CN110058725A - The preparation method of touch screen - Google Patents
The preparation method of touch screen Download PDFInfo
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- CN110058725A CN110058725A CN201910168587.XA CN201910168587A CN110058725A CN 110058725 A CN110058725 A CN 110058725A CN 201910168587 A CN201910168587 A CN 201910168587A CN 110058725 A CN110058725 A CN 110058725A
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- layer
- seed
- flexible material
- flexible
- material layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- General Engineering & Computer Science (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The present invention provides a kind of preparation method of touch screen, includes the following steps: to provide the printing work platform for being provided with soft cushioning;Prepare seed ink;In being scratched using blade coating tool to seed ink on soft cushioning in forming the first seed layer in each first groove structure;Based on the first seed layer in forming the first metal wire in the first groove structure;The first transparent optical glue-line is formed in the upper surface of driving layer structure;In carrying out scratching in each second groove structure to seed ink using blade coating tool on soft cushioning forming second of sublayer;Based on second of sublayer in forming the second metal wire in each second groove structure;Inductive layer structure is adhered on to the upper surface of the first transparent optical glue-line;The second transparent optical glue-line is formed in the upper surface of inductive layer structure;Cover transparent sheet is provided, cover transparent sheet is adhered on to the upper surface of the second transparent optical glue-line.The present invention does not need the step of additional precuring and cleaning, to simplify process flow, reduces production cost.
Description
Technical field
The invention belongs to technical field of touch control, more particularly to a kind of preparation method of touch screen.
Background technique
Touch screen is usually to have metal grill to constitute channel and have function.Metal grill is mostly regular figure, as rectangle,
Diamond shape or hexagon etc..Metal grill in existing touch screen generally passes through the shape in the groove structure of flexible material layer
It is obtained at conductive layer, the obtained metal grill is connected via flexible circuit board (FPC) with processing chip.And existing skill
In art, the method for conductive layer is formed as shown in Figure 1, generally folding the flexibility including flexible substrates 101 and flexible material layer 102
Layer structure 10 is placed in the upper surface of a printing work platform 12, after the upper surface drop coating silver paste 13 of the flexible material layer 102
Using scraper 14 scratch silver paste 13 so that silver paste 13 be filled in each groove structure 11 after solidified and
Obtain conductive layer.
However, when carrying out the blade coating of silver paste 13 using above-mentioned process, due to the printing work platform 12
When the area of generally working metal platform, the especially described working metal platform is bigger, the printing work platform 12
The flatness of upper surface not can guarantee, i.e., the upper surface of the described printing work platform 12 has pit or protrusion exists, and carry out
When the blade coating of silver paste 13, since there are the presence of pit or protrusion, silver paste in the upper surface of the printing work platform 12
13 while being filled in the groove structure 11, can remain in the upper surface of the flexible material layer 102;It is completed in blade coating
It needs the upper surface to the flexible material layer 102 to clean afterwards, 102 upper surface of flexible material layer will be remained on
Silver paste 13 removes, and silver paste 13 could be sintered to solidification to form the conductive layer after cleaning, so that touching
The entire processing step of control screen preparation is complicated, higher cost.
Meanwhile existing silver paste 13 belongs to Precious Metal, it is excessively high that this just inevitably results in cost.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of preparation method of touch screen,
For solving to will cause flexible material layer upper surface when the upper surface of flexible material layer carries out silver paste blade coating in the prior art and have
Middle silver paste residual, so that the upper surface to the flexible material layer be needed to clean after the completion of blade coating, after cleaning could incite somebody to action
Silver paste, which is sintered, is formed by curing conductive layer, so that entire processing step is more complicated, the higher problem of production cost, and make
When making conductive layer with silver paste, since silver paste belongs to noble metal, the problem of so as to cause higher cost.
In order to achieve the above objects and other related objects, the present invention provides a kind of preparation method of touch screen, the touch-control
The preparation method of screen comprising steps of
Printing work platform is provided, the upper surface of the printing work platform is provided with soft cushioning;
The first flexible overlapping structure is set in the upper surface of the soft cushioning, the first flexible overlapping structure includes first
Flexible substrates and the first flexible material layer, first flexible substrates are located at the upper surface of the soft cushioning, and described first is flexible
Material layer is located at the upper surface of first flexible substrates, and it is recessed that the upper surface of first flexible material layer is formed with multiple first
Slot structure;
Seed ink is prepared, the preparation method of the seed ink includes the following steps:
Iron powder and the first organic solvent are provided, mix the iron powder and part first organic solvent under reducing atmosphere
It closes uniformly, to obtain the first mixture;
High molecular polymer, the second organic solvent and deaeration agent are provided, by the high molecular polymer, described second organic
Solvent and deaeration agent mixing are to obtain the second mixture;
Nano-silica powder is provided, by the nano-silica powder and part second mixture and described first
Mixture is uniformly mixed, to obtain third mixture;
The third mixture is ground, so that the nano-silica powder comes into full contact with the iron powder, with
Obtain include the iron powder of surface coated silica layer slurry;
First organic solvent, second mixture and auxiliary agent are continuously added into the slurry and are uniformly mixed i.e.
Obtain the seed ink;
The seed ink is placed in the upper surface of first flexible material layer;Using blade coating tool to the seed oil
Ink is scratched, so that the seed ink, which is filled in each first groove structure, forms the first seed layer;
Based on first seed layer in forming the first metal wire, the first metal wire phase in first groove structure
It connects to form the first metal grill;The first flexible overlapping structure, first seed layer and first metal grill
Collectively form driving layer structure;
The first transparent optical glue-line is formed in the upper surface of the driving layer structure;
The second flexible overlapping structure is set in the upper surface of the soft cushioning, the second flexible overlapping structure includes second
Flexible substrates and the second flexible material layer, second flexible substrates are located at the upper surface of the soft cushioning, and described second is flexible
Material layer is located at the upper surface of second flexible substrates, and it is recessed that the upper surface of second flexible material layer is formed with multiple second
Slot structure;
The seed ink is placed in the upper surface of second flexible material layer, using the blade coating tool to described kind
Seed oil ink is scratched, so that the seed ink, which is filled in each second groove structure, forms second of sublayer;
Based on second of sublayer in forming the second metal wire, second metal wire in each second groove structure
It is interconnected to form the second metal grill;The second flexible overlapping structure, second of sublayer and second metal mesh
Lattice collectively form inductive layer structure;
The inductive layer structure is adhered on to the upper surface of the first transparent optical glue-line;
The second transparent optical glue-line is formed in the upper surface of the inductive layer structure;
Cover transparent sheet is provided, the cover transparent sheet is adhered on to the upper surface of the second transparent optical glue-line.
Optionally, the printing work platform includes metallic work table;The soft cushioning include Shao A hardness between 30 degree~
Liner between 80 degree, the thickness of the soft cushioning include 0.5 millimeter~10 millimeters.
Optionally, the process scratched in the seed ink to the upper surface for being located at first flexible material layer
In, the angle of the upper surface of the blade coating tool and first flexible material layer includes 30 °~70 °, and blade coating pressure includes 4 public
Jin power it is every square centimeter~6 Kgfs it is every square centimeter, blade coating speed include 50 millimeters it is per second~260 millimeters it is per second;It is aligning
During the seed ink of the upper surface of second flexible material layer is scratched, the blade coating tool with it is described
The angle of the upper surface of second flexible material layer include 30 °~70 °, blade coating pressure include 4 Kgfs it is every square centimeter~6 kilograms
Power is every square centimeter, blade coating speed include 50 millimeters it is per second~260 millimeters it is per second.
Optionally, the partial size of the iron powder includes 0.2 nanometer~5 microns, and the partial size of the nano-silica powder is less than
100 nanometers.
Optionally, in first mixture, the mass ratio of first organic solvent and the iron powder includes 0.5~
10;In the third mixture, the mass ratio of the nano-silica powder and the iron powder includes 0.1~3.
Optionally, high molecular polymer, the second organic solvent and deaeration agent are provided, by the high molecular polymer, described
Second organic solvent and deaeration agent mixing are included the following steps: with obtaining the second mixture
The high molecular polymer and second organic solvent are provided, the high molecular polymer is added to described
It is stirred in two organic solvents and at least heating is until the high molecular polymer is completely dissolved to obtain mixed solution;
The deaeration agent is provided, the deaeration agent is added into the mixed solution, stirs and vacuumizes described in removal
The oxygen dissolved in mixed solution.
Optionally, the temperature heated after the high molecular polymer being added into second organic solvent includes 40 DEG C
~90 DEG C;The high molecular polymer continues heating 5 hours~10 hours after being dissolved completely in second organic solvent.
Optionally, during removing the oxygen dissolved in the solution, environment where the solution is evacuated to negative pressure, and
Pressure maintaining 2 hours~3 hours.
Optionally, first organic solvent and second organic solvent include: ethyl acetate, butanone, dipropyl two
Alcohol methyl ether ester acid esters, butyl carbitol acetate, diethylene glycol ether, propylene glycol monomethyl ether ester acid esters, ethyl alcohol, α terpinol, butyl
Carbitol, propylene glycol monomethyl ether, dipropylene glycol methyl ether, dipropylene glycol propyl ether, propylene glycol propyl ether, propandiol butyl ether, dipropylene glycol fourth
Ether, tripropylene glycol butyl ether, propylene glycol phenylate, dimethyl ether, propylene glycol diacetate, amyl acetate mixture, acetic acid
N-butyl, isobutyl acetate, n-propyl acetate, isopropyl acetate, n-butyl propionate, 3- ethoxyl ethyl propionate, O-phthalic
Dibutyl phthalate, n-pentyl propionate, n propyl propionate, dibasic acid ester, acetone, beta-terpineol, hexylene glycol, amyl alcohol mixture, positive fourth
Alcohol, isobutanol, isopropanol, diisobutyl carbinol (DIBC), methyl isobutyl carbinol, 2- methyl butanol, n-amyl alcohol, normal propyl alcohol or trimethyl
Nonyl alcohol;The high molecular polymer include: polyurethane, polycarbonate, polyvinyl chloride, polymethyl methacrylate, phenoxy resin,
Polyester, ethylene copolymer;The deaeration agent includes: that high-carbon alcohols organic compound, polyethers organic compound or silicon class are organic
Compound;The auxiliary agent includes: Cationic aid, anionic auxiliary agent, non-ionic auxiliary agent or amphoteric auxiliary agent.
Optionally, the third mixture is ground by three-roll grinder, in process of lapping, spacing includes between roller
1 micron~25 microns.
Optionally, the depth of first groove structure includes 1 micron~20 microns, the width of first groove structure
Including 1 micron~10 microns;It is recessed that the sum of first metal wire and the thickness of first seed layer are less than or equal to described first
The depth of slot structure, the width of first metal wire are of same size with first groove structure;The second groove knot
The depth of structure includes 1 micron~20 microns, and the width of second groove structure includes 1 micron~10 microns;Second gold medal
Belong to the depth that the sum of thickness of line and second of sublayer is less than or equal to second groove structure, second metal wire
Width is of same size with second groove structure.
Optionally, first transparent optical cement includes OCA optical cement, and second transparent optical cement includes OCA optics
Glue, the cover transparent sheet include transparent glass.
Optionally, while the upper surface of the first flexible material layer of Yu Suoshu forms first groove structure, Yu Suoshu
The upper surface of first flexible material layer forms first lead groove, and the first lead groove is connected with first groove structure
It is logical;First seed layer is formed simultaneously in first groove structure and in the first lead groove;In described first
While forming first metal wire in groove structure, formation first lead in Yu Suoshu first lead groove, described first
Lead is connected with first metal wire;
While the upper surface of second flexible material layer forms second groove structure, Yu Suoshu second is flexible
The upper surface of material layer forms the second lead groove, and the second lead groove is connected with second groove structure;It is described
Second of sublayer is formed simultaneously in second groove structure and in the second lead groove;In second groove structure
While interior formation second metal wire, the second lead, second lead and institute are formed in the second lead of Yu Suoshu groove
The second metal wire is stated to be connected.
Optionally, the cover transparent sheet is adhered on behind the upper surface of the second transparent optical glue-line further includes walking as follows
It is rapid:
Flexible circuit board and processing chip are provided;
The flexible circuit board is coupled with first metal grill, second metal grill and the processing chip
Connection, so that first metal grill and second metal grill are via the flexible circuit board and the processing chip
Electrical connection.
Optionally, the seed ink includes following component by mass percentage:
Surface is coated with silicon oxide the iron powder 10%~90% of layer;
High molecular polymer 5%~50%;
Organic solvent 10%~50%;
Auxiliary agent 0.1%~10%;
Defrother 0.01%~10%.
As described above, the preparation method of touch screen of the invention, has the advantages that
In the preparation method of touch screen of the invention, when preparing the first seed layer and second of sublayer, respectively by first
Flexible overlapping structure and the second flexible overlapping structure are placed in the upper surface progress seed for being provided with the printing work platform of soft cushioning
The blade coating of ink, due to the presence of soft cushioning, when carrying out the blade coating of seed ink using blade coating tool, in the work of blade coating pressure
Under, soft cushioning can absorb the factor of printing work platform part out-of-flatness, to avoid seed ink in the first flexible material
The residual of layer and the second flexible material layer surface, it is ensured that the upper surface of the first flexible material layer and the second flexibility after the completion of blade coating
The cleannes of the upper surface of material layer do not need additional the step of carrying out precuring to seed ink and to the first flexible material
The step of upper surface of layer and the upper surface of the second flexible material layer are cleaned, to simplify process flow, reduces life
Produce cost;
Using iron powder as raw material in seed ink prepared by the present invention, iron dust can reduce production cost in base metal;
Iron powder surface in seed ink prepared by the present invention is coated with silicon oxide layer, i.e., the first seed layer of the invention
And the iron powder surface in second of sublayer is coated with silicon oxide layer, silicon dioxide layer is adsorbed in iron powder by physisorption
Surface, there is the characteristic that persistently coats, and silicon dioxide layer has repulsive interaction to oxygen, connecing for oxygen and iron powder can be prevented
Touching, thus guarantee the zeroth order chemical valence state of iron powder, so that iron powder maintains higher reproducibility, it can be to avoid based on described first
The first metal wire and the second metal wire broken string that seed layer and second of sublayer are formed, so that it is guaranteed that the first metal grill formed
And second metal grill performance, and then ensure the performance of touch screen;
When preparing seed ink in the present invention, first iron powder is added in the first organic solvent and is stirred mixed under reducing atmosphere
It closes uniformly, so that iron powder surface sufficiently infiltrates the first organic solvent, can be connect in subsequent preparation process to avoid iron powder and oxygen
Touching, so that iron powder be avoided to be oxidized;
When preparing seed ink in the present invention, third mixture is ground using three-roll grinder, grinding rate compared with
Fastly, yield is high, and energy consumption is lower;
When preparing seed ink in the present invention, first high molecular polymer is dissolved in after the second organic solvent then at nanometer two
Silica powder is added together into the first mixture, will not since high molecular polymer has been dissolved in the second organic solvent
The first organic solvent is destroyed to the cladding of iron powder, so as to avoid iron powder from being oxidized;
When preparing seed ink in the present invention, high molecular polymer is first dissolved in the second organic solvent and obtains mixed solution
Afterwards, it adds the oxygen dissolved in deaeration agent removal mixed liquor and obtains the second mixture, later just by the second mixture and nanometer
Silicon dioxide powder is added to the first mixture together and forms third mixture, so that it is guaranteed that not having oxygen to deposit in third mixture
, and then iron powder is avoided to be oxidized.
Detailed description of the invention
Fig. 1 is shown as carrying out the structural schematic diagram of silver paste blade coating in the upper surface of flexible material layer in the prior art.
Fig. 2 is shown as the flow chart of the preparation method of touch screen provided by the invention.
Fig. 3 is shown as the cross section structure signal of step 1) resulting structures in the preparation method of touch screen provided by the invention
Figure.
Fig. 4 is shown as the cross section structure signal of step 2) resulting structures in the preparation method of touch screen provided by the invention
Figure.
Fig. 5 to Fig. 7 is shown as the cross section structure of step 4) resulting structures in the preparation method of touch screen provided by the invention
Schematic diagram.
Fig. 8 is shown as the cross section structure signal of step 5) resulting structures in the preparation method of touch screen provided by the invention
Figure.
Fig. 9 is shown as the cross section structure signal of step 6) resulting structures in the preparation method of touch screen provided by the invention
Figure.
Figure 10 is shown as the cross section structure signal of step 7) resulting structures in the preparation method of touch screen provided by the invention
Figure.
Figure 11 to Figure 13 is shown as the section knot of step 8) resulting structures in the preparation method of touch screen provided by the invention
Structure schematic diagram.
Figure 14 is shown as the cross section structure signal of step 9) resulting structures in the preparation method of touch screen provided by the invention
Figure.
Figure 15 is shown as the cross section structure signal of step 10) resulting structures in the preparation method of touch screen provided by the invention
Figure.
Figure 16 is shown as the cross section structure signal of step 11) resulting structures in the preparation method of touch screen provided by the invention
Figure.
Figure 17 is shown as the cross section structure signal of step 12) resulting structures in the preparation method of touch screen provided by the invention
Figure.
