layer 412 may include 30 °~70 °, more Preferably, in the present embodiment, the blade coating tool 5 and the angle of the upper surface of first flexible material layer 412 may include 60 °~70 °.

As an example, in the step, it is described when being scratched using the blade coating tool 5 to the seed ink 42 Blade coating tool 5 applies preset pressure to first flexible material layer 412, it is preferable that in the present embodiment, institute in knifing process State blade coating tool 5 to the blade coating pressure that first flexible material layer 412 applies may include 4 Kgfs it is every square centimeter~6 It is Kgf every square centimeter.

As an example, the speed that the blade coating tool 5 scratches can be set according to actual needs in knifing process, It preferably, the use of the blade coating speed that the blade coating tool 5 scratches the seed ink 42 may include 50 millimeters per second ~260 millimeters per second, it is further preferable that being scratched using the blade coating tool 5 to the seed ink 42 in the present embodiment Blade coating speed may include 160 millimeters it is per second~260 millimeters it is per second.

The first flexible overlapping structure 41 is placed in the upper of the printing work platform 2 for being provided with the soft cushioning 3 Surface carries out the blade coating of the seed ink 42, due to the presence of the soft cushioning 3, is carrying out institute using the blade coating tool 5 When stating the blade coating of seed ink 42, under the action of scratching pressure, the soft cushioning 3 can absorb the printing work platform 2 innings The factor of portion's out-of-flatness, to avoid the seed ink 42 in the residual on 412 surface of the first flexible material layer, it is ensured that The cleannes of the upper surface of first flexible material layer 412 after the completion of blade coating do not need additional cleaning step to described The upper surface of one flexible material layer 412 is cleaned, to simplify process flow, reduces production cost.

As an example, further including to after being filled in each first groove structure 413 by the seed ink 42 blade coating The step of seed ink 42 is solidified.It, can will be described specifically, when the seed ink 42 is seed ink Seed ink 42 carries out being baked in order that the seed ink 42 is solidified to form first seed layer 43, as shown in Figure 7.

As an example, while the seed ink 42 blade coating is filled in each first groove structure 413, by institute It states the blade coating of seed ink 42 to be filled in the first lead groove, i.e., described first seed layer 43 is formed simultaneously in described first In groove structure 413 and in the first lead groove.

In step 5), S5 step and Fig. 8 in Fig. 2 are please referred to, it is recessed in described first based on first seed layer 43 The first metal wire 441 is formed in slot structure 413, first metal wire 441 is interconnected to form the first metal grill 44；It is described First flexible overlapping structure 41, first seed layer 43 and first metal grill 44 collectively form driving layer structure 4.

As an example, can be led using electroplating technology or chemical plating process in being formed in each first groove structure 413 Electric material is as first metal wire 441.Specifically, first seed layer 43 is immersed copper sulphate (CuSO₄) in solution, Since the diameter (0.15 ran) of copper ion is much smaller than the gap in silicon dioxide layer described in first seed layer 43, Gap in the silicon dioxide layer, copper ion can pass through in gap and the silicon dioxide layer in the silicon dioxide layer Iron powder surface contact, thus the gold with the oxidation of iron powder in the silicon dioxide layer-reduction reaction growth zeroth order Belong to copper to form first metal wire 441.

As an example, the sum of first metal wire 441 and the thickness of first seed layer 43 are less than or equal to described the The depth of one groove structure 413, it is preferable that in the present embodiment, the thickness of first metal wire 441 and first seed layer 43 The sum of degree is equal to the depth of first groove structure 413, i.e., during forming the first metal wire 441, using electricity Depositing process or chemical plating process are in filling the conductive material until the conductive material is filled out in each first groove structure 413 Until full first groove structure 413.

As an example, the width of first metal wire 441 can be of same size with first groove structure 413, The width of i.e. described first metal wire 441 can be 1 micron~10 microns.

As an example, the material of first metal wire 441 may include but be not limited only to copper, i.e., described first metal wire 441 may include but be not limited only to copper metal line.

As an example, first metal grill 44 may include rectangular metal grid, diamond-type metal grid, triangle gold Belong to grid, pentagon metal grill or hexagonal metallic grid etc..

