CN110055439A - Electronic component manufacture high-ductility thermal crack resistant brass alloys and its preparation process - Google Patents
Electronic component manufacture high-ductility thermal crack resistant brass alloys and its preparation process Download PDFInfo
- Publication number
- CN110055439A CN110055439A CN201910489123.9A CN201910489123A CN110055439A CN 110055439 A CN110055439 A CN 110055439A CN 201910489123 A CN201910489123 A CN 201910489123A CN 110055439 A CN110055439 A CN 110055439A
- Authority
- CN
- China
- Prior art keywords
- brass alloys
- electronic component
- crack resistant
- thermal crack
- component manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Abstract
The invention discloses a kind of electronic component manufacture high-ductility thermal crack resistant brass alloys, including following component (by mass percentage): CU:65~70%, Al:8~10%, Fe:5~7%, Bi:1~3%, Se:0.1~0.3%, Sn:3~7%, Mn:0.7~0.9%, surplus Zn.The invention also discloses a kind of preparation processes of electronic component manufacture high-ductility thermal crack resistant brass alloys, comprising the following steps: step 1: ingredient, step 2: melting, step 3: drop stamping, step 4: pickling and heat treatment and step 5: annealing.High-purity selenium and high purity tin is added in the present invention, changeable precipitation form and distribution situation of the bismuth in brass, form frangible compounds with the elements such as copper, zinc, bismuth and be distributed in crystal boundary and transgranular, make bismuth with it is blocky or it is spherical be present in crystal boundary, improve the plasticity and heat crack resistance of brass alloys.
Description
Technical field
The present invention relates to electronic component manufacture high-ductility thermal crack resistant brass alloys correlative technology field, in particular to one
Kind electronic component manufacture high-ductility thermal crack resistant brass alloys and its preparation process.
Background technique
Ledrite has good cutting ability and preferable hot and cold processing performance, is widely used in water heating bathroom, electronics
The fields such as electric appliance, horological instruments.However the lead in brass easily dissolves out, and all has biggish harm to human body and environment.Currently, state
A kind of interior brass not yet can substitute ledrite comprehensively, and the field for substituting ledrite is extremely limited.Bismuth and lead are in the periodic table of elements
In there are many similarities in adjacent position, physics and chemical property, at present to the lead-free reflow with bismuth for lead
Most study.Make a general survey of various researchs of the domestic and international experts and scholars to Bi brass, there are addition element type it is more (Sn, Fe, Sb, Ni,
Al, Si, Se, Te, P, La, Ce), the problems such as additional amount is larger, cost of material is high and industrial applications are difficult.Therefore, one kind is invented
Electronic component manufacture is solved the above problems necessary with high-ductility thermal crack resistant brass alloys and its preparation process.
Summary of the invention
The purpose of the present invention is to provide a kind of electronic component manufacture high-ductility thermal crack resistant brass alloys and its preparations
Technique, to solve the problems mentioned in the above background technology.
To achieve the above object, the invention provides the following technical scheme: a kind of manufacture high-ductility heat resistanceheat resistant of electronic component
Split brass alloys, including following component (by mass percentage): CU:65~70%, Al:8~10%, Fe:5~7%, Bi:1~
3%, Se:0.1~0.3%, Sn:3~7%, Mn:0.7~0.9%, surplus Zn.
Preferably, including following component (by mass percentage): CU:65%, Al:10%, Fe:5%, Bi:3%, Se:
0.1%, Sn:7%, Mn:0.9%, surplus Zn.
Preferably, including following component (by mass percentage): CU:67%, Al:9%, Fe:6%, Bi:2%, Se:
0.2%, Sn:5%, Mn:0.8%, surplus Zn.
Preferably, including following component (by mass percentage): CU:70%, Al:8%, Fe:7%, Bi:1%, Se:
0.3%, Sn:3%, Mn:0.7%, surplus Zn.
A kind of electronic component manufacture preparation process of high-ductility thermal crack resistant brass alloys, comprising the following steps:
Step 1: ingredient ingredient: is carried out according to the component of brass alloy material；
Step 2: it melting: will be added in antivacuum electric induction furnace with the copper and aluminium got ready first, in crystalline graphite powder conduct
Under the protection of coverture, 1000~1200 DEG C are warming up to, after copper is completely melt, iron is added, is warming up to 1600~1700 DEG C, to
After iron is completely melt, zinc is added, 10~15min is kept the temperature, finally sequentially adds high-purity selenium, high purity tin, high purity bismuth and high-purity manganese,
Electromagnetic agitation is used after selenium, tin, bismuth and manganese are completely melt, stirs molten bath, and water cooling continuous casting is carried out after stirring evenly, obtains brass alloys
Ingot casting；
Step 3: drop stamping: being heated to 250~350 DEG C for mold, after graphite lubrication, on 63~65 tonnes of forging beds
By brass alloys ingot casting punch forming, the extruded stock of all kinds of profiles is obtained；
Step 4: pickling and heat treatment: above-mentioned extruded stock is put into pickling tube, 30~50min is stood, then 300
The heat treatment of 2~4h is carried out at a temperature of~450 DEG C；
Step 5: annealing: the above-mentioned profile after Overheating Treatment is placed in annealing furnace, 200~300 DEG C at a temperature of
Stress relief annealing is carried out, soaking time is controlled in 0.5~1.5h, and straightening processing is then carried out on straightening equipment.
Preferably, in the step 3, before drop stamping, brass alloys ingot casting surface oxide layer is first removed.
Technical effect and advantage of the invention: the present invention substitutes harmful lead element using bismuth element, is conducive to environment guarantor
Shield and human health；Melting is carried out using antivacuum electric induction furnace, is directly added into the elements such as copper, aluminium, zinc, selenium, selenium, bismuth and manganese,
Melting intermediate alloy is not needed, preparation method is simple；High-purity selenium and high purity tin is added in the present invention, and analysis of the bismuth in brass can be changed
Form and distribution situation out form frangible compounds with the elements such as copper, zinc, bismuth and are distributed in crystal boundary and transgranular, make bismuth with blocky or
It is spherical to be present in crystal boundary, improve the plasticity and heat crack resistance of brass alloys.
Specific embodiment
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
Embodiment 1:
A kind of electronic component manufacture high-ductility thermal crack resistant brass alloys, including following component (by mass percentage):
CU:65%, Al:10%, Fe:5%, Bi:3%, Se:0.1%, Sn:7%, Mn:0.9%, surplus Zn.
A kind of electronic component manufacture preparation process of high-ductility thermal crack resistant brass alloys, which is characterized in that including with
Lower step:
Step 1: ingredient ingredient: is carried out according to the component of brass alloy material；
Step 2: it melting: will be added in antivacuum electric induction furnace with the copper and aluminium got ready first, in crystalline graphite powder conduct
Under the protection of coverture, 1000 DEG C are warming up to, after copper is completely melt, iron is added, is warming up to 1600 DEG C, is completely melt to iron
Afterwards, zinc is added, 10min is kept the temperature, high-purity selenium, high purity tin, high purity bismuth and high-purity manganese is finally sequentially added, when selenium, tin, bismuth and manganese
Electromagnetic agitation is used after being completely melt, stirs molten bath, and water cooling continuous casting is carried out after stirring evenly, obtains brass alloys ingot casting；
Step 3: drop stamping: before drop stamping, brass alloys ingot casting surface oxide layer is first removed, mold is heated to
250 DEG C, after graphite lubrication, by brass alloys ingot casting punch forming on 63 tonnes of forging beds, obtain the extruded stock of all kinds of profiles；
Step 4: pickling and heat treatment: above-mentioned extruded stock is put into pickling tube, 30min is stood, then at 300 DEG C
At a temperature of carry out 2h heat treatment；
Step 5: annealing: the above-mentioned profile after Overheating Treatment is placed in annealing furnace, 200 DEG C at a temperature of carry out
Stress relief annealing, soaking time are controlled in 0.5h, and straightening processing is then carried out on straightening equipment.
Embodiment 2:
A kind of electronic component manufacture high-ductility thermal crack resistant brass alloys, including following component (by mass percentage):
CU:67%, Al:9%, Fe:6%, Bi:2%, Se:0.2%, Sn:5%, Mn:0.8%, surplus Zn.
A kind of electronic component manufacture preparation process of high-ductility thermal crack resistant brass alloys, comprising the following steps:
Step 1: ingredient ingredient: is carried out according to the component of brass alloy material；
Step 2: it melting: will be added in antivacuum electric induction furnace with the copper and aluminium got ready first, in crystalline graphite powder conduct
Under the protection of coverture, 1100 DEG C are warming up to, after copper is completely melt, iron is added, is warming up to 1650 DEG C, is completely melt to iron
Afterwards, zinc is added, 13min is kept the temperature, high-purity selenium, high purity tin, high purity bismuth and high-purity manganese is finally sequentially added, when selenium, tin, bismuth and manganese
Electromagnetic agitation is used after being completely melt, stirs molten bath, and water cooling continuous casting is carried out after stirring evenly, obtains brass alloys ingot casting；
Step 3: drop stamping: before drop stamping, brass alloys ingot casting surface oxide layer is first removed, mold is heated to
300 DEG C, after graphite lubrication, by brass alloys ingot casting punch forming on 64 tonnes of forging beds, obtain the extruded stock of all kinds of profiles；
Step 4: pickling and heat treatment: above-mentioned extruded stock is put into pickling tube, 40min is stood, then at 400 DEG C
At a temperature of carry out 3h heat treatment；
Step 5: annealing: the above-mentioned profile after Overheating Treatment is placed in annealing furnace, 250 DEG C at a temperature of carry out
Stress relief annealing, soaking time are controlled in 1h, and straightening processing is then carried out on straightening equipment.
Embodiment 3:
A kind of electronic component manufacture high-ductility thermal crack resistant brass alloys, including following component (by mass percentage):
CU:70%, Al:8%, Fe:7%, Bi:1%, Se:0.3%, Sn:3%, Mn:0.7%, surplus Zn.
A kind of electronic component manufacture preparation process of high-ductility thermal crack resistant brass alloys, comprising the following steps:
Step 1: ingredient ingredient: is carried out according to the component of brass alloy material；
Step 2: it melting: will be added in antivacuum electric induction furnace with the copper and aluminium got ready first, in crystalline graphite powder conduct
Under the protection of coverture, 1200 DEG C are warming up to, after copper is completely melt, iron is added, is warming up to 1700 DEG C, is completely melt to iron
Afterwards, zinc is added, 15min is kept the temperature, high-purity selenium, high purity tin, high purity bismuth and high-purity manganese is finally sequentially added, when selenium, tin, bismuth and manganese
Electromagnetic agitation is used after being completely melt, stirs molten bath, and water cooling continuous casting is carried out after stirring evenly, obtains brass alloys ingot casting；
Step 3: drop stamping: before drop stamping, brass alloys ingot casting surface oxide layer is first removed, mold is heated to
350 DEG C, after graphite lubrication, by brass alloys ingot casting punch forming on 65 tonnes of forging beds, obtain the extruded stock of all kinds of profiles；
Step 4: pickling and heat treatment: above-mentioned extruded stock is put into pickling tube, 50min is stood, then at 450 DEG C
At a temperature of carry out 4h heat treatment；
Step 5: annealing: the above-mentioned profile after Overheating Treatment is placed in annealing furnace, 300 DEG C at a temperature of carry out
Stress relief annealing, soaking time are controlled in 1.5h, and straightening processing is then carried out on straightening equipment.
Electronic component manufacture high-ductility thermal crack resistant brass alloys can be made by above three groups of embodiments, wherein
The manufacture of electronic component made from second group of embodiment is best with high-ductility thermal crack resistant brass alloys effect, and the present invention is using bismuth member
Element substitutes harmful lead element, is conducive to environmental protection and human health；Melting is carried out using antivacuum electric induction furnace, is directly added
Enter the elements such as copper, aluminium, zinc, selenium, selenium, bismuth and manganese, do not need melting intermediate alloy, preparation method is simple.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features,
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (6)
1. a kind of electronic component manufacture high-ductility thermal crack resistant brass alloys, which is characterized in that (press quality including following component
Percentage): CU:65~70%, Al:8~10%, Fe:5~7%, Bi:1~3%, Se:0.1~0.3%, Sn:3~7%,
Mn:0.7~0.9%, surplus Zn.
2. a kind of electronic component manufacture high-ductility thermal crack resistant brass alloys according to claim 1, which is characterized in that
Including following component (by mass percentage): CU:65%, Al:10%, Fe:5%, Bi:3%, Se:0.1%, Sn:7%, Mn:
0.9%, surplus Zn.
3. a kind of electronic component manufacture high-ductility thermal crack resistant brass alloys according to claim 1, which is characterized in that
Including following component (by mass percentage): CU:67%, Al:9%, Fe:6%, Bi:2%, Se:0.2%, Sn:5%, Mn:
0.8%, surplus Zn.
4. a kind of electronic component manufacture high-ductility thermal crack resistant brass alloys according to claim 1, which is characterized in that
Including following component (by mass percentage): CU:70%, Al:8%, Fe:7%, Bi:1%, Se:0.3%, Sn:3%, Mn:
0.7%, surplus Zn.
5. a kind of electronic component manufacture as described in claim 1-4 preparation process of high-ductility thermal crack resistant brass alloys,
Characterized by comprising the following steps:
Step 1: ingredient ingredient: is carried out according to the component of brass alloy material；
Step 2: it melting: will be added in antivacuum electric induction furnace with the copper and aluminium got ready first, in crystalline graphite powder as covering
Under the protection of agent, 1000~1200 DEG C are warming up to, after copper is completely melt, iron is added, is warming up to 1600~1700 DEG C, it is complete to iron
After running down, zinc is added, 10~15min is kept the temperature, finally sequentially adds high-purity selenium, high purity tin, high purity bismuth and high-purity manganese, when
Selenium, tin, bismuth and manganese use electromagnetic agitation after being completely melt, stir molten bath, and water cooling continuous casting is carried out after stirring evenly, and obtain brass alloys casting
Ingot；
Step 3: drop stamping: being heated to 250~350 DEG C for mold, will be yellow on 63~65 tonnes of forging beds after graphite lubrication
Copper alloy casting ingot punch forming obtains the extruded stock of all kinds of profiles；
Step 4: pickling and heat treatment: above-mentioned extruded stock is put into pickling tube, 30~50min is stood, then 300~450
The heat treatment of 2~4h is carried out at a temperature of DEG C；
Step 5: annealing: the above-mentioned profile after Overheating Treatment is placed in annealing furnace, 200~300 DEG C at a temperature of carry out
Stress relief annealing, soaking time are controlled in 0.5~1.5h, and straightening processing is then carried out on straightening equipment.
6. a kind of electronic component manufacture high-ductility thermal crack resistant brass alloys according to claim 5 and its preparation work
Skill, it is characterised in that: in the step 3, before drop stamping, first remove brass alloys ingot casting surface oxide layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910489123.9A CN110055439A (en) | 2019-06-06 | 2019-06-06 | Electronic component manufacture high-ductility thermal crack resistant brass alloys and its preparation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910489123.9A CN110055439A (en) | 2019-06-06 | 2019-06-06 | Electronic component manufacture high-ductility thermal crack resistant brass alloys and its preparation process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110055439A true CN110055439A (en) | 2019-07-26 |
Family
ID=67325572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910489123.9A Pending CN110055439A (en) | 2019-06-06 | 2019-06-06 | Electronic component manufacture high-ductility thermal crack resistant brass alloys and its preparation process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110055439A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102918182A (en) * | 2010-04-15 | 2013-02-06 | 米巴·格来特来格有限公司 | Multi-layer plain bearing having an anti-fretting layer |
| CN103930576A (en) * | 2011-09-30 | 2014-07-16 | 株式会社豊山 | Leadless free-cutting copper alloy and method for producing same |
| CN104831116A (en) * | 2015-05-16 | 2015-08-12 | 四川鑫炬矿业资源开发股份有限公司 | Environment-friendly easy-cutting hot-cracking-resistant selenium-bismuth brass material and preparation process thereof |
| CN105039777A (en) * | 2015-05-05 | 2015-11-11 | 宁波博威合金材料股份有限公司 | Machinable brass alloy and preparation method thereof |
| CN105908012A (en) * | 2016-05-13 | 2016-08-31 | 四川鑫炬矿业资源开发股份有限公司 | Environment-friendly lead-free easily-cutting anti-heat-cracking brass alloy material and preparation method thereof |
-
2019
- 2019-06-06 CN CN201910489123.9A patent/CN110055439A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102918182A (en) * | 2010-04-15 | 2013-02-06 | 米巴·格来特来格有限公司 | Multi-layer plain bearing having an anti-fretting layer |
| CN103930576A (en) * | 2011-09-30 | 2014-07-16 | 株式会社豊山 | Leadless free-cutting copper alloy and method for producing same |
| CN105039777A (en) * | 2015-05-05 | 2015-11-11 | 宁波博威合金材料股份有限公司 | Machinable brass alloy and preparation method thereof |
| CN104831116A (en) * | 2015-05-16 | 2015-08-12 | 四川鑫炬矿业资源开发股份有限公司 | Environment-friendly easy-cutting hot-cracking-resistant selenium-bismuth brass material and preparation process thereof |
| CN105908012A (en) * | 2016-05-13 | 2016-08-31 | 四川鑫炬矿业资源开发股份有限公司 | Environment-friendly lead-free easily-cutting anti-heat-cracking brass alloy material and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101328522B (en) | Smelting production method of low activation martensitic steel for fusion reactor | |
| CN107022723B (en) | The big big substance 12Cr2Mo1VR steel plate of specification and its production method | |
| CN105950931A (en) | High-strength and high-hardness magnesium alloy in controllable reaction with water, and manufacturing method of component thereof | |
| CN102925753B (en) | Nickel-copper alloy with high strength and high corrosion resistance and manufacturing method thereof | |
| CN109266901A (en) | A kind of preparation method of Cu15Ni8Sn high-strength wearable rod of metal alloy/silk | |
| CN104328304B (en) | Copper alloy for high-strength and high-conductivity lead and preparation method of copper alloy | |
| CN108998635A (en) | The preparation method of anti-oxidant electrothermal alloy | |
| CN112646995A (en) | Production method of 6061T651 aluminum alloy plate | |
| CN106399861B (en) | For the alloy and its forging method of the 8th grade of partition board outer shroud of high pressure | |
| CN104831116B (en) | A kind of environment-protective free-cutting thermal crack resistant selenium Bi brass material and its preparation technology | |
| CN106399751A (en) | Preparing method for high-strength and high-conductivity copper alloy | |
| CN107805744B (en) | The manufacturing method of aluminium foil, the electronic component circuit board for having used it and aluminium foil | |
| CN110227892A (en) | A kind of 5 line aluminium alloy welding wire preparation methods containing rare earth element nd and Ce | |
| CN110055439A (en) | Electronic component manufacture high-ductility thermal crack resistant brass alloys and its preparation process | |
| CN107217204B (en) | A kind of preparation method of Fe-Mn-Al systems alloy | |
| CN106191552B (en) | It is a kind of can anodic oxidation pack alloy preparation method | |
| CN104032173A (en) | High-strength tin-brass alloy material and preparation method thereof | |
| CN104032169B (en) | A kind of containing cerium lead-free easy-to-cut zinc-white copper alloy material and preparation method thereof | |
| CN102029306A (en) | Method for manufacturing copper zinc alloy wire | |
| KR20140022941A (en) | Copper alloy of gold color and method of manufacturing the same | |
| CN103757476A (en) | Magnesium-bismuth brass alloy material and preparation method thereof | |
| CN107586980B (en) | A kind of multielement rare earth alloying high-conductivity copper alloy and preparation method thereof | |
| CN109396381B (en) | Physical modification semi-solid state die-casting preparation method of high-heat-conductivity baking tray | |
| CN108504904A (en) | A kind of high-strength temperature-resistant cond aluminium silk and preparation method thereof | |
| CN108950330B (en) | A kind of high thermal stability aluminium alloy and its preparation process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190726 |
|
| RJ01 | Rejection of invention patent application after publication |