CN110021687A - The transfer equipment and transfer method of micro- light emitting diode - Google Patents
The transfer equipment and transfer method of micro- light emitting diode Download PDFInfo
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- CN110021687A CN110021687A CN201910309358.5A CN201910309358A CN110021687A CN 110021687 A CN110021687 A CN 110021687A CN 201910309358 A CN201910309358 A CN 201910309358A CN 110021687 A CN110021687 A CN 110021687A
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- 238000012546 transfer Methods 0.000 title claims abstract description 73
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- 239000000758 substrate Substances 0.000 claims abstract description 51
- 230000002093 peripheral effect Effects 0.000 claims abstract description 24
- 230000004308 accommodation Effects 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 230000007246 mechanism Effects 0.000 claims description 22
- 238000010521 absorption reaction Methods 0.000 claims description 15
- 230000009471 action Effects 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
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- 238000013519 translation Methods 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 230000010355 oscillation Effects 0.000 description 10
- 238000003909 pattern recognition Methods 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 238000004020 luminiscence type Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229940041682 inhalant solution Drugs 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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Abstract
The disclosure provides the transfer equipment and transfer method of a kind of micro- light emitting diode, is related to field of display technology.The transfer equipment of the disclosure is used to micro- light emitting diode being transferred to substrate, which includes roller, which includes a side wall, cylinder end wall and the cavity surrounded by cylinder side wall and cylinder end wall；The outer peripheral surface of cylinder side wall is equipped with multiple adsorption tanks of circumferentially array arrangement, and cavity is connected to the bottom of each adsorption tank；Each adsorption tank is gradually tapered up along depth direction towards roller central axes, and is matched with one end of micro- light emitting diode, for adsorbing micro- light emitting diode；Cylinder end wall is equipped with the aperture being connected to cavity, makes cavity form negative pressure state by aperture.Transfer precision and efficiency can be improved in the transfer equipment of the disclosure, improves product quality.
Description
Technical field
This disclosure relates to field of display technology, transfer equipment and transfer in particular to a kind of micro- light emitting diode
Method.
Background technique
Micro- light emitting diode (Micro LED) is micron-sized light emitting diode, is distributed by driving circuit drive array
Micro- light emitting diode can realize that image is shown, have that superelevation contrast, low-power consumption, brightness is high, the service life is long, high colour gamut, reaction
The advantages that time is fast.After having manufactured micro- light emitting diode, need a large amount of micro- light emitting diode being transferred to drive circuit board
Array is gone up and is formed, to show image.But the precision and efficiency of existing branch mode are lower.
It should be noted that information is only used for reinforcing the reason to the background of the disclosure disclosed in above-mentioned background technology part
Solution, therefore may include the information not constituted to the prior art known to persons of ordinary skill in the art.
Summary of the invention
Transfer essence can be improved in the transfer equipment and transfer method for being designed to provide a kind of micro- light emitting diode of the disclosure
Degree and efficiency improve product quality.
According to one aspect of the disclosure, a kind of transfer equipment is provided, for micro- light emitting diode to be transferred to substrate,
The transfer equipment includes:
Roller, the roller include a side wall, cylinder end wall and the cavity surrounded by the cylinder side wall and the cylinder end wall；Institute
The outer peripheral surface for stating a side wall is equipped with multiple adsorption tanks of circumferentially array arrangement, the bottom company of the cavity and each adsorption tank
It is logical；Each adsorption tank is gradually tapered up along depth direction towards the roller central axes, and with micro- light emitting diode
One end matching, for adsorbing micro- light emitting diode；
The cylinder end wall is equipped with the aperture being connected to the cavity, makes the cavity form negative pressure shape by the aperture
State.
In a kind of exemplary embodiment of the disclosure, at least one described cylinder end wall is equipped with multiple drainage holes, the row
Water hole is connected to the cavity, and the outer peripheral surface minimum range in the radial direction of the drainage hole and the cylinder side wall is greater than described
The thickness of cylinder side wall.
In a kind of exemplary embodiment of the disclosure, the center of the aperture is located at the center line of the roller；It is described
Roller further include:
Shaft is arranged in the aperture, and is fixedly connected with the cylinder end wall, and at least one end of the shaft is located at institute
It states outside cavity；The outer peripheral surface of the part of the shaft position in the cavity is equipped with stomata, and air flue is equipped in the shaft, described
One end of air flue is connected to the stomata, and the other end of the air flue extends to outside the roller and is open end；
Negative pressure component is connected to the open end of the air flue, forms negative pressure in the cavity for making.
In a kind of exemplary embodiment of the disclosure, the bottom of each adsorption tank is equipped with to be connected to the cavity
Adsorption hole, the drainage hole be greater than the adsorption hole.
In a kind of exemplary embodiment of the disclosure, the adsorption tank is positive prism-frustum-shaped structure or round-like structure.
In a kind of exemplary embodiment of the disclosure, the transfer equipment further include:
Accommodation groove, for holding solution.
In a kind of exemplary embodiment of the disclosure, the transfer equipment further include:
Rotary drive assembly is connect with the roller, for driving the roller circumferentially to rotate；
Carrying mechanism is connect with the rotary drive assembly, for driving the roller removal or part to move into the appearance
Slot is set, and when the roller is located at outside the accommodation groove, the carrying mechanism is for driving the roller along preset direction water
Translation is dynamic.
In a kind of exemplary embodiment of the disclosure, the substrate has installing zone and is separated in the installing zone two sides
The first positioning area and the second positioning area, the installing zone is for installing micro- light emitting diode；
The transfer equipment further include:
Positioning component, for detecting whether the roller is located at position with the first positioning area face, and detection
Whether the roller is located at the second position with the second positioning area face；
It is described when the positioning component detects that the roller is located at the first position with the first positioning area face
Positioning component can control the carrying mechanism and the roller driven to move horizontally along the preset direction, and controls the rotation and drive
Roller rotation described in dynamic Component driver, and the direction of any linear velocity of the roller apart from the substrate farthest is described in
Second positioning area；
It is described when the positioning component detects that the roller is located at the second position with the second positioning area face
Positioning component, which can control the carrying mechanism, moves horizontally roller stopping, and control the rotary drive assembly make it is described
Roller stops operating.
According to one aspect of the disclosure, a kind of transfer method of micro- light emitting diode is provided, using above-mentioned any one
The transfer equipment, the transfer method include:
Multiple micro- light emitting diodes are placed in solution；
The part cylinder side wall of the roller is immersed into the solution, and rotates the roller circumferentially；
Negative pressure is generated in the cavity by the aperture, under the action of negative pressure, micro- light emitting diode is adsorbed on
In the adsorption tank；
The micro- light emitting diode of absorption on which cylinder is transferred on substrate.
In a kind of exemplary embodiment of the disclosure, the micro- light emitting diode of absorption on which cylinder is shifted
To substrate, comprising:
Multiple adhesive pads are set on substrate, and the quantity of the adhesive pad is identical as the quantity of the adsorption tank, and described
The distribution mode of each adsorption tank after the distribution mode of adhesive pad is launched into plane with the cylinder side wall is consistent；
The roller for being adsorbed with micro- light emitting diode is moved horizontally along preset direction on the substrate, meanwhile, make
The roller circumferentially rotates, and micro- light emitting diode of each adsorption tank absorption is adhered to each institute correspondingly
It states in adhesive pad.
In the transfer device and transfer method of micro- light emitting diode of the disclosure, micro- light emitting diode has first end and the
Two ends；Since the periphery of the cylinder side wall of roller is equipped with adsorption tank, the second end phase of the inner wall of adsorption tank and micro- light emitting diode
Match, thus can be aspirated by cavity of the aperture to roller, so that the cavity in roller forms negative pressure state, with roller
Rotation can adsorb fixed micro- light emitting diode by adsorption tank；Meanwhile the cross section of the first end of micro- light emitting diode is greater than the
Two ends could block adsorption tank when so that the second end matching of only micro- light emitting diode being fitted in adsorption tank, realize to micro-
The second end of the absorption of light emitting diode, the micro- light emitting diode being adsorbed is located in adsorption tank, and first end is located at adsorption tank
Outside, the control to the state of micro- light emitting diode is realized, convenient for that will be transferred on substrate for light emitting diode with identical state.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The disclosure can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure
Example, and together with specification for explaining the principles of this disclosure.It should be evident that the accompanying drawings in the following description is only the disclosure
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is the schematic diagram of micro- light emitting diode used by disclosure embodiment transfer equipment.
Fig. 2 is the schematic diagram of disclosure embodiment transfer equipment.
Fig. 3 is the schematic internal view of the roller of disclosure embodiment transfer equipment.
Fig. 4 is the schematic diagram of the roller of disclosure embodiment transfer equipment.
Fig. 5 is the enlarged drawing in the portion A in Fig. 4.
Fig. 6 is that the cylinder side wall of the roller of disclosure embodiment transfer equipment is launched into the schematic diagram of plate.
Fig. 7 is that the schematic diagram in solution is immersed in the roller part of disclosure embodiment transfer equipment.
Fig. 8 is that the adsorption tank of disclosure embodiment transfer equipment matches the schematic diagram being bonded with micro- light emitting diode.
Fig. 9 is that the adsorption tank of disclosure embodiment transfer equipment can not match the signal being bonded with micro- light emitting diode
Figure.
Figure 10 is the diagram for shifting micro- light emitting diode to substrate using the roller of disclosure embodiment.
Figure 11 is the schematic block circuit diagram of disclosure embodiment transfer equipment.
Figure 12 is the schematic diagram of substrate and adhesive pad.
Figure 13 is that micro- light emitting diode is transferred to the schematic diagram after substrate.
In figure: 100, micro- light emitting diode；101, first electrode layer；102, luminescent layer；1021, the first semiconductor layer；
1022, multi-quantum well luminescence layer；1023, the second semiconductor layer；103, the second electrode lay；200, substrate；300, adhesive pad；400,
First label；500, the second label；600, solution；
1, roller；11, cylinder side wall；12, cavity；13, cylinder end wall；14, adsorption tank；15, adsorption hole；16, drainage hole；17,
Shaft；171, stomata；172, air flue；2, negative pressure component；3, accommodation groove；4, carrying mechanism；41, track；42, erecting bed；43, it rises
It comes down to a lower group part；44, component is translated；5, rotary drive assembly；6, positioning component；61, filming apparatus；611, the first camera；612,
Second camera；62, pattern recognition device；63, control device；7, oscillation device；71, oscillation source；72, oscillating body.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, thesing embodiments are provided so that the present invention will
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.Identical attached drawing in figure
Label indicates same or similar structure, thus the detailed description that will omit them.
Although the term of relativity, such as "upper" "lower" is used to describe a component of icon for another in this specification
The relativeness of one component, but these terms are in this manual merely for convenient, for example, with reference to the accompanying drawings described in show
The direction of example.It is appreciated that, if making it turn upside down the device overturning of icon, the component described in "upper" will
As the component in "lower".When certain structure is at other structures "upper", it is possible to refer to that certain structural integrity is formed in other structures
On, or refer to that certain structure is " direct " and be arranged in other structures, or refer to that certain structure is arranged by the way that another structure is " indirect " in other knots
On structure.
Term "one", " one ", "the", " described " and "at least one" be to indicate that there are one or more elements/groups
At part/etc.；Term " comprising " and " having " is to indicate the open meaning being included and refer in addition to listing
Element/component part/also may be present except waiting other element/component part/etc.；Term " first " and " second " are only as mark
Note uses, and is not the quantity limitation to its object.
Disclosure embodiment provides a kind of transfer equipment of micro- light emitting diode, is used for multiple micro- light emitting diodes
It is transferred to substrate, realizes the flood tide transfer of micro- light emitting diode.Micro- light emitting diode can have opposite first end and second
End, the cross section of the first end of micro- light emitting diode are not less than the second end of micro- light emitting diode, and the side wall of second end is to remote
Direction from the first end is shunk, i.e. the transversal direction away from first end of the side wall of second end is gradually reduced.The substrate
Particular determination can not be done herein for the driving plate for installing micro- light emitting diode, the structure of substrate.
For example, as shown in Figure 1, micro- light emitting diode 100 in disclosure embodiment may include first electrode layer
101, luminescent layer 102 and the second electrode lay 103, luminescent layer 102 can be set to first electrode layer 101, and the second electrode lay 103 is set to hair
Photosphere 102 is far from 101 side of first electrode layer, by that can make to the voltage between first electrode layer 101 and the second electrode lay 103
Luminescent layer 102 shines, and this will not be detailed here for specific principle of luminosity.
Illustratively, as shown in Figure 1, luminescent layer 102 may include the first semiconductor layer 1021 being stacked, multiple quantum wells
Luminescent layer 1022 and the second semiconductor layer 1023, multi-quantum well luminescence layer 1022 are set to the first semiconductor layer 1021 and the second half and lead
Between body layer 1023, the first semiconductor layer 1021 is located at multi-quantum well luminescence layer 1022 close to the side of first electrode layer 101, and
Two semiconductor layers 1023 are located at multi-quantum well luminescence layer 1022 close to the side of the second electrode lay 103.First semiconductor layer 1021
It can be p type semiconductor layer, the second semiconductor layer 1023 can be n type semiconductor layer.
As shown in Figure 1, the outer peripheral surface of the luminescent layer 102 of micro- light emitting diode 100 includes along far from first electrode layer 101
The first area and second area that direction successively connects, second area are shunk along the direction far from first electrode layer 101.Second electricity
The periphery of pole layer 103 is shunk away from the direction of first electrode layer 101, and is aligned with second area, i.e. the second electrode lay 103
Outer peripheral surface and 102 outer peripheral surface of luminescent layer second area be same plane or curved surface, as long as being matched with the inner wall of adsorption tank 14
?.
The first end of micro- light emitting diode 100 includes the portion that first electrode layer 101 and luminescent layer 102 correspond to first area
Point, second end includes the part that the second electrode lay 103 and luminescent layer 102 correspond to second area.Certainly, in other embodiment
In, can also the outer peripheral surface of only the second electrode lay 103 shunk along the direction far from first electrode layer 101, and 101 He of first electrode layer
The outer peripheral surface of luminescent layer 102 is concordant.
As shown in figs 2-4, the transfer equipment of disclosure embodiment includes roller 1, roller 1 may include a side wall 11,
The outer peripheral surface of the cavity 12 that cylinder end wall 13 and tube side wall 11 and cylinder end wall 13 surround, cylinder side wall 11 can be equipped with circumferentially array point
Multiple adsorption tanks 14 of cloth, cavity 12 are connected to the bottom of each adsorption tank 14；Each adsorption tank 14 is along depth direction towards roller 1
Central axes gradually taper up, and match with one end of micro- light emitting diode 100, and adsorption tank 14 is for adsorbing micro- light emitting diode 100.
Cylinder end wall 13 is equipped with aperture, and aperture is connected to cavity 12, can be aspirated by aperture to cavity 12, so as to inside cavity 12
Negative pressure state is formed, so that micro- light emitting diode 100 is absorbed and fixed in adsorption tank 14 by adsorption tank 14.Adsorption tank 14 with
One end of light emitting diode 100 matches, for example, the inner wall of adsorption tank 14 can be with the periphery of the second end of micro- light emitting diode 100
Face matching fitting, and the first end of micro- light emitting diode 100 is then mismatched with the side wall of adsorption tank 14.
The transfer equipment of disclosure embodiment can form negative pressure in the cavity 12 of roller 1 by negative pressure component 2, with
The rotation of roller 1 can adsorb micro- light emitting diode 100, and the second end of only micro- light emitting diode 100 by adsorption tank 14
When with fitting in adsorption tank 14, adsorption tank 14 could be blocked, the absorption to micro- light emitting diode 100 is realized, so that being adsorbed
The second end of micro- light emitting diode 100 be located in adsorption tank 14, and first end is located at outside adsorption tank 14, realizes and shines two to micro-
The control of the posture of pole pipe 100, to be transferred on substrate with identical posture.
Specifically, when in use, multiple micro- light emitting diodes 100 can be placed in solution 600, prevent micro- light-emitting diodes
Pipe 100 scratches；Then, the part cylinder side wall 11 of roller 1 can be immersed solution 600, and rotates roller 1 circumferentially, by negative
Pressure component 2 generates negative pressure in cavity 12, so that the second end of micro- light emitting diode 100 in solution 600 is adsorbed in absorption
In slot 14, and the second end for the micro- light emitting diode 100 being adsorbed is located in adsorption tank 14, and first end is located at adsorption tank 14
Outside；Then, the micro- light emitting diode 100 being adsorbed on roller 1 can be transferred on substrate by mobile and rotation roller 1.
Each section of disclosure embodiment transfer equipment is described in detail below: as shown in Figure 3-Figure 5, roller 1
For adsorbing and shifting micro- light emitting diode 100, roller 1 can be columned hollow structure, specifically, roller 1 includes cylinder
Side wall 11 and two cylinder end walls 13, cylinder side wall 11 can be formed by a flat sheet roll around one week, and the plate is as shown in fig. 6, two cylinder ends
Wall 13 is shielded in the both ends of a side wall 11 respectively, and can through welding, clamping or in the way of screw connection etc. with cylinder side wall 11
It is fixedly connected, to surround cavity 12 with cylinder side wall 11.Certainly, cylinder side wall 11 can also be integrally formed with cylinder end wall 13.
As shown in Figure 3-Figure 5, the outer peripheral surface of cylinder side wall 11 can be equipped with multiple adsorption tanks 14, and it is special that particular number is not done herein
It limiting, each adsorption tank 14 can be distributed along the circumferential array of cylinder side wall 11, such as: adsorption tank 14 can circumferentially line up multiple row, often
Column include axially distributed multiple adsorption tanks 14.Meanwhile cavity 12 can be connected to the bottom of each adsorption tank 14, in cavity 12
When forming negative pressure, suction can be generated outside by 14 pairs of cylinder side walls 11 of adsorption tank, for example, as shown in Fig. 5, Fig. 8 and Fig. 9, each suction
The bottom of attached slot 14, which is equipped with, to be connected to adsorption hole 15, each adsorption hole 15 with cavity 12, and can be the straight hole radially extended,
And adsorption hole 15 is less than the bottom surface of adsorption tank 14.
As shown in figure 8, when the second end matching of micro- light emitting diode 100 fits in each adsorption tank 14 of adsorption tank 14
Adsorption tank 14 can be blocked completely, realize the absorption to micro- light emitting diode 100；As shown in figure 9, the of micro- light emitting diode 100
One end can not match with adsorption tank 14 and be bonded, and adsorption tank 14 can not be blocked completely, to can not adsorb, thus, it is ensured that inhaled
Attached micro- light emitting diode 100 is that second end is located in adsorption tank 14, and first end is located at the posture outside adsorption tank 14, so that micro-
The first end of light emitting diode 100 is fixed on substrate 200.
Specifically, this is micro- luminous as shown in figure 8, each adsorption tank 14 is along depth direction towards 1 axis linear shrinkage of roller
The shape and size of the outer peripheral surface of the second end of diode 100 and the inner wall of adsorption tank 14 match, so that the second end is outer
Circumferential surface can match the inner wall for fitting in adsorption tank 14, thus adsorption tank 14 is completely obscured, prevent solution 600 or air-flow from passing through；
As shown in figure 9, the cross section of the first end of micro- light emitting diode 100 is not less than the second end of micro- light emitting diode 100, i.e., it is not small
In the maximum cross section of second end, it is bonded so that first end can not be matched with the inner wall of adsorption tank 14, thus can not be with first end
Posture in adsorption tank 14 is adsorbed.
For example, as shown in Figure 3-Figure 5, adsorption tank 14 can be positive prism-frustum-shaped structure, the big end of the positive prism-frustum-shaped structure
Positioned at the outer peripheral surface of cylinder side wall 11, small end extends to the central axes of roller 1, and the second end of micro- light emitting diode 100 is and absorption
The matched positive prism-frustum-shaped structure of slot 14, the cross section of the first end of micro- light emitting diode 100 are greater than the of micro- light emitting diode 100
The minimum cross-section at two ends.Alternatively, adsorption tank 14 can be round-like structure, the big end of the round-like structure is located at cylinder side wall 11
Outer peripheral surface, small end extend to the central axes of roller 1, and the second end of micro- light emitting diode 100 is and the matched rotary table of adsorption tank 14
Shape structure, the minimum that the cross section of the first end of micro- light emitting diode 100 is greater than the second end of micro- light emitting diode 100 are transversal
Face.Certainly, adsorption tank 14 can also no longer arrange one by one for other shapes as long as gradually tapering up to the central axes of roller 1 herein
It lifts.
For the ease of being aspirated to cavity 12, to form negative pressure state, can be opened up open at least one end wall 13
Hole, which can be connected to cavity 12, when needing to form negative pressure, need to only connect the devices such as aperture and the pump that can be carried out suction
It is logical, negative pressure is formed in cavity 12.
Aperture can be set to the center of the cylinder end wall 13 where it, i.e. the center of aperture is located on the central axes of roller 1, to protect
When demonstrate,proving the rotation of roller 1, the position of aperture be will not change.
In order to avoid the solution 600 of sucking cavity 12 is excessive, as shown in Figure 3 and Figure 4, the solution 600 in cavity 12 is certainly
The micro- light emitting diode 100 being adsorbed pressure is fallen under the action of body gravity, drainage hole 16 can be opened up at least one end wall 13,
Drainage hole 16 is connected to cavity 12, to be discharged into the solution 600 of cavity 12, meanwhile, as shown in fig. 7, due to adsorption tank 14
Depth be not more than the thickness of cylinder side wall 11, thus the most narrow spacing of the outer peripheral surface of drainage hole 16 and cylinder side wall 11 radially can be made
From the thickness for being greater than cylinder side wall 11, so that immersing the depth of solution 600 by control roller 1, make liquid level that can be located at drainage hole 16
And enters between the adsorption tank 14 of solution 600, avoid drainage hole 16 and adsorption tank 14 while being located in solution 600 and destroying cavity
12 negative pressure guarantees being normally carried out for absorption.Wherein, the minimum range of the outer peripheral surface of drainage hole 16 and cylinder side wall 11 radially
Are as follows: the nearest some spacing with the outer peripheral surface of cylinder side wall 11 radially of outer peripheral surface of the drainage hole 16 away from cylinder side wall 11.
In addition, as shown in figure 3, the aperture of drainage hole 16 is greater than the aperture of adsorption hole 15, so that the efficiency of discharge solution 600
Not less than the efficiency of inhalation solution 600, further avoid saving bit by bit excessive solution 600 in cavity 12, such as: the aperture of adsorption hole 15
It is 10 μm, the aperture of drainage hole 16 is big for 1000 μm, 10000 μm or more.Certainly, the aperture of drainage hole 16 is also smaller than or waits
In the aperture of adsorption hole 15.
The quantity of the drainage hole 16 of same cylinder end wall 13 can be to be multiple, such as 10,12,13,14 etc., herein not
Do particular determination, and drainage hole 16 can the central axes of wound drum 1 be distributed in a ring.Certainly, drainage hole 16 is also possible to one.
For the ease of realizing the rotation of roller 1, and convenient for making cavity 12 form negative pressure, as shown in figure 3, in an embodiment
In, the transfer equipment of disclosure embodiment may also include shaft 17 and negative pressure component 2, in which:
Shaft 17 can be arranged in above-mentioned aperture along axial direction, and be fixedly connected with cylinder end wall 13, so as to pass through 17 band of shaft
Dynamic cylinder end wall 13 and cylinder side wall 11 rotate, and realize the rotation of roller 1；At least one end of shaft 17 is located at outside cavity 12, for example, turning
Axis 17 passes through two cylinder end walls 13, so that the both ends of shaft 17 are respectively positioned on outside cavity 12, certainly, one end of shaft 17 passes through one
End wall 13, and be located in cavity 12, the other end is outside cylinder end wall 13.
Shaft 17 is located at the outer peripheral surface setting stomata 171 of the part in cavity 12, is equipped with air flue 172, air flue in shaft 17
172 one end are connected to stomata 171, and the other end extends to outside cavity 12 and is open end, so that shaft 17 can be used to drive rolling
Cylinder 1 rotates, and is alternatively arranged as the channel being connected to cavity 12.
The air in cavity 12 is extracted out by air flue 172 and stomata 171, thus that can form negative pressure in cavity 12.Wherein,
The quantity of stomata 171 can be to be multiple, and the circumferentially distributed outer peripheral surface for being located at the part in cavity 12 in shaft 17, certainly, gas
The quantity in hole 171 is also possible to one.
As shown in figure 3, air flue 172 can be the cylindrical cavities circumferentially extended along shaft 17, so that shaft 17 can be tubulose knot
Structure, it is open end that air flue 172, which is located at one end outside cavity 12, in order to the connection of negative pressure component 2.Certainly, air flue 172 can also make
Other shapes, such as along the channel that curve or dog-leg path extend, pass through as long as stream can be supplied.
As shown in Fig. 2, negative pressure component 2 can be connected to the air flue 172 of shaft 17, to pass through 172 He of air flue of shaft 17
Stomata 171 aspirates cavity 12, generates negative pressure in cavity 12.Certainly, negative pressure component 2 can also be by across cylinder end wall 13
Pipeline be connected to cavity 12, and shaft 17 can be solid construction.
Negative pressure component 2 may include vacuum pump, which can be connected to the open end of the air flue 172 of shaft 17, so as to
Make to form negative pressure in cavity 12 by vacuum pump.Alternatively, vacuum pump can be replaced negative-pressure air fan, the air inlet of the negative-pressure air fan can
It is connected to the open end of the air flue 172 of shaft 17, so as to make to form negative pressure in cavity 12 by negative-pressure air fan.Certainly, negative pressure
Component 2 can also be other structures, as long as can make to form negative pressure in cavity 12.
For the ease of holding solution 600, as shown in Figure 2 and Figure 7, the transfer equipment of disclosure embodiment may also include appearance
Slot 3 is set, accommodation groove 3 there can be the cavity for holding solution 600, which has open end, to inject or to pour out
Solution 600, for example, accommodation groove 3 can be surrounded by bottom plate and around the side wall of bottom edge, micro- light emitting diode 100 can be suspended in
In the solution 600, for example, which can be aqueous isopropanol etc., as long as micro- light emitting diode 100 can be made outstanding
It is floating, and micro- 100 service performance of light emitting diode is not damaged.
In addition, as shown in Fig. 2, oscillation dress can be used in order to keep micro- light emitting diode 100 in solution 600 more uniform
It sets 7 pairs of solution 600 to vibrate, for example, oscillation device 7 may include oscillation source 71 and oscillating body 72, and oscillation source 71 is located at
Outside accommodation groove 3, oscillating body 72 is connect with oscillation source 71, and is protruded into the solution 600 of accommodation groove 3, and oscillation source 71 can driving oscillation
Body 72 vibrates, so that solution 600 be made to vibrate, so that micro- light emitting diode 100 is suspended more uniform, in order to be adsorbed by roller 1.
For the ease of automatic transporting roller 1, as shown in figs. 2 and 10, the transfer equipment of disclosure embodiment can also be wrapped
Carrying mechanism 4 is included, which can connect with roller 1, and roller 1 can be rotated circumferentially relative to carrying mechanism 4, carrying implement
Structure 4 can drive roller 1 to remove or partially move into accommodation groove 3 and will roll so as to micro- light emitting diode 100 in adsorbent solution 600
After cylinder 1 moves to outside accommodation groove 3, carrying mechanism 4 can also drive roller 1 to move horizontally along preset direction, so that roller 1 will be made along base
Plate 200 translates, for example, the preset direction can be such that roller 1 circumferentially rotates in the process for the X-direction in Figure 10
The micro- light emitting diode 100 being adsorbed on roller 1 is transferred on substrate 200.
In one embodiment, as shown in Fig. 2, carrying mechanism 4 may include track 41, erecting bed 42,43 and of lifting assembly
Translate component 44, in which:
Track 41 can extend along preset direction, and can be set to the top of accommodation groove 3.The specific structure of track 41, herein not
Particular determination is done, as long as the direction that roller 1 moves horizontally can be limited, for example, track 41 is linear guide, and along above-mentioned pre-
Set direction level is set to the top of accommodation groove 3.
Erecting bed 42 is set on track 41, and is slidably connected with track 41, so as to reciprocatingly slide along track 41.Erecting bed
42 can be a plate, be also possible to a strut, it is, of course, also possible to be the frame etc. that multiple connecting rods are spliced into, herein not to peace
The structure of dress platform 42 does particular determination, as long as it can be slided along track 41, and can be used to install lifting assembly 43.
Lifting assembly 43 is securable to erecting bed 42, and connect with roller 1, and lifting assembly 43 can drive roller 1 along vertical
Direction move back and forth, so as to roller 1 is removed or part move into accommodation groove 3.Meanwhile roller 1 can be horizontally disposed with, i.e. central axes water
Flat setting, and can circumferentially OQ t component 43 rotate.For example, lifting assembly 43 may include cylinder, the cylinder of the cylinder
Cylinder is fixed on erecting bed 42, and the piston rod of cylinder can extend straight down, and is rotatablely connected with roller 1, passes through the perpendicular of piston rod
Translation is dynamic, can drive 1 vertical shift of roller, and can circumferentially opposing pistons bar rotate.Certainly, cylinder also can be replaced hydraulic
Cylinder, linear motor etc. are able to achieve the device of linear movement, alternatively, rotating electric machine cooperation transmission mechanism can also be used in lifting assembly 43
1 vertical shift of roller is driven, which can be leadscrew-nut mechanism etc., no longer enumerated here.
Translation component 44 can drive erecting bed 42 to move horizontally along preset direction, and for example, translation component 44 may include
Motor, the motor can be set to erecting bed 42, and erecting bed 42 is equipped with the idler wheel that can be rolled on track 41, can be driven by the motor
Idler wheel rotation drives lifting assembly 43 and roller 1 along pre- so that erecting bed 42 be made to move horizontally on track 41 along preset direction
Set direction moves horizontally.Alternatively, translation component 44 may include cylinder, the cylinder barrel of cylinder is securable to one end of track 41, cylinder
Piston shaft connect with erecting bed 42, erecting bed 42 can also be driven to move horizontally on track 41 along preset direction, the cylinder
It can be replaced the device that hydraulic cylinder or linear motor etc. are able to achieve linear movement, herein other implementations no longer to translation component 44
Mode is enumerated.
In the other embodiment of the disclosure, carrying mechanism can also be other structures, for example, carrying mechanism can be used
Roller 1 is removed by the mechanical arm or part moves into accommodation groove 3 by multivariant mechanical arm by roller 1, and by roller 1
After moving to outside accommodation groove 3, driving roller 1 is moved horizontally along preset direction.It will not enumerate herein.
It is rotated for the ease of driving roller 1, as shown in Fig. 2, the transfer equipment of the disclosure may also include rotary drive assembly
5, rotary drive assembly 5 is securable to carrying mechanism 4, and connect with roller 1, for driving roller 1 with respect to carrying mechanism 4 along week
To rotation；Roller 1 is connect by rotary drive assembly 5 with carrying mechanism 4, so that carrying mechanism 4 can drive roller 1 and rotation to drive
Component 5 is moved along preset direction synchronous translational.
For example, rotary drive assembly 5 is fixed on above-mentioned erecting bed 42, and connect with roller 1, for driving roller
The 1 circumferentially rotation of OQ t component 43, is easy to implement automatic control.Rotary drive assembly 5 can be motor, can pass through the motor
The shaft 17 of roller 1 is driven to rotate, so that roller 1 be made to rotate.
It should be noted that rotary drive assembly 5, lifting assembly 43 and translation component 44 can independently work, so that
Three lifting of roller 1, translation and rotation movements can carry out simultaneously, can also only carry out any one or any two.
As shown in Figure 10, it is limited for the ease of the translation to roller 1, by micro- accurately transfer of light emitting diode 100
Onto substrate 200, substrate 200 can have installing zone and be separated in the first positioning area and the second positioning area of installing zone two sides, should
Installing zone can be used for installing micro- light emitting diode 100.Meanwhile the transfer equipment of the disclosure may also include positioning component 6, the positioning
Component 6 can detect roller 1 and whether be located at position with the first positioning area face, and whether detection roller 1 is located at and described the
The second position of two positioning area faces；
When detecting that roller 1 is located at the first position with the first positioning area face, which can control carrying implement
The translation component 44 of structure 4 drives erecting bed 42 to move horizontally along preset direction, and controls rotary drive assembly 5 and drive 1 turn of roller
It is dynamic, and direction the second positioning area of direction of any linear velocity of the roller 1 apart from substrate 200 farthest, so that the outer peripheral surface of roller 1
It is gradually bonded with installing zone, so that the micro- light emitting diode 100 being adsorbed on roller 1 to be transferred on substrate 200, such as Figure 10 institute
Show, the direction S in Figure 10 is the rotation direction of roller 1, and X-direction is the preset direction that roller 1 translates.If preset direction is the side X
To opposite direction, then the rotation direction of roller 1 be S opposite direction.
When detecting that roller 1 is located at the second position with the second positioning area face, illustrate that roller 1 has rolled across installing zone,
Make the erecting bed 42 of carrying mechanism 4 stop moving horizontally at this point, positioning component 6 can control translation component 44, and controls rotation and drive
Dynamic component 5 makes roller 1 stop operating.
It is described in detail below in such a way that positioning component 6 limits the range that roller 1 moves horizontally:
As shown in Figure 10, it can be equipped with the first label 400 in the first positioning area of substrate 200, in the second positioning area setting the
Two labels 500.As shown in figure 11, positioning component 6 may include filming apparatus 61, pattern recognition device 62 and control device 63,
In:
Filming apparatus 61 can be set to erecting bed 42, for shooting image towards 200 place plane of substrate.
Pattern recognition device 62 can identify the first label 400 and the second label 500 from the image that filming apparatus 61 is shot；
When identifying the first label 400, illustrate that roller 1 is located at the first position with the first positioning area face, at this point, the first control of output
Signal processed；When identifying the second label 500, illustrate that roller 1 is located at the second position with the second positioning area face, at this point, defeated
Second control signal out.
Control device 63 can respond above-mentioned first control signal, and control translation component 44 drives erecting bed 42 along preset direction
It moves horizontally, and controls rotary drive assembly 5 and roller 1 is driven to rotate, any the linear velocity farthest apart from substrate 200 of roller 1
Direction towards the second positioning area.Control device 63 can also be responsive to second control signal, and control translation component 44 drives erecting bed
42 stop movement, and control rotary drive assembly 5 and roller 1 is driven to stop operating, and complete transfer.
In one embodiment, as shown in Figure 10, the quantity of the first label 400 and the second label 500 is two, two
First label 400 is along the directional spreding perpendicular to preset direction and spacing is pre-determined distance, and two the second labels 500 are in default side
Face is arranged one by one with two the first labels 400 upwards, so that two the second labels 500 are along the direction point perpendicular to preset direction
Cloth and spacing are also pre-determined distance.First label 400 and the second label 500 can be the shapes such as " ten " shape or rectangle, circle
Pattern, alternatively, the first label 400 and the second label 500 are also possible to be set to the raised or sunken structure on substrate 200.
First label 400 and the second label 500 can be the same or different.
As shown in figs. 2 and 11, filming apparatus 61 may include the first camera 611 and second camera 612, the first camera shooting
First 611 and second camera 612 along the axial direction setting of roller 1, and roller 1 is located at the first camera 611 and second camera 612
Between, the spacing of the first camera 611 and second camera 612 is identical as above-mentioned pre-determined distance, so that the first camera 611
Two the first labels 400 can be taken simultaneously with second camera 612, or take two the second labels 500 simultaneously.
When roller 1 is located at first position, the first camera 611 and second camera 612 and two the first labels 400 1
One face, so as to take the image of two the first labels 400 respectively；When roller 1 is located at the second position, the first camera
611 and second camera 612 and two the second labels 500 face one by one, so as to take two the second labels 500 respectively
Image.
When pattern recognition device 62 identifies two the first labels 400 at the same time, illustrate that roller 1 is located at first position, i.e.,
Between two the first labels 400, at this point, exportable first control signal, two the are identified simultaneously in pattern recognition device 62
When two labels 500, illustrate that roller 1 is located at first position, i.e. between two the second labels 500, at this point, output second control
Signal.
Control device 63 can be PLC, single-chip microcontroller, is also possible to computer or other can control translates component 44, lifting
The device of component 43 and rotary drive assembly 5, does not do particular determination herein.
In another embodiment, positioning component may include photoelectric sensor, photoelectric sensor include the first receiver,
Second receiver and transmitter, wherein transmitter can be set to erecting bed 42 and be located on the extended line of the central axes of roller 1, the
One receiver and second receiver are respectively arranged on the first positioning area and the second positioning area, in transmitter and the first receiver face
When, roller 1 is located at first position, exportable first control signal；In transmitter and second receiver face, roller 1 is located at
The second position, exportable second control signal.
In the other embodiment of the disclosure, positioning component can also be other structures, as long as can be located at the in roller 1
When one position, first control signal is exported to control device 63, when roller 1 is located at the second position, is exported to control device 63
Second control signal.Such as: it can be on track 41 corresponding to the first close switch of the first positioning area and corresponding to second
The second of positioning area is close to switching, and setting can trigger the triggering of the first close switch and the second close switch on erecting bed 42
Part illustrates that roller 1 is located at first position, exportable first control signal in trigger member triggering first close to when switching；It is triggering
Part triggering second illustrates that roller 1 is located at the second position, exportable second control signal close to when switching.
It should be noted that roller 1 can be made to be located at first position and second by the position that substrate 200 is rationally arranged
When setting, the micro- light emitting diode 100 for being adsorbed on 1 bottom of roller is bonded with substrate 200.Certainly, it is located at first position in roller 1
When, if substrate 200 is located at the lower section of roller 1, and be adsorbed on 1 bottom of roller micro- light emitting diode 100 between have it is specified away from
From, at this point, can by control device 63 control lifting assembly 43 make roller 1 decline distance to a declared goal, make to be adsorbed on 1 bottom of roller
Micro- light emitting diode 100 be bonded with substrate 200.
Below with reference to above embodiment to the course of work for shifting micro- light emitting diode 100 using disclosure transfer equipment
It is described in detail:
Accommodation groove 3 can be made to be located at the lower section of track 41, and inject solution 600 in accommodation groove 3, and liquid level is lower than accommodation groove
3 top.Multiple micro- light emitting diodes 100 are placed in solution 600, and solution 600 is vibrated by oscillation device 7,
It is suspended in micro- light emitting diode 100 uniformly in solution 600.
As shown in Figure 10 and Figure 11, substrate 200 can be horizontally placed in the preset plane of 41 lower section of track, and be located at accommodation groove
Multiple adhesive pads 300 of array distribution can be arranged in 3 sides on substrate 200, and the material of adhesive pad 300 can be conductive for thermosetting property
Material, such as conducting resinl etc..The distribution mode and cylinder side wall 11 of adhesive pad 300 are launched into the distribution side of the adsorption tank 14 after plane
Formula is consistent.
Make erecting bed 42 that roller 1 be driven to be moved horizontally to above accommodation groove 3 along track 41 by translating component 44, passes through liter
Part 43 of coming down to a lower group declines roller 1, until solution 600 is immersed in 1 part of roller, and the liquid level of solution 600 is lower than drainage hole 16.
It drives roller 1 to circumferentially rotate by rotary drive assembly 5, and negative pressure is formed in cavity 12 by negative pressure component 2,
In the process, 14 inhalable solutions 600 of adsorption tank of roller 1, when the second end matching of micro- light emitting diode 100 fits in suction
When in attached slot 14, adsorption tank 14 is blocked, to realize the absorption to micro- light emitting diode 100, is rotated by control roller 1
Number is enclosed, micro- light emitting diode 100, and the second end of each micro- light emitting diode 100 can be adsorbed in each adsorption tank 14
In adsorption tank 14.
After each adsorption tank 14 is adsorbed with micro- light emitting diode 100 or roller 1 turns over predetermined amount, lifting can be passed through
Component 43 makes roller 1 remove accommodation groove 3 vertically.Then, make erecting bed 42 that roller 1 be driven to be moved to and base by translating component 44
The corresponding first position of the first positioning area of plate 200, cylinder side wall 11 near substrate 200 point between substrate 200 at a distance from not
Greater than the thickness of micro- light emitting diode 100.At this point, two the first labels 400 can be detected in pattern recognition device 62, and to control
Device 63 issues first control signal, and the controllable translation component 44 of control device 63 makes erecting bed 42 drive roller 1 fixed to second
Position area moves horizontally, and controls rotary drive assembly 5 and roller 1 is driven to rotate, so that the gradually installation with substrate 200 of cylinder side wall 11
Area's fitting, as shown in figure 12, micro- light emitting diode 100 is adhered in each adhesive pad 300, adhesive pad 300 and micro- hair are passed through
Micro- light emitting diode 100 is detached from by the bonding force of optical diode 100 with roller 1, and micro- light-emitting diodes due to being adsorbed in roller 1
Pipe 100 is that second end is located in adsorption tank 14, and first end is located at the posture outside adsorption tank 14, to guarantee each micro- luminous two
The first electrode layer 101 of the first end of pole pipe 100 is adhered to adhesive pad 300.
It should be noted that can control negative pressure component 2 to reduce power while roller 1 is translated along substrate 200, thus
Adsorption tank 14 is reduced to the suction of micro- light emitting diode 100, is conducive to adhesive pad 300 and glues micro- light emitting diode 100 from roller 1
From but suction should be able to still be enough to adsorb micro- light emitting diode 100, i.e. the suction gravity that is greater than light emitting diode 100, so that micro-
Light emitting diode 100 will not fall off because of self gravity.For example, control device 63 can respond first control signal, negative pressure group is controlled
Part 2 reduces absorption power, reduces adsorption tank 14 to the suction of micro- light emitting diode 100, but be not less than micro- light emitting diode 100
Gravity.
Illustratively, as shown in Figure 4 and Figure 6, if about 10 μm of the size of micro- light emitting diode, the length W of roller 1 is
10cm, length W are the axial length of roller 1, and perimeter L=2 π R=10cm, R of roller 1 are the radius of roller 1.The roller 1 can
It is micro- that transfer 1KK (1,000,000) disposably may be implemented in disposable transfer (10/0.01) × (10/0.01)=1KK, the i.e. roller 1
Light emitting diode greatly promotes transfer efficiency.The structure and quantity of adsorption tank 14 in Fig. 4 and Fig. 5 are only to show principle, not
It is the restriction to the structure and quantity of adsorption tank 14.
Disclosure embodiment also provides a kind of transfer method of micro- light emitting diode, the transfer for above embodiment
Equipment, can be by micro- light emitting diode transfer method, the transfer method can include:
Step S110, multiple micro- light emitting diodes are placed in solution.
Step S120, the part cylinder side wall of the roller is immersed into the solution, and rotates the roller circumferentially.
Step S130, negative pressure is generated in the cavity by the aperture, under the action of negative pressure, micro- light-emitting diodes
One end of pipe is adsorbed in the adsorption tank.
Step S140, the micro- light emitting diode of absorption on which cylinder is transferred on substrate.
In the transfer method of disclosure embodiment, the structure of micro- light emitting diode be can refer in above-mentioned transfer equipment
Micro- light emitting diode, this will not be detailed here.The solution can be the solution such as aqueous isopropanol, as long as micro- light emitting diode can be made outstanding
It is floating, and micro- light emitting diode service performance is not damaged.Substrate can be the driving plate for installing micro- light emitting diode, this turn
Shifting method detail in transfer equipment working principle to be described, and details are not described herein.
For example, in one embodiment, step S140 may include step S1410 and step S1420, in which:
Step S1410, multiple adhesive pads are set on substrate, and the quantity of adhesive pad and the quantity of adsorption tank are identical, and institute
State adhesive pad distribution mode be launched into plane with the cylinder side wall after the distribution mode of each adsorption tank it is consistent.
Step S1420, the roller for being adsorbed with micro- light emitting diode is moved along preset direction level on the substrate
It is dynamic, meanwhile, it rotates the roller circumferentially, micro- light emitting diode of each adsorption tank absorption is glued correspondingly
It is connected in each adhesive pad.
As shown in Figure 10, Figure 12 and Figure 13, multiple adhesive pads 300, the quantity of adhesive pad 300 can be set on substrate 200
The consistent of the adsorption tank 14 after plane is launched into cylinder side wall 11 with distribution mode；Then, it is located at bottom for what roller 1 adsorbed
100 adhesive substrates 200 of micro- light emitting diode, and move horizontally roller 1 along preset direction, and rotate roller 1 circumferentially,
To which the first end for micro- light emitting diode 100 that each adsorption tank 14 adsorbs is adhered to each adhesive pad 300 correspondingly
On, realize the transfer to micro- light emitting diode 100.Detailed process can refer to the course of work of above equipment, no longer superfluous herein
It states.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to its of the disclosure
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by appended
Claim is pointed out.
Claims (10)
1. a kind of transfer equipment, for micro- light emitting diode to be transferred to substrate, which is characterized in that the transfer equipment packet
It includes:
Roller, the roller include a side wall, cylinder end wall and the cavity surrounded by the cylinder side wall and the cylinder end wall；The cylinder
The outer peripheral surface of side wall is equipped with multiple adsorption tanks of circumferentially array arrangement, and the cavity is connected to the bottom of each adsorption tank；
Each adsorption tank is gradually tapered up along depth direction towards the roller central axes, and one end with micro- light emitting diode
Matching, for adsorbing micro- light emitting diode；
The cylinder end wall is equipped with the aperture being connected to the cavity, makes the cavity form negative pressure state by the aperture.
2. transfer equipment according to claim 1, which is characterized in that at least one described cylinder end wall is equipped with multiple drainings
Hole, the drainage hole are connected to the cavity, and the outer peripheral surface most narrow spacing in the radial direction of the drainage hole and the cylinder side wall
From the thickness for being greater than the cylinder side wall.
3. transfer equipment according to claim 2, which is characterized in that the center of the aperture is located at the center of the roller
Line；The roller further include:
Shaft is arranged in the aperture, and is fixedly connected with the cylinder end wall, and at least one end of the shaft is located at the sky
Outside chamber；The outer peripheral surface of the part of the shaft position in the cavity is equipped with stomata, is equipped with air flue, the air flue in the shaft
One end be connected to the stomata, it is outer and for open end that the other end of the air flue extends to the roller；
Negative pressure component is connected to the open end of the air flue, forms negative pressure in the cavity for making.
4. transfer equipment according to claim 2, which is characterized in that the bottom of each adsorption tank be equipped with it is described
The adsorption hole of cavity connection, the drainage hole are greater than the adsorption hole.
5. transfer equipment according to claim 1, which is characterized in that the adsorption tank is positive prism-frustum-shaped structure or round table-like
Structure.
6. transfer equipment according to claim 1-5, which is characterized in that the transfer equipment further include:
Accommodation groove, for holding solution.
7. transfer equipment according to claim 6, which is characterized in that the transfer equipment further include:
Rotary drive assembly is connect with the roller, for driving the roller circumferentially to rotate；
Carrying mechanism is connect with the rotary drive assembly, for driving the roller to remove or partially moving into the accommodation groove,
And when the roller is located at outside the accommodation groove, the carrying mechanism is for driving the roller to move along preset direction level
It is dynamic.
8. transfer equipment according to claim 7, which is characterized in that the substrate has installing zone and is separated in the peace
The first positioning area and the second positioning area of area two sides are filled, the installing zone is for installing micro- light emitting diode；
The transfer equipment further include:
Positioning component, for detecting whether the roller is located at position with the first positioning area face, and described in detection
Whether roller is located at the second position with the second positioning area face；
When the positioning component detects that the roller is located at the first position with the first positioning area face, the positioning
Component can control the carrying mechanism and the roller driven to move horizontally along the preset direction, and control the rotation driving group
Part drives roller rotation, and the direction of the roller any the linear velocity farthest apart from the substrate is towards described second
Positioning area；
When the positioning component detects that the roller is located at the second position with the second positioning area face, the positioning
Component, which can control the carrying mechanism, moves horizontally the roller stopping, and the control rotary drive assembly makes the roller
It stops operating.
9. a kind of transfer method of micro- light emitting diode, using the described in any item transfer equipments of claim 1-8, feature exists
In the transfer method includes:
Multiple micro- light emitting diodes are placed in solution；
The part cylinder side wall of the roller is immersed into the solution, and rotates the roller circumferentially；
Negative pressure is generated in the cavity by the aperture, under the action of negative pressure, micro- light emitting diode is adsorbed on described
In adsorption tank；
The micro- light emitting diode of absorption on which cylinder is transferred on substrate.
10. transfer method according to claim 9, which is characterized in that by absorption on which cylinder it is described it is micro- shine
Diode is transferred on substrate, comprising:
Multiple adhesive pads are set on substrate, and the quantity of the adhesive pad is identical as the quantity of the adsorption tank, and the bonding
The distribution mode of each adsorption tank after the distribution mode of pad is launched into plane with the cylinder side wall is consistent；
The roller for being adsorbed with micro- light emitting diode is moved horizontally along preset direction on the substrate, meanwhile, make described
Roller circumferentially rotates, and micro- light emitting diode of each adsorption tank absorption is adhered to correspondingly each described viscous
On connection pad.
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| CN112967991A (en) * | 2020-11-25 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Transfer device, system and method |
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| WO2021237529A1 (en) * | 2020-05-27 | 2021-12-02 | 重庆康佳光电技术研究院有限公司 | Mass transfer device and transfer method thereof |
| CN113964147A (en) * | 2021-10-21 | 2022-01-21 | 上海天马微电子有限公司 | Display panel, assembling method thereof and display device |
| CN115621378A (en) * | 2022-10-21 | 2023-01-17 | 惠科股份有限公司 | Chip transfer device, system and display panel |
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