CN209486610U - Cooling device for server - Google Patents

Abstract

The utility model relates to a cooling device for a server, comprising a circulation pool and a circulation assembly, the circulation pool is in contact with the server shell; the circulation assembly includes a delivery pump, a water storage cavity, a water cooling block and a semiconductor refrigeration sheet, and the water cooling block A water flow pipe is arranged inside, and the surface of the water cooling block is provided with a water flow pipe liquid inlet and a water flow pipe liquid outlet. The water cooling block is provided with a heat absorption plane, and the heat absorption plane is set facing the CPU. Used to contact the back of the CPU, the circulating liquid outlet is connected to the liquid inlet of the water storage chamber through a delivery pump, the liquid outlet of the water storage chamber is opened above the liquid inlet of the water storage chamber, and the liquid outlet of the water storage chamber The mouth is connected to the water flow pipe liquid inlet of the water cooling block through a pipe, the water flow pipe liquid outlet of the water cooling block is connected to the circulation liquid inlet, and the heat dissipation surface of the semiconductor refrigeration sheet is arranged facing the outside of the circulation pool. The server cooling device has the advantages of efficient cooling, low noise and high safety performance.

Description

Cooling device for server

technical field

The utility model relates to the field of server cooling equipment, in particular to a server cooling device.

Background technique

The server cabinet is used to store computer servers and related control equipment in a neat and orderly manner. It is convenient to protect the storage equipment so as to ensure the stable operation of the equipment. It has the characteristics of shielding electromagnetic interference, dustproof, waterproof, and anti-vibration. Because the server cluster will overheat locally during the long-running computing process, overheating will not only reduce the efficiency of the CPU, but also damage the server equipment.

In the existing technology, fans are installed in the cabinet to dissipate heat inside the server cabinet. The cooling fan blows directly to the server cluster, and then dissipates the heat to the external environment through the mesh-shaped outer frame. However, this technology consumes a lot of energy. , the heat dissipation efficiency is low and it will make noise, which is not conducive to the operation of the server. Long-term use of the fan will gather dust and other sundries in the environment on the server equipment, which not only weakens the cooling capacity of the chassis, but also brings in dust or moisture that is harmful to the equipment, posing a greater safety hazard.

Utility model content

Therefore, it is necessary to provide a cooling device for a server to solve the problem of difficulty in cooling the CPU.

In order to achieve the above object, the inventor provides a server cooling device, including a circulation pool and a circulation assembly, the circulation assembly is arranged on one side of the circulation pool, and the circulation pool is provided with an external liquid inlet and a circulation outlet And a circulation liquid inlet, the circulation liquid outlet and the circulation liquid inlet are set towards the circulation assembly, the external liquid inlet is connected to the external water source through the first valve, and the circulation pool contacts the server shell;

The circulation assembly includes a delivery pump, a water storage chamber, a water cooling block, and a semiconductor cooling chip. A water flow pipe is arranged inside the water cooling block, and a water flow pipe liquid inlet and a water flow pipe liquid outlet are opened on the surface of the water cooling block. A heat-absorbing plane is arranged on the water-cooling block, and the heat-absorbing plane is set facing the CPU. The heat-absorbing plane is used to contact the back of the CPU. The liquid outlet of the water chamber is set above the liquid inlet of the water storage chamber, and the liquid outlet of the water storage chamber is connected to the liquid inlet of the water flow pipe of the water cooling block through a pipe, and the liquid outlet of the water flow pipe of the water cooling block is connected to the circulation The liquid inlet, the side wall of the circulation pool is provided with a semiconductor cooling chip installation hole, the semiconductor cooling chip is installed in the semiconductor cooling chip installation hole, the heat absorption surface of the semiconductor cooling chip is set towards the circulation pool, the The heat dissipation surface of the semiconductor cooling sheet is set towards the outside of the circulation pool;

It also includes a temperature control system, the temperature control system includes a temperature sensor, a comparator and a single-chip microcomputer, the temperature sensor, the comparator and the single-chip microcomputer are fixed on the wall of the circulation pool, the temperature sensor is used to detect the water temperature in the circulation pool, the The temperature sensor is electrically connected to the comparator, and the comparator is connected to the semiconductor cooling chip through the single-chip microcomputer.

Further, the water flow pipes inside the water cooling block are arranged in a spiral manner.

Further, it also includes a digital-to-analog converter and a digital tube, the digital-to-analog converter and the digital tube are fixed on the wall of the circulation pool, the analog-to-digital converter is electrically connected to the digital tube, and the analog-to-digital converter is electrically connected to the temperature sensor. connect.

Further, the installation height of the water cooling block is lower than the height of the liquid outlet of the water storage chamber.

Further, a second valve and a third valve are also included, and the second valve and the third valve are respectively arranged at the inlet and outlet positions of the delivery pump.

Different from the prior art, the above-mentioned technical solution has the following advantages: the heat of the CPU is taken away by the water flow pipe provided in the water cooling block, and the water flow with increased heat flows into the circulation pool again to cool down the temperature of the semiconductor cooling plate for the next round of CPU cooling work. The cooling device for the server has the advantages of high-efficiency cooling, low noise and high safety performance by using the circulating pool to cool down the server as a whole.

Description of drawings

FIG. 1 is a schematic structural diagram of a cooling device for a server in this embodiment;

FIG. 2 is a schematic structural diagram of a server cooling device used for CPU and server cooling in this embodiment.

Explanation of reference signs:

1. Server shell;

11. Delivery pump;

12. Water storage cavity;

13. Water cooling block;

131. Water flow pipeline;

2. Circulating pool;

21. The first valve;

22. Outlet;

3. CPU;

31. Heat-absorbing plane;

4. Semiconductor refrigeration chip;

5. Nixie tube.

Detailed ways

In order to explain in detail the technical content, structural features, achieved goals and effects of the technical solution, the following will be described in detail in conjunction with specific embodiments and accompanying drawings.

Please refer to Fig. 1 and Fig. 2, the utility model provides a cooling device for servers, including a circulation pool 2 and a circulation assembly, the circulation pool is a water storage container provided with various functional openings, as a cooling place for circulating water, said The circulation component is arranged on one side of the circulation pool, the circulation pool contacts the server shell 1, and the circulating water in the circulation pool can also absorb the heat of the server through heat transfer;

The circulating pool is provided with an external liquid inlet, a circulating liquid outlet, and a circulating liquid inlet, and the circulating liquid outlet and the circulating liquid inlet are set toward the circulation component, that is, the circulating liquid outlet and the circulating liquid inlet are opened in the circulation The side of the pool facing the circulation component, the external liquid inlet is connected to the external water source through the first valve 21. In order to facilitate the external connection of the external liquid inlet to the external water source, the external liquid inlet is set on the side of the circulating pool, which is convenient to communicate with the external water source through the pipeline. Connect, inject a certain amount of circulating water into the circulating pool through an external water source for system use.

The circulation assembly includes a delivery pump 11, a water storage chamber 12 and a water cooling block 13. The delivery pump can be locked on the wall of the circulation pool through a connector, and the water storage chamber and the water cooling block can be mounted on the wall of the circulation pool through a bracket. On the wall of the pool, the function of the delivery pump is to pump the water in the circulating pool to the water storage chamber. The function of the water storage chamber is to collect a certain amount of circulating water for the cooling work of the cooling device. (Central Processing Unit) 3-phase contact, the water cooling block made of high thermal conductivity material can quickly absorb the heat of the CPU, and the absorbed heat flows out of the water cooling block along with the water flow channel inside the water cooling block.

The water cooling block is a metal block with high thermal conductivity, and the inside of the water cooling block is provided with a water flow pipe, the surface of the water cooling block is provided with a water flow pipe liquid inlet and a water flow pipe liquid outlet, and the water cooling block is provided with The heat absorption plane 31 is arranged towards the CPU, and the heat absorption plane is used to contact the back of the CPU. The heat-absorbing plane of the water-cooling block means that at least one side of the water-cooling block is flat to contact the back of the CPU. The beneficial effect of the flat contact surface is that it can increase its contact area and accelerate heat absorption. Usually, the water cooling block is a regular geometric shape, such as a cuboid, triangular prism or triangular pyramid. Any geometric surface of the water cooling block is used to contact the back of the CPU. The water cooling block can also be an irregular shape with more than two heat-absorbing planes. shape. What needs to be specially explained here is: the back of the CPU refers to the side of the CPU without pins.

The circulating liquid outlet is connected to the liquid inlet of the water storage chamber through a transfer pump, and the liquid outlet of the water storage chamber is opened above the liquid inlet of the water storage chamber. When the water level in the water storage chamber overflows to the outlet of the water storage chamber When the height of the liquid port is high, the water in the water storage chamber overflows from the liquid outlet of the water storage chamber. The liquid port is connected to the circulating liquid inlet, and the side wall of the circulation pool is provided with a semiconductor cooling chip installation hole, which is used to install and fix the semiconductor cooling chip 4. The working principle of the semiconductor cooling chip is: when the direct current passes through When two different semiconductor materials are connected in series to form a galvanic couple, heat can be absorbed and released at both ends of the galvanic couple, which can achieve the purpose of refrigeration. The semiconductor refrigeration chip has the advantages of high reliability and no refrigerant pollution. The two working surfaces of the semiconductor refrigerating sheet are a heat-absorbing surface and a heat-dissipating surface respectively, and the heat-absorbing surface of the semiconductor refrigerating sheet is arranged toward the inside of the circulation pool, and the heat-dissipating surface of the semiconductor refrigerating sheet is arranged toward the outside of the circulating pool.

When the server cooling device is in use, the first valve is opened, the external water source injects a certain amount of water into the circulation pool through the external liquid inlet, the first valve is closed, the delivery pump is turned on, and the delivery pump pumps the water in the circulation pool through the circulation outlet After entering the water storage chamber, after the water entering the water storage chamber stabilizes the water pressure, it overflows from the outlet of the water storage chamber with a stable flow into the water flow pipe of the water cooling block, and is sucked away from the back of the CPU through the heat absorption plane of the water cooling block. Heat, the heat is taken away with the water flow in the water flow pipe of the water cooling block. The stable water flow in the water cooling block can ensure the constant cooling efficiency of the CPU and avoid the impact of the sudden temperature drop on the CPU. The hot water flows back into the circulation pool through the circulation liquid inlet, and the semiconductor cooling chip set on the side wall of the circulation pool works to transfer the heat in the circulation water to the outside of the circulation pool, thus realizing the circulation cooling effect of the server cooling device.

In other embodiments, the external water source can be replaced with other refrigerant sources.

In this embodiment, both the water storage chamber and the circulation pool are airtight containers, and the CPU is installed vertically or horizontally, both of which can ensure the normal cooling operation of the cooling device for the server.

In some preferred embodiments, the height of the water cooling block is lower than the height of the liquid outlet of the water storage chamber. Under the influence of the height difference, the water flow in the water flow pipe of the water cooling block can be accelerated to flow into the water storage cavity, thereby improving the cooling efficiency of the CPU.

In some preferred embodiments, the water flow pipe 131 inside the water cooling block is spirally arranged, and the longer the path of the water flow pipe spiraling in the water cooling block, the more obvious the cooling effect of the water cooling block on the CPU.

In some preferred embodiments, the cooling device for the server also includes a temperature control system, the temperature control system includes a temperature sensor, a comparator and a single-chip microcomputer, and the temperature sensor, the comparator and the single-chip microcomputer are fixed on the wall of the circulation pool, The temperature sensor is used to detect the water temperature in the circulation pool, and the temperature sensor is electrically connected to a comparator, and the comparator is connected to a semiconductor cooling chip through a single-chip microcomputer. The temperature sensor detects the water temperature in the circulating pool, converts the water temperature signal into an electrical signal and compares it with the preset value in the comparator. If the water temperature in the circulating pool exceeds or equals the preset value, the comparator transmits the working signal to the single-chip microcomputer. The single-chip microcomputer controls the semiconductor refrigeration chip to perform cooling work. If the water temperature in the circulating pool does not exceed the preset value, the single-chip microcomputer will not control the semiconductor refrigeration chip to work, and the temperature control system can save energy;

More preferably, it also includes a digital-to-analog converter and a digital tube 5, the digital-to-analog converter and the digital tube are fixed on the circulation pool wall, the analog-to-digital converter is electrically connected to the digital tube, and the analog-to-digital converter is connected to the temperature The sensor is electrically connected. After the temperature sensor detects the water temperature in the circulating pool, it converts the water temperature signal into an electrical signal and sends it to the analog-to-digital converter. You can directly know the water temperature in the circulating pool on the Internet. If the temperature of the water in the circulation pool is too high and the cooling effect of the semiconductor cooling sheet is difficult to guarantee, it is necessary to replace the water storage in the cooling device for the server, so as to ensure that the cooling device for the server can perform normal cooling work. In order to realize water exchange, a drain port 22 is provided at the bottom of the circulating pool.

In some preferred embodiments, the server cooling device further includes a second valve and a third valve, and the second valve and the third valve are respectively arranged at the inlet and outlet positions of the delivery pump. The beneficial effect is that the delivery pump can be conveniently repaired and cleaned.

It should be noted that although the above-mentioned embodiments have been described herein, the patent protection scope of the present utility model is not limited thereby. Therefore, based on the innovative concept of the present utility model, the changes and modifications to the embodiments described herein, or the equivalent structure or equivalent process transformation made by using the description of the utility model and the contents of the accompanying drawings, directly or indirectly convert the above technologies The application of the scheme in other relevant technical fields is included in the protection scope of the utility model patent.

Claims (6)

1. A cooling device for a server, characterized in that: it includes a circulation pool and a circulation assembly, the circulation assembly is arranged on one side of the circulation pool, and the circulation pool is provided with an external liquid inlet, a circulation liquid outlet, and a circulation inlet The liquid outlet, the circulation liquid outlet and the circulation liquid inlet are set towards the circulation assembly, the external liquid inlet is connected to the external water source through the first valve, and the circulation pool is in contact with the server shell; The circulation assembly includes a delivery pump, a water storage chamber, a water cooling block, and a semiconductor cooling chip. A water flow pipe is arranged inside the water cooling block, and a water flow pipe liquid inlet and a water flow pipe liquid outlet are opened on the surface of the water cooling block. A heat-absorbing plane is arranged on the water-cooling block, and the heat-absorbing plane is set facing the CPU. The heat-absorbing plane is used to contact the back of the CPU. The liquid outlet of the water chamber is set above the liquid inlet of the water storage chamber, and the liquid outlet of the water storage chamber is connected to the liquid inlet of the water flow pipe of the water cooling block through a pipe, and the liquid outlet of the water flow pipe of the water cooling block is connected to the circulation The liquid inlet, the side wall of the circulation pool is provided with a semiconductor cooling chip installation hole, the semiconductor cooling chip is installed in the semiconductor cooling chip installation hole, the heat absorption surface of the semiconductor cooling chip is set towards the circulation pool, the The heat dissipation surface of the semiconductor cooling sheet is set towards the outside of the circulation pool; It also includes a temperature control system, the temperature control system includes a temperature sensor, a comparator and a single-chip microcomputer, the temperature sensor, the comparator and the single-chip microcomputer are fixed on the wall of the circulation pool, the temperature sensor is used to detect the water temperature in the circulation pool, the The temperature sensor is electrically connected to the comparator, and the comparator is connected to the semiconductor cooling chip through the single-chip microcomputer. 2 . The server cooling device according to claim 1 , wherein the water flow pipes inside the water cooling block are arranged in a spiral manner. 3 . 3. The server cooling device according to claim 1, further comprising a digital-to-analog converter and a digital tube, the digital-to-analog converter and the digital tube are fixed on the circulation pool wall, and the analog-to-digital converter It is electrically connected with the nixie tube, and the analog-to-digital converter is electrically connected with the temperature sensor. 4. The server cooling device according to claim 1, wherein the water cooling block is a metal block with high thermal conductivity. 5 . The server cooling device according to claim 1 , wherein the height of the water cooling block is lower than that of the liquid outlet of the water storage chamber. 6 . 6 . The server cooling device according to claim 1 , further comprising a second valve and a third valve, and the second valve and the third valve are respectively arranged at the inlet and outlet positions of the delivery pump. 7 .