CN109979824B - Positioning and pasting method for ceramic packaging ceramic cover - Google Patents
Positioning and pasting method for ceramic packaging ceramic cover Download PDFInfo
- Publication number
- CN109979824B CN109979824B CN201811476447.0A CN201811476447A CN109979824B CN 109979824 B CN109979824 B CN 109979824B CN 201811476447 A CN201811476447 A CN 201811476447A CN 109979824 B CN109979824 B CN 109979824B
- Authority
- CN
- China
- Prior art keywords
- ceramic
- cover
- clamp
- ceramic cover
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 147
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 6
- 238000001514 detection method Methods 0.000 claims description 16
- 230000033001 locomotion Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000010183 spectrum analysis Methods 0.000 claims description 3
- 210000000078 claw Anatomy 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims 1
- 230000001680 brushing effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007723 die pressing method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Ceramic Products (AREA)
Abstract
The invention relates to a positioning and mounting method of a ceramic packaging ceramic cover, which comprises the following steps: step one, vertically fixing a laser sensor, a ceramic cover clamp and a ceramic frame clamp from top to bottom in sequence; step two, mounting a ceramic ring on the ceramic frame, mounting pins on the ceramic ring, and fixing the ceramic frame on the ceramic frame fixture after the whole mounting is finished; aligning and calibrating the alignment marks on the ceramic ring and the laser light of the laser sensor; placing the ceramic cover on a ceramic cover clamp and brushing glue on the bottom surface of the ceramic cover; and fifthly, aligning the alignment mark of the ceramic cover with the laser light of the laser sensor, and mounting and attaching after alignment is finished. The invention adds the concave alignment marks on the surface of the ceramic ring and the surface of the ceramic cover, and determines the positions of the alignment marks by the strength of the detected pulse signals, thereby improving the alignment precision and the assembly error.
Description
Technical Field
The invention relates to a positioning and mounting method of a ceramic packaging ceramic cover, belonging to the technical field of semiconductor packaging.
Background
At present, a ceramic frame and a ceramic cover are pressed in ceramic packaging by adopting a die flip cover pressing mode, the position of a lower die is fixed, then an upper die is connected through an articulated mechanism, the die closing angle is 0-180 degrees, the ceramic frame is directly placed into the lower die, the ceramic cover is placed into the upper die, and die closing is completed by turning. The method has low installation precision, on one hand, the assembly error of the ceramic frame and the ceramic cover is large, the ceramic frame and the ceramic cover are respectively placed in a mould, the ceramic frame, the ceramic cover and the mould are in clearance fit, and the size of a mould cavity of the mould is slightly larger than that of the ceramic frame and the ceramic cover; on the other hand, the die pressing error is large, the upper die and the lower die are pressed only through the hinge motion mechanism during pressing, and the upper die and the lower die are easy to deviate.
Disclosure of Invention
The invention aims to solve the technical problem of providing a positioning and mounting method of a ceramic packaging ceramic cover in the prior art, which designs an alignment mark (such as a cross shape) on a ceramic ring and the ceramic cover, utilizes a laser sensor to aim laser pulse signals at a target and emit the laser pulse signals, the laser pulse signals reach the surface of a ceramic frame (heat sink) through the thickness of the ceramic cover and the ceramic ring and then are reflected, and the strength of the pulse signals is detected through a detection group, so that the target position is accurately judged.
The technical scheme adopted by the invention for solving the problems is as follows: a positioning and mounting method of a ceramic packaging ceramic cover comprises the following steps:
step one, vertically fixing a laser sensor, a ceramic cover clamp and a ceramic frame clamp from top to bottom in sequence, and keeping the laser sensor, the ceramic cover clamp and the ceramic frame clamp on the same vertical plane;
step two, mounting a ceramic ring on the ceramic frame, mounting pins on the ceramic ring, and fixing the ceramic frame on the ceramic frame fixture after the whole mounting is finished;
aligning and calibrating the alignment marks on the ceramic ring and the laser light of the laser sensor;
placing the ceramic cover with the bottom surface coated with the glue on a ceramic cover clamp;
and fifthly, aligning the alignment mark of the ceramic cover with the laser light of the laser sensor, and mounting and attaching after alignment is finished.
Furthermore, the laser sensor is arranged on the fixed support.
Furthermore, the laser sensor comprises a detection group, a receiving group and a laser source which are sequentially arranged from top to bottom, wherein the detection group is connected with the signal processor through a signal wire, and the signal processor is used for carrying out spectrum analysis.
Furthermore, the alignment marks on the surface of the ceramic ring and the surface of the ceramic cover are directly sintered and formed to form the depressions.
Further, the ceramic frame clamp and the ceramic cover clamp are both kneaded by the claw through pneumatic transmission.
Further, the ceramic frame clamp and the ceramic cover clamp are both pushed by the cylinder to realize reciprocating movement.
Furthermore, in the fifth step, the laser pulse signals are utilized to penetrate through different thicknesses of the ceramic cover and the ceramic ring, the pulse signals transmitted through the surface of the ceramic frame reach the receiving group and then are fed back to the detection group, and the strength of the laser pulse signals is obtained through detection to be installed and attached.
Further, the alignment is marked as a cross.
Compared with the prior art, the invention has the advantages that:
1. the invention adds the depressed contraposition mark on the surface of the ceramic ring and the surface of the ceramic cover, utilizes the pulse signal emitted by the laser sensor to penetrate the ceramic ring and the ceramic cover with different thicknesses, so that the pulse signal after the reflection is received by the laser sensor has the strength, the strength of the pulse signal detected by the detection group of the laser sensor is displayed on a spectrogram to determine the position of the contraposition mark, thereby improving the contraposition precision and the assembly error;
2. compared with the traditional die pressing mode, the invention improves the product yield and the production efficiency.
Drawings
Fig. 1 to 5 are schematic flow charts of steps of a positioning and mounting method of a ceramic package ceramic cover according to the present invention.
Fig. 6 is a schematic diagram of the laser sensor of the present invention.
Fig. 7 is an appearance schematic diagram of a ceramic package structure according to the present invention.
Fig. 8 is an internal cross-sectional view of fig. 7.
Wherein:
ceramic ring 1
Receive group 7
Fixed support 8
And a laser sensor 13.
Detailed Description
The invention is described in further detail below with reference to the accompanying examples.
The invention relates to a positioning and mounting method of a ceramic packaging ceramic cover, which comprises the following steps:
step one, referring to fig. 1, a laser sensor 13, a ceramic cover clamp 11 and a ceramic frame clamp 12 (in the subsequent steps, the ceramic frame and the ceramic cover are arranged on the clamps) are sequentially and vertically fixed from top to bottom, and the three are kept on the same vertical plane;
the laser sensor 13 is arranged on the fixed bracket 8;
the laser sensor 13 comprises a detection group 9, a receiving group 7 and a laser source 6 which are sequentially arranged from top to bottom, wherein the detection group 9 is connected with a signal processor through a signal wire 10, and the signal processor is used for carrying out spectrum analysis;
step two, referring to fig. 2, a ceramic ring 1 is mounted on a ceramic frame 2 (heat sink) in a glue dispensing or brushing manner, pins 3 are mounted on the ceramic ring 1, and the ceramic frame 2 is fixed on a ceramic frame clamp 12 after the whole mounting is completed;
the ceramic frame clamp 12 is clamped or loosened by a clamping jaw through pneumatic transmission, and the ceramic frame clamp 12 is pushed by an air cylinder to realize reciprocating movement;
thirdly, referring to fig. 3, aligning and calibrating the alignment mark 4 on the ceramic ring 1 with the laser light of the laser source 6;
the alignment mark 4 on the surface of the ceramic ring 1 is directly sintered and molded;
step four, referring to fig. 4, the ceramic cover 5 with the bottom surface coated with glue is placed on a ceramic cover clamp 11, the ceramic cover clamp 11 is clamped or loosened through pneumatic transmission by a clamping jaw, and the ceramic cover clamp 11 is pushed by an air cylinder to realize reciprocating movement;
step five, referring to fig. 5, aligning the alignment mark 4 of the ceramic cover 5 with the laser beam of the laser source 6, penetrating different thicknesses of the ceramic cover 5 and the ceramic ring 1 by using a laser pulse signal, transmitting a pulse signal (consistent with an original path) through the surface of the heat sink to the receiving group 7, feeding back to the detecting group 9, aligning the ceramic cover and the ceramic ring by detecting the strength of the obtained laser pulse signal, determining the position of the ceramic cover 5, and mounting and attaching by using glue brushed on the bottom surface of the ceramic cover;
the alignment mark 4 on the surface of the ceramic cover 5 is directly sintered and molded.
The working principle of the invention is as follows (as shown in fig. 6):
because laser sensor is insensitive to copper product (CPC material), when laser sensor vertical emission laser pulse signal, laser pulse signal pierces through ceramic lid, laser pulse signal continues to pierce through ceramic ring and finally arrives ceramic frame (heat sink) next, can not pierce through when laser pulse signal meets the CPC material, then reflect on the heat sink surface, the reverberation continues to pierce through ceramic lid (former route is unanimous) after passing ceramic ring, get back to pulse receiver (pulse receiver and laser emitter are the light with laser emission is same straight line), the pulse signal who accepts shows through detection device. The laser sensor sends out a pulse signal on the surface of the ceramic, the pulse signal penetrates through the ceramic cover and the ceramic ring to reach the surface of the heat sink for reflection, the reflected signal is consistent with the original path, and the signal received by the detection part is weakened because a part of the sent pulse signal is absorbed by the ceramic material and attenuated; when the laser sensor sends out a pulse signal on the ceramic surface and meets a ceramic marking position (a concave area), the pulse signal is a lossless signal and continuously penetrates, the lossless signal reaches the surface of the heat sink to be reflected, the reflected signal is consistent with the original path, and then the signal is received; when the overall paths are kept consistent, as the alignment marks (concave regions) are designed on the upper surface of the ceramic ring and the lower surface of the ceramic cover, the alignment marks (concave regions) are empty, the loss of pulse signals can be ignored, and the obtained reflected signals become stronger relative to the thickness of an entity (no concave regions), namely, the thicker the pulse signals penetrate through the thickness of the ceramic, the weaker the reflected signals and the weaker the received signals; conversely, the thinner the pulse signal penetrates through the ceramic, the stronger the reflected signal, and the stronger the received signal. When the signal received by the detection device reaches the maximum, the alignment mark position marks are completely overlapped, and the ceramic cover and the ceramic frame are aligned successfully (as shown in fig. 7).
In addition to the above embodiments, the present invention also includes other embodiments, and any technical solutions formed by equivalent transformation or equivalent replacement should fall within the scope of the claims of the present invention.
Claims (8)
1. A positioning and mounting method of a ceramic packaging ceramic cover is characterized by comprising the following steps:
step one, vertically fixing a laser sensor, a ceramic cover clamp and a ceramic frame clamp from top to bottom in sequence, and keeping the laser sensor, the ceramic cover clamp and the ceramic frame clamp on the same vertical plane;
step two, mounting a ceramic ring on the ceramic frame, mounting pins on the ceramic ring, and fixing the ceramic frame on the ceramic frame fixture after the whole mounting is finished;
aligning and calibrating the alignment marks on the ceramic ring and the laser light of the laser sensor;
placing the ceramic cover with the bottom surface coated with the glue on a ceramic cover clamp;
and fifthly, aligning the alignment mark of the ceramic cover with the laser light of the laser sensor, and mounting and attaching after alignment is finished.
2. The method of claim 1, wherein the method comprises: the laser sensor is arranged on the fixed support.
3. The method of claim 1, wherein the method comprises: the laser sensor comprises a detection group, a receiving group and a laser source which are sequentially arranged from top to bottom, wherein the detection group is connected with a signal processor through a signal line, and the signal processor is used for carrying out spectrum analysis.
4. The method of claim 1, wherein the method comprises: the alignment marks on the surface of the ceramic ring and the surface of the ceramic cover are directly sintered and molded to form a recess.
5. The method of claim 1, wherein the method comprises: the ceramic frame clamp and the ceramic cover clamp are both kneaded by the claw through pneumatic transmission.
6. The method of claim 1, wherein the method comprises: the ceramic frame clamp and the ceramic cover clamp are pushed by the cylinder to realize reciprocating movement.
7. The method for positioning and mounting a ceramic cover for ceramic packaging according to claim 3, wherein: and fifthly, penetrating different thicknesses of the ceramic cover and the ceramic ring by using a laser pulse signal, enabling the pulse signal reflected by the surface of the ceramic frame to reach a receiving group, feeding back to a detection group, and obtaining the strength of the laser pulse signal through detection to carry out installation and lamination.
8. The method of claim 1, wherein the method comprises: the alignment marks are cross-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811476447.0A CN109979824B (en) | 2018-12-04 | 2018-12-04 | Positioning and pasting method for ceramic packaging ceramic cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811476447.0A CN109979824B (en) | 2018-12-04 | 2018-12-04 | Positioning and pasting method for ceramic packaging ceramic cover |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109979824A CN109979824A (en) | 2019-07-05 |
| CN109979824B true CN109979824B (en) | 2020-05-15 |
Family
ID=67076179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811476447.0A Active CN109979824B (en) | 2018-12-04 | 2018-12-04 | Positioning and pasting method for ceramic packaging ceramic cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109979824B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107001147A (en) * | 2014-12-16 | 2017-08-01 | 日本碍子株式会社 | Ceramic matrix and its manufacture method |
| CN208028021U (en) * | 2017-06-07 | 2018-10-30 | 杭州暖芯迦电子科技有限公司 | A kind of wire bonding apparatus of implanted microelectronic product |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6395651A (en) * | 1986-10-13 | 1988-04-26 | Ngk Spark Plug Co Ltd | Manufacture of ceramic ic package substrate |
| JPH0492495A (en) * | 1990-08-08 | 1992-03-25 | Hitachi Ltd | Forming method for wiring and semiconductor integrated circuit device formed by use thereof |
| JP6167494B2 (en) * | 2012-09-26 | 2017-07-26 | セイコーエプソン株式会社 | Electronic device container manufacturing method, electronic device manufacturing method, electronic device, electronic apparatus, and mobile device |
| JP6318556B2 (en) * | 2013-11-11 | 2018-05-09 | セイコーエプソン株式会社 | Package manufacturing method and electronic device manufacturing method |
| CN205752137U (en) * | 2016-05-16 | 2016-11-30 | 深圳市芯思杰智慧传感技术有限公司 | Ceramic package shell and photodiode integrated light detector |
| CN206294135U (en) * | 2016-11-25 | 2017-06-30 | 烟台明德亨电子科技有限公司 | A kind of SMD quartz resonators and its process equipment |
-
2018
- 2018-12-04 CN CN201811476447.0A patent/CN109979824B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107001147A (en) * | 2014-12-16 | 2017-08-01 | 日本碍子株式会社 | Ceramic matrix and its manufacture method |
| CN208028021U (en) * | 2017-06-07 | 2018-10-30 | 杭州暖芯迦电子科技有限公司 | A kind of wire bonding apparatus of implanted microelectronic product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109979824A (en) | 2019-07-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| FI112610B (en) | Angle detection method for bending machines, angle detection device and its angle sensor | |
| US10586781B2 (en) | Bonding apparatus and method of estimating position of landing point of bonding tool | |
| CN109979824B (en) | Positioning and pasting method for ceramic packaging ceramic cover | |
| WO2006009877A2 (en) | Robot alignment system and method | |
| JP5562625B2 (en) | Electric wire position detection device for terminal crimping machine | |
| US8171771B2 (en) | Calibration for a nondestructive material testing system | |
| JP4791489B2 (en) | Ultrasonic beam forming device | |
| CN208246415U (en) | Coaxial non-contact laser tool setting gauge | |
| WO2021159675A1 (en) | Cup welding inspection apparatus and inspection method thereof | |
| US7624904B1 (en) | Calibration apparatus for bondhead of wire bonding machine | |
| KR100785631B1 (en) | Sensor head of optical displacement sensor | |
| CN109843570B (en) | Pressing device | |
| CN214313144U (en) | Intrinsic pressure device | |
| CN221776284U (en) | Debugging structure | |
| CN112123285B (en) | Welding cutter and manufacturing method thereof | |
| CN115302081A (en) | Welding method and device for power battery sealing nail | |
| CN209886931U (en) | Tool capable of quickly detecting quality of steel bar electroslag pressure welding joint | |
| CN208383095U (en) | A kind of Novel strip testing device for transparent paper | |
| CN221198292U (en) | Automobile decoration strip detection tool | |
| CN215787434U (en) | Multi-purpose five-light coaxial optical system | |
| CN221668029U (en) | Laser ranging device | |
| CN102175167A (en) | Method for measuring fastening condition of upper cover and lower cover | |
| CN214667056U (en) | Pipe section press-fitting device for automatic assembly line of ultrasonic flowmeter | |
| CN221507139U (en) | Ranging device and robot | |
| CN220509084U (en) | Probe testing device for CSP chip test and CSP chip testing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |