CN110010568A - Elcetronic package structure - Google Patents
Elcetronic package structure Download PDFInfo
- Publication number
- CN110010568A CN110010568A CN201910306326.XA CN201910306326A CN110010568A CN 110010568 A CN110010568 A CN 110010568A CN 201910306326 A CN201910306326 A CN 201910306326A CN 110010568 A CN110010568 A CN 110010568A
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- CN
- China
- Prior art keywords
- package structure
- radiator
- heat release
- socket
- structure according
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of elcetronic package structures.The elcetronic package structure includes radiator, socket and microelectronic core, substrate is provided on the socket, the microelectronic core is set on the substrate, the radiator is layed on the socket and covers the microelectronic core, and multiple heat release holes are offered on the side wall of the radiator.The elcetronic package structure heat dissipation effect is preferable.
Description
Technical field
The present invention relates to a kind of elcetronic package structures.
Background technique
Microelectric technique be with integrated circuit, especially Large Scale integrated circuit and grow up one it is new
Technology.Its theoretical basis developed is at the end of the 19th century to the modern physics set up during the 1930s.Microelectronics
Technology includes that system circuit design, device physics, technology, material preparation, automatically test and encapsulation, assembling etc. are a series of
Special technology, microelectric technique are the summations of every technology in microelectronics.However, microelectronic structure was encapsulating
It is easy to cause heat dissipation effect bad in journey.
Summary of the invention
Based on this, it is necessary to provide a kind of preferable elcetronic package structure of heat dissipation effect.
A kind of elcetronic package structure, including radiator, socket and microelectronic core are provided with lining on the socket
Bottom, the microelectronic core are set on the substrate, and the radiator is layed on the socket and covers micro- electricity
Sub- tube core offers multiple heat release holes on the side wall of the radiator.
In a wherein embodiment, the multiple heat release hole is round hole, and the multiple heat release hole is divided into first
Group heat release hole and second group of heat release hole, first group of heat release hole and second group of heat release hole are located at the radiator
Opposite sides.
It further include intermediary layer in a wherein embodiment, the intermediary layer is set on the socket, described to dissipate
Hot device covers the intermediary layer.
In a wherein embodiment, the radiator includes that roof with two is convexly equipped in the roof opposite two respectively
The side wall of side, first group of heat release hole and second group of heat release hole, which are located at, to be opened on described two side walls.
In a wherein embodiment, be formed with accommodating space between described two side walls, the microelectronic core and
The substrate is located in the accommodating space, and the width of the microelectronic core is less than the width of the substrate.
In a wherein embodiment, the socket includes that bottom plate with two is convexly equipped in the opposite of the bottom plate respectively
The mounting plate of two sides, the intermediary layer are layed on the bottom plate.
In a wherein embodiment, the width of the intermediary layer is greater than the width of the accommodating space, the intermediary
The opposite sides of layer is abutted with the two side walls of the radiator respectively.
In a wherein embodiment, described two mounting plates are fixed to each other with described two side walls respectively, the bottom
The thickness of plate is greater than the thickness of the intermediary layer.
In a wherein embodiment, there are two connected structures for setting on the bottom surface of the socket, described two to insert
Binding structure is oppositely arranged and is located at the opposite sides of the bottom plate.
In a wherein embodiment, each connected structure includes multiple contact pins and multiple solder balls.
It is covered on the microelectronic core and is offered on the side wall of the radiator multiple due to the radiator
Radiator, therefore facilitate the heat dissipation of the microelectronic core, improve heat dissipation effect.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of the elcetronic package structure of an embodiment.
Fig. 2 is the stereoscopic schematic diagram at another visual angle of elcetronic package structure shown in Fig. 1.
Fig. 3 is the package assembling of an embodiment and the perspective exploded view of driving lever component.
Fig. 4 is the perspective exploded view at another visual angle of package assembling shown in Fig. 3 and driving lever component.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term used herein is intended merely to the mesh of description specific embodiment
, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more relevant listed items
Any and all combinations.
The present invention relates to a kind of elcetronic package structures.For example, the elcetronic package structure includes radiator, socket
With microelectronic core, substrate is provided on the socket.For example, the microelectronic core is set on the substrate, it is described
Radiator is layed on the socket and covers the microelectronic core.For example, being offered on the side wall of the radiator more
A heat release hole.
Please refer to Fig. 1 and Fig. 2, a kind of elcetronic package structure 100, including radiator 10, socket 20 and micro electrical tube
Core 30 is provided with substrate 21 on the socket, and the microelectronic core is set on the substrate, and the radiator is layed in
On the socket and the microelectronic core is covered, multiple heat release holes are offered on the side wall of the radiator.
It is covered on the microelectronic core and is offered on the side wall of the radiator multiple due to the radiator
Radiator, therefore facilitate the heat dissipation of the microelectronic core, improve heat dissipation effect.
For example, the multiple heat release hole is round hole, and the multiple heat release hole is divided into for the ease of improving heat dissipation effect
First group of heat release hole and second group of heat release hole, first group of heat release hole and second group of heat release hole are located at the heat dissipation
The opposite sides of device.The elcetronic package structure further includes intermediary layer 23, and the intermediary layer is set on the socket, institute
It states radiator and covers the intermediary layer.The radiator includes that roof 11 and two are convexly equipped in the roof opposite sides respectively
Side wall 13, first group of heat release hole and second group of heat release hole, which are located at, to be opened on described two side walls.Described two
Accommodating space 15 is formed between a side wall, the microelectronic core and the substrate are located in the accommodating space, described micro-
The width of electronics tube core is less than the width of the substrate.By in first group of heat release hole and institute are opened up on described two side walls respectively
Second group of heat release hole is stated, consequently facilitating heat dissipation effect is improved, and the setting of the intermediary layer, then facilitate the microelectronic core
It is installed on the socket.
For example, the socket includes that bottom plate 251 and two are convexly equipped in the bottom plate respectively for the ease of socket power
The mounting plate 252 of opposite sides, the intermediary layer are layed on the bottom plate.It is empty that the width of the intermediary layer is greater than the receiving
Between width, the opposite sides of the intermediary layer abuts with the two side walls of the radiator respectively.Described two mounting plates point
It is not fixed to each other with described two side walls, the thickness of the bottom plate is greater than the thickness of the intermediary layer.The bottom surface of the socket
There are two connected structure (not shown), described two connected structures to be oppositely arranged and be located at the opposite of the bottom plate for upper setting
Two sides.Each connected structure includes multiple contact pins and multiple solder balls.Pass through two sides using the radiator
Wall abuts the intermediary layer, and the intermediary layer is fixed on the socket to facilitate, and is drawn by the way that multiple contacts are arranged
Foot and the multiple solder ball, to facilitate the installation and fixation of the socket.
For example, it is of particular importance that also referring to Fig. 3 and Fig. 4, for the ease of the microelectronic core disassembly with more
It changes, the elcetronic package structure further includes encapsulating shell (not shown), package assembling 40 and driving lever component 50, the driving lever component
And the package assembling is all set in the encapsulating shell, the radiator, the socket and microelectronic core activity
Ground is held in the package assembling, package assembling described in the driving lever component clamping position.
For example, the package assembling includes mounting plate 41, rotates shell 42, resilient brace 43, movable plate 44 and tension spring 45,
The mounting plate is fixed in the encapsulating shell and concordant with the top of the encapsulating shell, and one end of the rotation shell is rotationally
It is set to the inside bottom of the encapsulating shell, the other end is connected to the end of the mounting plate by the resilient brace, described
The rotation relatively described mounting plate of shell is obliquely installed.Accommodating groove 425 is formed in the shell of revolution body, the movable plate is inserted in
In the accommodating groove and one end of the movable plate is rotatably arranged on the bottom surface of the accommodating groove.The rotation shell direction
The side of the mounting plate, which offers, wears slot 4251, is formed with encapsulation between the movable plate and the side wall of the rotation shell
Slot, the encapsulation slot be in the movable plate deviate from described in wear the side of slot, the radiator, the socket with it is described micro-
The equal activity of electronics tube core is held in the encapsulation slot.The tension spring is set to the end of the movable plate, the phase of the tension spring
Both ends are connected on the side wall of the movable plate and the rotation shell, the tension spring is in the movable plate towards institute
The side for wearing slot is stated, the tension spring pulls and supports the movable plate rotation, to wear slot described in opening.
For example, actuation slot 415 is offered on the mounting plate, the extending direction of the actuation slot and the length of the mounting plate
Degree direction is parallel, and the actuation slot is provided with multiple location holes far from the side of the resilient brace, and the driving lever component includes
Rotating bar 51, rotation driving lever 52 and pressing lever 53, the rotating bar are laterally arranged in the middle part of the actuation slot, and the rotation is dialled
Bar is located in the actuation slot, and the middle part fixing sleeve of the rotation driving lever is set in the rotating bar, and the one of the rotation driving lever
End is vertically convexly equipped with clutching board 54, and the edge of the clutching board is formed with multiple engaging tooths 545, and the multiple engaging tooth is nibbled respectively
Together in the multiple location hole, to position the rotation driving lever, the pressing lever is convexly equipped in the rotation driving lever far from described
One end of clutching board, the pressing lever be actively arranged in it is described wear in slot, the width of the pressing lever is less than described wear
The width of slot so that the pressing lever can be arranged in it is described wear in slot, the pressing lever is held on the movable plate.
For example, be also rotationally provided with laying plate 55 on the side wall for wearing slot, the laying plate towards the resilient brace one
End activity is attached on the movable plate, and the end of the pressing lever is held on the laying plate.
When needing replacing the microelectronic core, pushes the clutching board aside and overturn the rotation driving lever, so that described
Rotation driving lever drives the pressing lever to rotate around the rotating bar, and the pressing lever discharges the laying plate, so that described
Movable plate rotates under tension spring tension effect, so that the encapsulation slot becomes larger to discharge the microelectronic core, at this time
The resilient brace pulls the rotation housing into rotation, and the opening of the rotation shell tilts upward, and then convenient for users to inciting somebody to action
The microelectronic core takes out to repair or replace.And after more finishing changing, the clutching board is pressed so that described
Clutching board is engaged on the side wall of the actuation slot, and the rotation driving lever drives the pressing lever to rotate and be held at this time
On the movable plate, the movable plate is forced on the microelectronic chip in the encapsulation slot at this time, to utilize the movable plate
Clamp the microelectronic core.The rotation shell is supported and is overcome the drawing of the resilient brace by the pressing lever simultaneously
Power and then rotation, flush in the top surface of the encapsulating shell, by above-mentioned setting, user can kill two birds with one stone, so that described micro-
The replacement of electronics tube core is more easy.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Only several embodiments of the present invention are expressed for embodiment described above, and the description thereof is more specific and detailed, but
It cannot be construed as a limitation to the scope of the present invention.It should be pointed out that for the ordinary skill people of this field
For member, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to of the invention
Protection scope.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of elcetronic package structure, which is characterized in that including radiator, socket and microelectronic core, the socket
On be provided with substrate, the microelectronic core is set on the substrate, and the radiator is layed on the socket and covers
The microelectronic core is covered, multiple heat release holes are offered on the side wall of the radiator.
2. elcetronic package structure according to claim 1, which is characterized in that the multiple heat release hole is round hole,
The multiple heat release hole is divided into first group of heat release hole and second group of heat release hole, first group of heat release hole and second group of heat dissipation
Hole is located at the opposite sides of the radiator.
3. elcetronic package structure according to claim 2, which is characterized in that further include intermediary layer, the intermediary layer is set
It is placed on the socket, the radiator covers the intermediary layer.
4. elcetronic package structure according to claim 3, which is characterized in that the radiator includes roof and two points
It is not convexly equipped in the side wall of the roof opposite sides, first group of heat release hole is located at second group of heat release hole and opens up
In on described two side walls.
5. elcetronic package structure according to claim 4, which is characterized in that be formed with receiving between described two side walls
Space, the microelectronic core and the substrate are located in the accommodating space, and the width of the microelectronic core is less than described
The width of substrate.
6. elcetronic package structure according to claim 5, which is characterized in that the socket includes bottom plate and two points
It is not convexly equipped in the mounting plate of the opposite sides of the bottom plate, the intermediary layer is layed on the bottom plate.
7. elcetronic package structure according to claim 6, which is characterized in that the width of the intermediary layer is greater than the receipts
Hold the width in space, the opposite sides of the intermediary layer is abutted with the two side walls of the radiator respectively.
8. elcetronic package structure according to claim 7, which is characterized in that described two mounting plates are respectively with described two
A side wall is fixed to each other, and the thickness of the bottom plate is greater than the thickness of the intermediary layer.
9. elcetronic package structure according to claim 8, which is characterized in that be provided with two on the bottom surface of the socket
A connected structure, described two connected structures are oppositely arranged and are located at the opposite sides of the bottom plate.
10. elcetronic package structure according to claim 9, which is characterized in that each connected structure includes multiple
Contact pin and multiple solder balls.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910306326.XA CN110010568B (en) | 2019-04-16 | 2019-04-16 | Microelectronic packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910306326.XA CN110010568B (en) | 2019-04-16 | 2019-04-16 | Microelectronic packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110010568A true CN110010568A (en) | 2019-07-12 |
| CN110010568B CN110010568B (en) | 2020-11-27 |
Family
ID=67172363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910306326.XA Active CN110010568B (en) | 2019-04-16 | 2019-04-16 | Microelectronic packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110010568B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128802A (en) * | 2019-12-16 | 2020-05-08 | 汤忠武 | Microelectronic die packaging system |
| CN113097161A (en) * | 2021-06-09 | 2021-07-09 | 江苏澳芯微电子有限公司 | Upset centre gripping formula chip packaging mechanism |
| CN114203655A (en) * | 2021-11-19 | 2022-03-18 | 苏州浪潮智能科技有限公司 | Chip packaging structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1848549A (en) * | 2005-03-10 | 2006-10-18 | 安普泰科电子有限公司 | IC package, IC socket, and IC socket assembly |
| CN101149396A (en) * | 2006-09-22 | 2008-03-26 | 株式会社爱德万测试 | Interface apparatus for electronic device test apparatus |
| CN101149394A (en) * | 2006-09-22 | 2008-03-26 | 未来产业株式会社 | Pushing block and a handler with the pushing block |
| CN106098641A (en) * | 2016-06-20 | 2016-11-09 | 东莞市联洲知识产权运营管理有限公司 | A kind of integrated circuit package structure of high efficiency and heat radiation |
| CN206774516U (en) * | 2017-05-02 | 2017-12-19 | 信丰明新电子科技有限公司 | A kind of encapsulating structure for improving integrated circuit stability |
| CN109524359A (en) * | 2018-11-13 | 2019-03-26 | 常州信息职业技术学院 | A kind of clipping chip package mechanism of overturning |
-
2019
- 2019-04-16 CN CN201910306326.XA patent/CN110010568B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1848549A (en) * | 2005-03-10 | 2006-10-18 | 安普泰科电子有限公司 | IC package, IC socket, and IC socket assembly |
| CN101149396A (en) * | 2006-09-22 | 2008-03-26 | 株式会社爱德万测试 | Interface apparatus for electronic device test apparatus |
| CN101149394A (en) * | 2006-09-22 | 2008-03-26 | 未来产业株式会社 | Pushing block and a handler with the pushing block |
| CN106098641A (en) * | 2016-06-20 | 2016-11-09 | 东莞市联洲知识产权运营管理有限公司 | A kind of integrated circuit package structure of high efficiency and heat radiation |
| CN206774516U (en) * | 2017-05-02 | 2017-12-19 | 信丰明新电子科技有限公司 | A kind of encapsulating structure for improving integrated circuit stability |
| CN109524359A (en) * | 2018-11-13 | 2019-03-26 | 常州信息职业技术学院 | A kind of clipping chip package mechanism of overturning |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128802A (en) * | 2019-12-16 | 2020-05-08 | 汤忠武 | Microelectronic die packaging system |
| CN111128802B (en) * | 2019-12-16 | 2022-09-27 | 深圳友讯达科技股份有限公司 | Microelectronic die packaging system |
| CN113097161A (en) * | 2021-06-09 | 2021-07-09 | 江苏澳芯微电子有限公司 | Upset centre gripping formula chip packaging mechanism |
| CN114203655A (en) * | 2021-11-19 | 2022-03-18 | 苏州浪潮智能科技有限公司 | Chip packaging structure |
| CN114203655B (en) * | 2021-11-19 | 2023-11-03 | 苏州浪潮智能科技有限公司 | Chip packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110010568B (en) | 2020-11-27 |
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Effective date of registration: 20221018 Address after: 111-1, Building 18, Jintong International Industrial Park, No. 8, Xihu Road, Wujin National High tech Industrial Development Zone, Changzhou City, Jiangsu Province, 213000 Patentee after: JIANGSU ZHONGYING TECHNOLOGY INTELLIGENT INFORMATION CO.,LTD. Address before: 213164 No. 22, Ming Xin Road, Wujin District, Changzhou, Jiangsu. Patentee before: CHANGZHOU College OF INFORMATION TECHNOLOGY |