CN110007737A - A kind of server cooling device - Google Patents
A kind of server cooling device Download PDFInfo
- Publication number
- CN110007737A CN110007737A CN201910374007.2A CN201910374007A CN110007737A CN 110007737 A CN110007737 A CN 110007737A CN 201910374007 A CN201910374007 A CN 201910374007A CN 110007737 A CN110007737 A CN 110007737A
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- China
- Prior art keywords
- water
- inlet
- liquid outlet
- cooled block
- circulatory pool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 74
- 239000007788 liquid Substances 0.000 claims abstract description 35
- 239000004065 semiconductor Substances 0.000 claims abstract description 30
- 238000010521 absorption reaction Methods 0.000 claims abstract description 19
- 239000002250 absorbent Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a kind of server cooling device, including circulatory pool and recirculation assembly, the circulatory pool contacts server enclosure；The recirculation assembly includes delivery pump, storage chamber, water-cooled block and semiconductor chilling plate, the water-cooled block is internally provided with water pipe, the water-cooled block surface offers water pipe inlet and water pipe liquid outlet, heat absorption plane is provided on the water-cooled block, the heat absorption plane is arranged towards CPU, the heat absorption plane is for contacting the back side CPU, the circulation liquid outlet is connected to storage chamber inlet by delivery pump, the storage chamber liquid outlet is opened in the top of storage chamber inlet, the storage chamber liquid outlet is connected to the water pipe inlet of water-cooled block by pipeline, the water pipe liquid outlet of the water-cooled block is connected to circulation inlet, the radiating surface of the semiconductor chilling plate is arranged outside towards circulatory pool.Server cooling device has the advantages that temperature with high efficiency, noise are small and security performance is high.
Description
Technical field
The present invention relates to the field of the cooling equipment of server more particularly to a kind of server cooling devices.
Background technique
Server cabinet is the object for storing computer server and related control device in good orderly, facilitates guarantor
Storage equipment is protected, to guarantee that equipment steadily works, there is the features such as shielding dust-proof waterproof of electromagnetic interference, anti-vibration.Due to
Server cluster can overheat the efficiency that can not only reduce CPU there is a situation where hot-spot in long-play calculating process,
Server apparatus can also be damaged.
In the prior art, it is radiated by installing fan in cabinet to server cabinet inside, radiator fan
Server cluster directly is blowed to, then is distributed heat in external environment by the outline border of mesh, but the energy consumption of this technology is big,
Radiating efficiency is low and can manufacture noise, is unfavorable for server operation.Fan is used for a long time, it can be miscellaneous by dust in environment etc.
Object is gathered on server apparatus, not only reduces the heat-sinking capability of cabinet, but also can bring the dust or moisture for endangering equipment into
Deng there are biggish security risks.
Summary of the invention
For this reason, it may be necessary to a kind of server cooling device be provided, to solve the problems, such as that CPU cooling is difficult.
To achieve the above object, a kind of server cooling device, including circulatory pool and circulation group are inventor provided
Part, the recirculation assembly are set to the side of circulatory pool, offered on the circulatory pool external inlet, circulation liquid outlet and
Inlet is recycled, the circulation liquid outlet and circulation inlet are arranged towards recirculation assembly, and the external inlet passes through the
One valve external water source, the circulatory pool contact server enclosure；
The recirculation assembly includes delivery pump, storage chamber, water-cooled block and semiconductor chilling plate, is set inside the water-cooled block
It is equipped with water pipe, the water-cooled block surface offers water pipe inlet and water pipe liquid outlet, on the water-cooled block
It is provided with heat absorption plane, the heat absorption plane is arranged towards CPU, and the heat absorption plane is described to recycle for contacting the back side CPU
Liquid mouth is connected to storage chamber inlet by delivery pump, and the storage chamber liquid outlet is opened in the top of storage chamber inlet, institute
State the water pipe inlet that storage chamber liquid outlet is connected to water-cooled block by pipeline, the water pipe liquid outlet of the water-cooled block
It is connected to circulation inlet, semiconductor chilling plate mounting hole, the semiconductor chilling plate are offered on the side wall of the circulatory pool
It is installed in semiconductor chilling plate mounting hole, the heat-absorbent surface of the semiconductor chilling plate is described partly to lead towards being arranged in circulatory pool
The radiating surface of body cooling piece is arranged outside towards circulatory pool.
Further, the water pipe inside the water-cooled block spirals setting.
Further, further include temperature control system, the temperature control system include temperature sensor, comparator and
Single-chip microcontroller, the temperature sensor, comparator and single-chip microcontroller are fixed on circulation pool wall, and the temperature sensor is for detecting
Water temperature in circulatory pool, the temperature sensor are electrically connected with comparator, and the comparator is connected to semiconductor by single-chip microcontroller
Cooling piece.
It further, further include digital analog converter and charactron, the digital analog converter and charactron, which are fixed on, to follow
On cisterna ambiens wall, the analog-digital converter is electrically connected with charactron, and analog-digital converter is electrically connected with temperature sensor.
Further, the setting height of the water-cooled block is lower than the liquid outlet height of storage chamber.
It further, further include the second valve and third valve, second valve is respectively arranged at defeated with third valve
Send the inlet and outlet position of pump.
It is different from the prior art, above-mentioned technical proposal has the advantages that will using the water pipe being arranged in water-cooled block
The heat of CPU is taken away, and the water flow that heat improves back flows back into circulatory pool by carrying out next round after semiconductor chilling plate cooling
CPU cooling work carries out whole cooling to server using circulatory pool, which has temperature with high efficiency, makes an uproar
The advantage that sound is small and security performance is high.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of server cooling device of the present embodiment；
Fig. 2 is a kind of server cooling device of the present embodiment structural schematic diagram cooling for CPU and server.
Description of symbols:
1, server enclosure；
11, delivery pump；
12, storage chamber；
13, water-cooled block；
131, water pipe；
2, circulatory pool；
21, the first valve；
22, discharge outlet；
3,CPU；
31, heat absorption plane；
4, semiconductor chilling plate；
5, charactron.
Specific embodiment
Technology contents, construction feature, the objects and the effects for detailed description technical solution, below in conjunction with specific reality
It applies example and attached drawing is cooperated to be explained in detail.
Fig. 1 and Fig. 2 is please referred to, the present invention provides a kind of server cooling device, including circulatory pool 2 and circulation group
Part, circulatory pool are the water storage container for being provided with each functional openings, and as the cooling place of recirculated water, the recirculation assembly is set
It is placed in the side of circulatory pool, the circulatory pool contacts server enclosure 1, and the recirculated water in circulatory pool can also lead to heat transfer suction
Receive the heat of server；
External inlet, circulation liquid outlet and circulation inlet, the circulation liquid outlet are offered on the circulatory pool
And circulation inlet is arranged towards recirculation assembly, i.e. circulation liquid outlet and circulation inlet is provided with circulatory pool towards circulation group
The side of part, the external inlet are tapped by 21 external water source of the first valve for convenience of external inlet external water source outside
Liquid mouth is provided with the side of circulatory pool, convenient for being connected by pipeline with peripheral hardware water source, is infused by external water source into circulatory pool
Enter certain recirculated water for system use.
The recirculation assembly includes delivery pump 11, storage chamber 12 and water-cooled block 13, and delivery pump can be locked by connector to be set
In on the pool wall of circulatory pool, the storage chamber and water-cooled block can be set up on the pool wall of circulatory pool by bracket, delivery pump
Effect is to pump the water in circulatory pool into storage chamber, and the effect of storage chamber is to collect quantitative recirculated water for cooling dress
The cooling work set, the effect of water-cooled block are to be made for being in contact with CPU (central processing unit) 3 using high conductivity material
Water-cooled block can be quickly by the heat absorption of CPU, and by the heat of absorption with the water stream channel outflow water inside water-cooled block
Cold piece.
The water-cooled block is the metal block with high-termal conductivity, and the water-cooled block is internally provided with water pipe, described
Water-cooled block surface offers water pipe inlet and water pipe liquid outlet, and heat absorption plane 31 is provided on the water-cooled block,
The heat absorption plane is arranged towards CPU, and the heat absorption plane is for contacting the back side CPU.Water-cooled block heat absorption plane refers to water-cooled block
On at least one side be plane be used for CPU back face touch, the contact surface of plane have the advantage that increase its contact
Area accelerates heat absorption.Normally, water-cooled block is regular geometric shapes body, such as cuboid, triangular prism or pyrometric cone, water-cooled block
Any one geometric surface be used to touch with CPU back face, water-cooled block is also possible to not advising with more than two heat absorption plane
Then shape.Herein it should be noted that: the back side of CPU refers to that CPU does not set the one side of pin.
The circulation liquid outlet is connected to storage chamber inlet by delivery pump, and the storage chamber liquid outlet is opened in water storage
The top of chamber inlet, when the water level in storage chamber overflows to the height of storage chamber liquid outlet, water in storage chamber is from storage chamber
Liquid outlet overflows, and the storage chamber liquid outlet is connected to the water pipe inlet of water-cooled block by pipeline, the water-cooled block
Water pipe liquid outlet is connected to circulation inlet, and semiconductor chilling plate mounting hole is offered on the side wall of the circulatory pool, and half
For installing fixed semiconductor chilling plate 4, the working principle of semiconductor chilling plate is conductor cooling piece mounting hole: when direct current is logical
When crossing the galvanic couple that two kinds of different semiconductor materials are connected into, heat can be absorbed respectively at the both ends of galvanic couple and releases heat, it can
To realize the purpose of refrigeration, semiconductor chilling plate has the advantages that high reliablity, pollutes without refrigerant.The two of semiconductor chilling plate
A working face is respectively heat-absorbent surface and radiating surface, and the heat-absorbent surface of the semiconductor chilling plate is described towards being arranged in circulatory pool
The radiating surface of semiconductor chilling plate is arranged outside towards circulatory pool.
In the server cooling device in use, opening the first valve, external water source is by external inlet to circulation
Certain water is injected in pond, closes the first valve, opens delivery pump, and delivery pump takes out the water in circulatory pool by circulation liquid outlet
It send into storage chamber, after stablizing hydraulic pressure into the water in storage chamber, enters water cooling from storage chamber liquid outlet with stable flow overflow
In the water pipe of block, heat is siphoned away from the back side CPU by the heat absorption plane of water-cooled block, heat is in water-cooled block water pipe
Water flow flowing is pulled away, and stable water flow can guarantee to avoid temperature decrease pair to the constant cooling efficiency of CPU in water-cooled block
CPU has an impact, and the water with certain heat flowed out out of water pipe is flowed back in circulatory pool by recycling inlet, recycles
The semiconductor chilling plate work being arranged on the side wall of pond is by outside the heat transfer to circulatory pool in recirculated water, to realize the service
The circulation temperature lowering effect of device cooling device.
In other embodiments, external water source can be replaced with other refrigerant sources.
In the present embodiment, storage chamber and circulatory pool are closed containers, and the vertical or horizontal installation of CPU can be protected
The cooling work for demonstrate,proving server cooling device is normally carried out.
In certain preferred embodiments, the setting height of the water-cooled block is lower than the liquid outlet height of storage chamber.In height
Under the force effect of degree difference, the water flow that can accelerate in water-cooled block water pipe is flowed into storage chamber, to improve the cooling of CPU
Efficiency.
In certain preferred embodiments, the water pipe 131 inside the water-cooled block spirals setting, and water pipe is in water
The path of cold piece of inside turn is longer, and the cooling effect that water-cooled block plays CPU is more obvious.
In certain preferred embodiments, which further includes temperature control system, the temperature control
System processed includes temperature sensor, comparator and single-chip microcontroller, and the temperature sensor, comparator and single-chip microcontroller, which are fixed on, to follow
On cisterna ambiens wall, the temperature sensor is used to detect the water temperature in circulatory pool, and the temperature sensor is electrically connected with comparator, institute
It states comparator and semiconductor chilling plate is connected to by single-chip microcontroller.Temperature sensor detects the water temperature in circulatory pool, and water temperature is believed
Number be converted to electric signal compares with the preset value in comparator, if the water temperature in circulatory pool than or equal to preset value,
Then working signal is transmitted to single-chip microcontroller by comparator, refrigeration work is carried out by single-chip microcontroller control semiconductor chilling plate, if circulation
Water temperature in pond is less than preset value, then single-chip microcontroller will not control semiconductor chilling plate work, is played by temperature control system
The effect of energy saving；
It is highly preferred that further including digital analog converter and charactron 5, the digital analog converter and charactron are fixed on and follow
On cisterna ambiens wall, the analog-digital converter is electrically connected with charactron, and analog-digital converter is electrically connected with temperature sensor.Temperature sensing
After device detects the water temperature in circulatory pool, it is delivered in analog-digital converter after water temperature signal is converted to electric signal, analog-digital converter
It is come out after being converted into digital signal by numeral method, so that staff can directly be known from charactron
Water temperature condition in circulatory pool.If the refrigeration effect of the water temperature over-high in circulatory pool, semiconductor chilling plate is difficult to ensure, then need
The server is replaced with the water storage in cooling device, to guarantee that the server is able to carry out normally with cooling device
Cooling work.Water is changed to realize, circulation bottom of pond portion offers discharge outlet 22.
In certain preferred embodiments, which further includes the second valve and third valve, described
Second valve and third valve are respectively arranged at the inlet and outlet position of delivery pump.The beneficial effect is that can facilitate to conveying
Pump is overhauled and is cleaned.
It should be noted that being not intended to limit although the various embodiments described above have been described herein
Scope of patent protection of the invention.Therefore, it based on innovative idea of the invention, change that embodiment described herein is carried out and is repaired
Change, or using equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it directly or indirectly will be with
Upper technical solution is used in other related technical areas, is included within the scope of protection of the patent of the present invention.
Claims (7)
1. a kind of server cooling device, it is characterised in that: including circulatory pool and recirculation assembly, the recirculation assembly setting
In offered on the side of circulatory pool, the circulatory pool external inlet, circulation liquid outlet and circulation inlet, the circulation
Liquid outlet and circulation inlet are arranged towards recirculation assembly, and the external inlet is described by the first valve external water source
Circulatory pool contacts server enclosure；
The recirculation assembly includes delivery pump, storage chamber, water-cooled block and semiconductor chilling plate, and the water-cooled block is internally provided with
Water pipe, the water-cooled block surface offer water pipe inlet and water pipe liquid outlet, are arranged on the water-cooled block
There is heat absorption plane, the heat absorption plane is arranged towards CPU, and the heat absorption plane is for contacting the back side CPU, the circulation liquid outlet
It is connected to storage chamber inlet by delivery pump, the storage chamber liquid outlet is opened in the top of storage chamber inlet, the storage
Water cavity liquid outlet is connected to the water pipe inlet of water-cooled block, the water pipe liquid outlet connection of the water-cooled block by pipeline
In offering semiconductor chilling plate mounting hole on circulation inlet, the side wall of the circulatory pool, the semiconductor chilling plate is installed
In semiconductor chilling plate mounting hole, the heat-absorbent surface of the semiconductor chilling plate is towards being arranged in circulatory pool, the semiconductor system
Cold radiating surface is arranged outside towards circulatory pool.
2. server cooling device according to claim 1, it is characterised in that: the water pipe inside the water-cooled block
It spirals setting.
3. server cooling device according to claim 1, it is characterised in that: it further include temperature control system, it is described
Temperature control system includes temperature sensor, comparator and single-chip microcontroller, and the temperature sensor, comparator and single-chip microcontroller are solid
Due on circulation pool wall, the temperature sensor is used to detect the water temperature in circulatory pool, the temperature sensor and comparator electricity
Connection, the comparator are connected to semiconductor chilling plate by single-chip microcontroller.
4. server cooling device according to claim 3, it is characterised in that: further include digital analog converter and number
Pipe, the digital analog converter and charactron are fixed on circulation pool wall, and the analog-digital converter is electrically connected with charactron, and mould
Number converter is electrically connected with temperature sensor.
5. server cooling device according to claim 1, it is characterised in that: the water-cooled block is with high-termal conductivity
Metal block.
6. server cooling device according to claim 1, it is characterised in that: the setting height of the water-cooled block is lower than
The liquid outlet height of storage chamber.
7. server cooling device according to claim 1, it is characterised in that: further include the second valve and third valve
Door, second valve and third valve are respectively arranged at the inlet and outlet position of delivery pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910374007.2A CN110007737A (en) | 2019-05-07 | 2019-05-07 | A kind of server cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910374007.2A CN110007737A (en) | 2019-05-07 | 2019-05-07 | A kind of server cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110007737A true CN110007737A (en) | 2019-07-12 |
Family
ID=67175911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910374007.2A Pending CN110007737A (en) | 2019-05-07 | 2019-05-07 | A kind of server cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110007737A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070209784A1 (en) * | 2006-03-10 | 2007-09-13 | Yu-Huang Peng | Water-cooling heat dissipation device and water block for the same |
| CN101261027A (en) * | 2008-04-18 | 2008-09-10 | 广东联塑科技实业有限公司 | Water cooled space cooling system |
| CN107426945A (en) * | 2017-06-26 | 2017-12-01 | 山东众志电子有限公司 | Server liquid-cooling system |
| CN107920459A (en) * | 2017-12-15 | 2018-04-17 | 浙江工商大学 | A kind of double water communication cycle machine room intelligent cooling systems using semiconductor refrigerating |
| CN209486610U (en) * | 2019-05-07 | 2019-10-11 | 福建师范大学 | A kind of server cooling device |
-
2019
- 2019-05-07 CN CN201910374007.2A patent/CN110007737A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070209784A1 (en) * | 2006-03-10 | 2007-09-13 | Yu-Huang Peng | Water-cooling heat dissipation device and water block for the same |
| CN101261027A (en) * | 2008-04-18 | 2008-09-10 | 广东联塑科技实业有限公司 | Water cooled space cooling system |
| CN107426945A (en) * | 2017-06-26 | 2017-12-01 | 山东众志电子有限公司 | Server liquid-cooling system |
| CN107920459A (en) * | 2017-12-15 | 2018-04-17 | 浙江工商大学 | A kind of double water communication cycle machine room intelligent cooling systems using semiconductor refrigerating |
| CN209486610U (en) * | 2019-05-07 | 2019-10-11 | 福建师范大学 | A kind of server cooling device |
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