As an example, while forming the first metal wire 441 in first groove structure 413, Yu Suoshu First lead (not shown) is formed in one lead groove, the first lead is connected with first metal wire 441.Specifically , described first lead one end is connected with first metal wire 441, and the other end extends to first flexible material layer 412 side draws first metal wire 441 from first flexible material layer 412 at least side.

In step 6), S6 step and Fig. 9 in Fig. 2 are please referred to, forms first in the upper surface of the driving layer structure 4 Transparent optical glue-line 6.

As an example, can use but be not limited only to spin coating proceeding formed in the upper surface of the driving layer structure 4 it is described First transparent optical glue-line 6, specifically, all first transparent optical glue-lines 6 are formed in first flexible material layer 412 and institute State the upper surface of the first metal grill 44.

As an example, the first transparent optical glue-line 6 may include but be not limited only to OCA (Optically Clear Adhesive) optical adhesive layer.

As an example, the first transparent optical glue-line 6 can cover the entire upper surface of the driving layer structure 4.

In step 7), S7 step and Figure 10 in Fig. 2 are please referred to, the upper surface setting second of Yu Suoshu soft cushioning 3 is soft Property laminated construction 71, the second flexible overlapping structure 71 include the second flexible substrates 711 and the second flexible material layer 712, institute The upper surface that the second flexible substrates 711 are located at the soft cushioning 3 is stated, it is soft that second flexible material layer 712 is located at described second The upper surface of property substrate 711, the upper surface of second flexible material layer 712 is formed with multiple second groove structures 713.

As an example, second groove structure 713 can be formed in second flexible material layer using imprint process 712 upper surface.

As an example, second flexible substrates 711 may include but be not limited only to polyethylene terephthalate (PET) substrate, polyimides (PI) substrate, polycarbonate (PC) substrate or polymethyl methacrylate (PMMA) substrate.

As an example, second flexible material layer 712 may include photoresist layer or UV (ultraviolet light) resin layer.It needs Illustrate, the UV resin layer is also known as photosensitive resin layer, UV-cured resin layer, it can be used as paint, coating, oil The sizing material of ink etc. uses.UV is the abbreviation of English Ultraviolet Rays, i.e. ultraviolet light.Ultraviolet light be it is invisible, It is one section of electromagnetic radiation other than visible light, range of the wavelength in 10nm~400nm.The principle of solidification of the UV resin layer is institute It states after the photoinitiator (or photosensitizer) in UV resin absorbs ultraviolet light under ultraviolet irradiation and generates living radical or sun Ion causes monomer polymerization, is crosslinked and connects branch chemical reaction, so that the UV resin layer is converted into admittedly within the several seconds by liquid State.

As an example, the width and depth of second groove structure 713 can be set according to actual needs, preferably Ground, the depth of second groove structure 713 may include 1 micron~20 microns, and the width of second groove structure 713 can To include 1 micron~10 microns.

As an example, each second groove structure 713 can be interconnected into it is latticed, specifically, described second is recessed Slot structure 713 can be interconnected, and rectangular latticed, rhombus net trellis, network of triangle trellis, pentagon be latticed or six sides Shape is latticed etc..

As an example, forming the same of second groove structure 713 in the upper surface of second flexible material layer 712 When, the upper surface of the second flexible material layer of Yu Suoshu 712 forms the second lead groove (not shown), the second lead groove with Second groove structure 713 is connected.Specifically, described second lead groove one end and 713 phase of the second groove structure Connection, the other end extends to the side of second flexible material layer 712, by second groove structure 713 from described the It draws two flexible material layers 712 at least side.

In step 8), the S8 step and Figure 11 to Figure 13 in Fig. 2 are please referred to, it is soft that seed ink 42 is placed in described second The upper surface of property material layer 712, scratches the seed ink 42 using the blade coating tool 5, so that the seed Ink 42 is filled in each second groove structure 713 and forms second of sublayer 72.

As an example, the seed ink 42 can be dripped to the upper surface for being placed in second flexible material layer 712.

As an example, the seed ink 42 can drip any of the upper surface for being placed in second flexible material layer 712 At position, it is preferable that in the present embodiment, the seed ink 42, which can drip, is placed in the one of multiple second groove structures 713 Side, in order to be scraped from a laterally opposed other side of the upper surface of second flexible material layer 712 when subsequent blade coating It applies.

As an example, the blade coating tool 5 is in knifing process with upper compared to second flexible material layer 712 The posture that surface is tilted a certain angle scratches the seed ink 42, it is preferable that in the present embodiment, the blade coating tool 5 can be configured according to actual needs with the angle of the upper surface of second flexible material layer 712, it is preferable that this implementation In example, the blade coating tool 5 and the angle of the upper surface of second flexible material layer 712 may include 30 °~70 °, more Preferably, in the present embodiment, the blade coating tool 5 and the angle of the upper surface of second flexible material layer 712 may include 60 °~70 °.

As an example, in the step, it is described when being scratched using the blade coating tool 5 to the seed ink 42 Blade coating tool 5 applies preset pressure to second flexible material layer 712, it is preferable that in the present embodiment, institute in knifing process State blade coating tool 5 to the blade coating pressure that second flexible material layer 712 applies may include 4 Kgfs it is every square centimeter~6 It is Kgf every square centimeter.

The second flexible overlapping structure 71 is placed in the upper of the printing work platform 2 for being provided with the soft cushioning 3 Surface carries out the blade coating of the seed ink 42, due to the presence of the soft cushioning 3, is carrying out institute using the blade coating tool 5 When stating the blade coating of seed ink 42, under the action of scratching pressure, the soft cushioning 3 can absorb the printing work platform 2 innings The factor of portion's out-of-flatness, to avoid the seed ink 42 in the residual on 712 surface of the second flexible material layer, it is ensured that The cleannes of the upper surface of second flexible material layer 712 after the completion of blade coating do not need additional cleaning step to described The upper surface of two flexible material layers 712 is cleaned, to simplify process flow, reduces production cost.

As an example, further including to after being filled in each second groove structure 713 by the seed ink 42 blade coating The step of seed ink 42 is solidified.It, can will be described specifically, when the seed ink 42 is seed ink Seed ink 42 carries out being baked in order that the seed ink 42 is solidified to form second of sublayer 72, as shown in figure 13.

As an example, while the seed ink 42 blade coating is filled in each second groove structure 713, by institute It states the blade coating of seed ink 42 to be filled in the second lead groove, i.e., described second of sublayer 72 is formed simultaneously in described second In groove structure 713 and in the second lead groove.

In step 9), S9 step and Figure 14 in Fig. 2 are please referred to, based on second of sublayer 72 in each described second The second metal wire 731 is formed in groove structure 713, second metal wire 731 is interconnected to form the second metal grill 73；Institute It states the second flexible overlapping structure 71, second of sublayer 72 and second metal grill 73 and collectively forms inductive layer structure 7.

As an example, can be led using electroplating technology or chemical plating process in being formed in each second groove structure 713 Electric material is as second metal wire 731.Specifically, second of sublayer 72 is immersed copper sulphate (CuSO₄) in solution, Since the diameter (0.15 ran) of copper ion is much smaller than the gap in silicon dioxide layer described in second of sublayer 72, Gap in the silicon dioxide layer, copper ion can pass through in gap and the silicon dioxide layer in the silicon dioxide layer Iron powder surface contact, thus the gold with the oxidation of iron powder in the silicon dioxide layer-reduction reaction growth zeroth order Belong to copper to form second metal wire 731.

As an example, the sum of second metal wire 731 and the thickness of second of sublayer 72 are less than or equal to described the The depth of two groove structures 713, it is preferable that in the present embodiment, the thickness of second metal wire 731 and second of sublayer 72 The sum of degree is equal to the depth of second groove structure 713, i.e., during forming the second metal wire 731, using electricity Depositing process or chemical plating process are in filling the conductive material until the conductive material is filled out in each second groove structure 713 Until full second groove structure 713.

As an example, the width of second metal wire 731 can be of same size with second groove structure 713, The width of i.e. described second metal wire 731 can be 1 micron~10 microns.

As an example, the material of second metal wire 731 may include but be not limited only to copper, i.e., described second metal wire 731 may include but be not limited only to copper metal line.

As an example, second metal grill 73 may include rectangular metal grid, diamond-type metal grid, triangle gold Belong to grid, pentagon metal grill or hexagonal metallic grid etc..

As an example, while forming the second metal wire 731 in second groove structure 713, Yu Suoshu The second lead (not shown) is formed in two lead grooves, second lead is connected with second metal wire 731.Specifically , second lead one end is connected with second metal wire 731, and the other end extends to second flexible material layer 712 side draws second metal wire 731 from second flexible material layer 712 at least side.

It should be noted that step 6) can also be interchangeable with step 7)~step 9) sequence, i.e., can also first hold Existing the step 7)~step 9) of row, then existing step 6) is executed, also that is, the inductive layer structure 7 can also be prepared first, then The first transparent optical glue-line 6 is formed in the upper surface of the driving layer structure 4.

In step 10), S10 step and Figure 15 in Fig. 2 are please referred to, the inductive layer structure 7 is adhered on described The upper surface of one transparent optical glue-line 6.

As an example, the upper surface phase of the upper surface of second flexible substrates 711 and the first transparent optical glue-line 6 Contact.The inductive layer structure 7 is posted via the first transparent optical glue-line 6 to be fixed on the driving layer structure 4.

In step 11), S11 step and Figure 16 in Fig. 2 are please referred to, the upper surface of Yu Suoshu inductive layer structure 7 is formed Second transparent optical glue-line 81.

As an example, can use but be not limited only to spin coating proceeding formed in the upper surface of the inductive layer structure 7 it is described Second transparent optical glue-line 81, specifically, all second transparent optical glue-lines 81 be formed in second flexible material layer 712 and The upper surface of second metal grill 73.

As an example, the second transparent optical glue-line 81 may include but be not limited only to OCA (Optically Clear Adhesive) optical adhesive layer.

As an example, the second transparent optical glue-line 81 can cover the entire upper surface of the inductive layer structure 7.

In step 12), S12 step and Figure 17 in Fig. 2 are please referred to, cover transparent sheet 82 is provided, by the cover transparent sheet 82 adhere on the upper surface of the second transparent optical glue-line 81.

As an example, the cover transparent sheet 82 may include but be not limited only to glass cover-plate.The cover transparent sheet 82 via Second optical adhesive layer 8 adheres in the inductive layer structure 7.

As an example, the second transparent optical glue-line 81 can be completely covered in the cover transparent sheet 82.

As an example, further including following steps after step 12):

13) flexible circuit board (FPC) (not shown) and processing chip (not shown) are provided；

14) by the flexible circuit board and first metal grill 44, second metal grill 73 and the processing Chip is of coupled connections so that first metal grill 44 and second metal grill 73 via the flexible circuit board with The processing chip electrical connection.

As an example, the specific structure of the flexible circuit board and the processing chip that provide in step 13) is ability Field technique personnel are known, are not repeated herein.

As an example, first metal grill 44 is electrically connected via the first lead with the flexible circuit board, institute It states the second metal grill 73 and is electrically connected via second lead with the flexible circuit board.

In conclusion the preparation method of touch screen of the invention, the preparation method of the touch screen is comprising steps of provide print The upper surface of brush workbench, the printing work platform is provided with soft cushioning；It is arranged first in the upper surface of the soft cushioning Flexible overlapping structure, the first flexible overlapping structure include the first flexible substrates and the first flexible material layer, and described first is soft Property substrate is located at the upper surface of the soft cushioning, and first flexible material layer is located at the upper surface of first flexible substrates, The upper surface of first flexible material layer is formed with multiple first groove structures；Seed ink is prepared, the seed ink Preparation method includes the following steps: to provide iron powder and the first organic solvent, will be described in the iron powder and part under reducing atmosphere First organic solvent is uniformly mixed, to obtain the first mixture；High molecular polymer, the second organic solvent and deaeration agent are provided, The high molecular polymer, second organic solvent and the deaeration agent are mixed to obtain the second mixture；Nanometer is provided The nano-silica powder and part second mixture are uniformly mixed by silicon dioxide powder with first mixture, To obtain third mixture；The third mixture is ground, so that the nano-silica powder is filled with the iron powder Tap touching, with obtain include the iron powder of surface coated silica layer slurry；Described first is continuously added into the slurry Organic solvent, second mixture and auxiliary agent are simultaneously uniformly mixed and obtain the seed ink；The seed ink is placed in The upper surface of first flexible material layer；The seed ink is scratched using blade coating tool, so that the seed Ink, which is filled in each first groove structure, forms the first seed layer；Based on first seed layer in first groove The first metal wire is formed in structure, first metal wire is interconnected to form the first metal grill；First flexible overlapping Structure, first seed layer and first metal grill collectively form driving layer structure；In the upper of the driving layer structure Surface forms the first transparent optical glue-line；The second flexible overlapping structure is set in the upper surface of the soft cushioning, described second is soft Property laminated construction include the second flexible substrates and the second flexible material layer, second flexible substrates are located at the upper of the soft cushioning Surface, second flexible material layer are located at the upper surface of second flexible substrates, the upper table of second flexible material layer Face is formed with multiple second groove structures；The seed ink is placed in the upper surface of second flexible material layer, uses institute It states blade coating tool to scratch the seed ink, so that the seed ink is filled in each second groove structure Form second of sublayer；Based on second of sublayer in forming the second metal wire in each second groove structure, described Two metal wires are interconnected to form the second metal grill；The second flexible overlapping structure, second of sublayer and described Two metal grills collectively form inductive layer structure；The inductive layer structure is adhered on to the upper table of the first transparent optical glue-line Face；The second transparent optical glue-line is formed in the upper surface of the inductive layer structure；Cover transparent sheet is provided, the cover transparent sheet is pasted It is placed in the upper surface of the second transparent optical glue-line.In the preparation method of touch screen of the invention, the first seed layer is being prepared And when second of sublayer, the first flexible overlapping structure and the second flexible overlapping structure are placed in the printing for being provided with soft cushioning respectively The upper surface of workbench carries out the blade coating of seed ink, due to the presence of soft cushioning, is carrying out seed oil using blade coating tool When the blade coating of ink, under the action of scratching pressure, soft cushioning can absorb the factor of printing work platform part out-of-flatness, to keep away Exempt from seed ink in the first flexible material layer and the residual of the second flexible material layer surface, it is ensured that first is flexible after the completion of blade coating The cleannes of the upper surface of material layer and the upper surface of the second flexible material layer do not need additional pre- solid to the progress of seed ink The step of change and the step of cleaned to the upper surface of the first flexible material layer and the upper surface of the second flexible material layer, thus Process flow is simplified, production cost is reduced；Using iron powder as raw material in seed ink prepared by the present invention, iron dust is in low-priced Metal can reduce production cost；Iron powder surface in seed ink prepared by the present invention is coated with silicon oxide layer, i.e. this hair Iron powder surface in bright the first seed layer and second of sublayer is coated with silicon oxide layer, and silicon dioxide layer passes through physical absorption Effect is adsorbed in the surface of iron powder, has the characteristic persistently coated, and silicon dioxide layer has repulsive interaction to oxygen, can prevent Contact of the oxygen with iron powder, so that iron powder maintains higher reproducibility, can be kept away to guarantee the zeroth order chemical valence state of iron powder Exempt from the first metal wire and the second metal wire broken string formed based on first seed layer and second of sublayer, so that it is guaranteed that being formed The first metal grill and the second metal grill performance, and then ensure the performance of touch screen；Seed ink is prepared in the present invention When, first iron powder is added in the first organic solvent and is uniformly mixed under reducing atmosphere, so that iron powder surface sufficiently infiltrates First organic solvent can contact to avoid iron powder with oxygen in subsequent preparation process, so that iron powder be avoided to be oxidized；The present invention In when preparing seed ink, third mixture is ground using three-roll grinder, grinding rate is very fast, and yield is high, energy consumption It is lower；When preparing seed ink in the present invention, first high molecular polymer is dissolved in after the second organic solvent then at nano-silica SiClx powder is added together into the first mixture, since high molecular polymer has been dissolved in the second organic solvent, will not be broken The first organic solvent is gone bad to the cladding of iron powder, so as to avoid iron powder from being oxidized；When preparing seed ink in the present invention, first will High molecular polymer is dissolved in after the second organic solvent obtains mixed solution, adds the oxygen dissolved in deaeration agent removal mixed liquor It is so incensed that the second mixture, later the second mixture is just added to the first mixture together with nano-silica powder and forms the Three mixtures so that it is guaranteed that not having oxygen presence in third mixture, and then avoid iron powder from being oxidized.

The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as At all equivalent modifications or change, should be covered by the claims of the present invention.

Claims

1. a kind of preparation method of touch screen, which is characterized in that the preparation method of the touch screen comprising steps of

The first flexible overlapping structure is set in the upper surface of the soft cushioning, the first flexible overlapping structure includes first flexible Substrate and the first flexible material layer, first flexible substrates are located at the upper surface of the soft cushioning, first flexible material Layer is located at the upper surface of first flexible substrates, and the upper surface of first flexible material layer is formed with multiple first groove knots Structure；

Iron powder and the first organic solvent are provided, mix the iron powder with part first organic solvent under reducing atmosphere It is even, to obtain the first mixture；

High molecular polymer, the second organic solvent and deaeration agent are provided, by the high molecular polymer, second organic solvent And the deaeration agent mixing is to obtain the second mixture；

Nano-silica powder is provided, the nano-silica powder and part second mixture are mixed with described first Object is uniformly mixed, to obtain third mixture；

The third mixture is ground, so that the nano-silica powder comes into full contact with the iron powder, to obtain The slurry of iron powder including surface coated silica layer；

First organic solvent, second mixture and auxiliary agent are continuously added into the slurry and is uniformly mixed obtains The seed ink；

The seed ink is placed in the upper surface of first flexible material layer；Using blade coating tool to the seed ink into Row blade coating, so that the seed ink, which is filled in each first groove structure, forms the first seed layer；

It is mutually interconnected based on first seed layer in forming the first metal wire, first metal wire in first groove structure It connects to form the first metal grill；The first flexible overlapping structure, first seed layer and first metal grill are common Constitute driving layer structure；

The second flexible overlapping structure is set in the upper surface of the soft cushioning, the second flexible overlapping structure includes second flexible Substrate and the second flexible material layer, second flexible substrates are located at the upper surface of the soft cushioning, second flexible material Layer is located at the upper surface of second flexible substrates, and the upper surface of second flexible material layer is formed with multiple second groove knots Structure；

The seed ink is placed in the upper surface of second flexible material layer, using the blade coating tool to the seed oil Ink is scratched, so that the seed ink, which is filled in each second groove structure, forms second of sublayer；

Based on second of sublayer in forming the second metal wire in each second groove structure, second metal wire is mutual Connection forms the second metal grill；The second flexible overlapping structure, second of sublayer and second metal grill are total With composition inductive layer structure；

2. the preparation method of touch screen according to claim 1, it is characterised in that: the printing work platform includes metal Workbench；The soft cushioning includes liner of Shao A hardness between 30 degree~80 degree, and the thickness of the soft cushioning includes 0.5 Millimeter~10 millimeters.

3. the preparation method of touch screen according to claim 1, it is characterised in that: to positioned at first flexible material During the seed ink of the upper surface of layer is scratched, the blade coating tool is upper with first flexible material layer The angle on surface includes 30 °~70 °, and blade coating pressure includes 4 Kgfs of every square centimeter~6 Kgfs of every square centimeter, blade coatings Speed include 50 millimeters it is per second~260 millimeters it is per second；In the seed to the upper surface for being located at second flexible material layer During ink is scratched, the angle of the upper surface of the blade coating tool and second flexible material layer includes 30 °~ 70 °, blade coating pressure include 4 Kgfs it is every square centimeter~6 Kgfs it is every square centimeter, blade coating speed include 50 millimeters it is per second~ 260 millimeters per second.

4. the preparation method of touch screen according to claim 3, it is characterised in that: the partial size of the iron powder is received including 0.2 Rice~5 microns, the partial size of the nano-silica powder is less than 100 nanometers.

5. the preparation method of touch screen according to claim 1, it is characterised in that: in first mixture, described The mass ratio of one organic solvent and the iron powder includes 0.5~10；In the third mixture, the nano-silica powder with The mass ratio of the iron powder includes 0.1~3.

6. the preparation method of touch screen according to claim 1, it is characterised in that: offer high molecular polymer, second have Solvent and deaeration agent mix the high molecular polymer, second organic solvent and the deaeration agent to obtain second Mixture includes the following steps:

The high molecular polymer and second organic solvent are provided, the high molecular polymer, which is added to described second, to be had It is stirred in solvent and at least heating is until the high molecular polymer is completely dissolved to obtain mixed solution；

The deaeration agent is provided, the deaeration agent is added into the mixed solution, stir and vacuumizes the removal mixing The oxygen dissolved in solution.

7. the preparation method of touch screen according to claim 1, it is characterised in that: by the high molecular polymer be added to The temperature heated after in second organic solvent includes 40 DEG C~90 DEG C；The high molecular polymer is dissolved completely in described Continue heating 5 hours~10 hours after in two organic solvents.

8. the preparation method of touch screen according to claim 7, which is characterized in that remove the oxygen dissolved in the solution During, environment where the solution is evacuated to negative pressure, and pressure maintaining 2 hours~3 hours.

9. the preparation method of touch screen according to claim 1, which is characterized in that first organic solvent and described Two organic solvents include: ethyl acetate, butanone, dipropylene glycol methyl ether ester acid esters, butyl carbitol acetate, diethylene glycol second Ether, propylene glycol monomethyl ether ester acid esters, ethyl alcohol, α terpinol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol methyl ether, dipropylene glycol Propyl ether, propylene glycol propyl ether, propandiol butyl ether, dipropylene, tripropylene glycol butyl ether, propylene glycol phenylate, dipropylene glycol diformazan Ether, propylene glycol diacetate, amyl acetate mixture, n-butyl acetate, isobutyl acetate, n-propyl acetate, isopropyl acetate, N-butyl propionate, 3- ethoxyl ethyl propionate, dibutyl phthalate, n-pentyl propionate, n propyl propionate, dibasic acid ester, Acetone, beta-terpineol, hexylene glycol, amyl alcohol mixture, n-butanol, isobutanol, isopropanol, diisobutyl carbinol (DIBC), methyl-isobutyl Methanol, 2- methyl butanol, n-amyl alcohol, normal propyl alcohol or Exxal 12；The high molecular polymer includes: polyurethane, poly- carbonic acid Ester, polyvinyl chloride, polymethyl methacrylate, phenoxy resin, polyester, ethylene copolymer；The deaeration agent includes: high-carbon alcohols Organic compound, polyethers organic compound or silicon class organic compound；The auxiliary agent includes: Cationic aid, anion Type auxiliary agent, non-ionic auxiliary agent or amphoteric auxiliary agent.

10. the preparation method of touch screen according to claim 1, which is characterized in that by three-roll grinder by described Three mixtures are ground, and in process of lapping, spacing includes 1 micron~25 microns between roller.

11. the preparation method of touch screen according to claim 1, it is characterised in that: the depth of first groove structure Including 1 micron~20 microns, the width of first groove structure includes 1 micron~10 microns；First metal wire and institute State the depth that the sum of thickness of the first seed layer is less than or equal to first groove structure, the width of first metal wire and institute State the of same size of the first groove structure；The depth of second groove structure includes 1 micron~20 microns, second groove The width of structure includes 1 micron~10 microns；Second metal wire and the sum of the thickness of second of sublayer are less than or equal to The depth of second groove structure, the width of second metal wire are of same size with second groove structure.

12. the preparation method of touch screen according to claim 1, it is characterised in that: first transparent optical cement includes OCA optical cement, second transparent optical cement include OCA optical cement, and the cover transparent sheet includes transparent glass.

13. the preparation method of touch screen according to claim 1, which is characterized in that

While the upper surface of first flexible material layer forms first groove structure, the first flexible material of Yu Suoshu The upper surface of layer forms first lead groove, and the first lead groove is connected with first groove structure；Described first Seed layer is formed simultaneously in first groove structure and in the first lead groove；In shape in first groove structure While at first metal wire, first lead is formed in Yu Suoshu first lead groove, the first lead and described the One metal wire is connected；

While the upper surface of second flexible material layer forms second groove structure, the second flexible material of Yu Suoshu The upper surface of layer forms the second lead groove, and the second lead groove is connected with second groove structure；Described second Seed layer is formed simultaneously in second groove structure and in the second lead groove；In shape in second groove structure While at second metal wire, the second lead is formed in the second lead of Yu Suoshu groove, second lead and described the Two metal wires are connected.

14. the preparation method of touch screen according to claim 13, which is characterized in that the cover transparent sheet is adhered on institute Stating behind the upper surface of the second transparent optical glue-line further includes following steps: