CN109983355A - Magnet sensor arrangement - Google Patents
Magnet sensor arrangement Download PDFInfo
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- CN109983355A CN109983355A CN201780070376.1A CN201780070376A CN109983355A CN 109983355 A CN109983355 A CN 109983355A CN 201780070376 A CN201780070376 A CN 201780070376A CN 109983355 A CN109983355 A CN 109983355A
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- shell
- magneto
- effect element
- resistance effect
- magnet
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/16—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying resistance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/007—Environmental aspects, e.g. temperature variations, radiation, stray fields
- G01R33/0076—Protection, e.g. with housings against stray fields
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/091—Constructional adaptation of the sensor to specific applications
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
- G07D11/00—Devices accepting coins; Devices accepting, dispensing, sorting or counting valuable papers
- G07D11/20—Controlling or monitoring the operation of devices; Data handling
- G07D11/22—Means for sensing or detection
- G07D11/235—Means for sensing or detection for monitoring or indicating operating conditions; for detecting malfunctions
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
- G07D7/00—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
- G07D7/04—Testing magnetic properties of the materials thereof, e.g. by detection of magnetic imprint
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Measuring Magnetic Variables (AREA)
- Inspection Of Paper Currency And Valuable Securities (AREA)
- Geophysics And Detection Of Objects (AREA)
Abstract
Magnet sensor arrangement includes: the magnet (4) that magnetic field is formed in the transmitting path of test object object (21)；The magneto-resistance effect element (2) that the variation in magnetic field is exported as the variation of resistance value；The shell (6) that permanent magnet (4) and magneto-resistance effect element (2) are stored or kept；Cover magneto-resistance effect element (2), formed along transmitting path face, that is, transmission path surface (1b) cover board (1)；And signal amplification substrate (9) amplified IC (8) with the signal for being configured at the cross facet to intersect with transmission path surface, and the variation of resistance value corresponding with the variation in magnetic field generated by test object object (21) transmitted on transmission path surface (1b), by magneto-resistance effect element (2) output is amplified using signal amplification IC (8).
Description
Technical field
The present invention relates to the magnet sensor arrangements that the magnetic pattern to paper sheet mediums such as bank note is detected.
Background technique
In existing magnet sensor arrangement, the face of the transport path side of magnet is equipped with magneto-resistance effect element and signal amplification
IC, and it is accommodated in shell.In order to protect magneto-resistance effect element and signal to amplify IC, covering magneto-resistance effect element and signal are amplified
The cover board of IC is set to the transport path side of shell.That is, for example, as shown in Patent Document 1, being configured between cover board and magnet
Magneto-resistance effect element and signal amplify IC.
Existing technical literature
Patent document
Patent document 1: International Patent Publication the 2015/194605th
Summary of the invention
The technical problems to be solved by the invention
In existing magnet sensor arrangement, in order to transmit bank note, in the opposite of the transmitting path for clipping magnet sensor arrangement
Roller is used configured with bank note transmission in side.If bank note is pushed to the lid of magnet sensor arrangement by bank note transmission roller by bank note
Plate.Amplify IC configured with magneto-resistance effect element and signal between cover board and magnet, therefore, because the press pressure of bank note and
Pressure change is generated between cover board and magnet.The pressure change is applied to semiconductor element i.e. signal amplification IC, generation to be based on
The electromotive force of piezoelectric effect.There are problems that electromotive force is Chong Die with the output signal exported from signal amplification IC and becomes noise.
The present invention was completed to solve the above problem, it is intended that inhibiting noise when bank note transmission, and makes
The quality of the output signal of magnet sensor arrangement improves.
Technical scheme applied to solve the technical problem
Magnet sensor arrangement according to the present invention includes magnet, magneto-resistance effect element, shell, cover board and signal amplification base
Plate.Magnet forms magnetic field in the transmitting path of test object object.Magneto-resistance effect element is by the variation in magnetic field as resistance value
Variation is exported.The shell direction opposite with transmitting path in a face in the face and magneto-resistance effect element that make magnet
On, magnet and magneto-resistance effect element are stored or kept.Cover board at least carries out one face of magneto-resistance effect element
Covering, and form the transmission path surface along transmitting path.There is signal amplification substrate edge to intersect with the transmission path surface
The signal amplification IC that is configured of cross facet, utilize signal to amplify IC pairs and the test object because transmitting in transmission path surface
The variation of object and corresponding, by magneto-resistance effect element output the resistance value of variation in the magnetic field that generates amplifies.
Invention effect
According to the present invention, amplify the signal of IC with signal by configuring along the cross facet to intersect with transmission path surface
Amplify substrate, the electromotive force noise generated by piezoelectric effect when so as to transmit to test object object inhibits, and energy
Improve the quality of the output signal of magnet sensor arrangement.
Detailed description of the invention
Fig. 1 is the cross-sectional view in the XZ plane of magnet sensor arrangement involved in embodiment of the present invention.
Fig. 2 is the cross-sectional view including the screw in the XZ plane comprising magnet sensor arrangement involved in embodiment.
Fig. 3 is eliminated in the cover board of magnet sensor arrangement involved in embodiment and the YZ plane in the state of magnetic screen
Side view.
Fig. 4 is from the magnetoresistance in the state of the cover board and magnetic screen for eliminating magnet sensor arrangement involved in embodiment
Perspective view obtained from element and signal amplification IC unilateral observation.
Fig. 5 is the cross-sectional view including the screw in the XZ plane comprising magnet sensor arrangement involved in embodiment.
Specific embodiment
Using attached drawing, embodiments of the present invention will be described.In all the appended drawings, identical or equivalent structure is wanted
Element adds same label.It is denoted as in figure in three axis of X, Y, Z, X indicates X-axis, indicates the direction of transfer 22 of magnet sensor arrangement.It passes
Sending direction 22 is the direction being transmitted in magnet sensor arrangement, to test object object 21, is the short side side of magnet sensor arrangement
To.Y indicates Y-axis orthogonal to X-axis, is the reading width direction of magnet sensor arrangement, is the longitudinal direction of sensor device.Z
It indicates the Z axis orthogonal with X-axis and Y-axis, indicates the short transverse of magnet sensor arrangement.By the direction of transfer 22 of magnet sensor arrangement
The center of length be set as the origin of X-axis, the center of the length of the reading width direction of magnet sensor arrangement is set as to the original of Y-axis
The transmission plane of the test object object 21 of magnet sensor arrangement is set as the origin of Z axis by point.
In all of the embodiments of the present invention, the transmission of test object object 21 is in addition to transmission test object object 21 itself
Outside situation, do not moved and situation that magnet sensor arrangement itself is moved along direction of transfer 22 comprising test object object 21 also.Transmission
Direction 22 also includes the negative direction of X-axis other than the positive direction of X-axis.It will be passed for test object object 21 along direction of transfer 22
The position sent is known as transmitting path.
About embodiment, the structure of magnet sensor arrangement is illustrated with Fig. 1 to Fig. 4.Fig. 1 is embodiment of the present invention institute
Cross-sectional view in the XZ plane for the magnet sensor arrangement being related to.Fig. 2 includes magnet sensor arrangement involved in embodiment
The cross-sectional view including screw in XZ plane.Fig. 3 is the cover board and magnetic for eliminating magnet sensor arrangement involved in embodiment
The side view in YZ plane in the state of shielding.Fig. 4 is from the lid for eliminating magnet sensor arrangement involved in embodiment
Perspective view obtained from magneto-resistance effect element and signal amplification IC unilateral observation in the state of plate and magnetic screen.
Using Fig. 1 to Fig. 4, the structural element of magnet sensor arrangement involved in embodiment is described in detail.Lid
Plate 1 is the component for constituting the transmission path surface of test object object 21 of magnet sensor arrangement.Biography of the cover board 1 in magnet sensor arrangement
Send and extend along the y axis in path surface, and cover shell 6 Z-direction face in, the side configured with magneto-resistance effect element 2.
Shell 6 is on the direction opposite with transmitting path of a face in the face and magneto-resistance effect element 2 that make permanent magnet 4, to permanent magnetism
Body 4 and magneto-resistance effect element 2 are stored or are kept.Cover board 1 at least covers opposite with the transmitting path of magneto-resistance effect element 2
One face.That is, cover board 1 covers the transmitting path side of shell 6.Shell 6 is in have opening in the transmitting path side of Z-direction
Box shape.Shell 6 has for storing and keeping the opening of each component of magnet sensor arrangement, hole used for positioning
And mounting surface.
Sensor base plate 3 is present between cover board 1 and the Z-direction of permanent magnet 4, and extends along the y axis.Sensor base
In plate 3, magnetoresistance member is installed on the face of face, that is, Z axis positive direction side of the side opposite with the face towards permanent magnet 4
Part 2.That is, being equipped with magneto-resistance effect element 2 on the face of the transport path side of sensor base plate 3.For example, sensor base plate 3 has
Having carrier 3a and dielectric base plate 3b, dielectric base plate 3b is the glass epoxide for being set to the transmitting path side of carrier 3a
Resin plate.
As shown in Figure 1 and Figure 2, magneto-resistance effect element 2 is for example fixed in sensor base plate 3 using bonding agent and is had
Carrier 3a transmitting path side face.The X-direction of magneto-resistance effect element 2 on sensor base plate 3 and the position of Y direction
It sets according to the requirement of the position to the detection part of magnet sensor arrangement and different.
What 2 pairs of magneto-resistance effect element generated due to transmission includes the test object object 21 of magnetic component on direction of transfer 22
The variation of the component of the direction of transfer 22 in magnetic field is detected.Since the resistance value of magneto-resistance effect element 2 changes, magnetic resistance effect
It answers element 2 to detect the magnetic component of test object object 21, and detects signal as electric signal and export.
In sensor base plate 3, the wiring pattern for being formed in dielectric base plate 3b is metal via golden conducting wire, aluminum conductor etc.
Conducting wire 5 is electrically connected with magneto-resistance effect element 2.Sensor base plate 3 has for exporting the electric signal of magneto-resistance effect element 2
To external external connecting.
The face towards permanent magnet 4 of carrier 3a, the face i.e. positioned at the negative direction side of Z axis and with transport path side opposite side
A part connect with shell 6.The a part in the face of the carrier 3a to connect with shell 6 is for example fixed on shell 6 by bonding agent,
Sensor base plate 3 is fixed on shell 6 as a result,.
Permanent magnet 4 is in the rodlike shape extended along the y axis.Permanent magnet 4 is for example fixed on and is sensed by bonding agent
The face of the face opposite side for being equipped with magneto-resistance effect element 2 of device substrate 3.That is, permanent magnet 4 is for example fixed on biography by bonding agent
The face of the negative direction side of the Z axis of carrier 3a possessed by sensor substrate 3.
Permanent magnet 4 configures in parallel with magneto-resistance effect element 2, and is equipped with magneto-resistance effect element 2 with sensor base plate 3
The face of face opposite side be in contact, thus determine the position of Z-direction.The position of the X-direction of permanent magnet 4 is regarded as
The position consistent with the X-direction center of magneto-resistance effect element 2.
Permanent magnet 4 can extend along the y axis in one form, can also be in the state of being divided into more along Y
Axis direction extends.
Permanent magnet 4 forms magnetic field, and applies bias magnetic field to magneto-resistance effect element 2.Due to by permanent magnet 4 in transmission path
Test object object 21 is transmitted in the magnetic field formed in diameter, the size of bias magnetic field will generate variation.Magneto-resistance effect element 2
Resistance value will generate variation because of the variation of bias magnetic field, detection signal is exported by magneto-resistance effect element 2.
As shown in Figure 1 and Figure 2, cover board 1 covers in the face orthogonal with the Z-direction of shell 6, is configured with magneto-resistance effect element 2
Side.That is, cover board 1 covers the face for being equipped with magneto-resistance effect element 2 of sensor base plate 3.
