CN110014572A - Polymer-based insulating heat-conductive composite material and preparation method - Google Patents
Polymer-based insulating heat-conductive composite material and preparation method Download PDFInfo
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- CN110014572A CN110014572A CN201710904007.XA CN201710904007A CN110014572A CN 110014572 A CN110014572 A CN 110014572A CN 201710904007 A CN201710904007 A CN 201710904007A CN 110014572 A CN110014572 A CN 110014572A
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- insulating heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
- B29C48/18—Articles comprising two or more components, e.g. co-extruded layers the components being layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
- B29C48/49—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using two or more extruders to feed one die or nozzle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/42—Alternating layers, e.g. ABAB(C), AABBAABB(C)
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of polymer-based insulating heat-conductive composite materials, the composite material be by following polymer-based/conductive and heat-conductive filler pre-composition, polymer-based/insulating heat-conductive filler pre-composition through fusion plastification, n times stratiform overlaps and the 2(n+1 that is formed) layer thermally conductive layer, the thermal insulation layer composite material or 2(n+1 of the special double Chongqing infiltration structures that are arranged alternately) composite material that+1 layer of thermally conductive layer, thermal insulation layer are arranged alternately, wherein the outermost end of material is thermal insulation layer.The present invention also provides the preparation methods of the composite material.In composite material of the invention, polymer and filler are without carrying out specially treated, and preparation method simple process, and convenient operation and control, high production efficiency, production cost is low, have wide industrialization and market prospects.
Description
Technical field
The invention belongs to polymeric material fields, and in particular to a kind of polymer-based insulating heat-conductive composite material and its preparation
Method.
Background technique
Currently, its localized heat release phenomenon is particularly acute with the integrated of electronic component, high speed and high frequency,
This can not only reduce its working efficiency, but will shortening its service life at double.Therefore, in order to solve this problem, have all
More scholars are dedicated to developing novel high-efficiency heat conduction composite material.Wherein, since polymer-based material has light weight, corrosion resistant
Erosion, it is at low cost the advantages that and widely paid close attention to.For electronic component safety in operation the considerations of, and to thermally conductive compound
Material proposes the requirement of high-insulativity, because when the heat-conductive composite material with certain electric conductivity is applied to electronic packaging
When, the short circuit even behavior of electric leakage are easily brought it about, this also just significantly limits conductive and heat-conductive composite material in this field
Application.Therefore, how that the heating conduction of composite material entirety is efficient, become and limits it and develop mostly important problem.
Currently, being related to most being the directional profile for realizing filler, to improve its local concentration, and then the entirety of reinforcing material is thermally conductive
Performance.But this method process is cumbersome, and the directional profile region of filler is uncontrollable, but it is in disorganized form, make
Material overall performance deviation is larger and performance is single and is difficult to be promoted.
On design on material structure in the present invention, by the oriented and ordered distribution of filler can effective solution it is above-mentioned
Problem, so that the heating conduction of material is more efficient and the diversification of function.Such as in one layer of its alternating laminated structure
Conductive and heat-conductive filler is added, insulating heat-conductive filler is in addition added in one layer, and guarantee that thermal insulation layer is contacted with electronic component,
It can both guarantee the integral insulation of material in this way, it is ensured that the safe operation of electronic component, while there is more high heat conductance
Thermally conductive layer can also play positive synergistic effect to thermal insulation layer on perpendicular to layer direction, improve the heat of material entirety
Conductance, that is to say, that can reach higher thermal coefficient in the insulating heat-conductive filler using lower content and assign simultaneously
Material certain antistatic property and electromagnetic shielding performance are given, answers it available in electronics field more wide
With.In addition, the dosage of the insulating heat-conductive filler of more high price in material can also be effectively reduced by the adjusting of Thickness ratio,
Increase the highly efficient and cheap application to conductive and heat-conductive filler simultaneously, so as to reduce material overall cost
Under the premise of further enhance its heating conduction.
Summary of the invention
In view of the above shortcomings of the prior art, the present invention provides a kind of polymer-based insulating heat-conductive composite material and its systems
Preparation Method, which can improve the heating conduction of material on the basis of cost reduction, and realize the multi-functional of material
Change.
The scheme that the present invention solves technical problem is: a kind of polymer-based insulating heat-conductive composite material, the composite material are
By following polymer-based/conductive and heat-conductive filler pre-composition, polymer-based/insulating heat-conductive filler pre-composition through fusion plastification, n times layer
Shape overlapping and the 2(n+1 formed) special double Chongqings for being arranged alternately of layer thermally conductive layer, thermal insulation layer seep the composite materials of structures
Or 2(n+1) composite material that+1 layer of thermally conductive layer, thermal insulation layer are arranged alternately, wherein the outermost end of material is insulation
Heat-conducting layer.
Selected high molecular polymer can be the thermoplastics such as polyolefins, polyamide-based, polyesters, polyethers
One or both of.
Selected conductive and heat-conductive filler can be graphite, carbon black, graphene, carbon nanotube, copper, silver, gold, aluminium, in nickel
One or more.
Selected insulating heat-conductive filler can be silicon carbide, boron carbide, titanium carbide, zirconium carbide, chromium carbide, tungsten carbide,
One or more of silicon nitride, boron nitride, aluminium nitride, beryllium oxide, aluminium oxide and zinc oxide.
The additive amount of its conductive and heat-conductive filler is more than or equal to 3wt% with thermally conductive layer total mass ratio.
The additive amount of its insulating heat-conductive filler is more than or equal to 5wt% with thermal insulation layer total mass ratio.
The present invention also provides the preparation methods of above-mentioned polymer-based insulating heat-conductive composite material, it includes following operation step
It is rapid:
1) it stirs machine using height uniformly to mix polymer by a certain percentage with conductive and heat-conductive filler or insulating heat-conductive filler, and vacuum
It is dried, for use；
2) said mixture is squeezed out using double screw extruder, granulation forms pre-composition, and is dried again；
3) by above-mentioned polymer/conductive and heat-conductive filler pre-composition, polymer/insulating heat-conductive filler pre-composition respectively by extruder A,
B melting extrusion, the microbedding co-extrusion that the junction station (C) being connected using same two extruders, layer multiplier (D), chill roll are constituted
Device is prepared into total 2(n+1) layer or 2(n+1) special double Chongqings for being arranged alternately of+1 layer of thermally conductive layer, thermal insulation layer seep knot
The composite material of structure.
The invention patent has the advantage that
1) composite material of the present invention is superimposed by thermally conductive layer and thermal insulation layer, realizes material overall thermal conductivity energy
Positive synergy, while realizing the multifunction of material, it can meet prevent needed for current electronics field it is quiet
The diversity requirements such as electrical and electromagnetic wave shielding.Specifically, compared to independent thermal insulation layer (identical filer content)
0.91w/ (m × k), the multilayer materials thermal conductivity containing thermally conductive layer are up to 1.43w/ (m × k), electromagnetic shielding
Performance has also increased up to 45dB from 23dB, and parallel direction resistivity is equally reduced to from 1.5 × 1010(Ω × cm)
1.05 × 104(Ω × cm), and vertical direction resistivity can be always in 1.5 × 1010(Ω × cm) (maximum range of equipment,
Equaling or exceeding this value explanation has been absolute insulator) more than.
2) composite material of the invention is due to being the segmentation realized in this special structure of layer multiplier, overlapping, i.e.,
It is realized under melt state, so the bonding situation at bed boundary is very well, very securely, the mechanical property of material will not be damaged
Deng.Instead due to two layers of complementation, mechanical property increases.
3) the one-shot forming technique preparation method simple process that preparation method of the present invention uses lamellar composite to squeeze out, operation control
System is convenient；By the extrusion rotating ratio of regulation and control two extruders, adjustable thermally conductive layer and thermal insulation layer
Thickness, by the quantity of control increase and decrease layer multiplier, adjustable thickness in monolayer and the whole number of plies, so as to realize performance and
The regulation of function.It specifically when expanding the thickness ratio of thermally conductive layer and thermal insulation layer, may be implemented that insulation is greatly reduced
Heat-conducting layer filer content reduces cost and greatly improves material overall thermal conductivity, parallel conductive electrical property and electromagnetic wave shielding, further
Realize the high performance and multifunction of material.
4) present invention also can regulate and control whole performance parameter by changing the recipe ingredient of material, and enhancing component is such as added
The mechanical property of material is adjusted with toughening element；Ceramic-like component is added to adjust the hot property of material；Ferromagnetism object is added
Matter increases its magnetic induction performance etc., it can realizes the function combination and performance optimization of material in a wide range.
In composite material of the invention, polymer and filler are grasped without carrying out specially treated, and preparation method simple process
Make easy to control, high production efficiency, production cost is low, has wide industrialization and market prospects.
Specific embodiment
Below with reference to embodiment, the present invention is described in further detail:
Embodiment:
Polymer-based insulating heat-conductive composite material of the invention, the composite material are by following polymer-based/conductive and heat-conductive filler
Pre-composition, polymer-based/insulating heat-conductive filler pre-composition is overlapped through fusion plastification, n times stratiform and the 2(n+1 of formation) layer conduction
Seep the composite material or 2(n+1 of structures in special double Chongqings that heat-conducting layer, thermal insulation layer are arranged alternately)+1 layer of thermally conductive layer, absolutely
The composite material that edge heat-conducting layer is arranged alternately, wherein the outermost end of material is thermal insulation layer.
Selected high molecular polymer can be the thermoplastics such as polyolefins, polyamide-based, polyesters, polyethers
One or both of.
Selected conductive and heat-conductive filler can be graphite, carbon black, graphene, carbon nanotube, copper, silver, gold, aluminium, in nickel
One or more.
Selected insulating heat-conductive filler can be silicon carbide, boron carbide, titanium carbide, zirconium carbide, chromium carbide, tungsten carbide,
One or more of silicon nitride, boron nitride, aluminium nitride, beryllium oxide, aluminium oxide and zinc oxide.
The additive amount of its conductive and heat-conductive filler is more than or equal to 3wt% with thermally conductive layer total mass ratio.
The additive amount of its insulating heat-conductive filler is more than or equal to 5wt% with thermal insulation layer total mass ratio.
The present invention also provides the preparation methods of polymer-based insulating heat-conductive composite material, it includes following operating procedure:
1) it stirs machine using height uniformly to mix polymer by a certain percentage with conductive and heat-conductive filler or insulating heat-conductive filler, and vacuum
It is dried, for use；
2) said mixture is squeezed out using double screw extruder, granulation forms pre-composition, and is dried again；
3) by above-mentioned polymer/conductive and heat-conductive filler pre-composition, polymer/insulating heat-conductive filler pre-composition respectively by extruder A,
B melting extrusion, the microbedding co-extrusion that the junction station (C) being connected using same two extruders, layer multiplier (D), chill roll are constituted
Device is prepared into total 2(n+1) layer or 2(n+1) special double Chongqings for being arranged alternately of+1 layer of thermally conductive layer, thermal insulation layer seep knot
The composite material of structure.
In composite material of the invention, polymer and filler are grasped without carrying out specially treated, and preparation method simple process
Make easy to control, high production efficiency, production cost is low, has wide industrialization and market prospects.
Claims (7)
1. a kind of polymer-based insulating heat-conductive composite material, it is characterised in that: the composite material is by following polymer-based/conductive
Heat filling pre-composition, polymer-based/insulating heat-conductive filler pre-composition is overlapped through fusion plastification, n times stratiform and the 2(n+ of formation
1) composite material or 2(n+1 of structures are seeped in special double Chongqings that layer thermally conductive layer, thermal insulation layer are arranged alternately)+1 layer of conduction lead
The composite material that thermosphere, thermal insulation layer are arranged alternately, wherein the outermost end of material is thermal insulation layer.
2. polymer-based insulating heat-conductive composite material according to claim 1, it is characterised in that: selected polyphosphazene polymer
Closing object can be one or both of thermoplastics such as polyolefins, polyamide-based, polyesters, polyethers.
3. polymer-based insulating heat-conductive composite material according to claim 1, it is characterised in that: selected conductive and heat-conductive
Filler can be one or more of graphite, carbon black, graphene, carbon nanotube, copper, silver, gold, aluminium, nickel.
4. polymer-based insulating heat-conductive composite material according to claim 1, it is characterised in that: selected insulating heat-conductive
Filler can be silicon carbide, boron carbide, titanium carbide, zirconium carbide, chromium carbide, tungsten carbide, silicon nitride, boron nitride, aluminium nitride, oxidation
One or more of beryllium, aluminium oxide and zinc oxide.
5. polymer-based insulating heat-conductive composite material according to claim 1 or 3, it is characterised in that: its conductive and heat-conductive is filled out
The additive amount of material is more than or equal to 3wt% with thermally conductive layer total mass ratio.
6. polymer-based insulating heat-conductive composite material according to claim 1 or 4, it is characterised in that: its insulating heat-conductive is filled out
The additive amount of material is more than or equal to 5wt% with thermal insulation layer total mass ratio.
7. the preparation method of polymer-based insulating heat-conductive composite material described in claim 1~6 any one, it is characterised in that:
It includes following operating procedure:
1) it stirs machine using height uniformly to mix polymer by a certain percentage with conductive and heat-conductive filler or insulating heat-conductive filler, and vacuum
It is dried, for use；
2) said mixture is squeezed out using double screw extruder, granulation forms pre-composition, and is dried again；
3) by above-mentioned polymer/conductive and heat-conductive filler pre-composition, polymer/insulating heat-conductive filler pre-composition respectively by extruder A,
B melting extrusion, the microbedding co-extrusion that the junction station (C) being connected using same two extruders, layer multiplier (D), chill roll are constituted
Device is prepared into total 2(n+1) layer or 2(n+1) special double Chongqings for being arranged alternately of+1 layer of thermally conductive layer, thermal insulation layer seep knot
The composite material of structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710904007.XA CN110014572A (en) | 2017-09-29 | 2017-09-29 | Polymer-based insulating heat-conductive composite material and preparation method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710904007.XA CN110014572A (en) | 2017-09-29 | 2017-09-29 | Polymer-based insulating heat-conductive composite material and preparation method |
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| CN110014572A true CN110014572A (en) | 2019-07-16 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111961333A (en) * | 2020-08-30 | 2020-11-20 | 宁波耀众模塑科技有限公司 | Preparation formula of polyurethane foaming product based on graphite material |
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2017
- 2017-09-29 CN CN201710904007.XA patent/CN110014572A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111961333A (en) * | 2020-08-30 | 2020-11-20 | 宁波耀众模塑科技有限公司 | Preparation formula of polyurethane foaming product based on graphite material |
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Application publication date: 20190716 |