CN110021487B - APG back pressure pouring method and system thereof - Google Patents
APG back pressure pouring method and system thereof Download PDFInfo
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- CN110021487B CN110021487B CN201910129642.4A CN201910129642A CN110021487B CN 110021487 B CN110021487 B CN 110021487B CN 201910129642 A CN201910129642 A CN 201910129642A CN 110021487 B CN110021487 B CN 110021487B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
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Abstract
The invention discloses an APG back pressure pouring method and a system thereof. The APG back pressure casting method comprises the following steps: the mold device after mold closing and mold closing is provided with a mold cavity, a material injection nozzle of the mold device, a feeding device filled with mixed epoxy resin materials, and a back pressure air inlet and a pressure supply device which are connected with the mold device are communicated; the pressure supply device supplies pressure to the mold cavity through the backpressure air inlet so as to form constant backpressure P1 in the mold cavity; introducing pushing air pressure P2 into the feeding device, wherein P2 is more than P1, P2-P1 is delta P, the epoxy resin material of the feeding device is filled into the die cavity through the material injection nozzle under the pushing action of the delta P, and the constant back pressure P1 is kept unchanged in the filling process; when the epoxy resin material fills the mold cavity, the constant back pressure P1 is increased to stop the filling, and the epoxy resin material is cured under this pressure, keeping adjusted P1 and P2. It has the following advantages: the product size is more stable, and the yield is improved.
Description
Technical Field
The invention relates to the field of APG production, in particular to an APG back pressure pouring method and an APG back pressure pouring system.
Background
An APG (automatic pressure gelation) pouring method, such as a pouring method of a solid-sealed polar pole of power equipment, such as CN107706040A, a production method of the solid-sealed polar pole, which comprises the following steps: s01, fixing the upper wiring terminal at the corresponding position of the female die in the forming die; s02, fixing the lower wiring terminal at the corresponding position of a female die in a forming die; s03, bonding the part of the heat pipe, which is to be positioned in the second diversion trench, to the notch of the mold core in the forming mold, ensuring that all the heat pipes are correspondingly bonded to the notch, and then fixing the whole mold core in the cavity of the female mold; s04, injecting molten plastic into the cavity of the forming mold to complete encapsulation of the upper wiring terminal, the lower wiring terminal and the heat pipe, removing the female mold after the plastic is solidified, and then extracting the mold core to obtain a semi-finished product of the solid-encapsulated terminal; s05, sequentially installing a vacuum arc extinguish chamber and a base in the semi-finished product of the solid-sealed polar pole, and finally connecting the outlet end at the lower end of the vacuum arc extinguish chamber with the lower wiring terminal through soft connection to obtain the finished product of the solid-sealed polar pole. The casting method comprises the following steps: the normal pressure setting in the mould die cavity in the pouring process, the difficult discharge of gas in the mould die cavity leads to the filling material can't fill up the die cavity, exists gappedly in the die cavity, and then leads to the rejection rate to increase.
Disclosure of Invention
The invention provides an APG back pressure pouring method and a system thereof, which overcome the defects of the APG pouring method in the background art.
One of the technical schemes adopted by the invention for solving the technical problems is as follows:
the APG back pressure casting method comprises the following steps:
step 2, the pressure supply device supplies pressure to the mold cavity through the backpressure air inlet so as to form constant backpressure P1 in the mold cavity;
step 3, introducing material pushing air pressure P2 into the feeding device, wherein P2 is greater than P1, P2-P1 is delta P, the epoxy resin material of the feeding device is filled into a mold cavity through the material injection nozzle under the pushing action of the delta P, and the constant back pressure P1 is kept unchanged in the filling process;
and 4, when the epoxy resin material is filled in the die cavity, increasing the constant back pressure P1 to stop filling, and keeping the adjusted P1 and P2 to finish curing the epoxy resin material under the pressure.
In one embodiment: and (3) arranging a control valve between the material injection nozzle and the feeding device of the die device, and in the step 3, adjusting the flow of the epoxy resin material through the control valve to enable the material injection speed of the epoxy resin material to be uniform.
In one embodiment: an electronic scale is arranged below the feeding device, and a control system is additionally arranged to connect the electronic scale and the control valve so as to drive the control valve to realize flow regulation of the epoxy resin material according to the weight of the feeding device in step 3.
In one embodiment: the pressure supply device is a first pressure supply device; the feeding device is also connected with a second pressure supply device which is connected with the feeding device so as to lead the pushing air pressure P2 to be introduced, and the P2 is kept constant.
The second technical scheme adopted by the invention for solving the technical problems is as follows:
the APG back pressure casting system comprises a mould device, a feeding device and a pressure supply device, wherein the feeding device can be filled with mixed epoxy resin materials; the mold device is provided with a mold cavity, a material injection nozzle capable of communicating with the mold cavity and a back pressure air inlet; the pressure supply device is connected with a back pressure air inlet of the mould device so as to form back pressure in the mould cavity; the feeding device is communicated with a material injection nozzle of the die device, material pushing air pressure P2 is introduced into the feeding device, the P2 is greater than the back pressure, so that the epoxy resin material of the feeding device is filled into a die cavity through the material injection nozzle under the action of the pressure difference between the P2 and the back pressure, and the back pressure is kept unchanged in the filling process; wherein: when the epoxy resin material fills the mold cavity, the back pressure is adjusted to stop the filling, and the adjusted back pressure and P2 are maintained, at which pressure the epoxy resin material is cured.
In one embodiment: a control valve is arranged between an injection nozzle and a feeding device of the die device, an electronic scale is arranged below the feeding device, and a control system is additionally arranged to be connected with the electronic scale and the control valve so as to drive the control valve to realize flow regulation of the epoxy resin material according to the weight of the feeding device, so that the injection speed of the epoxy resin material is uniform.
In one embodiment: the control valve comprises a clamping mechanism for clamping the material injection hose and a driving mechanism, the control system is connected with the driving mechanism, the driving mechanism is in transmission connection with the clamping mechanism, and the material passing cross-sectional area of the material injection hose is controlled through the clamping force of the clamping mechanism so as to adjust the flow of the epoxy resin material.
In one embodiment: the pressure supply device is a first pressure supply device; the feeding device is also connected with a second pressure supply device which is connected with the feeding device to introduce a material pushing air pressure P2, and the P2 is kept constant.
In one embodiment: the pressure supply device is provided with a pressure control mechanism which is connected with a back pressure air inlet of the die device to control back pressure; the material injection nozzle and the back pressure air inlet are respectively arranged at two ends of the mold cavity.
In one embodiment: the die device comprises a static die, a movable die and a lower core, wherein the static die, the movable die and the lower core are matched to form a die cavity after die assembly.
Compared with the background technology, the technical scheme has the following advantages:
the pressure supply device supplies pressure to the mold cavity through the backpressure air inlet so as to form constant backpressure P1 in the mold cavity, the epoxy resin material of the pressure supply device is filled into the mold cavity through the material injection nozzle under the pushing action of delta P, the constant backpressure P1 is kept unchanged in the filling process, when the mold cavity is filled with the epoxy resin material, the constant backpressure P1 is increased so that the filling is stopped, the adjusted P1 and P2 are kept, the epoxy resin material is cured under the pressure, air in the mold cavity can be discharged through the arrangement, the material is better filled into a gap, the internal stress caused by curing shrinkage is reduced, the pressure can be effectively supplemented so as to avoid shrinkage caused by material curing shrinkage, the size of a product is more stable, and the yield is improved.
The flow of the epoxy resin material is adjusted by the control valve, so that the material injection speed of the epoxy resin material is uniform, the yield of products can be improved, and the control production is convenient.
And an electronic scale is arranged below the feeding device, and a control system is additionally arranged to connect the electronic scale and the control valve so as to drive the control valve to realize flow regulation of the epoxy resin material in step 3 according to the weight of the feeding device, so that the control is simple, convenient and effective.
Drawings
The invention is further described with reference to the following figures and detailed description.
Fig. 1 is a perspective view of a mold apparatus according to an embodiment.
Fig. 2 is a perspective view of a stationary mold of the mold apparatus according to the embodiment.
Fig. 3 is a schematic perspective view of a movable mold of the mold apparatus according to the embodiment.
Fig. 4 is a perspective view of a mold core of the mold apparatus of the embodiment.
Detailed Description
Referring to fig. 1 to 4, the APG back pressure casting system includes a mold device 1, a feeding device, such as a movable tank, and a first pressure supplying device, wherein the feeding device can be filled with mixed epoxy resin material; the die device 1 comprises a static die 11, a movable die 12 and a lower core 13, for example, when a solid-sealed pole is manufactured, a vacuum arc-extinguishing chamber, a movable die head, an upper conductive connecting terminal, a lower conductive connecting terminal and the like (embedded materials) are also required to be arranged in the die device 1 in the production process, and the static die, the movable die, the embedded materials and the lower core are matched to form a die cavity after die assembly. The mold device 1 is provided with a material injection nozzle 14 and a backpressure air inlet 15 which can be communicated with a mold cavity, a flash tank 16 communicated with the mold cavity is further arranged in the mold device according to requirements, and the flash tank 16 is provided with an exhaust groove 17 and the backpressure air inlet 15. The injection nozzle and the flash tank 16 are respectively provided at both ends of the mold cavity, and the injection nozzle and the back pressure air inlet are respectively provided at both ends of the mold cavity. The first pressure supply device is connected with a back pressure air inlet of the mould device so as to form back pressure in the mould cavity; the feeding device is communicated with the material injection nozzle of the die device through a material injection hose, material pushing air pressure P2 is introduced into the feeding device, the P2 is larger than the back pressure, so that the epoxy resin material of the feeding device is filled into a die cavity through the material injection nozzle under the action of the pressure difference between the P2 and the back pressure, and the back pressure is kept unchanged in the filling process. When the epoxy resin material fills the mold cavity, the back pressure is adjusted to stop the filling, and the adjusted back pressure and P2 are maintained, at which pressure the epoxy resin material is cured.
According to the requirement, a control valve is arranged between the material injection nozzle and the feeding device of the mold device, an electronic scale is arranged below the feeding device, and a control system is additionally arranged to be connected with the electronic scale and the control valve so as to drive the control valve to realize flow regulation of the epoxy resin material according to the weight of the feeding device, so that the material injection speed of the epoxy resin material is uniform. The control system is a PLC; the control valve comprises a clamping mechanism for clamping the material injection hose and a driving mechanism, the control system is connected with the driving mechanism, the driving mechanism is in transmission connection with the clamping mechanism, and the material passing cross-sectional area of the material injection hose is controlled through the clamping force of the clamping mechanism so as to adjust the flow of the epoxy resin material. Furthermore, if the clamp mechanism comprises two clamp sheets with middle parts rotatably connected, the driving mechanism comprises a telescopic mechanism, the two telescopic mechanisms are propped between the first ends of the clamp sheets, the second ends of the clamp sheets are clamped with the material injection hoses, the clamping force of the clamp mechanism can be controlled through the telescopic action of the telescopic mechanism, when the filling flow becomes small, the clamping force is released, the material passing area of the hoses is increased, and the flow is increased; otherwise, the clamping force is increased. Alternatively, the control valve may be a solenoid valve for controlling the flow rate.
The feeding device is also connected with a second pressure supply device which is connected with the feeding device to introduce a material pushing air pressure P2, and the P2 is kept constant. The first pressure supply device is provided with a pressure control mechanism, the pressure control mechanism is connected with a back pressure air inlet of the die device to control back pressure, and the pressure control mechanism is a pressure regulating valve. In this embodiment, the first and second pressure supply devices include, for example, a valve mechanism connected to a pressure source.
The APG back pressure casting method comprises the following steps:
step 2, the first pressure supply device supplies pressure to the mold cavity through the backpressure air inlet so as to form constant backpressure P1 in the mold cavity;
step 3, installing an electronic scale below the movable tank, introducing pushing air pressure with pressure of P2 into the movable tank through a second pressure supply device, wherein P2 is greater than P1, P2-P1 is delta P, epoxy resin materials of the feeding device are filled into a mold cavity through a material injection nozzle under the pushing action of the delta P, and constant back pressure P1 is kept unchanged in the filling process; moreover, the control valve is driven according to the weight of the feeding device to realize the flow regulation of the epoxy resin material, so that the material injection speed of the epoxy resin material is uniform; further, if the control valve is connected with the electronic scale through the PLC, a material injection rate curve is set through the PLC, when the material injection rate is higher than the set rate, the flow is controlled to be reduced, the material injection rate is reduced, when the material injection rate is lower than the set rate, the flow is controlled to be increased, the material injection rate is increased, and finally the material injection time (from material injection to cavity filling) of each mold is kept unchanged;
and 4, when the epoxy resin material fills the mold cavity, increasing the constant back pressure P1, stopping filling if P1 is equal to P2, and keeping the adjusted P1 and P2, wherein the epoxy resin material is cured under the pressure.
The above description is only a preferred embodiment of the present invention, and therefore should not be taken as limiting the scope of the invention, which is defined by the appended claims and their equivalents.
Claims (10)
- The APG back pressure casting method is characterized by comprising the following steps: the method comprises the following steps:step 1, the die device after die assembly is provided with a die cavity, a material injection nozzle of the die device, a feeding device filled with mixed epoxy resin materials, and a back pressure air inlet and a pressure supply device which are connected with the die device are communicated;step 2, the pressure supply device supplies pressure to the mold cavity through the backpressure air inlet so as to form constant backpressure P1 in the mold cavity;step 3, introducing material pushing air pressure P2 into the feeding device, wherein P2 is greater than P1, P2-P1 is delta P, the epoxy resin material of the feeding device is filled into a mold cavity through the material injection nozzle under the pushing action of the delta P, and the constant back pressure P1 is kept unchanged in the filling process;and 4, when the epoxy resin material is filled in the die cavity, increasing the constant back pressure P1 to stop filling, and keeping the adjusted P1 and P2 to finish curing the epoxy resin material under the pressure.
- 2. The APG back pressure casting method of claim 1, wherein: and (3) arranging a control valve between the material injection nozzle and the feeding device of the die device, and in the step 3, adjusting the flow of the epoxy resin material through the control valve to enable the material injection speed of the epoxy resin material to be uniform.
- 3. The APG back pressure casting method of claim 2, wherein: an electronic scale is arranged below the feeding device, and a control system is additionally arranged to connect the electronic scale and the control valve so as to drive the control valve to realize flow regulation of the epoxy resin material according to the weight of the feeding device in step 3.
- 4. The APG back pressure casting method of claim 1, wherein: the pressure supply device is a first pressure supply device; the feeding device is also connected with a second pressure supply device which is connected with the feeding device so as to lead the pushing air pressure P2 to be introduced, and the P2 is kept constant.
- The APG back pressure gating system is characterized in that: the device comprises a die device, a feeding device and a pressure supply device, wherein the feeding device can be filled with well-mixed epoxy resin materials; the mold device is provided with a mold cavity, a material injection nozzle capable of communicating with the mold cavity and a back pressure air inlet; the pressure supply device is connected with a back pressure air inlet of the mould device so as to form back pressure in the mould cavity; the feeding device is communicated with a material injection nozzle of the die device, material pushing air pressure P2 is introduced into the feeding device, the P2 is greater than the back pressure, so that the epoxy resin material of the feeding device is filled into a die cavity through the material injection nozzle under the action of the pressure difference between the P2 and the back pressure, and the back pressure is kept unchanged in the filling process; wherein: when the epoxy resin material fills the mold cavity, the back pressure is adjusted to stop the filling, and the adjusted back pressure and P2 are maintained, at which pressure the epoxy resin material is cured.
- 6. The APG back pressure gating system of claim 5, wherein: a control valve is arranged between an injection nozzle and a feeding device of the die device, an electronic scale is arranged below the feeding device, and a control system is additionally arranged to be connected with the electronic scale and the control valve so as to drive the control valve to realize flow regulation of the epoxy resin material according to the weight of the feeding device, so that the injection speed of the epoxy resin material is uniform.
- 7. The APG back pressure gating system of claim 6, wherein: the control valve comprises a clamping mechanism for clamping the material injection hose and a driving mechanism, the control system is connected with the driving mechanism, the driving mechanism is in transmission connection with the clamping mechanism, and the material passing cross-sectional area of the material injection hose is controlled through the clamping force of the clamping mechanism so as to adjust the flow of the epoxy resin material.
- 8. The APG back pressure gating system of claim 5, wherein: the pressure supply device is a first pressure supply device; the feeding device is also connected with a second pressure supply device which is connected with the feeding device to introduce a material pushing air pressure P2, and the P2 is kept constant.
- 9. The APG back pressure gating system of claim 5, wherein: the pressure supply device is provided with a pressure control mechanism which is connected with a back pressure air inlet of the die device to control back pressure; the material injection nozzle and the back pressure air inlet are respectively arranged at two ends of the mold cavity.
- 10. The APG back pressure gating system of claim 5, wherein: the die device comprises a static die, a movable die and a lower core, wherein the static die, the movable die and the lower core are matched to form a die cavity after die assembly.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910129642.4A CN110021487B (en) | 2019-02-21 | 2019-02-21 | APG back pressure pouring method and system thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910129642.4A CN110021487B (en) | 2019-02-21 | 2019-02-21 | APG back pressure pouring method and system thereof |
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| CN110021487A CN110021487A (en) | 2019-07-16 |
| CN110021487B true CN110021487B (en) | 2020-11-06 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3699865B2 (en) * | 1999-08-03 | 2005-09-28 | 株式会社東芝 | Casting device, mold release device, and protective jig |
| CN100543900C (en) * | 2007-08-03 | 2009-09-23 | 北海银河开关设备有限公司 | The production technology of solid sealing electrode pole of high voltage vacuum breaker |
| CN201342778Y (en) * | 2009-02-12 | 2009-11-11 | 麦克奥迪（厦门）电气有限公司 | Automatic material feeding device for APG process |
| US20110173977A1 (en) * | 2009-08-10 | 2011-07-21 | Antonio Ancona | HP Generator |
| CN101767394B (en) * | 2010-01-14 | 2012-02-15 | 浙江雷安电气有限公司 | Automatic control system of epoxy resin gel forming machine |
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