Component label instructions
10 flexible overlapping structures
101 flexible substrates
102 flexible material layers
11 groove structures
12 printing work platforms
13 seed ink
14 scrapers
2 printing work platforms
3 soft cushionings
4 driving layer structure
41 first flexible overlapping structures
411 first flexible substrates
412 first flexible material layers
413 first groove structures
42 seed ink
43 first seed layers
44 first metal grills
441 first metal wires
5 blade coating tools
6 first optical adhesive layers
7 inductive layer structures
71 second flexible overlapping structures
711 second flexible substrates
712 second flexible material layers
713 second groove structures
72 second of sublayer
73 second metal grills
731 second metal wires
81 second transparent optical glue-lines
82 cover transparent sheets
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.
Please refer to Fig. 2~Figure 17.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of invention, though only show in diagram with related component in the present invention rather than package count when according to actual implementation
Mesh, shape and size are drawn, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its
Assembly layout kenel may also be increasingly complex.
Referring to Fig. 2, the preparation method of the touch screen includes step the present embodiment provides a kind of preparation method of touch screen
It is rapid:
1) printing work platform is provided, the upper surface of the printing work platform is provided with soft cushioning;
2) the first flexible overlapping structure is arranged in the upper surface of Yu Suoshu soft cushioning, and the first flexible overlapping structure includes the
One flexible substrates and the first flexible material layer, first flexible substrates are located at the upper surface of the soft cushioning, and described first is soft
Property material layer is located at the upper surface of first flexible substrates, and the upper surface of first flexible material layer is formed with multiple first
Groove structure;
3) seed ink is prepared, the preparation method of the seed ink includes the following steps:
Iron powder and the first organic solvent are provided, mix the iron powder and part first organic solvent under reducing atmosphere
It closes uniformly, to obtain the first mixture;
High molecular polymer, the second organic solvent and deaeration agent are provided, by the high molecular polymer, described second organic
Solvent and deaeration agent mixing are to obtain the second mixture;
Nano-silica powder is provided, by the nano-silica powder and part second mixture and described first
Mixture is uniformly mixed, to obtain third mixture;
The third mixture is ground, so that the nano-silica powder comes into full contact with the iron powder, with
Obtain include the iron powder of surface coated silica layer slurry;
First organic solvent, second mixture and auxiliary agent are continuously added into the slurry and are uniformly mixed i.e.
Obtain the seed ink;
4) seed ink is placed in the upper surface of first flexible material layer;Using blade coating tool to the seed ink
It is scratched, so that the seed ink, which is filled in each first groove structure, forms the first seed layer;
5) based on first seed layer in forming the first metal wire, first metal wire in first groove structure
It is interconnected to form the first metal grill;The first flexible overlapping structure, first seed layer and first metal mesh
Lattice collectively form driving layer structure;
6) the first transparent optical glue-line is formed in the upper surface of the driving layer structure;
7) the second flexible overlapping structure is arranged in the upper surface of Yu Suoshu soft cushioning, and the second flexible overlapping structure includes the
Two flexible substrates and the second flexible material layer, second flexible substrates are located at the upper surface of the soft cushioning, and described second is soft
Property material layer is located at the upper surface of second flexible substrates, and the upper surface of second flexible material layer is formed with multiple second
Groove structure;
8) seed ink is placed in the upper surface of second flexible material layer, using the blade coating tool to the seed
Ink is scratched, so that the seed ink, which is filled in each second groove structure, forms second of sublayer;
9) based on second of sublayer in forming the second metal wire, second metal in each second groove structure
Line is interconnected to form the second metal grill;The second flexible overlapping structure, second of sublayer and second metal
Grid collectively forms inductive layer structure;
10) the inductive layer structure is adhered on to the upper surface of the first transparent optical glue-line;
11) upper surface of Yu Suoshu inductive layer structure forms the second transparent optical glue-line;
12) cover transparent sheet is provided, the cover transparent sheet is adhered on to the upper surface of the second transparent optical glue-line.
In step 1), S1 step and Fig. 3 in Fig. 2 are please referred to, printing work platform 2 is provided, the printing work is flat
The upper surface of platform 2 is provided with soft cushioning 3.
As an example, the printing work platform 2 may include working metal platform, specifically, the printing work is flat
Platform 2 may include aluminium workbench, stainless steel workbench or aluminium alloy workbench etc..
As an example, the upper surface of the printing platform 2 is not absolutely smooth, i.e., the upper surface of the described printing platform 2
Flatness can be bad, that is, the upper surface part subregion of the printing platform 2 could be formed with pit (not shown) or protrusion
Structure.
As an example, the cushion 3 can by but be not limited only to barbola work and be pasted on the printing work platform 2
Upper surface.
As an example, the soft cushioning 3 may include liner of Shao A hardness between 30 degree~80 degree.It needs to illustrate
, described herein refers to " between 30 degree~80 degree " including all numerical value between 30 degree, 80 degree and 30 degree~80 degree
Numberical range, i.e., described herein refers to the numberical range including endpoint " between 30 degree~80 degree ".
As an example, the soft cushioning 3 may include rubber pad, blanket, silicagel pad or silicone rubber pad etc..
As an example, the thickness of the soft cushioning 3 can be set according to actual needs, it is preferable that in the present embodiment,
The thickness of the soft cushioning 3 may include 0.5 millimeter (mm)~10 millimeter.
Step 2), please refers to S2 step and Fig. 4 in Fig. 2, and the first flexible overlapping is arranged in the upper surface of Yu Suoshu soft cushioning 3
Structure 41, the first flexible overlapping structure 41 include the first flexible substrates 411 and the first flexible material layer 412, described first
Flexible substrates 411 are located at the upper surface of the soft cushioning 3, and first flexible material layer 412 is located at first flexible substrates
411 upper surface, the upper surface of first flexible material layer 412 are formed with multiple first groove structures 413.
As an example, first groove structure 413 can be formed in first flexible material layer using imprint process
412 upper surface.
As an example, first flexible substrates 411 may include but be not limited only to polyethylene terephthalate
(PET) substrate, polyimides (PI) substrate, polycarbonate (PC) substrate or polymethyl methacrylate (PMMA) substrate.
As an example, first flexible material layer 412 may include photoresist layer or UV (ultraviolet light) resin layer.It needs
Illustrate, the UV resin layer is also known as photosensitive resin layer, UV-cured resin layer, it can be used as paint, coating, oil
The sizing material of ink etc. uses.UV is the abbreviation of English Ultraviolet Rays, i.e. ultraviolet light.Ultraviolet light be it is invisible,
It is one section of electromagnetic radiation other than visible light, range of the wavelength in 10nm~400nm.The principle of solidification of the UV resin layer is institute
It states after the photoinitiator (or photosensitizer) in UV resin absorbs ultraviolet light under ultraviolet irradiation and generates living radical or sun
Ion causes monomer polymerization, is crosslinked and connects branch chemical reaction, so that the UV resin layer is converted into admittedly within the several seconds by liquid
State.
As an example, the width and depth of first groove structure 413 can be set according to actual needs, preferably
Ground, the depth of first groove structure 413 may include 1 micron~20 microns, and the width of first groove structure 413 can
To include 1 micron~10 microns.
As an example, each first groove structure 413 can be interconnected into it is latticed, specifically, described first is recessed
Slot structure 413 can be interconnected, and rectangular latticed, rhombus net trellis, network of triangle trellis, pentagon be latticed or six sides
Shape is latticed etc..
As an example, forming the same of first groove structure 413 in the upper surface of first flexible material layer 412
When, the upper surface of the first flexible material layer of Yu Suoshu 412 forms first lead groove (not shown), the first lead groove with
First groove structure 413 is connected.Specifically, first lead groove one end and 413 phase of the first groove structure
Connection, the other end extends to the side of first flexible material layer 412, by first groove structure 413 from described the
It draws one flexible material layer 412 at least side.
In step 3), the S3 step in Fig. 2 is please referred to, seed ink 42 is prepared.
As an example, step 3) may include steps of:
Iron powder and the first organic solvent 3-1) are provided, it is under reducing atmosphere that the iron powder and part described first is organic molten
Agent is uniformly mixed, to obtain the first mixture;
High molecular polymer, the second organic solvent and deaeration agent 3-2) are provided, by the high molecular polymer, described second
Organic solvent and deaeration agent mixing are to obtain the second mixture;
3-3) provide nano-silica powder, by the nano-silica powder and part second mixture with it is described
First mixture is uniformly mixed, to obtain third mixture;
3-4) the third mixture is ground, so that the nano-silica powder sufficiently connects with the iron powder
Touching, with obtain include the iron powder of surface coated silica layer slurry;
First organic solvent, second mixture and auxiliary agent 3-5) are continuously added in Xiang Suoshu slurry and are mixed equal
It is even to obtain the seed ink 42.
As an example, step 3-1) in provide the iron powder can be to be used under hot conditions, use reducing gas
Iron oxide is reduced into iron powder obtained from the method for Zero-valent Iron by (for example hydrogen).It should be noted that " the high temperature item
Part " refers to the temperature condition that reducing gas can be chemically reacted with iron oxide.
As an example, step 3-1) in, it can be in the iron powder is added into first organic solvent while progress
Stirring, can also be stirred again after the iron powder is added into first organic solvent, the specific time of stirring and stir
Mixing rate can select according to actual needs, herein without limitation.
As an example, step 3-1) in the partial size of the iron powder that provides can be selected according to actual needs, preferably
Ground, in the present embodiment, the iron powder is nanometer iron powder, and the partial size of the iron powder includes 0.2 nanometer~5 microns.
As an example, step 3-1) described in reducing atmosphere may include hydrogen atmosphere, i.e., under hydrogen shield atmosphere will
The iron powder is added in first organic solvent.First organic solvent is added in the iron powder under reducing atmosphere
It is interior, it can be ensured that iron powder will not be contacted with oxygen during addition, and iron powder will not be oxidized.
As an example, step 3-1) in, first organic solvent may include that lipid solvent, ether solvent, alcohols are molten
Agent or ketones solvent etc.;Specifically, first organic solvent may include but be not limited only to ethyl acetate, butanone, dipropyl
Glycol methyl ether ester acid esters, butyl carbitol acetate, diethylene glycol ether, propylene glycol monomethyl ether ester acid esters, ethyl alcohol, α terpinol with
And butyl carbitol;In addition to this, the first organic solvent can also use propylene glycol monomethyl ether, dipropylene glycol methyl ether, dipropylene glycol
Propyl ether, propylene glycol propyl ether, propandiol butyl ether, dipropylene, tripropylene glycol butyl ether, propylene glycol phenylate, dipropylene glycol diformazan
Ether, propylene glycol diacetate, amyl acetate mixture, n-butyl acetate, isobutyl acetate, n-propyl acetate, isopropyl acetate,
N-butyl propionate, 3- ethoxyl ethyl propionate, dibutyl phthalate, n-pentyl propionate, n propyl propionate, dibasic acid ester,
Acetone, beta-terpineol, hexylene glycol, amyl alcohol mixture, n-butanol, isobutanol, isopropanol, diisobutyl carbinol (DIBC), methyl-isobutyl
Methanol, 2- methyl butanol, n-amyl alcohol, normal propyl alcohol or Exxal 12.
As an example, step 3-1) obtained in first mixture, first organic solvent and the iron powder
Mass ratio may include 0.5~10, that is, the quality of first organic solvent used is into first organic solvent
0.5 times~10 times of the quality for the iron powder being added, it is preferable that in the present embodiment, first organic solvent and the iron
The mass ratio of powder is 2, that is, the quality of first organic solvent used be added into first organic solvent described in
2 times of the quality of iron powder.
The iron powder is added in first organic solvent and is uniformly mixed under reducing atmosphere, so that the iron
Powder surface sufficiently infiltrates first organic solvent, can contact to avoid the iron powder with oxygen in subsequent preparation process, from
And the iron powder is avoided to be oxidized, so that the iron powder remains at reduction valence state, keep good reducing property.
As an example, step 3-2) high molecular polymer, the second organic solvent and deaeration agent are provided, by the polyphosphazene polymer
Close object, second organic solvent and deaeration agent mixing may include steps of with obtaining the second mixture:
The high molecular polymer and second organic solvent 3-2-1) are provided, by the high molecular polymer be added to
It is stirred in second organic solvent and at least heating is until the high molecular polymer is completely dissolved to obtain mixed solution;
The deaeration agent 3-2-2) is provided, the deaeration agent is added into the mixed solution, stirs and vacuumizes
Except the oxygen dissolved in the mixed solution.
As an example, step 3-2-1) in, add after the high molecular polymer is added into second organic solvent
The temperature of heat includes 40 DEG C~90 DEG C;The high molecular polymer continues to heat after being dissolved completely in second organic solvent
5 hours~10 hours, it is preferable that in the present embodiment, after the high molecular polymer is dissolved completely in second organic solvent
Continue heating 8 hours.
As an example, can be heated using heating mantle to second organic solvent using oil bath, water-bath.
As an example, step 3-2-2) in, it, will be where the solution during removing the oxygen dissolved in the solution
Environment is evacuated to negative pressure, and pressure maintaining 2 hours~3 hours;Environment where the solution can be pumped down to 0MPa~0.1MPa.
As an example, step 3-2) in provide second organic solvent may include: ethyl acetate, butanone, dipropyl
Glycol methyl ether ester acid esters, butyl carbitol acetate, diethylene glycol ether, propylene glycol monomethyl ether ester acid esters, ethyl alcohol, α terpinol, fourth
Base carbitol, propylene glycol monomethyl ether, dipropylene glycol methyl ether, dipropylene glycol propyl ether, propylene glycol propyl ether, propandiol butyl ether, dipropylene glycol
Butyl ether, tripropylene glycol butyl ether, propylene glycol phenylate, dimethyl ether, propylene glycol diacetate, amyl acetate mixture, vinegar
Sour N-butyl, isobutyl acetate, n-propyl acetate, isopropyl acetate, n-butyl propionate, 3- ethoxyl ethyl propionate, adjacent benzene two
Formic acid dibutyl ester, n-pentyl propionate, n propyl propionate, dibasic acid ester, acetone, beta-terpineol, hexylene glycol, amyl alcohol mixture, just
Butanol, isobutanol, isopropanol, diisobutyl carbinol (DIBC), methyl isobutyl carbinol, 2- methyl butanol, n-amyl alcohol, normal propyl alcohol or front three
Base nonyl alcohol.
As an example, step 3-2) in the high molecular polymer that provides may include: polyurethane, it is polycarbonate, poly-
Vinyl chloride, polymethyl methacrylate, phenoxy resin, polyester, ethylene copolymer;Wherein, the polyester includes poly- terephthaldehyde
Sour second diester, polybutylene terephthalate, poly terephthalic acid diallyl, ekonol, unsaturated polyester (UP)
Resin, phenolic resin or acrylic resin;The ethylene copolymer includes the monomer for containing vinyl by two or more
Polymer made of copolymerization.
As an example, step 3-2) in provide the deaeration agent may include: high-carbon alcohols organic compound, polyethers
Organic compound or silicon class organic compound.Specifically, the high-carbon alcohols organic compound may include benzyl carbinol oleate
Or Laurate alcohol ester phenylacetate etc.;The polyethers organic compound may include: GP type defoaming agent, GPE type defoaming agent or
GPES type defoaming agent etc.;The silicon class organic compound may include: dimethyl silicone polymer or polyether-modified silicon etc..
First the high molecular polymer is dissolved in after second organic solvent in subsequent step and nano-silica
SiClx powder is added together into first mixture, since to be dissolved in described second organic molten for the high molecular polymer
In agent, first organic solvent will not be destroyed to the cladding of the iron powder, so as to avoid the iron powder from being oxidized;Together
When, the oxygen dissolved in the mixed liquor can be removed by the way that the deaeration agent is added, it can be ensured that subsequent the be mixed to form
There is no oxygen presence in three mixtures, and then the iron powder is avoided to be oxidized.
As an example, step 3-3) in the partial size of the nano-silica powder that provides can carry out according to actual needs
Selection, it is preferable that in the present embodiment, the partial size of the nano-silica powder is less than 100 nanometers.
As an example, step 3-3) in the resulting third mixture, the nano-silica powder and the iron powder
Mass ratio may include 0.1~3, i.e., the quality for the nano-silica powder being added into first mixture is institute
0.1 times~3 times for stating the quality of iron powder described in the first mixture, it is preferable that in the present embodiment, the nano-silica powder
Mass ratio with the iron powder is 0.5, i.e., the quality for the nano-silica powder being added into first mixture is
0.5 times of the quality of iron powder described in first mixture.
As an example, step 3-4) in can use but be not limited only to three-roll grinder and grind the third mixture
Mill, during grinding, spacing between regulating roller, to ensure to have enough pressure to make the nano-silica powder and institute
Iron powder is stated to come into full contact with, so that the nano-silica powder is adsorbed on the surface of the iron powder by physisorption, with
Layer of silicon dioxide layer is coated on the surface of the iron powder;Since this layer of silicon dioxide layer is being interacting at by charge
It attracts each other, there is lasting characteristic;And the silicon dioxide layer for being coated on the iron powder periphery has row to oxygen
Reprimand effect, can prevent the contact of oxygen with the iron powder, will not react with the iron powder, so that it is guaranteed that the iron powder
Zeroth order chemical valence state makes it have preferable reduction characteristic.The third mixture is ground using three-roll grinder, is ground
It is very fast to grind rate, yield is high, and energy consumption is lower.
As an example, spacing may include 1 micron~25 microns between the three-roll grinder central roll in process of lapping.
As an example, the milling time ground to the third mixture can select according to actual needs,
Preferably, in the present embodiment, the milling time ground to the third mixture may include 0.5 hour~24 hours.
As an example, step 3-5) in provide the auxiliary agent can be used as dispersing agent.
As an example, step 3-5) in, first organic solvent, second mixing are continuously added in Xiang Suoshu slurry
First organic solvent, second mixture and institute are continuously added while object and the auxiliary agent or into the slurry
It needs to be stirred after stating auxiliary agent.
As an example, the auxiliary agent may include: Cationic aid, anionic auxiliary agent, non-ionic auxiliary agent or two
Property type auxiliary agent.
As an example, the Cationic aid may include polyethyleneimine, the double ammonio methacrylate of double octadecyls or
Person's imidazoline quaternary ammonium salt;The anionic auxiliary agent may include soybean lecithin;The non-ionic auxiliary agent may include rouge
Fat alcohol polyoxyethylene ether;The amphoteric auxiliary agent may include cocoyl azochlorosulfonate propyl lycine.
As an example, step 3-5) obtained in the seed ink 42 by mass percentage may include following component:
Surface is coated with silicon oxide the iron powder 10%~90% of layer;High molecular polymer 5%~50%;Organic solvent 10%~
50%;Auxiliary agent 0.1%~10%;Defrother 0.01%~10%.
Preferably, the component of the seed ink 42 by mass percentage may include: 50%~80% surface cladding
Have the iron powder of silicon dioxide layer, 5%~15% high molecular polymer, 15%~35% organic solvent, 0.05%~1%
Defrother and 0.1%~1% auxiliary agent;It is further preferable that the component of the seed ink 42 by mass percentage may include:
60%~70% surface be coated with silicon oxide the iron powder of layer, 8%~10% high molecular polymer, 25%~30% have
Solvent, 0.05%~0.5% defrother and 0.1%~1% auxiliary agent;It is further preferable that in one example, the seed
The component of ink 42 by mass percentage may include: that 63% surface is coated with silicon oxide the iron powder of layer, 9.4% high score
Sub- polymer, 36% organic solvent, 0.1% defrother and 0.5% auxiliary agent.
Iron powder surface in the seed ink 42 prepared by the present invention is coated with silicon oxide layer, the silicon dioxide layer
It is adsorbed in the surface of the iron powder by physisorption, there is the characteristic persistently coated, and the silicon dioxide layer is to oxygen
Gas has repulsive interaction, can prevent the contact of oxygen with the iron powder, thus guarantee the zeroth order chemical valence state of the iron powder, so that
The iron powder maintains higher reproducibility so that based on the seed ink 42 formed seed layer in iron powder maintain it is higher
Reproducibility, to avoid the metal wire broken string formed based on the seed layer, and then first be subsequently formed for ensuring to be formed
The performance of metal grill and the second metal grill.
It should be noted that the sequence of step 3) and step 2) can be interchanged, it can first carry out existing step 3) and hold again
The existing step 2) of row, also i.e., it is possible to first prepare the seed ink 42, described in the setting of the upper surface of the soft cushioning 3
First flexible overlapping structure 41.
In step 4), the S4 step and Fig. 5 to Fig. 7 in Fig. 2 are please referred to, it is flexible that seed ink 42 is placed in described first
The upper surface of material layer 412;The seed ink 42 is scratched using blade coating tool 5, so that the seed ink 42
It is filled in each first groove structure 413 and forms the first seed layer 43.
As an example, the seed ink 42 can be dripped to the upper surface for being placed in first flexible material layer 412.
As an example, the seed ink 42 can drip any position for being placed in 412 upper surface of the first flexible material layer
Set place, it is preferable that in the present embodiment, the seed ink 42, which can drip, is placed in multiple first groove structure, 413 sides, with
Convenient for that can be scratched from a laterally opposed other side of the upper surface of first flexible material layer 412 when subsequent blade coating.
As an example, the blade coating tool 5 may include but be not limited only to scraper;The structure of the scraper is this field skill
Art personnel are known that this is not repeated.
As an example, the blade coating tool 5 is in knifing process with upper compared to first flexible material layer 412
The posture that surface is tilted a certain angle scratches the seed ink 42, it is preferable that in the present embodiment, the blade coating tool
5 can be configured according to actual needs with the angle of the upper surface of first flexible material layer 412, it is preferable that this implementation
In example, the blade coating tool 5 and the angle of the upper surface of first flexible material layer 412 may include 30 °~70 °, more
Preferably, in the present embodiment, the blade coating tool 5 and the angle of the upper surface of first flexible material layer 412 may include
60 °~70 °.
As an example, in the step, it is described when being scratched using the blade coating tool 5 to the seed ink 42
Blade coating tool 5 applies preset pressure to first flexible material layer 412, it is preferable that in the present embodiment, institute in knifing process
State blade coating tool 5 to the blade coating pressure that first flexible material layer 412 applies may include 4 Kgfs it is every square centimeter~6
It is Kgf every square centimeter.
As an example, the speed that the blade coating tool 5 scratches can be set according to actual needs in knifing process,
It preferably, the use of the blade coating speed that the blade coating tool 5 scratches the seed ink 42 may include 50 millimeters per second
~260 millimeters per second, it is further preferable that being scratched using the blade coating tool 5 to the seed ink 42 in the present embodiment
Blade coating speed may include 160 millimeters it is per second~260 millimeters it is per second.
The first flexible overlapping structure 41 is placed in the upper of the printing work platform 2 for being provided with the soft cushioning 3
Surface carries out the blade coating of the seed ink 42, due to the presence of the soft cushioning 3, is carrying out institute using the blade coating tool 5
When stating the blade coating of seed ink 42, under the action of scratching pressure, the soft cushioning 3 can absorb the printing work platform 2 innings
The factor of portion's out-of-flatness, to avoid the seed ink 42 in the residual on 412 surface of the first flexible material layer, it is ensured that
The cleannes of the upper surface of first flexible material layer 412 after the completion of blade coating do not need additional cleaning step to described
The upper surface of one flexible material layer 412 is cleaned, to simplify process flow, reduces production cost.
As an example, further including to after being filled in each first groove structure 413 by the seed ink 42 blade coating
The step of seed ink 42 is solidified.It, can will be described specifically, when the seed ink 42 is seed ink
Seed ink 42 carries out being baked in order that the seed ink 42 is solidified to form first seed layer 43, as shown in Figure 7.
As an example, while the seed ink 42 blade coating is filled in each first groove structure 413, by institute
It states the blade coating of seed ink 42 to be filled in the first lead groove, i.e., described first seed layer 43 is formed simultaneously in described first
In groove structure 413 and in the first lead groove.
In step 5), S5 step and Fig. 8 in Fig. 2 are please referred to, it is recessed in described first based on first seed layer 43
The first metal wire 441 is formed in slot structure 413, first metal wire 441 is interconnected to form the first metal grill 44;It is described
First flexible overlapping structure 41, first seed layer 43 and first metal grill 44 collectively form driving layer structure 4.
As an example, can be led using electroplating technology or chemical plating process in being formed in each first groove structure 413
Electric material is as first metal wire 441.Specifically, first seed layer 43 is immersed copper sulphate (CuSO4) in solution,
Since the diameter (0.15 ran) of copper ion is much smaller than the gap in silicon dioxide layer described in first seed layer 43,
Gap in the silicon dioxide layer, copper ion can pass through in gap and the silicon dioxide layer in the silicon dioxide layer
Iron powder surface contact, thus the gold with the oxidation of iron powder in the silicon dioxide layer-reduction reaction growth zeroth order
Belong to copper to form first metal wire 441.
As an example, the sum of first metal wire 441 and the thickness of first seed layer 43 are less than or equal to described the
The depth of one groove structure 413, it is preferable that in the present embodiment, the thickness of first metal wire 441 and first seed layer 43
The sum of degree is equal to the depth of first groove structure 413, i.e., during forming the first metal wire 441, using electricity
Depositing process or chemical plating process are in filling the conductive material until the conductive material is filled out in each first groove structure 413
Until full first groove structure 413.
As an example, the width of first metal wire 441 can be of same size with first groove structure 413,
The width of i.e. described first metal wire 441 can be 1 micron~10 microns.
As an example, the material of first metal wire 441 may include but be not limited only to copper, i.e., described first metal wire
441 may include but be not limited only to copper metal line.
As an example, first metal grill 44 may include rectangular metal grid, diamond-type metal grid, triangle gold
Belong to grid, pentagon metal grill or hexagonal metallic grid etc..
As an example, while forming the first metal wire 441 in first groove structure 413, Yu Suoshu
First lead (not shown) is formed in one lead groove, the first lead is connected with first metal wire 441.Specifically
, described first lead one end is connected with first metal wire 441, and the other end extends to first flexible material layer
412 side draws first metal wire 441 from first flexible material layer 412 at least side.
In step 6), S6 step and Fig. 9 in Fig. 2 are please referred to, forms first in the upper surface of the driving layer structure 4
Transparent optical glue-line 6.
As an example, can use but be not limited only to spin coating proceeding formed in the upper surface of the driving layer structure 4 it is described
First transparent optical glue-line 6, specifically, all first transparent optical glue-lines 6 are formed in first flexible material layer 412 and institute
State the upper surface of the first metal grill 44.
As an example, the first transparent optical glue-line 6 may include but be not limited only to OCA (Optically Clear
Adhesive) optical adhesive layer.
As an example, the first transparent optical glue-line 6 can cover the entire upper surface of the driving layer structure 4.
In step 7), S7 step and Figure 10 in Fig. 2 are please referred to, the upper surface setting second of Yu Suoshu soft cushioning 3 is soft
Property laminated construction 71, the second flexible overlapping structure 71 include the second flexible substrates 711 and the second flexible material layer 712, institute
The upper surface that the second flexible substrates 711 are located at the soft cushioning 3 is stated, it is soft that second flexible material layer 712 is located at described second
The upper surface of property substrate 711, the upper surface of second flexible material layer 712 is formed with multiple second groove structures 713.
As an example, second groove structure 713 can be formed in second flexible material layer using imprint process
712 upper surface.
As an example, second flexible substrates 711 may include but be not limited only to polyethylene terephthalate
(PET) substrate, polyimides (PI) substrate, polycarbonate (PC) substrate or polymethyl methacrylate (PMMA) substrate.
As an example, second flexible material layer 712 may include photoresist layer or UV (ultraviolet light) resin layer.It needs
Illustrate, the UV resin layer is also known as photosensitive resin layer, UV-cured resin layer, it can be used as paint, coating, oil
The sizing material of ink etc. uses.UV is the abbreviation of English Ultraviolet Rays, i.e. ultraviolet light.Ultraviolet light be it is invisible,
It is one section of electromagnetic radiation other than visible light, range of the wavelength in 10nm~400nm.The principle of solidification of the UV resin layer is institute
It states after the photoinitiator (or photosensitizer) in UV resin absorbs ultraviolet light under ultraviolet irradiation and generates living radical or sun
Ion causes monomer polymerization, is crosslinked and connects branch chemical reaction, so that the UV resin layer is converted into admittedly within the several seconds by liquid
State.
As an example, the width and depth of second groove structure 713 can be set according to actual needs, preferably
Ground, the depth of second groove structure 713 may include 1 micron~20 microns, and the width of second groove structure 713 can
To include 1 micron~10 microns.
As an example, each second groove structure 713 can be interconnected into it is latticed, specifically, described second is recessed
Slot structure 713 can be interconnected, and rectangular latticed, rhombus net trellis, network of triangle trellis, pentagon be latticed or six sides
Shape is latticed etc..
As an example, forming the same of second groove structure 713 in the upper surface of second flexible material layer 712
When, the upper surface of the second flexible material layer of Yu Suoshu 712 forms the second lead groove (not shown), the second lead groove with
Second groove structure 713 is connected.Specifically, described second lead groove one end and 713 phase of the second groove structure
Connection, the other end extends to the side of second flexible material layer 712, by second groove structure 713 from described the
It draws two flexible material layers 712 at least side.
In step 8), the S8 step and Figure 11 to Figure 13 in Fig. 2 are please referred to, it is soft that seed ink 42 is placed in described second
The upper surface of property material layer 712, scratches the seed ink 42 using the blade coating tool 5, so that the seed
Ink 42 is filled in each second groove structure 713 and forms second of sublayer 72.
As an example, the seed ink 42 can be dripped to the upper surface for being placed in second flexible material layer 712.
As an example, the seed ink 42 can drip any of the upper surface for being placed in second flexible material layer 712
At position, it is preferable that in the present embodiment, the seed ink 42, which can drip, is placed in the one of multiple second groove structures 713
Side, in order to be scraped from a laterally opposed other side of the upper surface of second flexible material layer 712 when subsequent blade coating
It applies.
As an example, the blade coating tool 5 is in knifing process with upper compared to second flexible material layer 712
The posture that surface is tilted a certain angle scratches the seed ink 42, it is preferable that in the present embodiment, the blade coating tool
5 can be configured according to actual needs with the angle of the upper surface of second flexible material layer 712, it is preferable that this implementation
In example, the blade coating tool 5 and the angle of the upper surface of second flexible material layer 712 may include 30 °~70 °, more
Preferably, in the present embodiment, the blade coating tool 5 and the angle of the upper surface of second flexible material layer 712 may include
60 °~70 °.
As an example, in the step, it is described when being scratched using the blade coating tool 5 to the seed ink 42
Blade coating tool 5 applies preset pressure to second flexible material layer 712, it is preferable that in the present embodiment, institute in knifing process
State blade coating tool 5 to the blade coating pressure that second flexible material layer 712 applies may include 4 Kgfs it is every square centimeter~6
It is Kgf every square centimeter.
As an example, the speed that the blade coating tool 5 scratches can be set according to actual needs in knifing process,
It preferably, the use of the blade coating speed that the blade coating tool 5 scratches the seed ink 42 may include 50 millimeters per second
~260 millimeters per second, it is further preferable that being scratched using the blade coating tool 5 to the seed ink 42 in the present embodiment
Blade coating speed may include 160 millimeters it is per second~260 millimeters it is per second.
The second flexible overlapping structure 71 is placed in the upper of the printing work platform 2 for being provided with the soft cushioning 3
Surface carries out the blade coating of the seed ink 42, due to the presence of the soft cushioning 3, is carrying out institute using the blade coating tool 5
When stating the blade coating of seed ink 42, under the action of scratching pressure, the soft cushioning 3 can absorb the printing work platform 2 innings
The factor of portion's out-of-flatness, to avoid the seed ink 42 in the residual on 712 surface of the second flexible material layer, it is ensured that
The cleannes of the upper surface of second flexible material layer 712 after the completion of blade coating do not need additional cleaning step to described
The upper surface of two flexible material layers 712 is cleaned, to simplify process flow, reduces production cost.
As an example, further including to after being filled in each second groove structure 713 by the seed ink 42 blade coating
The step of seed ink 42 is solidified.It, can will be described specifically, when the seed ink 42 is seed ink
Seed ink 42 carries out being baked in order that the seed ink 42 is solidified to form second of sublayer 72, as shown in figure 13.
As an example, while the seed ink 42 blade coating is filled in each second groove structure 713, by institute
It states the blade coating of seed ink 42 to be filled in the second lead groove, i.e., described second of sublayer 72 is formed simultaneously in described second
In groove structure 713 and in the second lead groove.
In step 9), S9 step and Figure 14 in Fig. 2 are please referred to, based on second of sublayer 72 in each described second
The second metal wire 731 is formed in groove structure 713, second metal wire 731 is interconnected to form the second metal grill 73;Institute
It states the second flexible overlapping structure 71, second of sublayer 72 and second metal grill 73 and collectively forms inductive layer structure 7.
As an example, can be led using electroplating technology or chemical plating process in being formed in each second groove structure 713
Electric material is as second metal wire 731.Specifically, second of sublayer 72 is immersed copper sulphate (CuSO4) in solution,
Since the diameter (0.15 ran) of copper ion is much smaller than the gap in silicon dioxide layer described in second of sublayer 72,
Gap in the silicon dioxide layer, copper ion can pass through in gap and the silicon dioxide layer in the silicon dioxide layer
Iron powder surface contact, thus the gold with the oxidation of iron powder in the silicon dioxide layer-reduction reaction growth zeroth order
Belong to copper to form second metal wire 731.
As an example, the sum of second metal wire 731 and the thickness of second of sublayer 72 are less than or equal to described the
The depth of two groove structures 713, it is preferable that in the present embodiment, the thickness of second metal wire 731 and second of sublayer 72
The sum of degree is equal to the depth of second groove structure 713, i.e., during forming the second metal wire 731, using electricity
Depositing process or chemical plating process are in filling the conductive material until the conductive material is filled out in each second groove structure 713
Until full second groove structure 713.
As an example, the width of second metal wire 731 can be of same size with second groove structure 713,
The width of i.e. described second metal wire 731 can be 1 micron~10 microns.
As an example, the material of second metal wire 731 may include but be not limited only to copper, i.e., described second metal wire
731 may include but be not limited only to copper metal line.
As an example, second metal grill 73 may include rectangular metal grid, diamond-type metal grid, triangle gold
Belong to grid, pentagon metal grill or hexagonal metallic grid etc..
As an example, while forming the second metal wire 731 in second groove structure 713, Yu Suoshu
The second lead (not shown) is formed in two lead grooves, second lead is connected with second metal wire 731.Specifically
, second lead one end is connected with second metal wire 731, and the other end extends to second flexible material layer
712 side draws second metal wire 731 from second flexible material layer 712 at least side.
It should be noted that step 6) can also be interchangeable with step 7)~step 9) sequence, i.e., can also first hold
Existing the step 7)~step 9) of row, then existing step 6) is executed, also that is, the inductive layer structure 7 can also be prepared first, then
The first transparent optical glue-line 6 is formed in the upper surface of the driving layer structure 4.