As shown in Figure 1 and Figure 2, when observing magnet sensor arrangement along the y axis, cover board 1 has to be formed along the x axis
The both ends of face, that is, transmission path surface 1b and the X-direction from transmission path surface 1b are bored to the inclined a pair of Z axis negative direction
Body 1a.A pair of bullet 1a and transmission path surface 1b extends in the Y-axis direction.
By carrying out bending machining to metal thin plate, thus the transmission path surface 1b of cover board 1 and a pair of of bullet 1a
It is integrally formed.Cover board 1 is installed on the face of the transmitting path side of shell 6.Since cover board 1 has the cone for becoming transmission guiding piece
Body 1a, therefore, in transmission, test object object 21 will be moved along bullet 1a, and having prevents test object object 21 in X-axis
The effect moved on direction other than direction.
Making test object object 21, when transmitting on magnet sensor arrangement, cover board 1 protects magnet sensor arrangement, particularly magnetic
Inhibition effect element 2 is not by impact, abrasion caused by due tos hitting or rubbing etc..Cover board 1 is present in test object object 21 and magnetic
Between inhibition effect element 2.Therefore, in order to inhibit the influence of the magnetic induction performance to magnet sensor arrangement, the preferably material of cover board 1
For non-magnetic material.
In above-mentioned example, cover board 1 is formed and carrying out bending machining to thin metallic plate, but as long as magnetic can be protected to sense
Device device, then material and production method can be arbitrary.
As shown in Figure 1 and Figure 2, shell 6 is for removing cover board 1, magnetic screen 7, signal amplification substrate in inside storage or holding
9 and signal processing substrate 13 other than structural element, i.e. sensor base plate 3, permanent magnet 4 etc. component.Shell 6 is by metal, example
Such as aluminium, the material of electric conductivity etc., such as electroconductive resin are formed.Shell 6 has for right in X-direction and Y direction
The opening that sensor base plate 3 is positioned.Opening by from the mounting surface between cover board 1 of shell 6 to the negative direction of Z axis
Side is recessed to be formed.
In order to inhibit the influence to magnetic field, preferably shell 6 is formed by non-magnetic material, such as aluminium.
Shell 6 is formed by being cut aluminium in embodiment.In addition, in inside storage or as long as sensing can be kept
Device substrate 3, permanent magnet 4 etc., then the material of shell 6 can be arbitrary, and shell 6 can also be by dielectric resin come shape
At.
Signal amplification substrate 9 is configured at the side of the shell 6 orthogonal with X-direction, the transmission i.e. in shell 6 with cover board 1
The cross facet 6a that path surface 1b intersects.Cross facet 6a and the face of the transport path side of shell 6 intersect.Signal amplifies substrate 9
Isolator it is arranged with transmitting path.Cross facet 6a is the outer surface of the shell 6 to intersect with transmission path surface 1b.Two intersected
Face can be two faces in following positional relationship, it may be assumed that if extending any one face, being in contact and handing over without being in contact
Fork.For example, signal amplification substrate 9 has carrier 9a and dielectric base plate 9b, dielectric base plate 9b is to be set to carrier 9a
The face opposite side opposite with shell 6 face glass epoxy board.
Signal amplifies substrate 9 and is fixed on shell 6 by screw 12.It is located at signal amplification substrate 9 in the head of screw of screw 12
It is equipped on the direction of the side of signal amplification IC8, in the state that signal amplification substrate 9 is pressed into shell 6 by screw 12,
Signal amplification substrate 9 is fixed in shell 6.If signal amplifies the transmission of substrate 9 and cover board 1 from the XZ planar observation of shell 6
Path surface 1b is in the positional relationship intersected with 90 degree.
As shown in figure 5, the side with the face of cross facet 6a opposite side of shell 6 can also be located in the head of screw of screw 16
Upwards, make the screw thread of screw 16 in the through hole 6b being opened in shell 6 by the way that signal is amplified the pull of substrate 9 to shell
In the state of 6, signal amplification substrate 9 is fixed on shell 6.
Signal amplification IC8 is installed, which amplifies IC8 by semiconductor element, such as silicon come shape on signal amplification substrate 9
At, and the detection signal exported by magneto-resistance effect element 2 is amplified.The carrier 9a's possessed by signal amplification substrate 9
On the face of the face opposite side opposite with shell 6, for example, by bonding agent fixed bonding have signal amplify IC8.Signal amplifies IC8
Amplify dielectric base plate 9b's possessed by substrate 9 with signal is formed in via the metal conducting wire 10 such as golden conducting wire, aluminum conductor
Wiring pattern is connected.Molding 17 for example amplifies IC8 to signal using silicone resin and conducting wire 10 molds, to protect signal
Amplification IC8 and conducting wire 10 are not influenced by foreign matter.
1 side of cover board of signal amplification substrate 9, the i.e. end of Z axis positive direction side are provided with curved substrate 11, the bending
Substrate 11 is connected with sensor base plate 3, and the detection signal exported from magneto-resistance effect element 2 is input to signal amplification substrate 9,
And the curved substrate 11 is, for example, flexible base board.The connection of sensor base plate 3 and signal amplification substrate 9 is in addition to using curved substrate
Other than 11 method, it is also possible to the component carried out using connector etc. connection.
Side, the i.e. Z axis negative direction side opposite with signal amplification 1 side of cover board of substrate 9 is provided with connecting line 14, the company
Wiring 14 is connected with signal processing substrate 13, will export from magneto-resistance effect element 2 and amplify the amplified inspection of IC8 by signal
It surveys signal and is input to signal processing substrate 13.Signal amplifies the connection of substrate 9 and signal processing substrate 13 in addition to using connecting line
Other than 14 method, such as it is also possible to the component for using the connector to carry out connection.
It is next integrally formed that hard and soft substrate can be used in sensor base plate 3, signal amplification substrate 9 and curved substrate 11.This
Outside, it is next integrally formed that hard and soft substrate also can be used in signal amplification substrate 9, connecting line 14 and signal processing substrate 13.Also,
Hard and soft also can be used in sensor base plate 3, curved substrate 11, signal amplification substrate 9, connecting line 14 and signal processing substrate 13
Substrate comes integrally formed.
Signal processing substrate 13 is solid by screw 15 on the face with the face opposite side of transport path side of shell 6
Due to shell 6.
Signal processing substrate 13 carries out signal processing to the detection signal inputted from signal amplification substrate 9, and as parallel
Signal or serial signal output.
As shown in Figure 1 and Figure 2, when observing magnet sensor arrangement in the Y-axis direction, magnetic screen 7 has to be formed along the x axis
Bottom and a pair of sidewalls portion being vertically arranged from the bottom along Z axis positive direction, configuring along the x axis.A pair of sidewalls portion
Extend in the Y-axis direction with bottom.That is, magnetic screen 7 is in the shape in the opposite side opening of the Z-direction relative to bottom.It is excellent
The length of the Y direction of magnetic screen 7 is selected to be at least the length of the length of the Y direction of permanent magnet 4 and sensor base plate 3 or more.
The inside in the space, i.e. magnetic screen 7 that are surrounded by the bottom and a pair of sidewalls portion of magnetic screen 7 configured with shell 6 with
And it is fixed on the signal amplification substrate 9 of shell 6.That is, shell 6 is by magnetic other than the face for the side for being fixed with sensor base plate 3
Shielding 7 is covered.In other words, the face in addition to transmission path surface 1b of shell 6 is covered by magnetic screen 7.Signal amplifies as a result,
Substrate 9 configures between shell 6 and magnetic screen 7.
Magnetic screen 7 is fastened by fastening member or bonding for example is fixed by bonding agent to be fixed on shell
6.The bottom and a pair of sidewalls portion of magnetic screen 7 can be separately formed and be engaged with bonding agent, also can use made of metal
The bending machining of thin plate or the extrusion process of bulk material come integrally formed.
The signal-oriented of magnetic screen 7 amplifies the face of substrate 9 and the screw 12 that signal amplification substrate 9 is fixed on to shell 6
Head of screw abuts against, and ensures space between magnetic screen 7 and signal amplification substrate 9 as a result,.The height of the head of screw of screw 12
Height than the bending part of conducting wire 10 is high.The head of screw of screw 12 plays the role of spacer, can anti-stop signal amplification IC8
And conducting wire 10 the case where being in contact and damage with magnetic screen 7.In addition to this, moreover it is possible to prevent molding 17 be in contact with magnetic screen 7 and
The case where pressure is applied to signal amplification IC8.
Amplify between substrate 9 and magnetic screen 7 in signal, resin mass, backing plate (shim can be inserted as spacer
Plate) etc..The thickness in the dielectric base plate portion of composition signal amplification substrate 9 can be made than the height of the bending part of conducting wire 10
It wants thick, and the dielectric base plate portion can be made to be in contact with magnetic screen 7.
The movement of magnet sensor arrangement when then, in embodiments, to transmission test object object 21 is illustrated.
If being transmitted to test object object 21, test object object 21 is in contact with cover board 1.It will be with using bullet 1a
The test object object 21 that cover board 1 is in contact is guided to transmission path surface 1b.It is configured with and puts in 6 side of shell of transmission path surface 1b
Set the magneto-resistance effect element 2 on the face of the transport path side of permanent magnet 4.That is, being clipped by transmission path surface 1b and permanent magnet 4
Space in be configured with magneto-resistance effect element 2.
If test object object 21 is directed to transmission path surface 1b, because test object object 21 connects with transmission path surface 1b
Touching, although so that generating in transmission path surface 1b small can make transmission path surface 1b deform in the negative direction of Z axis
Press pressure.
In patent document 1 in the case where documented magnet sensor arrangement, clipped by transmission path surface and permanent magnet
Space in configured with magneto-resistance effect element and signal amplify IC.In the magnet sensor arrangement, if magneto-resistance effect element and letter
Number amplification IC is for example molded by silicone resin, and silicone resin is in contact with transmission path surface 1b, then press pressure will be applied to
Silicone resin.Therefore, the signal amplification IC formed by semiconductor element receives the pressure change of silicone resin, and in signal amplification IC
Generate the electromotive force because of caused by piezoelectric effect.
In this regard, in the magnet sensor arrangement of embodiment, be mounted with the signal amplification substrate 9 of signal amplification IC8 not by
It is mounted in the space clipped by transmission path surface 1b and permanent magnet 4.Signal amplification substrate 9 be fixed on shell 6 in X-axis side
Upward opposite side, the cross facet 6a to intersect with the transmission path surface 1b of cover board 1 for being configured at shell 6.Therefore, signal
Amplification IC8 is not influenced by the pressure change in the space clipped by transmission road surface 1b and permanent magnet 4.Even if detection pair as a result,
Come as object 21 is transported through, piezoelectric effect will not be generated, because of caused by piezoelectric effect electromotive force noise will not with from letter
The detection signal overlap of number amplification IC8 output, the good detection signal of quality exported.
In embodiment, shows and that signal amplification substrate 9 is configured at shell 6 intersect with transport path side face
The example of cross facet 6a.It is configured at the face opposite with the cross facet 6a of shell 6 in signal amplification substrate 9, i.e., by cross facet 6a
Be set as the surface of shell 6, even if it is configured at the back side of shell 6, can also obtain same effect.
The present invention is not in the case where departing from broad sense thought and range of the invention, it can be achieved that various embodiments and change
Shape.In addition, above embodiment is used for, the present invention will be described, without being defined to the scope of the present invention.That is, of the invention
Range indicated by the scope of the claims, without being indicated by embodiment.Also, within the scope of the claims and with
The various modifications implemented in the range of its same invention meaning are also contemplated as being within the scope of the present invention.
The application is willing to No. 2016-229100 based on the Japanese patent application laid filed an application on November 25th, 2016.This theory
In bright book referring to and introduce Japanese patent application laid is willing to No. 2016-229100 specification, patent claims and whole it is attached
Figure.
Label declaration
1 cover board
1a bullet
1b transmission path surface
2 magneto-resistance effect elements
3 sensor base plates
3a carrier
3b dielectric base plate
4 permanent magnets
5 conducting wires
6 shells
6a cross facet
6b through hole
7 magnetic screens
8 signals amplify IC
9 signals amplify substrate
9a carrier
9b dielectric plate
10 conducting wires
11 curved substrates
12 screws
13 signal processing substrates
14 connecting lines
15,16 screw
17 moldings
21 test object objects
22 direction of transfers
Claims (6)
1. a kind of magnet sensor arrangement characterized by comprising
Magnet, the magnet form magnetic field in the transmitting path of test object object；
Magneto-resistance effect element, the magneto-resistance effect element export the variation in the magnetic field as the variation of resistance value；
Shell, a face and the transmitting path phase of the shell in the face and the magneto-resistance effect element for making the magnet
Pair direction on, the magnet and the magneto-resistance effect element are stored or are kept；
Cover board, the cover board at least cover one face of the magneto-resistance effect element, and are formed along the transmission
The transmission path surface in path；And
Signal amplifies substrate, what the cross facet that there is the signal amplification substrate edge to intersect with the transmission path surface was configured
Signal amplifies IC, amplifies IC pairs using the signal and produces with because of the test object object transmitted in the transmission path surface
The variation for the resistance value that the variation in the raw magnetic field is corresponding, is exported by the magneto-resistance effect element amplifies.
2. magnet sensor arrangement as described in claim 1, which is characterized in that
In the shell, the face other than the face opposite with the transmitting path is covered by magnetic cup covert,
The signal amplification substrate is fixed on the outer surface of the i.e. described shell of the cross facet.
3. magnet sensor arrangement as claimed in claim 2, which is characterized in that
The signal amplification IC configuration is between the shell and the magnetic screen.
4. magnet sensor arrangement as claimed in claim 3, which is characterized in that
The signal amplification IC is configured at the spacer by being in contact with the magnetic screen and signal amplification substrate and ensures
Space.
5. magnet sensor arrangement as claimed in claim 4, which is characterized in that
The spacer is the head of screw that signal amplification substrate is fixed on to the screw of the shell.
6. such as described in any item magnet sensor arrangements of claim 1 to 5, which is characterized in that
The magneto-resistance effect element and signal amplification substrate are connected by curved substrate, and the curved substrate is from the shell
The face opposite with the transmitting path configured throughout the cross facet, that is, shell outer surface.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016229100 | 2016-11-25 | ||
| JP2016-229100 | 2016-11-25 | ||
| PCT/JP2017/038318 WO2018096862A1 (en) | 2016-11-25 | 2017-10-24 | Magnetic sensor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109983355A true CN109983355A (en) | 2019-07-05 |
| CN109983355B CN109983355B (en) | 2022-07-15 |
Family
ID=62194984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780070376.1A Active CN109983355B (en) | 2016-11-25 | 2017-10-24 | Magnetic sensor device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10663320B2 (en) |
| JP (1) | JP6440904B2 (en) |
| CN (1) | CN109983355B (en) |
| DE (1) | DE112017005974T5 (en) |
| WO (1) | WO2018096862A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112021002070T5 (en) * | 2020-03-30 | 2023-01-12 | Mitsubishi Electric Corporation | magnetic sensor device |
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Also Published As
| Publication number | Publication date |
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| CN109983355B (en) | 2022-07-15 |
| US20190360838A1 (en) | 2019-11-28 |
| JPWO2018096862A1 (en) | 2018-11-22 |
| US10663320B2 (en) | 2020-05-26 |
| JP6440904B2 (en) | 2018-12-19 |
| DE112017005974T5 (en) | 2019-08-08 |
| WO2018096862A1 (en) | 2018-05-31 |
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