CN110031032B - Sensor head and method for producing a sensor head - Google Patents
Sensor head and method for producing a sensor head Download PDFInfo
- Publication number
- CN110031032B CN110031032B CN201811520878.2A CN201811520878A CN110031032B CN 110031032 B CN110031032 B CN 110031032B CN 201811520878 A CN201811520878 A CN 201811520878A CN 110031032 B CN110031032 B CN 110031032B
- Authority
- CN
- China
- Prior art keywords
- receptacle
- sensor
- sensor element
- sensor head
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 230000008878 coupling Effects 0.000 claims description 21
- 238000010168 coupling process Methods 0.000 claims description 21
- 238000005859 coupling reaction Methods 0.000 claims description 21
- 239000000945 filler Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 12
- 230000004308 accommodation Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 239000000523 sample Substances 0.000 description 10
- 238000001746 injection moulding Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 235000019589 hardness Nutrition 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000005355 Hall effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/142—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage using Hall-effect devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
- G01P3/42—Devices characterised by the use of electric or magnetic means
- G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
- G01P3/42—Devices characterised by the use of electric or magnetic means
- G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
- G01P3/48—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
- G01P3/481—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
- G01P3/42—Devices characterised by the use of electric or magnetic means
- G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
- G01P3/48—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
- G01P3/481—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals
- G01P3/488—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals delivered by variable reluctance detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/029—Welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/142—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage using Hall-effect devices
- G01D5/145—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage using Hall-effect devices influenced by the relative movement between the Hall device and magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
Abstract
The invention relates to a sensor head (1) comprising at least one receptacle (4) in the form of a through-opening of the sensor head (1) and at least one sensor element (7) which is received in the receptacle (4). The receptacle (4) is closed on both sides of the through-opening thereof by means of a cover plate (2, 3). The invention further relates to a method for producing a sensor head.
Description
Technical Field
The present invention relates to a sensor head and a method for manufacturing a sensor head.
Background
The publication DE 19828598 a1 discloses a rotation detection device with a housing body having a head section, a mounting bearing section and a connecting section. A groove section is formed on a side surface of the head section. The magnet, hall effect structural element and circuit substrate are mounted into the groove section and then covered with a seal.
Disclosure of Invention
The sensor head according to the invention comprises at least one receptacle in the form of a through opening of the sensor head. At least one sensor element is accommodated in an accommodation of the sensor head. The receptacle is closed on one side of its through-opening by means of a cover. The sensor head can be, for example, an injection-molded part, which has a through-opening that is free in the component formed by the injection-molding process. The sensor element, for example an ASIC or an IC, can be accommodated in the accommodation. Such sensor elements can be, for example, sensor elements based on AMR technology, GMR technology, TMR technology or hall technology. One of the open sides of the receptacle is closed by a cover, which may be a film or a cover, for example, that is to say a cover having a different hardness or flexibility. The provision of a sensor head with two open sides improves the possibilities of assembly of the sensor, in particular the possibility of the receptacle being provided with the sensor element and the sensor element being positioned inside the receptacle. Furthermore, the protection of the sensor element is ensured by the receptacle closed on one side. The assembly is simpler and faster to carry out overall.
In a further embodiment, the sensor head has at least two busbars which project into a receptacle of the sensor head. In this way, it is ensured that the sensor element accommodated in the accommodation can be electrically contacted and electrical signals can be conducted out of the accommodation and can project into the accommodation. In this way, the sensor element can be supplied with power and communication of the sensor element with a connected control device can be achieved.
In an advantageous embodiment, the sensor head has a sensor element, which is connected in an electrically conductive manner to the busbar in the receptacle. The sensor element here establishes a connection to the busbar by means of a coupling element. In this way, the sensor element is inserted with its coupling element into the receptacle, so that the coupling element can already be brought into contact with or against the busbar during insertion. This enables a simple assembly.
In one embodiment of the sensor head, the receptacle is filled with a filler material, wherein the filler material surrounds the sensor element, the coupling element and the busbar. In this case, the elements may be completely surrounded by the filler or may be only partially surrounded by the filler. By partially enclosing is meant that an element, such as the sensor element or its coupling element, is not completely filled or enclosed by the filler material, but rather is partially not enclosed. It can be stated with regard to the busbar that the busbar, as long as it is located in the receptacle, can likewise be only partially surrounded by the filler. The part of the busbar which does not project into the receptacle, for example, is not surrounded by the filler. The advantage of filling the receptacle with the filler is that the electronic component is supported, held in the receptacle and at the same time protected. The filler can be present in the form of a silicone or in the form of a resin.
It is also possible that the filling material does not completely fill the receptacle, but rather that the region of the receptacle is released in a targeted manner.
In one embodiment of the sensor head, the remaining side of the through-opening of the receptacle is also closed by a further cover. In an advantageous manner, the molded receptacle, which is already closed on one side, can then also be closed on the other side, so that the receptacle, in particular the molded region thereof, is optimally protected from external influences, wherein the receptacle is optimally accessible on one or both open sides before the closure of the receptacle, so that the insertion, alignment and contacting of the sensor element can be easily achieved.
In a further embodiment of the sensor head, the bus bar is made of a stamped component, which is spaced apart inside the receptacle of the sensor head. In this way, it is possible to initially maintain the original component, which is to be subsequently formed into the bus bar, in one piece in the production process, wherein the component is injected in an injection molding step in order to form the main body of the sensor head. The separation in the form of two separate rows of busbars without electrical connections only begins inside the receptacle of the sensor head. At this point the busbars are correctly positioned and can be easily separated. It is advantageous here if the receptacle is open on both sides and the components forming the busbar are easily accessible from both sides.
The manufacturing method according to the invention of the sensor head comprises the following steps: preparing a blank of the sensor head; receiving a sensor element into a receiving portion in the form of a through-opening of the blank; the receptacle is closed on one side of the through-opening of the receptacle by means of a cover. In this way, the blank can be easily equipped with the sensor element, wherein the receptacle of the sensor head can additionally be closed off on one side after insertion of the sensor element. The through-opening in the sensor head has the advantage that the introduced sensor element can be accessed from both sides in the interior of the receptacle in order, for example, to contact, align or introduce further components both above and below the sensor element.
Another embodiment of the method comprises the following steps: a punch member is partitioned inside the housing. Two spaced rows of busbars are produced by this separation. The bus bar is in contact with the sensor element via its coupling element. This has the advantage that the punch member can be mounted in one piece in the blank of the sensor head first in the injection molding step, wherein the punch member can then be separated into busbars in the installed state in the interior of the receptacle with a fixed orientation and position of the busbars. This step can be carried out here not only before the closure of the receptacle opening on one side, but also after the closure of the receptacle opening on one side.
In an advantageous embodiment, the production method further comprises the following steps: the receptacle is filled with a filler material, wherein the filler material at least partially surrounds the sensor element, its coupling element and the busbar. By partially enclosing is understood that an element, such as for example a sensor element or a coupling element thereof, is not completely filled or enclosed by a filler material, but rather a part thereof is not enclosed by a filler material. It is possible to ensure that the busbar, as long as it is located in the receptacle, can also be surrounded only partially by the filler. The part of the busbar which does not project into the receptacle, for example, is not surrounded by the filler. It will also be appreciated that a portion of the receptacle does not contain a filler.
In one embodiment of the method, the through-opening is closed in a step with a further cover plate on the remaining side of the receptacle. This better protects the electronic components, which are advantageously accommodated completely or partially in the filling.
Drawings
FIG. 1 discloses a rotational speed detector;
FIG. 2 shows a side view of a rotational speed detector;
FIG. 3 shows a top view of a rotational speed detector;
FIG. 4 shows another view of the rotational speed detector;
fig. 5 shows a view of the rotational speed detector in a first assembly step;
FIG. 6 shows a cut-out section of the revolution detector during assembly;
FIG. 7 shows two views of a tachometer, one in top view and one in side view;
FIG. 8 shows two further views of the revolution detector during assembly;
FIG. 9 shows two further views of the revolution detector during assembly;
fig. 10 and 11 show two further views of the revolution detector during assembly;
fig. 12 schematically shows a method of manufacturing the revolution detector.
Embodiments of the present invention are described next based on the drawings. In this case, an embodiment is described with reference to fig. 1 to 4, in which the rotational speed detector is realized in the form of a sensor with two cover plates 2, 3. This includes, of course, but is not limited to, conventional rotational speed sensors, in which only a single cover plate is provided, as will be explained in more detail below.
Fig. 5 to 11 illustrate part of the steps of the manufacturing method. In the case of a rotational speed sensor with only one cover 2, 3, there is no step of closing with a second cover (fig. 11).
Detailed Description
Fig. 1 shows a rotational speed detector 1 with a cable 10 and a fastening tab with a collar 11. The rotational speed detector 1 has a receptacle 4 for electronic components in its front section, which is closed by a cover plate 2 and by a cover plate 3. The cover plate 2 rests on the receptacle 4 for the electronic component from above in fig. 1, whereas the cover plate 3 rests on the receptacle 4 for the electronic component from below. In the illustration of fig. 1, the electronic components and their contacting with the cable 10 are not shown. It should be noted that in another embodiment of the rotational speed detector 1, only one of the cover plates 2, 3 (not shown in the figures) may be provided.
Fig. 2 shows a transparent side view of the rotational speed detector 1 shown in fig. 1. The cable 10 passes through the body 1a of the rotational speed detector 1 into the receptacle 4 for electronic components. The cable 10 can be guided in the main body la of the rotational speed probe 1 with its outer circumference, wherein the individual conductors 12a and 12b of the cable 10 reach the receptacle 4 in an uninsulated or, if appropriate, partially insulated manner. The individual wires 12a, 12b of the cable 10 are connected to the busbars 13a and 13b, respectively, for example by means of so-called crimped connections (Crimpverbindungen).
In the front region of the receptacle 4 of the rotational speed probe 1, a sensor element 7 can be seen, which is connected to the busbars 13a and 13b and thus to the lines of the cable 10 via coupling elements 15a and 15 b. Furthermore, the upper cover 2 and the lower cover 3 of the receptacle 4 can be seen, wherein in another embodiment, only one of the covers 2, 3 may be present.
Fig. 3 is a plan view of the rotational speed detector 1, wherein on the right-hand side the cable 10 reaches into the body 1a of the rotational speed detector 1. The lines 12a and 12b are connected to the busbars 13a and 13b by means of crimped connections, as already mentioned. The coupling elements 15a, 15b of the sensor element 7 are in contact with the busbars 13a, 13 b. The upper cover plate 2 of the rotational speed sensor is not shown in fig. 3, but the lower cover plate 3 can be seen. However, it is also possible to apply the upper cover 2 in a subsequent production step or, in another embodiment of the rotational speed detector, to dispense with the upper cover.
Fig. 4 shows the rotational speed detector 1 with the cable 10, the fastening tab 11, the bus bars 13a, 13b with crimped connection, the lines 12a, 12b, the upper cover 2, the lower cover 3 and the sensor element 7 connected together again in an oblique view. In a further embodiment of the rotational speed detector 1, only one of the cover plates 2, 3 may be present.
In an alternative embodiment of the rotational speed sensor, a contact-free connection of the cable 10 can be realized. Instead of the cable 10 and its lines 12a, 12b, the busbars 13a, 13b can also be guided out of the body la of the rotational speed probe 1 and then contacted outside the rotational speed probe 1. The contact can then be made again by a crimped connection or also by a plug.
The individual steps (121 to 127) of the method for producing the tachometer 1 are described next with reference to fig. 5 to 11.
Fig. 5 shows the rotational speed detector 1 as a blank, which in the exemplary embodiment shown already comprises the cable 10 and the receptacle 4. Furthermore, a conductor component 5 is shown, which has bus bars 13a, 13b with a crimped connection on one end and projects into the receptacle 4 on the other end. The wires 12a and 12b of the cable 10 are connected to the member 5 at the crimped connection. This connection region is located in a main body la of the rotational speed detector 1, which is produced, for example, by injection molding. The leading end portion of the conductor member 5 protrudes from the main body la of the revolution speed detector 1 and enters the accommodating portion 4.
Fig. 6 shows a front section of the rotational speed sensor 1, which comprises a receptacle 4. In contrast to fig. 5, the component 5 is stamped. In this way, there is no electrical connection between the bus bars 13a and 13 b. The wires 12a and 12b, which are connected to the busbars 13a and 13b, respectively, are not electrically short-circuited in this way. The part of the member 5 that is subjected to the stamping is shown by reference numeral 6. The receptacle 4 in the body la of the rotational speed probe 1 is open both upwards and downwards at this point in time. The receptacle 4 extends from one side of the speed probe 1 to the opposite side of the speed probe 1.
Fig. 7 shows a further assembly step, in which the receptacle 4 is closed by the lower cover 3. The receptacle 4 is changed from a through-opening to a closed half-shell by the lower cover 3. For this purpose, the lower cover plate 3 can be adhesively bonded, laser welded, ultrasonically welded or connected in some other way to the rotational speed detector 1, in particular to its main body la. In the upper half of the figure, the rotational speed detector 1 is seen from above, wherein the cover plate 3 is already present. The busbars 13a and 13b have been separated. Likewise, instead of cover plate 3, cover plate 2 shown in fig. 1 to 4 can also be applied on top, but this is not shown in the figures.
In a further assembly step, which is illustrated in fig. 8, the original sensor element 7 is accommodated in the rotational speed detector 1, in particular in its body la. The sensor element 7 is introduced into the receptacle 4 and arranged there. The coupling elements 15a and 15b are positioned at the busbars 13a and 13b and/or on the busbars 13a and 13 b. The step of introducing the sensor element 7 into the receptacle 4 can be carried out either before the closure of the underside of the receptacle by the cover 3 or else after the closure of the underside of the receptacle by the cover 3. The cover plate 3 can also be used as a stop for positioning the sensor element 7 if the receptacle 4 is already closed.
The same applies to the cover plate 2 when applying the cover plate 2 instead of the cover plate 3. If the cover plate 2 is applied before the sensor element 7 is introduced, the cover plate 2 can also be used as a support for the sensor element 7. The sensor element 7 can be introduced on both sides of the open receptacle 4. If the receptacle 4 is already closed on one side, the sensor element can be introduced starting from the side facing away from the respective cover 2, 3.
The precise positioning of the sensor element 7 in the receptacle 4 can be carried out by means of a positioning aid 14, in particular by means of a positioning aid 14 which is present in or is formed as part of the body la of the rotational speed probe 1. Such a positioning aid can be produced in an injection molding process during the production of the body la of the rotational speed probe 1. The positioning aid 14 can be, for example, a latching hook, a clamping rib or a positioning rib. In the upper illustration of fig. 8, it is shown how the sensor elements are introduced between the positioning aids 14. Fig. 8 shows a side view in the lower half of fig. 8 of how the sensor element 7 is introduced into the receptacle 4.
In a further assembly step, as can be seen in fig. 9, the coupling elements 15a, 15b are contacted with the busbars 13a, 13 b. The contacting can be effected here by soldering or welding. The electrical contacting can be performed by means of laser welding or resistance welding. The contact via is shown in fig. 9 by two solder points 8a and 8 b. The contacting of the coupling elements 15a, 15b with the busbars 13a and 13b can also take place before the closing of the receptacle 4 on the underside of the receptacle 4 by means of the cover 3; the contacting can likewise also take place after the receptacle 4 has been closed on the underside by means of the cover 3. The same applies to another embodiment in which the cover plate 3 is replaced by a cover plate 2.
In a further assembly step described, the region of the receptacle 4 of the rotational speed probe 1 is filled with the aid of a mass 9. For filling the receptacle 4, a silicone material can be used. The mass 9 can be, for example, a two-component silicone, which is injected in a flowing manner into the receptacle and hardens there. The masses 9 can be present with different hardnesses or elasticity. The mass 9 can then have a low hardness and be compliant to forces from the outside; but may alternatively also have a higher stiffness and only a lesser flexibility for force effects.
The mass 9 comprises a rotational speed sensor, in particular an electronic component of the sensor element 7, coupling elements 15a, 15b and busbars 13a and 13 b. In this way, the electronic components of the rotational speed detector 1 are protected from environmental influences and are supported in the rotational speed detector 1.
In an alternative embodiment, the component can also be surrounded only partially by the mass 9. This results in that regions of the sensor element 7 or the coupling elements 15a, 15b or the busbars 13a, 13b are not surrounded by the mass 9 as long as they are located in the receptacle.
In another embodiment, it is possible that the receptacle 4 is not completely filled, but rather that a part thereof, for example the gap between the mass 9 and the upper cover 2, is not filled.
The filling of the receptacle 4 with the substance 9 takes place in contrast to the cover plates 2, 3 which close the receptacle 4 on one side. According to one embodiment, as described above, an upper cover plate 2 or a lower cover plate 3 can be provided, wherein the receptacle 4 is filled with the substance 9 starting from the respective other side.
In a further assembly step, which is described with reference to fig. 11, the receptacle 4 is closed at the upper side by means of the cover 2. The receptacle 4 now contains the electronic components of the rotational speed sensor 1, which are in contact with the electrical lines leading out of the receptacle 4, and the mass 9. The mass 9 with the electronic components is accommodated in the receptacle 4 and protected from both sides by the cover plates 2, 3. The cover plates 2, 3 close the receptacle 4 on two opposite top sides, in particular on the top and bottom sides of the receptacle opening 4. In the upper part of fig. 11, the rotational speed detector is shown in a top view, wherein the cover plate 2 has been applied. In the lower half of fig. 11, it can be seen in a side view how the receptacle 4 is closed at the upper side by the cover 2 and at the lower side by the cover 3. The electronic components and the mass 9 are located between the two cover plates. The state shown in fig. 11 corresponds to the state shown in fig. 1. If the upper cover 2 is first applied in a preceding step, a further cover 3, here the lower cover 3, can be applied in this step and the receptacle 4 is thereby closed.
As already mentioned, only one cover plate 2, 3 for the rotational speed detector 1 can also be provided. In one embodiment of the rotational speed sensor, this can be the case if the mass 9 fills the receptacle 4 in a relatively hard embodiment and the enclosed electronic components are already sufficiently protected by the mass 9 alone.
In the lower half of fig. 10 and 11, the solder points 8a and 8b are not drawn for the sake of clarity.
The rotational speed sensor 1 can be produced in a production method which is described in detail with reference to fig. 5 to 11. The manufacturing method is illustrated in the flow chart shown in fig. 12.
In a first step 121, the rotational speed detector 1 is provided as a blank. The blank here already comprises a stamped member 5, which later forms two busbars 13a and 13 b. The punch member can be partially sprayed in the injection molding process and then partially received in the body la of the rotational speed detector. A part of the punch member 5 protrudes into the opening 4 of the main body la of the rotational speed detector 1.
In the next step 122, the conductor member 5 is punched, so that there are two separate busbars 13a and 13 b.
In a further step 123, the underside of the receptacle 4 is closed by the cover 3. In another embodiment, the closure can also be achieved with the upper cover plate 2.
In a further step 124, the sensor element 7 is introduced into the receptacle 4.
In a further step 125, the sensor element 7 is brought into contact with the busbars 13a and 13b by means of its coupling elements 15a and 15 b.
In a next step 126, the receptacle 4 is cast with the material 9.
In a further step 127, the receptacle 4 containing the electronic components and the mass 9 is closed by means of the upper cover 2. If the receptacle 4 is closed with the upper cover 2 in step 123, the receptacle is closed with the lower cover 3 in step 127. Said step 127 is not compulsorily necessary as described previously. In one embodiment, provision can be made for the receptacle 4 to be closed only on one side of the receptacle 4 by means of a cover 2, 3.
In an alternative embodiment of the production method, steps 124 and 125 are carried out before the receptacle 4 is closed from below by the cover 3, i.e. the sensor element 7 is introduced into the receptacle 4 and the sensor element 7 is contacted to the busbars 13a, 13b by means of the coupling elements 15a, 15 b. This variant is not shown as a block diagram of the method. If, in step 123 of the alternative embodiment, the receptacle 4 is closed with the cover 2, it is also suitable accordingly.
It should be noted that another suitable, chronological order of the manufacturing steps is possible. The filling of the receptacle 4 can then be started from the opposite side, depending on which side of the receptacle 4 is first closed. If, in step 123 of this alternative embodiment, the receptacle 4 is closed with the cover 2, it is also suitable accordingly.
Claims (8)
1. A sensor head (1) comprising:
-at least one housing (4) in the form of a through opening of the sensor head (1);
-at least one sensor element (7) accommodated in the accommodation (4) and accessible from both sides inside the accommodation (4) of the sensor element (7),
wherein the receptacle (4) is closed on one of the sides of its through-opening by means of a cover plate (2, 3), so that the receptacle (4) is changed from the through-opening into a closed half-shell by the cover plate and the remaining side of the through-opening of the receptacle (4) is closed by means of a further cover plate (2, 3).
2. Sensor head (1) according to claim 1, characterized in that at least two busbars (13a, 13b) project into the receptacle (4) of the sensor head (1).
3. Sensor head (1) according to claim 2, characterized in that the sensor element (7) accommodated in the accommodation (4) is electrically conductively connected to the busbars (13a, 13b) by means of coupling elements (15a, 15b) of the sensor element (7).
4. Sensor head (1) according to claim 3, characterized in that the receptacle (4) is filled with a filling material (9), wherein the filling material (9) at least partially surrounds the sensor element (7), the coupling element (15a, 15b) and the busbar (13a, 13 b).
5. Sensor head (1) according to any one of claims 2 to 4, wherein the busbars (13a, 13b) are made of stamped members (5) which are spaced apart inside the housing (4).
6. A method for manufacturing a sensor head (1) according to any one of the preceding claims, the method comprising the steps of:
-preparing (121) a blank of the sensor head (1);
-accommodating (124) a sensor element (7) into an accommodation, wherein the sensor element (7) is accessible from both sides inside the accommodation (4), the accommodation being in the form of a through opening (4) of the blank;
-closing (123) the receptacle (4) on one of its sides of the through-opening by means of a cover plate (2, 3) so that the receptacle (4) is changed from the through-opening to a closed half-shell by the cover plate,
and the method further comprises a step (127) of closing the through opening of the receptacle (4) with a further cover plate (2, 3) on the remaining side of the receptacle.
7. The method of claim 6, further comprising the steps of:
-separating (122) the punch member (5) in the housing (4) to make the busbars (13a, 13 b);
-contacting (125) the sensor element (7) with the busbar by means of a coupling element (15a, 15 b).
8. The method of claim 7, further comprising the steps of:
-filling (126) the receptacle (4) with a filler (9) which at least partially surrounds the sensor element (7), the coupling element (15a, 15b) and the busbar (13a, 13 b).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017222681.1 | 2017-12-13 | ||
| DE102017222681.1A DE102017222681A1 (en) | 2017-12-13 | 2017-12-13 | Sensor head and method for manufacturing a sensor head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110031032A CN110031032A (en) | 2019-07-19 |
| CN110031032B true CN110031032B (en) | 2022-04-01 |
Family
ID=66629608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811520878.2A Active CN110031032B (en) | 2017-12-13 | 2018-12-12 | Sensor head and method for producing a sensor head |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110031032B (en) |
| DE (1) | DE102017222681A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7390184B2 (en) * | 2019-12-26 | 2023-12-01 | Thk株式会社 | Sensor and motion guide device equipped with this sensor |
| DE102021108659A1 (en) * | 2021-04-07 | 2022-11-03 | Robert Bosch Gesellschaft mit beschränkter Haftung | Sensor unit and method of manufacturing a sensor unit |
| DE102021108660A1 (en) * | 2021-04-07 | 2022-10-13 | Robert Bosch Gesellschaft mit beschränkter Haftung | Sensor unit and method of manufacturing a sensor unit |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0312197A2 (en) * | 1987-09-11 | 1989-04-19 | DELCO ELECTRONICS CORPORATION (a Delaware corp.) | Pressure sensor and method of manufacturing the same |
| JP3534949B2 (en) * | 1996-08-12 | 2004-06-07 | アルプス電気株式会社 | Electronic components sealed structure |
| CN201694829U (en) * | 2010-06-13 | 2011-01-05 | 苏州敏芯微电子技术有限公司 | Encapsulating structure of MEMS micro sensor |
| CN102393216A (en) * | 2011-08-02 | 2012-03-28 | 上官明禹 | Method for manufacturing ultrasonic transducer |
| CN103257007A (en) * | 2012-02-17 | 2013-08-21 | 苏州敏芯微电子技术有限公司 | Pressure sensor dielectric medium isolation packaging structure and packaging method of same |
| CN204202701U (en) * | 2014-09-25 | 2015-03-11 | 中山欧麦克仪器设备有限公司 | A kind of window anti-corrosion type function ultrasonic liquid level measuring sensor |
| CN104953522A (en) * | 2014-03-26 | 2015-09-30 | Abb股份公司 | Flush mounting of an electrical installation apparatus |
| CN106457636A (en) * | 2014-06-14 | 2017-02-22 | 奥迪股份公司 | Plastic injection overmoulded conductor path structure, and method for producing the plastic injection overmoulded conductor path structure |
| CN106574854A (en) * | 2014-09-08 | 2017-04-19 | 威伯科有限公司 | Support for a sensor element, assembly, and rotational speed sensor |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4422951A1 (en) * | 1994-06-30 | 1996-01-04 | Bosch Gmbh Robert | Motor vehicle rpm sensor connector |
| JP3433051B2 (en) | 1997-06-26 | 2003-08-04 | 株式会社日立ユニシアオートモティブ | Rotation detection device |
| DE102005012709A1 (en) * | 2005-03-22 | 2006-09-28 | Robert Bosch Gmbh | magnetic field sensor |
| DE102009028963A1 (en) * | 2009-08-28 | 2011-03-03 | Robert Bosch Gmbh | Connection arrangement for a sensor arrangement and sensor arrangement |
| DE102014202208A1 (en) * | 2014-02-06 | 2015-08-06 | Robert Bosch Gmbh | Sensor unit for a vehicle |
| DE202014002881U1 (en) * | 2014-04-03 | 2015-07-07 | S + S Regeltechnik Gmbh | Immersion sensor sensor and device for its assembly with a connection cable |
| TWI552885B (en) * | 2014-09-01 | 2016-10-11 | 佳世達科技股份有限公司 | Printer |
| DE102014013312A1 (en) * | 2014-09-08 | 2016-03-10 | Wabco Gmbh | Support for a sensor element, component group and speed sensor |
| DE102014225856A1 (en) * | 2014-12-15 | 2016-06-16 | Robert Bosch Gmbh | sensor device |
| RU2594380C1 (en) * | 2015-06-23 | 2016-08-20 | Общество с ограниченной ответственностью "Приборы автоцистерн" | Transport level sensor design (versions) and set of equipment for fluid parameter control system (versions) |
| CN105527399B (en) * | 2016-02-01 | 2017-12-15 | 杭州绿洁水务科技股份有限公司 | A kind of Water Test Kits |
| DE102016210550B4 (en) * | 2016-06-14 | 2020-08-13 | Robert Bosch Gmbh | Sensor device and method for manufacturing a sensor device |
| DE102016210532B4 (en) * | 2016-06-14 | 2020-11-26 | Robert Bosch Gmbh | Sensor arrangement |
| CN206388960U (en) * | 2016-12-29 | 2017-08-08 | 重庆金鑫智慧科技有限公司 | A kind of intelligent radio socket |
| CN107212948B (en) * | 2017-05-15 | 2018-12-28 | 上海交通大学 | The anal sphincter prosthese of integrated patch type sensor |
-
2017
- 2017-12-13 DE DE102017222681.1A patent/DE102017222681A1/en active Pending
-
2018
- 2018-12-12 CN CN201811520878.2A patent/CN110031032B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0312197A2 (en) * | 1987-09-11 | 1989-04-19 | DELCO ELECTRONICS CORPORATION (a Delaware corp.) | Pressure sensor and method of manufacturing the same |
| JP3534949B2 (en) * | 1996-08-12 | 2004-06-07 | アルプス電気株式会社 | Electronic components sealed structure |
| CN201694829U (en) * | 2010-06-13 | 2011-01-05 | 苏州敏芯微电子技术有限公司 | Encapsulating structure of MEMS micro sensor |
| CN102393216A (en) * | 2011-08-02 | 2012-03-28 | 上官明禹 | Method for manufacturing ultrasonic transducer |
| CN103257007A (en) * | 2012-02-17 | 2013-08-21 | 苏州敏芯微电子技术有限公司 | Pressure sensor dielectric medium isolation packaging structure and packaging method of same |
| CN104953522A (en) * | 2014-03-26 | 2015-09-30 | Abb股份公司 | Flush mounting of an electrical installation apparatus |
| CN106457636A (en) * | 2014-06-14 | 2017-02-22 | 奥迪股份公司 | Plastic injection overmoulded conductor path structure, and method for producing the plastic injection overmoulded conductor path structure |
| CN106574854A (en) * | 2014-09-08 | 2017-04-19 | 威伯科有限公司 | Support for a sensor element, assembly, and rotational speed sensor |
| CN204202701U (en) * | 2014-09-25 | 2015-03-11 | 中山欧麦克仪器设备有限公司 | A kind of window anti-corrosion type function ultrasonic liquid level measuring sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110031032A (en) | 2019-07-19 |
| DE102017222681A1 (en) | 2019-06-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110031032B (en) | Sensor head and method for producing a sensor head | |
| HU223248B1 (en) | Plastic encapsulated sensor and process for producing it | |
| CN1930481B (en) | Movement sensor and method for producing a movement sensor | |
| US9585280B2 (en) | Electronic modular unit, in particular capacitive proximity sensor for a vehicle and method of producing the modular unit | |
| US4803544A (en) | Prefabricated strip conductor network assembly unit and process for making same | |
| CN104854671B (en) | Case mold type capacitor and its manufacture method | |
| CN104871308B (en) | Method for manufacturing electronic building brick | |
| JP5409904B2 (en) | Method for manufacturing an electronic component | |
| US20200049536A1 (en) | Sensor Arrangement | |
| US9480178B2 (en) | Method for forming a component of a vehicle latch assembly | |
| KR102327471B1 (en) | Connection devices and electric motors | |
| US9596773B2 (en) | Electronic device with connector arrangement | |
| US8307714B1 (en) | Dual port pressure sensor | |
| CN105611774B (en) | Assembly with sensor and cable | |
| JP2019016453A (en) | Circuit device | |
| JP2017506336A (en) | Vehicular sensor unit and method for manufacturing vehicular sensor unit | |
| US20120304452A1 (en) | Method of making a dual port pressure sensor | |
| CN110036538B (en) | Transmission control for a motor vehicle and method for producing a plug housing | |
| CN214067190U (en) | Wheel speed sensor chip module and wheel speed sensor | |
| JP6756854B2 (en) | Sensor device and manufacturing method of sensor device | |
| US11401740B2 (en) | Component carrier for electrical/electronic parts for attachment in a motor vehicle door lock | |
| CN111108347B (en) | Support for a sensor unit | |
| US8784121B2 (en) | Control device for a motor vehicle and related method for mounting a control device for a motor vehicle | |
| CN109843789A (en) | The corresponding method of the pressure sensor apparatus of micromechanics and the pressure sensor apparatus for manufacturing micromechanics | |
| JP2003284218A (en) | Water-proof structure of circuit sub-unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |