CN110003659A - A kind of heat-conducting silicone grease - Google Patents
A kind of heat-conducting silicone grease Download PDFInfo
- Publication number
- CN110003659A CN110003659A CN201910344545.7A CN201910344545A CN110003659A CN 110003659 A CN110003659 A CN 110003659A CN 201910344545 A CN201910344545 A CN 201910344545A CN 110003659 A CN110003659 A CN 110003659A
- Authority
- CN
- China
- Prior art keywords
- heat
- aluminum nitride
- dosage
- nitride powder
- diamond dust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/41—Compounds containing sulfur bound to oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/10—Liquid materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lubricants (AREA)
Abstract
A kind of heat-conducting silicone grease, including silicone oil, aluminum nitride powder, also there is diamond dust, lauryl sodium sulfate, amino alcohol solvay-type titanate esters, diamond dust grain size specification is W5 and two kinds of W0.25, wherein the ratio of partial size W5 and W0.25 is 3:1, silicon oil dosage is 24 percent, aluminum nitride powder dosage is 50 percent, diamond dust dosage is 15 percent, lauryl sodium sulfate dosage is 10, the dosage of amino alcohol solvay-type titanate esters is 1 percent, silicone oil, the diamond dust of aluminum nitride powder and partial size W5 are as base-material, lauryl sodium sulfate, the diamond dust of amino alcohol solvay-type titanate esters and partial size W0.25 are as auxiliary material, above-mentioned each raw material reconciles through high temperature.The present invention effectively increases the thermal coefficient of finished product, ensure that integrated circuit effectively radiates in use, improves integrated circuit operation performance and reduces the probability of damage.Based on above-mentioned, so the application prospect that the present invention has had.
Description
Technical field
The present invention relates to electronic device auxiliary material field, especially a kind of heat-conducting silicone grease.
Background technique
Temperature rise can be generated in the work such as relatively high power integrated circuit, therefore in practical application, relatively high power integrated circuit one
As need using cooling fin and radiator fan, the heat generated for its work radiates, and then guarantees its normal working performance,
Also it is unlikely to damage because temperature rise is excessively high.For example normal temperature can guarantee its normal work at 75 DEG C or less to computer CPU at work
Make, temperature is more than 80 DEG C or more and is easy to cause computer crash or automatic shutdown, or even because temperature is excessively high cause CPU burn to
User brings larger economic loss；Under actual conditions, cpu temperature is lower, and work runnability is higher, otherwise performance is poorer；Cause
This computer CPU is provided with cooling fin and radiator fan as CPU heat dissipation.Since manufacturing process limits, it is impossible to accomplish CPU shell table
Face and the absolute mirror surface of spreader surface, in order to guarantee cooling fin heating surface and CPU surface of shell be effectively bonded it is thermally conductive, therefore
It needs to spread heat-conducting silicone grease between the surface of shell of CPU and the binding face of cooling fin, guarantees leakproofness between the two, and lead to
Heat-conducting silicone grease is crossed to distribute the heat walking guide that CPU is generated through cooling fin and radiator fan.
