CN110039057A - A kind of densification method and densification device - Google Patents
A kind of densification method and densification device Download PDFInfo
- Publication number
- CN110039057A CN110039057A CN201910483797.8A CN201910483797A CN110039057A CN 110039057 A CN110039057 A CN 110039057A CN 201910483797 A CN201910483797 A CN 201910483797A CN 110039057 A CN110039057 A CN 110039057A
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- China
- Prior art keywords
- accommodating chamber
- gas
- occurring source
- densification
- main body
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
- B22F3/15—Hot isostatic pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
- B22F3/15—Hot isostatic pressing
- B22F2003/153—Hot isostatic pressing apparatus specific to HIP
Abstract
The application provides a kind of densification method and densification device, is related to hot isostatic pressing technique field.Densification method includes: to be placed in workpiece to be processed and gas occurring source in the accommodating chamber of processing main body, and accommodating chamber is sealed；Accommodating chamber after sealing is internally heated, so that gas occurring source generates gas and reaches preset pressure in accommodating chamber；The gas that gas occurring source generates is the gas not reacted with workpiece to be processed.Densification device includes internal sealing structure, workpiece to be processed and the gas occurring source with accommodating chamber；Workpiece to be processed is placed in accommodating chamber；Gas occurring source is placed in accommodating chamber；The inside of accommodating chamber can be heated mechanism heats so that gas occurring source generates gas reaches preset pressure in accommodating chamber.Since gas occurring source is placed in accommodating chamber, then without being passed through gas into accommodating chamber by other special equipments, pressure can be formed in accommodating chamber while heating, has saved equipment cost.
Description
Technical field
This application involves hot isostatic pressing technique fields, in particular to a kind of densification method and densification
Processing unit.
Background technique
Heat and other static pressuring processes are that product is placed in the container of sealing, apply to product each to same pressure, are applied simultaneously
With high temperature, under the influence of high pressure and temperature, product is able to be sintered and densify.
Currently, heat and other static pressuring processes are carried out by dedicated hot isostatic apparatus, needing will by dedicated equipment
Gas is passed into high-pressure bottle, these equipment prices are costly.
Summary of the invention
The embodiment of the present application is designed to provide a kind of densification technique and densification device, it is intended to solve
Certainly the technical issues of existing hot isostatic apparatus somewhat expensive.
In a first aspect, the embodiment of the present application provides a kind of densification method, comprising: by workpiece to be processed and gas
Body occurring source is placed in the accommodating chamber of processing main body, and accommodating chamber is sealed；Accommodating chamber after sealing is internally heated, so that
Gas occurring source generates gas and reaches preset pressure in accommodating chamber；Gas occurring source generate gas be not with work to be processed
The gas of part reaction.
During above-mentioned realization, first workpiece to be processed and gas occurring source are placed in accommodating chamber, and accommodating chamber is close
Envelope then forms a confined space in accommodating chamber.Gas when being heated to the processing main body after sealing, in accommodating chamber
Body occurring source generates gas under heating conditions, and gas forms pressure in closed accommodating chamber, and workpiece to be processed is closed
Accommodating chamber in be sintered and densify under the conditions of certain pressure and temperature.During this, since gas occurring source is
It is placed in accommodating chamber, then without being passed through gas into accommodating chamber by other special equipments, can hold while heating
It receives intracavitary formation pressure, has saved equipment cost.
In a kind of possible embodiment, the gas that gas occurring source generates includes inert gas, nitrogen and titanium dioxide
At least one of carbon.
During above-mentioned realization, the chemical property torpescence of inert gas, nitrogen and carbon dioxide, will not with wait locate
Science and engineering part reacts.
In a kind of possible embodiment, gas occurring source includes dry ice, liquid nitrogen, liquid argon, liquid helium, liquid neon and calcium carbonate
Any one or more of.
During above-mentioned realization, dry ice and calcium carbonate can generate carbon dioxide gas in a certain temperature conditions.
Liquid nitrogen, liquid argon, liquid helium and liquid neon can generate nitrogen, argon gas, helium and neon respectively in a certain temperature conditions.In addition,
Any the two in carbon dioxide gas, nitrogen, argon gas, helium and neon or both is formed above in closed accommodating chamber
It will not react.
In a kind of possible embodiment, after accommodating chamber is sealed, it is internally heated to the accommodating chamber after sealing
Before, it will first be vacuumized inside accommodating chamber.
During above-mentioned realization, the to be processed workpiece more active for chemical property, by first to closed receiving
Chamber vacuumizes, and can take out the air in accommodating chamber, and workpiece to be processed is avoided to be oxidized under certain temperature and pressure.
In a kind of possible embodiment, the step of being internally heated to the accommodating chamber after sealing includes: that will seal
Processing main body afterwards is heated in heated at constant temperature mechanism, handles the material of main body as high-intensitive Heat Conduction Material.
During above-mentioned realization, since the material of processing main body is high-intensitive Heat Conduction Material, then by the processing after sealing
When main body is heated in heated at constant temperature mechanism, processing main body has conductive force, can transfer heat in accommodating chamber,
So that reaching certain temperature in accommodating chamber, and the gas occurring source in accommodating chamber is made to generate gas.
It in a kind of possible embodiment, is heated inside accommodating chamber by heating mechanism, heating mechanism includes adding
Thermal element, heating element are mounted on inside accommodating chamber, and the material for handling main body is high temperature resistant heat insulation material.
During above-mentioned realization, accommodating chamber is internally heated by heating mechanism, so that reaching one in accommodating chamber
Fixed temperature, and the gas occurring source in accommodating chamber is made to generate gas.Since the material of processing main body is high temperature resistant heat insulation material
Matter, then handling main body can be retained in heat in accommodating chamber, avoid heat loss.
In a kind of possible embodiment, the accommodating chamber after sealing is internally heated, so that gas occurring source produces
Angry body simultaneously reaches after preset pressure carries out densification to workpiece to be handled in accommodating chamber, further includes: will be in accommodating chamber
Portion cooled down, pressure release.
During above-mentioned realization, since gas is in the case where temperature is higher, the pressure in certain volume is bigger.To
After handling workpiece densification, is first cooled down and carry out being depressured the generation that can reduce safety accident again.
Second aspect, the embodiment of the present application provide a kind of densification device comprising inside has the close of accommodating chamber
Seal structure, workpiece to be processed and gas occurring source；Workpiece to be processed is placed in accommodating chamber；Gas occurring source is placed in accommodating chamber
It is interior；The inside of accommodating chamber can be heated mechanism heats so that gas occurring source generates gas reaches default pressure in accommodating chamber
Power.
During above-mentioned realization, when in use, accommodating chamber inside is heated by heating mechanism, so that gas occurring source
It generates gas and reaches preset pressure in accommodating chamber, the workpiece to be processed under the heating temperature and pressure condition, in accommodating chamber
It is sintered and densifies.During this, since gas occurring source is placed in accommodating chamber, then without dedicated being set by other
It is standby that gas is passed through into accommodating chamber, pressure can be formed in accommodating chamber while heating, saved equipment cost.
In a kind of possible embodiment, sealing structure includes processing main body and end cap, and processing body interior, which has, to be held
Receive chamber, for end cap for that will handle body seal, the outer surface for handling the junction of main body and end cap forms v-notch.
It needs to cool down after workpiece densification to be processed, pressure release, then by workpiece to be processed from accommodating intracavitary taking-up, by
V-notch is formed in the outer surface of processing main body and the junction of end cap, then facilitates and separates end cap with processing main body, thus will
Workpiece to be processed takes out.
Detailed description of the invention
Technical solution in ord to more clearly illustrate embodiments of the present application will make below to required in the embodiment of the present application
Attached drawing is briefly described, it should be understood that the following drawings illustrates only some embodiments of the application, therefore should not be seen
Work is the restriction to range, for those of ordinary skill in the art, without creative efforts, can be with
Other relevant attached drawings are obtained according to these attached drawings.
Fig. 1 is the flow chart of densification method provided by the embodiments of the present application；
Fig. 2 is the structural schematic diagram of sealing structure provided by the embodiments of the present application；
Fig. 3 is the control flow chart of heating mechanism provided by the embodiments of the present application.
Icon: 10- sealing structure；11- handles main body；111-V type notch；12- end cap；13- workpiece to be processed；14- gas
Ware occurs for body；151- heating element；152- power supply device；153- temperature sense module；154- control module.
Specific embodiment
To keep the purposes, technical schemes and advantages of embodiment of the present invention clearer, implement below in conjunction with the present invention
The technical solution in embodiment of the present invention is clearly and completely described in attached drawing in mode, it is clear that described reality
The mode of applying is some embodiments of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ability
Domain those of ordinary skill every other embodiment obtained without creative efforts, belongs to the present invention
The range of protection.The person that is not specified actual conditions in embodiment, carries out according to conventional conditions or manufacturer's recommended conditions.Examination used
Production firm person is not specified in agent or instrument, is the conventional products that can be obtained by commercially available purchase.
The embodiment of the present application provides a kind of densification technique and densification device, it is intended to solve existing heat
The technical issues of equal pressing equipment somewhat expensive.
Referring to Fig.1 and 2, the present embodiment provides a kind of densification methods, comprising:
S1, workpiece 13 to be processed and gas occurring source are placed in the accommodating chamber of processing main body 11, accommodating chamber is sealed.
Referring to figure 2., illustratively, the shape of the processing main body 11 in the embodiment of the present application is in cuboid, and inside has
Accommodating chamber, is also cuboid inside accommodating chamber, and the opposite end of processing main body 11 all has the opening being connected to accommodating chamber, passes through
The opening sealing for handling 11 both ends of main body can be sealed accommodating chamber.It should be noted that the opening at processing 11 both ends of main body
Bore be greater than workpiece 13 to be processed size, with facilitate by workpiece 13 to be processed put into processing main body 11 accommodating chamber in.Separately
Outside, two openings that processing main body 11 is opened may not be the case where being oppositely arranged.It is understood that processing main body 11 can also
With only one opening or open up more than two openings, the present embodiment to the quantity of opening without limitation.
It should be noted that the shape of processing main body 11 is also possible to other shapes, such as spherical shape.The application leads processing
The shape of body 11 is not specifically limited.In addition, the shape inside accommodating chamber is optionally spherical shape, spheroid shape etc., the application is to place
The shape of reason main body 11 is also not specifically limited.
It illustratively, is by the way that two end caps 12 are separately mounted to the two of processing main body 11 in embodiments herein
The opening at end, by welding by two end caps 12 and processing main body 11 outer wall carry out welding to by accommodating chamber into
Row sealing.It is understood that being also possible to connect the outer wall of end cap 12 and processing main body 11 by multiple screw bolt and nut
It connects, and sealing joint strip is set before the outer wall and end cap 12 of processing main body 11, to achieve the effect that seal accommodating chamber.It needs
It is noted that the mode that the application seals accommodating chamber is not specifically limited, as long as can seal accommodating chamber.
Further, in a kind of embodiment of the application, gas occurring source is placed on gas and occurs to put in ware 14
The gas for being equipped with gas occurring source occurs ware 14 and is placed in accommodating chamber.It should be noted that the gas of the embodiment of the present application
Occurring source is liquid either solid-state, only can just generate gas at a temperature of being heated to certain.
S2, the accommodating chamber after sealing is internally heated, so that gas occurring source generates gas and reaches in accommodating chamber
To preset pressure；The gas that gas occurring source generates is the gas not reacted with workpiece 13 to be processed.
It should be noted that embodiments herein to heating method without limitation, whether through heating sealing after
It handles main body 11 and heating element 151 is still installed in accommodating chamber, accommodating chamber inside is heated as long as can be realized.
In a kind of possible embodiment, the step of being internally heated to the accommodating chamber after sealing includes: that will seal
Processing main body 11 afterwards is heated in heated at constant temperature mechanism, and the material of processing main body 11 is high-intensitive Heat Conduction Material.
Illustratively, heated at constant temperature mechanism can choose heated at constant temperature case or the heat-treatment furnace with temperature incubation function.It is permanent
The heating temperature of warm heating mechanism can reach preset temperature.In embodiments herein, optionally, actual heating temperature
It can float within the scope of ± 10 DEG C of preset temperature.
In addition, high-intensitive Heat Conduction Material refers to capable of thering is higher intensity under the high temperature conditions, and with thermally conductive fast
Performance.Illustratively, the high-intensitive Heat Conduction Material of the present embodiment can choose steel or nickel-base alloy.
In alternatively possible embodiment, heated inside accommodating chamber by heating mechanism, heating mechanism includes
Heating element 151, heating element 151 are mounted on inside accommodating chamber, and the material of processing main body 11 is high temperature resistant heat insulation material.
Heating mechanism includes the heating element 151 and power supply device 152 being electrically connected.Illustratively, heating element 151 can
To select heating tube or heating film.When selecting heating tube, heating tube can be placed directly in accommodating chamber, when selection heating film
When, heating film can be attached to the inner wall of accommodating chamber.Referring to figure 3., it can be powered to heating element 151 by power supply device 152,
Accommodating chamber is heated so that heating element 151 distributes heat.Illustratively, power supply device 152 passes through with heating element 151
Cable connection, processing main body 11 open up mounting hole, and power supply device 152 is mounted on outside processing main body 11, and cable passes through mounting hole
It is electrically connected with heating element 151 and power supply device 152.In addition, the size of mounting hole is matched with the size of cable, cable is just
Mounting hole can be passed through and be mounted hole and blocked.It, can also be between cable outer wall and the inner wall of mounting hole in order to increase leakproofness
Sealing ring is installed.
Illustratively, heating mechanism further includes constant temperature controller, can control heating temperature by constant temperature controller.Constant temperature
Controller includes the temperature sense module 153 and control module 154 being electrically connected, control module 154 and 152 signal of power supply device
Connection.
Temperature sense module 153 is used to detect the temperature in accommodating chamber and the temperature signal is passed to control module 154,
Control module 154 receives the temperature signal and judges whether the temperature reaches preset temperature, if not reaching preset temperature,
It then controls power supply device 152 to power to heating element 151, if reaching preset temperature, controls power supply device 152 and heating unit
Part 151 powers off, to control heating temperature.
In addition.One disconnecting switch is set between power supply device 152 and heating element 151, and heating element 151 is by should be every
Pass is left to couple with power supply device 152.Wherein, disconnecting switch can be switching tube, relay, and meet according to control module
154 control instructions sent remove to control the component of the requirement of the on/off electricity between a certain component and power supply.
Wherein, temperature sense module 153 can be temperature sensor, which can be commonly uses on the market at present
Temperature sensor, for example, thermocouple, thermistor, resistance temperature detector (RTD) and IC temperature sensor etc..Wherein, hot
Quick resistance can select the thermistor temperature sensor of MF12 series, MF53 series or MZ11 series.
In addition, control module 154 can be general processor, general processor includes central processing unit (Central
Processing Unit, CPU), network processing unit (Network Processor, NP) etc.；It can also be Digital Signal Processing
Device (Digital Signal Processing, DSP), specific integrated circuit (Application Specific
Integrated Circuit, ASIC), ready-made programmable gate array (Field Programmable Gate Array, FPGA)
Either other programmable logic device, discrete gate or transistor logic, discrete hardware components.Wherein, general processor
It can be microprocessor or be also possible to any conventional processor etc..
In addition, high temperature resistant heat insulation material is optionally by two layers of steel and the silicide heat insulation foam being located between two layers of steel
It is made.Optionally, the silicide heat insulation foam between two layers of steel is alternatively at expansion polyphenyl plate or polyurethane foam material.
The gas that gas occurring source generates is the gas not reacted with workpiece 13 to be processed, in the embodiment of the present application, gas
The gas that body occurring source generates includes at least one of inert gas, nitrogen and carbon dioxide.Illustratively, inert gas packet
Include argon gas, helium and neon.It should be noted that if the embodiment of the present application, without specified otherwise, at least one refers to one kind, two
Kind is two or more.It can be understood that inert gas can be in inert gas when gas occurring source has inert gas
One kind, two or more.
In addition, any one of dry ice, liquid nitrogen, liquid argon, liquid helium, liquid neon and calcium carbonate or several may be selected in gas occurring source
Kind.Several to refer to two or more it should be noted that if the embodiment of the present application is without specified otherwise.
It is understood that the amount used when gas occurring source be it is constant, heating temperature be it is constant, inside accommodating chamber
Volume be it is constant, then according to Clapyron Equation formula: PV=nRT accommodated in pressure gauge formula: P=nRT/V.Its
In, n indicates to accommodate the content of intracavity gas, and R is constant (constant), and T is the temperature in accommodating chamber, and V is the volume of capacity chamber.Then
The densification under preset pressure, preset temperature can be realized with to workpiece to be handled 13.
Similarly, preset pressure and preset temperature are set before use, then it can be according to Clapyron Equation formula:
N is calculated in PV=nRT, so as to calculate the merging amount of gas occurring source according to the raw material difference of gas occurring source.
In a kind of possible embodiment, after accommodating chamber is sealed, it is internally heated to the accommodating chamber after sealing
Before, it will first be vacuumized inside accommodating chamber.
Illustratively, the side wall for handling main body 11 is equipped with vacuum pumping valve.When needing being vacuumized inside accommodating chamber, open
Vacuum pumping valve closes vacuum pumping valve after exhausting, and processing can be internally heated to accommodating chamber.
S3, the accommodating chamber after sealing is internally heated, so that gas occurring source generates gas and reaches in accommodating chamber
To after preset pressure to workpiece to be handled 13 progress densifications, further includes: will be cooled down inside accommodating chamber, pressure release.
When the mode that the processing main body 11 after sealing is heated in selection in heated at constant temperature mechanism, to accommodating chamber
The mode of internal cooling can choose following several:
1) after the power-off of heated at constant temperature mechanism, the processing main body 11 after sealing is also placed on cold with furnace in heated at constant temperature mechanism
But.
2) after the power-off of heated at constant temperature mechanism, the processing main body 11 after sealing is taken out out of heated at constant temperature mechanism and is placed in air
Middle progress is air-cooled or progress water cooling, oil are cold or air-cooled.
It, can be with to accommodating chamber internal cooling when the mode that heating element 151 is installed in selection in accommodating chamber is heated
It selects mode below: after heating element 151 powers off, it is cold or air-cooled that the processing main body 11 after sealing being subjected to air-cooled water cooling, oil.
It should be noted that the mode to cool down to accommodating chamber inside is not limited to above scheme.
In addition, carrying out pressure release to accommodating chamber inside after the completion of cooling.Illustratively, processing main body 11 is opened after cooling
Hole carries out pressure release.It can be carried out using bench drill when aperture.
After the completion of pressure release, end cap 12 can be cut with processing main body 11 so that end cap 12 is separated with processing main body 11, so
The workpiece after densification is taken out afterwards.It is appreciated that being also possible to directly cut processing main body 11.
The present embodiment also provides a kind of densification device comprising inside have accommodating chamber sealing structure 10, to
Handle workpiece 13 and gas occurring source；Workpiece 13 to be processed is placed in accommodating chamber (referring to Fig. 2)；Gas occurring source is placed in receiving
It is intracavitary；The inside of accommodating chamber can be heated mechanism heats so that gas occurring source generates gas reaches default in accommodating chamber
Pressure.
Illustratively, gas occurring source is located in gas and occurs in ware 14, and gas occurs ware 14 and is placed on accommodating chamber
It is interior.It is understood that directly gas occurring source can also be placed in accommodating chamber.
To be heated inside accommodating chamber in outside heating sealing structure 10 it should be noted that heating mechanism can be,
It is also possible to directly heat inside accommodating chamber.
When the selection sealing structure 10 of portion's heating outside makes the heating method being heated inside accommodating chamber, heating mechanism can
Heated at constant temperature case or the heat-treatment furnace with temperature incubation function are selected, the material of sealing structure 10 is high-intensitive Heat Conduction Material.It is high
Intensity Heat Conduction Material refers to capable of thering is higher intensity under the high temperature conditions, and has thermally conductive fast performance.Illustratively, originally
The high-intensitive Heat Conduction Material of embodiment can choose steel or nickel-base alloy.
Since the material of sealing structure 10 is high-intensitive Heat Conduction Material, then sealing structure 10 carries out in heated at constant temperature mechanism
When heating, sealing structure 10 has conductive force, can transfer heat in accommodating chamber, so that reaching in accommodating chamber certain
Temperature, and the gas occurring source in accommodating chamber is made to generate gas.
When selection directly heats inside accommodating chamber, illustratively, heating mechanism includes the heating element 151 being electrically connected
With power supply device 152 (referring to Fig. 3).In addition, heating mechanism further includes constant temperature controller, constant temperature controller includes being electrically connected
Temperature sense module 153 and control module 154, control module 154 are connect with 152 signal of power supply device.The material of sealing structure 10
Matter is high temperature resistant heat insulation material, and high temperature resistant heat insulation material is optionally by two layers of steel and the silicide being located between two layers of steel
Heat insulation foam, expansion polyphenyl plate or polyurethane foam material are made.To the knot of this kind of heating mechanism in densification technique
Structure, working principle are described, and therefore, details are not described herein.
