CN109989000A - Evaporation coating device and evaporation coating method - Google Patents
Evaporation coating device and evaporation coating method Download PDFInfo
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- CN109989000A CN109989000A CN201811453479.9A CN201811453479A CN109989000A CN 109989000 A CN109989000 A CN 109989000A CN 201811453479 A CN201811453479 A CN 201811453479A CN 109989000 A CN109989000 A CN 109989000A
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- injection nozzle
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Engineering & Computer Science (AREA)
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Abstract
The present invention provides the evaporation coating device for being designed to be formed the evaporation film that film thickness uniformity is high and shade is few and the evaporation coating method using the evaporation coating device.Evaporation coating device of the invention includes: evaporation source, has and is configured to multiple injection nozzles that are linear and spraying evaporation material；And substrate securing part, substrate is fixed into parallel with above-mentioned multiple injection nozzles, above-mentioned multiple injection nozzles include central injection nozzle and a pair of outside injection nozzle, which meets formula below (1) and formula (2).In formula (1) and formula (2), L1It is multiple injection nozzles (mm) at a distance from substrate.L2It is above-mentioned central injection nozzle at a distance from above-mentioned outside injection nozzle (mm).θ is the angle (°) at angle formed by the surface of substrate and the opening face of outside injection nozzle.L1/2L2≤tanθ≤L1/L2···(1)；60°≤θ≤70°···(2).
Description
Technical field
The present invention relates to evaporation coating devices and evaporation coating method.
Background technique
It is deposited sometimes with vacuum vapour deposition etc., the metal electrode wiring of formation display panel, solar battery etc., organic EL
Layer, semiconductor layer, other organic material films, inorganic material film etc..Vapor deposition usually carries out in the following way: by earthenware
Evaporation material in crucible is heated, and evaporation material is made to gasify, and the evaporation material to have gasified is sprayed to substrate surface, makes to be deposited
Material is deposited on the substrate surface.The evaporation material of deposition on the surface of the substrate forms film.In addition, passing through apparatus when vapor deposition
There is the exposure mask covering substrate surface of regulation shape, is capable of forming patterned evaporation film.Carry out such evaporation coating device being deposited
It generally includes: evaporation source, in the internal crucible etc. configured with receiving evaporation material, and there is the evaporation material of injection caburation
Injection nozzle；And substrate securing part, fixed substrate.
Here, in order to carry out vapor deposition corresponding with large substrate, as shown in Figure 4, it may be considered that increase the injection nozzle 31 used
Quantity.Quantity by increasing injection nozzle 31 is also capable of forming the high steaming of film thickness uniformity even for large substrate X
Plated film.In addition, the curve P schematically shown in Fig. 4 is the curve for indicating the vapor deposition amount distribution of each injection nozzle 31.But
Using evaporation coating device 30 with multiple injection nozzles 31, especially in the end of substrate X, from remote position
Injection nozzle 31 spray evaporation material with lesser angle reach substrate surface.As shown in figure 5, in such part,
Evaporation material is easily accessible the part covered by exposure mask Y.In this case, in evaporation film Z, the referred to as layer of shade S
The region for being laminated with thin evaporation material becomes larger.Therefore, in the case where such previous evaporation coating device 30, it is difficult to obtain fine
At film figure.In contrast, by reducing injection nozzle and not configuring the structure of injection nozzle in end can make that material is deposited
Expect that the angle up to substrate surface becomes larger.But in this case, it is difficult to which the high vapor deposition of film thickness uniformity is formed to large substrate
Film.
In this case, for the film thickness uniformity of the evaporation film improved and shade is reduced, proposed with inclined spray
Penetrate the evaporation coating device of nozzle and the evaporation coating method (referring to patent document 1,2) using the evaporation coating device.
Patent document 1: Japanese Patent Laid-Open Publication 2014-77193
Patent document 2: Japanese Patent Laid-Open Publication 2016-125091
But even if in the evaporation coating device with above-mentioned previous inclined injection nozzle and use the vapor deposition side of the evaporation coating device
In method, the film thickness uniformity and shade of the evaporation film fully improved can not be said, large substrate cannot be carried out good
Good vapor deposition.
Summary of the invention
The present invention is the invention made based on above situation, equal the purpose of the present invention is to provide being designed to form film thickness
The evaporation coating device for the evaporation film that even property is high and shade is few and the evaporation coating method for using the evaporation coating device.
In order to solve the problem above-mentioned, the present invention provides a kind of evaporation coating device comprising: evaporation source has and is configured to linearly
And spray multiple injection nozzles of evaporation material；And substrate securing part, substrate is fixed into and is put down with the multiple injection nozzle
Row, the multiple injection nozzle includes: central injection nozzle, has the opening face with the substrate-parallel；And a pair of outside
Injection nozzle is configured to have relative to the central injection nozzle bilateral symmetry towards the inclined opening face in outside, the steaming
Plating appts meet formula below (1) and formula (2):
L1/2L2≤tanθ≤L1/L2···(1)
60°≤θ≤70°···(2)
In the formula (1) and the formula (2), L1It is the multiple when the substrate is fixed on the substrate securing part
Injection nozzle is at a distance from the substrate, L1Unit be mm；L2It is the central injection nozzle and the outside injection nozzle
Distance, L2Unit be mm；θ is the surface and the outside of the substrate when substrate is fixed on the substrate securing part
The angle at angle formed by the opening face of injection nozzle, the unit of θ are °.
Preferably, in the evaporation coating device, also meet formula (1 '):
L1/(L2+87)≤tanθ≤L1/L2···(1’)。
Preferably, the multiple injection nozzle is sprayed by three of the central injection nozzle and the pair of outside injection nozzle
Penetrate nozzle composition.
In order to solve the problem above-mentioned, the present invention also provides a kind of evaporation coating methods comprising is steamed using the evaporation coating device
The process of plating.
According to the present invention, it is capable of providing the evaporation coating device for being designed to be formed the evaporation film that film thickness uniformity is high and shade is few and makes
With the evaporation coating method of the evaporation coating device.
Detailed description of the invention
Fig. 1 is the schematic diagram for indicating the evaporation coating device of one embodiment of the present invention.
Fig. 2 is the explanatory diagram of the evaporation coating device of Fig. 1.
Fig. 3 is the figure for indicating the measurement result of embodiment and comparative example.
Fig. 4 is the schematic diagram for indicating an example of previous evaporation coating device.
Fig. 5 is the schematic diagram for indicating the state using the evaporation film in the case of previous evaporation coating device.
Description of symbols
10 evaporation coating devices
11 evaporation sources
12 substrate securing parts
13 injection nozzles
13a central injection nozzle
Injection nozzle on the outside of 13b, 13c
14 evaporation material reception rooms
15 diffuser casings
The upper surface of 15A diffuser casing
16 (16a, 16b, 16c) opening face
The axis of 17a central injection nozzle
The axis of the front end portion of each outside injection nozzle of 17b, 17c
X substrate
Y exposure mask
Z evaporation film
M connects the straight line at the center in each opening face of multiple injection nozzles
N intersection point
P indicates the curve of the vapor deposition amount distribution of injection nozzle
The relative position (center of substrate surface) at the center in the opening face of the central injection nozzle of Q substrate surface
The relative position for opening aperture centre of the outside injection nozzle in the left side of R substrate surface
S shade
L1Multiple injection nozzles are at a distance from substrate
L2Central injection nozzle is at a distance from the injection nozzle of outside
The angle at angle formed by the surface of θ substrate and the opening face of outside injection nozzle
Specific embodiment
In the following, suitably the evaporation coating device and evaporation coating method of one embodiment of the present invention are described in detail referring to attached drawing.
<evaporation coating device>
The evaporation coating device 10 of Fig. 1 includes evaporation source 11 and substrate securing part 12.In addition, the configuration of evaporation coating device 10 is keeping appropriate
In the vacuum chamber (not shown) of vacuum degree.It may include: vacuum pump in vacuum chamber, the indoor gas of vacuum be discharged and is made true
Empty indoor pressure decline；Ventilating part injects certain gas into vacuum chamber and increase the indoor pressure of vacuum；Deng
Deng.
Evaporation source 11 has multiple injection nozzles 13 (13a~13c) of the evaporation material of injection caburation.The receiving of evaporation source 11 is solid
The evaporation material of body shape makes evaporation material gasify, from the evaporation material of multiple 13 injection caburations of injection nozzle by heating.It steams
Plating source 11 for example can be the structure of evaporation material reception room 14 and the connection setting of diffuser casing 15.In the upper surface of diffuser casing 15
15A is configured with multiple injection nozzles 13.
It is configured with crucible (not shown) in evaporation material reception room 14, the evaporation material of solid-like is stored in the crucible.Earthenware
The evaporation material of gasification in crucible is from evaporation material reception room 14 to diffuser casing 15 mobile.Consider gasification efficiency, it can be in earthenware
Granular heat transfer medium is stored together with evaporation material in crucible, the thermally and chemically property stabilization and thermal conductivity of the granular heat transfer medium
Rate is higher than the thermal conductivity of evaporation material, or can store composite material in crucible, which is situated between by granular heat transfer
Matter and the evaporation material for covering the heat transfer medium are constituted.In addition, configured with the heater as heating element around crucible
Deng (not shown).The evaporation material in crucible is heated by heating element, evaporation material is made to gasify.
In addition, being made up of in evaporation source 11 heating element and the valve etc. being arranged on the runner of evaporation material (not shown)
For the burst size that can control evaporation material.
Substrate X is fixed on the direction parallel with multiple injection nozzles 13 by substrate securing part 12.That is, substrate securing part 12 with
The opposite mode fixed substrate X of multiple injection nozzles 13.Substrate securing part 12 is with detachable mode fixed substrate X.Substrate is solid
Determining portion 12 can also fixed substrate X in a movable manner.Substrate securing part 12 can be had with known evaporation coating device
Standby substrate securing part is identical.In addition, on substrate X, in the face (under in Fig. 1 of the side opposite with multiple injection nozzles 13
Surface) on be provided with the vapor deposition of the pattern with regulation shape with exposure mask (not shown).
Substrate X is parallel with multiple injection nozzles 13 can to refer to substrate X and the face 15A (diffusion configured with multiple injection nozzles 13
The upper surface 15A of room 15) parallel state, or can refer to substrate X and each opening face for connecting multiple injection nozzles 13
The parallel state of the straight line (the straight line M in Fig. 1) at the center of (16a~16c).
Evaporation source 11 and substrate X can be deposited when mutually relatively moving.For example, in the case where substrate X has been fixed,
The normal direction that evaporation source 11 is configured to the paper along Fig. 1 moves.In addition, in the case where evaporation source 11 has been fixed, substrate X
The normal direction for being configured to the paper along Fig. 1 moves.
Multiple injection nozzles 13 are configured to linear (configuration is on straight line).That is, from the upper surface 15A of substrate X and diffuser casing 15
Normal direction observation when, multiple injection nozzles 13 are located on straight line.Multiple injection nozzles 13 by respectively upward in a manner of be arranged
On the upper surface 15A of diffuser casing 15.Multiple injection nozzles 13 include central injection nozzle 13a and a pair of outside injection nozzle
Three injection nozzles of 13b, 13c.
Central injection nozzle 13a has the opening face 16a parallel with the upper surface 15A of substrate X and diffuser casing 15.Central injection spray
Mouth 13a has cylindrical shape, and the upper surface 15A relative to diffuser casing 15 is vertically uprightly arranged.
Opening face 16a has circular shape.Opening face 16a is formed as vertical with the axis 17a of central injection nozzle 13a.
A pair of outside injection nozzle 13b, 13c are configured to relative to central injection nozzle 13a bilateral symmetry.Each outside injection nozzle
Opening face 16b, 16c of 13b, 13c are respectively facing outside inclination.The opening for the outside injection nozzle 13b configured in Fig. 1 on right side
Face 16b is tilted in a manner of towards right side.On the other hand, the opening face for the outside injection nozzle 13c configured in Fig. 1 in left side
16c is tilted in a manner of towards left side.Each outside injection nozzle 13b, 13c have the midway bending of cylindrical shape, side view sight
It is shape generally L-shaped when examining.But it is sprayed for example, it is also possible to which the nozzle of cylindrical shape is obliquely arranged and is sprayed as outside
Mouth 13b, 13c.
Opening face 16b, 16c of outside injection nozzle 13b, 13c have circular shape.Opening face 16b, 16c are formed as and outside
Axis 17b, 17c of the front end portion (outlet side part) of injection nozzle 13b, 13c are respectively perpendicular.In addition, each injection nozzle 13
The center of opening face 16a, 16b, 16c are located on straight line M.
There is no particular limitation for the size of each opening face 16a~16c, it is preferred that each outside injection nozzle 13b, 13c
The area (opening area) of opening face 16b, 16c are bigger than the area (opening area) of the opening face 13a of central injection nozzle 13a.
Moreover it is preferred that the area (opening area) of opening face 16b, 16c of two outsides injection nozzle 13b, 13c are identical.Each
In the case that the size of opening face 16a~16c is such relationship, the uniformity for the evaporation film that can be further increased.
In the evaporation coating device 10, meet formula below (1) and formula (2).
L1/2L2≤tanθ≤L1/L2···(1)
60°≤θ≤70°···(2)
Above-mentioned L1It is multiple injection nozzles 13 when substrate X is fixed on substrate securing part 12 at a distance from substrate X (mm).Specifically
It says, is the vapor deposition face of the straight line M and substrate X at the center of opening face 16a~16c of each injection nozzle 13 of connection (on the downside of in Fig. 1
The distance between face).In addition, straight line M is parallel with vapor deposition face.
Above-mentioned L2It is central injection nozzle 13a at a distance from outside injection nozzle 13b, 13c (mm).Specifically, being central spray
It penetrates at a distance from the center of the opening face 16a of nozzle 13a and the center of opening face 16b, 16c of each outside injection nozzle 13b, 13c.
Above-mentioned θ be substrate X when substrate X is fixed on substrate securing part 12 surface (vapor deposition face) and outside injection nozzle 13b,
The angle (°) at angle formed by opening face 16b, 16c of 13c.
Here, firstly, being illustrated to the meaning of formula (1).In each injection nozzle 13, evaporation material mainly to opening face
16 (16a~16c) vertical direction (axial direction of injection nozzle 13) radiation, compared with the positive side in opening face 16 substantially forward
Side's injection.Therefore, by tilting opening face 16b, 16c of outside injection nozzle 13b, 13c outward, on the outside on a large scale
Form the vapor deposition region of these outsides injection nozzle 13b, 13c.Specifically, configuring the outside injection nozzle on right side in Fig. 1
The vapor deposition region of 13b is than by the friendship of the extended straight line of opening face 16b of outside injection nozzle 13b and the vapor deposition face of substrate X
The region of point N more on the right side.In addition, outside injection nozzle 13b to the vapor deposition amount of substrate X is schematically shown with curve P
Distribution.
In the evaporation coating device 10, it is important that make the position of above-mentioned intersection point N be located on the vapor deposition face of substrate X from point Q (substrate
The center on the surface X) between point R, point Q is the relative position at the center of the opening face 16a of central injection nozzle 13a, and point R is left
The relative position at the center of the opening face 16c of the outside injection nozzle 13c of side.In addition, the distance of point Q and point R is L2。
Here, Fig. 2 is for illustrating above-mentioned L1、L2, θ, intersection point N, point Q and point R relationship explanatory diagram.As shown in Fig. 2, intersection point
N becomes tan θ=L when on point Q1/L2Relationship.In addition, intersection point N becomes tan θ=L when on point R1/2L2Relationship.
That is, meeting above-mentioned formula (1) when intersection point N is between point Q and point R.
When tan θ is greater than L1/L2That is, intersection point N compared with point Q be located at right side when, it is meant that the opening face of outside injection nozzle 13b
16b relatively (right side) over-tilting outward.In this case, the vapor deposition region of outside injection nozzle 13b is outward
(right side) excessive enlargement, film uniformity reduce.
On the other hand, when tan θ is less than L1/2L2That is, intersection point N compared with point R be located at left side when, from outside injection nozzle 13b spray
The evaporation material penetrated is easy to reach the surface substrate X with small angle.Specifically, the outside injection nozzle in Fig. 1, from right side
The evaporation material of 13b injection is accessible near the left end on the surface substrate X.Outside injection nozzle 13b's from right side
When evaporation material is reached near the left end on the surface substrate X, evaporation material is with small angle reaches the surface of substrate X and makes yin
Shadow becomes larger.In addition, when tan θ is less than L1/2L2When, the vapor deposition region transitions of outside injection nozzle 13b are biased to inside, and region is deposited
Narrow, cannot fully correspond to large substrate.In addition, from the viewpoint of making shade become smaller and vapor deposition region is made to become larger, preferably
, tan θ is L1/1.5L2More than.
In addition, the outside injection nozzle 13b based on right side, is illustrated above-mentioned formula (1), but the outside injection of left and right
Nozzle 13b, 13c are relative to central injection nozzle 13a bilateral symmetry.Therefore, even for the outside injection nozzle 13c in left side,
Also because same reason meets above-mentioned formula (1).
In addition, about above-mentioned formula (2), when θ is greater than 70 °, it is meant that the opening face 16b of outside injection nozzle 13b, 13c,
16c over-tilting outward.In this case, the vapor deposition region of outside injection nozzle 13b, 13c excessive enlargement outward,
Film uniformity reduces.
On the other hand, when θ is less than 60 °, the evaporation material sprayed from outside injection nozzle 13b, 13c is well over substrate X table
The center Q in face is simultaneously reached near the end of opposite side.In this case, which is reached with small angle due to evaporation material
Near portion, so shade becomes larger.In addition, when θ is less than 60 °, in the vapor deposition region transitions deviation of outside injection nozzle 13b, 13c
Side, vapor deposition region narrow, and cannot fully correspond to large substrate.
For the above reasons, it is equal to be capable of forming film thickness by meeting above-mentioned formula (1) and formula (2) according to the evaporation coating device 10
The evaporation film that even property is high and shade is few.Therefore, according to the evaporation coating device 10, good vapor deposition can be carried out to large substrate X.Separately
Outside, in above-mentioned formula (1), other than the adjustment of the angle, θ in opening face, by adjusting distance L1With distance L2, also can be at
For the relationship for meeting above-mentioned formula (1).
As specific size, as above-mentioned L1Lower limit, there is no particular limitation, but for example can be 100mm, 200mm,
300mm, 400mm, 500mm, 600mm, 700mm etc..By making above-mentioned L1Lower limit arrive such as 400mm or more greatly, can make to steam
Plating region sufficiently becomes larger, it is further possible to which shade is made sufficiently to become smaller.On the other hand, above-mentioned L1The upper limit also do not limit particularly
Determine, such as preferably 2000mm, more preferably 1000mm are also possible to 800mm.By making above-mentioned L1The above-mentioned upper limit with
Under, it can be improved the utilization efficiency of evaporation material.
As above-mentioned L2Lower limit, there is no particular limitation, such as can be 10mm or 40mm, preferably 150mm.Another party
Face, above-mentioned L2The upper limit also there is no particular limitation, such as can be 500mm, preferably 400mm, more preferably
300mm。
Specifically, for example in above-mentioned L1And L2Under the case where being above-mentioned numerical value etc., preferably meet following formula (1 ').
L1/(L2+87)≤tanθ≤L1/L2···(1’)
In the case where the evaporation coating device 10 meets above-mentioned formula (1 '), it is capable of forming the vapor deposition that film thickness uniformity is high and shade is few
Film further improves the effect that good vapor deposition can be carried out to large substrate X.
<evaporation coating method>
The evaporation coating method of one embodiment of the present invention includes the process being deposited using the evaporation coating device 10.
Other than using the evaporation coating device 10, the evaporation coating method can in a manner of same as known evaporation coating method into
Row.In addition, can be used can adjust substrate X and multiple injection nozzle distance L in the evaporation coating method1, central injection spray
Mouth and outside injection nozzle distance L2And the device of the angle, θ in the opening face of outside injection nozzle, on being adjusted to satisfaction
It states formula (1) and formula (2) is deposited later.
According to the evaporation coating method, it is capable of forming the evaporation film that film thickness uniformity is high and shade is few.Therefore, according to the evaporation coating method,
Even for large substrate X, it is also able to carry out good vapor deposition.According to the evaporation coating method, such as more than width 900mm, more
Specifically in the range of 925mm, it is capable of forming the evaporation film that film thickness uniformity is high and shade is few.By the evaporation coating device and
The amplitude of fluctuation of the film thickness for the evaporation film that the evaporation coating method obtains is for example within ± 5%, further within ± 3%, more into
One step is within ± 1%.
<other embodiment>
The present invention is not limited to above embodiment, can change its structure in the range of not changing present inventive concept.Example
Such as, in the above-described embodiment, multiple injection nozzles are by the total of a central injection nozzle and a pair of outside injection nozzle
The structure that three injection nozzles are constituted, but also can have more than four injection nozzles.However, it is possible to as above-mentioned embodiment party
Formula is such, is reduced as far as the quantity of injection nozzle, by being set as three injection nozzles, can more fully reduce yin
Shadow.Therefore, above-mentioned multiple injection nozzles are preferably three by above-mentioned central injection nozzle and above-mentioned a pair of outside injection nozzle
A injection nozzle is constituted.
[embodiment]
Hereinafter, enumerating embodiment and comparative example, more specifically the contents of the present invention are illustrated.In addition, the present invention and unlimited
Due to embodiment below.
<embodiment 1>
Using the evaporation coating device with the structure illustrated in Fig. 1, vacuum evaporation has been carried out to the substrate of width 925mm.In addition, θ
=65 ° of (tan65 ° of ≈ 2.14), L1=500mm, L2=190mm.
<comparative example 1>
Other than θ=50 ° for making evaporation coating device, vacuum evaporation has been carried out in a manner of similarly to Example 1.
<comparative example 2>
Other than θ=80 ° for making evaporation coating device, vacuum evaporation has been carried out in a manner of similarly to Example 1.
[evaluation]
Using spectroscopic ellipsometers (" the UVISEL M200-VIS-AG-200S " of Ku Chang Co., Ltd.), the vapor deposition measured
The film thickness of film.The figure for schematically showing measurement result is as shown in Figure 3.
As shown in figure 3, the angle, θ in the opening face of outside injection nozzle is narrow less than the vapor deposition region of 60 ° of comparative example 1, it cannot be right
Large substrate is adequately deposited.In addition, becoming larger in end shade.The angle, θ in the opening face of outside injection nozzle is greater than 70 °
The difference of film thickness of comparative example 2 become larger.On the other hand, in embodiment 1, it is capable of forming that film thickness uniformity is high and area is big
Evaporation film.The amplitude of fluctuation of the film thickness of the evaporation film obtained by embodiment 1 has the uniformity within ± 3%.In addition, shade
Also sufficiently small.
Industrial applicibility
Evaporation coating device and evaporation coating method of the invention can be suitable for display panel, solar battery etc. metal electrode wiring,
The film forming of semiconductor layer, organic EL layer, other organic material films, inorganic material film etc..
Claims (4)
1. a kind of evaporation coating device, which is characterized in that
The evaporation coating device includes:
Evaporation source has and is configured to multiple injection nozzles that are linear and spraying evaporation material；And
Substrate securing part, substrate is fixed into it is parallel with the multiple injection nozzle,
The multiple injection nozzle includes:
Central injection nozzle has the opening face with the substrate-parallel；And
A pair of outside injection nozzle is configured to have inclined towards outside relative to the central injection nozzle bilateral symmetry
Opening face,
The evaporation coating device meets formula below (1) and formula (2):
L1/2L2≤tanθ≤L1/L2···(1)
60°≤θ≤70°···(2)
In the formula (1) and the formula (2), L1It is the multiple when the substrate is fixed on the substrate securing part
Injection nozzle is at a distance from the substrate, L1Unit be mm；L2It is the central injection nozzle and the outside injection nozzle
Distance, L2Unit be mm；θ is the surface and the outside of the substrate when substrate is fixed on the substrate securing part
The angle at angle formed by the opening face of injection nozzle, the unit of θ are °.
2. evaporation coating device according to claim 1, which is characterized in that the evaporation coating device also meets formula (1 '):
L1/(L2+87)≤tanθ≤L1/L2···(1’)
3. evaporation coating device according to claim 1 or 2, which is characterized in that the multiple injection nozzle is sprayed by the center
Three injection nozzles for penetrating nozzle and the pair of outside injection nozzle are constituted.
4. a kind of evaporation coating method, which is characterized in that including using claim 1, claim 2 or steaming as claimed in claim 3
The process that plating appts are deposited.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017234376A JP6931599B2 (en) | 2017-12-06 | 2017-12-06 | Thin-film deposition equipment and thin-film deposition method |
| JP2017-234376 | 2017-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109989000A true CN109989000A (en) | 2019-07-09 |
Family
ID=66846752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811453479.9A Pending CN109989000A (en) | 2017-12-06 | 2018-11-30 | Evaporation coating device and evaporation coating method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6931599B2 (en) |
| KR (1) | KR20190067103A (en) |
| CN (1) | CN109989000A (en) |
| TW (1) | TW201925504A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110592538A (en) * | 2019-09-26 | 2019-12-20 | 京东方科技集团股份有限公司 | Evaporation device, evaporation source and nozzle |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20240069268A (en) * | 2022-11-11 | 2024-05-20 | 주식회사 야스 | Deposition system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR102046440B1 (en) * | 2012-10-09 | 2019-11-20 | 삼성디스플레이 주식회사 | Depositing apparatus and method for manufacturing organic light emitting diode display using the same |
| JP6529257B2 (en) * | 2014-12-26 | 2019-06-12 | キヤノントッキ株式会社 | Vacuum evaporation system |
| KR20170038288A (en) * | 2015-09-30 | 2017-04-07 | 진중 김 | Evaporation source of mixed organic gases |
-
2017
- 2017-12-06 JP JP2017234376A patent/JP6931599B2/en active Active
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- 2018-11-30 CN CN201811453479.9A patent/CN109989000A/en active Pending
- 2018-12-05 KR KR1020180154963A patent/KR20190067103A/en unknown
- 2018-12-05 TW TW107143552A patent/TW201925504A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110592538A (en) * | 2019-09-26 | 2019-12-20 | 京东方科技集团股份有限公司 | Evaporation device, evaporation source and nozzle |
| CN110592538B (en) * | 2019-09-26 | 2021-12-24 | 京东方科技集团股份有限公司 | Evaporation device, evaporation source and nozzle |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190067103A (en) | 2019-06-14 |
| TW201925504A (en) | 2019-07-01 |
| JP2019099887A (en) | 2019-06-24 |
| JP6931599B2 (en) | 2021-09-08 |
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Application publication date: 20190709 |