Existing heat-conducting silicone grease mainly includes that (main Heat Conduction Material, there are also use and aluminium nitride for Heat Conduction Material aluminum nitride powder
The boron nitride that mealiness can approach) and the composition such as silicone oil, limit by its composition material, although existing heat-conducting silicone grease aluminum nitride powder tool
There are very low specific heat capacity (22.87J/(kg. DEG C of specific data), has the characteristics that temperature rise is fast, but its thermal coefficient only has
The left and right 300W/ (mK), since the aluminum nitride powder content of heat-conducting silicone grease typically constitutes from the percentage of all material on 60 percent left side
Right (excessively will lead to end properties variation, mobility is small, can not effectively be bonded the surface of CPU and cooling fin), the conducts such as silicone oil
Basic material thermal coefficient is lower, therefore the thermal coefficient gross data of finished product heat-conducting silicone grease only has 180W/ (mK), actual conditions
It is, since the aluminum nitride powder partial size that existing heat-conducting silicone grease uses is minimum, to be applied to after thermally conductive sheet lower end and the upper end CPU, nitrogen
Changing can not effectively contact between aluminium powder grain and aluminium nitride powder, be also impossible to effectively between thermally conductive sheet lower end and the upper end CPU
Contact, thermal resistance thus can be generated between aluminium nitride powder and aluminium nitride powder (namely can not effectively transmit heat between gap
Amount), actual thermal conductivity only has the left and right 1-5W/ (mK), therefore effectively CPU can not be made to cool down, this is also that existing CPU etc. can not be real
The main reason for existing overclocking.And existing heat-conducting silicone grease is limited since proportion forms, and after heat effect, is easy to appear viscosity
Situations such as being lower causes heat-conducting silicone grease after smearing to flow out between CPU and the surface of cooling fin or aluminum nitride powder is out of silicone grease
It is precipitated, it is even more impossible to guarantee the effect of heat dissipation in this way.
Summary of the invention
In order to overcome existing heat-conducting silicone grease because constituent limits, it is poor that there are thermal conductivitys, can not effectively be relatively high power collection
It is thermally conductive at circuit and then the drawbacks of effectively radiate through cooling fin, radiator fan, the present invention provides use partial size for W5's or so
Lauryl sodium sulfate, amino alcohol solvay-type metatitanic acid is added as thermally conductive main material in diamond dust and aluminum nitride powder
In conjunction with the finished product that silicone grease forms the reunion and fusion of a variety of materials can be not only effectively ensured, and increase the sticky of finished product in ester
Degree, and combination aluminum nitride powder specific heat capacity is low, temperature rise is fast, the big spy of bortz powder thermal coefficient (thermal coefficient is in 2000W/mK)
Point, after smearing, partial size is that the diamond dust of W5 or so can effectively be bonded the shell upper end radiating surface and radiating copper of integrated circuit
(for the radiator mirror surface that in the prior art, object finely polishes at present in W5 or so, partial size is the gold of W5 or so between the lower end of piece
Hard rock powder can be effectively bonded between the shell upper end radiating surface of integrated circuit and the lower end of radiating copper sheet), integrated circuit generates
Heat efficiency act on aluminum nitride powder, aluminum nitride powder temperature rise transfers heat to bortz powder in time fastly, and then leads with height
The bortz powder of heating rate can effectively transfer heat to radiating copper sheet, and bortz powder dosage is 20 or so percent, due to gold
Emery partial size and cooling fin, integrated circuit shell radiating surface gap close to consistent, can effective, thermal conductivity at least exists
300W/(mK), the thermal coefficient for thus effectively increasing finished product ensure that integrated circuit effectively radiates in use, improve collection
At circuit working performance and a kind of heat-conducting silicone grease for reducing damage probability.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of heat-conducting silicone grease, including silicone oil, aluminum nitride powder, it is characterised in that also have diamond dust, lauryl sodium sulfate,
Amino alcohol solvay-type titanate esters, diamond dust grain size specification are W5 and two kinds of W0.25, wherein the ratio of partial size W5 and W0.25
For 3:1, silicon oil dosage is 24 percent, aluminum nitride powder dosage is 50 percent, diamond dust dosage is percent
15, lauryl sodium sulfate dosage is 10, the dosage of amino alcohol solvay-type titanate esters is 1 percent, silicone oil,
The diamond dust of aluminum nitride powder and partial size W5 are as base-material, lauryl sodium sulfate, amino alcohol solvay-type titanate esters and partial size
The diamond dust of W0.25 reconciles as auxiliary material, above-mentioned each raw material through high temperature.
In the heat-conducting silicone grease preparation, first silicone oil is poured into the thermostatic container of process equipment, in thermostatic container in temperature
After being raised to 80 DEG C or so, constant temperature in thermostatic container is kept, partial size W5 and W0.25 is then successively added in thermostatic container respectively
Bortz powder and aluminum nitride powder start the rabbling mechanism of process equipment, and rabbling mechanism is stirred continuously material in thermostatic container, interval
After ten minutes, after above-mentioned material stirs, stopping is stirred into next process.