Further, in a kind of possible embodiment, sealing structure 10 includes processing main body 11 and end cap 12, processing
There is accommodating chamber, end cap 12 is sealed for that will handle main body 11, the junction of processing main body 11 and end cap 12 inside main body 11
Outer surface forms v-notch 111 (referring to Fig. 2).
Wherein, it handles main body 11 and the connection relationship of end cap 12 has been described in densification technique, specifically, ask
Referring to above description, details are not described herein.Illustratively, the bore of v-notch 111 be from the appearance of sealing structure 10 towards
What inner surface was gradually reduced, it is separated with facilitating from v-notch 111 by the excision of end cap 12 with processing main body 11.
It is understood that sealing structure 10 is also possible to an overall structure, when needing to take out workpiece after pressure release, directly
It connects and cuts sealing structure 10.
The foregoing is merely the preferred embodiment of the present invention, are not intended to restrict the invention, for this field
For technical staff, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any
Modification, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of densification method characterized by comprising
Workpiece to be processed and gas occurring source are placed in the accommodating chamber of processing main body, the accommodating chamber is sealed；
The accommodating chamber after sealing is internally heated, so that the gas occurring source generates gas and in the accommodating chamber
Inside reach preset pressure；The gas that the gas occurring source generates is the gas not reacted with the workpiece to be processed.
2. densification method according to claim 1, which is characterized in that the gas packet that the gas occurring source generates
Include at least one of inert gas, nitrogen and carbon dioxide.
3. densification method according to claim 2, which is characterized in that the gas occurring source includes dry ice, liquid
Any one or more of nitrogen, liquid argon, liquid helium, liquid neon and calcium carbonate.
4. densification method according to claim 1, which is characterized in that after accommodating chamber sealing, to close
Before the accommodating chamber being honored as a queen is internally heated, it will first be vacuumized inside the accommodating chamber.
5. densification method according to claim 1-4, which is characterized in that described after described pair of sealing
The step of accommodating chamber is internally heated includes: to heat the processing main body after sealing in heated at constant temperature mechanism,
The material of the processing main body is high-intensitive Heat Conduction Material.
6. densification method according to claim 1-4, which is characterized in that pass through inside the accommodating chamber
Heating mechanism is heated, and the heating mechanism includes heating element, and the heating element is mounted on inside accommodating chamber, the place
The material for managing main body is high temperature resistant heat insulation material.
7. densification method according to claim 1-4, which is characterized in that the receiving after sealing
Chamber is internally heated, so that the gas occurring source generates gas and reaches preset pressure in accommodating chamber to described to be processed
After workpiece carries out densification, further includes: will be cooled down inside the accommodating chamber, pressure release.
8. a kind of densification device, characterized in that it comprises:
Inside has the sealing structure of accommodating chamber；
Workpiece to be processed, the workpiece to be processed are placed in the accommodating chamber；And
Gas occurring source, the gas occurring source are placed in the accommodating chamber；
The inside of the accommodating chamber can be heated mechanism heats so that the gas occurring source generates gas in the receiving
It is intracavitary to reach preset pressure.
9. densification device according to claim 8, which is characterized in that the sealing structure include processing main body and
End cap, the processing body interior have the accommodating chamber, and the end cap is used for the processing body seal, the processing master
The outer surface of the junction of body and the end cap forms v-notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910483797.8A CN110039057A (en) | 2019-06-04 | 2019-06-04 | A kind of densification method and densification device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910483797.8A CN110039057A (en) | 2019-06-04 | 2019-06-04 | A kind of densification method and densification device |
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| CN110039057A true CN110039057A (en) | 2019-07-23 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022088707A1 (en) * | 2020-10-30 | 2022-05-05 | 嘉思特华剑医疗器材(天津)有限公司 | Oxide layer-containing zirconium-niobium alloy partitioned bone trabecula femoral condyle prosthesis and preparation method |
-
2019
- 2019-06-04 CN CN201910483797.8A patent/CN110039057A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022088707A1 (en) * | 2020-10-30 | 2022-05-05 | 嘉思特华剑医疗器材(天津)有限公司 | Oxide layer-containing zirconium-niobium alloy partitioned bone trabecula femoral condyle prosthesis and preparation method |
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Application publication date: 20190723 |
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