CN109998210A - A kind of semiconductor refrigerating helmet - Google Patents
A kind of semiconductor refrigerating helmet Download PDFInfo
- Publication number
- CN109998210A CN109998210A CN201910367686.0A CN201910367686A CN109998210A CN 109998210 A CN109998210 A CN 109998210A CN 201910367686 A CN201910367686 A CN 201910367686A CN 109998210 A CN109998210 A CN 109998210A
- Authority
- CN
- China
- Prior art keywords
- cold source
- cap shell
- source layer
- layer
- chilling plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- A—HUMAN NECESSITIES
- A42—HEADWEAR
- A42B—HATS; HEAD COVERINGS
- A42B1/00—Hats; Caps; Hoods
- A42B1/04—Soft caps; Hoods
- A42B1/08—Soft caps; Hoods with protection against blows
-
- A—HUMAN NECESSITIES
- A42—HEADWEAR
- A42B—HATS; HEAD COVERINGS
- A42B1/00—Hats; Caps; Hoods
- A42B1/24—Hats; Caps; Hoods with means for attaching articles thereto, e.g. memorandum tablets or mirrors
Abstract
The present invention provides a kind of semiconductor refrigerating helmets, are related to electric system appurtenance technical field, by being additionally provided with one layer of heat insulating coating between cap shell and cold source layer；Semiconductor chilling plate include from it is lower on the refrigerating layer, the heating layer and radiator that set gradually；Semiconductor chilling plate positions the outer side edges for being located at cap shell, and is connect by cold, metal with the cold source of cold source layer；Temperature controller and semiconductor chilling plate are electrically connected；Micropump positions another outer side edges for being located at cap shell, and is connected to cold source layer to realize the cold source Rapid Circulation in cold source layer；Power supply is mounted on the outside of cap shell, and is electrically connected with semiconductor chilling plate and micropump；The heat of cap body exterior conductive is reduced by heat insulating coating, while the heat dissipation surrounded entirely to the head surrounded in cap shell is realized by cold source layer, substantially increases effective heat dissipation area to head, good heat dissipation effect；The heat exchange for accelerating cold source is realized by setting micropump, greatly improves radiating efficiency.
Description
Technical field
The present invention relates to electric system appurtenance technical fields, and in particular to a kind of semiconductor refrigerating helmet.
Background technique
Line maintenance staff is frequently necessary to overhaul the route on coil holder, and general staff can wear peace
Full cap under high temperature environment with the case where the easily causing insobriety and heatstroke generation that wears a safety helmet, therefore exists to body
The hurtful security risk of health, working efficiency can also reduce.Current existing safety cap is generally only used for security protection,
Its own, which not can be carried out, actively cools down, and is unable to satisfy the requirement of wearer under hot conditions, therefore designer designs
A kind of semiconductor refrigerating helmet.
Summary of the invention
The object of the present invention is to provide a kind of semiconductor refrigerating helmet, design rationally, it is compact-sized.
In order to achieve the above object, the present invention is achieved by the following technical programs:
A kind of semiconductor refrigerating helmet, including cap shell, cold source layer, semiconductor chilling plate, temperature controller, micropump and
Power supply；The cold source layer is located at the cap shell inside；One layer of heat insulating coating is additionally provided between the cap shell and cold source layer；Described half
Conductor cooling piece include from it is lower on the refrigerating layer, the heating layer and radiator that set gradually；The semiconductor chilling plate positioning is set
It is connect in an outer side edges of the cap shell, and by cold, metal with the cold source of the cold source layer；The temperature controller and institute
State semiconductor chilling plate electric connection；Micropump positioning is located at another outer side edges of the cap shell, and with the cold source layer
Connection is to realize the cold source Rapid Circulation in the cold source layer；The power supply is mounted on the outside of the cap shell, and is partly led with described
Body cooling piece and micropump are electrically connected.
Further, the cold source layer is set as and the matched one layer of hollow cavity structure of the cap shell inside size, and institute
It states and is equipped with cooling water in cavity body structure.
Further, the power supply is rechargeable battery；Charging interface is additionally provided on the rechargeable battery.
Further, the cap shell inside is additionally provided with hat lining；The hat lining is located on the inside of the cold source layer, and with it is described cold
The setting of active layer spacing.
Further, the cold source layer is cooling water.
Further, the temperature controller is located at the outer side edges of the cap shell.
Further, the micropump uses micro pump.
Compared with prior art, the invention has the benefit that
1, the present invention reduces the heat of cap body exterior conductive by heat insulating coating, while being realized by cold source layer in cap shell
The heat dissipation that the head of encirclement is surrounded entirely substantially increases effective heat dissipation area to head, good heat dissipation effect.
2, the present invention realizes the heat exchange for accelerating cold source by setting micropump, greatly improves radiating efficiency.
Certainly, it implements any of the products of the present invention and does not necessarily require achieving all the advantages described above at the same time.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it is therefore apparent that the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is schematic perspective view of the invention；
Fig. 2 is schematic perspective view of the invention；
Fig. 3 is schematic cross-sectional view of the invention；
Figure label explanation:
1, cap shell；2, cold source layer；3, semiconductor chilling plate；31, refrigerating layer；32, layer is heated；33, radiator；4, temperature control
Device processed；5, micropump；6, power supply；7, hat lining；8, heat insulating coating.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention,
Technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is the present invention one
Divide embodiment, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making
Every other embodiment obtained, shall fall within the protection scope of the present invention under the premise of creative work.
In conjunction with attached drawing 1 to Fig. 3, the present invention is further described:
A kind of semiconductor refrigerating helmet, including it is cap shell 1, cold source layer 2, semiconductor chilling plate 3, temperature controller 4, miniature
Pump 5 and power supply 6；The cold source layer 2 is located at 1 inside of cap shell；One layer of insulation is additionally provided between the cap shell 1 and cold source layer 2
Coating 8；The semiconductor chilling plate 3 include from it is lower on the refrigerating layer 31, the heating layer 32 and radiator 33 that set gradually；It is described
Semiconductor chilling plate 3, which positions, is located at outer side edges of the cap shell 1, and passes through the cold source company of cold of metal and the cold source layer 2
It connects；The temperature controller 4 is electrically connected with the semiconductor chilling plate 3；The positioning of micropump 5 is located at the cap shell 1
Another outer side edges, and be connected to the cold source layer 2 to realize the cold source Rapid Circulation in the cold source layer 2；The power supply 6 is installed
In 1 outside of cap shell, and it is electrically connected with the semiconductor chilling plate 3 and micropump 5.
The present invention reduces the heat of cap body exterior conductive by heat insulating coating 8, while being realized by cold source layer 2 to cap shell 1
The heat dissipation that the head of interior encirclement is surrounded entirely substantially increases effective heat dissipation area to head, good heat dissipation effect；Lead to simultaneously
Setting micropump 5 is crossed to realize the heat exchange for accelerating cold source, greatly improves radiating efficiency.
The cold source layer 2 is set as and the matched one layer of hollow cavity structure of 1 inside dimensions of cap shell, and the cavity knot
Cooling water is equipped in structure.
The power supply 6 is rechargeable battery；Charging interface is additionally provided on the rechargeable battery.
Preferably, the cold source layer 2 and heat insulating coating 8, which are fixed, is located at 1 inside of cap shell；The cavity body structure is silica gel
Material is made；It is realizing the buffering effect for increasing cap body while the heat conduction in cap shell 1, is improving anti-fight energy.
Hat lining 7 is additionally provided on the inside of the cap shell 1, the lower end of the cap shell 1 is additionally provided with chin strap；The hat lining 7 is located at institute
2 inside of cold source layer is stated, and is arranged with 2 spacing of cold source layer；The cap further includes sweatband, lining band and buffer unit.
The cold source layer 2 is cooling water, low in cost, more economical practical.
Model XH-C1208S2 can be used in the semiconductor chilling plate 3, and 40*40*6.0mm specification maximum temperature difference is 89
℃；When the galvanic couple that direct current is connected by two kinds of different semiconductor materials, heat can be absorbed respectively at the both ends of galvanic couple
With releasing heat, the mesh of refrigeration may be implemented.
Preferably, in the polarity for changing DC power supply 6, semiconductor chilling plate 3 can realize the switching of cooling and warming；And it partly leads
The 3 cooling and warming time of body cooling piece quickly, by heating, it can be achieved that heat preservation to head, and empty in the good cold end of hot-side heat dissipation
In the case where load, as soon as being powered less than minute, cooling piece can reach maximum temperature difference.
Preferably, the temperature controller 4 is located at the outer side edges of the cap shell 1；It may be implemented under hot weather, work as cap shell
In 1 when the temperature is excessively high, when and being more than the setting value of temperature controller 4, temperature controller 4 can automatically control semiconductor chilling plate
3 carry out active refrigeration heat dissipation, avoid staff's heatstroke.
Preferably, the micropump 5 uses micro pump；The inlet and outlet of the micro pump 5 with it is described
Cold source layer 2 is connected to, and to realize the flowing for accelerating the cold source in cold source layer, is realized the heat exchange for accelerating cold source, is greatly improved heat dissipation
Efficiency.
Preferably, the heat-insulating material of stratiform can be used in the heat insulating coating 8.
Present apparatus structure is simple, economical and practical, and easy to carry, management, using flexible, design is rationally, compact-sized, is suitble to
It is widely popularized.
Techniques well known is partly belonged to it should be noted that not elaborating in the present invention, or can be directly from market
Upper buying obtains, and those skilled in the art do not need to make the creative labor and can be obtained, and specific connection type is in ability
Have in domain or daily life and be extremely widely applied, and will not be described here in detail.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three
It is a etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements, unless otherwise restricted clearly.For those of ordinary skill in the art
For, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (7)
1. a kind of semiconductor refrigerating helmet, it is characterised in that: including cap shell (1), cold source layer (2), semiconductor chilling plate (3),
Temperature controller (4), micropump (5) and power supply (6)；The cold source layer (2) is located on the inside of the cap shell (1)；The cap shell (1)
One layer of heat insulating coating (8) is additionally provided between cold source layer (2)；The semiconductor chilling plate (3) include from it is lower on set gradually
Refrigerating layer (31), heating layer (32) and radiator (33)；Semiconductor chilling plate (3) positioning is located at the cap shell (1)
One outer side edges, and connect by cold, metal with the cold source of the cold source layer (2)；The temperature controller (4) is partly led with described
Body cooling piece (3) is electrically connected；The micropump (5) positioning is located at another outer side edges of the cap shell (1), and with the cold source
Layer (2) connection is to realize the cold source Rapid Circulation in the cold source layer (2)；The power supply (6) is mounted on the cap shell (1) outside
Side, and be electrically connected with the semiconductor chilling plate (3) and micropump (5).
2. semiconductor refrigerating helmet according to claim 1, it is characterised in that: the cold source layer (2) be set as with it is described
The matched one layer of hollow cavity structure of cap shell (1) inside dimensions, and cooling water is equipped in the cavity body structure.
3. semiconductor refrigerating helmet according to claim 1, it is characterised in that: the power supply (6) is rechargeable battery；Institute
It states and is additionally provided with charging interface on rechargeable battery.
4. semiconductor refrigerating helmet according to claim 1, it is characterised in that: be additionally provided with cap on the inside of the cap shell (1)
It serves as a contrast (7)；The hat lining (7) is located on the inside of the cold source layer (2), and is arranged with cold source layer (2) spacing.
5. semiconductor refrigerating helmet according to claim 1, it is characterised in that: the cold source layer (2) is cooling water.
6. semiconductor refrigerating helmet according to claim 1, it is characterised in that: the temperature controller (4) is located at institute
State the outer side edges of cap shell (1).
7. semiconductor refrigerating helmet according to claim 1, it is characterised in that: the micropump (5) uses Miniature water
Pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910367686.0A CN109998210A (en) | 2019-05-05 | 2019-05-05 | A kind of semiconductor refrigerating helmet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910367686.0A CN109998210A (en) | 2019-05-05 | 2019-05-05 | A kind of semiconductor refrigerating helmet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109998210A true CN109998210A (en) | 2019-07-12 |
Family
ID=67175558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910367686.0A Pending CN109998210A (en) | 2019-05-05 | 2019-05-05 | A kind of semiconductor refrigerating helmet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109998210A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200267571Y1 (en) * | 2001-11-28 | 2002-03-13 | 김진홍 | The cooling helmet for working |
| KR100955025B1 (en) * | 2009-10-29 | 2010-04-27 | 정금량 | A helmet for cooling and heating |
| KR20100060458A (en) * | 2008-11-27 | 2010-06-07 | 탁승호 | Multi-function helmet |
| CN203353757U (en) * | 2013-07-10 | 2013-12-25 | 杭州元城建筑工程有限公司 | Air conditioner type safety helmet structure |
| CN104705885A (en) * | 2015-04-01 | 2015-06-17 | 黄斌 | Temperature adjustable safety helmet |
-
2019
- 2019-05-05 CN CN201910367686.0A patent/CN109998210A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200267571Y1 (en) * | 2001-11-28 | 2002-03-13 | 김진홍 | The cooling helmet for working |
| KR20100060458A (en) * | 2008-11-27 | 2010-06-07 | 탁승호 | Multi-function helmet |
| KR100955025B1 (en) * | 2009-10-29 | 2010-04-27 | 정금량 | A helmet for cooling and heating |
| CN203353757U (en) * | 2013-07-10 | 2013-12-25 | 杭州元城建筑工程有限公司 | Air conditioner type safety helmet structure |
| CN104705885A (en) * | 2015-04-01 | 2015-06-17 | 黄斌 | Temperature adjustable safety helmet |
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