CN110010016B - Display panel - Google Patents
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- CN110010016B CN110010016B CN201910245487.2A CN201910245487A CN110010016B CN 110010016 B CN110010016 B CN 110010016B CN 201910245487 A CN201910245487 A CN 201910245487A CN 110010016 B CN110010016 B CN 110010016B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a display panel which is formed by splicing a plurality of substrates and comprises a first substrate, a plurality of first light-emitting units, a first patterned conductive layer and a first driving circuit component. The first substrate is provided with a first light emergent surface and a first side wall; the first side wall is connected with the first light-emitting surface and forms a non-180-degree angle. The first light emitting unit is arranged on the first light emitting surface. The first patterned conductive layer is arranged on the first side wall. The first driving circuit assembly is arranged on the first substrate, is adjacent to the first edge of the first substrate, and is electrically connected with at least one of the first light-emitting units.
Description
Technical Field
The present invention relates to a display device, and more particularly, to a display panel formed by splicing a plurality of substrates.
Background
With the advance of science and technology, the display industry is advancing towards higher quality, such as more comfortable, large-sized, high-resolution, multi-frequency, digital picture, etc. In order to provide a larger Display screen, a plurality of Liquid Crystal Displays (LCDs) are spliced and combined to form a single Display panel. However, the splicing technology of the liquid crystal display cannot achieve the visual effect of seamless splicing due to the limitation of the technology.
Compared to the liquid crystal display, the self-Light-Emitting display (self-Light-Emitting display), for example, a micro-LED (micro-Light-Emitting Diode) display, has the advantages of pixel self-luminescence, small size, low power consumption, high color saturation, high response speed, etc., and has become one of the popular technologies for the next generation of display products. However, the micro-led technology involves mass transfer of led chips, and thus requires mass transfer of a large number of micro-led chips onto a pre-fabricated circuit board. With the miniaturization trend of micro light emitting diode chips, if a large number of micro light emitting diode chips are transferred at one time, the precision requirement on transfer equipment is extremely high, and the yield is difficult to improve; if only a few micro led chips are transferred at a time, the transfer time will be significantly increased, and it is difficult to achieve an effective throughput level.
In order to solve this problem, in the prior art, a splicing process is used to combine smaller display panels into a larger display panel. Because, each small-sized display panel requires dense wiring and driving circuit components at the edge of the substrate; in order to avoid the influence of these still visible (visible) lines and driving circuit components on the display quality of the display panel, these lines and driving circuit components are generally covered by a black matrix. When a plurality of small-sized display panels are spliced into a larger-sized display panel, how to effectively integrate these circuits and driving circuit components has become an important issue in this technical field. In addition, after splicing, the black light shielding layer positioned at the periphery of each small-size display panel can highlight the splicing seams of the adjacent display panels, and the display quality of the display panels is seriously influenced.
Therefore, there is a need to provide an advanced display panel to solve the problems faced by the prior art.
Disclosure of Invention
An object of the present invention is to provide a display panel to solve the above problems.
To achieve the above object, the present invention provides a display panel formed by splicing a plurality of substrates, including:
the first substrate is provided with a first light emitting surface and a first side wall, and the first side wall is connected with the first light emitting surface and forms a non-180-degree angle;
a plurality of first light emitting units disposed on the first light emitting surface;
a first patterned conductive layer disposed on the first sidewall; and
the first driving circuit component is arranged on the first substrate and is adjacent to the first edge of the first substrate, and the first driving circuit component is electrically connected with at least one of the plurality of first light-emitting units.
Preferably, the method further comprises:
the second substrate is provided with a second light emergent surface and a second side wall; the second side wall is connected with the second light emergent surface and is in contact with the first side wall; the second light-emitting surface is coplanar with the first light-emitting surface;
a plurality of second light emitting units disposed on the second light emitting surface; and
the second patterned conductive layer is arranged on the second side wall and is electrically connected with the plurality of second light-emitting units.
Preferably, the first driving circuit assembly is disposed on an opposite side of the first light emitting surface and electrically connected to the plurality of first light emitting units and the plurality of second light emitting units.
Preferably, the mask further comprises a second patterned conductive layer electrically contacting the first patterned conductive layer.
Preferably, the method further comprises:
the first conducting wire is positioned on the opposite side of the first light emergent surface and is electrically contacted with the first patterned conducting layer and the first driving circuit component;
the second conducting wire is positioned on the opposite side of the second light emergent surface and is electrically contacted with the second patterned conducting layer;
a plurality of first contact plugs penetrating through the first substrate, one end of each of the first contact plugs being connected to one of the plurality of first light emitting units, and the other end of each of the first contact plugs being connected to the first wire; and
and a plurality of second contact plugs penetrating through the second substrate, wherein one end of each second contact plug is connected with one of the plurality of second light-emitting units, and the other end of each second contact plug is connected with the second wire.
Preferably, the display device further comprises a first black light-shielding layer located on the first light-emitting surface and overlapping the first driving circuit element.
Preferably, the first substrate further includes:
the third side wall is connected with the first edge and the first light-emitting surface, and the third side wall and the first light-emitting surface form a non-180-degree angle;
a fourth side wall connected with the first edge and the first light-emitting surface, wherein the fourth side wall and the first light-emitting surface form a non-180-degree angle;
a third patterned conductive layer disposed on the third sidewall; and
and the fourth patterned conductive layer is arranged on the fourth side wall.
Preferably, the method further comprises:
a third substrate having a third light exit surface and a fifth sidewall; wherein the fifth sidewall is connected to the third light exit surface and contacts the third sidewall; the third light-emitting surface is coplanar with the first light-emitting surface;
a plurality of third light emitting units disposed on the third light emitting surface;
a third driving circuit assembly disposed on the third substrate and adjacent to a third edge of the third substrate;
a fourth driving circuit component disposed on the third substrate and adjacent to a fourth edge of the third substrate, wherein the third edge is connected to the fourth edge and the first edge, and the third edge and the fourth edge are not parallel to each other;
a third black light-shielding layer on the third light-emitting surface, adjacent to the third edge, and overlapping the third driving circuit element; and
and a fourth black light-shielding layer on the third light-emitting surface, adjacent to the fourth edge, and overlapping the fourth driving circuit element.
Preferably, the method further comprises:
the fourth substrate is provided with a fourth light emergent surface and a sixth side wall; wherein the sixth sidewall is connected to the fourth light exit surface, and the sixth sidewall is in contact with the fourth sidewall; and the fourth light-emitting surface is coplanar with the first light-emitting surface;
a plurality of fourth light emitting units disposed on the fourth light emitting surface;
a fifth driving circuit component disposed on the fourth substrate and adjacent to a fourth edge or a sixth edge of the fourth substrate, wherein the fifth edge connects the first edge and the sixth edge, and the fifth edge and the sixth edge are not parallel to each other;
a fifth black light-shielding layer on the fourth light-emitting surface and adjacent to the fifth edge; and
and a sixth black matrix disposed on the fourth light-emitting surface and adjacent to the sixth edge, wherein at least one of the fifth black matrix and the sixth black matrix overlaps the fifth driving circuit element.
In order to achieve the above object, the present invention further provides a display panel formed by splicing a plurality of substrates, including:
a plurality of outer frame substrates connected to each other to define an outer frame portion of the display panel; the outer frame part is provided with a light emergent surface of the outer frame part, an outer edge side wall and an inner edge side wall; the outer edge side wall surrounds the light emitting surface of the outer frame part; the inner edge side wall is positioned at the opposite side of the outer edge side wall, is connected with the light-emitting surface of the outer frame part and forms an angle of non-180 degrees;
a plurality of core substrates connected to each other to define a core portion of the display panel; the core part is provided with a core part light-emitting surface and a core side wall; the core side wall is connected with the light-emitting surface of the core part and forms an angle of 180 degrees; the inner edge sidewall facing the core sidewall; the light-emitting surface of the core part is coplanar with the light-emitting surface of the outer frame part;
a driving circuit component which is positioned on the light-emitting surface of the outer frame part or the opposite side of the light-emitting surface of the outer frame part and is adjacent to the outer edge side wall;
a plurality of outer frame light-emitting units which are positioned on the light-emitting surface of the outer frame and are electrically connected with the driving circuit component;
a plurality of core light emitting units located on the light exit surface of the core;
the outer frame part patterned conducting layer is positioned on the inner edge side wall and is electrically connected with at least one of the plurality of outer frame part light-emitting units;
the core part patterned conductive layer is positioned on the side wall of the core, is electrically contacted with the outer frame part patterned conductive layer and is electrically connected with at least one of the plurality of core part light-emitting units; and
and the black light shielding layer is positioned on the light emitting surface of the outer frame part and is adjacent to the outer edge side wall, and the black light shielding layer covers the driving circuit component.
Compared with the prior art, the invention provides a display panel which is formed by splicing a plurality of substrates. At least one outer frame substrate adjacent to the outer edge of the display panel is provided with a plurality of light-emitting units, an edge side wall, a patterned conductive layer, a driving circuit component and a black shading layer. Wherein the first light emitting unit is positioned on the light emitting surface; the edge side wall is connected with the light-emitting surface and forms a non-180-degree angle with the light-emitting surface; the patterned conductive layer is positioned on the side wall of the edge, and the driving circuit component is adjacent to the edge of the substrate; the black shading layer is overlapped with the driving circuit component. When two adjacent substrates are spliced, the light-emitting units respectively positioned on the two adjacent spliced substrates can be electrically connected to the same driving circuit component positioned at the edge of the display panel through the patterned conductive layer, so as to provide image signals for further displaying images. Covering the driving circuit component with a black shading layer to prevent the driving circuit component from influencing the display quality of the display panel due to the reflected light; the plurality of outer frame substrates adjacent to the outer edge of the display panel can be spliced with each other to define the outer frame portion of the display panel and surround the core portion formed by splicing the plurality of core substrates. The driving circuit assembly of the display panel is only arranged in the peripheral area of one or more outer frame substrates adjacent to the outer edge of the display panel; the core substrate is not provided with any driving circuit components. The plurality of core portion light-emitting units on the core substrate and the plurality of outer frame portion light-emitting units on the outer frame substrate can respond to image signals provided by the same driving circuit component to display images.
Drawings
Fig. 1 is a simplified structural perspective view of a display panel according to an embodiment of the present disclosure.
Fig. 2 is a simplified perspective view of a display panel according to another embodiment of the present disclosure.
Detailed Description
In order to further understand the objects, structures, features and functions of the present invention, the following embodiments are described in detail.
Referring to fig. 1, fig. 1 is a simplified perspective view of a display panel 10 according to an embodiment of the present disclosure. The manufacturing of the display panel 10 includes the following steps: firstly, providing a first substrate 101, so that the first substrate 101 has a first light-emitting surface 101a and a first sidewall 101 b; the first sidewall 101b is connected to the first light exit surface 101a and encloses an angle Θ 1 that is different from 180 °. In some embodiments of the present disclosure, the first substrate 101 may be a light-transmissive semiconductor substrate (e.g., a silicon substrate), a glass substrate, a ceramic substrate, a flexible plastic substrate (e.g., a polyvinyl Chloride (PVC) film), or other suitable material. In this embodiment, the first substrate 101 may be a glass substrate.
Next, a plurality of first light emitting units 102 are formed on the first light emitting surface 101 a. In some embodiments of the present disclosure, the fabrication of the first light emitting unit 102 may include the following steps: first, a plurality of Electroluminescent (EL) units (not shown) each including at least one micro light emitting diode are formed on an epitaxial substrate (not shown) by an epitaxial process, then the epitaxial substrate is subjected to wafer dicing (wafer dicing) to divide the electroluminescent units to form a plurality of micro light emitting diode dies 102a, and the micro light emitting diode dies 102a are transferred from the epitaxial substrate (not shown) to another temporary substrate (not shown) by a mechanical tool (not shown), and then transferred from the temporary substrate to the first substrate 101. The material constituting the epitaxial substrate may be sapphire (sapphire), silicon carbide (SiC), silicon (Si), zinc oxide (ZnO), magnesium oxide (MgO), aluminum nitride (AlN), gallium nitride (GaN), or any combination thereof.
In some embodiments of the present disclosure, before the plurality of micro led dies are transferred onto the first substrate 101, a plurality of first wires 103 are formed on the first light emitting surface 101a of the first substrate 101 or the opposite side 101c of the first light emitting surface 101a, and the plurality of first wires 103 are electrically connected to the first driving circuit element 104 located in a peripheral region of the first substrate 101 (e.g., a region adjacent to the first edge 101d of the first substrate 101). Each of the micro led dies 102a transferred onto the first substrate 101 may be electrically connected to one of the first conductive wires 103 through the contact plug 106, thereby forming the first light emitting unit 102. Wherein, the plurality of first light emitting units 102 may be arranged on the first light emitting surface 101a to form a pixel matrix (matrix) K1; each of the first light emitting units 102 can be turned on or off in response to an image signal provided by the first driving circuit element 104, so as to display an image.
In the present embodiment, the plurality of first wires 103 are formed on the opposite side 101c of the first light emitting surface 101 a. The formation of the contact plug 106 includes the steps of: the Glass substrate is drilled using, for example, a Through Glass Via (TGV) technique, so as to form a plurality of Through holes 105 on the first light-emitting surface 101 a. Sputtering a conductive material (e.g., copper, tungsten, aluminum, gold, silver, or any alloy thereof, metal oxide, or other metal material) on the sidewall of each through hole 105 to form a contact plug 106, and forming a plurality of bonding pads 107 on the first light-emitting surface 101 a; so that one end of each contact plug 106 penetrating through the first substrate 101 is connected to a corresponding one of the pads 107, and the other end of each contact plug 106 penetrating through the first substrate 101 is connected to a corresponding one of the first wires 103. Each of the micro led dies 102a transferred onto the first substrate 101 is respectively landed on a corresponding pad 107, and is electrically connected to the first driving circuit element 104 through the corresponding pad 107, the contact plug 106 and the first wire 103. Each of the first light emitting units 102 is formed as a pixel, and a pixel pitch (P) is formed between two adjacent pixels. For example, in some embodiments of the present disclosure, each pixel (i.e., the first light emitting unit 102) at least includes a plurality of micro light emitting diode dies 102a emitting different colors of light (e.g., three primary colors of red (R), green (G), and blue (B)).
Next, a first patterned conductive layer 108 is formed on the first sidewall 101b, such that the first patterned conductive layer 108 is electrically connected to the first conductive line 103. In some embodiments of the present disclosure, a conductive material layer may be formed on the first sidewall 101b, and then a portion of the conductive material layer (not shown) is removed by, for example, etching or laser, to form the first patterned conductive layer 108. In other embodiments of the present disclosure, a patterned photoresist layer (not shown) may be formed on the first sidewall 101b before forming. Then, a conductive material is deposited on the first sidewall 101b to form a first patterned conductive layer 108. In this embodiment, the first patterned conductive layer 108 may longitudinally extend upward beyond the first sidewall 101b to electrically connect with the first conductive line 103 on the first light-emitting surface 101a of the first substrate 101, or the first patterned conductive layer 108 may longitudinally extend downward beyond the first sidewall 101b to electrically connect with the first conductive line 103 on the opposite side 101c of the first light-emitting surface 101a of the first substrate 101.
In addition, in order to avoid the first driving circuit element 104 reflecting light to affect the display quality of the display panel 10, a first black light shielding layer 109 may be formed (or coated) on the first light emitting surface 101a of the first substrate 101 in a peripheral region adjacent to the first edge 101d so as to overlap with the first driving circuit element 104.
Next, in the same manner, one second substrate 121 is provided, and a plurality of second light emitting units 122 are formed on the second substrate 121. The second substrate 121 has a second light-emitting surface 121a and a second sidewall 121 b; the second sidewall 121b is connected to the second light exit surface 121a and includes an angle Θ 2 different from 180 °. Forming a plurality of second wires 123 on the second light-emitting surface 121a of the second substrate 121 or the opposite side 121 of the second light-emitting surface 121a, wherein the plurality of second wires 123 are electrically connected to the second driving circuit elements 124 located in the peripheral region of the second substrate 121 (e.g., the region adjacent to the second edge 121d of the second substrate 121); the second driving circuit element 124 is electrically connected to the second light emitting unit 122 through the second wire 123. And a second patterned conductive layer 128 is formed on the second sidewall 121b to electrically connect to the second conductive line 123.
For example, in the present embodiment, the plurality of second wires 123 are formed on the opposite side 121c of the second light emitting surface 121 a. The second light exit surface 121a further includes a plurality of through holes 125; a contact plug 126 is formed by sputtering a conductive material (e.g., cu, w, al, au, ag, or any alloy thereof, metal oxide, or other metal material) on the sidewall of each through hole 125, and a plurality of bonding pads 127 are formed on the second light-emitting surface 121 a. One end of each contact plug 126 is connected to a corresponding one of the pads 127, and the other end is electrically connected to a corresponding one of the second conductive traces 123. Each micro led die 122a is disposed on a corresponding bonding pad 127, and is electrically connected to the second driving circuit element 124 through the corresponding bonding pad 127, the contact plug 126 and the second conductive trace 123. Each of the second light emitting units 122 is formed as a pixel, and a plurality of the second light emitting units 122 are arranged on the second light emitting surface 121a to form a pixel matrix K2. For example, in some embodiments of the present disclosure, each pixel (i.e., the second light emitting unit 122) at least includes a plurality of micro light emitting diode dies 122a emitting different colors (e.g., three primary colors of red (R), green (G), and blue (B)).
Similarly, in order to avoid the second driving circuit element 124 reflecting light to affect the display quality of the display panel 10, a second black light-shielding layer 129 may be formed (or coated) on the second light-emitting surface 121a of the second substrate 121 in a peripheral region adjacent to the second edge 121d so as to overlap the second driving circuit element 124.
Subsequently, the first substrate 101 and the second substrate 121 are spliced together, and then a series of back-end processes (not shown) are performed to form the display panel 10. In the present embodiment, the first patterned conductive layer 108 on the first sidewall 101b of the first substrate 101 and the second patterned conductive layer 128 on the second sidewall 121b of the second substrate 121 are matched with each other and contact each other, and the second light emitting surface 121a and the first light emitting surface 101a are coplanar. The second light emitting units 122 can be electrically connected to the first driving circuit element 104 through the first patterned conductive layer 108, the second patterned conductive layer 128, the first wires 103 and the second wires 123, and each of the second light emitting units 122 can display an image in response to an image signal provided by the first driving circuit element 104.
However, the image display modes of the first light emitting unit 102 and the second light emitting unit 122 are not limited thereto. For example, in some other embodiments of the present disclosure, each of the first light emitting unit 102 and the second light emitting unit 122 can respectively display an image in response to an image signal provided by the second driving circuit component 124 disposed on the second substrate 121. In still other embodiments of the present disclosure, each of the first light emitting units 102 can respectively display an image in response to an image signal provided by the first driving circuit element 104 disposed on the first substrate 101; meanwhile, each of the second light emitting units 122 can respectively display images in response to the image signals provided by the second driving circuit component 124.
In still other embodiments of the present disclosure, the first driving circuit element 104 and the second driving circuit element 124 may be integrated into a combined driving circuit element (not shown) disposed in a peripheral region adjacent to the first edge 101d of the first substrate 101 or disposed in a peripheral region adjacent to the second edge 121d of the second substrate 121 for simultaneously driving the first light emitting unit 102 and the second light emitting unit 122 to display images. In summary, any arrangement that arranges the driving circuit elements (e.g., the first driving circuit element 104 and the second driving circuit element 124) adjacent to the peripheral region of the outer edge of the display panel 10 (e.g., the first edge 101d of the first substrate 101 or the second edge 121d of the second substrate 121) for providing the image signals to the light emitting units (e.g., the first light emitting unit 102 and the second light emitting unit 122) on the two adjacent substrates to be spliced does not depart from the spirit and scope of the present invention.
The display panel 20 may include more substrates, for example, referring to fig. 2, fig. 2 is a simplified structural perspective view of the display panel 20 according to another embodiment of the present disclosure. Compared with the display panel 10 of fig. 1, the display panel 20 further includes at least one third substrate 201 and one fourth substrate 221 respectively spliced to two sides of the first edge 101d of the first substrate 101. A plurality of other substrates without driving circuit components, such as core substrates 315 and 316 (details of which will be described later), are also included between the first substrate 101 and the second substrate 121.
For example, in the present embodiment, the first substrate 101 further includes a third sidewall 101e, a fourth sidewall 101f, a third patterned conductive layer 110 and a fourth patterned conductive layer 111. The third sidewall 101e is located on the opposite side of the fourth sidewall 101f, that is, the third sidewall 101e and the fourth sidewall 101f are located on two opposite sides of the first substrate 101, the third sidewall 101e is connected to the first light emitting surface 101a and the first edge 101d, and the fourth sidewall 101f is connected to the first light emitting surface 101a and the first edge 101 d; the first light exit surface 101a and the third sidewall 101e enclose an angle Θ 3 different from 180 °; the first light exit surface 101a and the fourth sidewall 101f form an angle Θ 4 different from 180 °; the third patterned conductive layer 110 is disposed on the third sidewall 101 e; the fourth patterned conductive layer 111 is disposed on the fourth sidewall 101 f.
The third substrate 201 has a third light-emitting surface 201a, a fifth sidewall 201b, and a plurality of third light-emitting units 202 disposed on the third light-emitting surface 201 a. The fifth sidewall 201b is connected to the third light-emitting surface 201a, and forms an angle Θ 5 different from 180 ° with the third light-emitting surface 201 a. When the first substrate 101 is spliced with the third substrate 201, the fifth sidewall 201b of the third substrate 201 contacts with the third sidewall 101e of the first substrate 101, so that the third light exit surface 201a is coplanar with the first light exit surface 101 a.
The third substrate 201 may further include a third driving circuit element 204 and a fourth driving circuit element 205, the third driving circuit element 204 is disposed on an opposite side of the third light emitting surface 201a of the third substrate 201 and adjacent to the third edge 201c of the third substrate. The fourth driving circuit element 205 is disposed on the opposite side of the third light emitting surface 201a of the third substrate 201 and abuts against the fourth edge 201d of the third substrate 201. The third edge 201c of the third substrate 201 is connected to the fourth edge 201d of the third substrate 201 and the first edge 101d of the first substrate 101, respectively, and the third edge 201c and the fourth edge 201d of the third substrate 201 are not parallel to each other (e.g., may be perpendicular to each other). Each of the third light emitting units 202 may be electrically connected to the third driving circuit element 204 and/or the fourth driving circuit element 205 through a conductive wire (not shown), and further display images in response to the image signals provided by the corresponding third driving circuit element 204 and/or the fourth driving circuit element 205.
In order to avoid the third driving circuit element 204 and the fourth driving circuit element 205 from affecting the display quality of the display panel 20, a third black light-shielding layer 206 may be formed (or coated) on the third light-emitting surface 201a of the third substrate 201 in the peripheral region adjacent to the third edge 201c so as to overlap with the third driving circuit element 204; a fourth black mask layer 207 is formed (or coated) on the third light-emitting surface 201a of the third substrate 201 adjacent to the fourth edge 201d so as to at least overlap the third driving circuit 204 and the fourth driving circuit component 205.
In addition, the display panel 20 may further include a fourth substrate 221 joined to the first substrate 101. The fourth substrate 221 has a fourth light-emitting surface 221a, a sixth sidewall 221b connected to the fourth light-emitting surface 221a, and a plurality of fourth light-emitting units 222 disposed on the fourth light-emitting surface 221 a. When the first substrate 101 is joined to the fourth substrate 221, the sixth sidewall 221b of the fourth substrate 221 contacts the fourth sidewall 101f of the first substrate 101; and the fourth light exit surface 221a of the fourth substrate 221 is coplanar with the first light exit surface 101a of the first substrate 101.
In this embodiment, the fourth substrate 221 further includes a fifth driving circuit element 223 disposed on an opposite side of the fourth light-emitting surface 221a of the fourth substrate 221 and adjacent to a fifth edge 221c or a sixth edge 221d of the fourth substrate 221. Wherein the fifth edge 221c of the fourth substrate 221 connects the first edge 101d of the first substrate 101 and the sixth edge 221d of the fourth substrate 221, and the fifth edge 221c and the sixth edge 221d are not parallel to each other (e.g., may be perpendicular to each other).
Similarly, in order to avoid the fifth driving circuit component 223 from affecting the display quality of the display panel 20, a fifth black light-shielding layer 224 and a sixth black light-shielding layer 225 may be formed (or coated) on the fourth light-emitting surface 221a of the fourth substrate 221 in the peripheral region adjacent to the fifth edge 221c and the sixth edge 221d, respectively, such that at least one of the fifth black light-shielding layer 224 and the sixth black light-shielding layer 225 overlaps the fifth driving circuit component 223.
In some embodiments of the present disclosure, a plurality of substrates (hereinafter, collectively referred to as outer frame substrates) having the same structure as (similar to) the first substrate 101, the third substrate 201, and the fourth substrate 221 may be used and connected to each other, so as to define an outer frame portion 31 of the display panel 20; a plurality of substrates without any driving circuit components (hereinafter, referred to as core substrates) are used to define a core portion 32 of the display panel 20.
For example, in the present embodiment, the outer frame portion 31 of the display panel 20 includes an outer frame substrate 301 having the same structure as the third substrate 201, an outer frame substrate 321 having the same structure as the fourth substrate 221; and five casing substrates 121, 311, 312, 313 and 314 having the same (similar) structure as the first substrate 101. Wherein, the outer frame substrate 301 is located at the diagonal of the third substrate 201; the outer frame substrate 321 is located at the diagonal of the fourth substrate 221; the outer frame substrates 311 and 312 are positioned between the fourth substrate 221 and the outer frame substrate 301, and the four are arranged in a line; the second substrate 121 is located between the outer frame substrates 301 and 321, and the three substrates are arranged in a row; and the outer frame substrates 313 and 314 are positioned between the third substrate 201 and the outer frame substrate 321, and the four are aligned in a line. The outer frame portion 31 having a square frame structure can be defined by the first substrate 101, the second substrate 121, the third substrate 201, the fourth substrate 221, and the outer frame substrates 301, 311, 312, 313, 314, and 321 connected to each other.
The light-emitting surfaces of the first substrate 101, the second substrate 121, the third substrate 201, the fourth substrate 221, and the outer frame substrates 301, 311, 312, 313, 314, and 321 may collectively define an outer frame light-emitting surface 31A. The outer frame portion 31 further includes an outer edge sidewall 31B (e.g., a sidewall connected to the third edge 201C of the third substrate 201) and an inner edge sidewall 31C located on the opposite side of the outer edge sidewall 31B. The outer sidewall 31B surrounds the light exit surface 31A of the outer frame, and the inner sidewall 31C is connected to the light exit surface 31A of the outer frame and forms an angle Θ 6 different from 180 °.
The core portion 32 of the display panel 20 includes two core substrates 315 and 316 connected to each other and surrounded by the outer frame portion 31. The core substrates 315 and 316 are substantially similar to the first substrate 101, the third substrate 201, and the fourth substrate 221 in structure and splicing manner. The only difference is that core substrates 315 and 316 do not have any drive circuit components. The light exit surfaces of the core substrates 315 and 316 may be integrated into a core light exit surface 32A, surrounded by the outer frame light exit surface 31A, and coplanar with the outer frame light exit surface 31A. The core portion 32 also has a core side wall 32B facing the inner edge side wall 31C of the outer frame portion 31. The core sidewall 32B is in surface contact with the core light exit surface 32A and includes an angle Θ 7 that is not 180 °.
The outer frame 31 of the display panel 20 further includes an outer frame patterned conductive layer 35 (e.g., the first patterned conductive layer 108) on the inner sidewall 31C, which can be electrically connected to the outer frame light-emitting units 33 (including the first light-emitting unit 102, the second light-emitting unit 102, the third light-emitting unit 202, the fourth light-emitting unit 202, and the light-emitting units on the light-emitting surfaces of the outer frame substrates 301, 311, 312, 313, 314, and 321) on the surface of the outer frame light-emitting surface 31A. The core 32 of the display panel 20 further includes a core patterned conductive layer 36 on the core sidewall 32B, which is electrically connected to the core light-emitting units 34 on the core light-emitting surface 32A.
By the above splicing method, the outer frame light-emitting unit 33 of the outer frame 31 and the core light-emitting unit 34 of the core 32 can be electrically connected to a driving circuit element (e.g., the third driving circuit element 204) on the outer frame substrate (e.g., the third substrate 201), so that they can respectively respond to the image signal provided by the driving circuit element to display the image.
The black mask layers (including the first black mask layer 109, the second black mask layer 206, the third black mask layer 207, the fourth black mask layer 224, and the fifth black mask layer 225) on the first substrate 101, the second substrate 121, the third substrate 201, the fourth substrate 221, and the outer frame substrates 301, 311, 312, 313, 314, and 321 may be integrated into a single outer frame black mask layer, and may be overlapped with the driving circuit component (e.g., the third driving circuit component 204) adjacent to the outer edge sidewall 31B, so as to alleviate the problem that the driving circuit component affects the display quality of the display panel 20 due to the reflected light.
According to the above embodiments, embodiments of the present disclosure provide a display panel, which is formed by splicing a plurality of substrates, wherein at least one of the frame substrates is adjacent to an edge of the display panel, and has a plurality of first light emitting units, a sidewall, a patterned conductive layer, a driving circuit assembly, and a black light shielding layer. Wherein the first light emitting unit is positioned on the light emitting surface; the side wall is connected with the light-emitting surface and forms a non-180-degree angle with the light-emitting surface; the patterned conductive layer is positioned on the side wall, and the driving circuit component is positioned at the edge of the substrate; the driving circuit assembly overlaps the black light-shielding layer. The driving circuit assembly can be electrically connected with the first light-emitting unit and the second light-emitting unit on the other spliced substrate to provide image signals for displaying images. Therefore, the driving circuit component can be arranged at the edge of the display panel, and the problem that the display quality of the display panel is affected by the driving circuit component due to the reflected light is alleviated by the black shading layer overlapped with the driving circuit component.
According to the embodiments, embodiments of the present disclosure provide a display panel formed by splicing a plurality of substrates. At least one outer frame substrate adjacent to the outer edge of the display panel is provided with a plurality of light-emitting units, an edge side wall, a patterned conductive layer, a driving circuit component and a black shading layer. Wherein the first light emitting unit is positioned on the light emitting surface; the edge side wall is connected with the light-emitting surface and forms a non-180-degree angle with the light-emitting surface; the patterned conductive layer is positioned on the side wall of the edge, and the driving circuit component is adjacent to the edge of the substrate; the black shading layer is overlapped with the driving circuit component. When two adjacent substrates are spliced, the light-emitting units respectively positioned on the two adjacent spliced substrates can be electrically connected to the same driving circuit component positioned at the edge of the display panel through the patterned conductive layer, so as to provide image signals for further displaying images. The driving circuit component is covered by a black shading layer to prevent the driving circuit component from influencing the display quality of the display panel due to the reflected light.
In one embodiment, a plurality of outer frame substrates adjacent to the outer edge of the display panel may be spliced together to define an outer frame portion of the display panel, and the outer frame portion surrounds a core portion formed by splicing a plurality of core substrates. The driving circuit assembly of the display panel is only arranged in the peripheral area of one or more outer frame substrates adjacent to the outer edge of the display panel; the core substrate is not provided with any driving circuit components. The plurality of core portion light-emitting units on the core substrate and the plurality of outer frame portion light-emitting units on the outer frame substrate can respond to image signals provided by the same driving circuit component to display images.
The present invention has been described in relation to the above embodiments, which are only exemplary of the implementation of the present invention. It should be noted that the disclosed embodiments do not limit the scope of the invention. Rather, it is intended that all such modifications and variations be included within the spirit and scope of this invention.
Claims (10)
1. The utility model provides a display panel is formed by a plurality of base plates concatenation, its characterized in that includes:
a plurality of outer frame substrates connected to each other to define an outer frame portion of the display panel; the outer frame part is provided with a light emergent surface of the outer frame part, an outer edge side wall and an inner edge side wall; the outer edge side wall surrounds the light emitting surface of the outer frame part; the inner edge side wall is positioned at the opposite side of the outer edge side wall, is connected with the light-emitting surface of the outer frame part and forms an angle of non-180 degrees;
a plurality of core substrates connected to each other to define a core portion of the display panel; the core part is provided with a core part light-emitting surface and a core side wall; the core side wall is connected with the light-emitting surface of the core part and forms an angle of 180 degrees; the inner edge sidewall facing the core sidewall; the light-emitting surface of the core part is coplanar with the light-emitting surface of the outer frame part;
a driving circuit component which is positioned on the light-emitting surface of the outer frame part or the opposite side of the light-emitting surface of the outer frame part and is adjacent to the outer edge side wall;
a plurality of outer frame light-emitting units which are positioned on the light-emitting surface of the outer frame and are electrically connected with the driving circuit component;
a plurality of core light emitting units located on the light exit surface of the core;
the outer frame part patterned conducting layer is positioned on the inner edge side wall and is electrically connected with at least one of the plurality of outer frame part light-emitting units;
the core part patterned conductive layer is positioned on the side wall of the core, is electrically contacted with the outer frame part patterned conductive layer and is electrically connected with at least one of the plurality of core part light-emitting units; and
a black light shielding layer on the light emergent surface and adjacent to the outer edge side wall and covering the drive circuit assembly
2. The display panel of claim 1, wherein the outer frame substrate comprises:
the first substrate is provided with a first light emitting surface and a first side wall, and the first side wall is connected with the first light emitting surface and forms a non-180-degree angle;
a plurality of first light emitting units disposed on the first light emitting surface;
a first patterned conductive layer disposed on the first sidewall; and
the first driving circuit component is arranged on the first substrate and is adjacent to the first edge of the first substrate, and the first driving circuit component is electrically connected with at least one of the plurality of first light-emitting units.
3. The display panel of claim 1, wherein the core substrate comprises:
the second substrate is provided with a second light emergent surface and a second side wall; the second side wall is connected with the second light emergent surface and is in contact with the first side wall; the second light-emitting surface is coplanar with the first light-emitting surface;
a plurality of second light emitting units disposed on the second light emitting surface; and
the second patterned conductive layer is arranged on the second side wall and is electrically connected with the plurality of second light-emitting units.
4. The display panel of claim 2, wherein the first driving circuit element is disposed on an opposite side of the first light emitting surface and electrically connected to the first light emitting units and the second light emitting units.
5. The display panel of claim 4, further comprising a second patterned conductive layer in electrical contact with the first patterned conductive layer.
6. The display panel of claim 5, further comprising:
the first conducting wire is positioned on the opposite side of the first light emergent surface and is electrically contacted with the first patterned conducting layer and the first driving circuit component;
the second conducting wire is positioned on the opposite side of the second light emergent surface and is electrically contacted with the second patterned conducting layer;
a plurality of first contact plugs penetrating through the first substrate, one end of each of the first contact plugs being connected to one of the plurality of first light emitting units, and the other end of each of the first contact plugs being connected to the first wire; and
and a plurality of second contact plugs penetrating through the second substrate, wherein one end of each second contact plug is connected with one of the plurality of second light-emitting units, and the other end of each second contact plug is connected with the second wire.
7. The display panel of claim 6, further comprising a first black mask layer on the first light-emitting surface and overlapping the first driving circuit element.
8. The display panel of claim 7, wherein the first substrate further comprises:
the third side wall is connected with the first edge and the first light-emitting surface, and the third side wall and the first light-emitting surface form a non-180-degree angle;
a fourth side wall connected with the first edge and the first light-emitting surface, wherein the fourth side wall and the first light-emitting surface form a non-180-degree angle;
a third patterned conductive layer disposed on the third sidewall; and
and the fourth patterned conductive layer is arranged on the fourth side wall.
9. The display panel of claim 8, further comprising:
a third substrate having a third light exit surface and a fifth sidewall; wherein the fifth sidewall is connected to the third light exit surface and contacts the third sidewall; the third light-emitting surface is coplanar with the first light-emitting surface;
a plurality of third light emitting units disposed on the third light emitting surface;
a third driving circuit assembly disposed on the third substrate and adjacent to a third edge of the third substrate;
a fourth driving circuit component disposed on the third substrate and adjacent to a fourth edge of the third substrate, wherein the third edge is connected to the fourth edge and the first edge, and the third edge and the fourth edge are not parallel to each other;
a third black light-shielding layer on the third light-emitting surface, adjacent to the third edge, and overlapping the third driving circuit element; and
and a fourth black light-shielding layer on the third light-emitting surface, adjacent to the fourth edge, and overlapping the fourth driving circuit element.
10. The display panel of claim 9, further comprising:
the fourth substrate is provided with a fourth light emergent surface and a sixth side wall; wherein the sixth sidewall is connected to the fourth light exit surface, and the sixth sidewall is in contact with the fourth sidewall; and the fourth light-emitting surface is coplanar with the first light-emitting surface;
a plurality of fourth light emitting units disposed on the fourth light emitting surface;
a fifth driving circuit component disposed on the fourth substrate and adjacent to a fourth edge or a sixth edge of the fourth substrate, wherein the fifth edge connects the first edge and the sixth edge, and the fifth edge and the sixth edge are not parallel to each other;
a fifth black light-shielding layer on the fourth light-emitting surface and adjacent to the fifth edge; and
and a sixth black matrix disposed on the fourth light-emitting surface and adjacent to the sixth edge, wherein at least one of the fifth black matrix and the sixth black matrix overlaps the fifth driving circuit element.
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| CN201910245487.2A CN110010016B (en) | 2019-03-28 | 2019-03-28 | Display panel |
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| CN201910245487.2A CN110010016B (en) | 2019-03-28 | 2019-03-28 | Display panel |
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| TWI721836B (en) * | 2020-03-24 | 2021-03-11 | 友達光電股份有限公司 | Display device and mosaic display module |
| CN116068795A (en) * | 2023-04-06 | 2023-05-05 | 深圳铭创智能装备有限公司 | Processing method of liquid crystal display screen, liquid crystal display screen and large-format spliced screen |
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| CN102708842B (en) * | 2012-06-08 | 2014-09-17 | 宁波Gqy视讯股份有限公司 | Image processor for mosaic screen |
| CN102931330A (en) * | 2012-11-12 | 2013-02-13 | 中国科学院半导体研究所 | Preparation method of LED (light-emitting diode) flat-panel display unit |
| CN203225845U (en) * | 2013-05-13 | 2013-10-02 | 颜文胜 | Digital high-definition video-wall |
| CN106486490B (en) * | 2015-08-31 | 2021-07-23 | 吴昭武 | Novel LED panel assembly, 3D panel assembly and 3D display screen |
| CN107302011B (en) * | 2016-04-14 | 2020-11-20 | 群创光电股份有限公司 | Display device |
| CN205862772U (en) * | 2016-06-23 | 2017-01-04 | 深圳市威帝欧科技有限公司 | The LCD TV splicing apparatus of a kind of built-in hybrid matrix and liquid crystal-spliced system |
| CN206115896U (en) * | 2016-10-27 | 2017-04-19 | 京东方科技集团股份有限公司 | Tiled display panel and tiled display device |
| CN106791649A (en) * | 2016-12-21 | 2017-05-31 | Tcl数码科技（深圳）有限责任公司 | A kind of display system and display methods of achievable shuangping san |
| CN106710461A (en) * | 2017-02-20 | 2017-05-24 | 吴宇嘉 | Transparent substrate full-color LED (light emitting diode) display screen and production technology |
| US10546913B2 (en) * | 2017-08-01 | 2020-01-28 | Innolux Corporation | Tile display devices and display devices |
| CN207752739U (en) * | 2018-01-31 | 2018-08-21 | 国春鹏 | display device with splicing function |
| CN109167860B (en) * | 2018-11-16 | 2021-03-26 | Oppo（重庆）智能科技有限公司 | Screen cover plate, method for manufacturing screen cover plate and electronic equipment |
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