CN109995901A - Electronics module and electronic equipment - Google Patents
Electronics module and electronic equipment Download PDFInfo
- Publication number
- CN109995901A CN109995901A CN201711499556.XA CN201711499556A CN109995901A CN 109995901 A CN109995901 A CN 109995901A CN 201711499556 A CN201711499556 A CN 201711499556A CN 109995901 A CN109995901 A CN 109995901A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- receiver
- shell
- electronics module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
Abstract
The embodiment of the present application provides a kind of electronics module comprising shell and electronic building brick, shell have at least one empty avoiding mouth and the inner cavity that is connected at least one empty avoiding mouth；Electronic building brick includes sensor, flexible circuit board, receiver, flexible circuit board includes the first face and the second face being disposed opposite to each other, sensor is set on the first face of flexible circuit board, and sensor is electrically connected to flexible circuit board, receiver is set on the second face of flexible circuit board, the sound channel of receiver is connected to outside across or past flexible circuit board, and electronic building brick is placed in the inner cavity of shell, and at least one empty avoiding mouth of the sound channel corresponding housing of sensor and receiver.Electronics module provided by the embodiments of the present application by make sensor, flexible circuit board and receiver in stacked saved the X of electronic building brick and electronic equipment to size.In addition, the embodiment of the present application also provides a kind of electronic equipment.
Description
Technical field
This application involves a kind of electronic equipment field more particularly to a kind of electronics module and electronic equipments.
Background technique
With the development increasingly of electronic device technology, the demand to mobile phone is lightening is higher and higher.The prior art, mobile phone etc.
In order to realize more and more functions in electronic equipment, interior of mobile phone integrates more and more devices, the position between each device
The relationship of setting becomes increasingly complex, and with also increasing to the lightening influence of mobile phone, is unfavorable for the design of mobile phone.
Summary of the invention
This application provides a kind of electronics module and electronic equipments.
The embodiment of the present application provides a kind of electronics module, including shell and electronic building brick, and the shell has at least one
A empty avoiding mouth and the inner cavity for being connected at least one empty avoiding mouth；The electronic building brick includes sensor, flexible circuit board, called
Device, the flexible circuit board include the first face and the second face being disposed opposite to each other, and the sensor is set to the flexible circuit board
The first face on, and the sensor is electrically connected to the flexible circuit board, and the receiver is set to the flexible circuit board
The second face on, the sound channel of the receiver is connected to outside, the electronics group across or past the flexible circuit board
Part is placed in the inner cavity of the shell, and the sound channel of the sensor and the receiver corresponds to the shell at least
One empty avoiding mouth.On the other hand, the embodiment of the present application also provides a kind of electronic equipment, including electronics module.
In another aspect, the embodiment of the present application also provides the assembly methods of a kind of electronic equipment, comprising:
Display module is provided, the display module has non-display area, and the non-display area opens up called window；
Center is provided, the center is stacked in the display module, and described in the fixed part face of the center
Non-display area；
Electronics module is provided, the electronics module includes shell and electronic building brick, and the shell has at least one empty avoiding
Mouthful and at least one empty avoiding mouth described in being connected to inner cavity；The electronic building brick includes sensor, flexible circuit board, receiver, institute
Stating flexible circuit board includes the first face and the second face being disposed opposite to each other, and the sensor is set to the first of the flexible circuit board
On face, and the sensor is electrically connected to the flexible circuit board, and the receiver is set to the second of the flexible circuit board
On face, the sound channel of the receiver is connected to outside, the electronic building brick accommodating across or past the flexible circuit board
In the inner cavity of the shell, and the sound channel of the sensor and the receiver corresponds at least one of the shell and keeps away
It eats dishes without rice or wine；
The electronics module is fixed on the fixed part of the center；
Display module is stacked on the center, and makes the fixed part of center described in the non-display area face.
Electronics module provided by the embodiments of the present application and electronic equipment are in by making sensor, flexible circuit board and receiver
Stacked, when the electronic building brick of the structure is set in electronic equipment, sensor, flexible circuit board and receiver are successively along electricity
The Z-direction of sub- equipment stacks, save the X of electronic building brick and electronic equipment to size；In addition, electronics module sets for electronic building brick
It is placed in shell and forms the structure of module, conducive to the assembly of electronics module, improve assembly efficiency.
Detailed description of the invention
In order to illustrate more clearly of the technical solution of the application, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the application, general for this field
For logical technical staff, without any creative labor, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the schematic diagram for a kind of electronic equipment that the embodiment of the present application one provides；
Fig. 2 is the schematic diagram of electronics module shown in FIG. 1；
Fig. 3 is the schematic diagram of the electronic building brick of electronic equipment shown in FIG. 1；
Fig. 4 is a kind of schematic diagram of electronic building brick shown in Fig. 3；
Fig. 5 is cross-sectional view of the electronic building brick shown in Fig. 4 along line A-A；
Fig. 6 is the schematic diagram at another visual angle of electronic building brick shown in Fig. 4；
Fig. 7 is the schematic diagram of another electronic building brick shown in Fig. 3；
Fig. 8 is cross-sectional view of one of the electronic building brick shown in Fig. 7 sealing element along line A-A；
Fig. 9 is cross-sectional view of another sealing element in electronic building brick shown in Fig. 7 along line A-A；
Figure 10 is the schematic diagram of the sensor of electronic building brick shown in Fig. 3 and the relativeness of receiver；
Figure 11 is the schematic diagram of the sensor of the electronic building brick in other embodiments and another relativeness of receiver；
Figure 12 is the schematic diagram of the sensor of the electronic building brick in other embodiments and another relativeness of receiver；
Figure 13 is the schematic diagram in the called hole of electronic building brick shown in Fig. 3 and the relativeness of vibration section；
Figure 14 is the schematic diagram in the called hole of the electronic building brick in other embodiments and another relativeness of vibration section；
Figure 15 is the sensor and the non-schematic diagram arranged side by side of receiver of the electronic building brick in other embodiments；
Figure 16 is the schematic diagram of the display module of electronic equipment shown in FIG. 1；
Figure 17 is the schematic diagram of electronics module shown in FIG. 1 and center；
Figure 18 is the schematic diagram of the center in Figure 17；
Figure 19 is the schematic diagram of the screen assembly of the display module of Figure 16；
Figure 20 is the schematic diagram of another screen assembly of the display module in other embodiments；
Figure 21 is the schematic diagram of another screen assembly of the display module in other embodiments；
Figure 22 is the schematic diagram that the electronic building brick in other embodiments is entirely located in the groove of screen assembly；
Figure 23 is the flow chart of the assembly method of electronic equipment provided by the embodiments of the present application.
Specific embodiment
Below in conjunction with the attached drawing in the application embodiment, the technical solution in the application embodiment is carried out clear
Chu is fully described by.
It is with reference to the accompanying drawing and specific real in order to be more clearly understood that the above objects, features, and advantages of the application
Mode is applied the application is described in detail.It should be noted that in the absence of conflict, presently filed embodiment and reality
The feature applied in mode can be combined with each other.
Many details are explained in the following description in order to fully understand the application, described embodiment
Only a part of embodiment of the application, rather than whole embodiments.Based on the embodiment in the application, this field
Those of ordinary skill's every other embodiment obtained without making creative work belongs to the application guarantor
The range of shield.
In addition, the explanation of following embodiment is referred to the additional illustration, the spy that can be used to implement to illustrate the application
Determine embodiment.The direction term being previously mentioned in the application, for example, " length ", " width ", " thickness " etc., are only with reference to appended drawings
The direction of formula, therefore, the direction term used be in order to it is more preferable, be illustrated more clearly that and understand the application, rather than indicate or
Implying signified device or element must have a particular orientation, is constructed and operated in a specific orientation, therefore should not be understood as
Limitation to the application.Unless otherwise clearly defined and limited, term " installation ", " connected ", " connection " shall be understood in a broad sense,
For example, it may be fixedly connected, it is also possible to detachably connected, or is integrally connected；It can be mechanical connection；It can be
It is connected directly, the connection inside two elements can also be can be indirectly connected through an intermediary.For the common of this field
For technical staff, it can understand that the tool of above-mentioned term in the present invention illustrates body meaning with concrete condition.
Fig. 1 is please referred to, Fig. 1 is the first visual angle schematic diagram of electronic equipment 100.Electronic equipment 100 includes electronics module 10.
Electronics module 10 is contained in the inside of electronic equipment 100, to realize the functions such as called of electronic equipment 100.The electronics is set
Standby 100 can be any equipment for having electronic building brick, such as: tablet computer, mobile phone, camera, personal computer, notebook
The smart machines such as computer, mobile unit, wearable device.Wherein, for ease of description, the first view is in electronic equipment 100
Angle is that reference is defined, and the width direction of electronic equipment 100 is defined as X to the length direction of electronic equipment 100 is defined as Y
To the thickness direction of electronic equipment is defined as Z-direction.
Referring to figure 2., Fig. 2 is the schematic diagram of the electronics module 10 of electronic equipment 100 shown in FIG. 1.Electronics module 10 is wrapped
Include shell 3 and electronic building brick 1.Electronic building brick 1 is set in shell 3, to form modular electronics module 10.Conducive to electronic die
The assembly of group 10.
Referring to figure 2., the shell 3 has that at least one empty avoiding mouth 3a's and at least one empty avoiding mouth 3a described in being connected to is interior
Chamber 3b.Electronic building brick 1 includes sensor 11, flexible circuit board 12 and receiver 13.Sensor 11, flexible circuit board 12 and called
Device 13 be in stacked, when the electronic building brick 1 of the structure is set in electronic equipment 100, sensor 11, flexible circuit board 12 and by
Device 13 is talked about successively to stack along the Z-direction of electronic equipment 100, save the X of electronic building brick 1 and electronic equipment 100 to size.
Referring to figure 2., the electronic building brick 1 is placed in the inner cavity 3b of the shell 3, and the sensor 11 and described
At least one empty avoiding mouth 3a of the corresponding shell 3 of the sound channel 131 of receiver 13.Electronics module 10 is that electronic building brick 1 is set
It is placed in shell 3 and forms the structure of module, conducive to the assembly of electronics module 10, improve assembly efficiency.
It should be understood that referring to figure 2., where the plane and at least one empty avoiding mouth 3a where the sensor 11
Plane it is concordant.I.e. electronic building brick 1 is entirely located in shell 3, is not stretched out from shell 3, and entire electronic die is further reduced
The size of group 10.Certainly, in other embodiments, operative sensor 11 can also stretch out the empty avoiding mouth 3a of shell 3.
Shell 3 can form shell 3 by injection molding or in the external encapsulating of electronic building brick 1.
It should be understood that referring to figure 2., there are two empty avoiding mouth 3a, the empty avoiding mouths of a shell 3 for the tool of shell 3
3a corresponds to the sensor, and the empty avoiding mouth 3a of another shell 3 corresponds to the sound channel 131 of the receiver 13.So
The shell 3 of structure ensure that electronic building brick 1 can be bound more closely with shell 3, more conducively the one of shell 3 and electronic building brick 1
Body.
In a kind of embodiment, referring to figure 2., the electronics module 10 substantially carries out encapsulating encapsulation to electronic building brick 1
It is formed, wherein the part of encapsulating forms shell 3 on the electronic building brick 1, corresponding, encapsulating rings of material is around the portion of electronic building brick 1
Divide the inner wall 3c for forming shell 3, the region that inner wall 3c ring connects is the inner cavity 3b of shell 3.And in order to guarantee 11 He of sensor
The sound channel 131 of receiver 13 can reach on sensor 11 with external interactive media, such as external light, called
The voice signal 131 of device 13 can be transmitted to outside, to electronic building brick 1 carry out encapsulating encapsulation when, avoid sensor 11 and by
Device 13 is talked about, that is, the sound channel 131 that two empty avoiding mouth 3a are respectively aligned to sensor 11 and receiver 13 is formed, to guarantee electronics group
Reliability Work after 1 module of part.Certainly, in other embodiments, the shell 3 has an empty avoiding mouth 3a, the sensing
The empty avoiding mouth 3a of the corresponding shell 3 of the sound channel 131 of device 11 and the receiver 13.Specifically, the ruler of empty avoiding mouth 3a
It is very little larger, it can be understood as two empty avoiding mouth 3a in above-described embodiment get through to form one.The shell 3 of the structure is conducive to electronics
Component 1 is set in the inner cavity 3b of shell 3.The electronics module 10 is conducive to processing, and shell 3 is directly in the external shape of electronic building brick
At without considering the assembly between electronic building brick 1 and shell 3.Certainly, in other embodiments, shell has ontology and cover board,
Ontology is the cuboid with an open end, and cover board opens up two empty avoiding mouth 3a, and cover plate lid is connected on the open end of ontology.It will
Electronic building brick is put into ontology, is then connect cover board opposing body lid, two on cover board empty avoiding mouth 3a is respectively aligned to receiver
Sound channel and sensor, to guarantee the reliability Work after electronic component module.The electronics module of the structure is conducive to electronics
Component is dismounted from shell and is come out.
It should be understood that referring to figure 2., there is the shell 3 first mounting surface 3d, the first mounting surface 3d to open up institute
At least one empty avoiding mouth 3a is stated, the first mounting surface 3d is flat face.Specifically, opening up two empty avoidings on the first mounting surface 3d
Mouth 3a, the first mounting surface 3d are flat face, and when guaranteeing that the first mounting surface 3d is set on center, there is no seams between the two
Gap, conducive to the sealing of the sound channel 131 of electronics module 10.
It should be understood that referring to figure 2., the inner wall 3c of the shell 3 is wrapped on the electronic building brick 1.The present embodiment
In, the circumferential surface of electronic building brick 1 is resisted against on the inner wall 3c of shell 3, i.e. the size and electricity in the region that the inner wall 3c ring of shell 3 connects
The size of sub-component circumferential direction is roughly the same, saves the volume of entire electronics module 10, is conducive to electronics module 10 in electronic equipment
In setting.Certainly, in other embodiments, the part electronic building brick 1 is embedded on the inner wall 3c of the shell 3.Specifically
, the partial portion of the outer peripheral surface of electronic building brick 1 can be inserted in the inner wall 3c of shell 3, so that electronic building brick 1 and 3 knot of shell
Close closer.Wherein, when carrying out encapsulating encapsulation to electronic building brick 1, flow into encapsulating material in the gap of electronic building brick 1,
So that the inner wall 3c of electronic building brick 1 and shell 3 is the relationship of insertion.Wherein, when shell 3 is the structure of ontology and cover board,
Avoiding hollow groove is set on the inner wall 3c of shell 3, the side of flexible circuit board 12 is allowed to be embedded in avoiding hollow groove, so that electronic building brick 1
It is bound more closely with shell 3.
It should be understood that referring to figure 2., the shell 3 also there is limiting section 3e, the limiting section 3e to be convexly equipped in the shell
On the inner wall 3c of body 3, the flexible circuit board 12 and the receiver 13 are located at the bottom wall of the limiting section 3e and the shell 3
Between.Flexible circuit board 12 is limited by limiting section 3e to move outward, is further ensured that the reliability of electronics module 10.
By making sensor 11, flexible circuit board 12 and receiver 13 in stacked, the electronic building brick 1 of the structure is set to
When in electronic equipment 100, sensor 11, flexible circuit board 12 and receiver 13 are successively stacked along the Z-direction of electronic equipment 100,
Save the X of electronic building brick 1 and electronic equipment 100 to size；In addition, electronics module 10 is that electronic building brick 1 is set to shell 3
The middle structure for forming module improves assembly efficiency conducive to the assembly of electronics module 10.
The following are the specific structures of the structure of electronic building brick 1:
In one embodiment, as shown in figure 3, flexible circuit board 12 includes the first face 121 and the second face being disposed opposite to each other
122.For flexible circuit board 12 for being electrically connected with sensor 11, flexible circuit board 12 is electric with the circuit board in electronic equipment 100 again
Connection, by circuit board of the electric signal transmission on sensor 11 into electronic equipment 100.
Please with reference to Fig. 3 and Fig. 4, the first face 121 and the second face 122 in flexible circuit board 12 are respectively flexible circuit
The plate face that plate 12 is disposed opposite to each other, plate face area is larger, can carry component.It is corresponding, the side of the plate face of flexible circuit board 12
Edge be then respectively be disposed opposite to each other first in S1 and second S2, the third that is disposed opposite to each other S4, the third in S3 and the 4th
While S3 and it is described 4th while S4 be connected to described first while S1 and it is described second while S2 between, the second side S2 is towards remote
Direction from the first side S1 extends, so that the flexible circuit board 12 and circuit board electrical connection.That is, flexible circuit board 12 is big
It causes to be in long rectangle.First in S1 and second S2 compared to third the S4 in S3 and the 4th, be flexible circuit board 12 in it is shorter
Side.That is, when flexible circuit board 12 is set in electronic equipment 100, along the substantially elongated arrangement of the Y-direction of electronic equipment 100,
In order to extend and circuit board electrical connection.
In one embodiment, as shown in figure 3, sensor 11 is set on the first face 121 of flexible circuit board 12, and it is described
Sensor 11 is electrically connected to the flexible circuit board 12.
It should be understood that sensor 11 includes at least one of range sensor, light sensor or photoelectric sensor.
In the present embodiment, sensor 11 is light sensor 11.Light sensor 11 is arranged close to the screen of electronic equipment 100, so as to
In the brightness for adjusting the screen of electronic equipment 100 according to the light of 100 local environment of electronic equipment.Light sensor 11 incudes
Medium be light, electronic equipment 100 is simultaneously not required to especially to be drilled or be arranged special structure and comes through light, by electronics group
Sensor 11 in part 1 is set as light sensor 11, stacks together in Z-direction with receiver 13, has advanced optimized electronics and set
Standby 100 structure, conducive to electronic equipment 100 X to direction.
In one embodiment, referring to figure 3., the receiver 13 is set to the second face 122 of the flexible circuit board 12
On.Referring to figure 5. or Fig. 7, the sound channel 131 of the receiver 13 are connected to outer across or past the flexible circuit board 12
Portion, so that the voice signal can be logical through the sound after the receiver 13 converts audio signals into voice signal
Road 131 propagates to outside.
As shown in fig. 6, receiver 13 is substantially in square shape, the intermediate region of receiver 13 is vibration section 132.The vibration section
132 generally with other components or structural member airtight connection to form vibration cavity, by that can incite somebody to action in component or structural member upper opening
Vibration propagation in vibration section 132 comes out.Sound letter in the actually receiver 13 that wherein sound channel 131 of receiver 13 refers to
Number channel propagated, corresponding in structure is vibration section 132 from channel between component or structural member upper opening.Receiver
It after 13 receive audio signal, is vibrated therewith by the vibration cavity of closed formation, voice signal is from the opening on component or structural member
It passes through.
In one embodiment, as shown in Figures 4 to 6, it can be soft for being tightly connected the component of the vibration section 132 of receiver 13
Property circuit board 12, flexible circuit board 12 i.e. as the load-bearing part that sensor 11 and receiver 13 are stacked, and as by
A part that the sound channel 131 of device 13 forms is talked about, reduces the apparatus assembly of electronic building brick 1, saves electronic building brick 1 in electricity
The thickness of the Z of sub- equipment 100, has advanced optimized electronic component.
Referring to figure 5., the flexible circuit board 12 covers and seals the connection receiver 13, the flexible circuit board 12
Called hole 123 is opened up, so that the vibration section 132 of the receiver 13 is between the called hole 123 of the flexible circuit board 12
Channel forms the sound channel 131.
Referring to figure 5., since called hole 123 opens up on flexible circuit board 12, the vibration section 132 of receiver 13 and flexible electrical
Channel between the called hole 123 of road plate 12 forms sound channel 131, therefore the sound channel 131 of receiver 13 passes through flexible electrical
Road plate 12.
Wherein, the area in the second face 122 of flexible circuit board 12 is slightly larger than the area of receiver 13, i.e., not because of flexible circuit
Plate 12 oversized and occupy space excessive in electronic equipment 100, receiver 13 can also be made to be set to flexible circuit board
When on 12 the second face 122, receiver 13 is located at the of flexible circuit board 12 in the region of the orthographic projection on flexible circuit board 12
In two regions occupied by face 122, i.e., flexible circuit board 12 entirely covers receiver 13.Certainly, in other embodiments, soft
Property circuit board 12 size can also be much larger than receiver 13 area.
Wherein, referring to figure 5., be bonded by foam 14 between flexible circuit board 12 and receiver 13, so that receiver
13 are sealed by flexible circuit board 12, conducive to the formation of the sound channel 131 of receiver 13.Specifically, please referring to Fig. 6, steep
Cotton 14 is hollow ring-type, is set between the second face 122 of flexible circuit board 12 and receiver 13, and foam 14 is just enclosed and connect
In the edge of the vibration section of receiver 13 132, after such flexible circuit board 12 is tightly connected with receiver 13, receiver 13
A part that cavity is then the sound channel 131 of receiver 13 is formed between vibration section 132 and flexible circuit board 12, for the ease of
The voice signal of receiver 13 is transferred to outside, called hole 123 is opened up on flexible circuit board 12, which is connected to
To the cavity formed between the vibration section of receiver 13 132 and flexible circuit board 12, to form sound channel 131.Certainly, at it
In its embodiment, flexible circuit board 12 and receiver 13 can also be tightly connected by the various ways such as welding or being glued.
After receiver 13 receives audio signal, the vibration of vibration section 132 of receiver 13 forms voice signal, voice signal
Self-excited oscillation chamber is transferred to called hole 123, is transferred to outside through called hole 123, the called function of receiver 13 can be realized.
In another embodiment, Fig. 7 is please referred to.It can also be close for being tightly connected the component of the vibration section 132 of receiver 13
Sealing 15,15 ', specific structure are as follows: 12 part of flexible circuit board covers and seals the connection receiver 13, the electronics
Component 1 further includes the sealing element 15,15 ' with 12 phase of flexible circuit board splicing, and the sealing element 15,15 ' covers and seals
It is connected to the remaining part of the receiver 13, the sealing element 15,15 ' opens up called hole 123, so that the receiver 13
Vibration section 132 to the channel between the called hole 123 of the sealing element 15,15 ' forms the sound channel 131.
Since called hole 123 is set on sealing element 15,15 ', i.e. the voice signal of receiver 13 be by sealing element 15,
15 ' called hole 123 propagates to outside, i.e. the sound channel 131 of receiver 13 bypasses flexible circuit board 12.
The practicability of the structure of the sealing element 15,15 ' is stronger, and the structure for not depending on flexible circuit board 12 unduly is come to called
Device 13 is carried and is sealed, and the structure of functional unit has been advanced optimized.
Wherein, the size of flexible circuit board 12 is roughly the same with the size of sensor 11, i.e., not because of flexible circuit board 12
It is oversized and occupy space excessive in electronic equipment 100, sensor 11 can also be made preferably to be carried on flexible circuit board
On 12, i.e., flexible circuit board 12 entirely covers flexible circuit board 12.
Wherein, sealing element 15,15 ' is substantially the foam of rectangle.The sealing element 15,15 ' and flexible circuit board 12 splice shape
At size it is roughly the same with the size of receiver 13.Certainly, in other embodiments, sealing element 15,15 ' can also be metal
Or the stiffening plate of the materials such as plastic cement.
After such sealing element 15,15 ' is tightly connected with receiver 13, the vibration section 132 of receiver 13 and flexible circuit board
A part that cavity is then the sound channel 131 of receiver 13 is formed between 12 and the structure that is spliced of sealing element 15,15 ',
For the ease of the voice signal of receiver 13 is transferred to outside, called hole 123 is opened up on sealing element 15,15 ', the called hole
123 are connected to shape between the structure that the vibration section 132 of receiver 13 and flexible circuit board 12 and sealing element 15,15 ' are spliced
At cavity, to form sound channel 131.
Shown in the structure that sealing element 15 and flexible circuit board 12 splice is specific as follows:
It should be understood that please referring to Fig. 8, Fig. 8 is that one of Fig. 7 sealing element 15 is close along cross-sectional view one kind of line A-A
The structure of sealing 15 specifically: the sealing element 15 has sequentially connected first sealing 151 and the second sealing 152, institute
It states the first sealing 151 and is fixedly connected with the flexible circuit board 12, so that the flexible circuit board 12 is sealed through described first
151 part of portion covers and seals the connection receiver 13, second sealing 152 cover and seal connection with it is described called
The remaining part of device 13.
Wherein, vertically connection, the section of sealing element 15 are big for the first sealing 151 of sealing element 15 and the second sealing 152
Cause it is L-shaped, when so that the second sealing 152 being fixedly connected with flexible circuit board 12, the first sealing 151 and flexible circuit board 12
With in one plane.Since sealing element 15 is foam, therefore the sealed connection between flexible circuit board 12 and receiver 13 is direct
It is connected and sealed by the second sealing 152 of sealing element 15, optimizes the structure of electronic building brick 1.