After the bortz powder and aluminum nitride powder, silicone oil material stir, lauryl sodium sulfate, amino alcohol
Solvay-type titanate esters are added in material, and continue to guarantee the temperature of thermostatic container, open the rabbling mechanism of process equipment, blender
Structure is stirred continuously silicone oil in thermostatic container, aluminum nitride powder, diamond dust, lauryl sodium sulfate, amino alcohol solvay-type metatitanic acid
Ester material, after twenty minutes, after above-mentioned material stirs, material just obtains finished product after stopping stirring cooling at interval, at
The laggard marketing of product packaging is sold.
In the rabbling mechanism whipping process of the process equipment, agitating shaft stirs for a period of time, counterclockwise according to clockwise
Stir a period of time stirring sequence be stirred, fully ensure that stirring after material it is uniform.
The medicine have the advantages that the present invention is in use, be uniformly applied to finished product the shell upper end heat dissipation of integrated circuit
Between face and the heat-absorbent surface of cooling fin.The present invention can effectively allow silicone oil and Nano diamond, nitridation using lauryl sodium sulfate
Aluminium powder is perfectly combined, and the reunion and fusion of a variety of materials can be effectively ensured, moreover it is possible to be prevented subsequent in use, aluminum nitride powder, Buddha's warrior attendant
Mountain flour etc. is precipitated out of silicone oil, and performance is more stable；The viscosity of finished product is increased using amino alcohol solvay-type titanate esters, not only
Conducive to the smearing in use, character will not cause product from integrated circuit because mobility enhances after also ensuring finished product heat absorption
It is flowed out between shell upper end radiating surface and the heat-absorbent surface of cooling fin and then heat dissipation performance is caused to be deteriorated.Present invention combination aluminium nitride
Powder specific heat capacity is low, thermal coefficient is big, and the big feature of bortz powder thermal coefficient (thermal coefficient is in 2000W/mK) (lead by bortz powder
Hot coefficient is big but specific heat capacity is high, temperature rise is slow), after smearing, partial size is that the diamond dust of W5 or so can effectively be bonded integrated electricity
(in the prior art, the radiator mirror that object finely polishes at present between the shell upper end radiating surface on road and the lower end of radiating copper sheet
In W5 or so, partial size is that the diamond dust of W5 or so can effectively be bonded the shell upper end radiating surface and radiating copper of integrated circuit in face
Between the lower end of piece), the heat efficiency that integrated circuit generates acts on aluminum nitride powder, and aluminum nitride powder temperature rise fastly in time passes heat
Bortz powder is passed, and then the bortz powder with big thermal conductivity can effectively transfer heat to radiating copper sheet, bortz powder is used
Amount 20 or so percent, due to bortz powder partial size and cooling fin, integrated circuit shell radiating surface gap close to consistent,
Energy effective, thermal conductivity is at least in 300W/(mK), the thermal coefficient of finished product is thus effectively increased, ensure that in use and collect
It effectively radiates at circuit, improve integrated circuit operation performance and reduces the probability of damage.Based on above-mentioned, so the present invention has
The application prospect having had.
Detailed description of the invention
The present invention is described further below in conjunction with drawings and examples.
Fig. 1 is that invention constitutes block diagram signal.
Specific embodiment
Shown in Fig. 1, a kind of heat-conducting silicone grease, including silicone oil, aluminum nitride powder, also there is diamond dust, dodecyl sulphur
Sour sodium, amino alcohol solvay-type titanate esters, diamond dust grain size specification be W5 and two kinds of W0.25, wherein partial size W5 and W0.25
Ratio is 3:1, and silicon oil dosage is 24 percent, aluminum nitride powder dosage is 50 percent, diamond dust dosage is hundred
/ mono- ten five, lauryl sodium sulfate dosage is 10, the dosage of amino alcohol solvay-type titanate esters is 1 percent, silicon
The diamond dust of oil, aluminum nitride powder and partial size W5 is as base-material, lauryl sodium sulfate, amino alcohol solvay-type titanate esters and grain
The diamond dust of diameter W0.25 reconciles as auxiliary material, above-mentioned each raw material through high temperature.
Shown in Fig. 1, in heat-conducting silicone grease preparation, first silicone oil is poured into the thermostatic container of process equipment, in thermostatic container
After temperature rises to 80 DEG C or so, keep thermostatic container in constant temperature, then respectively successively in thermostatic container be added partial size W5 and
The bortz powder and aluminum nitride powder of W0.25, starts the rabbling mechanism of process equipment, and rabbling mechanism is stirred continuously object in thermostatic container
Material, after ten minutes, after above-mentioned material stirs, stopping is stirred into next process at interval.Bortz powder and nitrogen
After change aluminium powder, silicone oil material stir, lauryl sodium sulfate, amino alcohol solvay-type titanate esters are added in material,
And continue to guarantee the temperature of thermostatic container, the rabbling mechanism of process equipment is opened, rabbling mechanism is stirred continuously silicon in thermostatic container
Oil, aluminum nitride powder, diamond dust, lauryl sodium sulfate, amino alcohol solvay-type titanate esters material, interval after twenty minutes, to
After above-mentioned material stirs, material just obtains finished product after stopping stirring cooling, and the laggard marketing of finished product packing is sold.Processing is set
In standby rabbling mechanism whipping process, agitating shaft stirs the stirring of a period of time according to stirring a period of time clockwise, counterclockwise
Sequence be stirred, fully ensure that stirring after material it is uniform.
Shown in Fig. 1, the present invention is in use, be uniformly applied to finished product shell upper end radiating surface and the heat dissipation of integrated circuit
Between the heat-absorbent surface of piece.The present invention can effectively allow silicone oil and Nano diamond, aluminum nitride powder perfect using lauryl sodium sulfate
The reunion and fusion of a variety of materials can be effectively ensured in fusion, moreover it is possible to prevent it is subsequent in use, aluminum nitride powder, bortz powder etc. from
It is precipitated in silicone oil, performance is more stable.The viscosity of finished product is increased using amino alcohol solvay-type titanate esters, is not only conducive to use
In smearing, also ensure finished product heat absorption after character will not because mobility enhance due to lead to shell upper end of the product from integrated circuit
It is flowed out between radiating surface and the heat-absorbent surface of cooling fin and then heat dissipation performance is caused to be deteriorated.Present invention combination aluminum nitride powder specific heat capacity
It is low, thermal coefficient is big, big feature (the bortz powder thermal coefficient of bortz powder thermal coefficient (thermal coefficient is in 2000W/mK)
Greatly, but specific heat capacity is high, temperature rise is slow, and specific heat capacity is on a 399.84J/(kg DEG C of left side), after smearing, partial size is the diamond of W5 or so
Powder can effectively be bonded between the shell upper end radiating surface of integrated circuit and the lower end of radiating copper sheet (in the prior art, object at present
For the radiator mirror surface that part finely polishes in W5 or so, partial size is that the diamond dust of W5 or so can effectively be bonded the shell of integrated circuit
Between body upper end radiating surface and the lower end of radiating copper sheet), the heat efficiency that integrated circuit generates acts on aluminum nitride powder, aluminium nitride
Powder temperature rise transfers heat to bortz powder in time fastly, and then the bortz powder with big thermal conductivity can be transferred heat to effectively
Radiating copper sheet, bortz powder dosage is 20 or so percent, due to the shell of bortz powder partial size and cooling fin, integrated circuit
Radiating surface gap is close to unanimously, and energy effective, thermal conductivity is at least in 300W/(mK), thus effectively increase the thermally conductive of finished product
Coefficient ensure that integrated circuit effectively radiates in use, improves integrated circuit operation performance and reduces the probability of damage.This
Invention partial size is existing for the diamond dust of W0.25 or so can effectively make between cooling integrated face and heat sink face
Microscopic gaps are filled, and cooling integrated face and heat sink face can more be effectively ensured in conjunction with the bortz powder of partial size W5
Between be sufficiently bonded thermally conductive, reach better heat transfer efficiency, thus effectively increase the thermal coefficient of finished product, ensure that in use
Integrated circuit effectively radiates, and improves integrated circuit operation performance and reduces the probability of damage.
Basic principles and main features and advantages of the present invention of the invention have been shown and described above, for this field skill
For art personnel, it is clear that the present invention is limited to the details of above-mentioned exemplary embodiment, and without departing substantially from spirit or base of the invention
In the case where eigen, the present invention can be realized in other specific forms.It therefore, in all respects, should all be by reality
Apply example and regard exemplary as, and be non-limiting, the scope of the present invention by appended claims rather than above description
It limits, it is intended that including all changes that fall within the meaning and scope of the equivalent elements of the claims in the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (4)
1. a kind of heat-conducting silicone grease, including silicone oil, aluminum nitride powder, it is characterised in that also have diamond dust, dodecyl sulphate
Sodium, amino alcohol solvay-type titanate esters, diamond dust grain size specification are W5 and two kinds of W0.25, wherein the ratio of partial size W5 and W0.25
Example is 3:1, and silicon oil dosage is 24 percent, aluminum nitride powder dosage is 50 percent, diamond dust dosage is percentage
One of 15, lauryl sodium sulfate dosage be 10, the dosage of amino alcohol solvay-type titanate esters is 1 percent, silicon
The diamond dust of oil, aluminum nitride powder and partial size W5 is as base-material, lauryl sodium sulfate, amino alcohol solvay-type titanate esters and grain
The diamond dust of diameter W0.25 reconciles as auxiliary material, above-mentioned each raw material through high temperature.
2. a kind of heat-conducting silicone grease according to claim 1, it is characterised in that in heat-conducting silicone grease preparation, first pour into silicone oil and add
In the thermostatic container of construction equipment, after temperature rises to 80 DEG C or so in thermostatic container, constant temperature in thermostatic container is kept, is then distinguished
The bortz powder and aluminum nitride powder of partial size W5 and W0.25 are successively added in thermostatic container, starts the rabbling mechanism of process equipment,
Rabbling mechanism is stirred continuously material in thermostatic container, and interval after ten minutes, after above-mentioned material stirs, stops stirring
Into next process.
3. a kind of heat-conducting silicone grease according to claim 2, it is characterised in that bortz powder and aluminum nitride powder, silicone oil material fill
Divide after mixing evenly, lauryl sodium sulfate, amino alcohol solvay-type titanate esters are added in material, and continues to guarantee thermostatic container
Temperature, open the rabbling mechanism of process equipment, rabbling mechanism is stirred continuously silicone oil in thermostatic container, aluminum nitride powder, diamond
Powder, lauryl sodium sulfate, amino alcohol solvay-type titanate esters material, interval after twenty minutes, are sufficiently stirred to above-mentioned material
After even, material just obtains finished product after stopping stirring cooling, and the laggard marketing of finished product packing is sold.
4. a kind of heat-conducting silicone grease according to claim 2, it is characterised in that in the rabbling mechanism whipping process of process equipment,
Agitating shaft stirs the stirring sequence of a period of time according to stirring a period of time clockwise, counterclockwise and is stirred, and fully ensures that and stirs
Mix the uniform of rear material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910344545.7A CN110003659A (en) | 2019-04-26 | 2019-04-26 | A kind of heat-conducting silicone grease |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910344545.7A CN110003659A (en) | 2019-04-26 | 2019-04-26 | A kind of heat-conducting silicone grease |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110003659A true CN110003659A (en) | 2019-07-12 |
Family
ID=67174591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910344545.7A Pending CN110003659A (en) | 2019-04-26 | 2019-04-26 | A kind of heat-conducting silicone grease |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110003659A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101104738A (en) * | 2006-07-12 | 2008-01-16 | 信越化学工业株式会社 | Heat conductive silicone grease composition and cured product thereof |
| US20080234421A1 (en) * | 2007-03-23 | 2008-09-25 | Zep Ip Holding Llc | Optically-Enhanced Tire Preparation |
| CN102134474A (en) * | 2010-12-29 | 2011-07-27 | 深圳市优宝惠新材料科技有限公司 | Thermal grease composition |
| CN109206912A (en) * | 2017-07-06 | 2019-01-15 | 河北高富氮化硅材料有限公司 | A kind of insulating heat conductive silicon grease composition |
-
2019
- 2019-04-26 CN CN201910344545.7A patent/CN110003659A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101104738A (en) * | 2006-07-12 | 2008-01-16 | 信越化学工业株式会社 | Heat conductive silicone grease composition and cured product thereof |
| US20080234421A1 (en) * | 2007-03-23 | 2008-09-25 | Zep Ip Holding Llc | Optically-Enhanced Tire Preparation |
| CN102134474A (en) * | 2010-12-29 | 2011-07-27 | 深圳市优宝惠新材料科技有限公司 | Thermal grease composition |
| CN109206912A (en) * | 2017-07-06 | 2019-01-15 | 河北高富氮化硅材料有限公司 | A kind of insulating heat conductive silicon grease composition |
Non-Patent Citations (2)
| Title |
|---|
| 钱逢麟等主编: "《涂料助剂 品种和性能手册》", 30 November 1990, 北京：化学工业出版社 * |
| 顾伟程等主编: "《新编皮肤科用药手册》", 1 March 1997, 北京医科大学 中国协和医科大学联合出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108192576A (en) | A kind of liquid metal thermal interface material and its preparation method and application | |
| US7576428B2 (en) | Melting temperature adjustable metal thermal interface materials and application thereof | |
| JP3290127B2 (en) | Heat conductive silicone rubber composition and heat dissipation sheet comprising the heat conductive silicone rubber composition | |
| CN102634212B (en) | A kind of heat conductive silicone grease composition | |
| US8080499B2 (en) | Nanodiamond thermal grease | |
| CN105754348A (en) | Low-filling high-heat-conductivity organic-inorganic compound | |
| CN108129841A (en) | A kind of liquid metal insulating heat-conduction material and preparation method thereof | |
| CN103756325A (en) | Low-filling-capacity and high-heat-conductivity graphene/silicone grease composite material and preparation method thereof | |
| CN105441034A (en) | Rubber modified phase change heat conduction interface material and preparation method | |
| CN106750819A (en) | A kind of computer radiating heat-conducting cream | |
| JP3891969B2 (en) | Thermally conductive grease | |
| JP2004091743A (en) | Thermal conductive grease | |
| CN113337125A (en) | Polydimethylsiloxane-based liquid metal bridged spherical boron nitride heat-conducting composite material and preparation method and application thereof | |
| CN109206912A (en) | A kind of insulating heat conductive silicon grease composition | |
| CN107739513A (en) | A kind of heat-conducting silicone grease and its processing method and application | |
| CN109852066A (en) | A kind of High thermal-conductive silicone grease and preparation method | |
| CN109735108A (en) | A kind of thermally conductive gel and preparation method thereof of the low fuel-displaced one pack system of high thermal conductivity | |
| CN1982404A (en) | Thermal-interface material and its production | |
| JP3794996B2 (en) | Thermally conductive resin composition and phase change type heat radiation member | |
| CN110003659A (en) | A kind of heat-conducting silicone grease | |
| CN204834603U (en) | High heat conduction graphite sheet | |
| CN108148558A (en) | A kind of thermally conductive gel of graphene-containing and its preparation method and application | |
| CN108728046A (en) | A kind of heat conduction heat accumulation composite material and preparation method, heat conduction heat accumulation radiator | |
| US7381346B2 (en) | Thermal interface material | |
| JP4030399B2 (en) | Self-adhesive phase change heat dissipation member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190712 |
|
| RJ01 | Rejection of invention patent application after publication |