CN110034246A - The polyimide film method for repairing and mending of Organic Light Emitting Diode - Google Patents
The polyimide film method for repairing and mending of Organic Light Emitting Diode Download PDFInfo
- Publication number
- CN110034246A CN110034246A CN201910004875.1A CN201910004875A CN110034246A CN 110034246 A CN110034246 A CN 110034246A CN 201910004875 A CN201910004875 A CN 201910004875A CN 110034246 A CN110034246 A CN 110034246A
- Authority
- CN
- China
- Prior art keywords
- polyimide film
- polyimides
- repairing
- defect
- mending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000004642 Polyimide Substances 0.000 claims abstract description 38
- 230000007547 defect Effects 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 230000008439 repair process Effects 0.000 claims abstract description 7
- 238000007711 solidification Methods 0.000 claims abstract description 4
- 230000008023 solidification Effects 0.000 claims abstract description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 150000002466 imines Chemical class 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/861—Repairing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
A kind of polyimide film method for repairing and mending of Organic Light Emitting Diode includes: providing a polyimide film；Judge the polyimide film with the presence or absence of a defect；If so, defining the coordinate position of the defect；A laser beam is issued according to the coordinate position of the defect to form an opening；Polyimides liquid is attached with coating needle to be coated in the opening, and the surface of the polyimides liquid is made to protrude from the surface of the polyimide film；The polyimides liquid is solidified with infrared ray roasting mode, the polyimides liquid after solidification forms a polyimides and repairs block；And polyimides repairing block is ground, flush the surface of polyimides repairing block with the surface of the polyimide film；Whereby, so that the polyimide film and the polyimides is repaired block and be integrally formed a flat surfaces, with the progress of sharp subsequent technique, and then effectively improve product yield.
Description
Technical field
The present invention is a kind of related film method for repairing and mending, particularly relates to the polyimide film repairing side of Organic Light Emitting Diode
Method.
Background technique
The structure of Organic Light Emitting Diode (OLED) is to carry out phase on the PI film for substrate with polyimide film (PI film)
The technique for closing element (such as: semiconductor material layer, electrode, dielectric layer ... etc.).As shown in figure 3, the PI layer 30 can the side of coating
Formula is formed on a glass substrate 31, and only the coating of the PI layer 30 is there may be defect, the defect can for protrusion foreign matter 32,
Surface protrusion 34, coat inside bubble 35 or the recess 36 swelled by bubble 33, the defect is probably led when carrying out subsequent technique
Technique and product failure, the problem for causing yield too low is caused to occur.
Summary of the invention
In view of this, the main object of the present invention is to provide a kind of polyimide film repairing side of Organic Light Emitting Diode
Method is to carry out defects detection and repairing to polyimide film, avoids defective effect subsequent technique.
The polyimide film method for repairing and mending of Organic Light Emitting Diode includes in the present invention:
One polyimide film is provided；
Judge the polyimide film with the presence or absence of a defect；If so, defining the coordinate position of the defect；
A laser beam is issued according to the coordinate position of the defect, the polyimide film is made to form an opening；
Polyimides liquid is attached with coating needle and is coated on the opening, and the surface of the polyimides liquid is made to protrude from the polyamides
The surface of imines film；
The polyimides liquid is solidified with infrared ray roasting mode, the polyimides liquid after solidification forms a polyamides
Imines repairs block；And
Polyimides repairing block is ground, keeps the surface of polyimides repairing block and the surface of the polyimide film neat
It is flat.
Method for repairing and mending according to the present invention can remove after the defect of polyimide film and be filled up, and made after repairing
The surface of polyimides repairing block is flushed with the surface of the polyimide film, and the polyimide film and the polyimides repair block
A flat surfaces are integrally formed, the element of subsequent technique can be formed on the flat surfaces, and then effectively improve product yield.
For above and other objects, features and advantages of the invention can be clearer and more comprehensible, preferred embodiment is cited below particularly,
And cooperate institute's accompanying drawings, it is described in detail below.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1: the flow diagram of the embodiment of polyimide film method for repairing and mending of the present invention.
Fig. 2A to Fig. 2 E: the floor map of each step of polyimide film method for repairing and mending of the present invention.
Fig. 3: the defect schematic diagram of known polyimide film.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the polyimide film method for repairing and mending of Organic Light Emitting Diode of the present invention can be executed in a film repairing machine,
Referring to FIG. 1, the method includes the steps of:
Step S01: a polyimides (Polyimide, PI) film is provided.As shown in Figure 2 A, in the embodiment of the present invention, this is poly-
Acid imide film 10 may be formed on a glass substrate 11, but is not limited with glass substrate 11.
Step S02: judge the polyimide film 10 with the presence or absence of a defect；If so, defining the coordinate position of the defect.
In the embodiment of the present invention, it can judge that the polyimide film whether there is defect by image identification means by film repairing machine, this
For the common knowledge in technical field, for example, film repairing machine can be clapped using image-taking device (such as digital camera)
The surface of the polyimide film is taken the photograph to generate a visual field (Field Of View, FOV) image, image is carried out to the field image
Identification only will herein be described in detail with judging whether there is defect.
Step S03: a laser beam is issued according to the coordinate position of the defect, Fig. 2A is please referred to, makes the polyimide film
10 form an opening 100.It, can be by the laser generator of film repairing machine according to the coordinate bit of the defect in the embodiment of the present invention
It sets and issues the laser beam, this is the common knowledge in technical field.
Step S04: please referring to Fig. 2 B, attaches polyimides liquid 21 with coating needle 20 and is coated in the opening 100, please join
Fig. 2 C is examined, and the surface 210 of the polyimides liquid 21 is made to protrude from the surface 101 of the polyimide film 10.The embodiment of the present invention
In, coating needle 20 is mountable in film repairing machine, is the coordinate position according to the defect so that polyimides liquid 21 is coated on this
In opening 100.
Step S05: solidifying the polyimides liquid with infrared ray roasting mode, please refers to Fig. 2 D, being somebody's turn to do after solidification
Polyimides liquid forms a polyimides and repairs block 22, and the surface 220 of polyimides repairing block 22 also protrudes from polyamides Asia
The surface 101 of amine film 10.In the embodiment of the present invention, the baking temperature of infrared ray baking is less than or equal to 500 degree Celsius, preferably
Baking temperature range be more than or equal to 100° centigrade and be less than or equal to 500 degree Celsius.
Step S06: please referring to Fig. 2 E, grinds polyimides repairing block 22, the polyimides repairing block after making grinding
22 surfaces 220 are flushed with the surface 101 of the polyimide film 10.In the embodiment of the present invention, due to the thickness of the polyimide film 10
Degree is it is known that user can allow the polyimides after grinding to repair block 22 in grinding technics to board setting grinding stroke
Surface 220 is flushed with the surface 101 of the polyimide film 10, completes repairing work.
In conclusion the polyimides repairs surface 220 and the polyimide film 10 of block 22 after completing repairing work
Surface 101 flushes, and so that the polyimide film 10 and the polyimides is repaired block 22 and is integrally formed a flat surfaces, the flat surfaces
It waits the technique of elements to run smooth for Subsequent semiconductor material layer, electrode, dielectric layer ..., and then effectively improves product yield.
Specific embodiment is applied in the present invention, and principle and implementation of the present invention are described, above embodiments
Explanation be merely used to help understand method and its core concept of the invention；At the same time, for those skilled in the art,
According to the thought of the present invention, there will be changes in the specific implementation manner and application range, in conclusion in this specification
Appearance should not be construed as limiting the invention.
Claims (3)
1. a kind of polyimide film method for repairing and mending of Organic Light Emitting Diode, characterized by comprising:
One polyimide film is provided；
Judge the polyimide film with the presence or absence of a defect；If so, defining the coordinate position of the defect；
A laser beam is issued according to the coordinate position of the defect, the polyimide film is made to form an opening；
Polyimides liquid coating is attached in the opening with coating needle, and it is described to protrude from the surface of the polyimides liquid
The surface of polyimide film；
The polyimides liquid is solidified with infrared ray roasting mode, the polyimides liquid after solidification forms a polyamides
Imines repairs block；And
The polyimides repairing block is ground, keeps the surface of the polyimides repairing block and the surface of the polyimide film neat
It is flat.
2. the polyimide film method for repairing and mending of Organic Light Emitting Diode according to claim 1, which is characterized in that with red
In the step of outside line roasting mode solidifies the polyimides liquid, baking temperature is less than or equal to 500 degree Celsius.
3. the polyimide film method for repairing and mending of Organic Light Emitting Diode according to claim 1, which is characterized in that with red
In the step of outside line roasting mode solidifies the polyimides liquid, baking temperature range is more than or equal to Celsius 100
It spends and less than or equal to 500 degree Celsius.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107100384A TWI655800B (en) | 2018-01-04 | 2018-01-04 | Polyimide film repair method for organic light emitting diode |
| TW107100384 | 2018-01-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110034246A true CN110034246A (en) | 2019-07-19 |
Family
ID=66996195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910004875.1A Pending CN110034246A (en) | 2018-01-04 | 2019-01-03 | The polyimide film method for repairing and mending of Organic Light Emitting Diode |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110034246A (en) |
| TW (1) | TWI655800B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102358063B1 (en) * | 2020-05-18 | 2022-02-04 | (주)미래컴퍼니 | Appratus for removing thin film and method for removing thin film |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1716043A (en) * | 2004-06-28 | 2006-01-04 | Ntn株式会社 | Correcting device for micro pattern and defect correcting method for micro pattern |
| CN103969855A (en) * | 2014-04-18 | 2014-08-06 | 京东方科技集团股份有限公司 | Method for repairing display substrate, display substrate and display device |
| US20140217383A1 (en) * | 2013-02-07 | 2014-08-07 | Samsung Display Co., Ltd. | Flexible display device and method for manufacturing flexible display device |
| WO2015133090A1 (en) * | 2014-03-07 | 2015-09-11 | 株式会社Ｊｏｌｅｄ | Method for repairing bank, organic el display device, and method for manufacturing same |
| CN106098966A (en) * | 2016-06-29 | 2016-11-09 | 京东方科技集团股份有限公司 | A kind of thin film and restorative procedure, display base plate and preparation method thereof |
| CN106238906A (en) * | 2015-06-08 | 2016-12-21 | 灿美工程股份有限公司 | Prosthetic device and restorative procedure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015109136A (en) * | 2012-03-14 | 2015-06-11 | 旭硝子株式会社 | Organic led element, translucent substrate and translucent substrate manufacturing method |
-
2018
- 2018-01-04 TW TW107100384A patent/TWI655800B/en active
-
2019
- 2019-01-03 CN CN201910004875.1A patent/CN110034246A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1716043A (en) * | 2004-06-28 | 2006-01-04 | Ntn株式会社 | Correcting device for micro pattern and defect correcting method for micro pattern |
| US20140217383A1 (en) * | 2013-02-07 | 2014-08-07 | Samsung Display Co., Ltd. | Flexible display device and method for manufacturing flexible display device |
| WO2015133090A1 (en) * | 2014-03-07 | 2015-09-11 | 株式会社Ｊｏｌｅｄ | Method for repairing bank, organic el display device, and method for manufacturing same |
| CN103969855A (en) * | 2014-04-18 | 2014-08-06 | 京东方科技集团股份有限公司 | Method for repairing display substrate, display substrate and display device |
| CN106238906A (en) * | 2015-06-08 | 2016-12-21 | 灿美工程股份有限公司 | Prosthetic device and restorative procedure |
| CN106098966A (en) * | 2016-06-29 | 2016-11-09 | 京东方科技集团股份有限公司 | A kind of thin film and restorative procedure, display base plate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI655800B (en) | 2019-04-01 |
| TW201931635A (en) | 2019-08-01 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190719 |