In step 10), S10 step and Figure 15 in Fig. 2 are please referred to, the inductive layer structure 7 is adhered on described
The upper surface of one transparent optical glue-line 6.
As an example, the upper surface phase of the upper surface of second flexible substrates 711 and the first transparent optical glue-line 6
Contact.The inductive layer structure 7 is posted via the first transparent optical glue-line 6 to be fixed on the driving layer structure 4.
In step 11), S11 step and Figure 16 in Fig. 2 are please referred to, the upper surface of Yu Suoshu inductive layer structure 7 is formed
Second transparent optical glue-line 81.
As an example, can use but be not limited only to spin coating proceeding formed in the upper surface of the inductive layer structure 7 it is described
Second transparent optical glue-line 81, specifically, all second transparent optical glue-lines 81 be formed in second flexible material layer 712 and
The upper surface of second metal grill 73.
As an example, the second transparent optical glue-line 81 may include but be not limited only to OCA (Optically Clear
Adhesive) optical adhesive layer.
As an example, the second transparent optical glue-line 81 can cover the entire upper surface of the inductive layer structure 7.
In step 12), S12 step and Figure 17 in Fig. 2 are please referred to, cover transparent sheet 82 is provided, by the cover transparent sheet
82 adhere on the upper surface of the second transparent optical glue-line 81.
As an example, the cover transparent sheet 82 may include but be not limited only to glass cover-plate.The cover transparent sheet 82 via
Second optical adhesive layer 8 adheres in the inductive layer structure 7.
As an example, the second transparent optical glue-line 81 can be completely covered in the cover transparent sheet 82.
As an example, further including following steps after step 12):
13) flexible circuit board (FPC) (not shown) and processing chip (not shown) are provided;
14) by the flexible circuit board and first metal grill 44, second metal grill 73 and the processing
Chip is of coupled connections so that first metal grill 44 and second metal grill 73 via the flexible circuit board with
The processing chip electrical connection.
As an example, the specific structure of the flexible circuit board and the processing chip that provide in step 13) is ability
Field technique personnel are known, are not repeated herein.
As an example, first metal grill 44 is electrically connected via the first lead with the flexible circuit board, institute
It states the second metal grill 73 and is electrically connected via second lead with the flexible circuit board.
In conclusion the preparation method of touch screen of the invention, the preparation method of the touch screen is comprising steps of provide print
The upper surface of brush workbench, the printing work platform is provided with soft cushioning;It is arranged first in the upper surface of the soft cushioning
Flexible overlapping structure, the first flexible overlapping structure include the first flexible substrates and the first flexible material layer, and described first is soft
Property substrate is located at the upper surface of the soft cushioning, and first flexible material layer is located at the upper surface of first flexible substrates,
The upper surface of first flexible material layer is formed with multiple first groove structures;Seed ink is prepared, the seed ink
Preparation method includes the following steps: to provide iron powder and the first organic solvent, will be described in the iron powder and part under reducing atmosphere
First organic solvent is uniformly mixed, to obtain the first mixture;High molecular polymer, the second organic solvent and deaeration agent are provided,
The high molecular polymer, second organic solvent and the deaeration agent are mixed to obtain the second mixture;Nanometer is provided
The nano-silica powder and part second mixture are uniformly mixed by silicon dioxide powder with first mixture,
To obtain third mixture;The third mixture is ground, so that the nano-silica powder is filled with the iron powder
Tap touching, with obtain include the iron powder of surface coated silica layer slurry;Described first is continuously added into the slurry
Organic solvent, second mixture and auxiliary agent are simultaneously uniformly mixed and obtain the seed ink;The seed ink is placed in
The upper surface of first flexible material layer;The seed ink is scratched using blade coating tool, so that the seed
Ink, which is filled in each first groove structure, forms the first seed layer;Based on first seed layer in first groove
The first metal wire is formed in structure, first metal wire is interconnected to form the first metal grill;First flexible overlapping
Structure, first seed layer and first metal grill collectively form driving layer structure;In the upper of the driving layer structure
Surface forms the first transparent optical glue-line;The second flexible overlapping structure is set in the upper surface of the soft cushioning, described second is soft
Property laminated construction include the second flexible substrates and the second flexible material layer, second flexible substrates are located at the upper of the soft cushioning
Surface, second flexible material layer are located at the upper surface of second flexible substrates, the upper table of second flexible material layer
Face is formed with multiple second groove structures;The seed ink is placed in the upper surface of second flexible material layer, uses institute
It states blade coating tool to scratch the seed ink, so that the seed ink is filled in each second groove structure
Form second of sublayer;Based on second of sublayer in forming the second metal wire in each second groove structure, described
Two metal wires are interconnected to form the second metal grill;The second flexible overlapping structure, second of sublayer and described
Two metal grills collectively form inductive layer structure;The inductive layer structure is adhered on to the upper table of the first transparent optical glue-line
Face;The second transparent optical glue-line is formed in the upper surface of the inductive layer structure;Cover transparent sheet is provided, the cover transparent sheet is pasted
It is placed in the upper surface of the second transparent optical glue-line.In the preparation method of touch screen of the invention, the first seed layer is being prepared
And when second of sublayer, the first flexible overlapping structure and the second flexible overlapping structure are placed in the printing for being provided with soft cushioning respectively
The upper surface of workbench carries out the blade coating of seed ink, due to the presence of soft cushioning, is carrying out seed oil using blade coating tool
When the blade coating of ink, under the action of scratching pressure, soft cushioning can absorb the factor of printing work platform part out-of-flatness, to keep away
Exempt from seed ink in the first flexible material layer and the residual of the second flexible material layer surface, it is ensured that first is flexible after the completion of blade coating
The cleannes of the upper surface of material layer and the upper surface of the second flexible material layer do not need additional pre- solid to the progress of seed ink
The step of change and the step of cleaned to the upper surface of the first flexible material layer and the upper surface of the second flexible material layer, thus
Process flow is simplified, production cost is reduced;Using iron powder as raw material in seed ink prepared by the present invention, iron dust is in low-priced
Metal can reduce production cost;Iron powder surface in seed ink prepared by the present invention is coated with silicon oxide layer, i.e. this hair
Iron powder surface in bright the first seed layer and second of sublayer is coated with silicon oxide layer, and silicon dioxide layer passes through physical absorption
Effect is adsorbed in the surface of iron powder, has the characteristic persistently coated, and silicon dioxide layer has repulsive interaction to oxygen, can prevent
Contact of the oxygen with iron powder, so that iron powder maintains higher reproducibility, can be kept away to guarantee the zeroth order chemical valence state of iron powder
Exempt from the first metal wire and the second metal wire broken string formed based on first seed layer and second of sublayer, so that it is guaranteed that being formed
The first metal grill and the second metal grill performance, and then ensure the performance of touch screen;Seed ink is prepared in the present invention
When, first iron powder is added in the first organic solvent and is uniformly mixed under reducing atmosphere, so that iron powder surface sufficiently infiltrates
First organic solvent can contact to avoid iron powder with oxygen in subsequent preparation process, so that iron powder be avoided to be oxidized;The present invention
In when preparing seed ink, third mixture is ground using three-roll grinder, grinding rate is very fast, and yield is high, energy consumption
It is lower;When preparing seed ink in the present invention, first high molecular polymer is dissolved in after the second organic solvent then at nano-silica
SiClx powder is added together into the first mixture, since high molecular polymer has been dissolved in the second organic solvent, will not be broken
The first organic solvent is gone bad to the cladding of iron powder, so as to avoid iron powder from being oxidized;When preparing seed ink in the present invention, first will
High molecular polymer is dissolved in after the second organic solvent obtains mixed solution, adds the oxygen dissolved in deaeration agent removal mixed liquor
It is so incensed that the second mixture, later the second mixture is just added to the first mixture together with nano-silica powder and forms the
Three mixtures so that it is guaranteed that not having oxygen presence in third mixture, and then avoid iron powder from being oxidized.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (15)
1. a kind of preparation method of touch screen, which is characterized in that the preparation method of the touch screen comprising steps of
Printing work platform is provided, the upper surface of the printing work platform is provided with soft cushioning;
The first flexible overlapping structure is set in the upper surface of the soft cushioning, the first flexible overlapping structure includes first flexible
Substrate and the first flexible material layer, first flexible substrates are located at the upper surface of the soft cushioning, first flexible material
Layer is located at the upper surface of first flexible substrates, and the upper surface of first flexible material layer is formed with multiple first groove knots
Structure;
Seed ink is prepared, the preparation method of the seed ink includes the following steps:
Iron powder and the first organic solvent are provided, mix the iron powder with part first organic solvent under reducing atmosphere
It is even, to obtain the first mixture;
High molecular polymer, the second organic solvent and deaeration agent are provided, by the high molecular polymer, second organic solvent
And the deaeration agent mixing is to obtain the second mixture;
Nano-silica powder is provided, the nano-silica powder and part second mixture are mixed with described first
Object is uniformly mixed, to obtain third mixture;
The third mixture is ground, so that the nano-silica powder comes into full contact with the iron powder, to obtain
The slurry of iron powder including surface coated silica layer;
First organic solvent, second mixture and auxiliary agent are continuously added into the slurry and is uniformly mixed obtains
The seed ink;
The seed ink is placed in the upper surface of first flexible material layer;Using blade coating tool to the seed ink into
Row blade coating, so that the seed ink, which is filled in each first groove structure, forms the first seed layer;
It is mutually interconnected based on first seed layer in forming the first metal wire, first metal wire in first groove structure
It connects to form the first metal grill;The first flexible overlapping structure, first seed layer and first metal grill are common
Constitute driving layer structure;
The first transparent optical glue-line is formed in the upper surface of the driving layer structure;
The second flexible overlapping structure is set in the upper surface of the soft cushioning, the second flexible overlapping structure includes second flexible
Substrate and the second flexible material layer, second flexible substrates are located at the upper surface of the soft cushioning, second flexible material
Layer is located at the upper surface of second flexible substrates, and the upper surface of second flexible material layer is formed with multiple second groove knots
Structure;
The seed ink is placed in the upper surface of second flexible material layer, using the blade coating tool to the seed oil
Ink is scratched, so that the seed ink, which is filled in each second groove structure, forms second of sublayer;
Based on second of sublayer in forming the second metal wire in each second groove structure, second metal wire is mutual
Connection forms the second metal grill;The second flexible overlapping structure, second of sublayer and second metal grill are total
With composition inductive layer structure;
The inductive layer structure is adhered on to the upper surface of the first transparent optical glue-line;
The second transparent optical glue-line is formed in the upper surface of the inductive layer structure;
Cover transparent sheet is provided, the cover transparent sheet is adhered on to the upper surface of the second transparent optical glue-line.
2. the preparation method of touch screen according to claim 1, it is characterised in that: the printing work platform includes metal
Workbench;The soft cushioning includes liner of Shao A hardness between 30 degree~80 degree, and the thickness of the soft cushioning includes 0.5
Millimeter~10 millimeters.
3. the preparation method of touch screen according to claim 1, it is characterised in that: to positioned at first flexible material
During the seed ink of the upper surface of layer is scratched, the blade coating tool is upper with first flexible material layer
The angle on surface includes 30 °~70 °, and blade coating pressure includes 4 Kgfs of every square centimeter~6 Kgfs of every square centimeter, blade coatings
Speed include 50 millimeters it is per second~260 millimeters it is per second;In the seed to the upper surface for being located at second flexible material layer
During ink is scratched, the angle of the upper surface of the blade coating tool and second flexible material layer includes 30 °~
70 °, blade coating pressure include 4 Kgfs it is every square centimeter~6 Kgfs it is every square centimeter, blade coating speed include 50 millimeters it is per second~
260 millimeters per second.
4. the preparation method of touch screen according to claim 3, it is characterised in that: the partial size of the iron powder is received including 0.2
Rice~5 microns, the partial size of the nano-silica powder is less than 100 nanometers.
5. the preparation method of touch screen according to claim 1, it is characterised in that: in first mixture, described
The mass ratio of one organic solvent and the iron powder includes 0.5~10;In the third mixture, the nano-silica powder with
The mass ratio of the iron powder includes 0.1~3.
6. the preparation method of touch screen according to claim 1, it is characterised in that: offer high molecular polymer, second have
Solvent and deaeration agent mix the high molecular polymer, second organic solvent and the deaeration agent to obtain second
Mixture includes the following steps:
The high molecular polymer and second organic solvent are provided, the high molecular polymer, which is added to described second, to be had
It is stirred in solvent and at least heating is until the high molecular polymer is completely dissolved to obtain mixed solution;
The deaeration agent is provided, the deaeration agent is added into the mixed solution, stir and vacuumizes the removal mixing
The oxygen dissolved in solution.
7. the preparation method of touch screen according to claim 1, it is characterised in that: by the high molecular polymer be added to
The temperature heated after in second organic solvent includes 40 DEG C~90 DEG C;The high molecular polymer is dissolved completely in described
Continue heating 5 hours~10 hours after in two organic solvents.
8. the preparation method of touch screen according to claim 7, which is characterized in that remove the oxygen dissolved in the solution
During, environment where the solution is evacuated to negative pressure, and pressure maintaining 2 hours~3 hours.
9. the preparation method of touch screen according to claim 1, which is characterized in that first organic solvent and described
Two organic solvents include: ethyl acetate, butanone, dipropylene glycol methyl ether ester acid esters, butyl carbitol acetate, diethylene glycol second
Ether, propylene glycol monomethyl ether ester acid esters, ethyl alcohol, α terpinol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol methyl ether, dipropylene glycol
Propyl ether, propylene glycol propyl ether, propandiol butyl ether, dipropylene, tripropylene glycol butyl ether, propylene glycol phenylate, dipropylene glycol diformazan
Ether, propylene glycol diacetate, amyl acetate mixture, n-butyl acetate, isobutyl acetate, n-propyl acetate, isopropyl acetate,
N-butyl propionate, 3- ethoxyl ethyl propionate, dibutyl phthalate, n-pentyl propionate, n propyl propionate, dibasic acid ester,
Acetone, beta-terpineol, hexylene glycol, amyl alcohol mixture, n-butanol, isobutanol, isopropanol, diisobutyl carbinol (DIBC), methyl-isobutyl
Methanol, 2- methyl butanol, n-amyl alcohol, normal propyl alcohol or Exxal 12;The high molecular polymer includes: polyurethane, poly- carbonic acid
Ester, polyvinyl chloride, polymethyl methacrylate, phenoxy resin, polyester, ethylene copolymer;The deaeration agent includes: high-carbon alcohols
Organic compound, polyethers organic compound or silicon class organic compound;The auxiliary agent includes: Cationic aid, anion
Type auxiliary agent, non-ionic auxiliary agent or amphoteric auxiliary agent.
10. the preparation method of touch screen according to claim 1, which is characterized in that by three-roll grinder by described
Three mixtures are ground, and in process of lapping, spacing includes 1 micron~25 microns between roller.
11. the preparation method of touch screen according to claim 1, it is characterised in that: the depth of first groove structure
Including 1 micron~20 microns, the width of first groove structure includes 1 micron~10 microns;First metal wire and institute
State the depth that the sum of thickness of the first seed layer is less than or equal to first groove structure, the width of first metal wire and institute
State the of same size of the first groove structure;The depth of second groove structure includes 1 micron~20 microns, second groove
The width of structure includes 1 micron~10 microns;Second metal wire and the sum of the thickness of second of sublayer are less than or equal to
The depth of second groove structure, the width of second metal wire are of same size with second groove structure.
12. the preparation method of touch screen according to claim 1, it is characterised in that: first transparent optical cement includes
OCA optical cement, second transparent optical cement include OCA optical cement, and the cover transparent sheet includes transparent glass.
13. the preparation method of touch screen according to claim 1, which is characterized in that
While the upper surface of first flexible material layer forms first groove structure, the first flexible material of Yu Suoshu
The upper surface of layer forms first lead groove, and the first lead groove is connected with first groove structure;Described first
Seed layer is formed simultaneously in first groove structure and in the first lead groove;In shape in first groove structure
While at first metal wire, first lead is formed in Yu Suoshu first lead groove, the first lead and described the
One metal wire is connected;
While the upper surface of second flexible material layer forms second groove structure, the second flexible material of Yu Suoshu
The upper surface of layer forms the second lead groove, and the second lead groove is connected with second groove structure;Described second
Seed layer is formed simultaneously in second groove structure and in the second lead groove;In shape in second groove structure
While at second metal wire, the second lead is formed in the second lead of Yu Suoshu groove, second lead and described the
Two metal wires are connected.
14. the preparation method of touch screen according to claim 13, which is characterized in that the cover transparent sheet is adhered on institute
Stating behind the upper surface of the second transparent optical glue-line further includes following steps:
Flexible circuit board and processing chip are provided;
The flexible circuit board is coupled into company with first metal grill, second metal grill and the processing chip
It connects, so that first metal grill and second metal grill are via the flexible circuit board and processing chip electricity
Connection.
15. according to claim 1 to the preparation method of touch screen described in any one of 14, which is characterized in that the seed oil
Ink includes following component by mass percentage:
Surface is coated with silicon oxide the iron powder 10%~90% of layer;
High molecular polymer 5%~50%;
Organic solvent 10%~50%;
Auxiliary agent 0.1%~10%;
Defrother 0.01%~10%.
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WO2020177736A1 (en) * | 2019-03-06 | 2020-09-10 | 苏州蓝沛光电科技有限公司 | Method for preparing touch screen |
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