First sealing 151 and the remaining part of receiver 13, to realize receiver 13 by sealing element 15 and flexible circuit
Plate 12 is tightly connected together.First sealing 151 opens up called hole 123.
It should be understood that in other embodiments, please referring to the structure of Fig. 9 another kind sealing element 15 specifically: described close
Sealing 15 is adhered on the side of the flexible circuit board 12, so that the sealing element 15 is spelled with 12 phase of flexible circuit board
It connects.
Wherein, sealing element 15 is straight plate.Sealing element 15 is directly adhered to close to the one side of flexible circuit board 12
On side (third side S3) on flexible circuit board 12.Connection between flexible circuit board 12 and receiver 13 needs that bubble is arranged again
Cotton, and sealing element 15 be foam, then directly with receiver 13 directly it is Nian Jie, realization receiver 13 vibration section 132, with it is soft
Property the structure that is spliced of circuit board 12 and sealing element 15 between form that cavity is then the sound channel 131 of receiver 13 one
Point.
Electronic building brick 1 and electronic equipment 100 provided by the embodiments of the present application are by making sensor 11,12 and of flexible circuit board
Receiver 13 is in stacked, when the electronic building brick 1 of the structure is set in electronic equipment 100, sensor 11, flexible circuit board 12
Successively stacked along the Z-direction of electronic equipment 100 with receiver 13, save the X of electronic building brick 1 and electronic equipment 100 to ruler
It is very little.
Further, Figure 10 is please referred to, the sensor 11 is in the region D1 of the orthographic projection on the flexible circuit board 12
Positioned at the receiver 13 in the region D2 of the orthographic projection on the flexible circuit board 12.Sensor 11 and receiver 13 are in Z
To overlapping, reduce load-bearing part (such as flexible circuit board 12 or the flexible circuit board being carried between sensor 11 and receiver 13
12 splicing constructions being composed with sealing element 15) size save electricity when so that electronic building brick 1 being assemblied in circuit board
Sub-component 1 X to size, advanced optimized the structure of electronic equipment 100.Certainly, in other embodiments, such as Figure 11 institute
Show, sensor 11 can also partly overlap with receiver 13 in the region of the orthographic projection on flexible circuit board 12, i.e., the described sensing
Device 11 is in the region D1 of the orthographic projection on the flexible circuit board 12 and the receiver 13 on the flexible circuit board 12
The region D2 of orthographic projection partly overlaps；Or as shown in figure 12, the sensor 11 is in the orthographic projection on the flexible circuit board 12
Region D1 be located at the receiver 13 and mutually staggered in the region D2 of the orthographic projection on the flexible circuit board 12, etc..
It should be understood that please referring to Figure 10, the sensor 11 is close to the first side S1 of the flexible circuit board 12 and institute
State the junction setting of third side S3.Sensor 11 is set to the corner of flexible circuit board 12, and from flexible circuit board 12 and electricity
Farther out, when so that electronic building brick 1 being set on electronic equipment 100, sensor 11 is close to electronic equipment 100 for the junction of road plate
Top, to reduce the size of the non-display area of electronic equipment 100.
It should be understood that referring to Figure 13, the sound channel 131 and the sensor 11 along the third side S3 extremely
The direction of the 4th side S4 is arranged side by side.
Wherein, as shown in figure 13, the called hole 123 in the region of the orthographic projection on the receiver 13 be located at it is described
Range overlapping on receiver 13 where the vibration section 132 of part.It is last that the i.e. described called hole 123 is directed at the receiver 13
The vibration section 132 divided.The size in i.e. called hole 123 is less than the size of the vibration section 132 of receiver 13.It is corresponding, called hole 123
It is located at the vibration section 132 of receiver 13 in the positive throwing on flexible circuit board 12 in the region D3 of the orthographic projection on flexible circuit board 12
In the region D4 of shadow.It can additionally be covered on called hole 123 and connect sound-guiding structure, guarantee the sound output of receiver 13.It is i.e. called
123 hole of hole is located at the vibration section 132 of receiver 13 in flexible circuit board 12 in the region D3 of the orthographic projection on flexible circuit board 12
Orthographic projection region D4 in.Called hole 123 close to first in S1 and the 4th S4 corner, realize sound channel 131 and pass
Sensor 11 is arranged side by side.Called hole 123 and sensor 11 are side by side, it is possible to reduce to the need of the non-display area of electronic equipment 100
It asks, improves the screen accounting of electronic equipment 100.Certainly, in other embodiments, Figure 14 is please referred to, the size in called hole 123 may be used also
Think the half of the vibration section 132 of receiver 13, alternatively, please refer to Figure 15, the row's setting different from sensor 11 of called hole 123.
Further, Fig. 1, Figure 16 and Figure 17 are please referred to, the electronic equipment 100 further includes display module 2 and center 4,
There is the display module 2 non-display area Z2, the non-display area Z2 to open up called window 21a, the center 4 be stacked in
In the display module 1, and non-display area described in 41 face of fixed part of the center 4, the electronics module 10 are fixed on institute
It states on the fixed part 41 of center 4, and the sound channel 131 of the electronic building brick 1 is connected to the called window 21a.
In one embodiment, Figure 17 and Figure 18 are please referred to, center 4 is mainly the support of the internal component of electronic equipment
Plate.4 face of center opens up fixed part 41, which is substantially groove, is conducive to electronics module 10 in groove, and
Center 4 is also provided with the first hole 42 and the second hole 43 on the bottom wall of groove, when display module 2 is set on center 4, first
Hole 42 and the second hole 43 are located at the non-display area Z2 of face display module 2, and after electronics module 10 is in fixed part 41, by
It talks about 13 corresponding empty avoiding mouth 3a of device and is connected to the first hole 42, the corresponding another empty avoiding mouth 3a of sensor 11 is connected to the second hole 43.
In one embodiment, please with reference to Figure 16 and Figure 19, display module 2 includes stacking gradually 21 He of cover board of connection
Screen assembly 22.3 casing cover of shell of display module 2 and electronic equipment 100 connects to form the closed inner cavity 3b of electronic equipment 100, electricity
Sub-component 1 is contained in the 3b of the inner cavity, and called hole 123 in electronic building brick 1 and sensor 11 are all directed at the non-of display module 2
Viewing area Z2, so that the voice signal in receiver 13 can be transmitted to called window 21a by called hole 123, to use
Family can listen to voice signal by called window 21a, and the alignment of sensor 11 display module 2 can also make sensor 11
External light can be received to work.Wherein, non-display area Z2 is non-for showing electronic image in electronic equipment 100
Region.Electronics module, center 4 and the assembly of display module 2 are as follows: electronics module 10 is embedded at the fixed part 41 of center 4
In；Then display module 2 is stacked on center 4, wherein the first face 121 of flexible circuit board 12 towards screen assembly 22,
So that called hole 123 and sensor 11 are directed at non-display area Z2, so that the voice signal in receiver 13 can pass sequentially through
Called hole 123, empty avoiding mouth 3a, the first hole 42 are transmitted to called window 21a, allow the user to listen to by called window 21a
Voice signal works so that sensor 11 can successively receive external light by empty avoiding mouth 3a, the second hole 43.
Since sensor 11, flexible circuit board 12 and receiver 13 are in stacked, therefore the electronic building brick 1 of the structure is set to
When in electronic equipment 100, sensor 11, flexible circuit board 12 and receiver 13 are successively stacked along the Z-direction of electronic equipment 100,
Save the X of the non-display area Z2 in electronic equipment 100 to size, the size of viewing area Z1 can be increased, improve electricity
Sub- 100 screen accounting of equipment.
In one embodiment, as shown in figure 16, also there is the display module 2 viewing area Z1, the viewing area Z1 to surround
The non-display area Z2.
It should be understood that as shown in figure 19, the display module 2 includes the cover board 21 and screen assembly for stacking gradually connection
22, the screen assembly 22 has two short side S5 being disposed opposite to each other and two long sides S6, two long side S6 being disposed opposite to each other
It is connected between two short side S5, the direction of the short side S5 towards another short side S5, which are recessed, to be formed
Groove 22a, region of the display module 2 within the groove 22a be the non-display area Z2, the display module 2 in
Region other than the groove 22a is the viewing area Z1, and the cover board 21 opens up the called window 21a.
As shown in Fig. 1 and Figure 19, i.e. cover board 21 and the display module 2 of the formation of screen assembly 22 is other than groove 22a
Region is all viewing area Z1.Wherein, groove 22a is opened in the middle position of a short side of screen assembly 22.It is opened up on cover board 21
Called window 21a corresponding with called hole 123.It should be understood that the called window 21a is elongated, size substantially by
2 times for talking about hole 123.The part of the corresponding groove 22a of cover board 21 can form the non-display area Z2 of display module 2 with printed coating.
Since sensor 11, flexible circuit board 12 and receiver 13 are successively stacked along the Z-direction of electronic equipment 100, reduce groove 22a
In the size of X-direction, the size of viewing area Z1 can be increased, improve 100 screen accounting of electronic equipment.Certainly, in other implementations
In example, as shown in figure 20, groove 22a may be located on the other positions such as the corner of screen assembly 22.Certainly, in other embodiments
In, the called window is 3:1 or 4:1 along the proportional region of the length of the short side direction with the called hole.
It should be understood that the electronic building brick 1 is the setting of display module 2 described in 10 face of electronics module, and described called
Device 13 is at least partly directed at the non-display area Z2.
In one embodiment, Fig. 1 and Figure 19 are please referred to, an edge groove 22a of the display module 2 forms non-aobvious
Show area Z2, region of the display module 2 other than the non-display area Z2 is viewing area Z1, the 1 face institute of electronic building brick
The setting of display module 2 is stated, and the receiver 13 is at least partly directed at the non-display area Z2 i.e. receiver 13 in described
The region of at least part of orthographic projection in display module 2 is located in the non-display area Z2.So that 13 part of receiver is aligned
Non-display area Z2 further reduces non-display area Z2 in the size of Y-direction, can increase the size of viewing area Z1, further
Improve 100 screen accounting of electronic equipment.
Further, the sensor 11 is located at described in at least part of orthographic projection region in the display module 2
In non-display area Z2.
It is located at the part-structure of receiver 13 and sensor 11 in groove 22a, and receiver 13 and sensor 11 are remaining
Structure in the range of the range of the orthographic projection in display module 2 is then located at the viewing area Z1 of display module 2, be further reduced
Size of the non-display area Z2 in Y-direction, can increase the size of viewing area Z1, further increase 100 screen accounting of electronic equipment.
Certainly, in other embodiments, referring to figure 2. 2, entire electronic building brick 1 can all be located in groove 22a.
It should be understood that as shown in figure 19, electronic building brick 1 is located at the edge of groove 22a, in favor of groove 22a X to
In continue that other components, such as camera module etc. are arranged.Certainly, in other embodiments, as shown in figure 21, electronic building brick
1 can also be for positioned at the middle position of groove 22a, other components be located at the two sides of electronic building brick 1.
When electronic equipment 100 provided by the embodiments of the present application assembles, sensor 11 is set to flexible circuit board 12 first
On, and be electrically connected with flexible circuit board 12, then receiver 13 and sensor 11 are disposed opposite to each other on flexible circuit board 12
Electronic building brick 1 is formed, the electronic building brick 1 of formation and 3 modularization of shell are installed together；Then electronics module 10 is embedded at
In the fixed part 41 of center 4；Display module 2 is stacked in 123 cover alignment of called hole on center 4, making electronic building brick 1 again
The orthographic projection of the part-structure of called window 21a on plate 21, receiver 13 and sensor 11 is located in groove 22a, and called
Device 13 and the remaining structure of sensor 11 are then located at the viewing area Z1 of display module 2 in the range of the orthographic projection in display module 2
In the range of.
Electronic module and electronic equipment 100 provided by the embodiments of the present application is by making sensor 11,12 and of flexible circuit board
Receiver 13 is in stacked, when the electronic building brick of the structure is set in electronic equipment 100, sensor 11, flexible circuit board 12
Successively stacked along the Z-direction of electronic equipment 100 with receiver 13, save the X of electronic building brick 1 and electronic equipment 100 to ruler
It is very little；In addition, electronics module 10 is that electronic building brick 1 is set to the structure for forming module in shell 3, conducive to the dress of electronics module 10
Match, improves assembly efficiency.
Referring to figure 2. 3, present invention also provides the installation methods of a kind of electronic equipment, comprising:
S101: providing display module 2, and the display module 2 has non-display area Z2, and the non-display area Z2 opens up called
Window 21a；
S103: center 4 is provided, the center 4 is stacked in the display module 2, and the fixed part of the center 4
Non-display area Z2 described in 41 faces；
S105: electronics module 10 is provided；
Specifically, the electronics module 10 includes shell 3 and electronic building brick 1, the shell 3 has at least one empty avoiding mouth
3a and the inner cavity 3b for being connected at least one empty avoiding mouth 3a；The electronic building brick 1 include sensor 11, flexible circuit board 12,
Receiver 13, the flexible circuit board 12 include the first face 12a and the second face 12b being disposed opposite to each other, and the sensor 11 is arranged
In on the first face 12a of the flexible circuit board 12, and the sensor 11 is electrically connected to the flexible circuit board 12, it is described by
Words device 13 is set on the second face 12b of the flexible circuit board 12, the sound channel 131 of the receiver 13 across or past
The flexible circuit board 12 is connected to outside, and the electronic building brick 1 is placed in the inner cavity 3b of the shell 3, and the sensing
At least one empty avoiding mouth 3a of the corresponding shell 3 of the sound channel 131 of device 11 and the receiver 13.
It should be understood that electronic building brick 1 is placed in the shell 3 and obtains electronics module by being molded into shell 3
10.Certainly, in other embodiments, encapsulating encapsulation is carried out to obtain electronics module 10, wherein the electronics group to electronic building brick 1
The part of encapsulating forms shell 3 on part 1.
S107: the electronics module 10 is fixed on the fixed part 41 of the center 4；
S109: display module 2 is stacked on the center 4, and makes center 4 described in the non-display area Z1 face
Fixed part 41.
Wherein, the structure of electronic equipment refers to the specific descriptions in electronic equipment provided by the embodiments of the present application.
During modular electronics module 10 is entirely installed on by the installation method of electronic equipment provided by the embodiments of the present application
On frame 4, then display module is stacked on center 4, since electronics module 10 is an integral structure, when installation only be should be noted
The installation relation of electronics module 10 and center 4, reduces assembly difficulty, improves assembly efficiency.
It is the preferred embodiment of the application above, it is noted that for those skilled in the art,
Under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications are also considered as this Shen
Protection scope please.
Claims (20)
1. a kind of electronics module, which is characterized in that including shell and electronic building brick, the shell have at least one empty avoiding mouth and
It is connected to the inner cavity of at least one empty avoiding mouth；The electronic building brick includes sensor, flexible circuit board, receiver, described soft
Property circuit board includes the first face and the second face being disposed opposite to each other, and the sensor is set to the first face of the flexible circuit board
On, and the sensor is electrically connected to the flexible circuit board, the receiver is set to the second face of the flexible circuit board
On, the sound channel of the receiver is connected to outside across or past the flexible circuit board, and the electronic building brick is placed in
In the inner cavity of the shell, and the sound channel of the sensor and the receiver corresponds at least one empty avoiding of the shell
Mouthful.
2. electronics module according to claim 1, which is characterized in that there are two empty avoiding mouths for the shell tool, described in one
The empty avoiding mouth of shell corresponds to the sensor, and the empty avoiding mouth of another shell corresponds to the sound channel of the receiver.
3. electronics module according to claim 2, which is characterized in that the shell also has limiting section, the limiting section
It is convexly equipped on the inner wall of the shell, the flexible circuit board and the receiver are located at the bottom of the limiting section and the shell
Between wall.
4. according to claim 1 to electronics module described in 3 any one, which is characterized in that the inner wall of the shell is wrapped in
On the electronic building brick.
5. according to claim 1 to electronics module described in 3 any one, which is characterized in that the part electronic building brick is embedded
In on the inner wall of the shell.
6. electronics module according to claim 1, which is characterized in that the shell have the first mounting surface, described first
Mounting surface opens up at least one described empty avoiding mouth, and first mounting surface is flat face.
7. electronics module described in any one according to claim 1, which is characterized in that plane and institute where the sensor
Plane where stating at least one empty avoiding mouth is concordant.
8. electronics module according to claim 1, which is characterized in that the sensor on the flexible circuit board just
The region of projection is located at the receiver in the region of the orthographic projection on the flexible circuit board.
9. electronics module according to claim 1, which is characterized in that the flexible circuit board part covers and seals connection
The receiver, the electronic building brick further include the sealing element mutually spliced with the flexible circuit board, sealing element covering and
It is sealedly attached to the remaining part of the receiver, the sealing element opens up called hole, so that the vibration section of the receiver is extremely
Channel between the called hole of the sealing element forms the sound channel.
10. electronics module according to claim 9, which is characterized in that the sealing element is close with sequentially connected first
Envelope portion and the second sealing, first sealing are fixedly connected with the flexible circuit board, so that the flexible circuit board passes through
First sealing part covers and seals the connection receiver, second sealing cover and seal connection with it is described
The remaining part of receiver.
11. electronics module according to claim 9, which is characterized in that the sealing element is adhered to the flexible circuit board
Side on so that the sealing element mutually splices with the flexible circuit board.
12. electronics module described in 0 or 11 according to claim 1, which is characterized in that the sealing element is foam.
13. electronics module according to claim 1, which is characterized in that the flexible circuit board covers and seals connection institute
State receiver, the flexible circuit board opens up called hole so that the vibration section of the receiver to the flexible circuit board by
Channel between words hole forms the sound channel.
14. a kind of electronic equipment, which is characterized in that including the electronics module as described in claim 1 to 13 any one.
15. electronic equipment according to claim 14, which is characterized in that the electronic equipment further includes display module in
Frame, the display module have non-display area, and the non-display area opens up called window, and the center is stacked in described aobvious
Show in mould group, and non-display area described in the fixed part face of the center, the electronics module is fixed on the fixation of the center
In portion, and the sound channel of the electronic building brick is connected to the called window.
16. electronic equipment according to claim 15, which is characterized in that the display module also has viewing area, described
Viewing area surrounds the non-display area.
17. electronic equipment according to claim 16, which is characterized in that the display module includes stacking gradually connection
Cover board and screen assembly, the screen assembly has two short sides being disposed opposite to each other and two long sides being disposed opposite to each other, described two long
While be connected between two short sides, the direction of the short side towards another short side be recessed to be formed it is recessed
Slot, region of the display module within the groove are the non-display area, and the display module is other than the groove
Region be the viewing area, the cover board opens up the called window.
18. the assembly method of a kind of electronic equipment characterized by comprising
Display module is provided, the display module has non-display area, and the non-display area opens up called window；
Center is provided, the center is stacked in the display module, and non-aobvious described in the fixed part face of the center
Show area；
Electronics module is provided, the electronics module includes shell and electronic building brick, the shell have at least one empty avoiding mouth and
It is connected to the inner cavity of at least one empty avoiding mouth；The electronic building brick includes sensor, flexible circuit board, receiver, described soft
Property circuit board includes the first face and the second face being disposed opposite to each other, and the sensor is set to the first face of the flexible circuit board
On, and the sensor is electrically connected to the flexible circuit board, the receiver is set to the second face of the flexible circuit board
On, the sound channel of the receiver is connected to outside across or past the flexible circuit board, and the electronic building brick is placed in
In the inner cavity of the shell, and the sound channel of the sensor and the receiver corresponds at least one empty avoiding of the shell
Mouthful；
The electronics module is fixed on the fixed part of the center；
Display module is stacked on the center, and makes the fixed part of center described in the non-display area face.
19. the assembly method of electronic equipment according to claim 18, which is characterized in that described to provide the step of electronics module
Suddenly include:
Encapsulating encapsulation is carried out to obtain electronics module to electronic building brick, wherein the part of encapsulating forms shell on the electronic building brick
Body.
20. the assembly method of electronic equipment according to claim 18, which is characterized in that described to provide the step of electronics module
Suddenly include:
By being molded into shell,
Electronic building brick is placed in the shell and obtains electronics module.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711499556.XA CN109995901B (en) | 2017-12-29 | 2017-12-29 | Electronic module and electronic equipment |
| PCT/CN2018/124792 WO2019129191A1 (en) | 2017-12-29 | 2018-12-28 | Electronic module, electronic device, and assembly method for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711499556.XA CN109995901B (en) | 2017-12-29 | 2017-12-29 | Electronic module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109995901A true CN109995901A (en) | 2019-07-09 |
| CN109995901B CN109995901B (en) | 2021-04-16 |
Family
ID=67066671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711499556.XA Active CN109995901B (en) | 2017-12-29 | 2017-12-29 | Electronic module and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109995901B (en) |
| WO (1) | WO2019129191A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111245986A (en) * | 2020-01-19 | 2020-06-05 | 惠州Tcl移动通信有限公司 | Distance sensor assembly and mobile terminal |
| WO2021238416A1 (en) * | 2020-05-28 | 2021-12-02 | 华为技术有限公司 | Electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140078708A1 (en) * | 2012-09-17 | 2014-03-20 | Lg Electronics Inc. | Mobile terminal |
| CN204119279U (en) * | 2014-06-18 | 2015-01-21 | 锤子科技（北京）有限公司 | A kind of mobile terminal |
| CN106940584A (en) * | 2017-03-07 | 2017-07-11 | 广东欧珀移动通信有限公司 | Terminal |
| CN106973132A (en) * | 2017-05-22 | 2017-07-21 | 青岛海信移动通信技术股份有限公司 | Receiver goes out mixer and mobile terminal |
| CN107395812A (en) * | 2017-08-23 | 2017-11-24 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic installation |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208128300U (en) * | 2017-12-29 | 2018-11-20 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic equipment |
-
2017
- 2017-12-29 CN CN201711499556.XA patent/CN109995901B/en active Active
-
2018
- 2018-12-28 WO PCT/CN2018/124792 patent/WO2019129191A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140078708A1 (en) * | 2012-09-17 | 2014-03-20 | Lg Electronics Inc. | Mobile terminal |
| CN204119279U (en) * | 2014-06-18 | 2015-01-21 | 锤子科技（北京）有限公司 | A kind of mobile terminal |
| CN106940584A (en) * | 2017-03-07 | 2017-07-11 | 广东欧珀移动通信有限公司 | Terminal |
| CN106973132A (en) * | 2017-05-22 | 2017-07-21 | 青岛海信移动通信技术股份有限公司 | Receiver goes out mixer and mobile terminal |
| CN107395812A (en) * | 2017-08-23 | 2017-11-24 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic installation |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111245986A (en) * | 2020-01-19 | 2020-06-05 | 惠州Tcl移动通信有限公司 | Distance sensor assembly and mobile terminal |
| WO2021238416A1 (en) * | 2020-05-28 | 2021-12-02 | 华为技术有限公司 | Electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019129191A1 (en) | 2019-07-04 |
| CN109995901B (en) | 2021-04-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208128300U (en) | Electronic building brick and electronic equipment | |
| CN106331965B (en) | Micro-electro-mechanical microphone | |
| CN108254975B (en) | Display screen assembly and electronic equipment | |
| WO2020215941A1 (en) | Terminal device | |
| CN109995903A (en) | Electronic equipment | |
| JP5146286B2 (en) | Device housing and portable terminal device | |
| CN108429831B (en) | Electronic device | |
| CN208094606U (en) | Electronic equipment | |
| KR20190121119A (en) | Conduit of electronic device and the electronic device comprising the same | |
| WO2019128645A1 (en) | Electronic assembly and electronic device | |
| WO2022163993A1 (en) | Electronic device comprising speaker module | |
| CN109995901A (en) | Electronics module and electronic equipment | |
| CN108429826A (en) | Electronic equipment | |
| CN108494919A (en) | Electronic equipment | |
| CN108494903B (en) | Electronic component and electronic equipment | |
| CN108418914A (en) | Electronic building brick and electronic equipment | |
| CN109995902A (en) | Electronic building brick and electronic equipment | |
| CN207782873U (en) | Electronic building brick and electronic equipment | |
| CN108494904A (en) | Electronic building brick and electronic equipment | |
| CN109995912A (en) | Electronic building brick and electronic equipment | |
| CN108418915A (en) | Electronic building brick and electronic equipment | |
| WO2022012615A1 (en) | Loudspeaker assembly and electronic device | |
| CN108418912A (en) | Electronic building brick and electronic equipment | |
| JP2014003540A (en) | Electronic apparatus | |
| WO2019129192A1 (en) | Electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |