CN219306919U

CN219306919U - Heat dissipation mechanism and laser dehairing instrument

Info

Publication number: CN219306919U
Application number: CN202223079879.2U
Authority: CN
Inventors: 陈永泽; 王淙湜; 李寰宇
Original assignee: Shenzhen Hengtian Weiyan Technology Co ltd
Current assignee: Shenzhen Hengtian Weiyan Technology Co ltd
Priority date: 2022-11-18
Filing date: 2022-11-18
Publication date: 2023-07-07
Anticipated expiration: 2032-11-18

Abstract

The utility model discloses a heat dissipation mechanism and a laser dehairing instrument, wherein the heat dissipation mechanism is suitable for dissipating heat of the laser dehairing instrument, and comprises: the heat dissipation device comprises a heat dissipation fan, a first radiator and a second radiator, wherein the heat dissipation fan is provided with an air outlet; the first radiator is arranged at the air outlet and radiates heat along a first direction; the second radiator is attached to the first radiator and radiates heat along a second direction; wherein the first direction and the second direction are perpendicular to each other. The utility model can simplify the heat radiation mode, has high heat radiation efficiency and reduces the whole volume.

Description

Heat dissipation mechanism and laser dehairing instrument

Technical Field

The utility model relates to the technical field of dehairing instruments, in particular to a heat dissipation mechanism and a laser dehairing instrument.

Background

The laser dehairing technology has the advantages of painless, noninvasive, convenience, quickness, safety, easiness in operation, mild treatment means, permanent treatment effect and the like. Is easy to be accepted by patients, thereby becoming a research hot spot in the laser medical cosmetology field. In the related art, the existing small-sized laser dehairing instrument generally adopts strong pulse laser to dehairing, but when the semiconductor laser is adopted to dehairing, the heat productivity is large, the existing heat dissipation mode has higher cost and low heat dissipation efficiency, so that the whole volume is difficult to control.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems in the related art to some extent. To this end, an object of the present utility model is to propose a heat dissipation mechanism adapted to dissipate heat from a laser epilator, the laser epilator comprising an application device, the heat dissipation mechanism comprising:

a heat radiation fan having an air outlet;

the first radiator is arranged at the air outlet and radiates heat along a first direction;

the second radiator is attached to the first radiator and radiates heat along a second direction; wherein the first direction and the second direction are perpendicular to each other.

Preferably, the refrigerator further comprises a refrigeration assembly, wherein the refrigeration assembly is connected with the second radiator; the laser dehairing instrument is provided with an applying device which is attached to the refrigerating assembly, so that the refrigerating assembly cools the applying device.

Preferably, the refrigerator further comprises a heat conducting pipe, wherein the first end of the heat conducting pipe is fixed with the second radiator, and the second end of the heat conducting pipe is connected with the refrigeration assembly.

Preferably, the refrigeration assembly comprises:

the radiating fin is attached to the second end of the heat conducting pipe;

the semiconductor refrigerating sheet is respectively attached to the radiating fin and the attaching device.

Preferably, the semiconductor refrigeration piece comprises a cold end and a hot end, the hot end is attached to the second refrigeration piece, and the cold end is attached to the attaching device.

Preferably, the heat conduction pipe comprises a flat section and a cylindrical section which are integrally connected, the cylindrical section is fixed with the first radiator, and the flat section is fixed with the radiating fin.

Preferably, the first heat sink includes:

a first fin portion extending in the first direction to construct heat dissipation gaps spaced apart in the second direction;

the first heat conduction part is enclosed outside the first fin part.

Preferably, the second heat sink includes:

a second fin portion extending in the second direction to construct a heat dissipation gap spaced along the first direction;

the second heat conduction part is enclosed outside the second fin part.

Another object of the present utility model is to provide a laser depilating apparatus, which includes the heat dissipation mechanism as described above.

The scheme of the utility model at least comprises the following beneficial effects:

when the laser dehairing instrument is used, the radiating mechanism provided by the utility model can supply air to the first radiator and the second radiator through the radiating fan, so that air flows in the first direction and the second direction through the first radiator and the second radiator, and the first radiator and the second radiator are cooled; preferably, the semiconductor laser in the laser dehairing instrument can be attached to the first radiator, so that heat generated by the semiconductor laser can be conducted to the first radiator for heat dissipation. Therefore, the heat dissipation mode is simpler, the heat dissipation efficiency is high, and the whole volume is reduced.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a heat dissipation mechanism provided in an embodiment of the present utility model;

FIG. 2 is an exploded view of a heat dissipation mechanism provided in an embodiment of the present utility model;

FIG. 3 is an exploded view of a refrigeration assembly and heat pipe provided in an embodiment of the present utility model;

reference numerals illustrate:

10. a heat radiation fan; 20. a first heat sink; 201. a first fin portion; 202. a first heat conduction part; 30. a second heat sink; 301. a second fin portion; 302. a second heat conduction part; 40. a refrigeration assembly; 41. a heat sink; 42. a semiconductor refrigeration sheet; 421. a cold end; 422. a hot end; 50. a heat conduction pipe; 501. a flat section; 502. a cylindrical section.

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below are exemplary and intended to illustrate the present utility model and should not be construed as limiting the utility model, and all other embodiments, based on the embodiments of the present utility model, which may be obtained by persons of ordinary skill in the art without inventive effort, are within the scope of the present utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplify the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The heat dissipation mechanism and the laser depilating apparatus according to the embodiment of the utility model are described in detail below with reference to the accompanying drawings.

Referring to fig. 1 and 2, the heat dissipation mechanism provided by the embodiment of the utility model is suitable for dissipating heat of a laser depilation instrument, the laser depilation instrument comprises an application device, the heat dissipation mechanism comprises a heat dissipation fan 10, a first heat radiator 20 and a second heat radiator 30, and the heat dissipation fan 10 is provided with an air outlet; the first radiator 20 is arranged at the air outlet and radiates heat along the first direction; the second radiator 30 is attached to the first radiator 20 and radiates heat along the second direction; wherein the first direction and the second direction are perpendicular to each other.

The heat dissipation fan 10 may be an axial flow fan, the first direction may be a horizontal direction, the second direction may be a vertical direction, and of course, the first direction may be a vertical direction, and the second direction may be a horizontal direction; the first heat spreader 20 and the second heat spreader 30 may be pure copper; in use, the first radiator 20 and the second radiator 30 are supplied with air by the heat radiation fan 10, so that air flows in the first direction and the second direction through the first radiator 20 and the second radiator 30, and the first radiator 20 and the second radiator 30 are cooled; preferably, the semiconductor laser in the laser dehairing instrument can be attached to the first radiator 20, so that heat generated by the semiconductor laser can be conducted to the first radiator 20 for heat dissipation; therefore, the heat dissipation mode is simpler, the heat dissipation efficiency is high, and the whole volume is reduced.

Referring to fig. 3, the cooling device further comprises a cooling assembly 40, wherein the cooling assembly 40 is connected with the second radiator 30; wherein, the laser dehairing instrument has the applying device and the refrigeration assembly 40 are attached to each other, so that the refrigeration assembly 40 cools the applying device.

In this embodiment, the application device may be sapphire glass, etc., and the application device may be cooled by the refrigeration component 40, so that the application device may generate a cooling effect, and the application effect is better when the application device is applied to skin; and the heat of the refrigeration assembly 40 can also be guided to the second radiator 30 to realize common heat radiation, so that the overall heat radiation effect is better, the cost can be effectively reduced, the heat radiation efficiency is high, and the overall volume can be reduced.

Further, the heat pipe 50 is further included, a first end of the heat pipe 50 is fixed with the second radiator 30, and a second end is connected with the refrigeration assembly 40; the heat conducting tube 50 includes a flat section 501 and a cylindrical section 502 integrally connected, the cylindrical section 502 is fixed to the first heat sink 20, and the flat section 501 is fixed to the heat sink 41.

In this embodiment, when in use, the cooling assembly 40 can cool down the application device, and the heat generated by the cooling assembly 40 can be conducted to the second radiator 30 through the heat conducting tube 50, so that when the cooling fan 10 cools down the first radiator 20 and the second radiator 30, the heat generated by the cooling assembly 40 can be quickly transferred, thereby eliminating the need for designing a heat dissipation structure, reducing the overall volume and lowering the cost.

Preferably, the refrigeration assembly 40 includes a heat sink 41 and a semiconductor refrigeration fin 42, wherein the heat sink 41 is attached to the second end of the heat pipe 50; the semiconductor refrigerating sheets 42 are respectively attached to the radiating sheets 41 and the attaching device; further, the semiconductor refrigeration piece 42 includes a cold end 421 and a hot end 422, the hot end 422 is attached to the semiconductor refrigeration piece 42, and the cold end 421 is attached to the attaching device.

When the semiconductor refrigeration sheet 42 works, mainly after the semiconductor refrigeration sheet 42 is electrified, the temperature of the cold end 421 of the semiconductor refrigeration sheet 42 is reduced, and the temperature of the hot end 422 is increased, so that the cold end 421 of the semiconductor refrigeration sheet 42 can cool the application device in a high temperature difference mode, and the heat of the hot end 422 can be conducted to the second radiator 30 through the heat conducting pipe 50, so that the heat generated by the hot end 422 and the heat generated by the semiconductor laser can be uniformly radiated through the second radiator 30 and the first radiator 20 respectively, the radiating mode is simpler, the whole volume is reduced, and the cost is reduced.

Further, the first heat spreader 20 includes a first fin portion 201 and a first heat conducting portion 202, wherein the first fin portion 201 extends along a first direction to construct a heat dissipation gap spaced along a second direction; the first heat conducting portion 202 surrounds the first fin portion 201. The first fin portions 201 may be plural and spaced apart from each other in the second direction, so as to form a heat dissipation gap, and when the heat dissipation fan 10 blows air, the air flow may enter the second heat sink 30 through the heat dissipation gap, so that the air flow in the horizontal direction is formed to dissipate heat.

Further, the second heat sink 30 includes a second fin portion 301 and a second heat conducting portion 302, the first fin portion 201 extending in the second direction to construct a heat dissipation gap spaced apart in the first direction; the second heat conducting portion 302 is enclosed outside the second fin portion 301. The second fin portions 301 may be plural and are disposed at intervals along the first direction to form corresponding heat dissipation gaps, and when the heat dissipation fan 10 sends air, the air flow may be discharged outwards through the heat dissipation gaps, so that the air flow in the vertical direction is formed to dissipate heat.

The laser dehairing instrument provided by the embodiment of the utility model comprises the heat dissipation mechanism. When the laser dehairing instrument is used, the first radiator 20 and the second radiator 30 can be supplied with air through the cooling fan 10, so that air flows along the first direction and the second direction through the first radiator 20 and the second radiator 30, and the first radiator 20 and the second radiator 30 are cooled; preferably, the semiconductor laser in the laser dehairing instrument can be attached to the first radiator 20, so that heat generated by the semiconductor laser can be conducted to the first radiator 20 for heat dissipation; therefore, the heat dissipation mode is simpler, the heat dissipation efficiency is high, and the whole volume is reduced.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims

1. A heat dissipation mechanism adapted to dissipate heat from a laser epilator, the heat dissipation mechanism comprising:

a heat radiation fan having an air outlet;

2. The heat dissipation mechanism of claim 1, further comprising a refrigeration assembly coupled to the second heat sink; the laser dehairing instrument is provided with an applying device which is attached to the refrigerating assembly, so that the refrigerating assembly cools the applying device.

3. The heat dissipation mechanism of claim 2, further comprising a heat pipe having a first end secured to the second heat sink and a second end connected to the refrigeration assembly.

4. The heat dissipation mechanism of claim 3, wherein the refrigeration assembly comprises:

the radiating fin is attached to the second end of the heat conducting pipe;

5. The heat dissipation mechanism of claim 4 wherein the semiconductor refrigeration sheet comprises a cold end and a hot end, the hot end being in engagement with the semiconductor refrigeration sheet and the cold end being in engagement with the applicator device.

6. The heat dissipating mechanism of claim 4, wherein said heat conducting tube comprises a flat section and a cylindrical section integrally connected, said cylindrical section being secured to said first heat sink, said flat section being secured to said heat sink.

7. The heat dissipation mechanism of claim 2, wherein the first heat sink comprises:

the first heat conduction part is enclosed outside the first fin part.

8. The heat dissipation mechanism of claim 7, wherein the second heat sink comprises:

the second heat conduction part is enclosed outside the second fin part.

9. A laser epilator comprising a heat dissipation mechanism as claimed in any one of claims 1 to 8.